Light-emitting device detection method and system and computer readable storage medium
The method enhances detection efficiency in Mini LED/Micro LED displays by using optical and appearance detection, neural network-based chip identification, and re-judgment processes to accurately locate and repair defects in light-emitting devices.
Patent Information
- Application Number
- CN202310763390.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-26
- Publication Date
- 2025-01-03
AI Technical Summary
The detection efficiency of Mini LED/Micro LED direct display technology is low due to the need to detect and repair bright spots and dark spots, which are common under high resolution and high contrast, and current methods are inefficient.
A method and system for detecting light-emitting devices that involves obtaining optical detection results, determining position coordinates of optical abnormalities, and aligning a target detection camera to detect these areas, using a neural network model for missing chip detection, and forming abnormality localization images for re-judgment.
Improves detection efficiency by accurately identifying dark spots and missing chips, allowing for precise laser repair and reducing damage to the devices.
Smart Images

Figure CN119246011A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of light-emitting device detection, and in particular to a light-emitting device detection method, system and computer-readable storage medium. Background Art
[0002] Consumers have high requirements for the yield of Mini LED (Mini Light Emitting Diode) / MicroLED (Micro Light Emitting Diode) direct display technology, even up to 99.9999% to 100%. Under high resolution and high contrast, a small amount of bright spots and dark spots will significantly affect the display effect, so it is necessary to detect and repair bright spots or dark spots. However, in the detection process, there are often multiple detection items, and the detection efficiency is low.
[0003] Therefore, how to improve the efficiency of detecting light-emitting devices such as Micro LED backplanes is an urgent problem to be solved. Summary of the invention
[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a light-emitting device detection method, system and computer-readable storage medium, aiming to solve the problem of low light-emitting device detection efficiency.
[0005] A method for detecting a light emitting device, comprising:
[0006] Obtaining optical detection results of the light-emitting device;
[0007] Determining the position coordinates of the optical abnormal area in the light emitting device according to the optical detection result; and
[0008] According to the position coordinates of the optical abnormal area, a target detection camera is controlled to align with the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result.
[0009] The above-mentioned light-emitting device detection method detects the optical condition and appearance of the light-emitting device. The optical detection result of the light-emitting device is first obtained, and the optical detection result is provided to the subsequent steps as a reference. The subsequent steps can be based on the results of the first executed steps to obtain a more efficient and simple execution process, thereby improving the detection efficiency in some implementation processes.
[0010] Optionally, the optical detection result includes a brightness value of the detected area, and the optical abnormal area includes a dark spot area; and controlling a target detection camera to align with the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result includes:
[0011] A missing core detection camera is controlled to align with the dark spot area to perform a missing core detection on the dark spot area to obtain a missing core detection result.
[0012] The above-mentioned light-emitting device detection method can not only detect the dark spot area, but also determine whether the dark spot area is missing a chip, and further refine the detection results, so that in the subsequent repair process, repairs can be performed based on more accurate detection results. In some implementation processes, the efficiency of detection can be improved by first finding the dark spot area and then performing chip missing detection, and performing chip missing detection on the light-emitting device helps the laser repair equipment to accurately determine the area to be laser repaired, avoiding laser scanning of the tested area where no light-emitting chip is set, and reducing the damage to the light-emitting device caused by laser repair.
[0013] Optionally, controlling a missing core detection camera to align with the dark spot area to perform missing core detection on the dark spot area to obtain a missing core detection result includes:
[0014] Acquire a detection image of the dark spot area by using the missing core detection camera;
[0015] The detection image is analyzed by a pre-trained neural network model to output a missing chip detection result; the neural network model is configured to: determine the situation where there is no light-emitting chip in the dark spot area as a missing light-emitting chip, and determine the situation where a complete or incomplete light-emitting chip exists in the dark spot area as a non-missing light-emitting chip.
[0016] The electrodes at the missing light-emitting chip and the incomplete light-emitting chip have very different morphologies and a variety of forms. The pre-trained neural network model can achieve a better judgment effect. The neural network model is configured to judge the presence of a defective light-emitting chip as a non-missing light-emitting chip, which helps the laser repair equipment accurately determine the area to be laser repaired.
[0017] Optionally, the light emitting device detection method further includes:
[0018] forming an abnormality localization image, in which the position of at least one abnormal area is marked and the position coordinates of the abnormal area are associated;
[0019] Acquire a positioning instruction issued based on the abnormal positioning image, and determine the position coordinates of the target abnormal area pointed to by the positioning instruction;
[0020] According to the position coordinates of the target abnormal area, a target detection device is controlled to align with the target abnormal area to perform re-judgment detection.
[0021] By forming an abnormality positioning map and obtaining positioning instructions issued based on the abnormality positioning image, the target abnormal area is found for re-judgment and detection. The re-judgment and detection process is convenient and intuitive, and is easy for technical personnel to operate.
[0022] Based on the same inventive concept, the present application also provides a light emitting device detection system, comprising:
[0023] an optical detection unit, configured to obtain an optical detection result of the light emitting device;
[0024] A coordinate acquisition unit, configured to determine the position coordinates of the optical abnormal area in the light emitting device according to the optical detection result;
[0025] The appearance detection unit is configured to control a target detection camera to align with the optical abnormal area according to the position coordinates of the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result.
[0026] The above-mentioned light-emitting device detection system obtains the optical detection results of the light-emitting device through an optical detection unit, and uses the optical detection results as a reference for appearance detection. The appearance detection step is based on the results of the optical detection performed first to obtain a more efficient and simple execution process, thereby improving the detection efficiency in some implementation processes.
