Laser light source module and control system

Abstract

The invention discloses a laser light source module and a control system, and belongs to the field of semiconductor light source devices, and the laser light source module mainly comprises an LD chip, a fluorescence conversion material, a controller, a heat dissipation device and a telescopic device. By adopting a split heat dissipation design and carrying out liquid cooling heat dissipation treatment on the fluorescence conversion material, the technical problems that the fluorescence conversion material is easy to damage under high-power excitation and the excitation effect is possibly influenced by adding a heat dissipation module to a transmission-type excitation fluorescence conversion material in the prior art are solved; the technical effects of stable excitation of the high-power LD and independent heat dissipation of the transmission-type excited fluorescence conversion material are achieved.

Description

Technical Field

[0001] The invention relates to a semiconductor lighting light source device, and in particular to a laser light source module and a control system. Background Art

[0002] Semiconductor lighting source devices are a lighting technology that has developed rapidly in recent years and represent a research hotspot in the field of light sources. Since the birth of the world's first commercial light-emitting diode in 1965, semiconductor lighting technology has experienced rapid development. This technology has been widely used in general lighting fields such as home lighting, commercial lighting, industrial lighting, as well as functional application fields such as agricultural lighting, health lighting, UV curing, sterilization and disinfection, and security detection due to its significant characteristics such as high efficiency, energy saving, environmental protection and versatility. With the continuous advancement of technology, the light efficiency of semiconductor lighting devices has been significantly improved. For example, from 1991 to 2001, the luminous flux of commercial LEDs (light-emitting diodes) increased by nearly 30 times, and the efficiency reached about 100 lumens per watt (lm / W). At present, semiconductor lighting technology is in a period of rapid development. LED has become the mainstream light source device in the field of lighting. Its development goal has shifted from the initial energy conservation and emission reduction to high-quality healthy lighting and innovative application functional lighting development.

[0003] As an emerging lighting technology, laser lighting has received extensive attention and research in recent years. It uses lasers as light sources and has the characteristics of high brightness, high energy efficiency, and long life, and has been widely used in many fields. Compared with traditional light sources, laser lighting technology can provide brighter and more uniform lighting effects, improving the lighting quality of working and living environments. Compared with the light generated by traditional LED spontaneous radiation, LD (laser) has the advantages of good directionality, high beam quality, high electro-optical conversion efficiency, and long life. These characteristics give laser lighting a natural advantage in special lighting scenarios, such as long-distance lighting, night vision security lighting, compact and flexible lighting design, etc. In the fields of automotive headlights, aviation and navigation lighting, military flashlights, laser cinemas, and laser TVs, laser lighting technology shows a wide range of application prospects.

[0004] At present, using high-power blue lasers to excite fluorescent conversion materials to obtain white light has become a major research trend in laser lighting. However, high power also brings problems of high heat and high stress. Not only can stable excitation light not be obtained, but related devices can also be damaged.

[0005] In the process of implementing the technical solution of the invention in the embodiment of the present application, the inventors of the present application found that the above technology has at least the following technical problems:

[0006] 1. Under high-power LD excitation, the fluorescent conversion material will be damaged due to problems such as heat failure or uneven heating.

[0007] 2. For the excitation of transmissive fluorescent conversion materials, if a heat dissipation module is installed separately, the excitation effect will usually be affected due to shielding, etc. Summary of the invention

[0008] The embodiments of the present application provide a laser light source module and a control system to solve the technical problems in the prior art that fluorescent conversion materials are easily damaged under high-power excitation and that installing a heat dissipation module on the fluorescent conversion materials for transmission-type excitation may affect the excitation effect, thereby achieving the technical effects of stable excitation of high-power LDs and separate heat dissipation of fluorescent conversion materials for transmission-type excitation.

[0009] An embodiment of the present application provides a laser light source module, including: a substrate, an LD chip, a first heat dissipation device, a second heat dissipation device, a fluorescent conversion material, a telescopic structure, a processor and a lampshade.

