Miniaturized base, manufacturing method thereof and method for forming groove in miniaturized base

Abstract

The invention discloses a miniaturized base, a manufacturing method thereof and a method for forming a groove in the miniaturized base, and relates to the technical field of packaging bases, the miniaturized base comprises a base body and a conductive assembly, the base body is provided with an inner cavity used for containing a chip, the base body comprises a ceramic green body sheet, and the conductive assembly is arranged in the inner cavity. At least part of the inner cavity is formed by forming a groove in the side face of one ceramic green body piece. The method for forming the groove in the miniaturized base comprises the step of etching the groove in the side face of the ceramic green body piece in a laser scanning mode. According to the invention, the manufacturing process of the inner cavity is improved, that is, the groove is processed on the ceramic green body sheet to form the inner cavity or a part of the inner cavity, and the existing scheme that the ceramic green bodies with through holes are stacked on a flat plate to form the inner cavity is abandoned, so that the inner cavity with smaller height size and accurate size is formed on the thinner ceramic green body sheet; and moreover, the number of laminated layers can be reduced, and the probability of air leakage, bubbling and cracking between layers is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging bases, and in particular to a miniaturized base and a manufacturing method thereof, and a method for opening a groove in the miniaturized base. Background Art

[0002] With the continuous development of electronic technology, chips are increasingly used in various fields. The packaging of chips is crucial to their performance and reliability. At present, the inner cavity for accommodating chips on the existing packaging base is usually formed by stacking multiple layers of ceramic green sheets with through holes and a ceramic green sheet without through holes. In the manufacturing process of such a packaging base, it is first necessary to punch through holes in the multi-layer ceramic green sheets. As the packaging base becomes increasingly miniaturized, the existing packaging base preparation method is not suitable for making miniaturized bases. Summary of the invention

[0003] The purpose of the present invention is to provide a miniaturized base and a method for manufacturing the same, and a method for opening a groove in the miniaturized base, so as to solve the problems existing in the above-mentioned prior art, realize the miniaturization of the base, and improve the accuracy, quality and reliability.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] The present invention provides a miniaturized base, comprising a substrate and a conductive component, wherein the substrate is provided with an inner cavity for accommodating a chip, the substrate comprises a ceramic green sheet, and at least part of the inner cavity is formed by a groove on a side of the ceramic green sheet.

[0006] Preferably, the conductive component comprises a plurality of conductive layers, and adjacent conductive layers are insulated by a porcelain slurry insulating layer and / or the ceramic green sheet.

[0007] Preferably, the inner cavity is the groove opened on the side of the ceramic green sheet.

[0008] Preferably, the substrate comprises a plurality of stacked ceramic green sheets, the ceramic green sheet having the groove is a first ceramic green sheet, a plurality of second ceramic green sheets are stacked on one side of the first ceramic green sheet having the groove, the second ceramic green sheet is provided with a through groove having the same cross-sectional shape as the groove, and the through groove and the groove together form the inner cavity.

[0009] Preferably, the thickness of the ceramic green sheet is 0.05 mm-0.2 mm.

[0010] The present invention also provides a method for forming a groove in a miniaturized base as described above, comprising: etching the groove on the side of a ceramic green sheet by laser scanning.

[0011] The present invention also provides a method for manufacturing the miniaturized base as described above, comprising: preparing a ceramic green sheet: obtaining a ceramic green sheet by tape casting a ceramic slurry;

[0012] Making conductive holes: Making conductive holes on the ceramic green sheet using laser drilling technology or punching technology;

[0013] Making a conductive column: filling the conductive hole with metal paste to form the conductive column;

[0014] Making a circuit pattern: printing a circuit pattern on the surface of the ceramic green sheet;

[0015] Making the inner cavity: etching a groove on the side of one of the ceramic green sheets by laser scanning to form the inner cavity;

[0016] Making a laminated green body: stacking a plurality of the ceramic green body sheets according to design requirements to form a laminated green body;

[0017] Sintering: Sintering the laminated green body at high temperature to form a mature ceramic substrate;

[0018] Electroplating: Electroplating of the ceramic substrate.

[0019] Preferably, after the step of making the laminated green body, pre-cutting is further included: using a hot cutter to pre-cut the laminated green body after pressing, so as to facilitate subsequent splitting;

[0020] After the electroplating step, the method further includes splitting into individual pieces: cutting the electroplated ceramic substrate into individual components.

[0021] Preferably, a full inspection step is also included after the electroplating step.

[0022] Compared with the prior art, the present invention has achieved the following technical effects:

[0023] The present invention improves the process of making the inner cavity, that is, a groove is machined on a ceramic green sheet to form an inner cavity or a part of the inner cavity, abandoning the existing scheme of "stacking ceramic green sheets with through holes on a flat plate to form an inner cavity", and realizes the formation of an inner cavity with a smaller height and precise size on a thinner ceramic green sheet, and can reduce the number of stacking layers, thereby reducing the probability of air leakage, bubbling and cracking between layers.

