Cooling unit, flow control method and vehicle

Abstract

The invention relates to a cooling unit, a flow control method and a vehicle. The cooling unit comprises a liquid cooling circulation loop formed by connecting a plurality of liquid supply pumps, a heat exchanger, a cooling module and a flow resistance device in series; the processor is in communication connection with the flow resistance device and is configured to control the flow resistance device according to the flow of the liquid in the liquid cooling circulation loop, and the liquid supply pumps are connected in parallel and are configured to drive the liquid in the liquid cooling circulation loop to flow; the heat exchanger is configured to enable liquid in the liquid cooling circulation loop to exchange heat with equipment to be cooled; the cooling module is configured to cool liquid in the liquid cooling circulation loop; and the flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that the flow of the liquid in the liquid cooling circulation loop is within a working range under the condition that all the liquid supply pumps work normally and part of the liquid supply pumps break down.

Description

Technical Field

[0001] The present disclosure relates to the field of refrigeration, and in particular to a cooling unit, a flow control method and a vehicle. Background Art

[0002] As communication technology advances with each passing day, the heat density of various communication devices is also increasing. In some situations, the space available for cooling units to cool these communication devices is limited. For example, for in-vehicle mobile communication devices, due to the limited energy and space of the vehicle, the space needs to be provided to the communication devices to the greatest extent. In this case, the space available for the cooling unit is very limited and is easily interfered by the communication devices.

[0003] In addition, in order to ensure the long-term reliable operation of the cooling unit, it is necessary to consider the situation of pump failure in the cooling unit and make alternative plans.

[0004] An alternative solution in the related art includes: using a backup pump, for example, setting the pumps in the cooling unit as two working pumps and one backup pump or one working pump and one backup pump, and using the backup pump to operate in the event of a working pump failure. The above backup pump solution may cause the pipeline structure to become complicated or the pump itself to be large in size, and there is a problem of occupying too much space, which is not suitable for cooling vehicle mobile communication equipment.

[0005] Another alternative solution in the related art includes: using bypass regulation, using multiple high-power pumps, and additionally including a bypass branch. The bypass branch is configured to divert the liquid when multiple pumps are working at the same time; and when a pump fails, the diversion is disconnected and stopped to ensure that the flow in the cooling unit meets the normal operation requirements. In the above bypass regulation solution, the pump always needs to run at high power, resulting in a reduced lifespan. Summary of the invention

[0006] In the related art, the pump in the cooling unit has problems such as occupying too much space and having a shortened lifespan.

[0007] In view of this, the present disclosure provides a cooling unit, which can save installation space while ensuring the reliability of the cooling unit, and can reduce the operating load of a pump in the cooling unit and increase the life of the pump.

[0008] According to one aspect of some embodiments of the present disclosure, a cooling unit is provided, comprising: a liquid cooling circulation loop composed of a plurality of liquid supply pumps, a heat exchanger, a cooling module and a flow resistance device connected in series; a processor, which is in communication connection with the flow resistance device and is configured to control the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop, wherein: the plurality of liquid supply pumps are connected in parallel and configured to drive the flow of the liquid in the liquid cooling circulation loop; the heat exchanger is configured to allow the liquid in the liquid cooling circulation loop to exchange heat with the equipment to be cooled, and the inlet of the heat exchanger is in fluid communication with the outlet of the plurality of liquid supply pumps; the cooling module is configured to cool the liquid in the liquid cooling circulation loop, the inlet of the cooling module is in fluid communication with the outlet of the heat exchanger, and the outlet of the cooling module is in fluid communication with the inlet of the plurality of liquid supply pumps; the flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all the plurality of liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

[0009] In the technical solution of the embodiment of the present disclosure, by not using a backup pump, the space utilization rate is improved and the installation space of the cooling unit is saved. Through the flow resistance device, resistance is applied to the liquid flowing in the liquid cooling circulation loop of the cooling unit, the flow rate output by the liquid supply pump is reduced, thereby reducing the operating power of multiple liquid supply pumps, and when all multiple liquid supply pumps are working normally, multiple liquid supply pumps can be operated at a lower load, thereby increasing the life of the liquid supply pumps; in addition, by controlling the flow resistance device, the flow rate of the liquid in the liquid cooling circulation loop can be kept within the working range, thereby ensuring the reliability of the cooling unit.

[0010] In some embodiments, the flow resistance device includes: a regulating valve with adjustable opening, configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting the opening according to the control of the processor; or a pipe segment switching device, configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by allowing part of the liquid cooling circulation loop to be selectively connected to pipe segments with different diameters or different curvatures according to the control of the processor.

[0011] In the technical solution of the embodiment of the present disclosure, the flow resistance device can be implemented in the form of a regulating valve with adjustable opening or a pipe section switching device. Specifically, the passage area of ​​the liquid can be changed or the flow of the liquid can be blocked by adjusting the opening of the regulating valve or adjusting the diameter or curvature of the pipeline, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop. The resistance applied by the flow resistance device can control the flow rate of the liquid in the liquid cooling circulation loop.

[0012] In some embodiments, the liquid supply pump is a fixed frequency pump.

