Cooling system and computer equipment

Abstract

The embodiment of the invention provides a heat dissipation system and computer equipment. The heat dissipation system comprises a heat dissipation assembly; the heat transfer mounting assembly is detachably arranged, and a component to be cooled is detachably mounted in the heat transfer mounting assembly and is in heat transfer fit with the heat transfer mounting assembly; and the heat transfer intermediate assembly is arranged between the heat transfer mounting assembly and the heat dissipation assembly and transfers the heat of the heat transfer mounting assembly to the heat dissipation assembly for heat dissipation. The problem that liquid leakage is likely to happen to cold plates of devices such as a computer equipment memory in the prior art is solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computers, and more specifically, to a heat dissipation system and a computer device. Background Art

[0002] At present, traditional air cooling is increasingly unable to meet the heat dissipation requirements of high power consumption, so liquid cooling has become an important direction in the field of computer equipment heat dissipation. In addition to the CPU, there are many other components inside the computer equipment that need to be cooled, such as memory and other devices. The traditional memory cold plate is generally installed between two memory sticks. It is a fixed structure with a small space, making it difficult to wire the leakage detection line and difficult to cover all the memory. When the memory heat dissipation cold plate leaks, the system is difficult to respond quickly, causing the coolant to leak to the motherboard and cause a short circuit, resulting in system downtime. Leaked coolant will pose risks to the hardware and data security of computer equipment, and for multi-node computer equipment, leakage in the upper node will affect the lower node, greatly increasing the operation and maintenance costs of liquid-cooled multi-node computer equipment. Summary of the invention

[0003] The embodiments of the present application provide a heat dissipation system and a computer device, so as to at least solve the problem in the related art that the cold plate of the computer device memory and other components is prone to leakage.

[0004] According to one aspect of the present application, a heat dissipation system is provided, including: a heat dissipation component; at least one heat transfer mounting component, which is detachably arranged, and a component to be dissipated heat is detachably mounted in the heat transfer mounting component and cooperates with the heat transfer mounting component in heat transfer; a heat transfer intermediate component, which is arranged between the heat transfer mounting component and the heat dissipation component, and transfers the heat of the heat transfer mounting component to the heat dissipation component for heat dissipation.

[0005] Furthermore, the heat transfer installation assembly includes: a first clamping plate; a second clamping plate, a mounting area for clamping and installing a component to be cooled is formed between the first clamping plate and the second clamping plate, the first clamping plate and the second clamping plate cooperate with the component to be cooled, and the first clamping plate and the second clamping plate have heat transfer ends, which are located in the heat transfer intermediate assembly and contact the heat transfer intermediate assembly for heat transfer.

[0006] Furthermore, the heat transfer mounting assembly also includes a heat conductor, which is arranged on the inner wall of the first clamping plate and / or the second clamping plate and is located between the first clamping plate and / or the second clamping plate and the component to be cooled. The component to be cooled contacts the first clamping plate and / or the second clamping plate for heat transfer through the heat conductor.

[0007] Furthermore, the heat transfer installation assembly also includes an installation elastic member, which is arranged on the inner wall of the first clamping plate and / or the second clamping plate, and the installation elastic member is limitedly matched with the component to be cooled and controls the position of the component to be cooled in the installation area.

[0008] Furthermore, the heat transfer intermediate component includes: a base body, the base body has at least one accommodating cavity, and at least a part of the heat transfer intermediate component is inserted into the accommodating cavity; a cover body, the cover body is movably connected to the base body, and has a closed position for covering the accommodating cavity and an open position for avoiding the accommodating cavity, and a locking structure for locking is arranged between the cover body and the base body, and the locking structure includes at least one of a snap-on structure, a magnetic attraction structure, and a fastener structure.

[0009] Furthermore, there are multiple heat transfer mounting components and accommodating cavities, and they are arranged in one-to-one correspondence; and / or the heat transfer intermediate component also includes a heat transfer elastic member, which is arranged on the inner wall of the accommodating cavity and abuts against the heat transfer mounting component to limit the position of the heat transfer mounting component in the accommodating cavity; and / or the heat transfer intermediate component also includes a positioning protrusion, which is located on one side of the seat body and is positioned and matched with the positioning hole of the external component.

[0010] Furthermore, there are multiple heat transfer intermediate components, and heat transfer intermediate components are arranged at both ends of the heat transfer mounting component.

[0011] Furthermore, the heat dissipation system also includes an operating component, which includes: an operating part, which is movably arranged; an operating elastic part, which is arranged on the heat transfer mounting component. When the operating part moves, it squeezes the operating elastic part and drives the heat transfer mounting component to be pressed onto the heat transfer intermediate component through the operating elastic part.

[0012] Furthermore, the heat dissipation system also includes a liquid leakage detection component, which is arranged at the heat dissipation component and detects liquid leakage at the heat dissipation component.

[0013] Furthermore, the heat dissipation system also includes a water receiving member, which is arranged below at least a portion of the heat dissipation component and is used to receive the cooling medium leaking from the heat dissipation component.

[0014] Furthermore, the heat dissipation system also includes a node base, which is arranged below at least part of the heat dissipation component. The node base has a cavity, a water retaining structure is arranged at the bottom edge of the cavity, a water absorbent is arranged on the inner side of the water retaining structure, and the bottom surface of the cavity of the node base is a non-porous structure.

[0015] Furthermore, the heat dissipation assembly includes a liquid cooling pipe and a joint assembly, the joint assembly includes: a liquid cooling pipe joint, the liquid cooling pipe joint is arranged at the end of the liquid cooling pipe; a joint mounting seat detachably connected to the chassis, the joint mounting seat has an installation cavity, at least a portion of the liquid cooling pipe joint is installed in the joint mounting seat, when the joint mounting seat is installed in the chassis, the chassis blocks the side opening of the installation cavity, and the installation cavity can receive leaked cooling medium.

