Exposure machine alignment method and system, computer and storage medium

Abstract

The invention provides an exposure machine alignment method and system, a computer and a storage medium, and the method comprises the following steps: obtaining an alignment light spot image on a to-be-exposed PCB, and carrying out the preprocessing of the image to eliminate the noise influence; performing edge extraction on the pre-processed alignment light spot image to obtain a target image, and performing calculation based on a gray value of the target image to obtain a center coordinate of a light spot; obtaining the alignment displacement of the PCB to be exposed according to the alignment mark coordinates and the center coordinates on the PCB to be exposed; and adjusting the input voltage of the moving motor based on the alignment displacement so as to move the PCB to be exposed to the target position based on the moving motor, and completing alignment operation with the film board. By identifying the distance difference between the alignment coordinate and the center coordinate, the alignment displacement required by the fine alignment of the PCB to be exposed is calculated, so that the accurate alignment of the film board and the PCB is realized, the identification of the position of the film board is reduced, and the alignment efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure machines, and in particular to an exposure machine alignment method, system, computer and storage medium. Background Art

[0002] Exposure machine refers to a machine that transfers the image information on film or other transparent objects to the surface coated with photosensitive materials by emitting UVA wavelength ultraviolet light. Before the exposure operation, the film and PCB board need to be aligned and debugged.

[0003] In the prior art, the alignment operation is usually performed by setting alignment marks on both the film and the PCB, identifying the coordinates of the film and the PCB respectively based on a visual system, and then performing the alignment operation manually, which has a low alignment efficiency. Summary of the invention

[0004] In view of the deficiencies in the prior art, an object of the present invention is to provide an exposure machine alignment method, system, computer and storage medium, aiming to solve the technical problem of low alignment efficiency in the prior art.

[0005] In order to achieve the above object, on the one hand, the present invention is implemented by the following technical solution: an exposure machine alignment method, comprising the following steps:

[0006] Acquire an alignment spot image on the PCB board to be exposed, and pre-process the alignment spot image to eliminate noise influence;

[0007] Performing edge extraction on the preprocessed alignment light spot image to obtain a target image, and calculating the center coordinates of the light spot based on the grayscale value of the target image;

[0008] Obtaining the alignment displacement of the PCB board to be exposed according to the alignment mark coordinates on the PCB board to be exposed and the center coordinates;

[0009] The input voltage of the moving motor is adjusted based on the alignment displacement, so as to move the PCB board to be exposed to a target position based on the moving motor, thereby completing the alignment operation with the film board.

[0010] According to one aspect of the above technical solution, the step of performing edge extraction on the preprocessed alignment spot image to obtain the target image specifically includes:

[0011] Binarize the preprocessed alignment spot image, group and mark each pixel in the binary image, and generate different connected components;

[0012] The connected domain corresponding to the connected component with the largest area is retained as the target image.

[0013] According to one aspect of the above technical solution, the step of adjusting the input voltage of the moving motor based on the alignment displacement specifically includes:

[0014] The input voltage to the moving motor is adjusted based on the alignment displacement according to the following calculation:

[0015]

[0016] Wherein, U is the calibrated voltage of the mobile motor, L is the calibrated stroke of the mobile motor, c is the stiffness of the piezoelectric ceramic, m is the mass of the mobile workbench of the PCB board to be exposed, l is the alignment displacement, u is the input voltage, d is the differential sign, and t is time.

[0017] According to one aspect of the above technical solution, the step of calculating the center coordinates of the light spot based on the grayscale value of the target image specifically includes:

[0018] The center coordinates of the light spot are calculated using the grayscale centroid method:

[0019]

[0020] Where x is the x-axis coordinate of the light spot, y is the y-axis coordinate of the light spot, P M is the sum of the grayscale values ​​of all pixels of the light spot, P1 and P2 are the products of the grayscale value of the pixel and its coordinates, I is the alignment light spot image, M is the target image, i is the x-axis coordinate of the pixel, and j is the y-axis coordinate of the pixel.

[0021] According to one aspect of the above technical solution, the step of preprocessing the alignment spot image to eliminate the influence of noise specifically includes:

[0022] The aligned light spot image is smoothly connected based on a mean filtering algorithm, and the interconnected blocks are closed through expansion and corrosion processing to fill the holes in the light spot, thereby eliminating the influence of noise.

[0023] According to one aspect of the above technical solution, before the step of obtaining the light spot collimated image on the PCB board to be exposed, the method further includes:

[0024] Move the film plate on one side of the PCB board to be exposed to a target position;

[0025] The PCB to be exposed is moved for rough alignment so that the light beam on the film workbench is completely irradiated on the PCB to be exposed.