[0013] In the technical solution of the embodiment of the present disclosure, by using a fixed frequency pump, the signal interference caused by the variable frequency pump can be avoided. In addition, the present disclosure can control the flow rate of the liquid in the liquid cooling circulation loop through the flow resistance device without using a variable frequency pump. The technical solution of the present disclosure also ensures the reliability of the cooling unit.

[0014] In some embodiments, controlling the flow resistance device according to the flow rate of liquid in the liquid cooling circulation loop includes: when the flow rate of liquid in the liquid cooling circulation loop is greater than the working range, controlling the flow resistance device to increase the flow resistance of liquid in the liquid cooling circulation loop; when the flow rate of liquid in the liquid cooling circulation loop is less than the working range, controlling the flow resistance device to reduce the flow resistance of liquid in the liquid cooling circulation loop.

[0015] In the technical solution of the embodiment of the present disclosure, the flow resistance device is controlled by the processor according to the flow rate of the liquid in the liquid cooling circulation loop. By adjusting the resistance applied by the flow resistance device as described above, the flow rate of the liquid in the liquid cooling circulation loop can be controlled to be within the working range.

[0016] In some embodiments, the working range includes a flow range from a first flow rate to a second flow rate, the second flow rate is greater than the first flow rate, and controlling the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop also includes: when the multiple liquid supply pumps are all working normally and the flow rate of the liquid in the liquid cooling circulation loop is greater than the second flow rate, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of the liquid in the liquid cooling circulation loop is less than or equal to the second flow rate; when some liquid supply pumps fail and the flow rate of the liquid in the liquid cooling circulation loop is less than the first flow rate, controlling the flow resistance device to reduce the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of the liquid in the liquid cooling circulation loop is greater than or equal to the first flow rate.

[0017] In the technical solution of the embodiment of the present disclosure, through the above control, it can be achieved that: when multiple liquid supply pumps are all working normally and the flow rate they provide is greater than the upper limit of the working range, that is, the second flow rate, the flow rate is controlled to be at or below the second flow rate by controlling the flow resistance device; and when some liquid supply pumps fail and the flow rate provided by the remaining liquid supply pumps is less than the lower limit of the working range, that is, the first flow rate, the flow rate is controlled to be at or above the first flow rate by controlling the flow resistance device. The above control can ensure the operation of the cooling unit and improve the reliability of the cooling unit.

[0018] In some embodiments, the working range includes a third flow rate, which is greater than the first flow rate and less than the second flow rate. Controlling the flow resistance device according to the flow rate of liquid in the liquid cooling circulation loop also includes: when all of the multiple liquid supply pumps are operating normally, controlling the flow resistance device so that the difference between the flow rate of liquid in the liquid cooling circulation loop and the third flow rate is less than a threshold value.

[0019] In the technical solution in the embodiment of the present disclosure, the third flow rate is, for example, the rated flow rate of the heat exchanger. By further setting the third flow rate and controlling the flow rate in the liquid cooling circulation loop near the third flow rate, the heat exchanger can have a higher working efficiency while avoiding the waste of excess flow, thereby improving the working efficiency of the cooling unit under normal working conditions.

[0020] In some embodiments, the liquid cooling circulation loop also includes: a flow sensor, which is communicatively connected to the processor and configured to sense the flow of liquid in the liquid cooling circulation loop; and / or at least one pressure sensor, which is communicatively connected to the processor and configured to sense the pressure of the liquid in the liquid cooling circulation loop.

[0021] In the technical solution in the embodiments of the present disclosure, accurate measurement of the flow rate and / or pressure of the liquid in the liquid cooling circulation loop of the cooling unit can be achieved through a flow sensor and / or a pressure sensor, which is convenient for the processor in the cooling unit to control.

[0022] In some embodiments, the at least one pressure sensor includes: a first pressure sensor located at an inlet of the heat exchanger; and / or a second pressure sensor located at an outlet of the plurality of liquid supply pumps.

[0023] In the technical solution of the embodiment of the present disclosure, the first pressure sensor can monitor the pressure of the liquid at the heat exchanger inlet, which can ensure that the liquid flowing through the heat exchanger inlet does not exceed the safety pressure of the heat exchanger inlet, effectively protecting the more fragile interface. The second pressure sensor can monitor the pressure of the liquid at the outlets of multiple liquid supply pumps, thereby accurately judging the working status of multiple liquid supply pumps.

[0024] In some embodiments, the liquid cooling circulation loop further includes: a bypass branch connected in parallel with the heat exchanger and configured to divert the liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger is greater than a threshold value.

[0025] In the technical solution in the embodiment of the present disclosure, through the bypass branch, the liquid in the liquid cooling circulation loop can be diverted when the pressure of the liquid at the inlet of the heat exchanger is close to the safety pressure of the inlet of the heat exchanger, thereby reducing the pressure of the liquid in the loop and protecting the inlet of the heat exchanger.

[0026] In some embodiments, the bypass branch includes a bypass valve, the processor is in communication with the bypass valve, and controls the bypass valve according to the pressure sensed by the first pressure sensor.

[0027] In the technical solution in the embodiment of the present disclosure, through the bypass valve and the control of the bypass valve by the processor, when the pressure sensed by the first pressure sensor is greater than the threshold, the bypass branch can be controlled to divert the flow, thereby achieving accurate control of the bypass branch and protecting the heat exchanger inlet.

