Adhesive tape clamping and cutting device for packaging semiconductor carrier tape disc

Abstract

The invention provides an adhesive tape clamping and cutting device for packaging a semiconductor carrier tape disc. The adhesive tape clamping and cutting device comprises a workbench, an idle wheel set, a fixing clamp mechanism, a drawing module, a mechanical arm module, two clamping jaw mechanisms and a cutting mechanism. In the working process, an adhesive tape of an adhesive tape disc passes through the idle wheel set and is fixed to the fixing clamp mechanism, the drawing module drives the clamping jaw mechanism to move to one side of the end of the adhesive tape, the mechanical arm module drives the first clamping jaw mechanism to vertically move downwards to the end of the adhesive tape, and the first clamping jaw mechanism can be used for clamping a section of adhesive tape; at the moment, the fixing clamp mechanism is started, the adhesive tape is released, then the drawing module drives the clamping jaw mechanisms to move by a certain distance, the mechanical arm module drives the second clamping jaw mechanism to vertically move downwards to the tail of the adhesive tape, the drawing module continues to drive the two clamping jaw mechanisms to move by a certain distance, and the end of the adhesive tape is drawn out by the required length; and then the fixing clamp mechanism is closed, the adhesive tape is fixed and cut off through the cutting-off mechanism, and therefore clamping and cutting-off of the adhesive tape are completed.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor carrier tape and reel packaging, and in particular relates to a tape clamping and cutting device for semiconductor carrier tape and reel packaging. Background Art

[0002] Semiconductor tape and reel packaging is an important way to package semiconductor components. It is mainly composed of a carrier tape and a reel. The carrier tape is mainly used to package electronic components such as semiconductor chips. It plays a role in protection and easy operation during transportation, storage and production. It can arrange individual electronic components in an orderly manner, which is convenient for subsequent automated mounting and other processes. The reel is a disc-shaped container for winding the carrier tape, which can facilitate the storage, transportation and subsequent production and processing of the carrier tape. In addition, the items in the reel can be fixed by tape.

[0003] When semiconductor carrier trays are packaged, one or several circles of foam or side tape are wrapped around their periphery to protect the products inside the carrier tray from bumps and stains during the transfer and transportation process. The tail of the foam or side tape is fixed on the carrier tray and pasted with tape. However, the semiconductor carrier tray packaging in the prior art usually adopts manual packaging, which has low efficiency, large workload, and large differences in packaging quality. In addition, since the tape is self-adhesive, it is not very convenient to operate manually with gloves, and sweat stains and stains have a great impact on the reliability of tape pasting. In order to avoid manual misoperation and standardize the packaging process, the production cost of the enterprise can be saved without damaging the carrier tray.

[0004] Therefore, automating this process is of great significance to realizing the automation of tape and tray packaging. Summary of the invention

[0005] The object of the present invention is to provide a tape clamping and cutting device for semiconductor carrier tape packaging, which can realize the clamping and cutting of the tape on the semiconductor carrier tape.

[0006] In order to solve the above technical problems, the present invention provides a tape clamping and cutting device for semiconductor carrier tape packaging, comprising a workbench, an inert wheel set, a fixing clamp mechanism, a pulling module, a mechanical arm module, at least two clamping claw mechanisms, a cutting mechanism, a tape sensor and a guide mechanism;

[0007] The workbench is respectively provided with a first mounting position and a second mounting position for rotatably connecting the tape reel and the idler wheel set, the tape on the tape reel passes through the idler wheel set and the fixing clamp mechanism in sequence, and the fixing and releasing of the end of the tape is controlled by the fixing clamp mechanism;

[0008] The movable end of the pulling module is connected to the fixed end of the mechanical arm module, and all the clamping mechanisms are arranged at the movable end of the mechanical arm module. The clamping mechanism is used to clamp the end of the tape to achieve pulling and grabbing. The pulling module is used to drive the mechanical arm module and the clamping mechanism to move along the pulling direction of the tape, and the mechanical arm module is used to drive each of the clamping mechanisms to approach the end of the tape. The cutting mechanism is arranged at the end of the fixed clamping mechanism and is used to cut the tape. The tape sensor is used to detect whether there is tape on the tape reel. The guide mechanism is arranged between the idle wheel group at the end and the fixed clamping mechanism to limit the position of the tape.

