Lead welding control method for chip packaging, production line and storage medium

Abstract

The invention discloses a lead welding control method for chip packaging, a production line and a storage medium, and the method comprises the steps: receiving a processing plate, and placing the processing plate on a welding station; the vision module is controlled to conduct image recognition processing on the front preset number of workpieces on the machining plate, and position information of the front preset number of workpieces on the machining plate and welding parameters of the welding module are obtained; according to the position information and the welding parameters, a welding module is controlled to conduct lead welding on the front preset number of workpieces on the machining plate; after lead welding of the workpieces of the preset number is completed, the visual module is controlled again to conduct image detection processing on the machining plate, and welding parameters are updated; determining the position information of other workpieces according to the position information of the workpieces with the preset number; and according to the position information of the other workpieces and the updated welding parameters, the welding module is controlled to conduct lead welding on the remaining workpieces on the machining plate. According to the invention, welding defects can be reduced, and the welding accuracy of the semiconductor chip lead is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a lead welding control method, a production line and a storage medium for chip packaging. Background Art

[0002] In the current chip packaging industry, wire welding is a key step in connecting the chip to the external circuit, and its quality directly affects the performance and reliability of the entire electronic product. When performing wire welding, the traditional chip packaging production line often relies on preset welding parameters to uniformly process the entire batch of workpieces. However, this "one-size-fits-all" welding method ignores the slight differences that may exist between workpieces, such as slight deformation of the lead frame, slight offset of the grain position, or slight changes in material properties. With the continuous improvement of chip integration and the continuous reduction of package size, the requirements for the accuracy and consistency of wire welding are becoming more and more stringent. The traditional wire welding method with fixed welding parameters may be difficult to adapt to the slight differences between workpieces, resulting in unstable welding quality and low accuracy. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip package lead welding control method, which can reduce welding defects and improve the accuracy of semiconductor chip lead welding.

[0004] In a first aspect, the present application provides a lead welding control method for chip packaging, which is applied to a chip packaging production line, wherein the production line includes a lead welding device, and the lead welding device includes a welding station, a vision module, and a welding module; the lead welding control method includes:

[0005] Receiving a processing plate and placing the processing plate on the welding station; wherein the processing plate is provided with a plurality of workpieces, the workpieces comprising a lead frame and a die attached to the lead frame;

[0006] Controlling the visual module to perform image recognition processing on the first preset number of workpieces on the processing plate to obtain position information of the first preset number of workpieces on the processing plate and welding parameters of the welding module;

[0007] According to the position information and the welding parameters, controlling the welding module to perform wire welding on a preset number of workpieces on the processing plate;

[0008] After the preset number of workpieces have completed lead welding, the visual module is controlled again to perform image detection processing on the processing plate, and the welding parameters of the welding module are updated;

[0009] Determine the position information of other workpieces on the processing plate according to the position information of a preset number of workpieces on the processing plate;

[0010] According to the position information of the other workpieces and the updated welding parameters, the welding module is controlled to perform wire welding on the remaining workpieces of the processing plate.

[0011] According to the lead welding control method of chip packaging in the first aspect of the embodiment of the present application, there are at least the following beneficial effects: the processing board to be packaged is received and accurately placed on the welding station, and a plurality of workpieces are provided on the processing board, each workpiece includes a lead frame and a grain attached to the frame. Subsequently, the visual module is controlled to perform image recognition processing on the previously preset number of workpieces on the processing board, and preliminarily determines the welding parameters applicable to the previously preset number of workpieces during processing. After the welding parameters are preliminarily determined, the welding module is controlled to perform lead welding on the previously preset number of workpieces according to the position information provided by the visual module and the preliminarily determined welding parameters. After the previously preset number of workpieces are welded, the visual module is controlled again to perform image detection processing on the welding area for evaluating the welding quality, thereby updating the welding parameters of the welding module according to the evaluation results. This step allows the system to dynamically adjust the parameters according to the actual welding effect to adapt to the slight differences between the workpieces. The position information of the previously preset number of workpieces is used to determine the position information of the other workpieces on the processing board, and then the welding module is controlled to perform wire welding on the remaining workpieces on the processing board according to the updated welding parameters and the position information of the remaining workpieces. Since the welding parameters have been optimized according to the previous welding results, the welding quality of the subsequent workpieces can be improved. In the wire welding control method provided in the present application, the welding parameters can be adjusted according to the previously welded workpieces to effectively reduce welding defects. By adapting to the slight differences between the workpieces, it is ensured that each workpiece can obtain the best welding effect, thereby improving the overall packaging yield, while also reducing rework and defective product rates, and improving the accuracy of semiconductor chip wire welding.

[0012] According to some embodiments of the first aspect of the present application, controlling the visual module to perform image recognition processing on a preset number of workpieces on the processing plate to obtain position information of the preset number of workpieces on the processing plate and welding parameters of the welding module includes:

[0013] Controlling the visual module to collect images of a preset number of workpieces in front of the processing plate to obtain first image information;

[0014] Determine the position information of the workpiece according to the first image information; wherein the position information includes the center coordinates of the workpiece, the contact coordinates of each contact in the grain, and the pin coordinates of each inner pin in the lead frame;

[0015] The welding parameters of the welding module for the workpiece are determined according to the position information, the corresponding relationship between the contact points of the grain and the inner pins of the lead frame.

