Cooling systems and computer equipment

Abstract

This application provides a heat dissipation system and a computer device. The heat dissipation system includes: a heat dissipation component; at least one heat transfer mounting component, which is detachably mounted and has heat-transfer cooperation with the component to be dissipated; and a heat transfer intermediate component, disposed between the heat transfer mounting component and the heat dissipation component, which transfers heat from the heat transfer mounting component to the heat dissipation component for cooling. This application solves the problem of liquid leakage in the cold plates of computer devices such as memory in related technologies.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to a heat dissipation system and a computer device. Background Technology

[0002] Currently, traditional air cooling methods are increasingly unable to meet the heat dissipation requirements of high-power applications, making liquid cooling an important direction in the field of computer equipment heat dissipation. Besides the CPU, many other components inside computer equipment require heat dissipation, such as memory. Traditional memory heatsinks are typically installed between two memory modules, forming a fixed structure with limited space, making it difficult to route leak detection lines and cover all memory modules. When a memory heatsink leaks, the system cannot respond quickly enough, leading to coolant leakage onto the motherboard, causing a short circuit and system crash. Leaking coolant poses risks to the hardware and data security of computer equipment. Furthermore, for multi-node computer equipment, a leak at one node can affect the next, significantly increasing the maintenance costs of liquid-cooled multi-node computer equipment. Summary of the Invention

[0003] This application provides a heat dissipation system and a computer device to at least solve the problem of liquid leakage in the cold plates of computer devices such as memory in related technologies.

[0004] According to one aspect of this application, a heat dissipation system is provided, comprising: a heat dissipation component; at least one heat transfer mounting component, the heat transfer mounting component being detachably disposed, the component to be dissipated being detachably mounted in the heat transfer mounting component and engaging with the heat transfer mounting component in a heat transfer cooperation; and a heat transfer intermediate component, the heat transfer intermediate component being disposed between the heat transfer mounting component and the heat dissipation component, and transferring the heat from the heat transfer mounting component to the heat dissipation component for heat dissipation.

[0005] Furthermore, the heat transfer mounting assembly includes: a first clamping plate; a second clamping plate, with an mounting area formed between the first clamping plate and the second clamping plate for clamping and mounting the component to be cooled, the first clamping plate and the second clamping plate engaging in heat transfer with the component to be cooled, the first clamping plate and the second clamping plate having heat transfer ends located within the heat transfer intermediate assembly and in contact with the heat transfer intermediate assembly for heat transfer.

[0006] Furthermore, the heat transfer mounting assembly also includes a heat-conducting element disposed on the inner wall of the first clamping plate and / or the second clamping plate, and located between the first clamping plate and / or the second clamping plate and the component to be cooled, wherein the component to be cooled contacts the first clamping plate and / or the second clamping plate for heat transfer through the heat-conducting element.

[0007] Furthermore, the heat transfer mounting assembly also includes a mounting elastic element, which is disposed on the inner wall of the first clamping plate and / or the second clamping plate. The mounting elastic element is matched with the component to be cooled and controls the position of the component to be cooled within the mounting area.

[0008] Furthermore, the heat transfer intermediate assembly includes: a base having at least one receiving cavity, wherein at least a portion of the heat transfer intermediate assembly is inserted into the receiving cavity; and a cover being movably connected to the base and having a closed position that blocks the receiving cavity and an open position that avoids the receiving cavity. A locking structure for locking is provided between the cover and the base, the locking structure including at least one of a snap-fit ​​structure, a magnetic structure, and a fastener structure.

[0009] Furthermore, there are multiple heat transfer mounting components and receiving cavities, and they are arranged in a one-to-one correspondence; and / or the heat transfer intermediate component also includes a heat transfer elastic element, which is disposed on the inner wall of the receiving cavity and abuts against the heat transfer mounting component to limit the position of the heat transfer mounting component in the receiving cavity; and / or the heat transfer intermediate component also includes a positioning protrusion, which is located on one side of the base and is positioned and engaged with the positioning hole of the external component.

[0010] Furthermore, there are multiple heat transfer intermediate components, and heat transfer intermediate components are provided at both ends of the heat transfer mounting component.

[0011] Furthermore, the heat dissipation system also includes an operating component, which includes: an operating member that is movably set; and an operating elastic member that is set on the heat transfer mounting component. When the operating member moves, it presses against the operating elastic member and drives the heat transfer mounting component to press against the heat transfer intermediate component.

[0012] Furthermore, the heat dissipation system also includes a leakage detection device, which is installed at the heat dissipation assembly and detects leakage at the heat dissipation assembly.

[0013] Furthermore, the heat dissipation system also includes a water receiving component, which is located below at least part of the heat dissipation components and is used to receive cooling medium that leaks from the heat dissipation components.

[0014] Furthermore, the heat dissipation system also includes a node base, which is located below at least part of the heat dissipation components. The node base has a cavity, and a water-blocking structure is provided at the bottom edge of the cavity. A water-absorbing component is provided inside the water-blocking structure. The bottom surface of the cavity of the node base is a non-porous structure.

[0015] Furthermore, the heat dissipation assembly includes a liquid cooling pipe and a connector assembly. The connector assembly includes: a liquid cooling pipe connector disposed at the end of the liquid cooling pipe; and a connector mounting base detachably connected to the chassis, the connector mounting base having a mounting cavity, at least a portion of the liquid cooling pipe connector being installed in the connector mounting base. When the connector mounting base is installed in the chassis, the chassis covers the side opening of the mounting cavity, and the mounting cavity is capable of receiving leaked cooling medium.