[0009] Optionally, the tape clamping and cutting device for the semiconductor carrier tape reel packaging further includes an alarm, which is electrically or signal-connected to the tape sensor and is used to sound an alarm when the tape sensor detects that there is no tape on the tape reel.

[0010] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape reel packaging, the guide mechanism includes a fixed plate, a movable plate, a movable plate positioning rod and a movable plate compression spring;

[0011] The fixed plate is fixed on the workbench, the movable plate can move closer to and farther from the fixed plate, and a tape channel for limiting the direction of the tape is formed between the movable plate and the fixed plate;

[0012] One end of the movable plate positioning rod is fixedly connected to the fixed plate, and the other end of the movable plate positioning rod penetrates the movable plate and is provided with the movable plate compression spring.

[0013] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape tray packaging, a movable plate pull button for easy gripping is provided on the movable plate.

[0014] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape packaging, the cutting mechanism includes a cutting cylinder and a cutting knife, the fixed end of the cutting cylinder is arranged on the workbench, and the movable end is connected to the cutting knife, and the cutting knife is used to cut the tape between the guide mechanism and the fixed clamp mechanism.

[0015] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tray packaging, the fixing clamp mechanism includes a fixing clamp cylinder and a group of fixing clamps, and a fixing position for fixing the tape is provided between the group of fixing clamps, and the fixing clamp cylinder is used to drive the group of fixing clamps to move closer and further away.

[0016] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape packaging, it also includes a module bracket for supporting the fixed end of the pull-out module, and the module bracket is a gantry, and the module bracket is arranged on the side of the workbench.

[0017] Optionally, the tape clamping and cutting device for semiconductor carrier tape packaging further includes an operating platform, and the operating platform is provided with at least a fixing clamp switch for controlling the opening or closing of the fixing clamp mechanism.

[0018] Optionally, in the above-mentioned tape clamping and cutting device for semiconductor carrier tape packaging, the robotic arm module includes two lifting linear modules arranged at intervals, one lifting linear module corresponds to one clamping mechanism, the fixed end of the lifting linear module is connected to the movable end of the pulling module, the movable end of the lifting linear module is connected to the clamping mechanism, and the two lifting linear modules operate independently.

[0019] The present invention provides a tape clamping and cutting device for semiconductor carrier tape reel packaging, which has the following beneficial effects:

[0020] During operation, the tape on the tape reel is fixed on the fixed clamping mechanism through the inert wheel group, and the clamping claw mechanism is driven to move to one side of the end of the tape through the pulling and pulling module. The first clamping claw mechanism is driven by the mechanical arm module to move vertically downward to the end of the tape, and a section of the tape can be clamped by the first clamping claw mechanism. At this time, the fixed clamping mechanism is opened and the tape is released. After the clamping claw mechanism is driven to move a certain distance by the pulling and pulling module, the mechanical arm module drives the second clamping claw mechanism to move vertically downward to the tail of the tape. The pulling and pulling module continues to drive the two clamping claw mechanisms to move a distance, so that the end of the tape is pulled out to the required length, and then the fixed clamping claw mechanism is closed and the tape is fixed. The tape between the clamping claw mechanism and the fixed clamping claw mechanism is cut off by the cutting mechanism, thereby completing the clamping and cutting of the tape.