[0010] Further, the LD chip is located at the center of the surface of one side of the substrate;

[0011] Furthermore, the first heat sink is generally in the shape of a cylinder and is connected to the other side surface of the substrate;

[0012] Furthermore, the second heat sink is generally in the form of a cylinder, a rectangular parallelepiped protrudes from the cylinder but the internal space is not directly connected, the bottom area of ​​the cylinder is set corresponding to the first heat sink, the second heat sink is connected to the first heat sink via a substrate and a chip, and liquid can flow inside;

[0013] Furthermore, the fluorescent conversion material is arranged inside the second heat sink parallel to the bottom surface of the second heat sink, with a certain space left on both sides;

[0014] Further, the telescopic structure is generally in the form of a cylinder, connected to the second heat sink, and the bottom surface is arranged corresponding to the bottom surface of the second heat sink;

[0015] Furthermore, the processor is a rectangular parallelepiped structure extending from the telescopic device, and its shape and size are the same as the rectangular parallelepiped protruding part of the second heat dissipation device (5).

[0016] Furthermore, a highly reflective coating is provided inside the lampshade;

[0017] The heat of the fluorescent conversion material is dissipated by the liquid flowing in the second heat dissipation device.

[0018] Furthermore, the side where the LD chip and the substrate are connected to the second heat sink should be provided with a highly transparent waterproof coating.

[0019] Furthermore, the second heat dissipation device includes: a cylindrical shell, holes, a water tank, pipes, a water pump and a refrigeration device.

[0020] Further, there are two holes, which are located on the same diameter of the bottom surface of the cylindrical shell;

[0021] Further, the water tank is formed by a rectangular parallelepiped shell extending from the cylindrical shell;

[0022] Further, a pipe connects the water tank and the cylindrical shell, and the aperture size corresponds to the hole setting;

[0023] Furthermore, the water pump is located on the side where the pipeline is connected to the water tank.

[0024] Furthermore, the refrigeration device is located on the inner side of one rectangular side of the water tank.

[0025] Furthermore, the telescopic structure includes a first telescopic structure and a second telescopic structure.

[0026] Furthermore, the first telescopic structure is a cylindrical shell, a rectangular parallelepiped protrusion is provided on the shell, and a convex-planar lens is fixed inside;

[0027] Furthermore, the second telescopic structure is a cylindrical shell with a radius slightly larger than that of the first telescopic structure, a groove is arranged inside the shell, and a plano-concave lens is arranged inside the shell.

[0028] Furthermore, the size of the groove is set corresponding to the protrusion so that the protrusion can move inside the groove without getting loose. The groove extends inward from the edge of the cylindrical shell of the second telescopic structure until it is large enough for the protrusion to completely enter the shell. A semicircular groove extends along the edge of the cylinder and then extends a certain distance to one side of the plano-concave lens.

[0029] In particular, a control system is provided, which is applicable to the above-mentioned laser light source module, and includes a processor, a first temperature sensor, a second temperature sensor, a third temperature sensor and a display screen.

[0030] Further, the first temperature sensor is located between the substrate and the LD chip;

[0031] Further, the second temperature sensor is located at the edge of the fluorescence conversion material;

[0032] Further, the third temperature sensor is located inside the water tank;

[0033] Furthermore, the display screen is used to display information.

[0034] Furthermore, the processor includes:

[0035] A first receiving module 601, used for receiving information;

[0036] A first acquisition module 602 is used to acquire information of a temperature sensor;

[0037] The first information processing module 603 is used to process information and issue instructions to other modules;

[0038] A first sending module 604, used to send information to a mobile terminal;

[0039] The power supply module 605 is used to supply power to the first receiving module 601 , the first acquiring module 602 , the first information processing module 603 , and the first sending module 604 .

[0040] Furthermore, a control method is provided, which is applicable to the above control system:

[0041] Receiving a command from a mobile terminal, wherein the command may be an opening command, a closing command, a timing command, or a parameter setting command;

[0042] If the command is an open command, the laser light source module starts working; if the command is a close command, the laser light source module stops working; if the command is a timing command, it will automatically stop working after a period of time; if the command is a parameter setting command, the corresponding parameter setting will be received; the parameters can be the water pump working speed, cooling efficiency, liquid temperature, and LD chip power.

[0043] Furthermore, a self-regulation method is applicable to the above control system:

[0044] If there is no special operation, the laser light source module enters the self-adjustment mode when working, which includes:

[0045] S1: Detect the temperature of LD chip, fluorescent conversion material and liquid in the water tank;

[0046] S2: Process the corresponding information and calculate the working time of the refrigeration device and the working rate of the water pump;

[0047] S3: If the water pump and refrigeration device cannot achieve stable working effect, the LD chip power can be slightly adjusted;

[0048] S4: Repeat the above steps until stopping.

