Miniature light emitting diode device packaging structure, packaging method and display device

Abstract

The invention provides a micro light-emitting diode device packaging structure, a packaging method and a display device, the packaging structure comprises a micro light-emitting diode device and a light-transmitting cover plate, and the micro light-emitting diode device comprises a micro light-emitting diode chip and a driving chip which are electrically connected; the light-transmitting cover plate comprises a color conversion layer, is arranged on the light-emitting side of the micro light-emitting diode chip, and enables the color conversion layer to cover at least part of the light-emitting area of the micro light-emitting diode chip. Based on this, the packaging structure of the present application has excellent packaging reliability and color display performance.

Description

Technical Field

[0001] The present application relates to the field of semiconductor light emitting technology, and in particular to a micro light emitting diode device packaging structure, a packaging method and a display device. Background Art

[0002] Micro-LED (Micro-Light Emitting Diode) display technology is a display technology that miniaturizes and arrays the traditional LED (Light Emitting Diode) structure and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to make driving circuits to achieve addressing control and individual drive of each pixel.

[0003] Among them, Micro-LED needs to be packaged after preparation, and the packaging method of Micro-LED in related technologies needs to be improved. Summary of the invention

[0004] The purpose of the present application is to provide a micro light emitting diode device packaging structure, packaging method and display device.

[0005] In a first aspect, the present application provides a packaging structure, including:

[0006] A micro light emitting diode device, comprising an electrically connected micro light emitting diode chip and a driver chip; and

[0007] The light-transmitting cover plate comprises a color conversion layer, wherein the light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip.

[0008] Optionally, the light-transmitting cover plate includes a first surface and a second surface that are arranged opposite to each other, the second surface is located between the first surface and the micro-light-emitting diode chip, and the color conversion layer is arranged on the second surface.

[0009] Optionally, the micro-LED chip further includes a non-luminous area, and the light-transmitting cover plate further includes a light-shielding layer, and the light-shielding layer covers the non-luminous area.

[0010] Optionally, the light-shielding layer is disposed on the first surface.

[0011] Optionally, the packaging structure further includes:

[0012] A glue frame structure is arranged on the driving chip, and the glue frame structure connects the micro light emitting diode device and the light-transmitting cover plate, and supports the light-transmitting cover plate.

[0013] Optionally, the plastic frame structure is provided with a notch; and the packaging structure further includes:

[0014] A sealing colloid is used to fill and seal the gap.

[0015] Optionally, the notch is arranged on an edge of the rubber frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

[0016] Optionally, the packaging structure further includes:

[0017] A packaging substrate, comprising a carrier plate and a circuit board connected to each other, the micro light emitting diode device is arranged on the carrier plate, and the circuit board is electrically connected to the driving chip through an electrical connector; and

[0018] The packaging colloid wraps the electrical connector and is connected to the colloid frame structure.

[0019] Optionally, the packaging structure further includes:

[0020] The reinforcing colloid is arranged on a side of the circuit board away from the micro-light emitting diode device and in an area adjacent to a connection area between the circuit board and the carrier board.

[0021] Optionally, the packaging substrate further includes a reinforcing sheet and a terminal structure disposed on two opposite sides of the circuit board, and a projection of the reinforcing sheet on the circuit board covers a projection of the terminal structure on the circuit board.

[0022] In a second aspect, the present application also provides a packaging method for a micro light emitting diode device packaging structure, comprising:

[0023] A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driving chip which are electrically connected;

[0024] Providing a light-transmitting cover plate, wherein the light-transmitting cover plate comprises a color conversion layer;

[0025] The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip to form a packaging structure.

[0026] Optionally, the light-transmitting cover plate includes a first surface and a second surface that are arranged opposite to each other;

[0027] The light-transmitting cover plate is provided, and the light-transmitting cover plate includes a color conversion layer, including:

[0028] Providing a light-transmitting cover plate, and forming a color conversion layer on a second surface of the light-transmitting cover plate;

[0029] The step of arranging the light-transmitting cover plate on the light-emitting side of the micro-LED chip comprises:

[0030] The light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the second surface is located between the first surface and the micro-LED chip.

[0031] Optionally, the micro-LED chip further includes a non-luminous area, and the light-transmitting cover further includes a light-shielding layer;

[0032] The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip to form a packaging structure, including:

[0033] The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers the light-emitting area, and the light-shielding layer covers the non-light-emitting area.

[0034] Optionally, the step of disposing the light-transmitting cover plate on the light-emitting side of the micro-LED chip includes:

[0035] forming a glue frame structure on the surface of the driving chip;

[0036] The light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the light-transmitting cover plate is connected to the micro-LED device through the glue frame structure.

[0037] Optionally, the plastic frame structure is provided with a notch, and the packaging method further comprises:

[0038] The gap is filled with a sealing colloid, and the sealing colloid is used to seal the gap.

[0039] Optionally, the notch is arranged on an edge of the rubber frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

[0040] Optionally, the packaging structure further includes a packaging substrate, and the packaging substrate includes a carrier plate and a circuit board connected to each other;

[0041] After the step of providing the micro light emitting diode device, the method further includes:

[0042] The micro light emitting diode device is arranged on the carrier board, and the circuit board is electrically connected to the driving chip through an electrical connector;

[0043] The electrical connector is filled with colloid to form a packaging colloid that wraps the electrical connector.

[0044] In a third aspect, the present application further provides a display device, wherein the display device includes the packaging structure as described above; or, the display device includes the packaging structure prepared by the packaging method as described above.

[0045] Based on the above technical scheme, the transparent cover plate of the packaging structure of the present application is arranged on the side of the micro-LED chip of the micro-LED device away from the driving chip. The transparent cover plate can encapsulate and protect the micro-LED device, reduce the adverse effects of water vapor and other objects on the micro-LED device, and improve the reliability of the packaging structure; at the same time, the transparent cover plate has a high light transmittance effect, which can ensure that the micro-LED device has a better luminous brightness; moreover, the transparent cover plate also includes a color conversion layer, and the color conversion layer of the transparent cover plate can convert the color of the light emitted by the micro-LED device and realize the color display of the micro-LED device, so that the micro-LED device does not need to set up a color display process, which simplifies the process flow of the entire packaging structure and reduces the preparation cost of the entire packaging structure. Based on this, the present application realizes the packaging of the micro-LED device through a transparent cover plate with a color conversion layer, and the packaging structure has better packaging reliability and color display performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solution in this application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0047] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0048] Figure 1 A schematic diagram of a packaging structure provided in an embodiment of the present application;

[0049] Figure 2 for Figure 1 A schematic structural diagram of the packaging structure in another direction shown;

[0050] Figure 3 A schematic diagram of the structure of a micro light emitting diode chip provided in an embodiment of the present application;

[0051] Figure 4 A schematic diagram of the structure of a driver chip provided in an embodiment of the present application;

[0052] Figure 5 A schematic diagram of the bonding connection between the driver chip and the micro light emitting diode chip provided in an embodiment of the present application;

[0053] Figure 6 A schematic diagram of the structure of a micro light emitting diode device provided in an embodiment of the present application;

[0054] Figure 7 A schematic diagram of the structure of a packaging substrate provided in an embodiment of the present application;

