Semiconductor cleaning rotating unit and cleaning equipment

Abstract

The invention discloses a semiconductor cleaning rotating unit and cleaning equipment, and belongs to the technical field of semiconductor cleaning. The semiconductor cleaning rotating unit comprises a mounting assembly, a sweeping assembly, a driving assembly and a dissolving assembly; according to the invention, when dust and metal oxides on the surface of the wafer are treated, the wafer can be put into the cleaning assembly firstly, the connecting ring is driven to rotate through the driving assembly, then the dust on the surface of the wafer can be cleaned, after cleaning is completed, the wafer can be put into the dissolving assembly, and the dust on the surface of the wafer can be removed through an acidic dissolving solution in the dissolving box. And after the metal oxide on the surface of the wafer is dissolved, the screw B can be driven to rotate through the driving assembly, so that the lifting plate drives the wafer to lift, and at the moment, the wafer can be taken out for subsequent processing.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor cleaning, and in particular relates to a semiconductor cleaning rotating unit and cleaning equipment. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials.

[0003] After searching, it was found that a semiconductor cleaning equipment was disclosed in a Chinese patent with authorization announcement number "CN112435943A", which includes: a workbench, characterized in that: a fixed plate is fixedly connected to the upper surface of the workbench, and the two fixed plates are symmetrically distributed with the axis of the workbench as the center, and a controller is fixedly installed on the surface of one of the fixed plates, and the surfaces of the fixed plates are respectively fixedly connected to a first cleaning box and a second cleaning box, the surfaces of the first cleaning box and the second cleaning box are both circular, and the surfaces of the first cleaning box and the second cleaning box are fixedly connected, and a feed trough is fixedly opened on the inner wall of the first cleaning box, and the inner wall of the feed trough is fixedly connected to the inner wall of the second cleaning box, and a feeding control device is provided on the inner wall of the feed trough, and the feeding control device includes a first rotating shaft and a second rotating shaft, and the first rotating shaft and the second rotating shaft are both fixedly rotatably connected to the inner wall of the feed trough.

[0004] In the prior art, before processing a semiconductor, it is usually necessary to clean the dust or metal oxides remaining on the surface of the wafer. In the prior art, when cleaning the dust on the surface of the wafer, workers usually clean it manually, which makes the efficiency low. For this reason, we propose a semiconductor cleaning rotating unit and cleaning equipment to solve the above-mentioned problems. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor cleaning rotation unit and a cleaning device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: A semiconductor cleaning rotating unit, comprising Install components; A cleaning assembly, wherein the cleaning assembly is mounted on the mounting assembly; A driving assembly, wherein the driving assembly is mounted on the cleaning assembly; The cleaning component comprises a lower plate, an upper plate, a connecting ring, an extension arm, a clamping member and a cleaning member, wherein the lower plate is arranged on the mounting assembly, the upper plate is arranged on the lower plate, a mounting groove is provided on the lower plate, the cleaning member is installed in the mounting groove, the connecting ring is rotatably arranged on the lower plate, the extension arm is installed on the connecting ring, and the clamping member is installed on the extension arm; The lower plate comprises a plate body, and an extrusion groove and a material leakage hole are provided on the plate body. The extrusion groove is set to an arc structure, and the extrusion groove is opened counterclockwise. The width of the front 1 / 4 of the extrusion groove gradually decreases, and the width of the rear 3 / 4 remains unchanged, and the two are connected. The material leakage hole is opened at the head and tail connection of the extrusion groove; The clamping member includes an A clamping arm, an A spring, a B spring and a B clamping arm, wherein the B clamping arm is fixedly arranged on the extension arm, and the A clamping arm is slidably arranged on the extension arm. The A spring and the B spring are both installed between the A clamping arm and the B clamping arm, and a sliding block is arranged at the lower end of the A clamping arm, and the sliding block is slidably arranged in the extrusion groove.