[0016] Furthermore, both the top and bottom surfaces of the joint mounting seat have through holes, there are multiple joint assemblies, at least some of the joint assemblies are arranged up and down, and in the two adjacent joint assemblies above and below, the through holes on the bottom surface of the upper joint assembly are aligned with the through holes on the top surface of the lower joint assembly, and the cooling medium in the upper joint assembly flows through the lower joint assembly via the through holes; and / or the liquid cooling pipe joint has a positioning structure, and the positioning structure is positioned and matched with the chassis and / or the joint mounting seat; and / or the top of the joint mounting seat has an openable top cover, and the side wall of the joint mounting seat has a avoidance port for avoiding the liquid cooling pipe, the liquid cooling pipe joint is installed from the top of the joint mounting seat to the mounting cavity, and the liquid cooling pipe passes through the avoidance port to be connected to the liquid cooling pipe joint.

[0017] According to another aspect of the present application, a computer device is provided, including a motherboard, components and the above-mentioned heat dissipation system, wherein the heat dissipation component of the heat dissipation system is arranged on the motherboard, the components and the heat transfer mounting component of the heat dissipation system are detachably arranged on the motherboard, and the components are parts to be cooled and are detachably matched with the heat transfer mounting component.

[0018] Furthermore, the computer device also includes a chassis, the chassis has an external connector, and the heat dissipation component is connected to the external connector.

[0019] The technical solution of the present application is provided with a heat transfer installation component and a heat transfer intermediate component, wherein the heat transfer installation component can be used to install the component to be cooled, thereby realizing the installation and fixation of the component to be cooled, and at the same time, the heat transfer installation component also plays a heat dissipation role, and the heat generated by the component to be cooled can be transferred to the heat transfer installation component, and the heat transfer effect of the heat transfer intermediate component is cooperated, so that the heat on the heat transfer installation component is further transferred to the heat dissipation component through the heat transfer intermediate component, so that the heat dissipation of the component to be cooled no longer requires additional liquid cooling components, and only the original heat dissipation component is needed to achieve the heat dissipation effect on the component to be cooled. Through the above-mentioned setting method, on the one hand, it is no longer necessary to set up a separate cold plate or other structure, thereby reducing the complexity of the overall structure and facilitating installation. On the other hand, due to the reduction in the number of cold plates, the number of pipelines is greatly reduced, the number of pipeline joints is small, and the structure is simple, thereby reducing the possibility of leakage and ensuring the safety and reliability of computer equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1It is a structural schematic diagram of the heat dissipation system of the present application;

[0021] Figure 2 is an exploded view of the heat transfer mounting assembly;

[0022] Figure 3 It is a schematic diagram of the structure of the heat transfer intermediate component;

[0023] Figure 4 It is a schematic diagram of the structure in which the heat transfer mounting assembly is mounted on the mainboard;

[0024] Figure 5 It is a schematic diagram of the structure at the operating component;

[0025] Figure 6 It is a structural schematic diagram of the water receiving part;

[0026] Figure 7 It is a structural diagram of the node base;

[0027] Figure 8 It is an exploded view of the liquid cooling pipe joint and the joint mounting base;

[0028] Fig. 9 It is a schematic diagram of the structure in which the connector mounting base is installed on the chassis;

[0029] Fig.10 It is a schematic diagram of the structure of the connector mounting seat on the computer equipment.

[0030] 10. heat dissipation assembly; 11. liquid cooling pipe; 12. liquid cooling pipe joint; 121. positioning structure; 13. joint mounting seat; 131. through hole; 132. top cover; 133. avoidance port; 134. labor-saving handle; 135. flow-blocking cotton; 136. positioning through hole; 14. fixing piece; 20. heat transfer mounting assembly; 21. first clamping plate; 22. second clamping plate; 23. heat conducting piece; 24. mounting elastic piece; 25. knob; 26. slot; 30. heat transfer intermediate assembly; 31. seat body; 32. Cover body; 33. Heat transfer elastic member; 34. Positioning protrusion; 35. Locking structure; 40. Operating assembly; 41. Operating member; 42. Operating elastic member; 43. Thumb screw; 44. Operating limiter; 50. Liquid leakage detection member; 60. Water receiving member; 61. Elastic hook; 70. Node base; 71. Cavity; 72. Water retaining structure; 73. Water absorbing member; 74. Convex structure; 80. Mainboard; 81. Positioning hole; 90. Chassis; 91. External connector; 100. Components. DETAILED DESCRIPTION

[0031] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0033] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0034] In order to solve the problem in the related art that the cold plate of components such as memory of computer equipment is prone to leakage, an embodiment of the present application provides a heat dissipation system and a computer equipment.

[0035] like Figures 1 to 10 A heat dissipation system shown includes a heat dissipation component 10, at least one heat transfer installation component 20 and a heat transfer intermediate component 30. The heat transfer installation component 20 is detachably arranged, and the component to be dissipated is detachably installed in the heat transfer installation component 20 and cooperates with the heat transfer installation component 20 for heat transfer; the heat transfer intermediate component 30 is arranged between the heat transfer installation component 20 and the heat dissipation component 10, and transfers the heat of the heat transfer installation component 20 to the heat dissipation component 10 for heat dissipation.