[0055] Figure 8 A schematic diagram of a connection between a packaging substrate and a micro light emitting diode device provided in an embodiment of the present application;

[0056] Fig. 9 A schematic diagram of the structure after the packaging substrate provided in an embodiment of the present application is connected to the micro light emitting diode device and the first substrate is removed;

[0057] Fig.10 A schematic diagram of electrical connection between a circuit board and a driver chip according to an embodiment of the present application;

[0058] Fig.11 for Fig.10 A schematic diagram of another orientation of the structure shown;

[0059] Fig.12 for Fig.10 A schematic diagram of a structure after the structure shown is filled with encapsulating colloid;

[0060] Fig.13 for Fig.12 A schematic diagram of the structure in another direction of the structure shown;

[0061] Fig.14 A schematic diagram of the structure of a light-transmitting cover plate provided in an embodiment of the present application;

[0062] Fig.15 A structural schematic diagram of a rubber frame structure provided in an embodiment of the present application;

[0063] Fig.16 A connection diagram of the rubber frame structure provided in the embodiment of the present application;

[0064] Fig.17 for Fig.16 A schematic diagram of another orientation of the structure shown;

[0065] Fig.18 A schematic diagram of a connection between the rubber frame structure and the light-transmitting cover plate provided in an embodiment of the present application;

[0066] Fig.19 for Fig.18A schematic diagram of another orientation of the structure shown;

[0067] Fig. 20 A schematic diagram of a structure of a packaging structure including a sealing colloid provided in an embodiment of the present application;

[0068] Fig.21 A schematic diagram of a structure of a packaging structure including a reinforcing colloid provided in an embodiment of the present application;

[0069] Fig. 22 A schematic diagram of a first process flow of a packaging method provided in an embodiment of the present application;

[0070] Fig.23 A second schematic flow chart of the packaging method provided in the embodiment of the present application;

[0071] Fig.24 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0072] The reference numerals are:

[0073] 10. packaging structure; 20. display device; 100. packaging substrate; 200. micro light emitting diode device; 300. transparent cover plate; 400. packaging colloid; 500. colloid frame structure; 600. sealing colloid; 700. reinforcing colloid; 800. reinforcing sheet; 900. electrical connector; 110. carrier plate; 120. circuit board; 210. micro light emitting diode chip; 220. driver chip; 230. filling structure; 240. solid crystal structure; 310. light shielding layer; 320. color conversion layer; 510. notch; 121. first terminal structure; 122. Two-terminal structure; 123, welding wire area; 201, light-emitting area; 202, non-light-emitting area; 211, first substrate; 212, first semiconductor layer; 213, light-emitting layer; 214, second semiconductor layer; 215, first electrode layer; 216, second electrode layer; 217, solder joint structure; 221, second substrate; 222, driving circuit; 223, driving pad; 224, bonding area; 321, black barrier glue; 322, no quantum dot structure; 323, red quantum dot structure; 324, green quantum dot structure; 331, first side; 332, second side. DETAILED DESCRIPTION

[0074] The following will be combined with the appendix of this application Figure 1 To Attachment Fig.24 The technical solutions in this application are clearly and completely described in the following embodiments. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0075] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0076] The following is a detailed description with reference to specific embodiments. It should be noted that the embodiments of the present application can be presented in various forms, some examples of which will be described below.

[0077] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram of a micro light emitting diode device packaging structure 10 (hereinafter referred to as packaging structure 10) provided in an embodiment of the present application is shown in FIG. Figure 2 for Figure 1 The package structure 10 is shown in another direction. The package structure 10 includes a micro light emitting diode device 200 and a transparent cover plate 300 .

[0078] The micro-LED device 200 includes an electrically connected micro-LED chip 210 and a driver chip 220. The light-transmitting cover plate 300 includes a color conversion layer 320, which is disposed on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers at least part of the light-emitting area 201 of the micro-LED chip 210, so that the orthographic projection of the color conversion layer 320 on the micro-LED chip 210 covers at least part of the light-emitting area 201. The light-emitting side of the micro-LED chip 210 is the side of the micro-LED chip 210 that is away from the packaging substrate 100 described later, and the electrically connected micro-LED chip 210 and the driver chip 220 can be homogeneously integrated.

[0079] It can be understood that, in some examples, the micro-LED chip 210 further includes a non-luminous region 202, the non-luminous region 202 is arranged around the outer periphery of the luminous region 201, and the luminous region 201 is located inside the non-luminous region 202. In some examples, the non-luminous region 202 is the electrode and wiring region of the micro-LED chip 210, and the luminous region 201 is the pixel region of the micro-LED chip 210; the luminous region 201 includes the luminous surface of the micro-LED chip 210 and the layered structure below the luminous surface, and the non-luminous region 202 includes the non-luminous surface of the micro-LED chip 210 and the layered structure below the luminous surface.

[0080] It is understandable that if Figure 3 As shown, Figure 3 A schematic diagram of the structure of a micro light emitting diode chip 210 provided in an embodiment of the present application is shown in FIG. Figure 3 In Figure 3 (a) and Figure 3 (b) are schematic diagrams of the structure of the micro-LED chip 210 in different directions. The micro-LED chip 210 includes a first substrate 211, and a first semiconductor layer 212, a light-emitting layer 213, a second semiconductor layer 214, a first electrode layer 215, a second electrode layer 216, and a plurality of solder joint structures 217 formed on the first substrate 211. The first substrate 211 is used to support the film structure thereon, and the first substrate 211 is a sapphire substrate, a silicon substrate, or a silicon carbide substrate. The light-emitting layer 213 is a quantum well layer, for example, the light-emitting layer 213 is an indium gallium nitride quantum well layer, or an indium gallium nitride / gallium nitride multi-quantum well layer. The first semiconductor layer 212 is one of an N-type semiconductor layer and a P-type semiconductor layer, and the second semiconductor layer 214 is the other of an N-type semiconductor layer and a P-type semiconductor layer, wherein the N-type semiconductor layer is an N-type gallium nitride layer or an N-type gallium arsenide layer, and the P-type semiconductor layer is a P-type gallium nitride layer or a P-type aluminum gallium nitride layer. The first electrode layer 215 is disposed on the side of the second semiconductor layer 214 away from the light emitting layer 213 and is electrically connected to the second semiconductor layer 214. The second electrode layer 216 is disposed in the exposed area of ​​the first semiconductor layer 212 and is electrically connected to the first semiconductor layer 212. The solder joint structure 217 is connected to the first electrode layer 215 and the second electrode layer 216. The solder joint structure 217 can be made of, but not limited to, metals such as indium (In), aluminum (Al), tin (Sn), silver (Ag), gold (Au), gold-tin alloy, and nickel-gold alloy. The solder joint structure 217 is used to electrically connect to the driver chip 220, such as bonding. It should be noted that the above is only an example of the micro light emitting diode chip 210. For example, the micro light emitting diode chip 210 can also include structures such as a current diffusion layer and a buffer layer.