[0027] Optionally, the optical detection unit includes a brightness detection unit, and the brightness detection unit is configured to detect the brightness of the light-emitting device to obtain a brightness detection result;
[0028] The coordinate acquisition unit is configured to determine the position coordinates of the dark spot area in the light emitting device according to the brightness detection result;
[0029] The appearance inspection unit includes a missing core detection unit, and the missing core detection unit is configured to control a missing core detection camera to align with the dark spot area to perform a missing core detection on the dark spot area to obtain a missing core detection result.
[0030] The above-mentioned light-emitting device detection system can not only detect the dark spot area, but also determine whether the chip is missing in the dark spot area, and further refine the detection result, so that in the subsequent repair process, repair can be performed based on more accurate detection results.
[0031] Optionally, the light emitting device detection system further includes at least one of the following units:
[0032] a missing chip full scanning unit, configured to obtain appearance detection images of all detected areas of the light emitting device, and determine the detected area of the missing chip according to the appearance detection images;
[0033] A re-judgment detection unit, the re-judgment detection unit is configured to control a target detection device to align with the target abnormal area for re-judgment detection according to the coordinates of the target abnormal area; the coordinate acquisition unit is further configured to acquire a positioning instruction issued based on the abnormal positioning image, and determine the coordinates of the target abnormal area pointed to by the positioning instruction, wherein the position of at least one abnormal area is marked in the abnormal positioning image and is associated with the position coordinates of the abnormal area;
[0034] The transport unit is configured to transfer the light-emitting device to be tested between other units of the light-emitting device detection system according to a predetermined sequence.
[0035] The above-mentioned light-emitting device detection system may also include a combination of other detection units or handling units, which can meet more detection requirements and provide more detection results in some implementation processes to ensure comprehensive and accurate detection.
[0036] Based on the same inventive concept, the present application also provides a computer-readable storage medium, which stores one or more programs, and the one or more programs can be executed by one or more processors to implement the steps of the light-emitting device detection method as described above.
[0037] The program stored in the above-mentioned computer-readable storage medium can be executed to implement the steps of the above-mentioned light-emitting device detection method. The optical detection results of the light-emitting device are first obtained to provide the optical detection results to subsequent steps as a reference. The subsequent steps can obtain a more efficient and simple execution process based on the results of the first executed steps, thereby improving the detection efficiency in some implementation processes. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 A schematic diagram of the basic flow of the light emitting device detection method provided in an embodiment of the present application;
[0039] Figure 2 A schematic diagram of a process for detecting missing cores provided in an embodiment of the present application;
[0040] Figure 3 A schematic diagram of a light-emitting device provided in an embodiment of the present application with a missing chip;
[0041] Figure 4 A schematic diagram of a defective light-emitting chip provided in an embodiment of the present application;
[0042] Figure 5 A schematic diagram of a process for performing re-judgment detection based on an abnormal positioning image provided in an embodiment of the present application;
[0043] Figure 6 A schematic diagram of an abnormality positioning image provided in an embodiment of the present application;
[0044] Figure 7 A schematic diagram of another abnormality positioning image provided in an embodiment of the present application;
[0045] Figure 8 A schematic structural diagram of a light emitting device detection system provided in another optional embodiment of the present application;
[0046] Fig. 9 Another structural schematic diagram of a light emitting device detection system provided in another optional embodiment of the present application;
[0047] Fig.10 A schematic diagram of the structure of a brightness and chromaticity detection unit provided in another optional embodiment of the present application;
[0048] Fig.11 A schematic diagram of the structure of a drive backplane provided in another optional embodiment of the present application;
[0049] Fig.12 A schematic diagram of the structure of a missing core detection unit provided in another optional embodiment of the present application;
[0050] Fig.13 A schematic diagram of the structure of a re-judgment detection unit provided in another optional embodiment of the present application;
[0051] Description of reference numerals:
[0052] 101-light-emitting chip; 1011-incomplete light-emitting chip; 102-electrode; 103-black spot; 104-hollow circle; 105-driving backplane; 106-LED chip; 107-marking point; 108-pixel area; 200-light-emitting device detection system; 201-optical detection unit; 2011-brightness and chromaticity detection unit; 2012-first needle power supply module; 2013-brightness and chromaticity detection optical system; 2014-first alignment module; 2015-first stage module; 202-coordinate Acquisition unit; 203-appearance inspection unit; 2031-core-missing inspection unit; 2032-main inspection camera; 2033-second alignment module; 2034-autofocus module; 2035-external light source module; 2036-second stage module; 204-core-missing full scanning unit; 205-re-judgment inspection unit; 2051-second needle-piercing power supply module; 2052-third alignment module; 2053-main inspection optical system module; 2054-third stage module; 206-conveying unit; 207-control unit. DETAILED DESCRIPTION
[0053] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.
[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0055] In the related art, it is necessary to detect and repair bright spots or dark spots. However, in the detection process, there are often multiple detection items, and the detection efficiency is low.
[0056] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.
[0057] Example:
[0058] This embodiment provides a method for detecting a light emitting device. Figure 1 The steps include but are not limited to:
[0059] S101, obtaining optical detection results of the light-emitting device;
[0060] S102, determining the position coordinates of the optical abnormal area in the light-emitting device according to the optical detection result;
[0061] S103, according to the position coordinates of the optical abnormal area, controlling a target detection camera to align with the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result;
[0062] In the above-mentioned light-emitting device detection method, the display condition of the light-emitting device is detected, wherein the optical detection results include but are not limited to parameters reflecting the condition of the emitted light, such as brightness, chromaticity, brightness classification, and color coordinates.