[0036] This embodiment is provided with a heat transfer installation component 20 and a heat transfer intermediate component 30, wherein the heat transfer installation component 20 can be used to install the component to be cooled, thereby achieving the installation and fixation of the component to be cooled. At the same time, the heat transfer installation component 20 also plays a heat dissipation role. The heat generated by the component to be cooled can be transferred to the heat transfer installation component 20. With the heat transfer effect of the heat transfer intermediate component 30, the heat on the heat transfer installation component 20 is further transferred to the heat dissipation component 10 through the heat transfer intermediate component 30, so that the heat dissipation of the component to be cooled no longer requires additional liquid cooling components, and only the original heat dissipation component 10 is needed to achieve the heat dissipation effect on the component to be cooled. Through the above-mentioned setting method, on the one hand, it is no longer necessary to set up a separate cold plate or other structure, thereby reducing the complexity of the overall structure and facilitating installation. On the other hand, due to the reduction in the number of cold plates, the number of pipelines is greatly reduced, the number of pipeline joints is small, and the structure is simple, thereby reducing the possibility of leakage and ensuring the safety and reliability of computer equipment.

[0037] In this embodiment, the heat dissipation component is a component 100 mounted on the mainboard 80. Specifically, the component 100 is a memory. Accordingly, the heat transfer mounting assembly 20 is essentially a component for heat dissipation of the memory. The heat dissipation assembly 10 can be a component such as a CPU cold plate on the mainboard 80. Of course, the component 100 can also be other components on the mainboard 80 that need to be heat dissipated, and the heat dissipation component can also be other components.

[0038] like Figure 2 As shown, in this embodiment, the heat transfer installation component 20 includes a first clamping plate 21 and a second clamping plate 22, both of which are plate-shaped members, and because the memory is generally inserted longitudinally into the socket on the mainboard 80, the first clamping plate 21 and the second clamping plate 22 of this embodiment are also arranged longitudinally, and an installation area for clamping and installing components 100 is formed between the first clamping plate 21 and the second clamping plate 22. In this way, when the memory is installed on the heat transfer installation component 20, the memory is installed by clamping the memory by the first clamping plate 21 and the second clamping plate 22. At the same time, the clamping setting method can also ensure the heat transfer coordination effect between the memory and the first clamping plate 21 and the second clamping plate 22, and ensure that the heat generated by the memory can be more transferred to the heat transfer installation component 20. At the same time, in this embodiment, heat transfer ends are arranged at the ends of the first clamping plate 21 and the second clamping plate 22, and the heat transfer ends are located in the heat transfer intermediate component 30 and contact the heat transfer intermediate component 30 for heat transfer. In this way, the heat generated by the memory is transferred to the first clamping plate 21 and the second clamping plate 22, and then transferred to the heat transfer mounting assembly 20 through the heat transfer ends thereon, and then transferred from the heat transfer mounting assembly 20 to the heat dissipation assembly 10 to achieve heat dissipation of the memory.

[0039] In order to achieve efficient heat transfer of the memory, the heat transfer mounting assembly 20 of the present embodiment also includes a heat conductor 23. The heat conductor 23 can be a structure such as a thermal pad. The heat conductor 23 is arranged on the inner wall of the first clamp plate 21 and / or the second clamp plate 22, and is located between the first clamp plate 21 and / or the second clamp plate 22 and the component 100. In the present embodiment, the heat conductor 23 is preferably arranged between the first clamp plate 21 and the memory, and between the second clamp plate 22 and the memory, so that the heat generated by the memory can be transferred through the heat conductor 23 on both sides and the first clamp plate 21 and the second clamp plate 22, thereby improving the heat transfer effect and then improving the heat dissipation effect.

[0040] Preferably, the area of ​​the heat conducting member 23 is substantially the same as the size of the memory, which helps to increase the heat transfer area and improve the heat transfer effect.

[0041] In this embodiment, the heat transfer installation assembly 20 also includes an installation elastic member 24. The installation elastic member 24 can be a spring sheet or other components. The installation elastic member 24 is arranged on the inner wall of the first clamping plate 21 and / or the second clamping plate 22, and the installation elastic member 24 is limited to cooperate with the component 100. In this embodiment, the installation elastic member 24 is arranged above the inner side surface of the first clamping plate 21 and the second clamping plate 22, so that the installation elastic member 24 can limit the upward movement of the memory, so that the component 100 is kept in the installation area, and the position of the component 100 is controlled. Since the installation elastic member 24 itself has a certain elasticity, there is a certain space between the installation elastic member 24 and the memory, which can not only make the installation elastic member 24 adapt to different types of memory, but also play a certain vibration reduction role for the vibration of the memory. At the same time, the installation elastic member 24 makes the distance between the first clamping plate 21 and the second clamping plate 22 have a certain activity space, which can adapt to more memory of different thicknesses, improve the versatility and heat dissipation performance, and effectively avoid the situation that when the thickness of the memory is thin, the heat conductive member 23 cannot be fully fitted with the memory and affect the heat dissipation. Of course, the elastic member 24 may be installed using other types of components, and its location may be adjusted accordingly, as long as it can limit the memory location.

[0042] The structures of the first clamping plate 21 and the second clamping plate 22 of this embodiment are basically the same. Taking the first clamping plate 21 as an example, the middle part of the first clamping plate 21 is the main body, and a heat conductive part 23 is arranged on the inner side surface of the main body to achieve cooperation with the memory, and extended sections extending along the length direction are arranged on the end side surfaces at both ends of the length direction of the main body. On the one hand, the extended section plays a role of cooperation with the heat transfer intermediate component 30, that is, the heat transfer installation component 20 is installed and cooperated with the heat transfer intermediate component 30 through the extended section. On the other hand, the extended section has a heat transfer end, so as to achieve the heat transfer effect between the heat transfer installation component 20 and the heat transfer intermediate component 30.