[0049] Furthermore, an overheat protection control method is applicable to the above-mentioned control system, comprising:

[0050] S1: receiving temperature threshold information from the mobile terminal;

[0051] S2: light source module works;

[0052] S3: Detect the real-time temperature of LD chip and fluorescent conversion material;

[0053] S4: If the measured temperature reaches the temperature threshold, the operation stops and an error message is sent to the mobile terminal, which is also displayed on the display screen.

[0054] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0055] 1. Due to the use of a combination of air cooling and liquid cooling to dissipate heat for the LD chip and the fluorescent conversion material separately, the technical problem of the fluorescent conversion material being easily damaged under high-power excitation in the prior art is effectively solved, thereby achieving the technical effect of stable excitation of high-power LD.

[0056] 2. Due to the use of liquid cooling technology to dissipate heat for the fluorescent conversion material, the technical problem that the installation of a heat dissipation module for the transmission-type excited fluorescent conversion material will affect the excitation effect is effectively solved, thereby achieving the technical effect of independently dissipating heat for the transmission-type excited fluorescent conversion material. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 This is a side view of the laser light source module according to an embodiment of the present application.

[0058] Figure 2 This is a position diagram of the second heat dissipation device and telescopic structure of the laser light source module in an embodiment of the present application.

[0059] Figure 3 This is a rear view of the laser light source module according to an embodiment of the present application.

[0060] Figure 4 This is the front view of the laser light source module according to the embodiment of the present application.

[0061] Figure 5 This is a detailed diagram of the substrate of an embodiment of the present application.

[0062] Figure 6 This is a detailed diagram of the second heat dissipation device of an embodiment of the present application.

[0063] Figure 7 This is a detailed diagram of the fluorescent conversion material according to an embodiment of the present application.

[0064] Figure 8 This is a side view of the first telescopic structure of an embodiment of the present application.

[0065] Fig. 9 This is a top view of the first telescopic structure of the embodiment of the present application.

[0066] Fig.10 This is a side view of the second telescopic structure of the embodiment of the present application.

[0067] Fig.11 This is a top view of the second telescopic structure of the embodiment of the present application.

[0068] Fig.12 This is a detailed diagram of the lampshade according to an embodiment of the present application.

[0069] Fig.13 This is an exploded diagram of the laser light source module according to an embodiment of the present application.

[0070] Fig.14 This is a diagram of the laser light source module of an embodiment of the present application.

[0071] Fig.15 This is a diagram of a processor according to an embodiment of the present application.

[0072] Fig.16 This is a control method diagram of an embodiment of the present application.

[0073] Fig.17 This is a diagram of the self-adjustment method of an embodiment of the present application.

[0074] Fig.18 This is a diagram of the overheat protection method of an embodiment of the present application. DETAILED DESCRIPTION

[0075] The embodiments of the present application solve the technical problems in the prior art that fluorescent conversion materials are easily damaged under high-power excitation and that the installation of heat dissipation modules on transmissive excitation fluorescent conversion materials will affect the excitation effect through a laser light source module and control system, thereby achieving the technical effects of stable excitation of high-power LD and independent heat dissipation of fluorescent conversion materials under transmissive excitation.

[0076] In order to solve the problem that the fluorescent conversion material is easily damaged under high-power excitation in the prior art, the overall idea is as follows:

[0077] LD has the characteristics of high power density and strong collimation. Long-term LD excitation will generate a lot of heat in the irradiated center area, resulting in a large temperature difference between the irradiated center and the irradiated edge. At the same time, stress accumulation will cause the fluorescent conversion material to break due to excessive stress. Even if the fluorescent conversion material is intact, the high heat generated under high-power excitation will quench the fluorescent conversion material and lose its function.

[0078] To solve the above problems, a split heat dissipation method is adopted, that is, the LD chip does not directly contact the fluorescent conversion material, and a certain space is used to install a heat dissipation module. The heat dissipation module is divided into a first heat dissipation module and a second heat dissipation module. The first heat dissipation module is air-cooled to dissipate heat for the LD chip and substrate, and the second heat dissipation module is water-cooled to dissipate heat for the fluorescent conversion material.