[0028] In some embodiments, the processor determines whether there is a fault in the plurality of liquid supply pumps based on the pressure sensed by the second pressure sensor.

[0029] In the technical solution in the embodiment of the present disclosure, through the pressure sensed by the second pressure sensor, the processor can make a timely and accurate judgment when there is a failure in the liquid supply pump, resulting in insufficient pressure of the liquid at the outlet.

[0030] In some embodiments, the liquid cooling circulation loop further includes: a ball valve, respectively connected to the inlet and outlet of the plurality of liquid supply pumps; and a flexible joint, respectively connected between the plurality of liquid supply pumps and the ball valve.

[0031] In the technical solution in the embodiment of the present disclosure, by installing ball valves and flexible joints at both ends of the liquid supply pump, the connection between the liquid supply pump and other parts of the liquid cooling circulation loop can be effectively cut off when the liquid supply pump fails, thereby repairing the liquid supply pump and improving the convenience of the system.

[0032] In some embodiments, the liquid cooling circulation loop further includes: a one-way valve configured to allow the liquid in the liquid cooling circulation loop to flow in one direction.

[0033] By installing a one-way valve at the outlet of the liquid supply pump, it can be ensured that the liquid in the liquid cooling circulation loop flows in one direction, avoiding damage caused by the liquid flowing back into the liquid supply pump due to unexpected circumstances.

[0034] According to one aspect of some other embodiments of the present disclosure, there is provided a flow control method, which is applied to the cooling unit as described above, and includes: determining the flow rate of liquid in a liquid cooling circulation loop; controlling a flow resistance device according to the flow rate of liquid in the liquid cooling circulation loop to apply resistance to the liquid flowing in the liquid cooling circulation loop, so that the flow rate of liquid in the liquid cooling circulation loop is within the working range when all multiple liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

[0035] In the technical solution of the embodiment of the present disclosure, after determining the flow rate of the liquid, the control of the cooling unit as described above is implemented, so that the flow rate of the liquid in the liquid cooling circulation loop can be kept within the working range, thereby ensuring the reliability of the cooling unit. In addition, the cooling unit as described above does not use a backup pump, thereby improving space utilization and saving installation space of the cooling unit. At the same time, when all the multiple liquid supply pumps are working normally, the multiple liquid supply pumps can be operated at a lower load, thereby increasing the life of the liquid supply pumps.

[0036] According to an aspect of some further embodiments of the present disclosure, there is provided a vehicle, comprising: a communication device; and a cooling unit as described above, configured to cool the communication device.

[0037] In the technical solution in the embodiment of the present disclosure, the cooling unit as described above does not use a backup pump, which improves space utilization and saves the installation space of the cooling unit. At the same time, when all the multiple liquid supply pumps are working normally, multiple liquid supply pumps can be operated at a lower load, thereby increasing the life of the liquid supply pumps. In addition, by controlling the flow resistance device, the flow rate of the liquid in the liquid cooling circulation loop can be kept within the working range, thereby ensuring the reliability of the cooling unit. The cooling unit as described above is used for cooling communication equipment in a vehicle, which can save the vehicle's load energy and ensure the effectiveness of cooling the communication equipment in the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0039] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0040] Figure 1 is a schematic diagram showing the structure of a cooling unit according to some embodiments of the present disclosure;

[0041] Figure 2 is a diagram showing the power-flow relationship of a liquid supply pump according to some embodiments of the present disclosure;

[0042] Figure 3 is a diagram showing characteristic curves of a liquid supply pump and a pipeline in a liquid cooling circulation loop according to some embodiments of the present disclosure;

[0043] Figure 4 is a schematic diagram showing the structure of a cooling unit according to other embodiments of the present disclosure;

[0044] Figure 5 is a flow chart illustrating a flow control method according to some embodiments of the present disclosure;

[0045] Figure 6is a block diagram illustrating a computer system for implementing some embodiments of the present disclosure.

[0046] It should be understood that the size of each part shown in the accompanying drawings is not drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0047] Various embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the embodiments is merely illustrative and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps described in these embodiments should be interpreted as being merely illustrative and not as a limitation.

[0048] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0049] It should also be understood that any component, data or structure mentioned in the embodiments of the present disclosure can generally be understood as one or more, unless explicitly limited or otherwise indicated in the context.

[0050] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0051] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0052] In the related art, the cooling unit has the problem that the pump occupies too large an area or the pump life is shortened.

[0053] In view of this, the present disclosure proposes a cooling unit that can avoid the above problems.

[0054] First, combine Figure 1 Some embodiments of the cooling unit in the present disclosure are described. Figure 1is a schematic diagram showing the structure of a cooling unit according to some embodiments of the present disclosure. Figure 1 As shown, the cooling unit 1 includes: a liquid cooling circulation loop 10, which is composed of multiple liquid supply pumps, heat exchangers, cooling modules and flow resistance devices connected in series; a processor 20, which is communicated with the flow resistance device and is configured to control the flow resistance device according to the flow rate of liquid in the liquid cooling circulation loop.

[0055] The liquid cooling circulation loop 10 includes: a plurality of liquid supply pumps 11 ; a heat exchanger 12 ; a cooling module 13 ; and a flow resistance device 14 .