[0026] On the other hand, the present invention also provides an exposure machine alignment system, comprising:

[0027] A preprocessing module is used to obtain an alignment light spot image on the PCB board to be exposed, and preprocess the alignment light spot image to eliminate noise influence;

[0028] A light spot module is used to extract the edge of the preprocessed alignment light spot image to obtain a target image, so as to calculate the center coordinates of the light spot based on the gray value of the target image;

[0029] An alignment module, used for obtaining the alignment displacement of the PCB board to be exposed according to the alignment mark coordinates on the PCB board to be exposed and the center coordinates;

[0030] The moving module is used to adjust the input voltage of the moving motor based on the alignment displacement, so as to move the PCB board to be exposed to a target position based on the moving motor to complete the alignment operation with the film board.

[0031] According to one aspect of the above technical solution, the light spot module is specifically used for:

[0032] Binarize the preprocessed alignment spot image, group and mark each pixel in the binary image, and generate different connected components;

[0033] The connected domain corresponding to the connected component with the largest area is retained as the target image.

[0034] According to one aspect of the above technical solution, the mobile module is specifically used for:

[0035] The input voltage to the moving motor is adjusted based on the alignment displacement according to the following calculation:

[0036]

[0037] Wherein, U is the calibrated voltage of the mobile motor, L is the calibrated stroke of the mobile motor, c is the stiffness of the piezoelectric ceramic, m is the mass of the mobile workbench of the PCB board to be exposed, l is the alignment displacement, u is the input voltage, d is the differential sign, and t is time.

[0038] According to one aspect of the above technical solution, the preprocessing module is specifically used for:

[0039] The aligned light spot image is smoothly connected based on a mean filtering algorithm, and the interconnected blocks are closed through expansion and corrosion processing to fill the holes in the light spot, thereby eliminating the influence of noise.

[0040] According to one aspect of the above technical solution, the system further includes:

[0041] A coarse alignment module, used for moving the film plate on one side of the PCB board to be exposed to a target position;

[0042] The PCB to be exposed is moved for rough alignment so that the light beam on the film workbench is completely irradiated on the PCB to be exposed.

[0043] Compared with the prior art, the beneficial effects of the present invention are as follows: a light source is arranged on a fixed workbench of a film board to obtain an alignment light spot image on a PCB board to be exposed, the image is processed to obtain the center coordinates of the light beam, and then the distance difference between the alignment coordinates and the center coordinates is further identified to calculate the alignment displacement required for the precise alignment of the PCB board to be exposed, thereby achieving precise alignment of the film board and the PCB board, reducing the identification of the film board position, and improving the alignment efficiency. At the same time, by adjusting the input voltage of the mobile motor based on the alignment displacement, the automatic alignment operation of the PCB board can be realized, and the error amount can be quickly obtained after the PCB board is flipped, thereby further improving the alignment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a flow chart of the exposure machine alignment method in the first embodiment of the present invention;

[0045] Figure 2 It is a structural block diagram of an exposure machine alignment system in a second embodiment of the present invention;

[0046] Figure 3 is a schematic diagram of the hardware structure of a computer in the third embodiment of the present application;

[0047] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0048] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0051] See also Figure 1 , is a flow chart of an exposure machine alignment method in a first embodiment of the present invention. As shown in the figure, the method includes the following steps:

[0052] Step S100, obtaining an alignment spot image on the PCB board to be exposed, and preprocessing the alignment spot image to eliminate noise influence.

[0053] Specifically, in this embodiment, the above-mentioned alignment spot image is formed based on the light source set on the film plate workbench irradiating the PCB board to be exposed. Since the acquired image often contains various noises, such as electronic noise, sensor noise, ambient light interference, etc., it will affect the quality of the image, and then affect the accuracy of subsequent edge detection, contour extraction and center coordinate calculation. Through image preprocessing, such as filtering and denoising, the influence of noise can be effectively reduced, the clarity and signal-to-noise ratio of the image can be improved, and the subsequent coordinate extraction is convenient.

[0054] Furthermore, in this embodiment, before the step of acquiring the light spot collimated image on the PCB board to be exposed, the method further includes:

[0055] Move the film plate on one side of the PCB board to be exposed to a target position;

[0056] The PCB to be exposed is moved for rough alignment so that the light beam on the film workbench is completely irradiated on the PCB to be exposed. Specifically, by setting the light source on the film, the alignment error between the film and the PCB can be intuitively obtained.

