Glass plate and method for producing same

Abstract

A method for manufacturing a glass plate includes a processing step (S) for processing a glass plate. The processing step (S) includes: an attaching step (S1) in which an adhesive film is attached to one main surface of a glass plate to form a laminate; a modification step (S2) in which a laser beam is irradiated onto the portion to be processed of the glass plate in the state of a laminate to form a modified portion in the portion to be processed; an etching step (S3) for etching the modified part of the glass plate in a laminate state; and a peeling step (S5) for peeling the adhesive film from the glass plate.

Description

Technical Field

[0001] The present invention relates to a glass sheet and a method for producing the same. Background Art

[0002] For example, a glass plate having fine through holes for wiring (through electrodes, etc.) is used as a substrate for a spliced ​​display (micro LED, etc.), a frameless display, a glass interposer, etc.

[0003] Such a through hole processing step includes, for example, a modification step of modifying a portion of the glass plate to be processed with a through hole by irradiating a laser to form a modified portion, and an etching step of etching the modified portion to form a through hole (see, for example, Patent Documents 1 and 2).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-199605

[0007] Patent Document 2: Japanese Patent Application Publication No. 2020-66551 Summary of the invention

[0008] Problems to be solved by the invention

[0009] In the above-mentioned processing steps, the modified portion formed in the modification step has a higher etching rate than the unmodified portion, and is therefore selectively removed in the etching step. Therefore, if the modified portion is formed in the processing portion of the through hole, the through hole can be formed in the processing portion by etching.

[0010] However, in the above-mentioned processing steps, when the glass plate is thin, it is sometimes difficult to handle the glass plate or the glass plate may be warped during processing, which may cause processing difficulties. Moreover, this problem is not limited to the case of forming a through hole in the glass plate in the processing step, for example, it may also occur when a glass plate of a predetermined shape is cut out from the glass plate.

[0011] An object of the present invention is to process a glass plate simply and reliably even when the glass plate is thin.

[0012] Solutions to Solve Problems

[0013] (1) The present invention is a method for manufacturing a glass plate, comprising a processing step for processing the glass plate, wherein the processing step comprises: a bonding step of bonding an adhesive film to a main surface of one side of the glass plate to form a laminate; a modification step of irradiating a portion of the glass plate to be processed with a laser in the state of the laminate after the bonding step to form a modified portion in the portion to be processed; an etching step of etching the modified portion of the glass plate in the state of the laminate after the modification step; and a peeling step of peeling the adhesive film from the glass plate after the etching step.

[0014] In this way, the rigidity of the glass plate is improved by the adhesive film. Therefore, the handleability of the glass plate is improved in the reforming process and the etching process, and the warping of the glass plate can be suppressed. Therefore, even in the case of a thin glass plate, the glass plate can be processed simply and reliably.

[0015] (2) In the configuration of (1) above, it is preferred that the thickness of the glass plate in the bonding step is 1 μm or more and 100 μm or less.

[0016] When the glass plate is thin as described above, the effect of the present invention becomes remarkable.

[0017] (3) In the configuration of (1) or (2) above, the laser light is preferably an ultrashort pulse laser light.

[0018] In this way, the energy of the laser light is sufficiently high, and a modified portion can be easily formed on the glass plate.

[0019] (4) In any one of the structures (1) to (3) above, preferably, in the etching step, the laminated body is immersed in an etching solution.

[0020] Furthermore, when the laminate is immersed in an etching solution, the main surface of the glass plate on which the adhesive film is attached is not etched and becomes a non-etched surface (eg, a forged surface).

[0021] (5) In any one of the above structures (1) to (4), the adhesive film preferably includes a polyolefin-based substrate and an acrylic or polyethylene-based adhesive layer formed on one surface of the substrate.

[0022] In this way, it is easy to give appropriate rigidity to the laminate including the glass plate and the adhesive film. Therefore, in the reforming process and the etching process, the handleability of the glass plate is further improved, and the warping of the glass plate can be more reliably suppressed. In addition, the chemical resistance of the adhesive film becomes good, so the reaction of the adhesive film in the etching process can be suppressed. Moreover, the peelability of the adhesive film becomes good, so the adhesive film can be easily peeled off from the glass plate in the peeling process.