[0081] It is understandable that if Figure 3As shown, the first semiconductor layer 212, the light-emitting layer 213, the second semiconductor layer 214, the first electrode layer 215 and the solder joint structure 217 connected thereto can form a plurality of pixel units arranged at intervals, and the driving chip 220 can drive the plurality of pixel units of the micro-LED chip 210 to emit light. Among them, the first electrode layer 215 is the P electrode or the positive electrode of the micro-LED chip 210, and the second electrode layer 216 is the N electrode or the negative electrode of the micro-LED chip 210. At this time, the first region formed by all the first electrode layers 215 and the layered structures above and below can be the P region of the micro-LED chip 210; the second region formed by all the second electrode layers 216 and the layered structures above and below can be the N region of the micro-LED chip 210. The P region can form the light-emitting region 201 of the micro-LED chip 210, and the N region can be the non-light-emitting region 202 of the micro-LED chip 210. It should be noted that the first electrode layer 215 can also be an N-electrode and the second electrode layer 216 can be a P-electrode. In this case, the first region can be an N-region and the light-emitting region 201 , and the second region can be a P-region and the non-light-emitting region 202 .

[0082] Among them, Figure 4 As shown, Figure 4 A schematic diagram of the structure of the driver chip 220 provided in the embodiment of the present application is shown in FIG. Figure 4 In Figure 4 (a) and Figure 4 (b) are schematic diagrams of the structure of the driver chip 220 in different directions. The driver chip 220 includes a second substrate 221, a driver circuit 222 formed on the second substrate 221, and a plurality of driver pads 223. The driver circuit 222 may be, but not limited to, a CMOS circuit structure or a TFT circuit structure. The driver pads 223 may be, but not limited to, made of metals such as In, Al, Sn, Ag, Au, gold-tin alloy, and nickel-gold alloy.

[0083] It is understandable that, combined with Figure 4 Please also refer to Figure 5 , Figure 5 The schematic diagram of the bonding connection between the driver chip 220 and the micro-LED chip 210 provided in the embodiment of the present application is shown. The multiple driving pads 223 of the driver chip 220 are used to form the bonding area 224 of the driver chip 220 and are used to be arranged one-to-one with the multiple solder joint structures 217 of the micro-LED chip 210, and are electrically connected one-to-one, such as bonding connection. The driver chip 220 is located between the micro-LED chip 210 and the packaging substrate 100. The driver chip 220 provides electrical signals to the micro-LED chip 210 and controls the micro-LED chip 210 to emit light.

[0084] It should be noted that in other embodiments, the driver chip 220 and the micro-LED chip 210 can also be prepared on the same substrate and electrically connected through a process. In this case, the micro-LED device 200 is relatively thin. Figure 6 As shown, Figure 6 A structural schematic diagram of a micro-LED device 200 provided in an embodiment of the present application. The micro-LED device 200 may also include a filling structure 230. The micro-LED device 200 can fill the filling structure 230, such as glue, from the bonding gap between the micro-LED chip 210 and the driving chip 220 into the interior of the micro-LED device 200 and form the micro-LED device 200 of the embodiment of the present application. The filling structure 230 can be filled between multiple pixel units of the micro-LED chip 210.

[0085] In some examples, please refer to Figure 1 and Figure 2 As shown, the package structure 10 also includes a package substrate 100, which is used to carry the micro-LED device 200 and the transparent cover 300. The package substrate 100 includes a carrier plate 110 and a circuit board 120 connected to each other, the driver chip 220 is arranged on the carrier plate 110, and the circuit board 120 is electrically connected to the driver chip 220 through an electrical connector 900.

[0086] It is understandable that if Figure 7 As shown, Figure 7 A schematic structural diagram of a packaging substrate 100 provided in an embodiment of the present application. Figure 7 middle Figure 7 (a) to Figure 7 (c) is a schematic diagram of the structure of the package substrate 100 in different directions. The circuit board 120 of the package substrate 100 is stacked and connected to the carrier board 110, the first end of the circuit board 120 is connected to the carrier board 110, and the second end of the circuit board 120 extends outside the carrier board 110 and is used to be electrically connected to the external circuit to receive the electrical signal and control signal provided by the external circuit. In some examples, the carrier board 110 is a heat dissipation substrate, which is a metal or non-metal structure, and the heat dissipation substrate can increase the heat dissipation of the package structure 10. In some examples, the circuit board 120 can be a flexible board, for example, the circuit board 120 is a soft cable structure. The flexible circuit board 120 is lighter in weight, has better reliability, and is more convenient for the transportation of the package structure 10.

[0087] It is understandable that if Figure 8 As shown, Figure 8 A schematic diagram of a connection between a package substrate 100 and a micro-LED device 200 provided in an embodiment of the present application. The micro-LED device 200 and the circuit board 120 are disposed on the same surface of the carrier board 110 and are spaced apart from each other. Figure 6 The bonding structure filled with glue is fixed on the carrier board 110 through the die-bonding structure 240, thereby achieving the connection between the driver chip 220 and the carrier board 110. The die-bonding structure 240 can be but is not limited to glue, metal welding material structure, or non-metal welding material structure.

[0088] It is understandable that if Fig. 9 As shown, Fig. 9 The schematic diagram of the structure of the package substrate 100 provided in the embodiment of the present application is connected to the micro-LED device 200 and the first substrate 211 is removed. After the micro-LED device 200 is connected to the carrier board 110, the first substrate 211 of the micro-LED chip 210 is peeled off by the laser lift-off (Laser Lift-Off, LLO for short) process.

[0089] It is understandable that if Fig.10 and Fig.11 As shown, Fig.10 Schematic diagram of electrical connection between the circuit board 120 and the driver chip 220 according to the embodiment of the present application. Fig.11 for Fig.10 Schematic diagram of another direction of the structure shown. After the first substrate 211 is peeled off, the driver chip 220 is electrically connected to the circuit board 120 through the electrical connector 900. For example, the circuit board 120 is also provided with an electrical connection terminal such as a first terminal structure 121, and the circuit board 120 and the driver chip 220 are connected by a wire bonding process. The electrical connector 900 realizes the electrical connection between the circuit board 120 and the driver chip 220 through the first terminal structure 121. The driver chip 220 can receive the electrical signal and control signal transmitted by the circuit board 120 and control the micro light emitting diode chip 210 to emit light. Among them, the electrical connector 900 can be, but is not limited to, a conductive gold wire, a conductive copper wire, a conductive aluminum wire and other structures.

[0090] It is understandable that, combined with Fig.10 and Fig.11 And refer to Fig.12 and Fig.13 , Fig.12 for Fig.10 The structure shown is a schematic diagram of a structure after the encapsulation colloid 400 is filled. Fig.13 for Fig.12A schematic diagram of the structure in another direction of the structure shown. A welding wire area 123 is preset on the circuit board 120, and the welding wire area 123 extends from the first end of the circuit board 120 toward the second end and covers the area where the electrical connector 900 is located. That is to say, the first side edge of the welding wire area 123 is aligned with the first end, and the second side edge of the welding wire area 123, which is arranged opposite to the first side edge, is located between the second end and the first terminal structure 121. Of course, the welding wire area 123 may also exceed the first end of the circuit board 120. For example, one side edge of the welding wire area 123 extends in the direction where the micro-light-emitting diode device 200 is located, and extends to the surface of the driving chip 220; even, one side edge of the welding wire area 123 also extends to the side wall edge of the micro-light-emitting diode chip 210. At this time, the welding wire area 123 covers a wider area, and the encapsulation colloid 400 filled therein can seal more areas. As shown in FIG. Fig.12 and Fig.13 As shown, in the process production, the wire bonding area 123 is subjected to a dispensing process to form a packaging colloid 400 that wraps the electrical connector 900. Specifically, firstly, dispensing is performed around the electrical connector 900 to form a dam retaining wall, and then the dam retaining wall area is filled with colloid to form the packaging colloid 400. The packaging colloid 400 wraps the electrical connector 900, which can minimize the corrosion of the electrical connection between the circuit board 120 and the driver chip 220 by liquids such as moisture, thereby improving the airtight layer and reliability of the packaging structure 10.