[0016] Furthermore, the top and bottom surfaces of the connector mounting base both have through holes, and there are multiple connector assemblies, with at least some connector assemblies arranged vertically. In two adjacent connector assemblies, the through hole on the bottom surface of the upper connector assembly is aligned with the through hole on the top surface of the lower connector assembly. The cooling medium in the upper connector assembly flows through the through hole to the lower connector assembly. And / or the liquid cooling pipe connector has a positioning structure that is positioned and engaged with the chassis and / or the connector mounting base. And / or the top of the connector mounting base has an openable top cover, and the side wall of the connector mounting base has a clearance opening for avoiding the liquid cooling pipe. The liquid cooling pipe connector is installed from the top of the connector mounting base into the mounting cavity, and the liquid cooling pipe passes through the clearance opening and connects to the liquid cooling pipe connector.

[0017] According to another aspect of this application, a computer device is provided, including a motherboard, components, and the aforementioned heat dissipation system. The heat dissipation component of the heat dissipation system is disposed on the motherboard, and the components and the heat transfer mounting component of the heat dissipation system are detachably disposed on the motherboard. The components are parts to be cooled and are detachably engaged with the heat transfer mounting component.

[0018] Furthermore, the computer equipment also includes a chassis, which has external connectors, and the heat dissipation components are connected to the external connectors.

[0019] The technical solution of this application includes a heat transfer mounting assembly and a heat transfer intermediate assembly. The heat transfer mounting assembly serves two purposes: firstly, it mounts the component to be cooled, securing it in place; secondly, it dissipates heat, transferring heat generated by the component to the mounting assembly. Combined with the heat transfer function of the intermediate assembly, the heat from the mounting assembly is further transferred to the cooling assembly. This eliminates the need for additional liquid cooling components; the existing cooling assembly is sufficient for cooling the component. This design eliminates the need for separate cold plates, reducing overall structural complexity and facilitating installation. Furthermore, the reduced number of cold plates significantly reduces the number of pipes and joints, simplifying the structure and minimizing the possibility of leakage, thus ensuring the safety and reliability of the computer equipment. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the heat dissipation system of this application;

[0021] Figure 2 This is an exploded view of the heat transfer installation components;

[0022] Figure 3 This is a schematic diagram of the structure of the heat transfer intermediate component;

[0023] Figure 4 This is a schematic diagram of the structure of the heat transfer mounting assembly installed on the motherboard;

[0024] Figure 5 This is a structural diagram of the operating component;

[0025] Figure 6 This is a structural diagram of the water inlet fitting;

[0026] Figure 7 This is a structural schematic diagram of the node base;

[0027] Figure 8 This is an exploded view of the liquid cooling pipe joint and its mounting base;

[0028] Figure 9 This is a schematic diagram of the connector mounting base being installed on the chassis;

[0029] Figure 10 This is a structural diagram of the connector mounting base on a computer device.

[0030] 10. Heat dissipation assembly; 11. Liquid cooling pipe; 12. Liquid cooling pipe connector; 121. Positioning structure; 13. Connector mounting base; 131. Through hole; 132. Top cover; 133. Clearance opening; 134. Effort-saving handle; 135. Flow-blocking cotton; 136. Positioning through hole; 14. Fixing component; 20. Heat transfer mounting assembly; 21. First clamping plate; 22. Second clamping plate; 23. Heat-conducting component; 24. Mounting elastic component; 25. Knob; 26. Slot; 30. Heat transfer intermediate assembly; 31. Base body; 32. Cover; 33. Heat transfer elastic element; 34. Positioning protrusion; 35. Locking structure; 40. Operating component; 41. Operating element; 42. Operating elastic element; 43. Hand-tightening screw; 44. Operating limit part; 50. Leakage detection element; 60. Water receiving element; 61. Elastic hook; 70. Node base; 71. Cavity; 72. Water-blocking structure; 73. Water-absorbing element; 74. Protrusion structure; 80. Main board; 81. Positioning hole; 90. Chassis; 91. External connector; 100. Components. Detailed Implementation

[0031] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0033] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0034] To address the problem of liquid leakage in the cold plates of computer equipment components such as memory in related technologies, embodiments of this application provide a heat dissipation system and a computer device.

[0035] like Figures 1 to 10 The heat dissipation system shown includes a heat dissipation component 10, at least one heat transfer mounting component 20, and a heat transfer intermediate component 30. The heat transfer mounting component 20 is detachably disposed, and the component to be dissipated is detachably mounted in the heat transfer mounting component 20 and cooperates with the heat transfer mounting component 20 for heat transfer. The heat transfer intermediate component 30 is disposed between the heat transfer mounting component 20 and the heat dissipation component 10, and transfers the heat from the heat transfer mounting component 20 to the heat dissipation component 10 for heat dissipation.

[0036] This embodiment incorporates a heat transfer mounting assembly 20 and a heat transfer intermediate assembly 30. The heat transfer mounting assembly 20 serves two purposes: firstly, it mounts the component to be cooled, securing it in place; secondly, it dissipates heat, transferring heat generated by the component to the mounting assembly 20. Combined with the heat transfer function of the intermediate assembly 30, the heat from the mounting assembly 20 is further transferred to the heat dissipation assembly 10. This eliminates the need for additional liquid cooling components; the existing heat dissipation assembly 10 suffices. This design eliminates the need for separate cold plates, reducing overall structural complexity and facilitating installation. Furthermore, the reduced number of cold plates significantly decreases the number of pipes and joints, simplifying the structure and reducing the likelihood of leaks, thus ensuring the safety and reliability of the computer equipment.