[0023] (6) In any one of the structures (1) to (5) above, it is preferred that the thickness of the adhesive film is 50 μm or more and 200 μm or less.

[0024] In this manner, the adhesive film can be appropriately bent, and thus the adhesive film can be easily peeled from the glass plate in the peeling step.

[0025] (7) In any one of the above (1) to (6), the method for manufacturing the glass plate preferably includes an adhesion weakening step of weakening the adhesion of the adhesive film after the etching step and before the peeling step. Here, the adhesion weakening step may include, for example, irradiating the adhesive film with ultraviolet light when the adhesive film includes an ultraviolet curing resin and heating the adhesive film when the adhesive film includes a thermosetting resin.

[0026] Thus, in the modification process and the etching process, the adhesive force of the adhesive film can be maintained at a relatively strong state, so that the glass plate can be reliably strengthened by the adhesive film. On the other hand, in the peeling process, the adhesive force of the adhesive film can be set to a relatively weak state, so that the adhesive film can be easily peeled off from the glass plate.

[0027] (8) In the configuration of (7) above, preferably, the adhesive film has an adhesive strength of 0.5 N / 20 mm or more before the adhesive strength weakening step and an adhesive strength of 0.05 N / 20 mm or less after the adhesive strength weakening step.

[0028] Thus, in the reforming step and the etching step, the adhesive strength of the adhesive film can be set to a moderately strong state that does not cause peeling. On the other hand, in the peeling step, the adhesive strength of the adhesive film can be set to a moderately weak state that easily causes peeling.

[0029] (9) In any one of the above structures (1) to (8), the adhesive film is preferably larger than the glass plate.

[0030] Thus, in the attaching step, it is easy to attach the adhesive film to the glass plate. In addition, in the reforming step and the etching step, the extended portion of the adhesive film extending from the glass plate can be supported, so the handling property of the glass plate becomes better.

[0031] (10) The present invention is a glass plate comprising a first main surface, a second main surface, and an end surface sandwiched between the first main surface and the second main surface, wherein the first main surface and the end surface are etched surfaces, the second main surface is a forged surface, and the thickness between the first main surface and the second main surface is greater than 1 μm and less than 100 μm.

[0032] Thus, the first main surface, the second main surface and the end surface become smooth surfaces with good surface properties. In addition, the first main surface, the second main surface and the end surface become a state with fewer defects such as cracks. As a result, even a thin glass plate can achieve high strength. In particular, the second main surface is a forged surface, so it is possible to achieve high smoothness while minimizing defects.

[0033] (11) In the above-described structure (10), preferably, the surface roughness Ra of the second main surface is 0.2 nm or less.

[0034] In this way, the second main surface becomes a very smooth surface.

[0035] (12) In the configuration of (10) or (11) above, the glass plate may be a sensor cover glass or a hollow optical fiber cover glass.

[0036] Since the surface properties are good, scattering of light can be suppressed, and thus, the glass can be suitably used as a cover glass for a sensor or a cover glass for a hollow optical fiber.

[0037] Effects of the Invention

[0038] According to the present invention, even when the glass plate is thin, it is possible to simply and reliably process the glass plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a flow chart of processing steps included in a method for manufacturing a glass plate.

[0040] Figure 2 It is a top view showing the attaching process.

[0041] Figure 3 yes Figure 2 A-A section view.

[0042] Figure 4 It is a top view showing the reforming step.

[0043] Figure 5 yes Figure 4 B-B section view.

[0044] Figure 6 It is a cross-sectional view showing the etching process.

[0045] Figure 7 It is a top view showing the etching process.

[0046] Figure 8 yes Figure 7 C-C section view.

[0047] Fig. 9 It is a cross-sectional view showing the adhesive force weakening process.

[0048] Fig.10 It is a cross-sectional view showing a modification of the adhesive force weakening step.

[0049] Fig.11 It is a cross-sectional view showing the peeling process.