[0057] Preferably, in this embodiment, the step of preprocessing the alignment spot image to eliminate the influence of noise specifically includes:

[0058] The alignment spot image is smoothly connected based on the mean filtering algorithm, and the interconnected blocks are closed through expansion and corrosion processing to fill the holes in the spot, thereby eliminating the influence of noise. Since the purpose of the scheme is to obtain the center coordinates of the spot, the integrity of the spot will affect the recognition accuracy of the center coordinates. By preprocessing the image, the incompleteness of the spot caused by reflection and other environmental factors can be reduced, thereby improving the recognition accuracy.

[0059] Step S200 , edge extraction is performed on the preprocessed alignment light spot image to obtain a target image, so as to calculate the center coordinates of the light spot based on the gray value of the target image.

[0060] Specifically, in this embodiment, the step of performing edge extraction on the pre-processed alignment spot image to obtain the target image specifically includes:

[0061] Binarize the preprocessed alignment spot image, group and mark each pixel in the binary image, and generate different connected components;

[0062] The connected domain corresponding to the connected component with the largest area is retained as the target image.

[0063] Furthermore, in this embodiment, the step of calculating the center coordinates of the light spot based on the grayscale value of the target image specifically includes:

[0064] The center coordinates of the light spot are calculated using the grayscale centroid method:

[0065]

[0066] Where x is the x-axis coordinate of the light spot, y is the y-axis coordinate of the light spot, P M is the sum of the grayscale values ​​of all pixels of the light spot, P1 and P2 are the products of the grayscale value of the pixel and its coordinates, I is the alignment light spot image, M is the target image, i is the x-axis coordinate of the pixel, and j is the y-axis coordinate of the pixel.

[0067] Step S300, obtaining the alignment displacement of the PCB board to be exposed according to the alignment mark coordinates on the PCB board to be exposed and the center coordinates.

[0068] Step S400, adjusting the input voltage of the moving motor based on the alignment displacement, so as to move the PCB board to be exposed to a target position based on the moving motor, and completing the alignment operation with the film board.

[0069] Specifically, in this embodiment, the step of adjusting the input voltage of the moving motor based on the alignment displacement specifically includes:

[0070] The input voltage to the moving motor is adjusted based on the alignment displacement according to the following calculation:

[0071]

[0072] Wherein, U is the calibrated voltage of the mobile motor, L is the calibrated stroke of the mobile motor, c is the stiffness of the piezoelectric ceramic, m is the mass of the mobile workbench of the PCB board to be exposed, l is the alignment displacement, u is the input voltage, d is the differential sign, and t is time.

[0073] Preferably, in this embodiment, during the movement of the PCB board, its position information can be monitored in real time by sensors such as encoders or laser rangefinders and compared with the target position. The motor control strategy can also be fine-tuned based on the real-time feedback results to further improve the alignment accuracy.

[0074] In summary, the exposure machine alignment method in the above-mentioned embodiment of the present invention sets a light source on a fixed workbench of the film board to obtain the alignment light spot image on the PCB board to be exposed, processes the image to obtain the center coordinates of the light beam, and then further identifies the distance difference between the alignment coordinates and the center coordinates to calculate the alignment displacement required for the precise alignment of the PCB board to be exposed, thereby achieving precise alignment of the film board and the PCB board, reducing the identification of the film board position, and improving the alignment efficiency. At the same time, by adjusting the input voltage of the moving motor based on the alignment displacement, the automatic alignment operation of the PCB board can be realized, and the error amount can be quickly obtained after the PCB board is flipped, thereby further improving the alignment efficiency.

[0075] Embodiment 2

[0076] The second embodiment of the present application also provides an exposure machine alignment system, which is used to implement the embodiments and preferred implementations, and will not be repeated here. As used below, the terms "module", "unit", "sub-unit", etc. can be a combination of software and / or hardware that implements a predetermined function. Although the system described in the following embodiments is preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0077] like Figure 2 As shown, the system includes: a pre-processing module 100 , a light spot module 200 , an alignment module 300 and a moving module 400 .

[0078] The preprocessing module 100 is used to obtain the alignment spot image on the PCB board to be exposed, and preprocess the alignment spot image to eliminate the influence of noise;

[0079] The light spot module 200 is used to extract the edge of the pre-processed alignment light spot image to obtain a target image, so as to calculate the center coordinates of the light spot based on the gray value of the target image;

[0080] The alignment module 300 is used to obtain the alignment displacement of the PCB board to be exposed according to the alignment mark coordinates on the PCB board to be exposed and the center coordinates;

[0081] The moving module 400 is used to adjust the input voltage of the moving motor based on the alignment displacement, so as to move the PCB board to be exposed to the target position based on the moving motor to complete the alignment operation with the film board.

