Backlight module and its fixing structure for Mini LED

Abstract

The present invention discloses a backlight module for Mini LED and a fixing structure thereof, the backlight module comprising: a backlight source, a base, a light guide plate and an optical film, a receiving cavity is provided in the base, an inner arch platform is provided inside the receiving cavity, and a recessed structure is formed on the bottom surface of the base, and a plurality of convex ribs are provided at the recessed structure. The backlight source comprises a substrate plate and a plurality of LED lamp beads, and the substrate plate is fitted with the inner arch platform. The light guide plate and the optical film are stacked on the LED lamp beads of the backlight source. The module fixing structure also comprises: a first inner bracket, a second inner bracket, an outer frame and a positioning plug, the first inner bracket and the second inner bracket are both slidably provided in the receiving cavity, and the two slide close to each other to clamp the light guide plate and the optical film. The backlight module and the fixing structure thereof of the present invention can improve the overall heat dissipation capacity, and facilitate the installation and disassembly operations of the backlight module, thereby improving product quality and extending its service life.

Description

Technical Field

[0001] The present invention relates to the technical field of backlight modules, and in particular to a backlight module for Mini LED and a fixing structure thereof. Background Art

[0002] The backlight module is one of the key components of the LCD panel. Its function is to supply sufficient brightness and evenly distributed light sources so that the LCD can display images normally. In the past, the lamp beads of traditional backlight modules were relatively large and few in number, which resulted in larger gaps between the lamp beads, which easily caused problems such as uneven backlight and dark corners. At the same time, the small number of light control zones resulted in insufficient light control and prone to halo problems. With the development and progress of science and technology, the existing backlight modules can make the lamp beads smaller and denser, thereby improving the uniformity of the backlight and increasing the number of light control zones. These tiny lamp beads are called Mini LED. The application of Mini LED backlight modules can actually improve the picture quality of LCDs and reduce the halo phenomenon.

[0003] However, the existing Mini LED backlight module still has the following defects: on the one hand, the heat dissipation capacity of the backlight module is insufficient. The LED will generate a lot of heat when working, and the heat needs to be discharged in time. The arrangement of Mini LED is relatively dense, resulting in poor overall heat dissipation performance of the backlight module, affecting the working life of Mini LED; on the other hand, the backlight module is inconvenient to install and disassemble. It is easy to cause the optical film to bulge during installation, and it is easy to cause the optical film to wrinkle or break during disassembly and maintenance, affecting its service life.

[0004] To this end, the present invention designs a backlight module for Mini LED and a fixing structure thereof to solve the above-mentioned technical problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a backlight module for Mini LED and a fixing structure thereof, which can improve the overall heat dissipation capacity and facilitate the installation and disassembly operations of the backlight module, thereby improving product quality and extending its service life.

[0006] The objective of the present invention is achieved through the following technical solutions:

[0007] A backlight module for Mini LED, comprising: a backlight source, a base, a light guide plate and an optical film, wherein a receiving cavity is provided in the base, and the backlight source is installed in the receiving cavity;

[0008] An inner arch platform is provided inside the accommodating cavity of the base, and a concave structure is formed at a corresponding position of the bottom surface of the base, and a plurality of convex ribs are provided at the concave structure; the backlight source includes a substrate plate and a plurality of LED lamp beads arranged on the substrate plate, the substrate plate is fitted with the inner arch platform, and the LED lamp beads face the opening direction of the accommodating cavity;

[0009] The light guide plate and the optical film are stacked on the LED lamp beads of the backlight source.

[0010] In one embodiment, the base is an aluminum-based material structure, and insulating thermal conductive silicone grease is provided between the inner arch platform and the substrate plate.

[0011] In one of the embodiments, the LED lamp beads are arranged in an array on the substrate plate, and the size of the LED lamp beads is less than or equal to 500 μm, and the distance between the light emitting centers of two adjacent LED lamp beads is less than or equal to 1000 μm.

[0012] In one embodiment, the LED lamp bead includes a light-emitting chip and a colloid, the light-emitting chip is welded on the substrate plate, the colloid covers the light-emitting chip, and the colloid is a light-transmitting structure.

[0013] In one embodiment, the cross-section of the colloid includes but is not limited to a combination of one or more of a sphere, a cone, a truncated cone, and a conic curve, and the distance between the edge of the colloid and the light-emitting chip is 50 μm to 200 μm.