[0056] A plurality of liquid supply pumps 11 are connected in parallel and configured to drive the liquid in the liquid cooling circulation loop to flow, in other words, to provide power for the liquid in the liquid cooling circulation loop. The liquid supply pump 11 may be a pump such as a centrifugal pump.

[0057] In some embodiments, the liquid supply pump 11 is a fixed frequency pump. In the above embodiments, by using a fixed frequency pump, signal interference caused by a variable frequency pump can be avoided. In addition, in the technical solution disclosed in the present invention, the flow resistance device can be used to control the flow rate of the liquid in the liquid cooling circulation loop without using a variable frequency pump, which also ensures the reliability of the cooling unit.

[0058] The power-flow relationship of the liquid supply pump 11 is as follows: Figure 2 shown. Figure 2 is a diagram showing the power-flow relationship of the liquid supply pump according to some embodiments of the present disclosure. Figure 2 It can be seen that the power and flow rate of the liquid supply pump 11 are positively correlated, that is, the greater the flow rate flowing through the liquid supply pump 11, the greater the power of the liquid supply pump 11.

[0059] The heat exchanger 12 is configured to exchange heat between the liquid in the liquid cooling circulation loop and the device to be cooled, and the inlet of the heat exchanger is fluidly connected to the outlets of the plurality of liquid supply pumps 11. The heat exchanger 12 can be, for example, a plate heat exchanger, a heat pipe heat exchanger, etc., which can realize cooling of the device to be cooled by the cooling liquid in the liquid cooling circulation loop.

[0060] In some embodiments, the device to be cooled may be a communication device in a vehicle.

[0061] The cooling module 13 is configured to cool the liquid in the liquid cooling circulation loop, the inlet of the cooling module 13 is in fluid communication with the outlet of the heat exchanger 12, and the outlet of the cooling module 13 is in fluid communication with the inlet of the plurality of liquid supply pumps 11. The cooling module 13 may be a device capable of cooling the liquid, such as an electric refrigerator, a chemical refrigerator, or a heat exchanger.

[0062] The flow resistance device 14 is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor 20, so that when all the multiple liquid supply pumps 11 are operating normally and when some of the liquid supply pumps fail, the flow rate of the liquid in the liquid cooling circulation loop is within the working range.

[0063] In some embodiments, the flow resistance device 14 includes a regulating valve with an adjustable opening, and is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting the opening according to the control of the processor 20.

[0064] Specifically, when the flow resistance device 14 includes a regulating valve with an adjustable opening, the opening of the regulating valve can be adjusted to change the passage area of ​​the liquid, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop.

[0065] In other embodiments, the flow resistance device 14 includes a pipe segment switching device, which is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting part of the liquid cooling circulation loop to pipe segments with different pipe diameters or different curvatures according to the control of the processor 20.

[0066] Specifically, when the flow resistance device 14 includes a pipe section switching device, the flow of liquid can be blocked by adjusting the pipe diameter or curvature of the pipeline, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop.

[0067] The above first introduces the implementation method of the flow resistance device 14, indicating that the flow resistance device 14 can apply resistance to the liquid flowing in the liquid cooling circulation loop. Figure 3 This paper introduces how the resistance exerted by the flow resistance device on the liquid affects the flow rate of the liquid. Figure 3 is a diagram showing characteristic curves of a liquid supply pump and pipelines in a liquid cooling circulation loop according to some embodiments of the present disclosure.

[0068] like Figure 3 As shown, curve 31 is the characteristic curve when a single liquid supply pump is working, curve 32 is the characteristic curve when two liquid supply pumps are working in parallel, curve 33 is the characteristic curve of the pipeline of the liquid cooling circulation loop when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circulation loop, and curve 34 is the characteristic curve of the pipeline of the liquid cooling circulation loop when the flow resistance device applies resistance to the liquid flowing in the liquid cooling circulation loop.

[0069] The characteristic curve of the above-mentioned liquid supply pump means a curve showing the relationship between the flow rate of the liquid flowing through the liquid supply pump and the pressure provided by the liquid supply pump for the liquid. Taking point A as an example, the meaning of point A on curve 31 is that when the flow rate of the liquid in the liquid cooling circulation loop is Q1, the pressure provided by a single liquid supply pump for the liquid is P1. The characteristic curve of the liquid supply pump is a reflection of the head of the liquid supply pump at different flow rates.

[0070] The characteristic curve of the above pipeline means a curve showing the relationship between the flow rate of the liquid in the pipeline and the pressure required by the liquid. Taking point B as an example, the meaning of point B on curve 33 is that when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circulation loop, the liquid needs a pressure of P2 to have a flow rate of Q2 in the pipeline. The characteristic curve of the pipeline is a manifestation of the resistance in the pipeline, including the built-in resistance such as the friction of the pipeline and / or the resistance applied to the liquid by the flow resistance device.

[0071] The meaning of the intersection of the above characteristic curves is that under a specific flow rate, the pressure provided by the liquid supply pump to the liquid is consistent with the pressure required for the liquid to flow in the pipeline. Taking point C as an example, the meaning of intersection C is that when the liquid flow rate is Q3, according to curve 34, the liquid requires a pressure of P3, and according to curve 32, the flow rate provided by a single liquid supply pump to the liquid is P3, which just meets the requirement. Therefore, when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circulation loop and a single liquid supply pump is working, the flow rate of the liquid is Q3. Therefore, in actual operation, the intersection of the characteristic curve is the operating condition point of the liquid cooling circulation loop.