[0043] In this embodiment, quick-loading structures are provided at the extended sections at both ends of the first splint 21 and the second splint 22, and the quick-loading structure includes a knob 25 and a slot 26. The knob 25 is arranged on the first splint 21, and the slot 26 is arranged on the second splint 22. One end of the knob 25 has a non-circular structure, and the shape of the slot 26 matches the non-circular structure. The knob 25 can be axially moved and can be rotatably arranged. In this way, when the first splint 21 and the second splint 22 need to be connected together, the person presses the knob 25 to make the non-circular structure extend into the slot 26, and then rotates the knob 25 to make the non-circular structure misaligned with the slot 26. At this time, the structural characteristics of the non-circular structure can be used to make it stuck in the slot 26, so that the first splint 21 and the second splint 22 can be quickly connected and fixed together, which is convenient for operation. Similarly, when disassembling, the heat transfer installation component 20 can be disassembled separately, and the memory can be replaced separately, without disassembling the entire cold plate mechanism, which is convenient for operation and improves the operation and maintenance efficiency. In addition, in the application scenario where the memory has no liquid cooling demand or the memory is not fully equipped, the heat transfer installation component 20 can be removed to reduce the space occupied by the heat transfer installation component 20 except the heat dissipation component 10. Of course, in addition to the above-mentioned quick-installation structure, other structural forms can also be used, as long as the connection between the first clamping plate 21 and the second clamping plate 22 can be achieved.

[0044] In this embodiment, avoidance grooves are further provided on the first clamping plate 21 and the second clamping plate 22. The avoidance grooves are used to avoid some components on the memory to avoid damage to the memory.

[0045] Since there are generally multiple memories installed on the motherboard 80, the present embodiment also has multiple heat transfer installation components 20, and preferably each heat transfer installation component 20 is arranged one-to-one with the memory, so that each memory can transfer heat and dissipate heat through its corresponding heat transfer installation component 20 to ensure the heat dissipation effect. Of course, multiple memories can also be installed in each heat transfer installation component 20, and at the same time, if only one memory needs to be installed, only one heat transfer installation component 20 can be provided.

[0046] like Figure 3As shown, the heat transfer intermediate component 30 of this embodiment includes a base 31 and a cover 32. The base 31 has at least one accommodating cavity, and at least a part of the heat transfer intermediate component 30 is inserted into the accommodating cavity. The side and top surfaces of the accommodating cavity of this embodiment are both opened, so that the extended sections of the first clamping plate 21 and the second clamping plate 22 can be extended into and installed in the accommodating cavity. The cover body 32 is movably connected to the base body 31. The cover body 32 of the present embodiment is flippably covered above the accommodating cavity. In this way, the cover body 32 has a closed position for covering the accommodating cavity and an open position for avoiding the accommodating cavity. When the heat transfer installation component 20 needs to be installed, the cover body 32 is flipped upward to open it, and then the heat transfer installation component 20 with the memory can be inserted into the accommodating cavity from top to bottom, and then the cover body 32 is flipped back to make the cover body 32 switch to the closed position, so that the path of the heat transfer installation component 20 to exit the heat transfer intermediate component 30 can be blocked, and the heat transfer installation component 20 can be fixed on the heat transfer intermediate component 30, which can not only realize the installation and fixation of the heat transfer installation component 20, but also ensure the stable and reliable heat transfer between the heat transfer installation component 20 and the heat transfer intermediate component 30.

[0047] In this embodiment, a locking structure 35 for locking is further provided between the cover body 32 and the base body 31. The locking structure 35 is located at the other end of the cover body 32 and the base body 31 that are rotatably connected. The locking structure 35 includes at least one of a snap-on structure, a magnetic structure, and a fastener structure. In this way, when the cover body 32 moves to the closed position, the cover body 32 can be locked between the locking structure 35 and the base body 31, thereby ensuring that the cover body 32 remains in the closed position, thereby ensuring the reliability of the connection between the heat transfer installation component 20 and the heat transfer intermediate component 30. The locking structure 35 of this embodiment adopts a magnetic structure, that is, a magnetic part is provided between the base body 31 and the cover body 32. When the cover body 32 is in the closed position, the magnetic part is adsorbed together with another component by magnetic attraction, thereby locking the cover body 32 and the base body 31 together. Of course, other aforementioned structural forms such as snaps can also be used.

[0048] Since there are multiple heat transfer installation components 20, there can also be multiple accommodating cavities on the seat body 31. The accommodating cavities are arranged along the arrangement direction between the heat transfer installation components 20, and the cover body 32 is integrally arranged above all the accommodating cavities, so that all the accommodating cavities can be opened and closed at the same time, which is more convenient to operate while ensuring reliability. In order to ensure the heat transfer effect, the preferred accommodating cavities in this embodiment are also multiple, and the accommodating cavities are arranged one-to-one with the heat transfer installation components 20, so that each heat transfer installation component 20 can be installed in the corresponding accommodating cavity, and heat is transferred through the side wall of the corresponding accommodating cavity.

[0049] The heat transfer intermediate component 30 of the present embodiment also includes a heat transfer elastic member 33. The heat transfer elastic member 33 can also be a spring or other component. The heat transfer elastic member 33 is arranged on the inner wall of the accommodating cavity. In this way, when the heat transfer installation component 20 is installed in the accommodating cavity, the side of the extended section of the heat transfer installation component 20 can abut against the heat transfer elastic member 33, thereby limiting the position of the heat transfer installation component 20 in the accommodating cavity under the action of the heat transfer elastic member 33, ensuring the stability of the position of the heat transfer installation component 20, and at the same time improving the heat transfer effect between the heat transfer installation component 20 and the heat transfer intermediate component 30.

[0050] like Figure 4 As shown, the heat transfer intermediate component 30 of this embodiment also includes a positioning protrusion 34, which is located on the side of the seat body 31 facing the main board 80. In this embodiment, it is set at the bottom surface of the seat body 31. The positioning protrusion 34 can be positioned and matched with the external component, that is, the positioning hole 81 of the main board 80. When the heat transfer intermediate component 30 is installed on the main board 80, it is only necessary to align the positioning protrusion 34 with the positioning hole 81 to achieve installation and fixation, ensuring that the installation position of the heat transfer intermediate component 30 is accurate and convenient. The positioning hole 81 on the main board 80 can be set as a long strip hole, so that the installation position of the heat transfer intermediate component 30 on the main board 80 can be adjusted, so that it can adapt to different types of memory and improve adaptability.