[0037] This embodiment uses component 100 mounted on the motherboard 80 as an example to illustrate the component to be cooled. More specifically, component 100 is described as memory. Correspondingly, the heat transfer mounting assembly 20 is essentially a component for cooling the memory. The heat dissipation assembly 10 can be a component such as the CPU cold plate on the motherboard 80. Of course, component 100 can also be other components on the motherboard 80 that need to be cooled, and the component to be cooled can also be other components.

[0038] like Figure 2 As shown, in this embodiment, the heat transfer mounting assembly 20 includes a first clamping plate 21 and a second clamping plate 22. Both the first clamping plate 21 and the second clamping plate 22 are plate-shaped. Since the memory is generally inserted vertically into the slot on the motherboard 80, the first clamping plate 21 and the second clamping plate 22 in this embodiment are also arranged vertically. The first clamping plate 21 and the second clamping plate 22 form a mounting area for clamping and mounting the component 100. In this way, when the memory is installed onto the heat transfer mounting assembly 20, the memory is installed by clamping it with the first clamping plate 21 and the second clamping plate 22. At the same time, the clamping arrangement can also ensure the heat transfer effect between the memory and the first clamping plate 21 and the second clamping plate 22, ensuring that more of the heat generated by the memory can be transferred to the heat transfer mounting assembly 20. In addition, in this embodiment, heat transfer ends are provided at the ends of the first clamping plate 21 and the second clamping plate 22. The heat transfer ends are located inside the heat transfer intermediate assembly 30 and contact the heat transfer intermediate assembly 30 for heat transfer. In this way, the heat generated by the memory is transferred to the first clamping plate 21 and the second clamping plate 22, and then transferred to the heat transfer mounting assembly 20 through the heat transfer end on them, and then transferred from the heat transfer mounting assembly 20 to the heat dissipation assembly 10, thereby achieving heat dissipation of the memory.

[0039] To achieve efficient heat transfer of the memory, the heat transfer mounting assembly 20 in this embodiment further includes a heat-conducting element 23. The heat-conducting element 23 can be a structure such as a heat-conducting pad. The heat-conducting element 23 is disposed on the inner wall of the first clamping plate 21 and / or the second clamping plate 22, and is located between the first clamping plate 21 and / or the second clamping plate 22 and the component 100. In this embodiment, heat-conducting elements 23 are preferably disposed between the first clamping plate 21 and the memory, and between the second clamping plate 22 and the memory, so that the heat generated by the memory can be transferred to the first clamping plate 21 and the second clamping plate 22 through the heat-conducting elements 23 on both sides, thereby improving the heat transfer effect and thus improving the heat dissipation effect.

[0040] Preferably, the area of ​​the heat-conducting element 23 is approximately the same as the size of the memory, which helps to increase the heat transfer area and improve the heat transfer effect.

[0041] In this embodiment, the heat transfer mounting assembly 20 further includes a mounting elastic element 24. The mounting elastic element 24 can be a spring or similar component. The mounting elastic element 24 is disposed on the inner wall of the first clamping plate 21 and / or the second clamping plate 22, and engages with the component 100 for positioning. In this embodiment, mounting elastic elements 24 are provided above the inner surfaces of both the first clamping plate 21 and the second clamping plate 22, thereby limiting the upward movement of the memory module and keeping the component 100 within the mounting area, thus controlling the position of the component 100. Because the mounting elastic element 24 has a certain degree of elasticity, there is sufficient space for its positioning contact with the memory module. This allows the mounting elastic element 24 to adapt to different memory module models while also providing some vibration damping for the memory module. Simultaneously, the mounting elastic element 24 allows for some movement between the first clamping plate 21 and the second clamping plate 22, enabling greater adaptation to memory modules of different thicknesses, improving versatility and heat dissipation performance, and effectively preventing situations where the heat-conducting component 23 cannot fully adhere to the memory module when the memory module is thin, thus affecting heat dissipation. Of course, other types of components can be used to install the elastic element 24, and its setting position can also be adjusted accordingly, as long as it can play a role in restricting the memory location.

[0042] In this embodiment, the first clamping plate 21 and the second clamping plate 22 have basically the same structure. Taking the first clamping plate 21 as an example, the middle part of the first clamping plate 21 is the main body. The inner side of the main body is provided with a heat-conducting component 23 to achieve cooperation with the memory. The end sides of both ends of the main body are provided with extension sections extending along the length direction. The extension sections serve to cooperate with the heat transfer intermediate component 30. That is, the heat transfer mounting component 20 is installed and cooperated with the heat transfer intermediate component 30 through the extension section. On the other hand, the extension section has a heat transfer end to achieve the heat transfer effect between the heat transfer mounting component 20 and the heat transfer intermediate component 30.