[0091] In some examples, the light-transmitting cover 300 further includes a light-shielding layer 310 , which can cover the non-luminous area 202 of the micro-LED chip 210 , and the projection of the light-shielding layer 310 on the micro-LED chip 210 covers the non-luminous area 202 .

[0092] It is understandable that if Fig.14 As shown, Fig.14 A schematic structural diagram of the light-transmitting cover plate 300 provided in an embodiment of the present application. Fig.14 In Fig.14 (a) and Fig.14(b) are schematic diagrams of the structure of the transparent cover plate 300 in different directions. The transparent cover plate 300 is attached to the top of the micro-light-emitting diode device 200. The transparent cover plate 300 can be, but is not limited to, an inorganic glass sheet, an organic glass sheet, a transparent resin substrate, a glass fiber reinforced plastic substrate, etc. The transparent cover plate 300 carries a light-shielding layer 310 and a color conversion layer 320. The light-shielding layer 310 and the color conversion layer 320 can be arranged in the same layer or in layers. The setting relationship between the light-shielding layer 310 and the color conversion layer 320 corresponds to the setting relationship between the light-emitting area 201 and the non-light-emitting area 202 of the micro-light-emitting diode chip 210, and the light-shielding layer 310 is arranged around the outer periphery of the color conversion layer 320. Among them, the light-shielding layer 310 is a black glue layer or other structure that can block light. The color conversion layer 320 includes a black blocking glue 321 and a quantum dot structure. The black blocking glue 321 is arranged in a crisscross pattern to form a filling grid. The quantum dot structure is arranged in a circular pattern of a non-quantum dot structure 322, a red quantum dot structure 323, and a green quantum dot structure 324 to fill the corresponding filling grids to form quantum dot blocks. When the transparent cover plate 300 is covered and connected to the micro-LED chip 210, each quantum dot block of the color conversion layer 320 can correspond to each pixel unit of the micro-LED chip 210, thereby realizing the color conversion of the pixel unit.

[0093] It can be understood that the size of the transparent cover 300 is the same as the size of the micro-LED chip 210, or the size of the transparent cover 300 is larger than the size of the micro-LED chip 210, so that the color conversion layer 320 can completely cover the orthographic projection of the light-emitting area 201 on the transparent cover 300, and the color conversion layer 320 is arranged opposite to the light-emitting area 201; the shading layer 310 can completely cover the orthographic projection of the non-luminous area 202 on the transparent cover 300, and the shading layer 310 is arranged opposite to the non-luminous area 202.

[0094] The transparent cover plate 300 of the packaging structure 10 of the embodiment of the present application is arranged on the side of the micro-LED chip 210 of the micro-LED device 200 away from the driving chip 220. The transparent cover plate 300 can encapsulate and protect the micro-LED device 200, reduce the adverse effects of water vapor and other objects on the micro-LED device 200, and improve the reliability of the packaging structure 10; at the same time, the transparent cover plate 300 has a high light transmittance effect, which can ensure that the micro-LED device 200 has a better luminous brightness; and the transparent cover plate 300 also includes a color conversion layer 320, which can convert the color of the light emitted by the micro-LED device 200 and realize the color display of the micro-LED device 200. Therefore, the micro-LED device 200 does not need to set a color display production process, which simplifies the process flow of the entire packaging structure 10 and reduces the preparation cost of the entire packaging structure 10. Based on this, the present application implements the packaging of the micro light emitting diode device 200 through the light-transmitting cover plate 300 having the color conversion layer 320, and the packaging structure 10 has better packaging reliability and color display performance.

[0095] Furthermore, when the carrier plate 110 of the present application is a heat dissipation substrate, the transparent cover plate 300 of the present application has a high light transmittance effect and good airtight protection, the carrier plate 110 has good thermal conductivity and heat dissipation, and the packaging structure 10 of the present application can meet the requirements of light, electricity, and heat to the maximum extent, and the packaging performance is relatively good. Moreover, when the micro-LED chip 210 is provided with a non-luminous area 202 and the transparent cover plate 300 includes a light shielding layer 310, the light shielding layer 310 can make the user unable to see the structure of the non-luminous area 202 on the light-emitting side of the micro-LED chip 210, and the light shielding layer 310 can hide the layered structure under the non-luminous area 202; at the same time, the light shielding layer 310 can also block and absorb the light of the light-emitting area 201 of the micro-LED chip 210, and prevent the micro-LED device 200 from leaking light, thereby further improving the optical performance of the packaging structure 10.

[0096] In some embodiments, please refer to Fig.14The light-transmitting cover plate 300 includes a first surface 331 and a second surface 332 that are arranged opposite to each other. When the light-transmitting cover plate 300 is arranged on the light-emitting side of the micro-LED chip 210, the second surface 332 of the light-transmitting cover plate 300 is located between the first surface 331 and the micro-LED chip 210. At this time, the color conversion layer 320 is located between the light-transmitting cover plate 300 and the micro-LED chip 210. On the one hand, the color conversion layer 320 is not exposed to the outer surface of the packaging structure 10, and the probability of the color conversion layer 320 being hit or impacted by foreign objects is low, and the service life of the color conversion layer 320 is long; on the other hand, the distance between the color conversion layer 320 and the pixel unit of the micro-LED chip 210 is closer, and the color conversion layer 320 has a better color conversion effect on the light emitted by the micro-LED chip 210, and the color display effect of the micro-LED chip 210 is better.

[0097] It is understandable that, in some examples, the light shielding layer 310 is disposed on the first surface 331 of the light-transmitting cover plate 300. At this time, the light shielding layer 310 and the color conversion layer 320 are respectively disposed on two opposite sides of the light-transmitting cover plate 300, and the light shielding layer 310 and the color conversion layer 320 are arranged in layers. Since the quantum dot structure has a certain fluidity when it is not solidified, the light shielding layer 310 and the color conversion layer 320 are arranged in layers and at intervals in the present application, and the light shielding layer 310 is not easy to affect the process production of the color conversion layer 320, and the color display effect of the micro-LED chip 210 can be guaranteed.

[0098] In some embodiments, please refer to Figures 15 to 17 , Fig.15 A structural schematic diagram of a rubber frame structure 500 provided in an embodiment of the present application, Fig.16 A connection diagram of the plastic frame structure 500 provided in an embodiment of the present application is shown in FIG. Fig.17 for Fig.16 The package structure 10 of the present application further comprises a plastic frame structure 500. The plastic frame structure 500 connects the micro light emitting diode device 200 and the light-transmitting cover plate 300.