[0051] like Figure 1 As shown, there are multiple heat transfer intermediate components 30 in this embodiment, and heat transfer intermediate components 30 are provided at both ends of the length direction of the heat transfer installation component 20, that is, at both ends of the length direction of the memory, so that the heat transfer installation component 20 can transfer heat through the heat transfer intermediate components 30 on both sides at the same time, thereby improving the heat transfer efficiency. The heat transfer installation component 20 of this embodiment adopts the form of group setting, and the heat transfer installation component 20 is divided into multiple groups. Taking the four groups in this embodiment as an example, the four groups of heat transfer installation components 20 are arranged at different positions of the mainboard 80, and a heat transfer intermediate component 30 is respectively provided on both sides of each group of heat transfer installation components 20, so that each group of heat transfer installation components 20 transfers heat through the two heat transfer intermediate components 30 on both sides thereof. Of course, the specific setting quantity, setting position and matching relationship of the heat transfer intermediate components 30 and the heat transfer installation components 20 can also be adjusted as needed, and are not limited to the above-mentioned setting method of this embodiment.

[0052] like Figure 4 and Figure 5As shown, in this embodiment, the heat dissipation system further includes an operating assembly 40, which is used for personnel to operate. The operating assembly 40 includes an operating member 41 and an operating elastic member 42. The operating member 41 can be movably arranged. The operating member 41 can adopt a labor-saving handle component, and a hand screw 43 can be provided on the handle component. The operating elastic member 42 is arranged on the heat transfer installation assembly 20. The operating elastic member 42 of this embodiment adopts a spring. The operating elastic member 42 is arranged on the upper surface of the extension section of the first clamping plate 21 and / or the second clamping plate 22, and is exposed to the accommodating cavity through the top opening of the accommodating cavity. In this way, when installing the heat transfer installation component 20 into the accommodating cavity, the operator can operate the rotating operating member 41, and the operating member 41 rotates and approaches the upper surface of the heat transfer installation component 20 until the operating member 41 contacts the operating elastic member 42. The operating member 41 continues to rotate to squeeze the operating elastic member 42, and the operating elastic member 42 is compressed and transmits the elastic force to the heat transfer installation component 20, so that the driving force of the operating member 41 is transmitted to the heat transfer installation component 20 through the operating elastic member 42, so as to achieve the effect of driving the heat transfer installation component 20 to be pressed on the heat transfer intermediate component 30. After the installation is completed, the cover body 32 can be turned down to keep the heat transfer installation component 20 on the heat transfer intermediate component 30. Due to the setting of the operating elastic member 42, the heat transfer installation component 20 has a certain movement margin, thereby effectively preventing the internal memory from being damaged by transportation vibration. At the same time, an operating limit part 44 can be set at the rotatable end of the operating member 41 to limit the rotation range of the operating member 41.

[0053] The heat transfer installation component 20 and the heat transfer intermediate component 30 of this embodiment are both made of metal materials with good thermal conductivity, such as copper or aluminum, which is beneficial to improving the heat transfer performance.

[0054] like Figure 1 As shown, in this embodiment, the heat dissipation system also includes a liquid leakage detection member 50, which is arranged at the heat dissipation component 10 and detects the liquid leakage at the heat dissipation component 10. The liquid leakage detection member 50 of this embodiment adopts a liquid leakage detection line, and the liquid leakage detection member 50 is wound around the joint of the heat dissipation component 10, so that the liquid leakage detection line can detect the liquid leakage. When a cooling medium leaks, the liquid leakage detection line detects the leak and transmits the liquid leakage signal to the mainboard 80, and then the operation and maintenance personnel perform the liquid leakage processing, so that the liquid leakage detection line has the function of first-level liquid leakage prevention processing.

[0055] like Figure 1 and Figure 6As shown, in addition to the above-mentioned leakage detection line, the heat dissipation system of this embodiment also includes a water receiving part 60. The water receiving part 60 adopts a water receiving trough. The water receiving part 60 is arranged below at least part of the heat dissipation component 10. In this embodiment, the water receiving part 60 is mainly arranged below the joint of the heat dissipation component 10, so that the water receiving part 60 can receive the cooling medium leaking from the heat dissipation component 10. The water receiving part 60 of this embodiment is assembled to the heat dissipation component 10 through the elastic hook 61 arranged thereon. The connection between the water receiving part 60 and other components is coated with sealant to ensure that the coolant at the joint can be safely diverted into the water receiving part 60 without leaking to the mainboard 80. A certain degree of accumulation of cooling medium can be achieved, effectively preventing the problem that the operation and maintenance personnel cannot find in time when leakage occurs, and gaining a certain response time for the operation and maintenance personnel, which has the function of secondary anti-leakage treatment. The above-mentioned leakage detection line and the water receiving part 60 cooperate with each other to realize the function of multi-level anti-leakage treatment.

[0056] like Figure 1 and Figure 7 As shown, in this embodiment, the heat dissipation system also includes a node base 70, which is arranged below at least part of the heat dissipation assembly 10, and the node base 70 has a cavity 71, and a water retaining structure 72 is arranged at the bottom edge of the cavity 71. In this embodiment, a water retaining structure 72 is arranged at the front end of the node base 70, and a water absorbing member 73 is arranged inside the water retaining structure 72, that is, inside the node base 70. Thereby, it plays a role in collecting the leaked liquid. In this embodiment, a convex hull structure 74 is arranged in the cavity 71, and the convex hull structure 74 protrudes upward, so as to have a certain diversion effect, effectively preventing the coolant from flowing into the front window and affecting the electronic components of the front window, thereby causing the system to shut down. At the same time, the bottom surface of the cavity 71 of the node base 70 is a non-porous structure, and the bottom surface of the node base 70 is connected to other components by non-porous riveting. In this way, the bottom surface of the node base 70 is closed, so that the collected cooling medium will not leak further, avoiding the problem of single node leakage causing other node system crashes, and can effectively ensure the normal operation of other nodes, with a three-level anti-leakage treatment effect.