[0043] In this embodiment, quick-connect structures are provided at both ends of the extended sections of the first clamping plate 21 and the second clamping plate 22. The quick-connect structures include a knob 25 and a slot 26. The knob 25 is located on the first clamping plate 21, and the slot 26 is located on the second clamping plate 22. One end of the knob 25 has a non-circular structure, and the shape of the slot 26 matches the non-circular structure. The knob 25 can move axially and can be rotated. When it is necessary to connect the first clamping plate 21 and the second clamping plate 22 together, the operator presses the knob 25 to make the non-circular structure extend into the slot 26, and then rotates the knob 25 to make the non-circular structure misaligned with the slot 26. At this time, the structural characteristics of the non-circular structure can be used to make it lock in the slot 26, thereby realizing the quick connection and fixation of the first clamping plate 21 and the second clamping plate 22 together, which is convenient for operation. Similarly, during disassembly, the heat transfer mounting component 20 can be removed separately, and the memory module can be replaced individually without disassembling the entire cold plate mechanism. This simplifies operation and improves maintenance efficiency. Furthermore, in applications where the memory does not require liquid cooling or the memory is not fully configured, the heat transfer mounting component 20 can be removed, reducing the space occupied by the heat transfer mounting component 20 (excluding the heat dissipation component 10). Of course, in addition to the quick-installation structure described above, other structural forms can also be used, as long as the connection between the first clamping plate 21 and the second clamping plate 22 can be achieved.

[0044] In this embodiment, clearance grooves are also provided on the first clamping plate 21 and the second clamping plate 22. The clearance grooves are used to avoid some components on the memory, so as to avoid damage to the memory.

[0045] Since multiple memory modules are typically installed on the motherboard 80, multiple heat transfer mounting components 20 are also provided in this embodiment. Preferably, each heat transfer mounting component 20 is configured in a one-to-one correspondence with a memory module, so that each memory module can transfer and dissipate heat through its corresponding heat transfer mounting component 20, ensuring heat dissipation effect. Of course, multiple memory modules can be installed in each heat transfer mounting component 20. Alternatively, if only one memory module needs to be installed, only one heat transfer mounting component 20 can be provided.

[0046] like Figure 3As shown, the heat transfer intermediate assembly 30 of this embodiment includes a base 31 and a cover 32. The base 31 has at least one receiving cavity, and at least a portion of the heat transfer intermediate assembly 30 is inserted into the receiving cavity. In this embodiment, the side and top surfaces of the receiving cavity are both open, so that the extensions of the first clamping plate 21 and the second clamping plate 22 can extend into and be installed in the receiving cavity. The cover 32 is movably connected to the base 31. In this embodiment, the cover 32 is flipped over and placed above the receiving cavity. Thus, the cover 32 has a closed position that blocks the receiving cavity and an open position that avoids the receiving cavity. When the heat transfer mounting assembly 20 needs to be installed, the cover 32 is flipped upward to open it, and then the heat transfer mounting assembly 20 containing the memory can be inserted into the receiving cavity from top to bottom. Then, the cover 32 is flipped in the opposite direction to switch the cover 32 to the closed position. This blocks the path of the heat transfer mounting assembly 20 out of the heat transfer intermediate assembly 30 and fixes the heat transfer mounting assembly 20 on the heat transfer intermediate assembly 30. This can not only realize the installation and fixation of the heat transfer mounting assembly 20, but also ensure the stable and reliable heat transfer between the heat transfer mounting assembly 20 and the heat transfer intermediate assembly 30.

[0047] In this embodiment, a locking structure 35 for locking is also provided between the cover 32 and the base 31. The locking structure 35 is located at the other end where the cover 32 and the base 31 are rotatably connected. The locking structure 35 includes at least one of a snap-fit ​​structure, a magnetic attraction structure, and a fastener structure. Thus, when the cover 32 moves to the closed position, the cover 32 can be locked to the base 31 through the locking structure 35, thereby ensuring that the cover 32 remains in the closed position and ensuring the reliability of the connection between the heat transfer mounting assembly 20 and the heat transfer intermediate assembly 30. In this embodiment, the locking structure 35 adopts a magnetic attraction structure, that is, a magnetic element is provided between the base 31 and the cover 32. When the cover 32 is in the closed position, the magnetic element is attracted to the other component by magnetic attraction, thereby locking the cover 32 and the base 31 together. Of course, other structural forms such as snap-fits can also be used.

[0048] Since multiple heat transfer mounting components 20 are provided, multiple receiving cavities can also be provided on the base 31. The receiving cavities are arranged along the arrangement direction between the heat transfer mounting components 20, and the cover 32 covers all the receiving cavities, so that all the receiving cavities can be opened and closed simultaneously, which is more convenient for operation while ensuring reliability. In order to ensure the heat transfer effect, this embodiment preferably also has multiple receiving cavities, and the receiving cavities are arranged one-to-one with the heat transfer mounting components 20, so that each heat transfer mounting component 20 is installed in the corresponding receiving cavity and heat is transferred through the side wall of the corresponding receiving cavity.

[0049] The heat transfer intermediate component 30 in this embodiment also includes a heat transfer elastic element 33. The heat transfer elastic element 33 can also be a spring sheet or other components. The heat transfer elastic element 33 is disposed on the inner wall of the receiving cavity. In this way, when the heat transfer mounting component 20 is installed in the receiving cavity, the side of the extension section of the heat transfer mounting component 20 can abut against the heat transfer elastic element 33, thereby limiting the position of the heat transfer mounting component 20 in the receiving cavity under the action of the heat transfer elastic element 33, ensuring the stability of the position of the heat transfer mounting component 20, and improving the heat transfer effect between the heat transfer mounting component 20 and the heat transfer intermediate component 30.