[0021] Through the cooperation of the fixed clamp mechanism, the pulling module, the robot arm module and the clamping claw mechanism, the tape can be clamped and fixed before the cutting operation, avoiding the displacement of the tape during the cutting process. At the same time, the tape can be pulled after the clamping is released, and the cutting operation of the tape is performed using the cutting mechanism, so that the tape on the semiconductor carrier can be clamped and cut. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 A schematic structural diagram of a tape clamping and cutting device for semiconductor tape reel packaging provided by an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the structure of a workbench provided in an embodiment of the present invention and a fixing clamp mechanism, a cutting mechanism and a guiding mechanism arranged thereon;

[0025] Figure 3 A schematic diagram of the structure of an operating platform provided in an embodiment of the present invention.

[0026] In the above picture:

[0027] A-tape reel; A1-tape;

[0028] 100- workbench;

[0029] 200-Idler wheels;

[0030] 300-fixed clamp mechanism; 310-fixed clamp cylinder; 320-fixed clamp head;

[0031] 400-pull-out module; 410-module bracket;

[0032] 500-Robotic arm module;

[0033] 600-gripper mechanism;

[0034] 700-cutting mechanism; 710-cutting cylinder; 720-cutting knife;

[0035] 800-Tape sensor;

[0036] 900-guide mechanism; 910-fixed plate; 920-movable plate; 930-movable plate positioning rod; 940-movable plate compression spring; 950-movable plate pull button;

[0037] 1000-operating platform. DETAILED DESCRIPTION

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] The core of the present invention is to provide a tape clamping and cutting device for semiconductor carrier tray packaging, which can realize the clamping and cutting of the tape on the semiconductor carrier tray.

[0040] In order to enable those skilled in the art to better understand the technical solution provided by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0041] Specifically, please refer to Figure 1-Figure 3 The present invention provides a tape clamping and cutting device for semiconductor carrier tape packaging, comprising: a workbench 100, an inert wheel group 200, a fixed clamp mechanism 300, a pulling module 400, a mechanical arm module 500, at least two clamping claw mechanisms 600, a cutting mechanism 700, a tape sensor 800 and a guide mechanism 900.

[0042] The workbench 100 is used as a supporting platform, and a first mounting position and a second mounting position for rotatably connecting the tape reel A and the idler wheel assembly 200 may be respectively arranged thereon, and a fixing clamp mechanism 300 may also be arranged on the workbench 100. The upper surface of the workbench 100 may be a plane, and the smoothness of operation is improved by arranging the various components on the workbench 100 on the same plane. The tape reel A is wound in a roll shape of a tape, and the tape reel A is rotatably arranged at the first mounting position.

[0043] The idler wheel set 200 may be a pair of idler wheels, with a gap between the two idler wheels for the adhesive tape A1 to pass through, and the idler wheel set 200 may provide a certain guide for the pulling and turning of the adhesive tape A1. Of course, in a specific application, multiple idler wheel sets 200 may be adaptively arranged according to the actual arrangement positions of the components, so as to achieve the bending arrangement of the adhesive tape A1 at different angles and directions.

[0044] The fixing clamp mechanism 300 can control its own opening and closing. When it is opened, the adhesive tape A1 can be moved into the opening of the fixing clamp mechanism 300 or moved out of the opening of the fixing clamp mechanism 300, and the adhesive tape A1 is in a released state at this time; when it is closed, the adhesive tape A1 at the opening of the fixing clamp mechanism 300 can be clamped, and the adhesive tape A1 is in a fixed state at this time. In actual operation, the adhesive tape A1 on the tape reel A passes through the idler wheel set 200 and the fixing clamp mechanism 300 in sequence, and the fixing and release of the end of the adhesive tape A1 are controlled by the fixing clamp mechanism 300.