[0057] like Figure 1 and Figure 8As shown, in this embodiment, the heat dissipation assembly 10 includes a CPU liquid cooling plate, a liquid cooling pipe 11 and a joint assembly, wherein the CPU liquid cooling plate can be arranged on the motherboard 80 to achieve the heat dissipation and cooling function of the motherboard 80, and the liquid cooling pipe 11 is passed through the top of the motherboard 80 and is connected to the CPU liquid cooling plate, thereby realizing the function of supplying liquid to the CPU liquid cooling plate. The joint assembly includes a liquid cooling pipe joint 12 and a joint mounting seat 13 detachably connected to the chassis 90. The liquid cooling pipe joint 12 is arranged at the end of the liquid cooling pipe 11. The liquid cooling pipe joint 12 is a component for connecting the liquid cooling pipe 11 with the external joint 91 on the chassis 90, and the joint mounting seat 13 is also arranged on the chassis 90 and has an installation cavity. At least a part of the liquid cooling pipe joint 12 is installed in the joint mounting seat 13. When the joint mounting seat 13 is installed on the chassis 90, the chassis 90 blocks the side opening of the installation cavity. In this way, the connection position of the liquid cooling pipe joint 12 and the external joint 91 on the chassis 90 and the connection position of the liquid cooling pipe joint 12 and the liquid cooling pipe 11 can be both located in the installation cavity, so that the installation cavity can receive the overflowed cooling medium and effectively prevent the cooling medium from being sprayed. It has the function of four-level anti-leakage liquid treatment. The multi-level anti-leakage liquid treatment structure can effectively prevent leakage from affecting computer equipment, thereby improving the safety and reliability of computer equipment.

[0058] like Fig. 9 and Fig.10 As shown, since multiple groups of liquid cooling tubes 11 can be provided, and different groups of liquid cooling tubes 11 are correspondingly provided with liquid cooling tube joints 12, multiple joint mounting seats 13 can also be provided, so that multiple joint assemblies are provided, and at least some joint assemblies are arranged up and down on the inner wall surface of the chassis 90. In this embodiment, through holes 131 are opened on the top and bottom surfaces of each joint mounting seat 13, and in the two adjacent joint assemblies above and below, the through holes 131 on the bottom surface of the upper joint assembly are aligned with the through holes 131 on the top surface of the lower joint assembly, so that the cooling medium in the upper joint assembly can flow through the lower joint assembly through the through holes 131, and the cooling medium overflowing from the upper and lower joint mounting seats 13 is sequentially guided from top to bottom to the lowest joint mounting seat 13, and then flows into the water receiving trough on the bottom wall of the chassis 90 through the through holes 131 on the bottom surface of the lowest joint mounting seat 13, so as to achieve unified collection of leaked liquid and prevent leakage of cooling medium.

[0059] like Figure 8As shown, the top of the joint mounting seat 13 of this embodiment is open, so as to facilitate the installation of the liquid cooling pipe joint 12. At the same time, a top cover 132 that can be opened and closed is provided on the top of the joint mounting seat 13, so that the top opening can be opened and closed. A side plate is provided on the side of the joint mounting seat 13, and the side plate has a bypass port 133 for avoiding the liquid cooling pipe 11. The bypass port 133 is opened from top to bottom and is U-shaped. The bypass port 133 plays a role in avoiding the installation of the liquid cooling pipe 11. In this way, the liquid cooling pipe joint 12 can be installed in the installation cavity from the top of the joint mounting seat 13, and then the top cover 132 can be flipped and closed to ensure that the liquid cooling pipe joint 12 is stably installed in the joint mounting seat 13. As for the liquid cooling pipe 11, due to the setting of the bypass port 133, the liquid cooling pipe 11 can pass through the bypass port 133 and thus be connected to the liquid cooling pipe joint 12.

[0060] In this embodiment, a labor-saving handle 134 is also provided on the joint mounting seat 13, so that it is convenient for personnel to operate the liquid cooling pipe joint 12 and the external joint 91 on the chassis 90 to plug and connect. At the same time, a flow-blocking cotton 135 is provided at the front end of the joint mounting seat 13 that contacts the chassis 90, so that the flow-blocking cotton 135 is located between the joint mounting seat 13 and the inner wall of the chassis 90, which can prevent the sprayed cooling medium from leaking. A sealing ring can be provided between the liquid cooling pipe joint 12 and the liquid cooling pipe 11 to ensure the sealing of the connection between the liquid cooling pipe joint 12 and the liquid cooling pipe 11 and reduce leakage.

[0061] In this embodiment, positioning structures 121 are provided on both sides of the liquid cooling pipe joint 12, and the positioning structures 121 are positioned and matched with the chassis 90 and / or the joint mounting seat 13. The positioning structure 121 can be a structure such as a positioning boss, and correspondingly, a positioning through hole 136 is provided on the chassis 90 and the side plate of the joint mounting seat 13, so that when the liquid cooling pipe joint 12 is installed on the side plate, the positioning protrusion 34 on one side can be aligned with the positioning through hole 136 of the side plate, thereby ensuring the accuracy of the liquid cooling pipe joint 12 installed on the joint mounting seat 13, and blind plugging operation can be achieved at the same time. Similarly, when the liquid cooling pipe joint 12 is installed on the chassis 90, the positioning protrusion 34 on the other side can be aligned with the positioning through hole 136 of the chassis 90, thereby ensuring the accuracy of the liquid cooling pipe joint 12 installed on the chassis 90, and blind plugging operation can also be achieved at the same time.