[0063] In this embodiment, each light-emitting chip 101 in the light-emitting device can be individually detected. In order to more accurately obtain the optical detection result of the light-emitting chip 101, the surrounding interference light can be excluded during the measurement process, for example, the influence of possible crosstalk caused by other light-emitting chips 101 next to it can be subtracted from the actual measurement value. The detection method includes but is not limited to obtaining the detection image of the corresponding area through optical imaging, and determining the corresponding detection result according to the detection image. For example, the brightness can be determined according to the grayscale value of the pixel corresponding to the light-emitting chip 101 in the detection image. In fact, the measured area can be a solid crystal area for setting the light-emitting chip 101. If the light-emitting chip 101 is set on the measured area, the detected result is the optical detection result of the light-emitting chip 101 set on the measured area. If the light-emitting chip 101 is not set on the measured area (it may be that the light-emitting chip 101 is not successfully transferred or falls off), the measured area will appear as a dark spot. In practical applications, the reasons for the generation of dark spots include at least the absence of the light-emitting chip 101 at that location or the failure of the light-emitting chip 101 at that location to light up normally.
[0064] In the light-emitting device detection method of this embodiment, both the optical condition and the appearance condition of the light-emitting device are detected. In some cases, the normally luminous light-emitting chip 101 usually has a normal appearance, while the tested area with abnormal appearance, such as the area where the light-emitting chip 101 is missing, incomplete, or covered with foreign matter, is likely to have abnormal optical detection results. In order to improve the efficiency of detection, this embodiment first obtains the optical detection results of the light-emitting device, so as to provide the optical detection results to the subsequent steps as a reference, and the subsequent steps can obtain a more efficient and simple execution process based on the results of the first executed steps.
[0065] Since the abnormal appearance may cause the optical detection result to be abnormal, the abnormal appearance of the entire light-emitting device can be detected by simply judging whether there is an abnormal appearance in the optical abnormal area.
[0066] In some embodiments, obtaining an optical detection result of a light-emitting device includes: controlling an optical detection unit to detect optical parameters of a measured area of the light-emitting device; and associating and storing the optical parameters of the measured area with the position coordinates of the measured area to obtain the optical detection result.
[0067] The optical parameters of the measured area and the position coordinates of the measured area are stored in association with each other and can be stored and output in the form of a file (hereinafter referred to as a result file). For example, the result file includes but is not limited to a CSV (Comma-Separated Values) file, an Excel spreadsheet file, etc. The result file stores the position coordinates of each measured area and the optical parameters corresponding to the measured area, and has high readability and is easy to process and modify.
[0068] In practical applications, the results of other tests can be stored separately or combined and stored in the same result file and associated through position coordinates. Exemplarily, the position coordinates of each measured area can be stored in the result file, and the corresponding comprehensive test results can be stored in association with these position coordinates. The storage of the comprehensive test results in the result file can be simply storing the parameters obtained from various tests of the same measured area and associating them with the position coordinates of the measured area, or the test results can be classified in the form of BIN values, etc.
[0069] As an implementation method, the optical detection result includes the brightness value of the measured area, and the optical abnormal area includes a dark spot area; controlling a target detection camera to align with the optical abnormal area to detect the optical abnormal area to obtain the appearance detection result, including: controlling a missing core detection camera to align with the dark spot area to perform a missing core detection on the dark spot area to obtain a missing core detection result. It can be understood that if there is no light-emitting chip 101 on the measured area, the measured area will appear as a dark spot. Therefore, by finding the dark spot area in a targeted manner, the measured area where the light-emitting chip 101 is missing can be efficiently screened out. It can be understood that the dark spot area in the present application is a position that should have emitted light but did not, usually a solid crystal area for setting the light-emitting chip 101. If the transferred light-emitting chip 101 is completely damaged or no light-emitting chip 101 is transferred to the solid crystal area, a dark spot will be formed; for positions where the light-emitting chip 101 should not have been set, such as other positions outside the solid crystal area, these positions will not emit light but are not regarded as dark spot areas. In practical applications, the measured area can be located by means of simulated positioning based on the set arrangement of the light-emitting chips 101 , and the corresponding position coordinates can be determined for the located measured area and associated with the corresponding detection results.
[0070] In the process of controlling the missing chip detection camera to align with the dark spot area, the missing chip detection camera can be controlled to move and address the position of the corresponding dark spot area; or the carrier on which the light-emitting device is placed can be controlled to move and move the dark spot area on the light-emitting device to the position corresponding to the imaging unit in the missing chip detection equipment; or both the missing chip detection camera and the carrier can be moved to cooperate to achieve alignment.
[0071] In some embodiments, the brightness value can be judged by threshold value to determine abnormalities such as bright spots and dark spots. As an embodiment, the position coordinates of the optical abnormal area in the light-emitting device are determined according to the optical detection results, including: obtaining the position coordinates corresponding to the measured area with a brightness value lower than the set threshold as the position coordinates of the dark spot area. For example, if the brightness value of the measured area is higher than the threshold of the corresponding bright spot, the measured area is a bright spot area. Optical parameters such as brightness value are associated with the position coordinates of the measured area. It is only necessary to find the measured area whose brightness meets the conditions, and the coordinate position of the measured area can be determined by associative storage. For example, taking an Excel spreadsheet file as an example, the optical parameters and coordinate positions of the same measured area are stored in the same row of the table. When a measured area with a brightness value lower than the set threshold is found, the coordinate position is obtained from the same row as the coordinate position of the dark spot area. The CSV file is similar, and the optical parameters and coordinate position of the same measured area can also be stored in the same row.
[0072] The method of performing chip missing detection may include but is not limited to obtaining a detection image of the measured area by optical imaging or other methods, and judging whether the measured area is provided with a light-emitting chip 101 based on the content of the detection image. The detection image may be a black and white image or a color image, and may be imaged using a black and white / color camera accordingly, without limitation. In order to better achieve better imaging effects, an external light source may be provided to illuminate the measured area. The external light source may use an annular light or a coaxial light to provide more uniform illumination than a traditional light source, and avoid reflections from the light-emitting device, thereby improving the accuracy and reproducibility of imaging. In some embodiments, other imaging methods that can reflect the appearance and morphological characteristics of the measured area may also be used to obtain the detection image.