[0099] It can be understood that, in some embodiments, the glue frame structure 500 is disposed between the non-luminous area 202 of the micro-LED chip 210 and the transparent cover plate 300. In other embodiments, a portion of the glue frame structure 500 is disposed between the edge area of ​​the driving chip 220 not covered by the micro-LED chip 210 and the transparent cover plate 300, and another portion of the glue frame structure 500 is disposed between the non-luminous area 202 of the micro-LED chip 210 and the transparent cover plate 300. The transparent cover plate 300 can be bonded to the micro-LED chip 210 through the glue frame structure 500, and the connection between the transparent cover plate 300 and the micro-LED chip 210 is more secure.

[0100] It is understandable that, in some embodiments, the plastic frame structure 500 is provided with a notch 510. The notch 510 makes the plastic frame structure 500 an annular structure with an opening.

[0101] It is understandable that if Fig.18 and Fig.19 As shown, Fig.18 A schematic diagram of a connection between the plastic frame structure 500 and the light-transmitting cover plate 300 provided in an embodiment of the present application is shown in FIG. Fig.19 for Fig.18 Schematic diagram of the structure in another direction shown. In actual production, the glue frame structure 500 can be set at the edge area of ​​the driver chip 220 through a glue dispensing process, and a gap 510 is cut off from the glue frame structure 500 as an exhaust port during bonding. Subsequently, a bonding process is used to bond the light-transmitting cover plate 300 to the micro-LED device 200, and the light-shielding layer 310 of the light-transmitting cover plate 300 is arranged opposite to the glue frame structure 500 and bonded together.

[0102] It is understood that the plastic frame structure 500 is an annular structure with a notch 510. The plastic frame structure 500 is a rectangular ring, a circular ring or other annular structures. The notch 510 can be formed at any edge or any corner of the plastic frame structure 500. For example, Fig.17 As shown, a notch 510 is provided at an edge (eg, a middle area of ​​the edge) of the plastic frame structure 500 close to the circuit board 120 (or close to the electrical connector 900 ).

[0103] The glue frame structure 500 of the embodiment of the present application is provided with a notch 510, and the notch 510 can discharge the gas generated during the bonding process of the light-transmitting cover plate 300 and the glue frame structure 500 (due to high temperature), thereby avoiding the light-transmitting cover plate 300 and the glue frame structure 500 from not fitting together during the bonding process. The glue frame structure 500 provided with the notch 510 in the present application can greatly improve the bonding quality between the light-transmitting cover plate 300 and the glue frame structure 500.

[0104] Please refer again to Fig.15 When the notch 510 is disposed at an edge of the plastic frame structure 500, in some embodiments, the ratio of the opening size D1 of the notch 510 to the length size D2 of the edge is between 2% and 10% (including the endpoint values). For example, the opening size D1 of the notch 510 is 4% to 8% (including the endpoint values) of the length size D2 of the edge. For another example, the opening size D1 of the notch 510 is 2%, 4%, 6%, 8% or 10% of the length size D2 of the edge.

[0105] The opening size D1 of the notch 510 of the present application is 2%-10% of the length size D2 of the edge, which can prevent the opening size D1 from being too small, causing the glue frame structure 500 to deform during the bonding process of the light-transmitting cover plate 300 and the glue frame structure 500, thereby blocking the notch 510 and thus hindering exhaust, and can also prevent the opening size D1 from being too large, thereby reducing the bonding firmness of the light-transmitting cover plate 300 and the glue frame structure 500, and reducing the packaging sealing of the light-transmitting cover plate 300 and the glue frame structure 500. The above opening size of the notch 510 of the present application can take into account the bonding firmness, bonding quality and packaging sealing of the light-transmitting cover plate 300 and the glue frame structure 500.

[0106] Among them, please refer to Fig. 20 , Fig. 20 A schematic diagram of a structure of a packaging structure 10 provided in an embodiment of the present application includes a sealing colloid 600. The packaging structure 10 of the present application also includes a sealing colloid 600. The sealing colloid 600 can fill and seal the gap 510 of the packaging structure 10.

[0107] It can be understood that, in some embodiments, the encapsulation colloid 400 wraps the electrical connector 900 and is connected to the plastic frame structure 500. For example, there is a gap between the first side edge of the wire bonding area 123 of the encapsulation structure 10 and the edge of the plastic frame with the notch 510. At this time, the sealing colloid 600 can fill and seal the gap and the notch 510 at the same time, and the sealing colloid 600 can connect the encapsulation colloid 400 and the plastic frame structure 500 into a whole.

[0108] The packaging structure 10 of the embodiment of the present application is provided with a sealing colloid 600 for sealing the notch 510 of the sealing frame structure 500, which can improve the sealing and airtightness performance of the packaging structure 10; moreover, the packaging colloid 400, the sealing colloid 600 and the frame structure 500 are connected as an integrated structure, and there is almost no gap between the micro light emitting diode device 200 and the packaging substrate 100, which greatly improves the packaging airtightness performance of the packaging structure 10 of the present application.

[0109] Among them, please refer to Fig.21 , Fig.21 A schematic diagram of a structure in which the packaging structure 10 provided in the embodiment of the present application includes a reinforcing colloid 700. The packaging structure 10 in the embodiment of the present application also includes a reinforcing colloid 700. The reinforcing colloid 700 is arranged on a side of the circuit board 120 away from the micro-light emitting diode device 200, and the reinforcing colloid 700 is arranged in an adjacent area of ​​the connection area between the carrier board 110 and the circuit board 120 (the area where the first end of the circuit board 120 is located). The reinforcing colloid 700 can not only seal the connection gap between the carrier board 110 and the circuit board 120, but also increase the connection strength between the carrier board 110 and the circuit board 120.

[0110] Please refer again to Figures 1 to 21The packaging substrate 100 also includes a terminal structure, such as a second terminal structure 122, which is electrically connected to the aforementioned first terminal structure 121. At the same time, the second terminal structure 122 is also electrically connected to an external circuit, and the external circuit is electrically connected to the driving chip 220 through the first terminal structure 121, the second terminal structure 122 and the electrical connector 900.

[0111] It is understandable that the second terminal structure 122 can be disposed near the second end of the circuit board 120, and the distance between the second terminal structure 122 and the second end of the circuit board 120 is much smaller than the distance between the second terminal structure 122 and the first end. The second terminal structure 122 can extend out of the carrier board 110, making it easier to electrically connect to an external circuit.

[0112] It is understandable that if Figures 1 to 21 As shown, the package substrate 100 of the present application further includes a reinforcing sheet 800, and the reinforcing sheet 800 and the second terminal structure 122 are arranged on two opposite sides of the package substrate 100. For example, the second terminal structure 122 can be arranged on the side of the circuit board 120 away from the micro-light emitting diode device 200, and the reinforcing sheet 800 can be arranged on the side of the circuit board 120 close to the micro-light emitting diode device 200. For another example, the reinforcing sheet 800 can be arranged on the side of the circuit board 120 away from the micro-light emitting diode device 200, and the second terminal structure 122 can be arranged on the side of the circuit board 120 close to the micro-light emitting diode device 200. Among them, the reinforcing sheet 800 is arranged opposite to the second terminal structure 122, and the orthographic projection of the reinforcing sheet 800 on the circuit board 120 covers the orthographic projection of the second terminal structure 122 on the circuit board 120. The package substrate 100 of the embodiment of the present application is provided with the reinforcing sheet 800, and the reinforcing sheet 800 can increase the structural strength of the circuit board 120 at the second terminal structure 122.