[0016] According to some embodiments of the first aspect of the present application, the step of controlling the visual module again to perform image detection processing on the processed plate and updating the welding parameters of the welding module includes:

[0017] Controlling the visual module to collect images of the processing board to obtain second image information;

[0018] According to the second image information, a first solder joint state at a contact point of a grain, a second solder joint state at an inner lead of a lead frame, and a lead state of solder of the workpiece after welding are obtained;

[0019] Inputting the first solder joint state, the second solder joint state and the lead wire state into a preset quality assessment model to obtain a welding quality assessment value;

[0020] The welding parameters of the welding module are updated according to the welding quality evaluation value.

[0021] According to some embodiments of the first aspect of the present application, the first distances between the adjacent workpieces on the processing plate in the horizontal direction are equal, and the second distances between the adjacent workpieces in the vertical direction are equal;

[0022] Determining the position information of other workpieces on the processing board according to the position information of a preset number of workpieces on the processing board also includes:

[0023] Determine the center coordinates of the processing plate and the other workpieces according to the center coordinates of the welded workpiece, the first distance and the second distance;

[0024] Determine the coordinates of the joints of the processing plate and the other workpieces according to the coordinates of the joints of the welded workpieces, the first distance, and the second distance;

[0025] The pin coordinates of the processing plate and the other workpieces are determined according to the pin coordinates of the workpiece that has been welded, the first distance, and the second distance.

[0026] According to some embodiments of the first aspect of the present application, after the step of determining the position information of other workpieces on the processing board according to the position information of the first preset number of workpieces on the processing board, the step further includes:

[0027] According to the position information of the other workpieces to be welded, control the visual module to traverse and scan the other workpieces on the processing plate to obtain third image information corresponding to each workpiece;

[0028] Performing integrity detection on each of the workpieces to be welded according to the third image information;

[0029] Wherein, the integrity detection includes:

[0030] When there are grains on the lead frame on the workpiece, marking the corresponding workpiece as a first category;

[0031] When there is no die on the lead frame on the workpiece, the corresponding workpiece is marked as a second category.

[0032] According to some embodiments of the first aspect of the present application, the welding module includes a ceramic splitting knife and a wire feeding module, a channel for the welding wire to pass through is provided in the middle of the ceramic splitting knife, and the wire feeding module is used to provide the welding wire to the ceramic splitting knife;

[0033] The controlling the welding module to perform wire welding on the remaining workpieces of the processing plate comprises:

[0034] When the workpiece is of the first category, controlling the wire feed module to provide welding wire into the ceramic splitting knife, and controlling the ceramic splitting knife to move back and forth between the contact point of the grain and the inner pin of the lead frame according to the welding parameters;

[0035] When the workpiece is of the second category, the wire feed module is controlled to stop providing welding wire into the ceramic splitting knife, and the ceramic splitting knife is controlled to move back and forth according to the welding parameters.

[0036] According to some embodiments of the first aspect of the present application, the welding module includes a ceramic splitting knife, a wire feeding module and an air blowing module, a channel for the welding wire to pass through is provided in the middle of the ceramic splitting knife, and the wire feeding module is used to provide the welding wire to the ceramic splitting knife;

[0037] The lead welding comprises:

[0038] Controlling the wire feeding module to feed the welding wire into the ceramic splitter, and controlling the ceramic splitter to heat and melt the exposed welding wire until the exposed portion of the welding wire forms a welding ball;

[0039] Controlling the ceramic splitting knife to move to the contact position of the grain, and welding the solder ball to the contact position of the grain;

[0040] Controlling the ceramic splitting knife to move upward a first distance, move in a direction away from the inner pin corresponding to the lead frame by a second distance, then move upward a third distance, and finally move in the direction of the inner pin corresponding to the lead frame;

[0041] Controlling the ceramic splitting knife to press weld the welding wire to the inner pin corresponding to the lead frame;

[0042] The blowing module is controlled to continuously blow out the anti-oxidation mixed gas toward the ceramic splitting knife.

[0043] According to some embodiments of the first aspect of the present application, the production line further includes a lead wire detection device, and the lead wire detection device includes a positioning fixture, a wire hooking module, and a sensing module;

[0044] After the step of controlling the welding module to perform wire welding on the remaining workpieces of the processing plate according to the position information of the other workpieces and the updated welding parameters, the method further includes:

[0045] Transferring the processed plate from the welding station to the positioning fixture;

[0046] Controlling the wire hooking module to hook and pull the wires in a preset number of the workpieces, and using the sensing module to sense the pulling force value applied by the wire hooking module to the wires;

[0047] When the pulling force value is greater than or equal to a preset tolerance threshold, it is determined that the workpiece lead welding on the corresponding processing plate is good;

[0048] When the pulling force value is less than the tolerance threshold, a new workpiece to be detected is re-determined, and the hooking module and the sensing module are controlled to detect the new workpiece to be detected;

[0049] When the maximum force values ​​corresponding to all new workpieces to be tested are greater than or equal to the preset bearing threshold, it is determined that the workpiece leads on the corresponding processing board are well welded; conversely, when the maximum force value corresponding to one of the new workpieces to be tested is less than the bearing threshold, the quality of the corresponding processing board is marked as pending.

[0050] In a second aspect, the present application also provides a chip packaging production line, comprising: at least one memory; at least one processor; at least one program; the program is stored in the memory, and the processor executes at least one program to implement the chip packaging lead welding control method as described in any embodiment of the first aspect.

[0051] In a third aspect, the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the lead welding control method of the chip package as described in any embodiment of the first aspect.