[0082] Preferably, in this embodiment, the light spot module 200 is specifically used for:

[0083] Binarize the preprocessed alignment spot image, group and mark each pixel in the binary image, and generate different connected components;

[0084] The connected domain corresponding to the connected component with the largest area is retained as the target image.

[0085] Preferably, in this embodiment, the mobile module 400 is specifically used for:

[0086] The input voltage to the moving motor is adjusted based on the alignment displacement according to the following calculation:

[0087]

[0088] Wherein, U is the calibrated voltage of the mobile motor, L is the calibrated stroke of the mobile motor, c is the stiffness of the piezoelectric ceramic, m is the mass of the mobile workbench of the PCB board to be exposed, l is the alignment displacement, u is the input voltage, d is the differential sign, and t is time.

[0089] Preferably, in this embodiment, the preprocessing module 100 is specifically used for:

[0090] The aligned light spot image is smoothly connected based on a mean filtering algorithm, and the interconnected blocks are closed through expansion and corrosion processing to fill the holes in the light spot, thereby eliminating the influence of noise.

[0091] According to one aspect of the above technical solution, the system further includes:

[0092] A coarse alignment module, used for moving the film plate on one side of the PCB board to be exposed to a target position;

[0093] The PCB to be exposed is moved for rough alignment so that the light beam on the film workbench is completely irradiated on the PCB to be exposed.

[0094] In summary, the exposure machine alignment system in the above-mentioned embodiment of the present invention sets a light source on a fixed workbench of the film board through the preprocessing module 100 to obtain the alignment light spot image on the PCB board to be exposed, and processes the image based on the light spot module 200 to obtain the center coordinate of the light beam, and then further identifies the distance difference between the alignment coordinate and the center coordinate through the alignment module 300 to calculate the alignment displacement required for the precise alignment of the PCB board to be exposed, and uses the moving module 400 to achieve precise alignment of the film board and the PCB board, which reduces the identification of the film board position and improves the alignment efficiency. At the same time, by adjusting the input voltage of the moving motor based on the alignment displacement, the automatic alignment operation of the PCB board can be realized, and the error amount can be quickly obtained after the PCB board is flipped, thereby further improving the alignment efficiency.

[0095] It should be noted that each module can be a functional module or a program module, and can be implemented by software or hardware. For modules implemented by hardware, each module can be located in the same processor; or each module can be located in different processors in any combination.

[0096] Embodiment 3

[0097] The third embodiment of the present application provides a computer. It can be understood that the principles mentioned in the exposure machine alignment system in this embodiment correspond to the exposure machine alignment method in the first embodiment of the present application. The relevant principles not described can be referred to the first embodiment for details and will not be elaborated here.

[0098] The computer may include a processor 81 and a memory 82 storing computer program commands.

[0099] Specifically, the processor 81 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0100] Among them, the memory 82 may include a large-capacity memory for data or commands. By way of example and not limitation, the memory 82 may include a hard disk drive (HDD), a floppy disk drive, a solid-state drive (SSD), a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 82 may include a removable or non-removable (or fixed) medium. Where appropriate, the memory 82 may be inside or outside a data processing device. In a specific embodiment, the memory 82 is a non-volatile memory. In a specific embodiment, the memory 82 includes a read-only memory (ROM) and a random access memory (RAM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (Programmable Read-Only Memory, PROM for short), an erasable PROM (Erasable ProgrammableRead-Only Memory, EPROM for short), an electrically erasable PROM (Electrically Erasable ProgrammableRead-Only Memory, EEPROM for short), an electrically alterable ROM (Electrically Alterable Read-Only Memory, EAROM for short) or a flash memory (FLASH) or a combination of two or more of these. Under appropriate circumstances, the RAM can be a static random access memory (SRAM) or a dynamic random access memory (DRAM), wherein the DRAM can be a fast page mode dynamic random access memory (FPMDRAM), an extended data output dynamic random access memory (EDODRAM), a synchronous dynamic random access memory (SDRAM), etc.

[0101] The memory 82 may be used to store or cache various data files required for processing and / or communication, as well as possible computer program commands executed by the processor 81 .

[0102] The processor 81 implements any one of the exposure machine alignment methods in the above embodiments by reading and executing computer program commands stored in the memory 82 .

[0103] In some embodiments, the computer may further include a communication interface 83 and a bus 80. Figure 3 As shown, the processor 81, the memory 82, and the communication interface 83 are connected via a bus 80 and communicate with each other.

[0104] The communication interface 83 is used to implement communication between the modules, devices, units and / or equipment in the embodiment of the present application. The communication interface 83 can also implement data communication with other components such as: external devices, image / data acquisition equipment, databases, external storage, and image / data processing workstations.