[0007] Preferably, the cleaning assembly further comprises an A pipe and a B pipe, a feed hole is provided on the upper plate, the B pipe is installed in the feed hole, and the A pipe is installed in the leakage hole.

[0008] Preferably, the mounting assembly includes a base and a guide member, the base is provided with a mounting hole, the A pipe is arranged in the mounting hole, the guide member is rotatably arranged on the base, and the guide member is arranged directly below the A pipe.

[0009] Preferably, the driving assembly includes a motor and an A driving rod, the motor is arranged above the upper plate, the A driving rod passes through the lower plate and the upper plate and extends out of the surfaces of both, and the connecting ring is installed on the A driving rod, and a connecting hole is opened on the output end of the motor.

[0010] Preferably, the driving assembly also includes an A telescopic rod, an A connecting block, a B telescopic rod, a B connecting block and an A screw rod, the A driving rod is provided with two telescopic holes, the A telescopic rod and the B telescopic rod are respectively arranged in the two telescopic holes, the A connecting block and the B connecting block are symmetrically arranged, and the A connecting block and the B connecting block are respectively installed on the A telescopic rod and the B telescopic rod, the A screw rod is threadedly arranged on the B connecting block, and the A screw rod passes through the connecting hole and is threadedly connected to the A connecting block.

[0011] Preferably, a fixing plate is mounted on the upper plate, and the motor is mounted on the fixing plate.

[0012] A cleaning device includes a dissolving component, on which the semiconductor cleaning rotating unit is installed. The dissolving component includes a dissolving box and a valve. The dissolving box is arranged below a base, the upper end of the dissolving box is hollow, and a drainage hole is opened on the dissolving box, and the valve is installed in the drainage hole.

[0013] Preferably, the dissolving component further comprises a lifting plate and a B screw, wherein the lifting plate is slidably disposed inside the dissolving box, the B screw is rotatably disposed on the lower inner wall of the dissolving box, and the B screw is threadedly connected to the lifting plate.

[0014] Preferably, the B screw rod is sleeved in the A driving rod, the B screw rod is provided with a C telescopic rod, the C telescopic rod is installed with a transfer plate, and the transfer plate is installed with a clamping block.

[0015] Preferably, a clamping groove is provided on the output end of the motor, and the clamping block is arranged in the clamping groove.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The cleaning component and the driving component can make it possible to clean the dust remaining on the surface of the wafer more thoroughly and quickly before semiconductor production. During the cleaning period, only the driving component needs to be operated to drive the wafer to rotate rapidly. During the rotation process, the wafer can be stably clamped and cleaned to remove the dust on its surface.

[0017] 2. The cleaned wafers are placed into a dissolving assembly, which can remove the metal oxides remaining on the wafer surface. The cleaning operation can be repeated during this period, so that oxides can be removed from multiple wafers at the same time, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural diagram of the present invention; Figure 2 It is a first partial exploded view of the present invention; Figure 3 It is a second partial exploded view of the present invention; Figure 4 It is a third partial exploded view of the present invention; Figure 5 is a fourth partial exploded view of the present invention; Figure 6 It is a first partial plan view of the present invention; Figure 7 It is a second partial plan view of the present invention; Figure 8 is a fifth partial exploded view of the present invention; Fig. 9is a sixth partial exploded view of the present invention; Fig.10 It is the seventh partial explosion diagram of the present invention.