[0045] The movable end of the pulling module 400 is connected to the fixed end of the mechanical arm module 500, and all the clamping mechanisms 600 are arranged at the movable end of the mechanical arm module 500 along the length direction of the end of the tape A1. The clamping mechanism 600 is used to clamp the end of the tape A1 to achieve pulling and grabbing. The pulling module 400 is used to drive the mechanical arm module 500 and the clamping mechanism 600 to move along the pulling direction of the tape A1, and the mechanical arm module 500 is used to drive each clamping mechanism 600 to approach the end of the tape A1. The cutting mechanism 700 is arranged at the end of the fixed clamp mechanism 300 and is used to cut the tape A1. It should be noted that the pulling module 400 can drive the clamping mechanism 600 to move in the first direction, which is the pulling direction of the tape A1. The robotic arm module 500 can drive the clamping mechanism 600 to move in the second direction (i.e., the vertical direction). The first direction and the second direction are perpendicular to each other. The robotic arm module 500 can drive the clamping mechanism 600 to move closer to and away from the tape A1 through a compound drive.

[0046] The tape sensor 800 is used to detect whether there is tape A1 on the tape reel A.

[0047] The guide mechanism 900 is disposed between the idler wheel set 200 and the fixing clamp mechanism 300 at the end, and is used to limit the position of the adhesive tape A1.

[0048] The tape clamping and cutting device for semiconductor tape tray packaging provided by the present invention, when working, the tape A1 is fixed on the fixed clamp mechanism 300, and the clamping mechanism 600 is driven to move to one side of the end of the tape A1 by the pull-out module 400, and the first clamping mechanism of the clamping mechanism 600 is driven by the mechanical arm module 500 to move vertically downward to the end of the tape A1, and the first clamping mechanism can be used to clamp a section of the tape A1, at this time, the fixed clamp mechanism 300 is opened and the tape A1 is released, and then the pull-out module 400 is driven to After the clamping mechanism 600 moves a distance L1, the robot arm module 500 drives the second clamping mechanism of the clamping mechanism 600 to move vertically downward to the tail of the tape A1, and the pulling module 400 continues to drive the clamping mechanism 600 to move one end distance L2, so that the end of the tape A1 is pulled out to the required length, and then the fixed clamp mechanism 300 is closed and the tape A1 is fixed, and the cutting mechanism 700 is used to cut off the tape A1 between the clamping mechanism 600 and the fixed clamp mechanism 300, thereby completing the clamping and cutting of the tape A1.

[0049] Through the cooperation of the fixed clamp mechanism 300, the pulling module 400, the robot arm module 500 and the clamping claw mechanism 600, the tape A1 can be clamped and fixed before the cutting operation, thereby avoiding the displacement of the tape A1 during the cutting process, thereby greatly improving the cutting accuracy of the equipment; at the same time, the tape A1 can be pulled after the clamping is released, and the cutting operation of the tape A1 can be performed using the cutting mechanism 700, so that the tape on the semiconductor carrier can be clamped and cut.

[0050] The above device can be used to implement the following operations: 1. The adhesive tape is pulled out from the rolled adhesive tape reel A; 2. The pulled out adhesive tape can be cut into a fixed length; 3. The cut adhesive tape is placed at a fixed position, waiting to be taken and pasted.

[0051] Specifically, the robot arm module 500 includes two lifting linear modules arranged at intervals, one lifting linear module corresponds to a clamping mechanism 600, the fixed end of the lifting linear module is connected to the movable end of the pulling module 400, the movable end of the lifting linear module is connected to the clamping mechanism 600, and the two lifting linear modules operate independently.

[0052] In a specific embodiment, the solution also includes an alarm.

[0053] The alarm is electrically connected or signal-connected to the tape sensor 800, and is used to alarm when the tape sensor 800 detects that there is no tape A1 on the tape reel A. The sensor 800 detects the presence of the tape A1, and when it finds that there is no tape A1, it alarms that there is no material, stops the machine, and reminds people to replace the tape manually. When there is tape, it starts normally.

[0054] In a specific embodiment, Figure 2 As shown, the guide mechanism 900 includes a fixed plate 910, a movable plate 920, a movable plate positioning rod 930 and a movable plate compression spring 940. The movable plate positioning rod 930 and the movable plate compression spring 940 correspond to each other one by one, and one or more groups can be provided.