[0050] like Figure 4 As shown, the heat transfer intermediate component 30 in this embodiment also includes a positioning protrusion 34. The positioning protrusion 34 is located on the side of the base 31 facing the motherboard 80. In this embodiment, it is located on the bottom surface of the base 31. The positioning protrusion 34 can be positioned and engaged with the positioning hole 81 of the external component, i.e., the motherboard 80. When the heat transfer intermediate component 30 is installed on the motherboard 80, it is only necessary to align the positioning protrusion 34 with the positioning hole 81 to achieve installation and fixation, ensuring accurate and convenient installation of the heat transfer intermediate component 30. The positioning hole 81 on the motherboard 80 can be set as an elongated hole, so that the installation position of the heat transfer intermediate component 30 on the motherboard 80 can be adjusted, thereby adapting to different types of memory and improving adaptability.

[0051] like Figure 1 As shown, this embodiment has multiple heat transfer intermediate components 30, and heat transfer intermediate components 30 are provided at both ends of the length direction of the heat transfer mounting component 20, that is, at both ends of the memory length direction. This allows the heat transfer mounting component 20 to transfer heat simultaneously through the heat transfer intermediate components 30 on both sides, improving heat transfer efficiency. In this embodiment, the heat transfer mounting components 20 are arranged in groups. For example, in this embodiment, there are four groups. The four groups of heat transfer mounting components 20 are located at different positions on the motherboard 80. Each group of heat transfer mounting components 20 has one heat transfer intermediate component 30 on each side, allowing each group of heat transfer mounting components 20 to transfer heat through the two heat transfer intermediate components 30 on its sides. Of course, the specific number, location, and arrangement of the heat transfer intermediate components 30 and the heat transfer mounting components 20 can be adjusted as needed and are not limited to the arrangement described in this embodiment.

[0052] like Figure 4 and Figure 5As shown, in this embodiment, the heat dissipation system further includes an operating component 40, which is used for operation by personnel. The operating component 40 includes an operating member 41 and an operating elastic member 42. The operating member 41 is movably disposed and may be a handle component that saves effort. A hand-tightening screw 43 may be provided on the handle component. The operating elastic member 42 is disposed on the heat transfer mounting assembly 20. In this embodiment, the operating elastic member 42 is a spring. The operating elastic member 42 is disposed on the upper surface of the extension of the first clamping plate 21 and / or the second clamping plate 22, and is exposed in the receiving cavity through the top opening of the receiving cavity. In this way, when the heat transfer mounting assembly 20 is installed into the receiving cavity, the operator can operate the rotating operating member 41. The operating member 41 rotates and approaches the upper surface of the heat transfer mounting assembly 20 until it contacts the operating elastic member 42. The operating member 41 continues to rotate, thereby pressing the operating elastic member 42. The operating elastic member 42 is compressed and transmits its elastic force to the heat transfer mounting assembly 20. This allows the driving force of the operating member 41 to be transmitted to the heat transfer mounting assembly 20 through the operating elastic member 42, achieving the effect of pressing the heat transfer mounting assembly 20 onto the heat transfer intermediate assembly 30. After installation, flipping the cover 32 downwards will hold the heat transfer mounting assembly 20 on the heat transfer intermediate assembly 30. Due to the design of the operating elastic member 42, the heat transfer mounting assembly 20 has a certain amount of movement margin, thereby effectively preventing damage to the memory caused by transportation vibration. At the same time, an operating limit part 44 can also be provided at the rotatable end of the operating member 41 to limit the rotation range of the operating member 41.

[0053] In this embodiment, both the heat transfer mounting assembly 20 and the heat transfer intermediate assembly 30 are made of metal materials with good thermal conductivity, such as copper or aluminum, which helps to improve heat transfer performance.

[0054] like Figure 1 As shown, in this embodiment, the heat dissipation system also includes a leakage detection element 50, which is disposed at the heat dissipation assembly 10 and detects leakage at the heat dissipation assembly 10. In this embodiment, the leakage detection element 50 is a leakage detection cable, which is wound around the connector of the heat dissipation assembly 10, thereby enabling the leakage detection cable to detect leakage. When a cooling medium leak occurs, the leakage detection cable detects the leak and transmits the leakage signal to the motherboard 80, allowing maintenance personnel to handle the leakage, thus enabling the leakage detection cable to provide primary leakage prevention.

[0055] like Figure 1 and Figure 6As shown, in addition to the aforementioned leak detection line, the heat dissipation system of this embodiment also includes a water receiving component 60. The water receiving component 60 is a water receiving tank and is located below at least part of the heat dissipation components 10. In this embodiment, the water receiving component 60 is mainly located below the joint of the heat dissipation components 10, so that the water receiving component 60 can receive the cooling medium that overflows from the heat dissipation components 10. In this embodiment, the water receiving component 60 is assembled to the heat dissipation components 10 by means of elastic hooks 61 provided thereon. The connection between the water receiving component 60 and other components is coated with sealant to ensure that the coolant at the joint can be safely guided into the water receiving component 60 without leaking onto the motherboard 80. This allows for a certain degree of accumulation of the cooling medium, effectively preventing problems that maintenance personnel cannot detect in time when leaks occur, and giving maintenance personnel a certain response time. It has the function of secondary leak prevention treatment. The aforementioned leak detection line and water receiving component 60 work together to achieve the function of multi-level leak prevention treatment.