[0072] from Figure 3 It can be seen that the resistance exerted by the flow resistance device on the liquid will cause the characteristic curve of the pipeline to change from curve 33 to curve 34. As mentioned above, the operating condition point of the liquid cooling circulation loop is the intersection of the characteristic curve of the liquid supply pump and the characteristic curve of the pipeline. Therefore, as the flow resistance device exerts resistance on the liquid, the flow rate of the liquid in the liquid cooling circulation loop will also decrease.

[0073] In some embodiments, the operating range of the liquid flow in the liquid cooling circulation loop is within a certain range of the rated flow of the heat exchanger, for example, 80% to 120% of the rated flow, thereby ensuring the normal operation of the heat exchanger, that is, the normal cooling work of the cooling equipment.

[0074] According to the above principle, the flow resistance device 14 in the present disclosure ensures that the flow rate of liquid in the liquid cooling circulation loop is within the working range when all the multiple liquid supply pumps 11 are working normally and when some of the liquid supply pumps fail. That is, the flow rate corresponding to the intersection of the characteristic curve when all the liquid supply pumps are working normally and the characteristic curve when some of the liquid supply pumps fail and the characteristic curve of the pipeline are all within the working range.

[0075] For example, in Figure 3 In the corresponding embodiment, the rated flow is Q0, and the working range is 80% to 120% of the rated flow, that is, Figure 3When all the liquid supply pumps are working normally, the characteristic curve of the liquid supply pump is curve 32, and the flow resistance device is controlled to apply resistance to the liquid, so that the operating condition point is the above-mentioned point C, which is within the working range; and when one of the liquid supply pumps fails, the characteristic curve of the liquid supply pump becomes curve 31, and the flow resistance device is controlled to reduce the resistance applied to the liquid, so that the operating condition point can be changed to, for example, point D, which is also within the working range.

[0076] In some embodiments, the processor 20 controls the flow resistance device 14 according to the flow rate of liquid in the liquid cooling circulation loop, including: when the flow rate of liquid in the liquid cooling circulation loop is greater than the working range, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop; when the flow rate of liquid in the liquid cooling circulation loop is less than the working range, controlling the flow resistance device to reduce the flow resistance of the liquid in the liquid cooling circulation loop.

[0077] In the above embodiment, a method is given for the processor 20 to specifically control the flow resistance device 14 based on the principle of the flow resistance device. By adjusting the resistance applied by the flow resistance device as described above according to the flow rate of liquid in the liquid cooling circulation loop, the flow rate of liquid in the liquid cooling circulation loop can be controlled to be within the working range.

[0078] In some embodiments, the control of the processor may be to increase or decrease the flow resistance of the liquid in the liquid cooling circulation loop by a certain amplitude. For example, the resistance provided by the flow resistance device may be adjusted by an amplitude of 1%. Specifically, for example, when the flow resistance device includes a regulating valve with adjustable opening, the opening of the regulating valve is adjusted by an amplitude of 1%, thereby adjusting the resistance provided by the flow resistance device.

[0079] Through the above-mentioned adjustment performed at a certain amplitude, the flow rate of the liquid in the liquid cooling circulation loop can be controlled more quickly or more accurately based on the preset amplitude, thereby improving the control efficiency of the processor.

[0080] After the above adjustment, when all the liquid supply pumps are working normally, the flow resistance device applies a first resistance to the liquid in the liquid cooling circulation loop. When some of the liquid supply pumps fail, the flow resistance device applies a second resistance or no resistance to the liquid in the liquid cooling circulation loop, and the second resistance is smaller than the first resistance.

[0081] By applying the first resistance and the second resistance or not applying resistance in two cases respectively, the flow rate of the liquid can be within the working range in both cases. At the same time, when all the liquid supply pumps are working normally, the flow rate provided by the liquid supply pump will be reduced by the provided resistance. Since the power of the liquid supply pump is positively correlated with the flow rate flowing through the liquid supply pump, the control of the flow rate in the embodiment of the present disclosure can reduce the power of the liquid supply pump when all the liquid supply pumps are working normally, thereby increasing the service life of the liquid supply pump.

[0082] Based on the above processor control, further refinement can also be performed. In some embodiments, the working range includes a flow range from a first flow rate to a second flow rate, and the second flow rate is greater than the first flow rate. In other words, the first flow rate is the lower limit of the working range, and the second flow rate is the upper limit of the working range.

[0083] The control of the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop further includes: when all the multiple liquid supply pumps are working normally and the flow rate of the liquid in the liquid cooling circulation loop is greater than the second flow rate, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of the liquid in the liquid cooling circulation loop is less than or equal to the second flow rate;

[0084] When some liquid supply pumps fail and the flow rate of liquid in the liquid cooling circulation loop is less than the first flow rate, the flow resistance device is controlled to reduce the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of liquid in the liquid cooling circulation loop is greater than or equal to the first flow rate.