[0052] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0054] Figure 1 A flow chart of a lead welding control method for chip packaging provided in the present application;

[0055] Figure 2 For this application Figure 1 Flow chart of step S120;

[0056] Figure 3 For this application Figure 1 Flow chart of step S130;

[0057] Figure 4 For this application Figure 1 Flow chart of step S150;

[0058] Figure 5 For this application Figure 1 The flowchart after step S150;

[0059] Figure 6 For this application Figure 1 Flow chart of step S160;

[0060] Figure 7 For this application Figure 1 A flowchart of the lead welding steps;

[0061] Figure 8 For this application Figure 1 The flowchart after step S160;

[0062] Fig. 9 It is a structural schematic diagram of a wire welding device provided in one embodiment of the present application;

[0063] Fig.10 This is a schematic diagram of a die and a lead frame after lead welding is completed in one embodiment of the present application;

[0064] Fig.11This is a schematic diagram of the process of completing wire bonding between a die and a lead frame according to another embodiment of the present application.

[0065] The figures are as follows:

[0066] Welding station 110; vision module 120; welding module 130; welding wire 131; processing board 210; lead frame 220; inner pin 221; grain 230; contact 231. DETAILED DESCRIPTION

[0067] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0068] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0069] In the description of this application, if there is a description of first or second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0070] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0071] In the current chip packaging industry, wire welding is a key step in connecting the chip to the external circuit, and its quality directly affects the performance and reliability of the entire electronic product. When performing wire welding, the traditional chip packaging production line often relies on preset welding parameters to uniformly process the entire batch of workpieces. However, this "one-size-fits-all" welding method ignores the slight differences that may exist between workpieces, such as slight deformation of the lead frame, slight offset of the grain position, or slight changes in material properties. With the continuous improvement of chip integration and the continuous reduction of package size, the requirements for the accuracy and consistency of wire welding are becoming more and more stringent. The traditional wire welding method with fixed welding parameters may be difficult to adapt to the slight differences between workpieces, resulting in unstable welding quality and low accuracy.

[0072] Based on this, the present application provides a chip packaging lead welding control method, production line and storage medium to solve the above-mentioned technical problems. The technical solutions provided by the present application are described in detail one by one below.

[0073] First, refer to Figure 1 The present application provides a chip package lead welding control method, the lead welding control method is applied to a chip package production line, the production line includes a lead welding device, referring to Fig. 9 The wire welding equipment includes a welding station, a vision module, and a welding module; the wire welding control method may include but is not limited to the following steps:

[0074] Step S110: receiving a processing plate and placing the processing plate on a welding station; wherein a plurality of workpieces are arranged on the processing plate, and the workpieces include a lead frame and a die attached to the lead frame;

[0075] Step S120: Control the visual module to perform image recognition processing on the first preset number of workpieces on the processing plate to obtain position information of the first preset number of workpieces on the processing plate and welding parameters of the welding module;

[0076] Step S130: controlling the welding module to perform wire welding on a preset number of workpieces on the processing plate according to the position information and welding parameters;

[0077] Step S140: After the preset number of workpieces have completed lead welding, the visual module is controlled again to perform image detection processing on the processed board and the welding parameters of the welding module are updated;

[0078] Step S150: determining the position information of other workpieces on the processing plate according to the position information of the first preset number of workpieces on the processing plate;

[0079] Step S160: According to the position information of other workpieces and the updated welding parameters, the welding module is controlled to perform wire welding on the remaining workpieces of the processing plate.

[0080] In step S110, the processing board can be obtained by the following steps: select a suitable substrate material as the processing board, clean, dry and pre-treat the substrate to ensure that the surface is clean and free of oil and oxide. Then, the substrate is stamped, etched or electroplated to form a plurality of lead frames, and the lead frames are provided with a plurality of pins for connecting to the electrodes of the crystal grains and extending outward to connect to the external circuit. Then, the cut crystal grains are bonded to the designated positions of the lead frame by adhesive to form the processing board in step S110.

[0081] In step S120, the welding parameters of the welding module may specifically include the moving path of the welding module, welding temperature, welding time, welding pressure, welding current and voltage, gas environment, etc., which are not specifically limited in the present application.

[0082] In step S110 to step S160, the processing board to be packaged is received and accurately placed on the welding station. A plurality of workpieces are arranged on the processing board, and each workpiece includes a lead frame and a grain attached to the frame. Subsequently, the visual module is controlled to perform image recognition processing on the previously preset number of workpieces on the processing board, and preliminarily determine the welding parameters applicable to the previously preset number of workpieces during processing. For example, image recognition processing can be performed on the first five workpieces on the processing board, and lead welding is preferentially performed on these five workpieces. After the welding parameters are preliminarily determined, the welding module is controlled to perform lead welding on the previously preset number of workpieces according to the position information provided by the visual module and the preliminarily determined welding parameters. After the previously preset number of workpieces are welded, the visual module is controlled again to perform image detection processing on the welding area for evaluating the welding quality, so as to update the welding parameters of the welding module according to the evaluation results. This step allows the system to dynamically adjust the parameters according to the actual welding effect to adapt to the slight differences between the workpieces. The position information of the previously preset number of workpieces is used to determine the position information of other workpieces on the processing board, and then the welding module is controlled to perform wire welding on the remaining workpieces on the processing board according to the updated welding parameters and the position information of the remaining workpieces. Since the welding parameters have been optimized according to the previous welding results, the welding quality of subsequent workpieces can be improved. In the wire welding control method provided in the present application, the welding parameters can be adjusted according to the previously welded workpieces to effectively reduce welding defects. By adapting to the slight differences between the workpieces, it is ensured that each workpiece can obtain the best welding effect, thereby improving the overall packaging yield, while also reducing rework and defective product rates, and improving the accuracy of semiconductor chip wire welding.