[0073] In the above implementation, not only can the dark spot area be detected, but also a judgment can be made as to whether a chip is missing in the dark spot area, and the detection result can be further refined, so that in the subsequent repair process, it can be carried out based on more accurate detection results. In some implementation processes, this can enable the laser repair equipment to accurately locate the area to be repaired, avoid laser scanning of the detected area where the light-emitting chip 101 is not set, and reduce the damage of the laser repair to the light-emitting device.
[0074] As another embodiment, the optical detection result includes a brightness value, and the optical abnormal area may include an area with low brightness; controlling a target detection camera to locate to the optical abnormal area to detect the optical abnormal area to obtain the appearance detection result, including: controlling a detection camera to align with the area with low brightness to detect the area with low brightness to determine whether there is foreign matter covering the light-emitting chip 101. It can be understood that if there is foreign matter covering the light-emitting chip 101, its brightness will be weakened. Therefore, targeted positioning to the area with low brightness can efficiently screen out the light-emitting chip 101 that may be covered by foreign matter. Similarly, for other appearance abnormalities that may affect the optical detection results, detection based on the corresponding optical abnormal area can achieve higher detection efficiency. It can be seen that the detection of appearance abnormalities corresponding to other optical detection abnormalities is similar to the idea of dark spot area and core missing detection in the dark spot area. It is not repeated one by one in this embodiment. In this embodiment, the dark spot area and core missing detection in the dark spot area are mainly explained.
[0075] In order to more accurately detect the abnormality in the light-emitting device, a method of controlling a target detection camera to align with the optical abnormal area to detect the optical abnormal area to obtain the appearance detection result includes using a neural network model to recognize the image collected by the target detection camera. It can be understood that the neural network model is pre-trained and can be learned through a neural network learning algorithm. In actual application, the neural network model can also be repeatedly trained or the parameters can be adjusted according to actual conditions.
[0076] Considering that the electrode 102 at the missing light emitting chip 101 and the incomplete light emitting chip 1011 have great differences in morphology and a variety of morphologies, in order to ensure accurate detection of whether the light emitting chip 101 is missing, see Figure 2 In some embodiments, controlling a missing core detection camera to align with a dark spot area to perform missing core detection on the dark spot area to obtain a missing core detection result includes:
[0077] S201, obtaining a detection image of a dark spot area through a chip-missing detection camera;
[0078] S202, analyzing the detection image through a pre-trained neural network model to output a chip shortage detection result;
[0079] The neural network model in this embodiment is configured to: determine that the light emitting chip 101 is missing when there is no light emitting chip 101 in the dark spot area, and determine that the light emitting chip 101 is not missing when there is a complete or incomplete light emitting chip 1011 in the dark spot area. Figure 3As shown, the missing chip referred to in this application is the corresponding tested area where no light-emitting chip 101 is transferred. At this time, the corresponding tested area in the detection image presents the form of the electrode 102 used to bond the light-emitting chip 101. Figure 4 As shown, in some cases there may be defective light-emitting chips 1011, and some defective light-emitting chips 1011 cannot be illuminated, and dark spot areas will also be formed. However, in this embodiment, the presence of defective light-emitting chips 1011 should not be judged as missing light-emitting chips 101, which can distinguish the presence of defective light-emitting chips 1011 from the complete lack of light-emitting chips 101 in the subsequent repair process. For the tested area where the light-emitting chip 101 is completely missing, laser repair and other processes can be accurately avoided, and for the tested area where the defective light-emitting chip 1011 exists, the defective light-emitting chip 1011 can be removed by laser repair and other processes before repair. It can be understood that in order to achieve the above effect, when pre-training the neural network model, a corresponding training set can be provided for the neural network model to learn, and the training set distinguishes and marks the situations of completely missing light-emitting chips 101, the presence of defective light-emitting chips 1011, and the presence of complete light-emitting chips 101.
[0080] In some embodiments, see Figure 5 , the light emitting device detection method further includes:
[0081] S301, forming an abnormality localization image, in which the position of at least one abnormal area is marked and the position coordinates of the abnormal area are associated;
[0082] S302, obtaining a positioning instruction issued based on the abnormal positioning image, and determining the position coordinates of the target abnormal area pointed to by the positioning instruction;
[0083] S303, according to the position coordinates of the target abnormal area, controlling a target detection device to align with the target abnormal area to perform re-judgment detection;
[0084] The abnormal area marked in the abnormal positioning image can be an area with optical detection abnormalities such as a dark spot area, a bright spot area, and a chromaticity abnormality area, or an area with appearance detection abnormalities such as a missing core area. The abnormal positioning image can use text, patterns, etc. to mark the abnormal area, and there is no restriction on this. In some examples, the position distribution of each abnormal area marked in the abnormal positioning image in the abnormal positioning image corresponds to the actual position relationship. In the abnormal positioning image, the marked position of each abnormal area can be consistent with the proportion of the actual position, or it may not be strictly in accordance with the actual proportion, and only reflect the relative position relationship.
[0085] For different abnormalities, abnormality localization images can be formed respectively. For example, after obtaining the optical detection results, a corresponding optical abnormality localization image is formed, in which areas such as brightness abnormalities and chromaticity abnormalities are marked; after obtaining the appearance detection results, a corresponding appearance abnormality localization image is formed, in which areas such as missing chips and defective light-emitting chips 1011 are marked.
[0086] As an example, see Figure 6 As shown, Figure 6 The abnormality positioning image used in the example adopts a solid color background. In this example, the area with abnormal brightness and chromaticity is marked with a black dot 103. In this example, each area with abnormal brightness and chromaticity is marked according to the proportion of the actual position. Through the abnormality positioning image, the distribution of each area with abnormal brightness and chromaticity in the overall light-emitting device can be intuitively seen.