[0056] like Figure 1 and Figure 7 As shown, in this embodiment, the heat dissipation system further includes a node base 70, which is disposed below at least a portion of the heat dissipation components 10. The node base 70 has a cavity 71, and a water-blocking structure 72 is provided at the bottom edge of the cavity 71. In this embodiment, the water-blocking structure 72 is provided at the front end of the node base 70, and a water-absorbing element 73 is provided inside the water-blocking structure 72, that is, inside the node base 70. This serves to collect leaked liquid. In this embodiment, a convex structure 74 is provided inside the cavity 71. The convex structure 74 protrudes upward, thereby having a certain guiding effect and effectively preventing coolant from flowing into the windshield and affecting the electronic components of the windshield, thus causing system shutdown. Meanwhile, the bottom surface of the cavity 71 of the node base 70 is a non-perforated structure. The bottom surface of the node base 70 is connected to other components by non-perforated riveting. In this way, the bottom surface of the node base 70 is sealed, so that the collected cooling medium will not leak out further. This avoids the problem of single node leakage causing other node systems to crash, and can effectively ensure the normal operation of other nodes. It has the function of three-level leakage prevention.

[0057] like Figure 1 and Figure 8As shown, in this embodiment, the heat dissipation assembly 10 includes a CPU liquid cooling plate, a liquid cooling pipe 11, and a connector assembly. The CPU liquid cooling plate can be mounted on the motherboard 80 to achieve the function of heat dissipation and cooling of the motherboard 80. The liquid cooling pipe 11 passes through the top of the motherboard 80 and is connected to the CPU liquid cooling plate to supply liquid to the CPU liquid cooling plate. The connector assembly includes a liquid cooling pipe connector 12 and a connector mounting base 13 detachably connected to the chassis 90. The liquid cooling pipe connector 12 is located at the end of the liquid cooling pipe 11 and is the component that connects the liquid cooling pipe 11 to the external connector 91 on the chassis 90. The connector mounting base 13 is also located on the chassis 90 and has a mounting cavity. At least a portion of the liquid cooling pipe connector 12 is installed in the connector mounting base 13. When the connector mounting base 13 is installed on the chassis 90, the chassis 90 covers the side opening of the mounting cavity. In this way, the connection positions of the liquid cooling pipe connector 12 and the external connector 91 on the chassis 90, and the connection positions of the liquid cooling pipe connector 12 and the liquid cooling pipe 11, can all be located in the mounting cavity. This allows the mounting cavity to receive the overflowing cooling medium, effectively preventing the cooling medium from spraying out. It has a four-level anti-leakage treatment function. The multi-level anti-leakage treatment structure can effectively prevent leakage from affecting the computer equipment and improve the safety and reliability of the computer equipment.

[0058] like Figure 9 and Figure 10 As shown, since multiple sets of liquid cooling pipes 11 can be provided, and different sets of liquid cooling pipes 11 are correspondingly provided with liquid cooling pipe connectors 12, multiple connector mounting bases 13 can also be provided, resulting in multiple connector assemblies. At least some connector assemblies are arranged vertically on the inner wall of the chassis 90. In this embodiment, through holes 131 are provided on the top and bottom surfaces of each connector mounting base 13. In two adjacent connector assemblies, the through hole 131 on the bottom surface of the upper connector assembly is aligned with the through hole 131 on the top surface of the lower connector assembly. In this way, the cooling medium in the upper connector assembly can flow through the through hole 131 to the lower connector assembly. The cooling medium overflowing from the upper and lower connector mounting bases 13 is sequentially guided from top to bottom to the lowermost connector mounting base 13, and then flows into the water collection tank on the bottom wall of the chassis 90 through the through hole 131 on the bottom surface of the lowermost connector mounting base 13, realizing unified collection of leaked liquid and preventing the cooling medium from leaking out.

[0059] like Figure 8As shown, the top of the connector mounting base 13 in this embodiment is open to facilitate the installation of the liquid cooling pipe connector 12. A closable top cover 132 is also provided on the top of the connector mounting base 13, allowing the top opening to be opened and closed. A side plate is provided on the side of the connector mounting base 13, with a clearance opening 133 for avoiding the liquid cooling pipe 11. The clearance opening 133 is U-shaped and extends from top to bottom, serving to prevent the liquid cooling pipe 11 from being installed. Thus, the liquid cooling pipe connector 12 can be installed into the mounting cavity from the top of the connector mounting base 13, and then the top cover 132 can be flipped closed to ensure that the liquid cooling pipe connector 12 is stably installed in the connector mounting base 13. As for the liquid cooling pipe 11, due to the clearance opening 133, the liquid cooling pipe 11 can pass through the clearance opening 133 to connect with the liquid cooling pipe connector 12.

[0060] In this embodiment, a labor-saving handle 134 is also provided on the connector mounting base 13 to facilitate personnel operation in connecting the liquid cooling pipe connector 12 to the external connector 91 on the chassis 90. Simultaneously, a flow-blocking cotton 135 is provided at the front end of the connector mounting base 13 that contacts the chassis 90, ensuring that the flow-blocking cotton 135 is located between the connector mounting base 13 and the inner wall of the chassis 90, thus preventing leakage of the sprayed cooling medium. A sealing ring can be provided between the liquid cooling pipe connector 12 and the liquid cooling pipe 11 to ensure the sealing of the connection between the liquid cooling pipe connector 12 and the liquid cooling pipe 11, reducing the possibility of leakage.

[0061] In this embodiment, positioning structures 121 are provided on both sides of the liquid cooling pipe connector 12. The positioning structures 121 are positioned and engaged with the chassis 90 and / or the connector mounting base 13. The positioning structure 121 can be a positioning protrusion or other structure. Correspondingly, positioning through holes 136 are provided on the side plate of the chassis 90 and the connector mounting base 13. In this way, when the liquid cooling pipe connector 12 is installed on the side plate, the positioning protrusion 34 on one side can be aligned with the positioning through hole 136 on the side plate, thereby ensuring the accuracy of the liquid cooling pipe connector 12 installed on the connector mounting base 13 and enabling blind insertion. Similarly, when the liquid cooling pipe connector 12 is installed on the chassis 90, the positioning protrusion 34 on the other side can be aligned with the positioning through hole 136 on the chassis 90, thereby ensuring the accuracy of the liquid cooling pipe connector 12 installed on the chassis 90 and enabling blind insertion.