[0083] Reference Figure 2 It is understandable that step S120 may include but is not limited to the following steps:

[0084] Step S210: Control the visual module to collect images of a preset number of workpieces before the processing plate to obtain first image information;

[0085] Step S220: determining the position information of the workpiece according to the first image information; wherein the position information includes the center coordinates of the workpiece, the contact coordinates of each contact in the die, and the pin coordinates of each inner pin in the lead frame;

[0086] Step S230: determining welding parameters of the welding module for the workpiece according to the position information, the corresponding relationship between the contact points of the die and the inner pins of the lead frame.

[0087] In step S220, according to the first image information, noise removal processing can be performed first to improve the signal-to-noise ratio of the image. In addition, in order to improve the feature representation in the first image information, the image can also be enhanced to improve the clarity and contrast of the image, such as the edge information of the workpiece, the contour information of the lead frame and the grain in the workpiece. The center coordinates, contact coordinates and pin coordinates are specifically identified through the above steps. For a workpiece of regular shape, the center coordinates can be obtained by calculating its geometric center, while for a workpiece of irregular shape, it may be necessary to identify its contour through image processing technology and calculate the approximate center point position based on the contour. The contact point is usually not a strict point, but a contact area with a certain area. The contact point coordinates can be defined as the center point or geometric center of the contact area. There can be multiple contact point coordinates. For example, if the chip is a diode, there may be two corresponding contacts. If the contact point is a metal pad, then the contact point coordinates can be defined as the center position of the pad or the point with the best electrical performance. Similarly, the inner pins of the lead frame are usually also contact areas with a certain area. The pin coordinates can be defined as the center point or geometric center of the contact area. If the chip is a diode, it may also have two inner pins, and the two inner pins correspond to the two contacts one by one. Fig.10 , the chip has 4 internal pins, and there may be 4 corresponding contacts, Fig.10 This is a schematic diagram after the lead welding is completed. There may be two welding lines between some contacts and inner pins, which is not limited in this application.

[0088] In step S230, the system can automatically adjust the welding parameters of the welding module according to the workpiece position information and the correspondence between the die contacts and the inner pins. Since each semiconductor chip die may have multiple contacts, and there are one or more inner pins corresponding to each contact on the lead frame, the welding parameters also include the correspondence between each contact and each inner pin and the welding sequence. In addition, the area of ​​some contact areas may be relatively large, and multiple leads may need to be welded between the contact and the corresponding inner pin, and the number of welded leads, etc., also needs to be included in the welding parameters.

[0089] In step S210 to step S230, the image recognition technology can be used to accurately check and confirm the position of the workpiece before welding. According to the workpiece position information and the correspondence between the grain contact and the inner pin, the system can automatically adjust the welding parameters of the welding module, so that the equipment can adapt to workpieces of different specifications and layouts, improving the versatility and adaptability of the equipment. In addition, the image information and position data collected by the visual module can be recorded and used for subsequent analysis and tracing, providing a reliable basis for the analysis and resolution of product quality issues.

[0090] Reference Figure 3 It is understandable that step S140 may include but is not limited to the following steps:

[0091] Step S310: Control the visual module to collect images of the processed board to obtain second image information;

[0092] Step S320: obtaining the first solder joint state at the contact point of the grain, the second solder joint state at the inner lead of the lead frame, and the lead state of the solder of the welded workpiece according to the second image information;

[0093] Step S330: inputting the first solder joint state, the second solder joint state and the lead state into a preset quality assessment model to obtain a welding quality assessment value;

[0094] Step S340: updating the welding parameters of the welding module according to the welding quality evaluation value.

[0095] In step S310 to step S340, the image of the processed board is collected and processed by the visual module, and the first solder joint state, the second solder joint state and the lead state of the solder at the key parts after the welding is completed can be accurately obtained. Subsequently, the above state information is input into the preset quality assessment model to obtain a quantitative welding quality assessment value, so as to more accurately judge the quality of welding. Based on this assessment result, the system can adjust the welding parameters in time to ensure the quality of subsequent welding operations.

[0096] In the above-mentioned first solder joint state, it can specifically record solder joint morphology, solder joint size, solder joint defects and solder joint color, etc. The solder joint morphology can specifically be the shape of the first solder joint formed at the joint, such as a circle, an ellipse, etc. The solder joint size can be a dimensional parameter such as the diameter and height of the first solder joint, and the solder joint defect can record whether the first solder joint has defects such as cracks, pores, and slag inclusions. The solder joint color can reflect the temperature control and oxidation conditions during the welding process. The information recorded in the second solder joint state is similar to the first solder joint state, and will not be repeated here. In the above-mentioned lead state, it can specifically record lead morphology, lead position and lead defects, etc. The lead morphology can specifically describe the morphological parameters such as the curvature and straightness of the lead. The lead position records the specific position of the lead during the welding process to ensure that it is correctly connected to the die and the lead frame. The lead defect records whether the lead is damaged during the welding process, such as scratches, deformation, etc.