[0024] Furthermore, the present invention uses laser scanning to etch grooves on the side of the ceramic green sheet, which can improve the dimensional accuracy of the inner cavity, and the laser scanning process will not cause deformation of the ceramic green sheet, thereby improving the accuracy of the ceramic green sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic cross-sectional view of a ceramic green sheet with a groove provided in a miniaturized base according to an embodiment of the present invention;

[0027] Figure 2 A schematic structural diagram of a miniaturized base provided by an embodiment of the present invention;

[0028] Figure 3 for Figure 2 Exploded diagram of the structure;

[0029] Figure 4 for Figure 3 A view in another direction;

[0030] In the figure: 1-ceramic green sheet; 2-ceramic slurry insulating layer; 3-conductive layer; 4-inner cavity; 12-groove; 13-through groove. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] In the related art, the inner cavity for accommodating the chip on the ordinary packaging base is formed by stacking multiple layers of ceramic green sheets with through holes and a ceramic green sheet without through holes to form a larger inner cavity, and the through holes are made by punching and stamping processes. However, in the miniaturized base, due to the small size of the inner cavity, the optimal height required may not be an integer multiple of the thickness of the ceramic green sheet. If the existing method of opening through holes is adopted, an additional layer of ceramic green sheet is required. In addition, since the limit thickness of the ceramic green sheet has a minimum thickness, if it is lower than this thickness, the existing process is difficult to produce. For example: if the ceramic green sheet The minimum thickness of the green sheet is 0.06mm. When the inner cavity height needs to be designed to be 0.09mm, the existing method of opening through holes usually opens corresponding through holes on two 0.06mm ceramic green sheets. In this way, the height of the inner cavity is 0.12mm, which increases the thickness of the package base and increases the number of layers of the ceramic green sheets. The more layers are stacked, the greater the probability of leakage and cracking between layers. In addition, the existing stamping and punching methods will cause the ceramic green sheets to warp, thereby affecting the accuracy of the package base. Based on this, the following solutions are provided:

[0034] The embodiment of the present invention provides a miniaturized base, such as Figure 1 to Figure 4 As shown, it includes a substrate and a conductive component, the substrate is provided with an inner cavity 4 for accommodating the chip, and the conductive component includes a conductive layer 3 and a conductive column; the substrate includes a ceramic green sheet 1, and at least part of the inner cavity 4 is formed by opening a groove 12 on the side of a ceramic green sheet 1.

[0035] The present invention improves the manufacturing process of the inner cavity 4, that is, a groove 12 is processed on a ceramic green sheet 1 to form the inner cavity 4 or part of the inner cavity 4, abandoning the existing scheme of "stacking ceramic green sheets with through holes on a flat plate to form the inner cavity 4", and realizing the formation of a cavity 4 with a smaller height and precise size on a thinner ceramic green sheet 1, and can reduce the number of stacking layers, thereby reducing the probability of air leakage, bubbling and cracking between layers.

[0036] In some embodiments, the conductive component includes multiple conductive layers 3 , and adjacent conductive layers 3 are insulated by ceramic slurry insulation layers 2 and / or ceramic green sheets 1 .

[0037] In the related art, ceramic green sheets 1 are usually used to insulate adjacent conductive layers 3, while the embodiment of the present invention can use a ceramic slurry insulating layer 2 to insulate adjacent conductive layers 3, thereby further achieving miniaturization and reducing the number of stacked ceramic green sheets 1, thereby further reducing the probability of air leakage, bubbling, and cracking problems between layers.

[0038] In some embodiments, the inner cavity 4 is a groove 12 opened on the side of the ceramic green sheet 1 .

[0039] The inner cavity 4 in this embodiment is formed entirely by the groove 12 , and this solution is suitable for the case where the height of the inner cavity 4 is relatively small.

[0040] In some embodiments, the substrate includes a plurality of stacked ceramic green sheets 1, wherein the ceramic green sheet 1 having a groove 12 is a first ceramic green sheet 1, and a plurality of second ceramic green sheets are stacked on one side of the first ceramic green sheet having the groove 12, and the second ceramic green sheet is provided with a through groove 13 having the same cross-sectional shape as the groove 12, and the through groove 13 and the groove 12 together form an inner cavity 4.

[0041] In this embodiment, part of the inner cavity 4 is formed by the groove 12, that is, the groove 12 forms the bottom structure of the inner cavity 4, and the through groove 13 forms the remaining structure of the inner cavity 4. This solution is suitable for the case where the inner cavity 4 is relatively high.

[0042] The size of the inner cavity 4 is determined by the size of the packaged chip.

[0043] In some embodiments, the thickness of the ceramic green sheet is 0.05 mm-0.2 mm, and the overall size of the miniaturized base is 2520, 2016, 1210, 1008, 0806, etc.