[0085] Through the above control, it can be achieved that: when all the multiple liquid supply pumps are working normally and the flow rate they provide is greater than the upper limit of the working range, that is, the second flow rate, the flow rate is controlled to be at or below the second flow rate by controlling the flow resistance device; and when some of the liquid supply pumps fail and the flow rate provided by the remaining liquid supply pumps is less than the lower limit of the working range, that is, the first flow rate, the flow rate is controlled to be at or above the first flow rate by controlling the flow resistance device. The above control can ensure the operation of the cooling unit and improve the reliability of the cooling unit.

[0086] For example, in Figure 3 In the illustrated embodiment, the first flow rate is the lower limit of the working range, namely 80% of the rated flow rate Q0, and the second flow rate is the upper limit of the working range, namely 120% of the rated flow rate Q0.

[0087] Under the condition that all the liquid supply pumps work normally, if the resistance imposed by the flow resistance device is not applied, the operating condition point of the liquid cooling circulation pipeline should be the intersection of curve 32 and curve 33, and the flow provided by multiple liquid supply pumps will exceed the upper limit of the working range, resulting in failure to work. Therefore, by increasing the flow resistance of the flow resistance device, changing the characteristic curve of the pipeline, the operating condition point is changed to the intersection C of curve 32 and curve 34, that is, the flow of the liquid cooling circulation pipeline is controlled at Q3, which is less than 120% of Q0, and the operation of the cooling unit can be guaranteed.

[0088] Similarly, in the case of partial failure of the liquid supply pump, if the resistance applied by the flow resistance device is not reduced, the operating condition point of the liquid cooling circulation pipeline should be the intersection of curve 31 and curve 34, and the flow rate provided by the remaining liquid supply pumps will be less than the lower limit of the working range. Therefore, by reducing the resistance of the flow resistance device, changing the characteristic curve of the pipeline, the operating condition point is changed to the intersection D of curve 31 and curve 34, that is, the flow rate of the liquid cooling circulation pipeline is controlled at Q4, which is greater than 80% of Q0, and the operation of the cooling unit can also be guaranteed.

[0089] In some embodiments, the working range includes a third flow rate, which is greater than the first flow rate and less than the second flow rate. Controlling the flow resistance device according to the flow rate of liquid in the liquid cooling circulation loop also includes: when all of the multiple liquid supply pumps are operating normally, controlling the flow resistance device so that the difference between the flow rate of liquid in the liquid cooling circulation loop and the third flow rate is less than a threshold value.

[0090] The third flow rate may be, for example, the rated flow rate Q0 of the heat exchanger, and the threshold of the difference may be, for example, 5% of Q0. By further setting the third flow rate and controlling the flow rate in the liquid cooling circulation loop to be near the third flow rate, that is, in the range of 95% to 105% of the rated flow rate, the heat exchanger may have a higher working efficiency while avoiding the waste of excess flow, thereby improving the working efficiency of the cooling unit under normal working conditions.

[0091] Based on the above Figure 1-3 Introducing some basic embodiments and operating principles of the present disclosure, the following will be based on Figure 4 Some further embodiments of the present disclosure are introduced. Figure 4 2 is a schematic diagram showing the structure of a cooling unit according to other embodiments of the present disclosure.

[0092] like Figure 4As shown, in some embodiments of the present disclosure, the liquid cooling circulation loop 10 also includes: a flow sensor 15, which is communicatively connected to the processor 20 and configured to sense the flow of liquid in the liquid cooling circulation loop; and / or at least one pressure sensor 16, which is communicatively connected to the processor 20 and configured to sense the pressure of the liquid in the liquid cooling circulation loop.

[0093] The flow sensor 15 and the pressure sensor 16 can accurately measure the flow and pressure of the liquid in the liquid cooling circulation loop 10, which facilitates the processor 20 to perform corresponding control, including the processor controlling the flow resistance device 14 according to the flow of the liquid in the liquid cooling circulation loop.

[0094] In some embodiments, the at least one pressure sensor 16 includes: a first pressure sensor 161 located at the inlet of the heat exchanger; and / or a second pressure sensor 162 located at the outlets of the plurality of liquid supply pumps.

[0095] Through the first pressure sensor 161, the pressure of the liquid at the heat exchanger inlet can be monitored to ensure that the liquid flowing through the heat exchanger inlet does not exceed the safety pressure of the heat exchanger inlet, thereby effectively protecting the more fragile interface.

[0096] By means of the second pressure sensor 162 , it is possible to monitor the pressure of the liquid at the outlets of the plurality of liquid supply pumps, thereby achieving accurate judgment of the working status of the plurality of liquid supply pumps.

[0097] For example, the processor 20 can determine whether there is a fault in multiple liquid supply pumps based on the pressure sensed by the second pressure sensor 162. Specifically, when a liquid supply pump fails, it will cause insufficient pressure of the liquid at the outlet of the liquid supply pump. Through real-time sensing of the second pressure sensor 162, the processor can make timely and accurate judgments on the above situation.

[0098] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a bypass branch 100 connected in parallel with the heat exchanger 12, configured to divert the liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger 12 is greater than a threshold value.

[0099] By means of the bypass branch 100 , when the pressure of the liquid at the heat exchanger inlet is close to the safety pressure at the heat exchanger inlet, the liquid in the liquid cooling circulation loop can be diverted, thereby reducing the pressure of the liquid in the loop and protecting the heat exchanger inlet.