[0062] In this embodiment, the liquid cooling pipe connector 12 and the connector mounting base 13, as well as the connector mounting base 13 and the chassis 90, can be connected by bolts, which makes the connection simple, stable and reliable. During assembly, first install the liquid cooling pipe connector 12 into the connector mounting base 13, then connect the liquid cooling pipe 11 to the liquid cooling pipe connector 12, and finally install the connector mounting base 13 onto the chassis 90.

[0063] like Figure 1 and Figure 10 As shown, the connector assembly in this embodiment also includes a fixing member 14. The fixing member 14 is disposed between the liquid cooling pipe 11 and the motherboard 80 and is located at the edge of the motherboard 80, so that the segment of the liquid cooling pipe 11 at the edge of the motherboard 80 is fixedly installed together with the motherboard 80 through the fixing member 14, ensuring the accurate and stable position of the liquid cooling pipe 11.

[0064] Optionally, the cooling system also includes a water pump that can be installed and fixed anywhere within the chassis 90, such as on the rear window of the computer equipment. When a certain level of leakage is detected, the water pump starts to work, and the four-node integrated flow guide directs the leaking coolant to the outside of the computer equipment.

[0065] This embodiment also provides a computer device, including a motherboard 80, components 100, and the aforementioned heat dissipation system. The heat dissipation component 10 of the heat dissipation system is disposed on the motherboard 80. Components 100 and the heat transfer mounting component 20 of the heat dissipation system are detachably disposed on the motherboard 80. Component 100 is a component to be cooled and is detachably coupled to the heat transfer mounting component 20. The specific coupling methods between the motherboard 80, components 100, and the various components of the heat dissipation system have been described above and will not be repeated here.

[0066] In this embodiment, the computer device is specifically a server. Of course, the computer device can also be a personal computer or other devices.

[0067] The computer device in this embodiment also includes a chassis 90, which has an external connector 91. The heat dissipation assembly 10 is connected to the external connector 91. The way the chassis 90 and the heat dissipation assembly 10 are coupled has been described above and will not be repeated here.

[0068] It should be noted that "multiple" in the above embodiments refers to at least two.

[0069] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0070] 1. Solved the problem of liquid leakage in the cold plates of computer equipment memory and other components in related technologies;

[0071] 2. The heat generated by components such as memory can be conducted to the heat transfer mounting component. The heat on the heat transfer mounting component is further transferred to the heat dissipation component through the heat transfer intermediate component. Thus, the heat dissipation of components such as memory no longer requires additional liquid cooling components. The heat dissipation component on the motherboard can be used to dissipate heat from the motherboard and its components such as memory.

[0072] 3. The need for memory cold plates and other structures has been eliminated, reducing the overall complexity of the structure and making installation easier;

[0073] 4. Due to the reduction in the number of cold plates, the number of pipes is greatly reduced, resulting in fewer pipe joints and a simpler structure, which reduces the possibility of leakage and ensures the safety and reliability of computer equipment.

[0074] 5. The installation of elastic components allows the heat transfer mounting assembly to adapt to different models of memory, while also providing some vibration damping for the memory. It also allows for some movement between the first and second clamping plates, enabling it to accommodate more memory modules of different thicknesses, improving versatility and heat dissipation performance. This effectively avoids situations where the heat-conducting components cannot fully fit the memory module when it is thin, thus affecting heat dissipation.

[0075] 6. During disassembly, the heat transfer mounting components can be disassembled separately and the memory can be replaced separately. There is no need to disassemble the entire cold plate mechanism, which facilitates operation and improves maintenance efficiency. Moreover, in application scenarios where the memory does not require liquid cooling or the memory is not fully configured, the heat transfer mounting components can be removed to reduce the space occupied by the heat transfer mounting components other than the heat dissipation components.

[0076] 7. The multi-level leak-proof structure can effectively prevent leakage from affecting computer equipment, thus improving the safety and reliability of the computer equipment.

[0077] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention.

[0078] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0079] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0080] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat dissipation system, characterized in that, include: Heat dissipation component (10); At least one heat transfer mounting assembly (20) is detachably provided, and the component to be cooled is detachably installed in the heat transfer mounting assembly (20) and heat-transfers with the heat transfer mounting assembly (20). A heat transfer intermediate component (30) is disposed between the heat transfer mounting component (20) and the heat dissipation component (10) and transfers the heat from the heat transfer mounting component (20) to the heat dissipation component (10) for heat dissipation. The heat dissipation system further includes an operating component (40), which includes: The operating component (41) is movable and adopts a labor-saving handle component; An operating elastic element (42) is disposed on the heat transfer mounting assembly (20). When the operating element (41) moves, it squeezes the operating elastic element (42) and drives the heat transfer mounting assembly (20) to press against the heat transfer intermediate assembly (30) through the operating elastic element (42). The heat transfer intermediate component (30) includes: The base (31) has at least one receiving cavity, and at least a portion of the heat transfer intermediate assembly (30) is inserted into the receiving cavity; A cover (32) is movably connected to the seat (31) and has a closed position that covers the receiving cavity and an open position that avoids the receiving cavity. A locking structure (35) for locking is provided between the cover (32) and the seat (31). The locking structure (35) includes at least one of a snap-fit ​​structure, a magnetic structure, and a fastener structure. The heat transfer intermediate component (30) further includes a heat transfer elastic element (33), which is disposed on the inner wall of the receiving cavity and abuts against the heat transfer mounting component (20) to limit the position of the heat transfer mounting component (20) in the receiving cavity; The heat transfer intermediate component (30) also includes a positioning protrusion (34), which is located on one side of the base (31) and is positioned and engaged with the positioning hole (81) of the external component.