[0014] In one embodiment, the optical film is composed of a lower diffusion film, a brightness enhancement film and an upper diffusion film stacked in sequence, the lower diffusion film is attached to the light guide plate, and the lower diffusion film is close to the backlight source.

[0015] A module fixing structure, comprising the above-mentioned backlight module, further comprising: a first inner bracket, a second inner bracket, an outer frame and a positioning plug, wherein the first inner bracket and the second inner bracket are both slidably disposed in the accommodating cavity, and the two slide close to each other to clamp the light guide plate and the optical film;

[0016] The outer frame covers the accommodating cavity of the base, and a light emitting window is provided on the outer frame;

[0017] The outer frame and the side wall of the base are both provided with waist-shaped through holes, and the waist-shaped through holes of the two correspond to each other. The first inner bracket and the second inner bracket are both provided with extension arms, and the extension arms are provided with sliders, and the sliders are accommodated in the waist-shaped through holes of the base;

[0018] The extension arm is provided with a convex pin, which is received in the waist-shaped through hole of the base, and the positioning plug is adapted to the convex pin; when the positioning plug is sleeved on the convex pin, the edge of the positioning plug will abut against the inner wall of the waist-shaped through hole, thereby limiting the sliding of the first inner bracket and the second inner bracket.

[0019] In one embodiment, a plurality of elevated blocks are provided on the first inner bracket and the second inner bracket, the positions of the elevated blocks correspond to the short sides of the optical film, and the vertices of the elevated blocks are in the same horizontal plane as the vertices of the LED lamp beads.

[0020] In summary, the backlight module for Mini LED and its fixing structure of the present invention can improve the overall heat dissipation capacity and facilitate the installation and disassembly operations of the backlight module, thereby improving product quality and extending the product service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below.

[0022] Figure 1 It is a schematic diagram of the structural decomposition of the backlight module of the present invention;

[0023] Figure 2 for Figure 1 The structural diagram of the base shown is (a);

[0024] Figure 3 for Figure 1 The structural diagram of the base shown (II);

[0025] Figure 4 A partial cross-sectional view of a base of the present invention;

[0026] Figure 5 for Figure 1 A partial cross-sectional view of the backlight source, light guide plate and optical film shown;

[0027] Figure 6 It is an exploded schematic diagram of the module fixing structure of the present invention;

[0028] Figure 7 for Figure 6 The schematic diagram of the structure of the outer frame and the base shown;

[0029] Figure 8 for Figure 6 A schematic structural diagram of the first inner bracket and the second inner bracket shown;

[0030] Fig. 9 It is a schematic diagram of the matching relationship between the first inner bracket, the second inner bracket and the optical film. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings below. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that the present invention can implement, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the scope that the technical content disclosed by the present invention can cover. At the same time, the terms such as "upper", "lower", "left", "right" and "middle" quoted in this specification are also only for the convenience of narration, rather than for limiting the scope of the present invention, and the change or adjustment of their relative relationship. Without substantially changing the technical content, it should also be regarded as the scope that the present invention can implement.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0033] The present invention provides a backlight module 100 for Mini LED, such as Figure 1 and Figure 2 As shown, it includes: a backlight source 110 , a base 120 , a light guide plate 130 and an optical film 140 . A receiving cavity 121 is defined in the base 120 , and the backlight source 110 is installed in the receiving cavity 121 .

[0034] like Figure 2 , Figure 3 and Figure 4 As shown, an inner arch platform 122 is provided inside the accommodating cavity 121 of the base 120, and a concave structure 123 is formed at a corresponding position on the bottom surface of the base 120, and a plurality of convex ribs 124 are provided at the concave structure 123. The provision of the convex ribs 124 can not only ensure the flatness of the inner arch platform 122, but also increase the effective heat dissipation area of ​​the concave structure 123, and its specific design principle will be described below.

[0035] like Figure 5As shown, the backlight source 110 includes a substrate plate 111 and a plurality of LED lamp beads 112 disposed on the substrate plate 111. The substrate plate 111 is attached to the inner arch platform 122, and the LED lamp beads 112 face the opening direction of the accommodating cavity 121. The light guide plate 130 and the optical film 140 are stacked on the LED lamp beads 112 of the backlight source 110.