[0113] Based on the above description, the transparent cover plate 300 with the color conversion layer 320 of the packaging structure 10 of the present application is arranged on the side of the micro-LED chip 210 of the micro-LED device 200 away from the driving chip 220, which can improve the reliability of the packaging structure 10 and realize the color display of the micro-LED device 200. At the same time, the transparent cover plate 300 is bonded to the micro-LED device 200 through the glue frame structure 500 with a notch 510, and the bonding quality of the two is better. At the same time, the packaging colloid 400, the sealing colloid 600 and the glue frame structure 500 are connected as an integrated structure, and there is almost no gap between the micro-LED device 200 and the packaging substrate 100, which can greatly improve the packaging airtightness of the packaging structure 10.

[0114] Based on the description of the above packaging structure 10, the present application embodiment also provides a packaging method. Fig. 22 , Fig. 22A first flow chart of the packaging method provided in an embodiment of the present application.

[0115] In S101 , a micro light emitting diode device 200 is provided. The micro light emitting diode device 200 includes a micro light emitting diode chip 210 and a driving chip 220 that are electrically connected.

[0116] like Figures 3 to 6 As shown, the micro-LED chip 210 and the driving chip 220 are bonded and connected. The micro-LED chip 210 includes a light-emitting area 201 and a non-light-emitting area 202, and the non-light-emitting area 202 is arranged around the outer periphery of the light-emitting area 201. The non-light-emitting area 202 is the electrode and wiring area of ​​the micro-LED chip 210, and the light-emitting area 201 is the pixel area of ​​the micro-LED chip 210.

[0117] In S102 , a light-transmitting cover plate 300 is provided, and the light-transmitting cover plate 300 includes a color conversion layer 320 .

[0118] like Fig.14 As shown, the light-transmitting cover plate 300 can be, but is not limited to, an inorganic glass sheet, an organic glass sheet, a transparent resin substrate, a glass fiber reinforced plastic substrate, etc. In some examples, the light-transmitting cover plate 300 also includes a light-shielding layer 310, and the light-transmitting cover plate 300 carries the light-shielding layer 310 and the color conversion layer 320. The light-shielding layer 310 is arranged around the outer periphery of the color conversion layer 320. Among them, the light-shielding layer 310 can be a black glue layer or other structure that can block light. The color conversion layer 320 includes a quantum dot structure that can achieve color conversion.

[0119] In S103 , the transparent cover plate 300 is disposed on the light emitting side of the micro LED chip 210 , and the color conversion layer 320 covers at least a portion of the light emitting region 201 of the micro LED chip 210 , thereby forming a package structure 10 .

[0120] like Figures 14 to 17 as well as Figure 1 and Figure 2 As shown, the transparent cover plate 300 can be bonded to the micro-LED device 200 through, but not limited to, the glue frame structure 500. The shape and area of ​​the color conversion layer 320 can be equal to or larger than the shape and area of ​​the light-emitting region 201 of the micro-LED chip 210, and the projection of the color conversion layer 320 on the micro-LED chip 210 can completely cover the light-emitting region 201.

[0121] In the packaging method of the embodiment of the present application, a transparent cover plate 300 is arranged on the light-emitting side of the micro-LED chip 210. The transparent cover plate 300 can encapsulate and protect the micro-LED device 200, and can reduce the adverse effects of water vapor and other objects on the micro-LED device 200. The transparent cover plate 300 can improve the reliability of the packaging structure 10; at the same time, the transparent cover plate 300 has a high light transmittance effect and is not easy to affect the luminous performance of the micro-LED device 200; moreover, the transparent cover plate 300 also includes a color conversion layer 320, and the color conversion layer 320 can convert the color of the light emitted by the micro-LED device 200 and realize the color display of the micro-LED device 200, so that the micro-LED device 200 does not need to set a color display production process, which simplifies the process flow of the entire packaging structure 10 and reduces the preparation cost of the entire packaging structure 10. Based on this, the packaging method of the present application realizes the packaging of the micro-LED device 200 through the light-transmitting cover plate 300 having the color conversion layer 320, and the packaging structure 10 prepared by the packaging method of the present application has better packaging reliability and color display performance. In addition, when the carrier plate 110 of the present application is a heat dissipation substrate, the light-transmitting cover plate 300 of the present application has a high light transmission effect and good airtight protection, and the carrier plate 110 has good thermal conductivity and heat dissipation. The packaging structure 10 prepared by the packaging method of the present application can meet the requirements of light, electricity, and heat to the maximum extent.

[0122] In some embodiments, step S102: providing a transparent cover plate 300, wherein the transparent cover plate 300 includes a color conversion layer 320, includes: providing a transparent cover plate 300, and forming the color conversion layer 320 on the second surface 332 of the transparent cover plate 300. At this time, step S103: arranging the transparent cover plate 300 on the light-emitting side of the micro-LED chip 210 includes: placing the transparent cover plate 300 on the light-emitting side of the micro-LED chip 210, and arranging the second surface 332 between the first surface 331 and the micro-LED chip 210.

[0123] In the embodiment of the present application, the color conversion layer 320 is located between the transparent cover plate 300 and the micro-LED chip 210, and the service life of the color conversion layer 320 is longer; at the same time, the distance between the color conversion layer 320 and the pixel unit of the micro-LED chip 210 is closer, the color conversion layer 320 has a better color conversion effect on the light emitted by the micro-LED chip 210, and the color display effect of the micro-LED chip 210 is better.

[0124] In some examples, the micro-LED chip 210 also includes a non-luminous area 202, and the transparent cover 300 also includes a shading layer 310. Step S103: the transparent cover 300 is set on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers at least part of the light-emitting area 201 of the micro-LED chip 210, and a packaging structure 10 is formed, including: the transparent cover 300 is set on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers the light-emitting area 201, and the shading layer 310 covers the non-luminous area 202.

[0125] In the embodiment of the present application, the shading layer 310 can prevent the user from seeing the structure of the non-luminous area 202 on the luminous side of the micro-LED chip 210, and the shading layer 310 can hide the layered structure under the non-luminous area 202; at the same time, the shading layer 310 can also block and absorb the light of the luminous area 201 of the micro-LED chip 210, and prevent the micro-LED device 200 from leaking light.

[0126] In some examples, step S102: providing a transparent cover plate 300, the transparent cover plate 300 including a color conversion layer 320, includes: providing a transparent cover plate 300, forming a light shielding layer 310 on a first surface 331 of the transparent cover plate 300, and forming a color conversion layer 320 on a second surface 332 of the transparent cover plate 300.

[0127] In the embodiment of the present application, the shading layer 310 and the color conversion layer 320 are respectively arranged on two opposite surfaces of the transparent cover plate 300, and the shading layer 310 and the color conversion layer 320 are arranged in layers and at intervals. The shading layer 310 is not likely to affect the process production of the color conversion layer 320, which can further improve the color display effect of the micro light emitting diode chip 210.