[0055] The fixed plate 910 is fixed on the workbench 100, and the movable plate 920 can move closer to and farther away from the fixed plate 910, and a limiting member is set between the movable plate 920 and the fixed plate 910 to form a tape channel for limiting the direction of the tape A1, and the width of the tape channel is slightly larger than the width of the tape A1.

[0056] One end of the movable plate positioning rod 930 is fixedly connected to the fixed plate 910 , and the other end of the movable plate positioning rod 930 passes through the movable plate 920 and is provided with a movable plate compression spring 940 , which can provide a tendency for the movable plate 920 to move toward the fixed plate 910 .

[0057] In order to realize the movement of the moving plate 920 relative to the fixed plate 910, in one form, a moving plate pull button 950 that is easy to hold can be provided on the moving plate 920, and the moving plate pull button 950 is used to pull the moving plate 920 to move along the moving plate positioning rod 930, and the moving plate compression spring 940 provides a pre-tightening force. Specifically, the moving plate 920 is moved closer to and away from the two guide pillars fixed on the fixed plate 910 by pulling the moving plate pull button 950;

[0058] In another form, the present solution further includes a linear module for driving the moving plate 920 to move closer to and away from the fixed plate 910. The movable end of the linear module is connected to the moving plate 920, and the moving plate 920 is driven by an electric drive to move along the moving plate positioning rod 930.

[0059] It should be noted that when the tape clamping and cutting device of the semiconductor carrier tape packaging is initially used or when the tape reel A needs to be replaced, the tape A1 needs to pass through the tape material channel of the guide mechanism 900. Pulling open the movable plate button 950 or controlling it through the linear module can make the tape A1 easily pass through the guide mechanism 900.

[0060] Furthermore, the cutting mechanism 700 includes a cutting cylinder 710 and a cutting knife 720 . The fixed end of the cutting cylinder 710 is arranged on the workbench 100 , and the movable end is connected to the cutting knife 720 . The cutting knife 720 is used to cut the tape A1 between the guide mechanism 900 and the fixing clamp mechanism 300 .

[0061] The fixing clamp mechanism 300 includes a fixing clamp cylinder 310 and a group of fixing clamps 320 . There are fixing positions for fixing the adhesive tape A1 between the group of fixing clamps 320 . The fixing clamp cylinder 310 is used to drive the group of fixing clamps 320 to move closer or farther away.

[0062] The control component in the fixing clamp cylinder 310 can control the opening and closing of the fixing clamp 320, that is, when replacing the tape, the fixing clamp 320 is opened, the head of the tape A1 is pulled out from the tape reel A, bypasses the idler wheel set 200, passes through the tape channel of the guide mechanism 900, and passes through the opened fixing clamp 320. At this time, the fixing clamp 320 is closed by the controller to cut off the excess tape.

[0063] like Figure 2 As shown, the tape reel A is installed on the first installation position of the workbench 100, and the tape A1 is pulled out a distance by the pulling module 400, so that the tape A1 passes through the guide mechanism 900 and the fixed clamp mechanism 300. At the same time, the movable plate compression spring 940 guides the movable plate 920 and the fixed plate 910 through the movable plate positioning rod 930 to form a tape material channel for accommodating and limiting the extension direction of the tape A1. The fixed clamp cylinder 310 drives a group of fixed clamps 320 to approach each other, so that the end of the tape A1 is fixed by the fixed clamp mechanism 300. The cut-off cylinder 710 drives the cutter 720 to move, so that the cutter 720 cuts off the tape A1 between the guide mechanism 900 and the fixed clamp mechanism 300.

[0064] The tape reel A is a rolled single product. To take out the fixed-length tape A1 from the tape reel A, first pull out the tape head from the tape reel A, fix the tape by the above-mentioned guide mechanism 900 and the fixing clamp mechanism 300, and after taking out the required length of tape, cut it by the cutting mechanism 700 to achieve fixed-length tape taking.

[0065] This solution also includes a module support 410 for supporting the fixed end of the pulling module 400. The module support 410 is a gantry, and the module support 410 is arranged on the side of the workbench 100. The top crossbeam of the gantry is arranged parallel to the guide mechanism 900, which facilitates the clamping and pulling operation of the end of the tape A1.