[0079] In order to solve the technical problem that adding a heat dissipation module to the transmission-type excitation fluorescence conversion material will affect the excitation effect, the overall idea is as follows:

[0080] Traditional heat dissipation methods all adopt direct contact heat conduction heat dissipation methods. The transmissive structure requires the laser to directly transmit the fluorescent conversion material to excite. If a direct contact heat dissipation module is set, it will block the light and affect the heat dissipation effect. Therefore, liquid cooling is adopted to dissipate heat by placing the fluorescent conversion material in flowing cooling liquid. The liquid has high transparency and has little effect on light.

[0081] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0082] Embodiment 1

[0083] A laser light source module comprises a first heat sink 3, a substrate 2, an LD chip 1, a second heat sink 5, a fluorescent conversion material 4, a telescopic device 7 and a lampshade 8 in sequence along a central axis.

[0084] The LD chip 1 is located at the center of the surface of one side of the substrate 2, and the surface of the other side of the substrate 2 is connected to the first heat sink 3. The side where the LD chip 1 and the substrate 2 are connected to the second heat sink 5 should be provided with a highly permeable waterproof coating. The first heat sink 3 is generally a cylinder, with a fan inside, and the side connected to the substrate 2 and the chip 1 is connected to the second heat sink 5. The second heat sink 5 is generally a cylinder, and the bottom radius is set corresponding to the first heat sink 3. The main body is a cylindrical shell 54, on which there are two holes 55 of the same size, located on the same diameter of the bottom surface of the cylindrical shell 54. The rectangular shell extending from the cylindrical shell 54 forms a water tank 51, and the pipe 52 connects the water tank 51 and the cylindrical shell 54, and the aperture size is set corresponding to the hole 55. A water pump 53 is set at the part where the pipe 52 on one side is connected to the water tank 51, and a refrigeration device 56 is set on the rectangular side inside the water tank. The internal space of the water tank 51 and the cylindrical shell 54 is connected by the pipe 52 instead of directly communicating, and the liquid can flow inside.

[0085] The fluorescent conversion material 4 is arranged inside the second heat sink 5 parallel to the bottom surface of the second heat sink 5, with a certain space left on both sides. The telescopic structure 7 is generally a cylinder, connected to the second heat sink 5, and the bottom surface is arranged corresponding to the bottom surface of the second heat sink 5. The processor 6 is a rectangular parallelepiped structure extending from the telescopic device 7, and its shape and size are the same as the rectangular protruding part of the second heat sink 5. The telescopic structure 7 includes a first telescopic structure 71 and a second telescopic structure 72. The first telescopic structure 71 is a cylindrical shell, a rectangular parallelepiped protrusion 711 is arranged on the shell, and a convex-planar lens 712 is fixed inside. The second telescopic structure 72 is a cylindrical shell with a radius slightly larger than the first telescopic structure 71, a groove 721 is arranged inside the shell, and a plano-concave lens 722 is arranged inside. The size of the groove 721 corresponds to that of the protrusion 711, so that the protrusion 711 can move inside the groove 721 without becoming loose. The groove 721 extends inward from the edge of the cylindrical shell of the second telescopic structure 72 until it is large enough for the protrusion 711 to completely enter the shell, and then extends a semicircular groove along the edge of the cylinder and extends a certain distance to one side of the plano-concave lens 722.

[0086] By connecting the protrusions and the grooves, the distance between the lenses inside the telescopic device can be adjusted to adjust the light output effect.

[0087] The other end of the telescopic device 7 is connected to a lampshade 8 , and a high-reflective coating 81 is provided inside the lampshade 8 ; wherein the heat of the fluorescent conversion material 4 is dissipated by the liquid flowing in the second heat dissipation device 5 .

[0088] In particular, a control system is provided, which is applicable to the above-mentioned laser light source module, and includes a processor 6, a first temperature sensor 61, a second temperature sensor 62, a third temperature sensor 63 and a display screen 64. The first temperature sensor 61 is located between the substrate 2 and the LD chip 1, the second temperature sensor is located at the edge of the fluorescent conversion material 4, the third temperature sensor is located inside the water tank 51, and the display screen 64 is located on the processor 6 for displaying information.