[0097] Specifically, the features of the first solder joint state, the second solder joint state and the lead state can be integrated to form a comprehensive feature vector, which will be used as the input of the quality assessment model. The quality assessment model can obtain a quantitative score representing the welding quality based on the comprehensive feature vector, that is, the welding quality assessment value. If the assessment result shows that the welding quality is poor, parameters such as welding current, welding time, and welding pressure can be adjusted, and the welding operation can be performed again.

[0098] It should be noted that although only one welding parameter adjustment operation is performed in the present application, after the first adjustment, the visual module can be used again for image detection and processing, and the welding quality can be re-evaluated until a satisfactory welding effect is achieved.

[0099] Reference Figure 4 It can be understood that the first distances between adjacent workpieces in the horizontal direction of the processing plate are equal, and the second distances between adjacent workpieces in the vertical direction are equal; in step S150, the following steps may be included but not limited to:

[0100] Step S410: determining the center coordinates of the processing plate and other workpieces according to the center coordinates of the welded workpiece, the first distance and the second distance;

[0101] Step S420: determining the coordinates of the joints of the processing plate and the other workpiece according to the coordinates of the joints of the welded workpieces, the first distance and the second distance;

[0102] Step S430: Determine the pin coordinates of the processing plate and other workpieces according to the pin coordinates of the welded workpiece, the first distance and the second distance.

[0103] In step S410 to step S430, all workpieces are arranged on the processing board at a uniform spacing, making the entire processing process more standardized and normalized. By utilizing this, the position information of all other workpieces on the processing board can be automatically calculated through preset workpiece position information (such as the center coordinates, contact coordinates, and pin coordinates of the welded workpiece) and the fixed first distance and second distance. Through the above steps, the time for measuring and positioning each workpiece can be reduced, and production efficiency can be improved.

[0104] For example, the processing plate is rectangular, with N workpieces in the horizontal direction (X axis) and M workpieces in the vertical direction (Y axis). The distance between adjacent workpieces in the horizontal direction (first distance) is Dx, and the distance in the vertical direction (second distance) is Dy. Through the above step S120, the center coordinates of the first workpiece on the processing plate are obtained to be (X0, Y0), the contact coordinates are (Xp0, Yp0), and the pin coordinates are (Xs0, Ys0). Through steps S410 to S430, it can be obtained that the center coordinates of the second workpiece in the horizontal direction are (X0+Dx, Y0), the contact coordinates are (Xp0+Dx, Yp0), and the pin coordinates are (Xs0+Dx, Ys0), and the center coordinates of the third workpiece are (X0+2*Dx, Y0), the contact coordinates are (Xp0+2*Dx, Yp0), and the pin coordinates are (Xs0+2*Dx, Ys0). The center coordinates of the second workpiece in the vertical direction are (X0, Y0 + Dy), the contact coordinates are (Xp0, Yp0 + Dy), and the pin coordinates are (Xs0, Ys0 + Dy). The center coordinates of the third workpiece are (X0, Y0 + 2*Dy), the contact coordinates are (Xp0, Yp0 + 2*Dy), and the pin coordinates are (Xs0, Ys0 + 2*Dy). In addition, if there are special layout requirements between workpieces, such as staggered arrangement and different spacing, the calculation method needs to be adjusted accordingly.

[0105] Reference Figure 5 It is understandable that after step S150, the following steps may also be included but not limited to:

[0106] Step S510: According to the position information of other workpieces to be welded, control the visual module to traverse and scan other workpieces on the processing plate to obtain third image information corresponding to each workpiece;

[0107] Step S520: performing integrity detection on each workpiece to be welded according to the third image information;

[0108] The integrity test includes:

[0109] Step S530: when there are grains on the lead frame on the workpiece, marking the corresponding workpiece as a first category;

[0110] Step S540: When there is no die on the lead frame on the workpiece, mark the corresponding workpiece as the second category.

[0111] In step S510 to step S540, by traversing and scanning the workpieces on the processing plate through the visual module, and obtaining the third image information of each workpiece, defects on the workpiece, such as whether there are missing grains on the lead frame, can be found in time. This real-time detection helps to avoid welding defective workpieces, thereby improving the overall welding quality. Marking the workpieces with missing grains as the second category, and possibly performing subsequent processing or removal, can effectively reduce the scrap rate caused by poor welding and improve the product qualification rate. In the step of lead welding, only workpieces with grains are selected for lead welding, that is, workpieces marked as the first type, to avoid the welding module from performing spot welding operations on the empty lead frame, which may cause the lead to be unable to detach from the welding module, thereby causing part of the lead to stick to the welding module, affecting the welding of the next workpiece, and even affecting the welding of the entire plate.

[0112] Reference Figure 6 It can be understood that the welding module includes a ceramic splitting knife and a wire feeding module, a channel for the welding wire to pass through is provided in the middle of the ceramic splitting knife, and the wire feeding module is used to provide the welding wire to the ceramic splitting knife; in step S160, the following steps may be included but not limited to:

[0113] Step S610: When the workpiece is of the first category, the wire feed module is controlled to provide welding wire into the ceramic splitting cutter, and the ceramic splitting cutter is controlled to move back and forth between the contact point of the grain and the inner pin of the lead frame according to the welding parameters;

[0114] Step S620: When the workpiece is of the second category, the wire feeding module is controlled to stop providing welding wire to the ceramic splitting knife, and the ceramic splitting knife is controlled to move back and forth according to the welding parameters.