[0087] The abnormality localization image can also be used to represent the comprehensive detection results of each tested area. For example, corresponding to different abnormal situations, the abnormal area can be marked in different ways, and various states can be marked in the same abnormality localization image.
[0088] As an example, this example distinguishes different abnormal areas. Figure 7 As shown, the abnormality positioning image uses a solid color background; the dark spot area is marked with a black dot 103; the bright spot area is marked with a hollow circle 104. This example displays multiple abnormal areas through a single abnormality positioning image, which can intuitively distinguish different states and understand the distribution of various abnormalities, which is conducive to improving the viewing and processing efficiency of the detection results. In some examples, different states can also be distinguished by different colors, for example, red dots represent dark spots and yellow dots represent bright spots.
[0089] In this embodiment, subsequent re-inspection can be performed based on the previously formed abnormality positioning image. For example, in some implementations, according to the marking of the dark spot area in the abnormality positioning image, the position coordinates of the dark spot area are determined and the missing core detection camera in the re-inspection detection unit is controlled to align with the dark spot area to perform missing core re-inspection.
[0090] In this example, the relative position of the target detection device and the light-emitting device under test can be controlled based on the abnormal positioning image, and the positioning instruction can be manually issued by the technician. The control performed by the technician through the abnormal positioning image is more intuitive and accurate. The way in which the technician manually issues the positioning instruction includes but is not limited to directly clicking, long pressing, and other operations on the abnormal positioning image. For example, if the user clicks on an abnormal area on the abnormal positioning image, a positioning instruction pointing to the abnormal area (that is, the abnormal area is selected as the target abnormal area) is generated; at this time, the position coordinates of the target abnormal area clicked by the user are obtained, and based on the position coordinates, the target detection device can be controlled to align with the target abnormal area. It can be understood that in the process of controlling the alignment of the target detection device with the target abnormal area, it can be to control the movement of the target detection device, or it can be to control the movement of the carrier on which the light-emitting device is placed, or both.
[0091] According to the type of abnormal area that needs to be re-judged, the target detection device can be a brightness detection device, a missing core detection device or other detection device. As an example, the light-emitting device repair method also includes re-judgment detection of the abnormal area. The re-judgment detection can be performed automatically, such as automatically finding the abnormal area for repeated judgment, or it can be manually re-judged. For example, for re-judgment detection that requires manual intervention, the technician can issue a positioning instruction by selecting the abnormal area to be re-judged on the abnormal positioning image, then control a target detection device to align with the target abnormal area, collect the image or other data of the target abnormal area through the target detection device for manual re-judgment, and accept the re-judgment result input by the technician. The re-judgment process is convenient and intuitive. The results of the re-judgment include but are not limited to confirmation or correction of the original detection results, and can also be further judged on the basis of the original detection results. For example, the present embodiment mentions that further judgment is made on whether there is an abnormality in the appearance based on the optical detection results, so that the abnormal situation can be classified more accurately. The scope of re-judgment can include all abnormal areas, or only some of the abnormal areas can be spot-checked or abnormal areas that are prone to misjudgment can be checked.
[0092] In some implementations, the comprehensive detection results of each tested area can also be determined based on the various detection results. The comprehensive detection results can be the corresponding BIN values determined by comprehensively determining the optical / appearance detection results. For the same tested area, it corresponds to optical detection results and appearance detection results. In some implementation processes, there may be other detection results. The various detection results of the tested area are combined together to determine the corresponding BIN value. Exemplarily, for the tested area with normal detection, it can be determined as BIN1; for the tested area with abnormal brightness and chromaticity detection but no missing chip, it can be determined as BIN2; for the tested area with missing chips, it can be determined as BIN3. For each type (such as different brightness and chromaticity abnormalities) or each category (such as the aforementioned example, all brightness and chromaticity abnormalities are classified into the same category) of abnormal situations, they correspond to a BIN value, and the corresponding abnormality can be determined by the BIN value. The specific BIN value division can be determined according to the actual situation, and the application is not limited. As another example, the comprehensive detection result can also be a simple superposition of various detection results, such as storing multiple detection results in association with the same tested area in the same file.
[0093] After the detection is completed, the light-emitting device can be repaired by a laser repair device. As an example, the position coordinates of the measured area and the corresponding test results are provided to the laser repair device, so that the laser repair device can determine the position coordinates of the target chip that needs to be repaired based on the test results. Exemplarily, the position coordinates of the measured area and the corresponding test results can be provided to the laser repair device in the form of a file, and the laser repair device can determine the detection status of each measured area by itself based on the received file. As an example, the position coordinates and the comprehensive test results of the measured area are stored in association in the file. The laser repair device searches the file for the position of the light-emitting chip 101 with a predetermined abnormality. According to the comprehensive test results, the abnormality corresponding to each measured area can be determined. When it is detected that the abnormality is a measured area where there is no missing chip but the brightness and chromaticity test result is a predetermined abnormality, it can be determined that the light-emitting chip 101 here is the target chip. Taking the comprehensive result in the form of BIN value as an example, when the BIN value corresponding to the position coordinates of a measured area is BIN2 (brightness and chromaticity detection abnormality but no missing chip), it can be determined that the light-emitting chip 101 at the position coordinates is the target chip that needs to be repaired; if the BIN value corresponding to the position coordinates of a measured area is BIN3 (missing chip), it does not belong to the predetermined abnormal situation, and it will not be determined that there is a target chip in the measured area. When performing laser scanning, the laser repair equipment will directly skip the measured area with the corresponding BIN value of BIN3 to prevent the laser from damaging the light-emitting device.