[0062] In this embodiment, the liquid cooling pipe joint 12 and the joint mounting seat 13, and the joint mounting seat 13 and the chassis 90 can be connected by bolts, so that the connection is simple, stable and reliable. During assembly, the liquid cooling pipe joint 12 is first installed in the joint mounting seat 13, and then the liquid cooling pipe 11 is connected to the liquid cooling pipe joint 12, and finally the joint mounting seat 13 is installed on the chassis 90.

[0063] like Figure 1 and Fig.10 As shown, the joint assembly of this embodiment also includes a fixing part 14, which is arranged between the liquid cooling tube 11 and the main board 80 and is located at the edge of the main board 80, so that the segment of the liquid cooling tube 11 at the edge of the main board 80 is fixedly installed together with the main board 80 through the fixing part 14, thereby ensuring the accurate and stable position of the liquid cooling tube 11.

[0064] Optionally, the cooling system also includes a water pump, which can be installed and fixed at any position in the chassis 90, such as fixed to the rear window of the computer device. When the leakage is detected to reach a certain level, the water pump starts to work, and the four-node integrated diversion guides the leaked coolant to the outside of the computer device.

[0065] This embodiment also provides a computer device, including a motherboard 80, a component 100 and the above-mentioned heat dissipation system, wherein the heat dissipation component 10 of the heat dissipation system is arranged on the motherboard 80, the component 100 and the heat transfer installation component 20 of the heat dissipation system are detachably arranged on the motherboard 80, and the component 100 is a component to be dissipated and is detachably matched with the heat transfer installation component 20. The specific matching mode between the motherboard 80, the component 100 and the components of the heat dissipation system has been described above, and thus will not be repeated here.

[0066] The computer device in this embodiment is specifically a server. Of course, the computer device may also be other devices such as a personal computer.

[0067] The computer device of this embodiment further includes a chassis 90, which has an external connector 91, and the heat dissipation assembly 10 is connected to the external connector 91. The matching mode between the chassis 90 and the heat dissipation assembly 10 has been described above and will not be repeated here.

[0068] It should be noted that, the multiple in the above embodiments refers to at least two.

[0069] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0070] 1. Solve the problem of leakage of cold plates of computer equipment memory and other devices in related technologies;

[0071] 2. The heat generated by components such as memory can be transferred to the heat transfer installation component, and the heat on the heat transfer installation component is further transferred to the heat dissipation component through the heat transfer intermediate component, so that the heat dissipation of components such as memory no longer requires additional liquid cooling components. Only the heat dissipation component on the motherboard can be used to achieve the heat dissipation of the motherboard and the memory and other components on it;

[0072] 3. It is no longer necessary to set up structures such as memory cold plates, thereby reducing the complexity of the overall structure and facilitating installation;

[0073] 4. Due to the reduction in the number of cold plates, the number of pipelines is greatly reduced, the number of pipeline joints is small, and the structure is simple, thereby reducing the possibility of leakage and ensuring the safety and reliability of computer equipment;

[0074] 5. Installing the elastic member can make the heat transfer installation assembly adapt to different types of memory, and at the same time play a certain role in reducing the vibration of the memory, and make a certain space between the first clamping plate and the second clamping plate, so that more memory of different thicknesses can be adapted, and the versatility and heat dissipation performance can be improved, and the situation that the heat conduction member and the memory cannot be fully fitted and the heat dissipation is effectively avoided when the thickness of the memory is thin;

[0075] 6. When disassembling, the heat transfer installation component can be disassembled separately, and the memory can be replaced separately. There is no need to disassemble the cold plate mechanism as a whole, which is convenient for operation and improves the operation and maintenance efficiency. In addition, in application scenarios where there is no liquid cooling requirement for the memory or the memory is not fully equipped, the heat transfer installation component can be removed to reduce the space occupied by the heat transfer installation component except the heat dissipation component.

[0076] 7. The multi-level anti-leakage treatment structure can effectively prevent leakage from affecting computer equipment, thereby improving the safety and reliability of computer equipment.

[0077] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0078] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0079] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0080] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation system, characterized in that: include: Heat dissipation component (10); at least one heat transfer installation component (20), the heat transfer installation component (20) being detachably arranged, the component to be dissipated heat being detachably installed in the heat transfer installation component (20) and cooperating with the heat transfer installation component (20) in heat transfer; A heat transfer intermediate component (30), the heat transfer intermediate component (30) being arranged between the heat transfer mounting component (20) and the heat dissipation component (10), and transferring heat from the heat transfer mounting component (20) to the heat dissipation component (10) for heat dissipation.

2. The heat dissipation system according to claim 1, characterized in that: The heat transfer mounting assembly (20) comprises: A first splint (21); A second clamping plate (22), a mounting area for clamping and mounting the component to be cooled is formed between the first clamping plate (21) and the second clamping plate (22), the first clamping plate (21) and the second clamping plate (22) cooperate with the component to be cooled in heat transfer, the first clamping plate (21) and the second clamping plate (22) have heat transfer ends, the heat transfer ends are located in the heat transfer intermediate component (30) and are in contact with the heat transfer intermediate component (30) for heat transfer.

3. The heat dissipation system according to claim 2, characterized in that: The heat transfer mounting assembly (20) further comprises a heat conducting member (23), wherein the heat conducting member (23) is arranged on the inner wall of the first clamping plate (21) and / or the second clamping plate (22), and is located between the first clamping plate (21) and / or the second clamping plate (22) and the component to be cooled. The component to be cooled contacts the first clamping plate (21) and / or the second clamping plate (22) for heat transfer via the heat conducting member (23).