[0019] In the figure: 1. Installation assembly; 11. Base; 12. Guide; 2. Cleaning assembly; 21. Lower plate; 211. Plate; 212. Extrusion groove; 213. Leakage hole; 22. Upper plate; 23. Pipe A; 24. Connecting ring; 25. Extension arm; 26. Clamping piece; 261. Clamping arm A; 262. Spring A; 263. Spring B; 264. Clamping arm B; 27. Cleaning piece; 28. Pipe B; 3. Driving assembly; 31. Motor; 32. Fixed plate; 33. Driving rod A; 34. Telescopic rod A; 35. Connecting block A; 36. Telescopic rod B; 37. Connecting block B; 38. Screw A; 4. Dissolving assembly; 41. Dissolving box; 42. Valve; 43. Lifting plate; 44. Screw B; 45. Telescopic rod C; 46. Transfer plate; 47. Connecting block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1-Figure 8 , the present invention provides; A semiconductor cleaning rotating unit, comprising Install component 1; A cleaning component 2, the cleaning component 2 is installed on the installation component 1; A driving assembly 3, wherein the driving assembly 3 is mounted on the cleaning assembly 2; The cleaning component 2 includes a lower plate 21, an upper plate 22, a connecting ring 24, an extension arm 25, a clamping member 26 and a cleaning member 27. The lower plate 21 is arranged on the mounting component 1, the upper plate 22 is arranged on the lower plate 21, a mounting groove is provided on the lower plate 21, the cleaning member 27 is installed in the mounting groove, the connecting ring 24 is rotatably arranged on the lower plate 21, the extension arm 25 is installed on the connecting ring 24, and the clamping member 26 is installed on the extension arm 25; The lower plate 21 includes a plate body 211, and an extrusion groove 212 and a material leakage hole 213 are provided on the plate body 211. The extrusion groove 212 is set to an arc structure, and the extrusion groove 212 is opened counterclockwise. The width of the front 1 / 4 of the extrusion groove 212 gradually decreases, and the width of the rear 3 / 4 remains unchanged, and the two are connected. The material leakage hole 213 is opened at the head and tail connection of the extrusion groove 212; The clamping member 26 includes an A clamping arm 261, an A spring 262, a B spring 263 and a B clamping arm 264. The B clamping arm 264 is fixedly arranged on the extension arm 25. The A clamping arm 261 is slidably arranged on the extension arm 25. The A spring 262 and the B spring 263 are both installed between the A clamping arm 261 and the B clamping arm 264. A sliding block is arranged at the lower end of the A clamping arm 261, and the sliding block is slidably arranged in the extrusion groove 212.

[0022] Specifically, when cleaning the dust remaining on the surface of the wafer, the wafer can be firstly put into the space between the lower plate 21 and the upper plate 22 from the feed hole. At this time, the clamping member 26 is arranged directly below the feed hole. After the wafer is put in, it will fall on the clamping member 26. By running the driving assembly 3, the connecting ring 24, the extension arm 25 and the clamping member 26 can be driven to rotate, and then the dust on the upper end of the wafer can be cleaned by the cleaning member 27. Since the wafer is arranged between the A clamping arm 261 and the B clamping arm 264, and since the extrusion groove 212 is opened counterclockwise, and the width of the front 1 / 4 of the extrusion groove 212 gradually decreases, when the clamping member 26 rotates, the inner wall of the extrusion groove 212 will gradually squeeze the sliding block, so that the A clamping arm The distance between A clamping arm 261 and B clamping arm 264 decreases, so that the wafer will be gradually stably clamped, and because the width of the rear 3 / 4 of the extrusion groove 212 is the same as the width at the end of the front 1 / 4, the sliding part will be continuously squeezed, so that the A clamping arm 261 and the B clamping arm 264 can continue to clamp the wafer. When the wafer rotates to above the leakage hole 213, the width of the extrusion groove 212 at this time is the maximum value, so the inner wall of the extrusion groove 212 will not squeeze the sliding block. At this time, the A spring 262 and the B spring 263 will push the A clamping arm 261 to move outward, causing the A clamping arm 261 and the B clamping arm 264 to no longer clamp the wafer, causing the wafer to fall from the leakage hole 213.

[0023] Furthermore, when in use, since the diameter of the wafer is approximately 8 inches, in order to adapt to the size of the wafer, the overall size of the device is adaptively adjusted. The radius of the A clamping arm 261 and the B clamping arm 264 is approximately 5-6 inches, the width of the front 1 / 4 of the extrusion groove 212 is a maximum of 15 inches and a minimum of 10 inches, the width of the rear 3 / 4 of the extrusion groove 212 is 10 inches, and the radius of the leakage hole 213 is 5 inches.