[0094] In the above example, the position coordinates of the complete measured area and the corresponding test results can be provided to the laser repair device, and the laser repair device can identify and control the position that needs laser repair, which is conducive to more refined laser repair control in some implementation processes. In other examples, a pre-screening method can also be used to extract the position coordinates of the target chip that needs to be repaired separately. When providing data to the laser repair device, only information corresponding to the target chip is provided, such as the position coordinates of the target chip, so that the laser repair device can skip the area outside the target chip during the laser repair process. In this way, in some implementation processes, it can be compatible with traditional laser repair equipment and reduce the complexity of the system.
[0095] In the light-emitting device detection method of this embodiment, the optical detection result of the light-emitting device is first obtained to provide the optical detection result to the subsequent steps as a reference. The subsequent steps can be based on the results of the first executed steps to obtain a more efficient and simple execution process. In some examples, a pre-trained neural network model is used to judge the missing chip, and the presence of a complete or incomplete light-emitting chip 1011 is judged as the light-emitting chip 101 is not missing, so that the subsequent repair process can accurately determine the area that needs to be repaired.
[0096] Another optional embodiment of the present application:
[0097] This embodiment provides a light emitting device detection system 200, see Figure 8 As shown, it includes but is not limited to an optical detection unit 201, a coordinate acquisition unit 202, and an appearance detection unit 203. The optical detection unit 201 is configured to acquire an optical detection result of the light-emitting device; the coordinate acquisition unit 202 is configured to determine the position coordinates of an optical abnormal area in the light-emitting device according to the optical detection result; and the appearance detection unit 203 is configured to control a target detection camera to align with the optical abnormal area according to the position coordinates of the optical abnormal area to detect the optical abnormal area and obtain an appearance detection result.
[0098] In this embodiment, the optical detection unit 201 may include a brightness detection unit, which is configured to detect the brightness of the light-emitting device to obtain a brightness detection result. The coordinate acquisition unit 202 is configured to determine the position coordinates of the dark spot area in the light-emitting device according to the brightness detection result. The appearance detection unit 203 includes a missing core detection unit 2031, which is configured to control a missing core detection camera to align with the dark spot area according to the position coordinates of the dark spot area to perform missing core detection on the dark spot area to obtain a missing core detection result.
[0099] The light emitting device detection system 200 in this embodiment may further include at least one of the following units:
[0100] The missing chip full scanning unit 204 is configured to obtain appearance inspection images of all the inspected areas of the light emitting device, and determine the inspected area of the missing chip according to the appearance inspection images;
[0101] The re-judgment detection unit 205 is configured to control a target detection device to align with the target abnormal area for re-judgment detection according to the coordinates of the target abnormal area; the coordinate acquisition unit 202 is also configured to acquire a positioning instruction issued based on the abnormal positioning image, and determine the coordinates of the target abnormal area pointed to by the positioning instruction, wherein the position of at least one abnormal area is marked in the abnormal positioning image and is associated with the position coordinates of the abnormal area;
[0102] The transport unit 206 is configured to transfer the light-emitting devices to be tested between other units of the light-emitting device detection system 200 according to a predetermined sequence.
[0103] For better understanding, the following example of this embodiment will further illustrate the light emitting device detection system 200 in combination with a specific light emitting device detection process.
[0104] See also Fig. 9 As shown, the light emitting device detection system 200 of this example includes but is not limited to a brightness detection unit 2011, a coordinate acquisition unit 202, a missing core detection unit 2031, a missing core full scanning unit 204, a re-judgment detection unit 205, a transport unit 206 and a control unit 207.
[0105] The transport unit 206 of this example may include but is not limited to a mechanical arm, a conveyor belt, or other devices that can transfer the light-emitting device to be detected back and forth between various units. The physical location of each of the above units can be arbitrary, but in order to improve the overall work efficiency, the corresponding units can be arranged in sequence according to the order corresponding to the steps of the predetermined detection process, so as to facilitate the transport unit 206 to transport and reduce the distance that the light-emitting device moves each time. It can be understood that the various units in the above-mentioned light-emitting device detection system 200 do not necessarily correspond to the division of physical components. For example, the coordinate acquisition unit 202 can be in the same physical device as the control unit 207; or the coordinate acquisition unit 202 can be dispersed in multiple detection units. The light-emitting device does not need to be transported to each of the above-mentioned units, for example, the light-emitting device does not need to be transported to the control unit 207; therefore, when the light-emitting device needs to be transferred between different units of the physical division, the transport unit 206 will transport the light-emitting device.
[0106] The control unit 207 can be a terminal device or processor such as a personal computer, which is connected to the coordinate acquisition unit 202, the brightness detection unit 2011, the missing core detection unit 2031, the missing core full scanning unit 204, the re-judgment detection unit 205 and the transport unit 206, and can uniformly control each unit and receive the detection results. In some implementations, the control unit 207 can also fuse the received detection results to obtain a comprehensive detection result, for example, determining the corresponding BIN value based on the detection results of each detected area. The control unit 207 can also perform other data processing or control as needed. In some examples, each other unit can also perform simple data processing or control, which is not limited in this embodiment.
[0107] See also Fig.10 The light-emitting device in this example is a driving backplane 105, on which a plurality of LED (Light Emitting Diode) chips 106 are transferred; the brightness and chromaticity detection unit 2011 includes but is not limited to a first needle-piercing power supply module 2012, a brightness and chromaticity detection optical system 2013 (which may include but is not limited to at least one of a colorimeter, a luminance meter, a camera, a spectrometer and the like), a first alignment module 2014 and a first carrier module 2015.
[0108] The first carrier module 2015 can be configured to be able to move in four-axis directions of X, Y, Z, and θ; in another example, the first carrier module 2015 can also be configured to move in three directions of X, Y, and θ, and the movement of the Z axis is bound to the brightness and chromaticity detection optical system 2013.