[0050] Fig.12 is a top view showing a processed glass plate.

[0051] Fig.13 yes Fig.12 D-D section view. DETAILED DESCRIPTION

[0052] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0053] like Figure 1 As shown in FIG. 1 , the manufacturing method of the glass plate of the present embodiment includes a processing step S of cutting a circular glass plate from a rectangular glass plate (the original glass plate before processing). The processing step S includes an attaching step S1, a reforming step S2, an etching step S3, an adhesion weakening step S4, and a peeling step S5 in sequence. It should be noted that the present manufacturing method may also include a forming step of forming the glass plate (the original glass plate before processing) before the processing step S. In addition, the present manufacturing method may also include a cleaning step of cleaning the processed glass plate after the processing step S, an inspection step of inspecting the processed glass plate, and the like.

[0054] (Attachment process)

[0055] like Figure 2 as well as Figure 3 As shown, in the attaching step S1 , a laminate 1 is formed. The laminate 1 is formed by attaching an adhesive film 3 to a glass plate 2 .

[0056] The glass plate 2 includes a first main surface 2a, a second main surface 2b, and an end surface 2c sandwiched between the first main surface 2a and the second main surface 2b. The glass plate 2 is formed by a known forming method such as an overflow down-draw method, a slit down-draw method, a float method, etc. In the present embodiment, the glass plate 2 is formed by an overflow down-draw method. If the glass plate 2 is formed by an overflow down-draw method, the first main surface 2a and the second main surface 2b become forged surfaces. Here, the forged surface means an unpolished surface that solidifies without contacting other components such as rollers after the glass is melted. If it is a forged surface, it becomes a smooth surface with very few defects (such as microcracks) that are the cause of breakage. The surface roughness Ra of the forged surface is, for example, less than 0.2nm. Here, the surface roughness Ra means a value measured using a method based on JIS B0601:2001.

[0057] The upper limit of the thickness of the glass plate 2 is preferably 10 μm, more preferably 50 μm, and the lower limit is preferably 1 μm, more preferably 10 μm. That is, the glass plate 2 is preferably a very thin glass film. It should be noted that a glass plate 2 having a thickness exceeding 100 μm can be processed even without attaching the adhesive film 3.

[0058] The adhesive film 3 is attached only to the second main surface 2b of the glass plate 2. The adhesive film 3 includes a substrate 4 and an adhesive layer 5 formed on one side (the side on the second main surface 2b of the glass plate 2) of the substrate 4. The adhesive layer 5 is arranged between the glass plate 2 and the substrate 4 in the state of the laminate 1. Thus, the glass plate 2 is fixed to the substrate 4 via the adhesive layer 5.

[0059] As the substrate 4, for example, a polyolefin resin (polyethylene, polypropylene, etc.) can be used. If a substrate 4 made of such a material is used, the substrate 4 is likely to have chemical resistance (resistance to an etching solution 12 (such as HF) described later) and flexibility. It should be noted that the material of the substrate 4 is not particularly limited as long as it has chemical resistance.

[0060] As the adhesive layer 5, for example, acrylic resin or polyethylene resin can be used. If the adhesive layer 5 is made of such a material, the adhesive layer 5 is likely to have chemical resistance (resistance to the etching solution 12 (such as HF) described later). It should be noted that the material of the adhesive layer 5 is not particularly limited as long as it has chemical resistance.

[0061] The adhesive layer 5 is preferably a functional material whose adhesive force changes during fixing (modification step S2 and etching step S3) and during peeling (peeling step S5) through a prescribed treatment. As a functional material capable of changing the adhesive force, for example, ultraviolet curing resins cured by ultraviolet irradiation, thermosetting resins cured by heating, etc. can be cited. It should be noted that the adhesive film 3 can also be a self-adhesive film that can be peeled off without applying a prescribed treatment. In this case, the adhesive force during fixing and during peeling is substantially the same.