[0089] like Fig.15 The processor diagram of the embodiment of the present application, the processor 6 includes:

[0090] A first receiving module 601, used for receiving information;

[0091] A first acquisition module 602 is used to acquire information of a temperature sensor;

[0092] The first information processing module 603 is used to process information and issue instructions to other modules;

[0093] A first sending module 604, used to send information to a mobile terminal;

[0094] The power supply module 605 is used to supply power to the first receiving module 601 , the first acquiring module 602 , the first information processing module 603 , and the first sending module 604 .

[0095] like Fig.16 The control method of the embodiment of the present application is shown in the figure:

[0096] The user issues commands to the module through the mobile terminal, and the module receives the commands from the mobile terminal. The commands may be opening commands, closing commands, timing commands, or parameter setting commands.

[0097] If the command is an open command, the laser light source module starts working; if the command is a close command, the laser light source module stops working; if the command is a timing command, it will automatically stop working after a period of time; if the command is a parameter setting command, the corresponding parameter setting will be received; the parameters can be the water pump working speed, cooling efficiency, liquid temperature, and LD chip power.

[0098] like Fig.17 The self-adjustment method of the embodiment of this application is shown in the figure:

[0099] If there is no special operation, the laser light source module enters the self-adjustment mode when working, which includes:

[0100] S1: Detect the temperature of LD chip, fluorescent conversion material and liquid in the water tank;

[0101] S2: Process the corresponding information and calculate the working time of the refrigeration device and the working rate of the water pump;

[0102] S3: If the water pump and refrigeration device cannot achieve stable working effect, the LD chip power can be slightly adjusted;

[0103] S4: Repeat the above steps until stopping.

[0104] like Fig.18 The overheat protection method of the embodiment of the present application is shown in the figure:

[0105] S1: receiving temperature threshold information from the mobile terminal;

[0106] S2: light source module works;

[0107] S3: Detect the real-time temperature of LD chip and fluorescent conversion material;

[0108] S4: If the measured temperature reaches the temperature threshold, the operation stops and an error message is sent to the mobile terminal, which is also displayed on the display screen.

[0109] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:

[0110] 1. The embodiment of the present application provides a laser light source module and control system, which solves the technical problem of the easy damage of the fluorescent conversion material under high-power excitation in the prior art, and achieves the technical effect of stable excitation of high-power LD. Among them, under 120W blue laser excitation, the temperature of the entire laser light source module can be controlled within 120-140 degrees Celsius for stable excitation, while if no heat dissipation measures are taken, the fluorescent conversion material will be quenched or broken due to excessive temperature.

[0111] 2. The embodiment of the present application provides a laser light source module and a control system to solve the technical problem that the installation of a heat dissipation module for the transmission-type excited fluorescent conversion material may affect the excitation effect, and achieves the technical effect of independently dissipating the heat of the transmission-type excited fluorescent conversion material.

[0112] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0113] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0114] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0115] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0116] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0117] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A laser light source module, comprising: base(2); An LD chip (1), wherein the LD chip (1) is located at the center of a surface of one side of the substrate (2); A first heat dissipation device (3), the first heat dissipation device (3) being generally cylindrical and connected to the other side surface of the substrate (2); A second heat sink (5), the second heat sink (5) is generally in the form of a cylinder, a rectangular parallelepiped protrusion extends from the cylinder but the internal space is not directly connected, the bottom surface area of ​​the cylinder is set corresponding to the first heat sink (3), the second heat sink (5) is connected to the first heat sink (3) at one side of the substrate (2) and the chip (1), and liquid can flow inside; A fluorescent conversion material (4), wherein the fluorescent conversion material (4) is arranged inside the second heat dissipation device (5) parallel to the bottom surface of the second heat dissipation device (5), with a certain space left on both sides; A telescopic structure (7) with a self-locking function, wherein the telescopic structure (7) with a self-locking function is generally in the form of a cylinder, connected to the second heat sink (5), and the bottom surface is arranged corresponding to the bottom surface of the second heat sink (5); The processor (6) is a rectangular parallelepiped structure extending from the telescopic device (7), and has the same shape and size as the rectangular parallelepiped protruding portion of the second heat dissipation device (2). A lampshade (8), wherein a high-reflective coating (81) is provided inside the lampshade (8); The heat of the fluorescent conversion material (4) is dissipated by the liquid flowing in the second heat dissipation device (5).