[0109] When the driving back plate 105 is placed on the first stage module 2015, it can be precisely aligned by the first alignment module 2014. Fig.11 In this example, the driving back plate 105 is provided with a marking point 107, and the first alignment module 2014 can identify the marking point 107 on the driving back plate 105, and accurately align the position with the help of the marking point 107. The driving back plate 105 on the first stage module 2015 can be powered by the first needle power supply module 2012, and then the detection image is obtained through the brightness and color detection optical system 2013. Fig.11In the example, the acquired detection image includes multiple pixel areas 108, and the acquired detection image includes but is not limited to the image when a single color is lit and the image when all colors are lit. According to the detection image, the optical detection parameters such as the brightness value and chromaticity of a single LED chip 106 can be extracted and output, and the optical detection parameters obtained by the detection are associated with the corresponding position coordinates. In practical applications, bright spots and dark spots can be determined by setting thresholds. When the brightness value is higher than the bright spot threshold, the corresponding LED chip 106 is determined to be a bright spot chip, and when the brightness value is lower than the dark spot threshold, the corresponding position is determined to be a dark spot area. For the case of bright spots and dark spots, an abnormal positioning image can be formed separately, in which the bright spots and dark spots are marked at the corresponding positions by different marks; a CSV file can also be output, in which the optical detection parameters and position coordinates corresponding to the bright spots and dark spots are saved.
[0110] See also Fig.12 , the missing chip detection unit 2031 includes but is not limited to the main inspection camera 2032, the second alignment module 2033, the autofocus module 2034, the external light source module 2035 (providing annular light or coaxial light) and the second stage module 2036. Similar to the first stage module 2015 of the brightness and chromaticity detection unit 2011, the second stage module 2036 of the missing chip detection unit 2031 can also be configured to move in the four-axis directions of X, Y, Z, and θ, or the second stage module 2036 moves in the three directions of X, Y, and θ, and the movement of the Z axis is bound to the main inspection camera 2032. The missing chip detection unit 2031 performs optical imaging by means of the main inspection camera 2032 and the external light source, and then identifies whether there is a missing chip in the tested area through the neural network model trained by the neural network learning algorithm. In this example, the detection rate of the neural network model is required to be greater than 99.9%, and the over-inspection rate is less than 0.001%; in actual applications, it can be adjusted according to needs, and the specific parameters of the neural network model can also be adjusted according to actual conditions. For example, the coordinate acquisition unit 202 can also call the CSV file or abnormal positioning image obtained by the brightness and chromaticity detection unit 2011, which records the brightness and chromaticity detection results of each LED chip 106, and identify the position coordinates of the dark spot area. The missing chip detection unit 2031 controls the main inspection camera 2032 to find the position of the dark spot area to obtain the corresponding image. In this example, the detection of brightness and chromaticity and whether the chip is missing can facilitate subsequent laser repair. If the abnormal area where the LED chip 106 is set does not emit light, it is necessary to remove the bad LED chip 106 by laser. Some abnormal areas do not emit light because the LED chip 106 is missing there. In this case, laser scanning is no longer used for these abnormal areas where the LED chip 106 is missing to prevent damage to the driver backplane 105.
[0111] The structure of the missing chip full scanning unit 204 is similar to that of the missing chip detection unit 2031 , and the missing chip full scanning unit 204 can image all the detected areas of the light-emitting device.
[0112] like Fig.13 The re-judgment detection unit 205 of this example may include but is not limited to a second needle-piercing power supply module 2051, a third alignment module 2052, a main inspection optical system module 2053, and a third stage module 2054. The movement of the main inspection optical system module 2053 and the third stage module 2054 may refer to the form in the aforementioned missing core detection unit 2031 or the brightness and chromaticity detection unit 2011. In this example, the coordinate acquisition unit 202 may determine the coordinates of the target abnormal area pointed to by the positioning instruction by acquiring the positioning instruction issued based on the abnormal positioning image, and the re-judgment detection unit 205 controls the main inspection optical system module 2053 to align with the target abnormal area according to the coordinates of the target abnormal area with the assistance of the third alignment module 2052. The re-judgment detection unit 205 may provide the detection image acquired by the main inspection optical system module 2053 to the technician, and receive the detection data fed back by the technician.
[0113] After completing various tests, the test results obtained by each unit can be integrated through the control unit 207. The test results of the same position coordinates can be merged to output a final CSV file. The CSV file uses BIN values or other methods to represent the test results (normal, dark spots, bright spots, missing chips, etc.) of each tested area; in some examples, an abnormality positioning image that combines multiple test results can also be output, in which different test results are distinguished and marked with different colors or graphics, etc., so that the overall quality and abnormal distribution of the driver backplane 105 can be intuitively seen.
[0114] When repairing the light-emitting device, the position coordinates and the corresponding BIN values of the measured area obtained by the light-emitting device detection system 200 can be provided to the laser repair unit. The BIN value indicates that the measured area has abnormal brightness but no missing chips, and the target LED chip needs to be removed by laser. If the BIN value indicates a missing chip in the measured area, it can be directly skipped without laser scanning to prevent damage to the driver backplane 105.
[0115] The light-emitting device detection system 200 of this example first obtains the optical detection parameters such as brightness and chromaticity of the light-emitting device through the brightness and chromaticity detection unit 2011, then finds the dark spot area, controls a missing chip detection unit 2031 to detect whether there is a missing chip in the dark spot area, and obtains the missing chip detection result, which improves the efficiency of missing chip detection in some implementation processes. In addition, the missing chip detection unit 2031 can identify whether there is a missing chip in the tested area through a neural network model, and can also achieve better judgment results in the face of complex morphologies and chip defect types. In some implementation processes, it can achieve higher accuracy than traditional AOI (Automated Optical Inspection) technology.