[0066] In addition, in order to facilitate the operation of the staff, the present solution also includes an operating platform 1000, on which at least a fixing clamp switch for controlling the opening or closing of the fixing clamp mechanism 300 is provided. Of course, a screen or other operating buttons can also be provided on the operating platform 1000. The control devices such as the controller in the above solution can all be provided in the operating platform 1000.

[0067] In a specific embodiment, the pull-out module 400 is a linear module arranged in the horizontal direction, and the robot arm module 500 can drive each clamping mechanism 600 to perform linear motion in the vertical direction. The linear module can specifically be a cylinder or a linear motor. There can be multiple clamping mechanisms 600, and the opening and closing of multiple clamping mechanisms 600 can be controlled by multiple clamping cylinders.

[0068] The present solution also includes a control system, which is used to control the actions of the fixing clamp mechanism 300, the pulling module 400, the mechanical arm module 500, the clamping mechanism 600 and the cutting mechanism 700. The control system is composed of components such as sensors, actuators, controllers and controlled objects, and can achieve control by continuously measuring feedback information and making adjustments to specific time signals or trigger signals between various mechanisms.

[0069] like Figure 1 As shown, the action of the entire tape clamping and cutting device is as follows:

[0070] In the initial stage, before the device is started, the tape head is pulled out from the tape reel A and drawn through the inert wheel assembly 200, the tape material channel of the guide mechanism 900 and the fixed clamp mechanism 300 in sequence, and the fixed clamp switch of the operating platform 1000 is activated, and the fixed position of the fixed clamp head 320 is controlled to be closed by the fixed clamp cylinder 310, so that the fixed clamp mechanism 300 clamps the end of the tape.

[0071] When the device is running, after the tape sensor 800 detects the tape signal at the workstation, it feeds back the signal to the controller, drives the first clamping mechanism to move between the guide mechanism 900 and the fixed clamping mechanism 300 through the drawing module 400 and the mechanical arm module 500, and drives the clamping claw of the first clamping mechanism to clamp the tape A1 through the clamping claw cylinder. At this time, the fixed clamping mechanism 300 is opened, and the first clamping claw mechanism is driven to move horizontally through the drawing module 400 to realize the drawing of the tape A1 (the clamping claw mechanism 600 can pass through the opening formed when the fixed clamping mechanism 300 is opened), and then the second clamping claw mechanism is driven to descend between the first clamping claw mechanism and the fixed clamping mechanism 300 through the mechanical arm module 500, so that the second clamping claw mechanism can just clamp the tape A1 between the first clamping claw mechanism and the fixed clamping mechanism 300. The section of tape A1 clamped by the two clamping claw mechanisms 600 moves under the drive of the drawing module 400, so that both clamping claw mechanisms 600 pass through the fixed clamping mechanism 300. Then, the fixing clamp mechanism 300 is closed, so that the fixing clamp mechanism 300 clamps the newly pulled out adhesive tape A1. The cutting mechanism 700 cuts off the part of adhesive tape A1 clamped by the clamping claw mechanism 600, thereby completing the clamping and cutting of the adhesive tape. The cut-off part can be used for the next process, and the pulling module 400 and the mechanical arm module 500 can drive the clamping claw mechanism 600 to reset and repeat the cycle operation.

[0072] It should be noted that when the fixed position of the fixing clamp mechanism 300 can be opened to a greater distance, it is convenient for the clamping claw mechanism 600 to pass smoothly during the pulling operation.