[0024] Furthermore, after the wafer is cleaned, it is necessary to move the wafer to the dissolution box 41. During the movement, a special wafer fixing and transmission device is used, such as a side point pressure wafer semiconductor positioning device, to ensure that the wafer will not slip or be damaged during the movement. Then, a robotic arm or an automated transmission system is used to gently clamp the wafer to ensure that it is smoothly moved from the upper container to the lower dissolution box 41. During the movement, the speed and force must be controlled to avoid the wafer from breaking due to too fast or too violent movement. After placing the wafer at the designated position of the lower dissolution box 41, the position is confirmed to ensure that the wafer is placed accurately and without offset, and then subsequent dissolution operations can be performed.

[0025] In this embodiment, the mounting assembly 1 includes a base 11 and a guide member 12. The base 11 is provided with a mounting hole, the A pipe 23 is arranged in the mounting hole, the guide member 12 is rotatably arranged on the base 11, and the guide member 12 is arranged directly below the A pipe 23.

[0026] Specifically, during use, in order to enable the cleaning component 2 to be stably set, a base 11 is set below the lower plate 21, and the lower plate 21 is placed on the base 11, and a guide member 12 is set directly below the A pipe 23, so that the wafers after subsequent cleaning can fall into the guide member 12 for secondary cleaning, and because the guide member 12 can rotate, the wafers for the second cleaning can be directly dropped under the base 11.

[0027] In this embodiment, the driving assembly 3 includes a motor 31 and an A driving rod 33. The motor 31 is arranged above the upper plate 22. The A driving rod 33 penetrates the lower plate 21 and the upper plate 22 and extends out of the surfaces of both. The connecting ring 24 is installed on the A driving rod 33, and a connecting hole is opened on the output end of the motor 31.

[0028] Specifically, when rotating the connecting ring 24, the A driving rod 33 can be passed through the lower plate 21 and the upper plate 22 to connect the connecting ring 24 with the A driving rod 33, and then the output end of the motor 31 can be connected to the A driving rod 33, thereby driving the connecting ring 24 to rotate.

[0029] In this embodiment, the driving assembly 3 also includes an A telescopic rod 34, an A connecting block 35, a B telescopic rod 36, a B connecting block 37 and an A screw 38. Two telescopic holes are provided on the A driving rod 33. The A telescopic rod 34 and the B telescopic rod 36 are respectively arranged in the two telescopic holes. The A connecting block 35 and the B connecting block 37 are symmetrically arranged, and the A connecting block 35 and the B connecting block 37 are respectively installed on the A telescopic rod 34 and the B telescopic rod 36. The A screw 38 is threadedly arranged on the B connecting block 37, and the A screw 38 passes through the connecting hole and is threadedly connected to the A connecting block 35.

[0030] Specifically, when connecting the output end of the motor 31 with the A drive rod 33, an A telescopic rod 34 and a B telescopic rod 36 can be set on the A drive rod 33, and an A connecting block 35 and a B connecting block 37 can be set on the two. The A screw rod 38 is first threadedly connected to the B connecting block 37, and the A screw rod 38 is passed through the connecting hole opened on the output end of the motor 31, and then the A screw rod 38 is threadedly connected to the A connecting block 35, so that the output end of the motor 31 is connected to the A drive rod 33.

[0031] In this embodiment, a fixing plate 32 is mounted on the upper plate 22 , and the motor 31 is mounted on the fixing plate 32 .

[0032] Specifically, in order to stably arrange the motor 31 , a fixing plate 32 is arranged on the upper plate 22 , and then the motor 31 is mounted on the fixing plate 32 .