[0116] The present embodiment also provides a computer-readable storage medium, which includes volatile or non-volatile, removable or non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, computer program modules or other data). Computer-readable storage media include, but are not limited to, RAM (Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable read only memory), flash memory or other memory technology, CD-ROM (Compact Disc Read-Only Memory), digital versatile disk (DVD) or other optical disk storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage device, or any other medium that can be used to store desired information and can be accessed by a computer.
[0117] The computer-readable storage medium in this embodiment can be used to store one or more computer programs, and the one or more computer programs stored therein can be executed by a processor to implement at least one step of the above-mentioned light-emitting device detection method.
[0118] It can be seen that those skilled in the art should understand that all or some of the steps, systems, and functional modules / units in the above disclosed methods can be implemented as software (which can be implemented with computer program code executable by a computing device), firmware, hardware, and appropriate combinations thereof. In hardware implementations, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component can have multiple functions, or a function or step can be performed by several physical components in cooperation. Some or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit.
[0119] The light-emitting device in the present application includes but is not limited to a display panel and a driving backplane 105 for display. When the light-emitting device is used for display, it can be a direct display device, a backlight device, or a projection device; and the light-emitting device can also be a light-emitting panel or other device that uses a light-emitting chip 101 as a light source. The light-emitting chip 101 can be but is not limited to an ordinary LED chip, a Mini LED chip, a Micro LED chip, and an OLED (Organic Light-Emitting Diode) chip.
[0120] In addition, it is well known to those skilled in the art that communication media generally contain computer readable instructions, data structures, computer program modules or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery media. Therefore, the present application is not limited to any specific hardware and software combination.
[0121] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.
Claims
1. A light emitting device detection method, characterized in that: include: Obtaining optical detection results of the light-emitting device; Determining the position coordinates of the optical abnormal area in the light emitting device according to the optical detection result; as well as According to the position coordinates of the optical abnormal area, a target detection camera is controlled to align with the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result.
2. The light emitting device detection method according to claim 1, characterized in that: The step of obtaining the optical detection result of the light emitting device comprises: Controlling an optical detection unit to detect optical parameters of a detected area of the light emitting device; The optical parameters of the measured area are associated with the position coordinates of the measured area and stored to obtain the optical detection result.
3. The light emitting device detection method according to claim 1, characterized in that: The optical detection result includes a brightness value of the detected area, and the optical abnormal area includes a dark spot area; and controlling a target detection camera to align with the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result includes: A missing core detection camera is controlled to align with the dark spot area to perform a missing core detection on the dark spot area to obtain a missing core detection result.
4. The light emitting device detection method according to claim 3, characterized in that: The step of determining the position coordinates of the optical abnormal area in the light emitting device according to the optical detection result includes: The position coordinates corresponding to the measured area whose brightness value is lower than the set threshold are used as the position coordinates of the dark spot area.
5. The light emitting device detection method according to claim 3, characterized in that: The controlling a missing core detection camera to align with the dark spot area to perform missing core detection on the dark spot area to obtain a missing core detection result includes: Acquire a detection image of the dark spot area by using the missing core detection camera; The detection image is analyzed by a pre-trained neural network model to output a missing chip detection result; the neural network model is configured to: determine the situation where there is no light-emitting chip in the dark spot area as a missing light-emitting chip, and determine the situation where a complete or incomplete light-emitting chip exists in the dark spot area as a non-missing light-emitting chip.
6. The light emitting device detection method according to claim 1, characterized in that: The light emitting device detection method further comprises: forming an abnormality localization image, in which the position of at least one abnormal area is marked and the position coordinates of the abnormal area are associated; Acquire a positioning instruction issued based on the abnormal positioning image, and determine the position coordinates of the target abnormal area pointed to by the positioning instruction; According to the position coordinates of the target abnormal area, a target detection device is controlled to align with the target abnormal area to perform re-judgment detection.
7. A light emitting device detection system, characterized in that: include: an optical detection unit, configured to obtain an optical detection result of the light emitting device; A coordinate acquisition unit, configured to determine the position coordinates of the optical abnormal area in the light emitting device according to the optical detection result; The appearance detection unit is configured to control a target detection camera to align with the optical abnormal area according to the position coordinates of the optical abnormal area to detect the optical abnormal area to obtain an appearance detection result.
8. The light emitting device detection system according to claim 7, characterized in that: The optical detection unit includes a brightness detection unit, and the brightness detection unit is configured to detect the brightness of the light emitting device to obtain a brightness detection result; The coordinate acquisition unit is configured to determine the position coordinates of the dark spot area in the light emitting device according to the brightness detection result; The appearance inspection unit includes a missing core detection unit, which is configured to control a missing core detection camera to align with the dark spot area according to the position coordinates of the dark spot area to perform a missing core detection on the dark spot area to obtain a missing core detection result.
9. The light emitting device detection system according to claim 7, characterized in that: The light emitting device detection system further comprises at least one of the following units: a missing chip full scanning unit, configured to obtain appearance detection images of all detected areas of the light emitting device, and determine the detected area of the missing chip according to the appearance detection images; A re-judgment detection unit, the re-judgment detection unit is configured to control a target detection device to align with the target abnormal area for re-judgment detection according to the coordinates of the target abnormal area; the coordinate acquisition unit is further configured to acquire a positioning instruction issued based on the abnormal positioning image, and determine the coordinates of the target abnormal area pointed to by the positioning instruction, wherein the position of at least one abnormal area is marked in the abnormal positioning image and is associated with the position coordinates of the abnormal area; The transport unit is configured to transfer the light-emitting device to be tested between other units of the light-emitting device detection system according to a predetermined sequence.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the steps of the light-emitting device detection method according to any one of claims 1 to 6.