[0062] The adhesive force during fixing is preferably stronger than the adhesive force during peeling. The adhesive force during fixing is preferably 0.1N / 20mm or more, more preferably 0.3N / 20mm or more, and further preferably 0.5N / 20mm or more. The adhesive force during peeling is preferably 0.1N / 20mm or less, more preferably 0.07N / 20mm or less, and further preferably 0.05N / 20mm or less. Here, the adhesive force means a value measured by a method based on JIS Z 0237:2022.

[0063] The thickness of the adhesive film 3 (the total thickness of the adhesive film 3 and the adhesive layer 5 ) is preferably 50 μm or more and 200 μm or less. In this way, the adhesive film 3 tends to have appropriate rigidity and flexibility.

[0064] The adhesive film 3 is preferably larger than the glass plate 2 in a plan view (when viewed along the thickness direction). In the present embodiment, the adhesive film 3 extends outward from each end face 2c of the glass plate 2. That is, the adhesive film 3 includes a rectangular overlapping portion 3a overlapping the glass plate 2 and a rectangular frame-shaped extension portion 3b extending from the rectangular glass plate 2. In this way, the glass plate 2 can be handled while the extension portion 3b is maintained, so the workability in the processing step S becomes better. In addition, the glass plate 2 is strengthened by the overlapping portion 3a, so that the occurrence of warping in the glass plate 2 in the processing step S (especially the reforming step S2) can also be reliably suppressed. Therefore, even if the glass plate 2 is thin, the glass plate 2 can be simply and reliably processed.

[0065] (Reforming process)

[0066] like Figure 4 as well as Figure 5 As shown, the modification step S2 is performed in a state of a laminate 1 including a glass plate 2 and an adhesive film 3. In the modification step S2, a modified portion 8 is formed in the processing portion 7 of the glass plate 2 included in the laminate 1 by irradiating a laser L from a laser device 6. The modified portion 8 has the property of being easily etched, and the etching rate is higher than that of the unmodified portion. In the present embodiment, the processing portion 7 is a circumferential linear area in order to cut out (carve out) a circular glass plate. Therefore, the laser L is scanned in a circular shape along the processing portion 7. As a result, the modified portion 8 is formed intermittently or continuously along the circumferential area when viewed from above. In addition, the modified portion 8 is formed intermittently or continuously along the thickness direction when viewed from the side (when viewed in a direction orthogonal to the thickness direction). From the viewpoint of improving the processing accuracy, the modified portion 8 is preferably formed continuously in the circumferential direction and / or the thickness direction. The formation method of the modified portion 8 (for example, the continuity or discontinuity of the modified portion 8) can be adjusted according to the focal position of the laser L, the spot diameter [mm], the spot interval [mm], the pulse width [s], the repetition frequency [Hz], the pulse energy [J], the peak output [W], etc.

[0067] The type and irradiation conditions of the laser light L are not particularly limited as long as the modified portion 8 can be formed in the planned processing portion 7. In the present embodiment, the laser light L is an ultrashort pulse laser light having a pulse width of picoseconds to femtoseconds.

[0068] In the present embodiment, in the modification step S2, the laser L is irradiated onto the glass plate 2 included in the stack 1 while the stack 1 is adsorbed by the adsorption table 9 having a plurality of suction holes 9a. In detail, in order to prevent the stack 1 (especially the glass plate 2) from deforming in accordance with the suction holes 9a, a glass support 10 is arranged between the stack 1 and the adsorption table 9. The support 10 is preferably larger than the adhesive film 3 when viewed from above. In this state, the glass plate 2 is fixed to the adhesive film 3. By applying alcohol to the surface of the support 10, the adhesive film 3 is closely attached to the surface of the support 10. It should be noted that the support 10 is not limited to a glass plate as long as it can prevent deformation of the stack 1 during adsorption, and any member such as a metal plate can be used. In addition, if deformation of the glass plate 2 included in the stack 1 does not occur during adsorption, the support 10 may not be provided.