[0100] In some embodiments, the bypass branch 100 includes a bypass valve 101 , and the processor 20 is in communication with the bypass valve 101 and controls the bypass valve according to the pressure sensed by the first pressure sensor.

[0101] The bypass valve can be used to control the flow diversion of the bypass branch. When the first pressure sensor senses that the pressure at the heat exchanger inlet is greater than the threshold, the processor controls the bypass valve to divert the liquid. The above configuration achieves accurate control of the bypass branch, thereby protecting the heat exchanger inlet.

[0102] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a ball valve 17 connected to the inlet and outlet of the plurality of liquid supply pumps 11 ; and a flexible joint 18 connected between the plurality of liquid supply pumps 11 and the ball valve 17 .

[0103] By installing ball valves and flexible joints at both ends of the liquid supply pump, the connection between the liquid supply pump and other parts of the liquid cooling circulation loop can be effectively cut off when the liquid supply pump fails, so that the liquid supply pump can be repaired, improving the convenience of the system.

[0104] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a one-way valve 19 , which is respectively connected to the outlets of the plurality of liquid supply pumps 11 .

[0105] By installing a one-way valve at the outlet of the liquid supply pump, it can be ensured that the liquid in the liquid cooling circulation loop flows in one direction, avoiding damage caused by the liquid flowing back into the liquid supply pump due to unexpected circumstances.

[0106] The above describes the cooling unit and its operation process according to some embodiments of the present disclosure. The cooling unit proposed in the present disclosure can avoid the problem of excessive pump occupation area or reduced pump life while ensuring reliability. Figure 5 The flow control method proposed in the present disclosure and applied to the cooling unit as described above is introduced.

[0107] Figure 5 FIG. 1 is a flow chart showing a flow control method according to some embodiments of the present disclosure. Figure 5 As shown, the flow control method includes steps S51 to S52.

[0108] In step S51, the flow rate of the liquid in the liquid cooling circulation loop is determined. Before the processor controls the flow resistance device, it determines the flow rate of the liquid in the liquid cooling circulation loop.

[0109] In step S52, the flow resistance device is controlled according to the flow rate of the liquid in the liquid cooling circulation loop to apply resistance to the liquid flowing in the liquid cooling circulation loop, so that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all the multiple liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

[0110] In the technical solution of the embodiment of the present disclosure, after determining the flow rate of the liquid, the control of the cooling unit as described above is implemented, so that the flow rate of the liquid in the liquid cooling circulation loop can be kept within the working range, thereby ensuring the reliability of the cooling unit. In addition, the cooling unit as described above does not use a backup pump, thereby improving space utilization and saving installation space of the cooling unit. At the same time, when all the multiple liquid supply pumps are working normally, the multiple liquid supply pumps can be operated at a lower load, thereby increasing the life of the liquid supply pumps.

[0111] Figure 6 is a block diagram illustrating a computer system for implementing some embodiments of the present disclosure.

[0112] like Figure 6 As shown, the computer system 6 may be in the form of a general purpose computing device. The computer system 6 includes a memory 61, a processor 62, and a bus 60 that connects the various system components.

[0113] The memory 61 may be a computer-readable storage medium in various forms, such as a system memory, a non-volatile storage medium, etc. The system memory, for example, stores an operating system, an application program, a boot loader (BootLoader), and other programs. The system memory may include a volatile storage medium, such as a random access memory (RAM) and / or a cache memory. The non-volatile storage medium, for example, stores instructions for executing the corresponding embodiment of the flow control method. The non-volatile storage medium includes, but is not limited to, a disk memory, an optical memory, a flash memory, etc.

[0114] The processor 62 may be implemented by a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gates or transistors, etc. Accordingly, each module may be implemented by a central processing unit (CPU) running instructions in a memory that execute corresponding steps, or by a dedicated circuit that executes corresponding steps.

[0115] The bus 60 may use any of a variety of bus architectures, including, but not limited to, an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MCA) bus, and a Peripheral Component Interconnect (PCI) bus.

[0116] The computer system 6 may also include an input / output interface 63, a network interface 64, a storage interface 65, etc. These interfaces 63, 64, 65, the memory 61, and the processor 62 may be connected via a bus 60. The input / output interface 63 may provide a connection interface for input / output devices such as a display, a mouse, and a keyboard. The network interface 64 may provide a connection interface for various networked devices. The storage interface 65 may provide a connection interface for external storage devices such as a floppy disk, a USB flash drive, and an SD card.

[0117] According to an embodiment of the present disclosure, the process described above with reference to the flowchart can be implemented as a computer software program. For example, some embodiments of the present disclosure include a computer program product, which, when running on a computer, enables the computer to implement the flow control method described in any of the foregoing embodiments. The computer program product includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart.

[0118] An embodiment of the present disclosure also provides a vehicle, comprising a communication device; the cooling unit as described above is configured to cool the communication device.

[0119] As before, the cooling unit described above does not use a backup pump, thereby improving space utilization and saving installation space of the cooling unit. At the same time, when all the multiple liquid supply pumps are working normally, the multiple liquid supply pumps can be operated at a lower load, thereby increasing the life of the liquid supply pumps. In addition, by controlling the flow resistance device, the flow rate of the liquid in the liquid cooling circulation loop can be kept within the working range, thereby ensuring the reliability of the cooling unit.