[0073] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0074] In the description of this application, the meaning of "plurality" is more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and it cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0075] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0076] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0077] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core ideas of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A tape clamping and cutting device for semiconductor carrier tape packaging, characterized in that: It comprises a workbench (100), an inert wheel set (200), a fixing clamp mechanism (300), a drawing module (400), a mechanical arm module (500), at least two clamping claw mechanisms (600), a cutting mechanism (700), a tape sensor (800), and a guiding mechanism (900); The workbench (100) is provided with a first mounting position and a second mounting position for rotatably connecting the tape reel (A) and the idler wheel assembly (200), respectively; the tape (A1) on the tape reel (A) passes through the idler wheel assembly (200) and the fixing clamp mechanism (300) in sequence, and the fixing and releasing of the end of the tape (A1) are controlled by the fixing clamp mechanism (300); The movable end of the pulling module (400) is connected to the fixed end of the mechanical arm module (500); all the clamping mechanisms (600) are arranged at the movable end of the mechanical arm module (500); the clamping mechanisms (600) are used to clamp the end of the adhesive tape (A1) to achieve pulling and grasping; the pulling module (400) is used to drive the mechanical arm module (500) and the clamping mechanisms (600) to move along the pulling direction of the adhesive tape (A1); the mechanical arm module (500) The device is used to drive each of the clamping jaw mechanisms (600) to approach the end of the adhesive tape (A1). The cutting mechanism (700) is arranged at the end of the fixing clamp mechanism (300) and is used to cut the adhesive tape (A1). The adhesive tape sensor (800) is used to detect whether there is an adhesive tape (A1) on the tape reel (A). The guide mechanism (900) is arranged between the idle wheel group (200) at the end and the fixing clamp mechanism (300) and is used to limit the position of the adhesive tape (A1).

2. The tape clamping and cutting device for semiconductor carrier tape packaging according to claim 1, characterized in that: It also comprises an alarm, which is electrically connected or signal-connected to the tape sensor (800) and is used to sound an alarm when the tape sensor (800) detects that there is no tape (A1) on the tape reel (A).

3. The tape clamping and cutting device for semiconductor carrier tape packaging according to claim 1, characterized in that: The guide mechanism (900) comprises a fixed plate (910), a movable plate (920), a movable plate positioning rod (930) and a movable plate compression spring (940); The fixed plate (910) is fixed on the workbench (100), the movable plate (920) can move closer to and farther from the fixed plate (910), and a tape channel for limiting the direction of the tape (A1) is formed between the movable plate (920) and the fixed plate (910); One end of the movable plate positioning rod (930) is fixedly connected to the fixed plate (910), and the other end of the movable plate positioning rod (930) passes through the movable plate (920) and is provided with the movable plate compression spring (940).

4. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 3, characterized in that: The movable plate (920) is provided with a movable plate pull button (950) which is convenient for gripping.

5. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, characterized in that: The cutting mechanism (700) comprises a cutting cylinder (710) and a cutting knife (720); the fixed end of the cutting cylinder (710) is arranged on the workbench (100), and the movable end is connected to the cutting knife (720); the cutting knife (720) is used to cut the adhesive tape (A1) between the guide mechanism (900) and the fixing clamp mechanism (300).

6. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, characterized in that: The fixing clamp mechanism (300) comprises a fixing clamp cylinder (310) and a group of fixing clamp heads (320), wherein a fixing position for fixing the adhesive tape (A1) is provided between the group of fixing clamp heads (320), and the fixing clamp cylinder (310) is used to drive the group of fixing clamp heads (320) to move closer or further away.

7. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, characterized in that: It also includes a module support (410) for supporting the fixed end of the drawer module (400); the module support (410) is a gantry; the module support (410) is arranged on the side of the workbench (100).

8. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, characterized in that: It also comprises an operating platform (1000), on which is at least a fixing clamp switch for controlling the fixing clamp mechanism (300) to open or close.

9. The tape clamping and cutting device for semiconductor tape reel packaging according to claim 1, characterized in that: The robotic arm module (500) comprises two lifting linear modules arranged at intervals, one lifting linear module corresponds to one clamping mechanism (600), a fixed end of the lifting linear module is connected to a movable end of the pulling module (400), and the movable end of the lifting linear module is connected to the clamping mechanism (600), and the two lifting linear modules operate independently.

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