[0069] (Etching process)

[0070] like Figure 6 As shown, the etching process S3 is performed in a state of a stacked body 1 including a glass plate 2 and an adhesive film 3. In the etching process S3, the stacked body 1 is immersed in an etching solution 12 stored in an etching tank 11 to etch the modified portion 8 of the glass plate 2. In this case, the modified portion 8 is preferentially etched, but the first main surface 2a and the end surface 2c to which the adhesive film 3 is not attached are also etched at a lower etching rate than the modified portion 8. That is, by etching, the modified portion 8 is removed, and the surface layer of the first main surface 2a and the end surface 2c is also slightly removed. Therefore, before and after etching, the thickness of the glass plate 2 is reduced by several % to 10%. Specifically, for example, in the case of a glass plate 2 having a thickness of 50 μm before etching, the thickness after etching becomes about 45 μm.

[0071] As the etching solution 12, an HF-based etching solution or an alkali-based etching solution can be used. As the HF-based etching solution, for example, a single acid composed of HF or a mixed acid of at least one acid selected from HCl, HNO3, and H2SO4 and HF can be used. As the alkali-based etching solution, for example, a NaOH aqueous solution, a KOH aqueous solution, etc. can be used.

[0072] The etching of the modified portion 8 of the glass plate 2 is performed from the first main surface 2a side to which the adhesive film 3 is not attached. Therefore, the etching removal amount on the first main surface 2a side of the modified portion 8 tends to be greater than the etching removal amount on the second main surface 2b side. Figure 7 as well as Figure 8As shown, when the modified portion 8 is removed by etching, the processed end surface 13c of the inner circular glass plate 13 becomes an inclined surface in which the first principal surface 13a side is located more inner than the second principal surface 13b side at the position corresponding to the modified portion 8. Similarly, the processed end surface 14c of the outer glass plate 14 (the portion other than the inner circular glass plate 13) becomes an inclined surface in which the first principal surface 14a side is located more outer than the second principal surface 14b side at the position corresponding to the modified portion 8. The inclination angle θ of the processed end surfaces 13c and 14c is, for example, 75 to 89°. It should be noted that the inclination angle θ can also be close to 90° by adjusting the etching method in the etching step S3.

[0073] (Adhesion weakening process)

[0074] The adhesion weakening step S4 is performed on the laminate 1 including the glass sheets 2 and the adhesive film 3. In the adhesion weakening step S4, a predetermined process is performed to weaken the adhesion between the glass sheets 2 (the inner glass sheets 13 and the outer glass sheets 14) from which the modified portions 8 have been removed and the adhesive film 3.

[0075] In the case of ultraviolet curing resins and heat curing resins, the adhesive force decreases as the resin is cured. Fig. 9 As shown, when the adhesive layer 5 of the adhesive film 3 is an ultraviolet curing resin, in the adhesive force weakening step S4, ultraviolet rays U are irradiated from the ultraviolet irradiation device 15 to the adhesive layer 5 in the state of the laminate 1 to cure the adhesive layer 5. Fig.10 As shown, when the adhesive layer 5 of the adhesive film 3 is a thermosetting resin, in the adhesive weakening step S4, the adhesive layer 5 is heated by the heater 16 in the state of the laminate 1 to cure the adhesive layer 5. It should be noted that when the adhesive film 3 is a self-adhesive film, the adhesive weakening step S4 may not be provided.

[0076] (Peeling process)

[0077] like Fig.11 As shown, in the peeling step S5, the adhesive film 3 with weakened adhesive force is bent and peeled off from the glass plate 2. Thus, the circular glass plate 13 can be extracted from the rectangular glass plate 2. At this time, if the extended portion 3b of the adhesive film 3 is grasped and peeled off, the peeling operation can be smoothly performed while preventing the glass plate 2 from being damaged.

[0078] (glass plate)

[0079] like Fig.12 as well as Fig.13 As shown in FIG. 1 , the glass plate (inner glass plate) 13 obtained through the processing step S as described above has a circular shape in a plan view.

[0080] The first main surface 13a and the end surface 13c of the glass plate 13 are etched surfaces obtained in the etching step S3. The end surface 13c is, for example, an inclined surface in which the first main surface 13a side is located inside the second main surface 13b side (see Figure 8 end surface 13c).