[0036] In this embodiment, the LED lamp beads 112 are arranged in an array on the substrate plate 111 , and the size of the LED lamp beads 112 is less than or equal to 500 μm, and the distance between the light emitting centers of two adjacent LED lamp beads 112 is less than or equal to 1000 μm.

[0037] Preferably, Figure 5 As shown, the LED lamp bead 112 includes a light emitting chip 113 and a colloid 114. The light emitting chip 113 is welded on the substrate plate 111. The colloid 114 covers the light emitting chip 113, and the colloid 114 is a light-transmitting structure. The cross-section of the colloid 114 includes, but is not limited to, a combination of one or more of a spherical shape, a conical shape, a truncated cone shape, and a conic curve shape, and the distance between its edge and the light emitting chip 113 is 50 μm to 200 μm.

[0038] When working, the light emitting chip 113 of the LED lamp bead 112 is powered on and emits light, and the light emitted is radiated to the surroundings through the colloid 114. During this period, the heat generated by the LED lamp bead 112 will be transferred to the substrate plate 111. Since the substrate plate 111 is attached to the inner arch platform 122 of the base 120, the heat will be further transferred to the base 120 and finally dissipated to the outside.

[0039] In a conventional backlight module, the substrate plate 111 and the base 120 are directly attached to each other for heat dissipation. This conventional heat dissipation method will result in poor flatness of the bottom of the base 120, which will cause the substrate plate 111 to not be completely attached, and there will be a gap between the substrate plate 111 and the base 120, resulting in low heat transfer efficiency. In contrast, in the present invention, an inner arch platform 122 and a corresponding recessed structure 123 are formed on the base 120, and the inner arch platform 122 is attached to the substrate plate 111. In this way, after assembly, the backlight source 110 has a downward pressing tendency, and the inner arch platform 122 has a bulging tendency, which enables the substrate plate 111 to be more closely attached to the inner arch platform 122, thereby reducing the gap. In addition, a convex rib 124 is also provided at the recessed structure 123 of the present invention. On the one hand, the convex rib 124 enhances the strength of the inner arch platform 122 (recessed structure 123) to prevent it from bending and deformation, thereby ensuring flatness; on the other hand, it also increases the surface area of ​​one side of the recessed structure 123, thereby increasing the effective heat dissipation area and achieving more efficient heat dissipation.

[0040] In this embodiment, the base 120 is an aluminum-based material structure, and an insulating thermally conductive silicone grease is provided between the inner arch platform 122 and the substrate plate 111. The insulating thermally conductive silicone grease can fill the gaps of different sizes that may exist between the two planes of the substrate plate 111 and the inner arch platform 122, and the insulating thermally conductive silicone grease has excellent thermal conductivity and good electrical insulation, and can quickly transfer the heat of the substrate plate 111 to the base 120, thereby improving the heat dissipation performance of the LED lamp bead 112.

[0041] In this embodiment, if Figure 5 As shown, the optical film 140 is composed of a lower diffusion film 141, a brightness enhancement film 142 and an upper diffusion film 143 stacked in sequence, and the lower diffusion film 141 is attached to the light guide plate 130, and the lower diffusion film 141 is close to the backlight source 110. When working, the LED lamp beads 112 are powered on to emit light and the light is irradiated to the light guide plate 130. Under the action of the light guide plate 130, the light will be refracted and irradiated upward more vertically. Then the light passes through the lower diffusion film 141, the brightness enhancement film 142 and the upper diffusion film 143 in sequence. There are several particles on the surface of the lower diffusion film 141 and the upper diffusion film 143. Through the arc surface of the large and small particles, the light has a larger diffusion angle, thereby eliminating Newton's rings as much as possible, reducing optical interference fringes, and making the light output more uniform. The main functions of the brightness enhancement film 142 include improving the utilization rate of light, converting the line light source into a surface light source, so that the light propagates toward the front of the screen, and can widen the screen viewing angle and balance the light source intensity.

[0042] Furthermore, in actual applications, glue is usually applied to the edge of the optical film 140 so that it can be adhered and fixed to the frame. Due to differences in the proficiency of the staff, the optical film 140 is prone to inappropriate size gaps during installation. For example, when the gap is too small, the edge of the optical film 140 is easily squeezed and causes bulges, resulting in a halo; when the gap is too large, the edge of the optical film 140 is prone to degumming, causing the optical film 140 to shake. Moreover, the use of glue for connection makes the backlight module 100 cumbersome to operate during subsequent maintenance and disassembly, and the optical film 140 is easily torn during disassembly, causing wrinkles or damage, affecting subsequent use.