[0033] See also Figure 1-Figure 10 The present invention provides a cleaning device, including a dissolving component 4, on which the semiconductor cleaning rotating unit is installed. The dissolving component 4 includes a dissolving box 41 and a valve 42. The dissolving box 41 is arranged below the base 11, the upper end of the dissolving box 41 is hollow, and a drainage hole is opened on the dissolving box 41, and the valve 42 is installed in the drainage hole.

[0034] Specifically, during use, in order to remove metal oxides on the surface of the wafer, a dissolution box 41 can be set directly below the base 11, and an acidic dissolving liquid is poured into the dissolution box 41. In order to facilitate the subsequent discharge of the acidic dissolving liquid inside, a valve 42 is installed in the drain hole.

[0035] In this embodiment, the dissolving component 4 also includes a lifting plate 43 and a B screw 44. The lifting plate 43 is slidably arranged inside the dissolving box 41, and the B screw 44 is rotatably arranged on the lower inner wall of the dissolving box 41, and the B screw 44 is threadedly connected to the lifting plate 43.

[0036] Specifically, after removing the metal oxide on the surface of the wafer, in order to take out all the wafers, a B screw 44 is installed on the dissolution box 41, and the lifting plate 43 is threadedly set on the B screw 44. At this time, only the B screw 44 needs to be rotated to lift the lifting plate 43 and then take out the wafer.

[0037] In this embodiment, the B screw rod 44 is sleeved in the A driving rod 33, the B screw rod 44 is provided with a C telescopic rod 45, a transfer plate 46 is installed on the C telescopic rod 45, and a clamping block 47 is installed on the transfer plate 46; a clamping groove is provided on the output end of the motor 31, and the clamping block 47 is arranged in the clamping groove.

[0038] Specifically, when in use, the C telescopic rod 45 can be installed on the B screw rod 44, the transfer plate 46 can be installed on the C telescopic rod 45, the clamping block 47 can be installed on the transfer plate 46, and a clamping groove can be opened on the output end of the motor 31. At this time, the transfer plate 46 and the clamping block 47 can be raised by the C telescopic rod 45, so that the clamping block 47 can be inserted into the clamping groove, so that the B screw rod 44 can be driven to rotate when the motor 31 is running.

[0039] Furthermore, when processing the dust and metal oxides on the surface of the wafer, the wafer can be first placed in the cleaning component 2, and the connecting ring 24 can be driven to rotate by the driving component 3 to clean the dust on the surface of the wafer. After the cleaning is completed, the wafer can be placed in the dissolving component 4, and the metal oxides on the surface of the wafer can be dissolved by the acidic dissolving liquid inside the dissolving box 41. After the dissolution is completed, the B screw 44 can be driven to rotate by the driving component 3, and the lifting plate 43 can drive the wafer to rise. At this time, the wafer can be taken out for subsequent processing.

[0040] The electronic components and modules used in the invention can be parts commonly used in the market and can realize the specific functions in this case, and the specific models and sizes can be selected and adjusted according to actual needs.

[0041] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor cleaning rotating unit, characterized in that: include: Install component (1); A cleaning component (2), wherein the cleaning component (2) is mounted on the mounting component (1); A driving assembly (3), wherein the driving assembly (3) is mounted on the cleaning assembly (2); The cleaning component (2) comprises a lower plate (21), an upper plate (22), a connecting ring (24), an extension arm (25), a clamping member (26) and a cleaning member (27); the lower plate (21) is arranged on the mounting component (1); the upper plate (22) is arranged on the lower plate (21); a mounting groove is provided on the lower plate (21); the cleaning member (27) is mounted in the mounting groove; the connecting ring (24) is rotatably arranged on the lower plate (21); the extension arm (25) is mounted on the connecting ring (24); and the clamping member (26) is mounted on the extension arm (25); The lower plate (21) comprises a plate body (211), the plate body (211) is provided with an extrusion groove (212) and a material leakage hole (213), the extrusion groove (212) is arranged in an arc-shaped structure, and the extrusion groove (212) is opened counterclockwise, the width of the extrusion groove (212) gradually decreases at the front 1 / 4 and remains unchanged at the rear 3 / 4, and the two are connected, and the material leakage hole (213) is opened at the connection between the head and the tail of the extrusion groove (212); The clamping member (26) comprises an A clamping arm (261), an A spring (262), a B spring (263) and a B clamping arm (264); the B clamping arm (264) is fixedly arranged on the extension arm (25); the A clamping arm (261) is slidably arranged on the extension arm (25); the A spring (262) and the B spring (263) are both installed between the A clamping arm (261) and the B clamping arm (264); a sliding block is arranged at the lower end of the A clamping arm (261); and the sliding block is slidably arranged in the extrusion groove (212).