[0081] The second main surface 13b of the glass plate 13 is not etched in the etching step S3 and maintains the original surface properties. That is, in this embodiment, the second main surface 13b is a forged surface obtained by the overflow down-draw method. The surface roughness Ra of the second main surface 13b is 0.2 nm or less.

[0082] The thickness of the glass plate 13 is not less than 1 μm and not more than 100 μm.

[0083] The glass plate 13 can be suitably used as, for example, a cover glass for a sensor or a cover glass for a hollow optical fiber.

[0084] It should be noted that the present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects. The present invention can be modified in various ways without departing from the gist of the present invention.

[0085] In the above-mentioned embodiment, the case where a circular glass plate is cut out from a rectangular original glass plate in the processing step is exemplified, but the shape of the original glass plate and / or the shape of the cut glass plate are not limited thereto. For example, the shape of the cut glass plate can be any shape such as an elliptical shape, a rectangular shape, a polygonal shape, a cross shape, etc. In particular, when the contour shape of the cut glass plate has a curved or concave curved portion, the manufacturing method of the present invention is useful.

[0086] In the above-mentioned embodiment, a case where a circular glass plate is cut out from a rectangular glass plate in a processing step is exemplified, but the processing type is not limited thereto. For example, a through hole may be formed in the glass plate in the processing step. In this case, a modified portion is formed in the processing predetermined portion of the through hole by laser. A plurality of through holes may be provided in one glass plate.

[0087] In the above-mentioned embodiment, the case where the glass plate is immersed in the etching liquid and etched in the etching step is exemplified, but the present invention is not limited thereto. For example, the etching liquid may be applied or sprayed on the first main surface of the glass plate and etched.

[0088] Example

[0089] Hereinafter, the present invention will be described in detail based on Examples, but the present invention is not limited to these Examples.

[0090] The rigidity of the adhesive film, the peelability (peeling ease) of the glass plate, chemical resistance, handling properties, and warping during processing were evaluated according to the type of adhesive film. The results are shown in Table 1. It should be noted that in the table, "○" indicates a result that is superior to "△".

[0091] [Table 1]

[0092]

[0093] According to Table 1, by attaching adhesive films such as Sample Nos. 1, 2, 3, and 4 to a glass plate to form a laminate, the handling properties during processing are improved and warping during processing can be suppressed.

[0094] According to Table 1, it is preferred that the substrate is a polyolefin-based substrate, and the adhesive layer is an acrylic or polyethylene-based adhesive layer, as in Samples No. 1, 3, and 4. In this case, moderate rigidity is imparted to the laminate including the glass plate and the adhesive film in the modification process and the etching process, and the adhesive film is easily bent and peeled off from the glass plate in the peeling process. It should be noted that, as in Sample No. 2, when the substrate is a polyester-based substrate, there is a tendency that the rigidity of the adhesive film becomes too high, and it is difficult to bend the adhesive film and peel it off from the glass plate in the peeling process.

[0095] According to Table 1, it is preferred that the total thickness of the adhesive film is 50 μm or more and 200 μm or less, as in Samples No. 2, 3, and 4. In this case, appropriate rigidity is imparted to the laminate including the glass plate and the adhesive film in the reforming process and the etching process, and the adhesive film is easily bent and peeled off from the glass plate in the peeling process. It should be noted that, in the case where the total thickness of the adhesive film is less than 50 μm, as in Sample No. 1, there is a tendency that the rigidity of the adhesive film becomes too low, and it is difficult to impart appropriate rigidity to the laminate including the glass plate and the adhesive film in the reforming process and the etching process.

[0096] According to Table 1, it is preferred that the adhesive force of the adhesive film before the treatment of weakening the adhesive force is more than 0.5N / 20mm, and the adhesive force of the adhesive film after the treatment of weakening the adhesive force is less than 0.05N / 20mm. That is, if the adhesive force before the treatment of weakening the adhesive force is more than 0.5N / 20mm, the glass plate can be reliably fixed relative to the adhesive film in the reforming process and the etching process. Therefore, for example, it is possible to reliably suppress the etching liquid from invading between the glass plate and the adhesive film in the etching process. On the other hand, if the adhesive force of the adhesive film after the treatment of weakening the adhesive force is more than 0.5N / 20mm, it is easy to peel off the adhesive film from the glass plate in the peeling process. It should be noted that in the case where the adhesive film is a self-adhesive film as in sample No.1, the adhesive force is very weak, and it is possible that the etching liquid intrudes between the glass plate and the adhesive film in the etching process.