[0044] Among them, taking 2520 as an example, the size of 2520 is 0.25mm*0.2mm.

[0045] In the related art, stamping is usually used to make the inner cavity 4. When the ceramic green sheet 1 in the miniaturized base is thin, the stamping method will cause deformation of the ceramic green sheet 1, and the stamping method cannot form a groove 12 structure. Based on this: the present invention also provides a method for opening a groove 12 in the miniaturized base as described above, including: etching a groove 12 on the side of the ceramic green sheet 1 by laser scanning.

[0046] The embodiment of the present invention uses laser scanning to etch the groove 12 on the side of the ceramic green sheet 1, which can improve the dimensional accuracy of the inner cavity 4. The laser scanning process will not cause deformation of the ceramic green sheet 1, thereby improving the accuracy of the ceramic green sheet 1.

[0047] It can be understood that the through grooves 13 in the present invention are also etched on the ceramic green sheet 1 by laser scanning.

[0048] The present invention also provides a method for manufacturing the miniaturized base as described above, comprising:

[0049] Preparation of ceramic green sheet 1: ceramic slurry is tape-cast to obtain ceramic green sheet 1;

[0050] Making conductive holes: Making conductive holes on the ceramic green sheet 1 using laser drilling technology or punching technology;

[0051] Making a conductive column: filling the conductive hole with metal paste to form a conductive column;

[0052] Making a circuit pattern: printing a circuit pattern on the surface of the ceramic green sheet 1;

[0053] Making the inner cavity 4: etching a groove 12 on the side of a ceramic green sheet 1 by laser scanning to form the inner cavity 4;

[0054] Making a laminated green body: stacking a plurality of ceramic green body sheets 1 according to design requirements to form a laminated green body;

[0055] Sintering: Sintering the laminated green body at high temperature to form a mature ceramic substrate;

[0056] Electroplating: Electroplating of the ceramic substrate.

[0057] In some embodiments, after the step of making the laminated green body, pre-cutting is further included: using a hot cutter to pre-cut the laminated green body after pressing, so as to facilitate subsequent splitting;

[0058] The electroplating step also includes singulation: cutting the electroplated ceramic substrate into individual components.

[0059] In some embodiments, a full inspection step is further included after the electroplating step.

[0060] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A miniaturized base, comprising a base and a conductive component, wherein the base is provided with an inner cavity for accommodating a chip, characterized in that: The substrate comprises a ceramic green sheet, and at least a portion of the inner cavity is formed by a groove formed on a side surface of the ceramic green sheet.

2. The miniaturized base according to claim 1, characterized in that: The conductive component includes multiple conductive layers, and adjacent conductive layers are insulated by a porcelain slurry insulating layer and / or the ceramic green sheet.

3. The miniaturized base according to claim 1, characterized in that: The inner cavity is the groove opened on the side of the ceramic green sheet.

4. The miniaturized base according to claim 1, characterized in that: The substrate includes a plurality of stacked ceramic green sheets, wherein the ceramic green sheet having the groove is a first ceramic green sheet, a plurality of second ceramic green sheets are stacked on one side of the first ceramic green sheet having the groove, and the second ceramic green sheet is provided with a through groove having the same cross-sectional shape as the groove, and the through groove and the groove together form the inner cavity.

5. The miniaturized base according to claim 3, characterized in that: The thickness of the ceramic green sheet is 0.05 mm-0.2 mm.

6. A method for forming a groove in a miniaturized base according to any one of claims 1 to 5, characterized in that: The groove is etched on the side of the ceramic green sheet by laser scanning.

7. A method for manufacturing a miniaturized base according to any one of claims 1 to 5, characterized in that: include: Preparation of ceramic green sheets: ceramic slurry is tape-cast to obtain ceramic green sheets; Making conductive holes: Making conductive holes on the ceramic green sheet using laser drilling technology or punching technology; Making a conductive column: filling the conductive hole with metal paste to form the conductive column; Making a circuit pattern: printing a circuit pattern on the surface of the ceramic green sheet; Making the inner cavity: etching a groove on the side of one of the ceramic green sheets by laser scanning to form the inner cavity; Making a laminated green body: stacking a plurality of the ceramic green body sheets according to design requirements to form a laminated green body; Sintering: Sintering the laminated green body at high temperature to form a mature ceramic substrate; Electroplating: Electroplating of the ceramic substrate.

8. The method for manufacturing a miniaturized base according to claim 7, characterized in that: Also includes: After the step of making the laminated green compact, the method further includes pre-cutting: using a hot cutter to pre-cut the laminated green compact after pressing, so as to facilitate subsequent splitting; After the electroplating step, the method further includes splitting into individual pieces: cutting the electroplated ceramic substrate into individual components.

9. The method for manufacturing a miniaturized base according to claim 7, characterized in that: A full inspection step is also included after the electroplating step.

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