[0128] Among them, in some embodiments, step S103: the transparent cover plate 300 is set on the light-emitting side of the micro-LED chip 210, and the color conversion layer 320 covers at least part of the light-emitting area 201 of the micro-LED chip 210, and a packaging structure 10 is formed, including: forming a glue frame structure 500 on the surface of the driving chip 220; the transparent cover plate 300 is set on the light-emitting side of the micro-LED chip 210, and the transparent cover plate 300 is connected to the micro-LED device 200 through the glue frame structure 500, and the color conversion layer 320 covers at least part of the light-emitting area 201, and a packaging structure 10 is formed.

[0129] In the embodiment of the present application, the light-transmitting cover plate 300 can be bonded to the micro-LED chip 210 through the glue frame structure 500, and the connection between the light-transmitting cover plate 300 and the micro-LED chip 210 is more secure.

[0130] In some embodiments, the plastic frame structure 500 is provided with a gap 510 . The packaging method further includes: filling the gap 510 with a sealing plastic 600 , and making the sealing plastic 600 seal the gap 510 .

[0131] In the embodiment of the present application, the glue frame structure 500 is provided with a notch 510, and the notch 510 can discharge the gas generated during the bonding process of the light-transmitting cover plate 300 and the glue frame structure 500, thereby greatly improving the bonding quality between the light-transmitting cover plate 300 and the glue frame structure 500. In addition, the sealing colloid 600 can further improve the sealing and airtightness performance of the packaging structure 10.

[0132] In some embodiments, the package structure 10 further includes a package substrate 100, and the package substrate 100 includes a carrier board 110 and a circuit board 120 connected to each other. After step S101, after the step of providing the micro-LED device 200, it also includes: placing the micro-LED device 200 on the carrier board 110, and electrically connecting the circuit board 120 to the driving chip 220 through the electrical connector 900; filling the electrical connector 900 with colloid to form a package colloid 400 that wraps the electrical connector 900.

[0133] The embodiment of the present application wraps the electrical connector 900 with the encapsulation colloid 400 , which can improve the sealing performance of the electrical connector 900 , prevent liquids such as water vapor from affecting the electrical connection between the driver chip 220 and the circuit board 120 , and improve the reliability of the packaging structure 10 .

[0134] Based on the above description, please refer to Fig.23 , Fig.23 A second flow chart of the packaging method provided in an embodiment of the present application.

[0135] In S201 , a micro-LED device 200 is provided. The micro-LED device 200 includes a micro-LED chip 210 and a driving chip 220 that are bonded together. The micro-LED chip 210 includes a light-emitting region 201 and a non-light-emitting region 202 .

[0136] like Figures 3 to 6 As shown, the micro LED chip 210 and the driving chip 220 are bonded and connected, and the driving chip 220 controls the micro LED chip 210 to emit light. The non-light emitting area 202 of the micro LED chip 210 is arranged around the outer periphery of the light emitting area 201.

[0137] In S202 , a packaging substrate 100 is provided, and the packaging substrate 100 includes a carrier board 110 and a circuit board 120 connected to each other.

[0138] like Figure 4As shown, the carrier board 110 is a heat dissipation substrate. The circuit board 120 is a flexible board, for example, the circuit board 120 is a flexible flat cable structure.

[0139] In S203 , the carrier board 110 is disposed and connected to a side of the driving chip 220 facing away from the micro light emitting diode chip 210 .

[0140] like Figure 8 and Fig. 9 As shown, the carrier board 110 is connected to the driver chip 220 through the die bonding structure 240. The micro-LED device 200 and the circuit board 120 are arranged on the same surface of the carrier board 110 and are spaced apart. The driver chip 220 is located between the micro-LED chip 210 and the carrier board 110.

[0141] In S204 , the first substrate 211 of the micro light emitting diode chip 210 is removed.

[0142] like Fig. 9 As shown, this step may be, but is not limited to, peeling off the first substrate 211 of the micro light emitting diode chip 210 through the LLO production process.

[0143] In S205 , the circuit board 120 is electrically connected to the driving chip 220 via the electrical connector 900 .

[0144] like Fig.10 and Fig.11 As shown, after the first substrate 211 is peeled off, the circuit board 120 and the driver chip 220 are connected by a wire bonding process in this step. The driver chip 220 is electrically connected to the circuit board 120 through an electrical connector 900. The driver chip 220 can receive electrical signals and control signals transmitted by the circuit board 120, thereby controlling the micro light emitting diode chip 210 to emit light.

[0145] In S206 , a packaging resin 400 is formed in the preset wire bonding area 123 , and the packaging resin 400 wraps the electrical connection.

[0146] like Figures 11 to 13 As shown, a welding wire area 123 is preset on the circuit board 120. In this step, glue is first dispensed around the electrical connector 900 to form a dam wall, and then colloid is filled in the dam wall area to form a packaging colloid 400. The packaging colloid 400 wraps the electrical connector 900, which can minimize the corrosion of the electrical connection between the circuit board 120 and the driver chip 220 by liquids such as moisture, thereby improving the airtight layer and reliability of the packaging structure 10 of the micro light emitting diode device 200.

[0147] In S207 , a plastic frame structure 500 having a notch 510 is formed on the surface of the driving chip 220 .

[0148] like Figures 15 to 17 As shown, in this step, a glue frame structure 500 is formed at the edge area of ​​the driving chip 220 by a glue dispensing process, and a gap 510 is cut off in the glue frame as an exhaust port during bonding.

[0149] In S208, the transparent cover 300 is connected to the side of the micro-LED chip 210 facing away from the driver chip 220 through the frame structure 500, and the shading layer 310 covers the projection of the non-luminous area 202 on the transparent cover 300, and the color conversion layer 320 covers the projection of the luminous area 201 on the transparent cover 300.

[0150] like Fig.18 and Fig.19 As shown, the transparent cover plate 300 is bonded to the micro-LED device 200 by using a bonding process, and the light shielding layer 310 of the transparent cover plate 300 is arranged opposite to the glue frame and bonded together.

[0151] In S209 , the sealing glue 600 is filled into the gap 510 , and the sealing glue 600 seals the gap 510 .

[0152] like Fig. 20 As shown, the sealing colloid 600 is filled into the gap 510 through the dispensing process, and the sealing colloid 600 seals the gap 510. In some embodiments, there is a gap between the first side edge of the welding wire area 123 of the packaging structure 10 and the edge of the glue frame with the gap 510. At this time, the sealing colloid 600 can fill and seal the gap and the gap 510 at the same time, and the sealing colloid 600 can connect the packaging colloid 400 and the glue frame structure 500 into a whole.

[0153] In S210 , a reinforcing colloid 700 is disposed in a connection area between the circuit board 120 and the carrier board 110 on a side of the circuit board 120 away from the micro light emitting diode device 200 , and a packaging structure 10 is formed.

[0154] like Fig.21 As shown, a reinforcing colloid 700 is disposed at the connection area between the circuit board 120 and the carrier board 110 on the side of the circuit board 120 away from the micro-LED device 200 by a dispensing process, and, as shown in FIG. Figure 1 and Figure 2 As shown, a packaging structure 10 is formed.