[0115] In step S610 to step S620, the step design allows the welding module to flexibly adjust its operation mode when processing different types of workpieces. Specifically, when the workpiece is of the first category, it means that there are grains in the lead frame of the workpiece to be welded, so the wire feed module is controlled to provide welding wires into the channel of the ceramic splitter, and the ceramic splitter is controlled to move back and forth between the contact of the grain and the inner pin of the lead frame according to the welding parameters to achieve the polarity connection between the contact and the corresponding inner pin. When the workpiece is of the second category, that is, there are no grains on the lead frame, by simulating the welding process but not actually welding (not loading), equipment damage or production interruption caused by incorrect loading or incorrect operation can be avoided, and program abnormalities or interruptions caused by changes in workpiece types can be avoided, thereby reducing the error rate and downtime, and the system can maintain the consistency of its execution logic, and will not be interrupted or abnormal due to the lack of actual welding operations, thereby improving the stability of program code operation, thereby improving the stability and reliability of the entire production line.

[0116] Reference Figure 7 and Fig.11 It can be understood that the welding module includes not only a ceramic splitter and a wire feeding module, but also a blowing module. In the lead welding step, the steps may specifically include but are not limited to the following steps:

[0117] Step S710: Control the wire feeding module to feed the welding wire into the ceramic splitting knife, and control the ceramic splitting knife to heat and melt the exposed welding wire until the exposed portion of the welding wire forms a welding ball;

[0118] Step S720: Control the ceramic splitting knife to move to the contact position of the grain, and weld the solder ball to the contact position of the grain;

[0119] Step S730: Control the ceramic splitting knife to move upward by a first distance, move in a direction away from the inner pin corresponding to the lead frame by a second distance, then move upward by a third distance, and finally move in the direction of the inner pin corresponding to the lead frame;

[0120] Step S740: controlling the ceramic splitting knife to press-weld the welding wire to the corresponding inner pin of the lead frame;

[0121] Step S750: Control the blowing module to continuously blow out the anti-oxidation mixed gas toward the ceramic splitting knife.

[0122] In step S710 to step S720, the welding wire is melted into a solder ball at the contact point of the grain by means of ceramic splitting knife ultrasonic welding. The spherical solder joint has a larger surface area and can better wet and contact the grain contact point to be welded, thereby improving the reliability and stability of welding, and can accurately control the position and shape of the solder joint to meet these high-precision welding requirements.

[0123] In step S730, after the solder ball is welded to the contact position of the grain, the ceramic splitting knife is controlled to move upward by a first distance in sequence to ensure that the solder ball is fully in contact with the contact position of the grain and is firmly welded. Subsequently, the ceramic splitting knife is controlled to move a second distance away from the inner pin corresponding to the lead frame to provide sufficient operating space for the welding wire to avoid interference or collision with the grain or other components when being pressed to the inner pin, thereby protecting the welded solder joints and grains from damage. Then, the ceramic splitting knife is controlled to move upward by a third distance again to further adjust the position of the welding wire to ensure that it is in the best state before being pressed to the inner pin, which is conducive to forming a high-quality welding connection. Finally, after precise position adjustment, the welding wire is accurately pressed to the inner pin to achieve a stable electrical connection.

[0124] In step S740, the inner pins corresponding to the lead frame are welded by pressure welding. The pressure welding technology promotes the diffusion and bonding of welding materials by applying pressure and ultrasonic vibration, thereby enhancing the bonding strength of the solder joints to ensure the long-term stability and reliability of the microelectronic device.

[0125] In step S750, during the welding process, the lead frame and the surface of the die are easily reacted with oxygen in the air in a high temperature environment, resulting in oxidation, which affects the welding effect. Controlling the blowing module to continuously blow out a mixture of nitrogen and hydrogen can effectively isolate oxygen in the air, reduce the risk of oxidation, and protect the welding quality between the lead frame and the die.

[0126] Reference Figure 8 It is understandable that the production line also includes a lead detection device, which includes a positioning fixture, a wire hooking module and a sensing module; after step S160, it may also include but is not limited to the following steps:

[0127] Step S810: moving the processed plate from the welding station to the positioning fixture;

[0128] Step S820: controlling the wire hooking module to hook and pull the wires in a preset number of workpieces, and using the sensing module to sense the pulling force applied by the wire hooking module to the wires;

[0129] Step S830: when the pulling force value is greater than or equal to the preset bearing threshold, it is determined that the workpiece lead welding on the corresponding processing plate is good;

[0130] Step S840: when the pulling force value is less than the bearing threshold, a new workpiece to be detected is re-determined, and the wire hooking module and the sensing module are controlled to detect the new workpiece to be detected;

[0131] Step S850: When the corresponding maximum force values ​​of all new workpieces to be tested are greater than or equal to the preset bearing threshold, it is determined that the workpiece leads on the corresponding processing board are well welded; conversely, when the corresponding maximum force value of one of the new workpieces to be tested is less than the bearing threshold, the quality of the corresponding processing board is marked as pending.