4. The heat dissipation system according to claim 2, characterized in that: The heat transfer installation assembly (20) further comprises an installation elastic member (24), wherein the installation elastic member (24) is arranged on the inner wall of the first clamping plate (21) and / or the second clamping plate (22), and the installation elastic member (24) is limitedly matched with the component to be cooled and controls the position of the component to be cooled within the installation area.

5. The heat dissipation system according to claim 1, characterized in that: The heat transfer intermediate component (30) comprises: A seat body (31), the seat body (31) having at least one accommodating cavity, at least a portion of the heat transfer intermediate component (30) being inserted into the accommodating cavity; A cover body (32) is movably connected to the base body (31) and has a closed position for shielding the accommodating cavity and an open position for avoiding the accommodating cavity. A locking structure (35) for locking is provided between the cover body (32) and the base body (31). The locking structure (35) comprises at least one of a snap-fit ​​structure, a magnetic attraction structure, and a fastener structure.

6. The heat dissipation system according to claim 5, characterized in that: The heat transfer installation assembly (20) and the accommodating cavity are both multiple and arranged in one-to-one correspondence; and / or The heat transfer intermediate component (30) further comprises a heat transfer elastic member (33), wherein the heat transfer elastic member (33) is arranged on the inner wall of the accommodating cavity and abuts against the heat transfer mounting component (20) to limit the position of the heat transfer mounting component (20) in the accommodating cavity; and / or The heat transfer intermediate component (30) further comprises a positioning protrusion (34), wherein the positioning protrusion (34) is located on one side of the seat body (31) and is positioned and matched with the positioning hole (81) of the external component.

7. The heat dissipation system according to claim 1, characterized in that: There are a plurality of heat transfer intermediate components (30), and both ends of the heat transfer installation component (20) are provided with the heat transfer intermediate components (30).

8. The heat dissipation system according to claim 7, characterized in that: The heat dissipation system further comprises an operating component (40), wherein the operating component (40) comprises: An operating member (41), wherein the operating member (41) is movably arranged; An operating elastic member (42), wherein the operating elastic member (42) is arranged on the heat transfer mounting assembly (20), and when the operating member (41) moves, it squeezes the operating elastic member (42) and drives the heat transfer mounting assembly (20) to be pressed onto the heat transfer intermediate assembly (30) through the operating elastic member (42).

9. The heat dissipation system according to any one of claims 1 to 8, characterized in that: The heat dissipation system further comprises a liquid leakage detection component (50), wherein the liquid leakage detection component (50) is arranged at the heat dissipation component (10) and detects liquid leakage at the heat dissipation component (10).

10. The heat dissipation system according to any one of claims 1 to 8, characterized in that: The heat dissipation system further comprises a water receiving member (60), wherein the water receiving member (60) is arranged below at least a portion of the heat dissipation component (10) and is used to receive cooling medium leaking from the heat dissipation component (10).

11. The heat dissipation system according to any one of claims 1 to 8, characterized in that: The heat dissipation system further comprises a node base (70), wherein the node base (70) is arranged below at least a portion of the heat dissipation assembly (10), the node base (70) having a cavity (71), a water retaining structure (72) being arranged at the bottom edge of the cavity (71), a water absorbing member (73) being arranged on the inner side of the water retaining structure (72), and the bottom surface of the cavity (71) of the node base (70) is a non-porous structure.

12. The heat dissipation system according to any one of claims 1 to 8, characterized in that: The heat dissipation assembly (10) comprises a liquid cooling pipe (11) and a joint assembly, wherein the joint assembly comprises: A liquid cooling pipe joint (12), wherein the liquid cooling pipe joint (12) is arranged at an end of the liquid cooling pipe (11); A joint mounting seat (13) detachably connected to a chassis (90), the joint mounting seat (13) having a mounting cavity, at least a portion of the liquid cooling pipe joint (12) being mounted in the joint mounting seat (13), and when the joint mounting seat (13) is mounted on the chassis (90), the chassis (90) blocks a side opening of the mounting cavity, and the mounting cavity is capable of receiving leaked cooling medium.

13. The heat dissipation system according to claim 12, characterized in that: The top and bottom surfaces of the joint mounting seat (13) both have through holes (131), there are a plurality of joint assemblies, at least some of the joint assemblies are arranged vertically, and in two adjacent joint assemblies, the through holes (131) on the bottom surface of the upper joint assembly are aligned with the through holes (131) on the top surface of the lower joint assembly, and the cooling medium in the upper joint assembly flows through the lower joint assembly via the through holes (131); and / or The liquid cooling pipe joint (12) has a positioning structure (121), and the positioning structure (121) is positioned and matched with the chassis (90) and / or the joint mounting seat (13); and / or The top of the joint mounting seat (13) is provided with an openable top cover (132), and the side wall of the joint mounting seat (13) is provided with an escape opening (133) for evading the liquid cooling pipe (11); the liquid cooling pipe joint (12) is installed in the installation cavity through the top of the joint mounting seat (13), and the liquid cooling pipe (11) passes through the escape opening (133) to be connected to the liquid cooling pipe joint (12).

14. A computer device, characterized in that: A heat dissipation system comprising a mainboard (80), a component (100) and any one of claims 1 to 13, wherein a heat dissipation component (10) of the heat dissipation system is arranged on the mainboard (80), the component (100) and a heat transfer mounting component (20) of the heat dissipation system are detachably arranged on the mainboard (80), and the component (100) is a component to be dissipated and is detachably matched with the heat transfer mounting component (20).

15. The computer device according to claim 14, characterized in that The computer device further comprises a chassis (90), the chassis (90) having an external connector (91), and the heat dissipation component (10) is connected to the external connector (91) in a docking connection.

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