[0155] Based on the above description, the packaging method of the present application sets the light-transmitting cover plate 300 with the color conversion layer 320 on the side of the micro-LED chip 210 of the micro-LED device 200 away from the driving chip 220, which can improve the reliability of the packaging structure 10 and realize the color display of the micro-LED device 200. At the same time, the light-transmitting cover plate 300 is bonded to the micro-LED device 200 through the glue frame structure 500 with a notch 510, and the bonding quality of the two is better. At the same time, the packaging colloid 400, the sealing colloid 600 and the glue frame structure 500 are connected as an integrated structure, and there is almost no gap between the micro-LED device 200 and the packaging substrate 100, which can greatly improve the packaging airtightness of the packaging structure 10.

[0156] Based on the above description, the present application embodiment further provides a display device 20, please refer to Fig.24 , Fig.24 A structural schematic diagram of a display device 20 provided in an embodiment of the present application. The display device 20 can be applied to electronic devices to realize extended reality (Extended Reality, XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). In implementation, the display device 20 can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the display device 20 can also be the display part of an electronic device, for example, the electronic device can include: any device with a display screen, such as a smart phone, a smart watch, a laptop computer, a tablet computer, a driving recorder, a navigator, a head-mounted device, etc.; for another example, the display device 20 can also be the lighting part of an electronic device, for example, the electronic device can include: any device with a lighting component, such as a vehicle and a street lamp.

[0157] It is understandable that the display device 20 of the embodiment of the present application includes the packaging structure 10 of any of the above embodiments, or includes the packaging structure 10 prepared by the packaging method of any of the above embodiments. Therefore, the display device 20 of the present application has better packaging integrity, high reliability and good aesthetics.

[0158] It should be noted that the packaging structure 10, packaging method, and display device 20 of the embodiments of the present application are different subjects under the same inventive concept. For features not described in detail in each embodiment, reference can be made to the description in other embodiments.

[0159] It should be noted that the "multiple" mentioned in this application generally refers to two or more. Moreover, the directional terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the embodiments of the present application, rather than to limit the embodiments of the present application. In the various drawings, units with similar structures are represented by the same figure numbers. For clarity, the various parts in the drawings are not drawn to scale. In addition, certain related parts may not be shown in the drawings.

[0160] It should be understood that, in the description of this application, terms such as "first", "second", etc. are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0161] It is understandable that those skilled in the art can combine various implementations in the above embodiments under the guidance of the above embodiments to obtain technical solutions of multiple implementations. The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0162] The packaging structure, packaging method and display device provided by the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device, comprising an electrically connected micro light emitting diode chip and a driver chip; and The light-transmitting cover plate comprises a color conversion layer, wherein the light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip.

2. The packaging structure according to claim 1, characterized in that: The light-transmitting cover plate comprises a first surface and a second surface which are arranged opposite to each other, wherein the second surface is located between the first surface and the micro-LED chip, and the color conversion layer is arranged on the second surface.

3. The packaging structure according to claim 2, characterized in that: The micro light emitting diode chip further includes a non-luminous area, and the light-transmitting cover plate further includes a light-shielding layer, and the light-shielding layer covers the non-luminous area.

4. The packaging structure according to claim 3, characterized in that: The light shielding layer is disposed on the first surface.

5. The packaging structure according to any one of claims 1 to 4, characterized in that: The packaging structure further includes: A glue frame structure is arranged on the driving chip, and the glue frame structure connects the micro light emitting diode device and the light-transmitting cover plate, and supports the light-transmitting cover plate.

6. The packaging structure according to claim 5, characterized in that: The plastic frame structure is provided with a notch; the packaging structure further comprises: A sealing colloid is used to fill and seal the gap.

7. The packaging structure according to claim 6, characterized in that: The notch is arranged at an edge of the rubber frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

8. The packaging structure according to claim 5, characterized in that: The packaging structure further includes: A packaging substrate, comprising a carrier plate and a circuit board connected to each other, the micro light emitting diode device is arranged on the carrier plate, and the circuit board is electrically connected to the driving chip through an electrical connector; and The packaging colloid wraps the electrical connector and is connected to the colloid frame structure.

9. The packaging structure according to claim 8, characterized in that: The packaging structure further includes: The reinforcing colloid is arranged on a side of the circuit board away from the micro-light emitting diode device and in an area adjacent to a connection area between the circuit board and the carrier board.

10. The packaging structure according to claim 8, characterized in that: The packaging substrate further includes a reinforcing sheet and a terminal structure disposed on two opposite sides of the circuit board, wherein a projection of the reinforcing sheet on the circuit board covers a projection of the terminal structure on the circuit board.

11. A packaging method for a micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driving chip which are electrically connected; Providing a light-transmitting cover plate, wherein the light-transmitting cover plate comprises a color conversion layer; The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip to form a packaging structure.

12. The packaging method according to claim 11, characterized in that: The light-transmitting cover plate comprises a first surface and a second surface which are arranged opposite to each other; The light-transmitting cover plate is provided, and the light-transmitting cover plate includes a color conversion layer, including: Providing a light-transmitting cover plate, and forming a color conversion layer on a second surface of the light-transmitting cover plate; The step of arranging the light-transmitting cover plate on the light-emitting side of the micro-LED chip comprises: The light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the second surface is located between the first surface and the micro-LED chip.

13. The packaging method according to claim 11, characterized in that: The micro-LED chip further includes a non-luminous area, and the light-transmitting cover plate further includes a light-shielding layer; The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers at least a part of the light-emitting area of ​​the micro-LED chip to form a packaging structure, including: The light-transmitting cover is arranged on the light-emitting side of the micro-LED chip, and the color conversion layer covers the light-emitting area, and the light-shielding layer covers the non-light-emitting area.

14. The packaging method according to claim 11, characterized in that: The step of arranging the light-transmitting cover plate on the light-emitting side of the micro-LED chip comprises: forming a glue frame structure on the surface of the driving chip; The light-transmitting cover plate is arranged on the light-emitting side of the micro-LED chip, and the light-transmitting cover plate is connected to the micro-LED device through the glue frame structure.

15. The packaging method according to claim 14, characterized in that: The plastic frame structure is provided with a notch, and the packaging method further comprises: The gap is filled with a sealing colloid, and the sealing colloid is used to seal the gap.

16. The packaging method according to claim 15, characterized in that: The notch is arranged at an edge of the rubber frame structure, and the ratio of the opening size of the notch to the length size of the edge is between 2% and 10%.

17. The packaging method according to any one of claims 11 to 16, characterized in that: The packaging structure further includes a packaging substrate, and the packaging substrate includes a carrier plate and a circuit board connected to each other; After the step of providing the micro light emitting diode device, the method further includes: The micro light emitting diode device is arranged on the carrier board, and the circuit board is electrically connected to the driving chip through an electrical connector; The electrical connector is filled with colloid to form a packaging colloid that wraps the electrical connector.

18. A display device, characterized in that: The display device comprises the packaging structure according to any one of claims 1 to 10; or, the display device comprises the packaging structure prepared by the packaging method according to any one of claims 11 to 17.

Images