[0132] In step S810 to step S830, the lead wires of the welded workpieces are hooked and pulled by the hooking module, and the pulling force value is detected in real time by the sensing module, so that the welding quality of the lead wires can be directly and accurately evaluated. When the pulling force value reaches or exceeds the preset tolerance threshold, it indicates that the welding strength of the lead wire is sufficient and the welding quality is good. In the present application, when welding the workpieces of the first preset number, the initial welding parameters are used for lead welding, and the overall welding quality may be lower than the welding quality of other workpieces. In step S820, the leads in the first preset number of workpieces are preferentially hooked and pulled, and the first preset number of workpieces are subjected to destructive testing. If the welding quality of the first preset number of workpieces is up to standard, then the quality of the workpieces welded by the optimized welding parameters will also meet the standard, thereby improving the efficiency and credibility of the workpiece quality inspection.

[0133] In step S840 to step S850, during the welding process, due to the influence of various factors, the tensile force value may be lower than the tolerance threshold by chance. When the tensile force value is less than the tolerance threshold, the re-inspection stage is entered. When quality problems are found, instead of simply stopping the inspection or marking the entire processed plate as unqualified, the inspection is continued to more comprehensively evaluate the welding quality. Only when all re-inspected workpieces meet the tensile force requirements, the welding quality of the workpieces on the processed plate is determined to be good. When it is found that the tensile force value of any re-inspected workpiece does not meet the standard, the quality of the corresponding processed plate is immediately marked as pending. The comprehensiveness and accuracy of the inspection are increased, the risk of misjudgment or missed judgment is reduced, the quality and reliability of the factory products are ensured, and customer satisfaction is improved.

[0134] In a second aspect, the present application also provides a chip packaging production line, comprising: at least one memory, at least one processor and at least one program, the program is stored in the memory, and the processor executes one or more programs to implement the lead welding control method of the above-mentioned chip packaging.

[0135] The lead welding equipment in the production line receives and accurately places the processing board to be packaged on the welding station. There are multiple workpieces on the processing board, each of which includes a lead frame and a grain attached to the frame. Subsequently, the visual module is controlled to perform image recognition processing on the previously preset number of workpieces on the processing board, and preliminarily determines the welding parameters applicable to the previously preset number of workpieces during processing. After the welding parameters are preliminarily determined, the welding module is controlled to perform lead welding on the previously preset number of workpieces according to the position information provided by the visual module and the preliminarily determined welding parameters. After the previously preset number of workpieces are welded, the visual module is controlled again to perform image detection processing on the welding area to evaluate the welding quality, so as to update the welding parameters of the welding module according to the evaluation results. This step allows the system to dynamically adjust the parameters according to the actual welding effect to adapt to the slight differences between the workpieces. Using the known position information of the previously preset number of workpieces, the position information of the other workpieces on the processing board is determined, and then the welding module is controlled to perform lead welding on the remaining workpieces on the processing board according to the updated welding parameters and the position information of the remaining workpieces. Since the welding parameters have been optimized according to the previous welding results, the welding quality of the subsequent workpieces can be improved. In the lead welding control method provided in the present application, the welding parameters can be adjusted according to the previously welded workpiece, which can effectively reduce welding defects. By adapting to the slight differences between the workpieces, it is ensured that each workpiece can obtain the best welding effect, thereby improving the overall packaging yield. At the same time, it can also reduce rework and defective product rates and improve the accuracy of semiconductor chip lead welding.

[0136] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs, non-transient computer executable programs and signals, such as program instructions / signals corresponding to the processing module in the embodiment of the present application. The processor executes various functional applications and data processing by running the non-transient software programs, instructions and signals stored in the memory, that is, the lead welding control method of the chip package of the above method embodiment is realized.

[0137] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required by at least one function; the data storage area may store relevant data of the lead welding control method of the above-mentioned chip package, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processing module via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0138] One or more signals are stored in the memory, and when executed by one or more processors, the wire bonding control method for chip packaging in any of the above method embodiments is executed.

[0139] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. The computer program is executed by one or more processors, and can enable the one or more processors to execute the lead welding control method of the chip package in the above method embodiment.

[0140] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, i.e., may be located in one place, or may be distributed over multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0141] Through the description of the above embodiments, it will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above can be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as a computer-readable signal, a data structure, a program module or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, magnetic tape, disk storage or other magnetic storage device, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media generally embodies computer readable signals, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0142] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0143] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0144] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0145] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0146] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0147] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. A chip packaging lead welding control method, characterized in that: A production line applied to chip packaging, the production line includes a wire bonding device, the wire bonding device includes a welding station, a vision module, and a welding module; The lead welding control method comprises: Receiving a processing plate and placing the processing plate on the welding station; wherein the processing plate is provided with a plurality of workpieces, the workpieces comprising a lead frame and a die attached to the lead frame; Controlling the visual module to perform image recognition processing on the first preset number of workpieces on the processing plate to obtain position information of the first preset number of workpieces on the processing plate and welding parameters of the welding module; According to the position information and the welding parameters, controlling the welding module to perform wire welding on a preset number of workpieces on the processing plate; After the preset number of workpieces have completed lead welding, the visual module is controlled again to perform image detection processing on the processing plate, and the welding parameters of the welding module are updated; Determine the position information of other workpieces on the processing plate according to the position information of a preset number of workpieces on the processing plate; According to the position information of the other workpieces and the updated welding parameters, the welding module is controlled to perform wire welding on the remaining workpieces of the processing plate.

2. The wire welding control method according to claim 1, characterized in that: The controlling of the visual module to perform image recognition processing on the first preset number of workpieces on the processing plate to obtain position information of the first preset number of workpieces on the processing plate and welding parameters of the welding module includes: Controlling the visual module to collect images of a preset number of workpieces in front of the processing plate to obtain first image information; Determine the position information of the workpiece according to the first image information; wherein the position information includes the center coordinates of the workpiece, the contact coordinates of each contact in the grain, and the pin coordinates of each inner pin in the lead frame; The welding parameters of the welding module for the workpiece are determined according to the position information, the corresponding relationship between the contact points of the grain and the inner pins of the lead frame.