[0105] The bus 80 includes hardware, software or both, and couples the components of the computer to each other. The bus 80 includes but is not limited to at least one of the following: a data bus, an address bus, a control bus, an expansion bus, and a local bus. By way of example and not limitation, bus 80 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable buses or a combination of two or more of these. Where appropriate, bus 80 may include one or more buses. Although embodiments of the present application describe and illustrate a particular bus, the present application contemplates any suitable bus or interconnect.

[0106] Embodiment 4

[0107] In combination with the exposure machine alignment method in the above embodiments, the fourth embodiment of the present application provides a readable storage medium having computer program commands stored thereon; when the computer program commands are executed by a processor, any exposure machine alignment method in the above embodiments is implemented.

[0108] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. An exposure machine alignment method, characterized in that: The following steps are involved: Acquire an alignment spot image on the PCB board to be exposed, and pre-process the alignment spot image to eliminate noise influence; Performing edge extraction on the preprocessed alignment light spot image to obtain a target image, and calculating the center coordinates of the light spot based on the grayscale value of the target image; Obtaining the alignment displacement of the PCB board to be exposed according to the alignment mark coordinates on the PCB board to be exposed and the center coordinates; The input voltage of the moving motor is adjusted based on the alignment displacement, so as to move the PCB board to be exposed to a target position based on the moving motor, thereby completing the alignment operation with the film board.

2. The exposure machine alignment method according to claim 1, characterized in that: The step of performing edge extraction on the preprocessed alignment spot image to obtain the target image specifically includes: Binarize the preprocessed alignment spot image, group and mark each pixel in the binary image, and generate different connected components; The connected domain corresponding to the connected component with the largest area is retained as the target image.

3. The exposure machine alignment method according to claim 1, characterized in that: The step of adjusting the input voltage of the moving motor based on the alignment displacement specifically includes: The input voltage to the moving motor is adjusted based on the alignment displacement according to the following calculation: Wherein, U is the calibrated voltage of the mobile motor, L is the calibrated stroke of the mobile motor, c is the stiffness of the piezoelectric ceramic, m is the mass of the mobile workbench of the PCB board to be exposed, l is the alignment displacement, u is the input voltage, d is the differential sign, and t is time.

4. The exposure machine alignment method according to claim 1, characterized in that: The step of calculating the center coordinates of the light spot based on the grayscale value of the target image specifically includes: The center coordinates of the light spot are calculated using the grayscale centroid method: Where x is the x-axis coordinate of the light spot, y is the y-axis coordinate of the light spot, P M is the sum of the grayscale values ​​of all pixels of the light spot, P1 and P2 are the products of the grayscale value of the pixel and its coordinates, I is the alignment light spot image, M is the target image, i is the x-axis coordinate of the pixel, and j is the y-axis coordinate of the pixel.

5. The exposure machine alignment method according to claim 1, characterized in that: The step of preprocessing the alignment spot image to eliminate the influence of noise specifically includes: The aligned light spot image is smoothly connected based on a mean filtering algorithm, and the interconnected blocks are closed through expansion and corrosion processing to fill the holes in the light spot, thereby eliminating the influence of noise.

6. The exposure machine alignment method according to claim 1, characterized in that: Before the step of obtaining the light spot collimated image on the PCB board to be exposed, the method further includes: Move the film plate on one side of the PCB board to be exposed to a target position; The PCB to be exposed is moved for rough alignment so that the light beam on the film workbench is completely irradiated on the PCB to be exposed.

7. An exposure machine alignment system, characterized in that: include: A preprocessing module is used to obtain an alignment light spot image on the PCB board to be exposed, and preprocess the alignment light spot image to eliminate noise influence; A light spot module is used to extract the edge of the preprocessed alignment light spot image to obtain a target image, so as to calculate the center coordinates of the light spot based on the gray value of the target image; An alignment module, used for obtaining the alignment displacement of the PCB board to be exposed according to the alignment mark coordinates on the PCB board to be exposed and the center coordinates; The moving module is used to adjust the input voltage of the moving motor based on the alignment displacement, so as to move the PCB board to be exposed to a target position based on the moving motor to complete the alignment operation with the film board.

8. The exposure machine alignment system according to claim 7, characterized in that: The light spot module is specifically used for: Binarize the preprocessed alignment spot image, group and mark each pixel in the binary image, and generate different connected components; The connected domain corresponding to the connected component with the largest area is retained as the target image.

9. A computer comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the exposure machine alignment method according to any one of claims 1 to 6 is implemented.

10. A storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, an exposure machine alignment method as described in any one of claims 1 to 6 is implemented.

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