[0097] Description of Reference Numerals

[0098] 1 Laminated body

[0099] 2 Glass Panes

[0100] 2a First main surface

[0101] 2b Second main surface

[0102] 2c End face

[0103] 3 Adhesive film

[0104] 3a Overlapping part

[0105] 3b Extension

[0106] 4 Substrate

[0107] 5 Adhesive layer

[0108] 6 Laser device

[0109] 7 Processing reservation department

[0110] 8. Reforming Department

[0111] 9 Adsorption table

[0112] 9a Suction hole

[0113] 10 Support

[0114] 11 Etching tank

[0115] 12 Etching solution

[0116] 13 Inner glass panel

[0117] 13a First main surface

[0118] 13b Second main surface

[0119] 13c Machining end face

[0120] 14 Outer glass panel

[0121] 14a First main surface

[0122] 14b Second main surface

[0123] 14c Processing end face

[0124] 15. Ultraviolet irradiation device

[0125] 16 Heater

[0126] L Laser

[0127] U Ultraviolet

[0128] S Processing

[0129] S1 Attachment Process

[0130] S2 Reforming process

[0131] S3 Etching Process

[0132] S4 Adhesion Weakening Process

[0133] S5 peeling process.

Claims

1. A method for manufacturing a glass plate, comprising a processing step of processing the glass plate, The method for manufacturing the glass plate is characterized in that: The processing steps include: a laminating step of laminating an adhesive film on one main surface of the glass plate to form a laminate; a modification step of irradiating a laser beam to a portion to be processed of the glass plate in a state of the laminate after the attaching step, thereby forming a modified portion on the portion to be processed; an etching step of etching the modified portion of the glass plate in the state of the laminate after the modifying step; as well as A peeling step of peeling the adhesive film from the glass plate after the etching step.

2. The method for manufacturing a glass plate according to claim 1, wherein: The thickness of the glass plate in the attaching step is greater than or equal to 1 μm and less than or equal to 100 μm.

3. The method for producing a glass plate according to claim 1 or 2, wherein: The laser is an ultrashort pulse laser.

4. The method for producing a glass plate according to claim 1 or 2, wherein: In the etching step, the laminated body is immersed in an etching solution.

5. The method for producing a glass plate according to claim 1 or 2, wherein: The adhesive film includes a polyolefin-based substrate and an acrylic or polyethylene-based adhesive layer formed on one surface of the substrate.

6. The method for manufacturing a glass plate according to claim 1 or 2, wherein: The adhesive film has a thickness of 50 μm or more and 200 μm or less.

7. The method for producing a glass plate according to claim 1 or 2, wherein: The method for manufacturing a glass plate includes an adhesive force weakening step of weakening the adhesive force of the adhesive film after the etching step and before the peeling step.

8. The method for manufacturing a glass plate according to claim 7, wherein: The adhesive film has an adhesive strength of 0.5 N / 20 mm or more before the adhesive strength weakening step, and an adhesive strength of 0.05 N / 20 mm or less after the adhesive strength weakening step.

9. The method for manufacturing a glass plate according to claim 1 or 2, wherein: The adhesive film is larger than the glass plate.

10. A glass plate comprising a first main surface, a second main surface, and an end surface interposed between the first main surface and the second main surface, The glass sheet is characterized in that The first main surface and the end surface are etched surfaces, The second main surface is a forging surface, The thickness between the first main surface and the second main surface is greater than or equal to 1 μm and less than or equal to 100 μm.

11. The glass sheet according to claim 10, wherein The surface roughness Ra of the second main surface is 0.2 nm or less.

12. The glass sheet according to claim 10 or 11, wherein: The glass plate is a cover glass for a sensor or a cover glass for a hollow optical fiber.

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