[0043] To solve these technical problems, the present invention also provides a module fixing structure 10, such as Figure 6 As shown, it not only includes the above-mentioned backlight module 100, but also includes: a first inner bracket 200, a second inner bracket 300, an outer frame 400 and a positioning plug (not shown). The first inner bracket 200 and the second inner bracket 300 are both slidably disposed in the accommodating cavity 121, and the two slide close to each other to clamp the light guide plate 130 and the optical film 140.

[0044] The outer frame 400 covers the accommodating cavity 121 of the base 120, and a light emitting window 410 (such as Figure 6 The outer frame 400 and the side wall of the base 120 are both provided with waist-shaped through holes 401 (as shown in FIG. Figure 2 and Figure 7 As shown in FIG. 4 ), the waist-shaped through holes 401 of the two correspond to each other. Figure 8 As shown, both the first inner bracket 200 and the second inner bracket 300 are provided with an extension arm 210 , and a slider 211 is provided on the extension arm 210 . The slider 211 is received in the waist-shaped through hole 401 of the base 120 .

[0045] The extension arm 210 is also provided with a protruding nail 212, which is received in the waist-shaped through hole 401 of the base 120, and the positioning plug is adapted to the protruding nail 212. When the positioning plug is sleeved on the protruding nail 212, the edge of the positioning plug will abut against the inner wall of the waist-shaped through hole 401, thereby limiting the sliding of the first inner bracket 200 and the second inner bracket 300.

[0046] The steps of assembling and disassembling the module fixing structure 10 are described below:

[0047] During assembly, the first inner bracket 200 and the second inner bracket 300 are first placed in the accommodating cavity 121, and then the backlight source 110, the light guide plate 130 and the optical film 140 are sequentially installed. At this time, the first inner bracket 200 and the second inner bracket 300 form a semi-enclosed structure for the optical film 140. Specifically, as Fig. 9 As shown, the first inner bracket 200 and the second inner bracket 300 are wrapped around the short sides of the optical film 140. Initially, there is a large gap between the inner wall of the first inner bracket 200 and the second inner bracket 300 and the short side of the optical film 140; after the optical film 140 is laid flat, the staff pushes the first inner bracket 200 and the second inner bracket 300 to slide toward the center, so that the first inner bracket 200 and the second inner bracket 300 are both in contact with the edge of the optical film 140, eliminating the above gap. In this way, the optical film 140 will be supported all around, and it can be stably restricted in the current position even without glue. Finally, the outer frame 400 is covered on the base 120, and the positioning plug is plugged on the convex nail 212. The positioning plug will expand and squeeze the inner wall of the waist-shaped through hole 401, thereby preventing the first inner bracket 200 and the second inner bracket 300 from sliding, and the outer frame 400 cannot be disassembled. In this way, the positions of the first inner bracket 200 and the second inner bracket 300 are fixed, and the module fixing structure 10 also forms a whole; when disassembling, the staff first removes the positioning plug, and then reverses the above steps.

[0048] Compared with the prior art method of using glue to fix, the present invention uses the first inner bracket 200 and the second inner bracket 300 to hold the edge of the optical film 140. In addition to having the same limiting function, it also has the following characteristics and beneficial effects:

[0049] First, during subsequent maintenance and disassembly, the optical film 140 can be easily removed by simply opening the first inner bracket 200 and the second inner bracket 300. In this way, without glue sticking, the optical film 140 can be prevented from being torn during the disassembly process, and it is not easy to cause wrinkles or damage, and there will be no problem of glue aging;

[0050] Secondly, the method of the present invention can adaptively adjust the size gap of the optical film 140 during installation, and the size of the gap can be changed by sliding the first inner bracket 200 and the second inner bracket 300. This means that during installation, even if the staff lacks proficiency, there will be no problem of inappropriate size gap;

[0051] Thirdly, the operation mode of the present invention can also realize the centering operation at the same time. The staff only needs to slide the first inner bracket 200 and the second inner bracket 300 to clamp the optical film 140 at the center position. Even if the position of the optical film 140 is deviated at the beginning, the centering operation of the optical film 140 can be completed during the clamping process, so that the optical film 140 can be placed at the predetermined position, ensuring the standardization of product quality.