[0120] The cooling unit as described above is used for cooling communication equipment in a vehicle, which can save space in the vehicle.

[0121] The specific type of the vehicle in the embodiments of the present disclosure is not limited, for example, it can be a sedan, an SUV, a van, a sports car or a special-purpose vehicle, etc.

[0122] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0123] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A cooling unit, comprising: A liquid cooling circulation loop composed of a plurality of liquid supply pumps, heat exchangers, cooling modules and flow resistance devices connected in series; A processor is in communication with the flow resistance device and is configured to control the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop, wherein: The plurality of liquid supply pumps are connected in parallel and configured to drive the liquid flow in the liquid cooling circulation loop; The heat exchanger is configured to exchange heat between the liquid in the liquid cooling circulation loop and the equipment to be cooled, and the inlet of the heat exchanger is in fluid communication with the outlets of the plurality of liquid supply pumps; The cooling module is configured to cool the liquid in the liquid cooling circulation loop, the inlet of the cooling module is in fluid communication with the outlet of the heat exchanger, and the outlet of the cooling module is in fluid communication with the inlet of the plurality of liquid supply pumps; The flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all the multiple liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

2. The cooling unit according to claim 1, wherein: The flow resistance device comprises: a regulating valve with adjustable opening, configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting the opening according to the control of the processor; or The pipe segment switching device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting part of the liquid cooling circulation loop with pipe segments with different pipe diameters or different curvatures according to the control of the processor.

3. The cooling unit according to claim 1, wherein: The liquid supply pump is a fixed frequency pump.

4. The cooling unit according to claim 1, wherein: According to the flow rate of the liquid in the liquid cooling circulation loop, controlling the flow resistance device comprises: When the flow rate of the liquid in the liquid cooling circulation loop is greater than the working range, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop; When the flow rate of the liquid in the liquid cooling circulation loop is less than the working range, the flow resistance device is controlled to reduce the flow resistance of the liquid in the liquid cooling circulation loop.

5. The cooling unit according to claim 4, wherein: The working range includes a flow range from a first flow rate to a second flow rate, the second flow rate is greater than the first flow rate, and the controlling the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop further includes: When all of the multiple liquid supply pumps are operating normally and the flow rate of the liquid in the liquid cooling circulation loop is greater than the second flow rate, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of the liquid in the liquid cooling circulation loop is less than or equal to the second flow rate; When some liquid supply pumps fail and the flow rate of liquid in the liquid cooling circulation loop is less than the first flow rate, the flow resistance device is controlled to reduce the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of liquid in the liquid cooling circulation loop is greater than or equal to the first flow rate.

6. The cooling unit according to claim 5, wherein: The working range includes a third flow rate, the third flow rate is greater than the first flow rate and less than the second flow rate, and the controlling the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop also includes: When all of the plurality of liquid supply pumps operate normally, the flow resistance device is controlled so that the difference between the flow rate of the liquid in the liquid cooling circulation loop and the third flow rate is smaller than a threshold value.

7. The cooling unit according to claim 1, wherein: The liquid cooling circulation loop also includes: a flow sensor, in communication with the processor, configured to sense the flow of liquid in the liquid cooling circulation loop; and / or At least one pressure sensor is communicatively connected to the processor and configured to sense the pressure of the liquid in the liquid cooling circulation loop.

8. The cooling unit according to claim 7, wherein: The at least one pressure sensor comprises: a first pressure sensor located at the inlet of the heat exchanger; and / or A second pressure sensor is located at the outlet of the plurality of liquid supply pumps.

9. The cooling unit according to claim 8, wherein: The liquid cooling circulation loop also includes: The bypass branch is connected in parallel with the heat exchanger and is configured to divert the liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger is greater than a threshold value.

10. The cooling unit according to claim 9, wherein: The bypass branch includes a bypass valve. The processor is in communication with the bypass valve and controls the bypass valve according to the pressure sensed by the first pressure sensor.

11. The cooling unit according to claim 9, wherein: The processor determines whether there is a fault in the plurality of liquid supply pumps according to the pressure sensed by the second pressure sensor.

12. The cooling unit according to claim 1, wherein: The liquid cooling circulation loop also includes: ball valves, respectively connected to the inlets and outlets of the plurality of liquid supply pumps; Flexible joints are respectively connected between the plurality of liquid supply pumps and the ball valve.

13. The cooling unit according to claim 1, wherein: The liquid cooling circulation loop also includes: The one-way valve is configured to allow the liquid in the liquid cooling circulation loop to flow in one direction.

14. A flow control method, applied to a cooling unit according to any one of claims 1 to 13, comprising: Determine the flow rate of liquid in the liquid cooling circulation loop; According to the flow rate of liquid in the liquid cooling circulation loop, the flow resistance device is controlled to apply resistance to the liquid flowing in the liquid cooling circulation loop, so that the flow rate of liquid in the liquid cooling circulation loop is within the working range when all multiple liquid supply pumps are operating normally and when some liquid supply pumps fail.

15. A vehicle comprising: Communications equipment; The cooling unit according to any one of claims 1 to 13, configured to cool the communication device.

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