2. A semiconductor cleaning rotating unit according to claim 1, characterized in that: The cleaning assembly (2) further comprises an A pipe (23) and a B pipe (28); a feed hole is provided on the upper plate (22); the B pipe (28) is installed in the feed hole; and the A pipe (23) is installed in the leakage hole (213).

3. A semiconductor cleaning rotating unit according to claim 2, characterized in that: The mounting assembly (1) comprises a base (11) and a guide member (12); the base (11) is provided with a mounting hole, the A pipe (23) is arranged in the mounting hole, the guide member (12) is rotatably arranged on the base (11), and the guide member (12) is arranged directly below the A pipe (23).

4. A semiconductor cleaning rotating unit according to claim 1, characterized in that: The driving assembly (3) comprises a motor (31) and an A driving rod (33), wherein the motor (31) is arranged above the upper plate (22), the A driving rod (33) penetrates the lower plate (21) and the upper plate (22) and extends out of the surfaces of both, and the connecting ring (24) is mounted on the A driving rod (33), and a connecting hole is provided on the output end of the motor (31).

5. A semiconductor cleaning rotating unit according to claim 4, characterized in that: The driving assembly (3) further comprises an A telescopic rod (34), an A connecting block (35), a B telescopic rod (36), a B connecting block (37) and an A screw rod (38); the A driving rod (33) is provided with two telescopic holes; the A telescopic rod (34) and the B telescopic rod (36) are respectively arranged in the two telescopic holes; the A connecting block (35) and the B connecting block (37) are symmetrically arranged; the A connecting block (35) and the B connecting block (37) are respectively mounted on the A telescopic rod (34) and the B telescopic rod (36); the A screw rod (38) is threadedly arranged on the B connecting block (37); the A screw rod (38) passes through the connecting hole and is threadedly connected to the A connecting block (35).

6. A semiconductor cleaning rotating unit according to claim 4, characterized in that: A fixing plate (32) is mounted on the upper plate (22), and the motor (31) is mounted on the fixing plate (32).

7. A cleaning device, comprising a dissolving component (4), on which a semiconductor cleaning rotating unit according to any one of claims 1 to 6 is installed, characterized in that: The dissolution assembly (4) comprises a dissolution box (41) and a valve (42); the dissolution box (41) is arranged below the base (11); the upper end of the dissolution box (41) is hollowed out; a drainage hole is provided on the dissolution box (41); and the valve (42) is installed in the drainage hole.

8. A cleaning device according to claim 7, characterized in that: The dissolving assembly (4) further comprises a lifting plate (43) and a B screw (44), wherein the lifting plate (43) is slidably disposed inside the dissolving box (41), and the B screw (44) is rotatably disposed on the lower inner wall of the dissolving box (41), and the B screw (44) is threadedly connected to the lifting plate (43).

9. A cleaning device according to claim 8, characterized in that: The B screw rod (44) is sleeved in the A driving rod (33), the B screw rod (44) is provided with a C telescopic rod (45), a transfer plate (46) is installed on the C telescopic rod (45), and a clamping block (47) is installed on the transfer plate (46).

10. A cleaning device according to claim 9, characterized in that: A clamping groove is provided on the output end of the motor (31), and the clamping block (47) is arranged in the clamping groove.

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