[0052] In one embodiment, if Figure 8 As shown, a plurality of elevated blocks 201 are disposed on the first inner bracket 200 and the second inner bracket 300, and the positions of the elevated blocks 201 correspond to the short sides of the optical film 140. Moreover, the vertices of the elevated blocks 201 and the vertices of the LED lamp beads 112 are in the same horizontal plane.

[0053] It should be supplemented that the setting of the elevated block 201 is to support the short side of the optical film 140. Since the long side span of the optical film 140 is relatively large, the short sides at both ends are prone to bending and collapse, resulting in poor flatness, which in turn affects the light output effect. The setting of the elevated block 201 is relative to giving the short side of the optical film 140 a step to rely on, thereby eliminating the collapse of its edge as much as possible and making its overall flatness higher. Of course, the size of the elevated block 201 needs to be as small as possible to avoid causing serious shading, resulting in obvious shadows on the light output surface.

[0054] In summary, the backlight module 100 for Mini LED and the fixing structure 10 thereof of the present invention can improve the overall heat dissipation capacity and facilitate the installation and disassembly operations of the backlight module 100, thereby improving product quality and extending the product service life.

[0055] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A module fixing structure, characterized in that: Including backlight modules for Mini LED, The backlight module comprises: a backlight source, a base, a light guide plate and an optical film, wherein a receiving cavity is provided in the base, and the backlight source is installed in the receiving cavity; An inner arch platform is provided inside the accommodating cavity of the base, and a concave structure is formed at a corresponding position of the bottom surface of the base, and a plurality of convex ribs are provided at the concave structure; the backlight source includes a substrate plate and a plurality of LED lamp beads arranged on the substrate plate, the substrate plate is fitted with the inner arch platform, and the LED lamp beads face the opening direction of the accommodating cavity; the light guide plate and the optical film are stacked on the LED lamp beads of the backlight source; The module fixing structure further includes: a first inner bracket, a second inner bracket, an outer frame and a positioning plug, wherein the first inner bracket and the second inner bracket are both slidably disposed in the accommodating cavity, and the two slide close to each other to clamp the light guide plate and the optical film; and the first inner bracket and the second inner bracket form a semi-enclosed structure for the optical film; The outer frame covers the accommodating cavity of the base, and a light emitting window is provided on the outer frame; The outer frame and the side wall of the base are both provided with waist-shaped through holes, and the waist-shaped through holes of the two correspond to each other. The first inner bracket and the second inner bracket are both provided with extension arms, and the extension arms are provided with sliders, and the sliders are accommodated in the waist-shaped through holes of the base; The extension arm is provided with a convex pin, which is received in the waist-shaped through hole of the base, and the positioning plug is adapted to the convex pin; when the positioning plug is sleeved on the convex pin, the edge of the positioning plug will abut against the inner wall of the waist-shaped through hole, thereby limiting the sliding of the first inner bracket and the second inner bracket, and the outer frame cannot be disassembled.

2. The module fixing structure according to claim 1, characterized in that: A plurality of elevated blocks are provided on the first inner bracket and the second inner bracket. The positions of the elevated blocks correspond to the short sides of the optical film, and the vertices of the elevated blocks and the vertices of the LED lamp beads are in the same horizontal plane.

3. The module fixing structure according to claim 1, characterized in that: The base is an aluminum-based material structure, and insulating heat-conducting silicone grease is provided between the inner arch platform and the substrate plate.

4. The module fixing structure according to claim 1, characterized in that: The LED lamp beads are arranged in an array on the substrate plate, and the size of the LED lamp beads is less than or equal to 500 μm, and the distance between the light emitting centers of two adjacent LED lamp beads is less than or equal to 1000 μm.

5. The module fixing structure according to claim 4, characterized in that: The LED lamp bead comprises a light-emitting chip and a colloid, wherein the light-emitting chip is welded on the substrate plate, the colloid covers the light-emitting chip, and the colloid is a light-transmitting structure.

6. The module fixing structure according to claim 5, characterized in that: The cross-section of the colloid includes, but is not limited to, a combination of one or more of a sphere, a cone, a truncated cone, and a conic curve, and the distance between the edge of the colloid and the light-emitting chip is 50 μm to 200 μm.

7. The module fixing structure according to claim 1, characterized in that: The optical film is composed of a lower diffusion film, a brightness enhancement film and an upper diffusion film stacked in sequence. The lower diffusion film is attached to the light guide plate and is close to the backlight source.

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