2. The heat dissipation system according to claim 1, characterized in that, The heat transfer mounting assembly (20) includes: First clamping plate (21); The second clamping plate (22) forms an installation area between the first clamping plate (21) and the second clamping plate (22) for clamping and installing the component to be cooled. The first clamping plate (21) and the second clamping plate (22) are in heat transfer cooperation with the component to be cooled. The first clamping plate (21) and the second clamping plate (22) have heat transfer ends. The heat transfer ends are located inside the heat transfer intermediate assembly (30) and are in contact with the heat transfer intermediate assembly (30) for heat transfer.

3. The heat dissipation system according to claim 2, characterized in that, The heat transfer mounting assembly (20) further includes a heat-conducting element (23), which is disposed on the inner wall of the first clamping plate (21) and / or the second clamping plate (22) and located between the first clamping plate (21) and / or the second clamping plate (22) and the component to be cooled. The component to be cooled contacts the first clamping plate (21) and / or the second clamping plate (22) for heat transfer through the heat-conducting element (23).

4. The heat dissipation system according to claim 2, characterized in that, The heat transfer mounting assembly (20) further includes a mounting elastic element (24), which is disposed on the inner wall of the first clamping plate (21) and / or the second clamping plate (22). The mounting elastic element (24) is in a limiting cooperation with the component to be cooled and controls the position of the component to be cooled in the mounting area.

5. The heat dissipation system according to claim 1, characterized in that, There are multiple heat transfer mounting components (20) and multiple receiving cavities, and they are set up one-to-one.

6. The heat dissipation system according to claim 1, characterized in that, There are multiple heat transfer intermediate components (30), and the heat transfer installation component (20) is provided with heat transfer intermediate components (30) at both ends.

7. The heat dissipation system according to any one of claims 1 to 6, characterized in that, The heat dissipation system also includes a leakage detection element (50), which is disposed at the heat dissipation component (10) and detects leakage at the heat dissipation component (10).

8. The heat dissipation system according to any one of claims 1 to 6, characterized in that, The heat dissipation system also includes a water receiving component (60), which is disposed below at least part of the heat dissipation component (10) and is used to receive cooling medium leaking from the heat dissipation component (10).

9. The heat dissipation system according to any one of claims 1 to 6, characterized in that, The heat dissipation system also includes a node base (70), which is disposed below at least part of the heat dissipation components (10). The node base (70) has a cavity (71), and a water-blocking structure (72) is provided at the bottom edge of the cavity (71). A water-absorbing element (73) is provided on the inner side of the water-blocking structure (72). The bottom surface of the cavity (71) of the node base (70) is a non-porous structure.

10. The heat dissipation system according to any one of claims 1 to 6, characterized in that, The heat dissipation assembly (10) includes a liquid cooling pipe (11) and a connector assembly, the connector assembly including: Liquid cooling pipe connector (12), the liquid cooling pipe connector (12) is disposed at the end of the liquid cooling pipe (11); A connector mounting base (13) is detachably connected to a chassis (90). The connector mounting base (13) has a mounting cavity. At least a portion of the liquid cooling pipe connector (12) is installed in the connector mounting base (13). When the connector mounting base (13) is installed in the chassis (90), the chassis (90) covers the side opening of the mounting cavity. The mounting cavity is capable of receiving leaked cooling medium.

11. The heat dissipation system according to claim 10, characterized in that, The top and bottom surfaces of the connector mounting base (13) both have through holes (131). There are multiple connector assemblies, with at least some of the connector assemblies arranged vertically. In two adjacent connector assemblies, the through hole (131) on the bottom surface of the upper connector assembly is aligned with the through hole (131) on the top surface of the lower connector assembly. The cooling medium in the upper connector assembly flows through the through hole (131) to the lower connector assembly; and / or The liquid cooling pipe connector (12) has a positioning structure (121) that is positioned and engaged with the chassis (90) and / or the connector mounting base (13); and / or The top of the connector mounting base (13) has an openable top cover (132), and the side wall of the connector mounting base (13) has a clearance opening (133) for avoiding the liquid cooling pipe (11). The liquid cooling pipe connector (12) is installed into the mounting cavity from the top of the connector mounting base (13), and the liquid cooling pipe (11) passes through the clearance opening (133) and connects to the liquid cooling pipe connector (12).

12. A computer device, characterized in that, The device includes a motherboard (80), components (100), and a heat dissipation system according to any one of claims 1 to 11. The heat dissipation component (10) of the heat dissipation system is disposed on the motherboard (80). The components (100) and the heat transfer mounting component (20) of the heat dissipation system are detachably disposed on the motherboard (80). The components (100) are components to be dissipated and are detachably engaged with the heat transfer mounting component (20).

13. The computer device according to claim 12, characterized in that, The computer device also includes a chassis (90) having an external connector (91), and the heat dissipation assembly (10) is connected to the external connector (91).

Images