3. The wire welding control method according to claim 2, characterized in that: The step of controlling the visual module again to perform image detection processing on the processed plate and updating the welding parameters of the welding module includes: Controlling the visual module to collect images of the processing board to obtain second image information; According to the second image information, a first solder joint state at a contact point of a grain, a second solder joint state at an inner lead of a lead frame, and a lead state of solder of the workpiece after welding are obtained; Inputting the first solder joint state, the second solder joint state and the lead wire state into a preset quality assessment model to obtain a welding quality assessment value; The welding parameters of the welding module are updated according to the welding quality evaluation value.

4. The wire welding control method according to claim 2, characterized in that: The first distances between the adjacent workpieces on the processing plate in the horizontal direction are equal, and the second distances between the adjacent workpieces in the vertical direction are equal; Determining the position information of other workpieces on the processing board according to the position information of a preset number of workpieces on the processing board also includes: Determine the center coordinates of the processing plate and the other workpieces according to the center coordinates of the welded workpiece, the first distance and the second distance; Determine the coordinates of the joints of the processing plate and the other workpieces according to the coordinates of the joints of the welded workpieces, the first distance, and the second distance; The pin coordinates of the processing plate and the other workpieces are determined according to the pin coordinates of the workpiece that has been welded, the first distance, and the second distance.

5. The wire welding control method according to claim 4, characterized in that: After the step of determining the position information of other workpieces on the processing board according to the position information of the preset number of workpieces on the processing board, the method further includes: According to the position information of the other workpieces to be welded, control the visual module to traverse and scan the other workpieces on the processing plate to obtain third image information corresponding to each workpiece; Performing integrity detection on each of the workpieces to be welded according to the third image information; Wherein, the integrity detection includes: When there are grains on the lead frame on the workpiece, marking the corresponding workpiece as a first category; When there is no die on the lead frame on the workpiece, the corresponding workpiece is marked as a second category.

6. The wire welding control method according to claim 5, characterized in that: The welding module comprises a ceramic splitting knife and a wire feeding module. A channel for the welding wire to pass through is provided in the middle of the ceramic splitting knife. The wire feeding module is used to provide the welding wire to the ceramic splitting knife. The controlling the welding module to perform wire welding on the remaining workpieces of the processing plate comprises: When the workpiece is of the first category, controlling the wire feed module to provide welding wire into the ceramic splitting knife, and controlling the ceramic splitting knife to move back and forth between the contact point of the grain and the inner pin of the lead frame according to the welding parameters; When the workpiece is of the second category, the wire feed module is controlled to stop providing welding wire into the ceramic splitting knife, and the ceramic splitting knife is controlled to move back and forth according to the welding parameters.

7. The wire welding control method according to claim 1, characterized in that: The welding module comprises a ceramic splitting knife, a wire feeding module and an air blowing module. A channel for the welding wire to pass through is provided in the middle of the ceramic splitting knife. The wire feeding module is used to provide the welding wire to the ceramic splitting knife. The lead welding comprises: Controlling the wire feeding module to feed the welding wire into the ceramic splitter, and controlling the ceramic splitter to heat and melt the exposed welding wire until the exposed portion of the welding wire forms a welding ball; Controlling the ceramic splitting knife to move to the contact position of the grain, and welding the solder ball to the contact position of the grain; Controlling the ceramic splitting knife to move upward a first distance, move in a direction away from the inner pin corresponding to the lead frame by a second distance, then move upward a third distance, and finally move in the direction of the inner pin corresponding to the lead frame; Controlling the ceramic splitting knife to press weld the welding wire to the inner pin corresponding to the lead frame; The blowing module is controlled to continuously blow out the anti-oxidation mixed gas toward the ceramic splitting knife.

8. The wire welding control method according to claim 1, characterized in that: The production line also includes a lead detection device, which includes a positioning fixture, a wire hooking module and a sensing module; After the step of controlling the welding module to perform wire welding on the remaining workpieces of the processing plate according to the position information of the other workpieces and the updated welding parameters, the method further includes: Transferring the processed plate from the welding station to the positioning fixture; Controlling the wire hooking module to hook and pull the wires in a preset number of the workpieces, and using the sensing module to sense the pulling force value applied by the wire hooking module to the wires; When the pulling force value is greater than or equal to a preset tolerance threshold, it is determined that the workpiece lead welding on the corresponding processing plate is good; When the pulling force value is less than the tolerance threshold, a new workpiece to be detected is re-determined, and the hooking module and the sensing module are controlled to detect the new workpiece to be detected; When the maximum force values ​​corresponding to all new workpieces to be tested are greater than or equal to the preset bearing threshold, it is determined that the workpiece leads on the corresponding processing board are well welded; conversely, when the maximum force value corresponding to one of the new workpieces to be tested is less than the bearing threshold, the quality of the corresponding processing board is marked as pending.

9. A chip packaging production line, characterized in that: include: at least one memory; at least one processor; at least one program; The programs are stored in the memory, and the processor executes at least one of the programs to implement the wire bonding control method for chip packaging according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the wire bonding control method for chip packaging according to any one of claims 1 to 8.

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