2. A laser light source module as claimed in claim 1, characterized in that: The side of the LD chip (1) and the substrate (2) connected to the second heat sink (5) should be provided with a high-transmittance waterproof coating.

3. The laser light source module according to claim 1, wherein the second heat dissipation device comprises: Cylindrical housing (54); Holes (55), there are two holes (55), which are located on the same diameter of the bottom surface of the cylindrical shell (54); A water tank (51), wherein the water tank (51) is formed by a rectangular parallelepiped shell extending from a cylindrical shell (54), wherein a plurality of fish-scale-shaped thin metal sheets protruding from the interior of the water tank (51) are provided, and wherein a filtering device is provided inside the water tank (51); A pipe (52), wherein the pipe (52) connects the water tank (51) and the cylindrical shell (54), and the size of the hole is set corresponding to the hole (55); A water pump (53), wherein the water pump (53) is located on the side where the pipeline (52) is connected to the water tank (51). A refrigeration device (56), wherein the refrigeration device (56) is located on the inner side of a rectangular surface of the water tank.

4. The laser light source module according to claim 1, wherein the telescopic structure (7) with a self-locking function comprises: A first telescopic structure (71), wherein the first telescopic structure (71) is a cylindrical shell, a rectangular parallelepiped protrusion (711) is provided on the shell, and a convex-planar lens (712) is fixed inside the shell; The second telescopic structure (72) is a cylindrical shell with a radius slightly larger than that of the first telescopic structure (71), a groove (721) is arranged inside the shell, and a plano-concave lens (722) is arranged inside the shell.

5. The telescopic structure (7) with self-locking function according to claim 4, characterized in that: The size of the groove (721) corresponds to the size of the protrusion (711), so that the protrusion (711) can move inside the groove (721) without being loose. The groove (721) extends inward from the edge of the cylindrical shell of the second telescopic structure (72) until it is large enough to allow the protrusion (711) to completely enter the shell. After extending a semicircular groove along the edge of the cylinder, it extends a certain distance to one side of the plano-concave lens (722).

6. A control system, applicable to a laser light source module according to claims 1 to 5, comprising: Processor (6); A first temperature sensor (61), the first temperature sensor (61) being located between the substrate (2) and the LD chip (1); A second temperature sensor (62), the second temperature sensor being located at an edge of the fluorescence conversion material (4); a third temperature sensor (63), the third temperature sensor being located inside the water tank (51); A display screen (64), wherein the display screen (64) is used to display information.

7. The control system of claim 6, wherein the processor (6) comprises: A first receiving module 601, used for receiving information; A first acquisition module 602 is used to acquire information of a temperature sensor; The first information processing module 603 is used to process information and issue instructions to other modules; A first sending module 604, used to send information to a mobile terminal; The power supply module 605 is used to supply power to the first receiving module 601 , the first acquiring module 602 , the first information processing module 603 , and the first sending module 604 .

8. A control method, applicable to a control system as claimed in claim 6, characterized in that: Receiving a command from a mobile terminal, wherein the command may be an opening command, a closing command, a timing command, or a parameter setting command; If the command is an open command, the laser light source module starts working; if the command is a close command, the laser light source module stops working; if the command is a timing command, it will automatically stop working after a period of time; if the command is a parameter setting command, the corresponding parameter setting will be received; the parameters can be the water pump working speed, cooling efficiency, liquid temperature, and LD chip power.

9. A self-regulating method, applicable to a control system as claimed in claim 6, characterized in that: If there is no special operation, the laser light source module enters the self-adjustment mode when working, which includes: S1: Detect the temperature of LD chip, fluorescent conversion material and liquid in the water tank; S2: Process the corresponding information and calculate the working time of the refrigeration device and the working rate of the water pump; S3: If the water pump and refrigeration device cannot achieve stable working effect, the LD chip power can be slightly adjusted; S4: Repeat the above steps until stopping.

10. An overheat protection method, applicable to a control system as claimed in claim 6, comprising: S1: receiving temperature threshold information from the mobile terminal; S2: light source module works; S3: Detect the real-time temperature of LD chip and fluorescent conversion material; S4: If the measured temperature reaches the temperature threshold, the light source module stops working and sends an error message to the mobile terminal, which is also displayed on the display screen.

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