Wafer carrying device

Abstract

The embodiment of the invention discloses a wafer carrying device. The wafer carrying device is used in cooperation with a preloading cavity, a first containing cavity is formed in the preloading cavity, an opening is formed in the side face of the first containing cavity, and the wafer carrying device comprises a moving cavity, a sealing bottom plate, a wafer frame and a linkage mechanism; the shape of the moving cavity is matched with that of the first accommodating cavity, and the moving cavity can be accommodated in the first accommodating cavity; a mounting hole is formed in the moving cavity, and the linkage mechanism is arranged on the mounting hole; a second containing cavity is formed in the moving cavity, and a sealing opening is formed in the bottom of the second containing cavity. And the sealing bottom plate and the wafer rack are arranged on the linkage mechanism. The wafer carrying device has the advantages of being small in size, flexible to use, low in cost and high in reliability, is suitable for carrying small-batch wafers, and can remarkably improve the overall carrying efficiency.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of wafer transport technology, and in particular to a wafer transport device. Background Art

[0002] At present, wafer transportation is mostly achieved through the cooperation of Load Port (often translated as "wafer parking platform") and FOUP (often translated as "front-opening wafer transfer box"). Among them, Load Port and FOUP are already mature existing technologies, and together they are components of the wafer transportation system. The core working principle of the wafer transportation system is to detect the position of the FOUP and the wafers inside it through various sensors, and then use robots to transport the wafers.

[0003] However, the existing wafer handling system (including software and hardware) is highly dependent on the position of the wafer, and therefore more sensors need to be set up to accurately detect the position of the wafer. For example, the robot is required to be able to detect, position, store, and clamp the wafer. For example, the FOUP needs to protect and accurately position the wafer, especially during and after transportation, the position change of the wafer should be as small as possible, which requires the FOUP to have very high processing accuracy. On the one hand, this results in the huge size of the entire wafer handling system and a large space occupied for installation. On the other hand, due to the complexity of the technology, the technical implementation of the entire system is very difficult, which ultimately makes the handling cost of the wafer remain high. Most importantly, these current wafer handling systems (including software and hardware) cannot meet the technical requirements of small-batch and flexible handling scenarios such as laboratories.

[0004] In addition, during the wafer handling process, FOUP is needed to protect the wafer to ensure that the positioning of the wafer can be precisely controlled during and even after transportation, so as to reduce the requirements for the robot when the wafer is subsequently removed (such as positioning accuracy and positioning efficiency), thereby improving the efficiency of the wafer during the handling process. Summary of the invention

[0005] The embodiment of the present invention provides a wafer transport device. Aiming at the defects of the existing wafer transport system being bulky, technically complex, and costly, and unable to adapt to the scenario of transporting small batches of wafers, the wafer transport device provided by the embodiment of the present invention is compatible with the existing wafer transport system, has a relatively simple structure, is easy to use, has high overall transport efficiency, and has low use cost.

[0006] The wafer conveying device provided by the present invention is used in conjunction with a pre-loading cavity, wherein a first accommodating cavity is provided in the pre-loading cavity, and an opening is provided on the side of the first accommodating cavity, and comprises: a moving cavity, a sealing bottom plate, a wafer rack and a linkage mechanism;

[0007] The shape of the movable cavity is adapted to the first accommodating cavity, and the movable cavity can be accommodated in the first accommodating cavity;

[0008] The movable cavity is provided with a mounting hole, and the linkage mechanism is arranged on the mounting hole;

[0009] A second accommodating chamber is provided inside the movable cavity, and a sealing opening is provided at the bottom of the second accommodating chamber;

[0010] The sealing bottom plate and the wafer rack are arranged on the linkage mechanism;

[0011] When the linkage mechanism is in the first state, the sealing bottom plate abuts against the sealing port, the second accommodating cavity is in a sealed state, and the wafer rack is located in the second accommodating cavity;

[0012] When the linkage mechanism is in the second state, the sealing bottom plate is separated from the sealing port, the second accommodating cavity is in an open state, and the wafer rack is located outside the second accommodating cavity and corresponds to the position of the opening.

[0013] Optionally, the linkage mechanism comprises: a limiting frame, a linkage frame and a linkage rod;

[0014] The limiting frame is fixedly arranged on the moving cavity, and the linkage rod is slidably arranged on the limiting frame;

[0015] The lower end of the linkage rod is connected to the wafer rack, and the upper end of the linkage rod is connected to the linkage rack;

[0016] When the linkage frame is located at a first height, the linkage mechanism is in the first state, and when the linkage frame is located at a second height, the linkage mechanism is in the second state.

[0017] Optionally, the linkage mechanism further includes: a first actuating mechanism, one end of the first actuating mechanism is connected to the limiting frame, and the other end of the first actuating mechanism is connected to the linkage frame.

[0018] Optionally, the linkage mechanism further includes: a second actuating mechanism, one end of the second actuating mechanism is connected to the limiting frame, and the other end of the second actuating mechanism is connected to the linkage frame.

[0019] Optionally, it also includes: a positioning mechanism;

[0020] The positioning mechanism further comprises: a driving rod, a connector and an eccentric rod;

[0021] The linkage rod is provided with a first through hole, and the driving rod is arranged in the first through hole;

[0022] The eccentric rod is arranged on the wafer rack, and the eccentric rod is connected to the lower end of the driving rod through the connector.

[0023] Optionally, the wafer rack comprises: a main connecting frame, at least two groups of supporting frames and at least two groups of positioning blocks;

[0024] The main connecting frame is connected to the linkage rod;

[0025] The support frame is arranged on the main connecting frame, the positioning block is horizontally arranged on the support frame, and the support frame and the positioning block are used to support the placed wafer;

[0026] The eccentric rod is arranged on one side of the main connecting frame;

[0027] A group of the positioning blocks arranged opposite to the eccentric rod serves as a positioning reference for the wafer and has higher processing accuracy than other groups of the positioning blocks.

[0028] Optionally, a limiting groove is provided on the eccentric rod, and the limiting groove is at the same horizontal position as the wafer to be placed.

[0029] Optionally, the bottom of the limiting groove is a curved structure.

[0030] Optionally, it also includes: a nitrogen purge mechanism;

[0031] The nitrogen purge mechanism comprises: a nitrogen source, a first pipeline and a purge rod;

[0032] The purge rod is arranged near the wafer positioning block serving as a positioning reference, and a plurality of purge holes are arranged on the purge rod;

[0033] The nitrogen source is connected to the purge rod through the first pipeline, and is used to provide nitrogen to the purge hole.

[0034] Optionally, it also includes: a negative pressure source;

[0035] A hollow structure is provided inside the eccentric rod, and two negative pressure holes arranged in an "eight" shape are provided at the bottom of the eccentric rod located at the limiting groove. The negative pressure holes are connected to the negative pressure source through the hollow structure.

[0036] Optionally, it also includes: an elastic protection mechanism;

[0037] The elastic force protection mechanism comprises: a positioning sleeve, a positioning ring, a positioning ball and a positioning spring;

[0038] The negative pressure hole is provided with a first positioning step near the bottom of the limiting groove;

[0039] The positioning sleeve is arranged in the negative pressure hole and is located at the first positioning step;

[0040] The positioning spring is arranged in the positioning sleeve, the positioning ball is arranged at the top end of the positioning spring, and the positioning ball protrudes from the bottom of the limiting groove;

[0041] The positioning ring is arranged at the top end of the negative pressure hole, and the positioning ring is used to limit the positioning ball from popping out of the negative pressure hole.

[0042] The beneficial effects achieved by the wafer handling device provided by the present invention by adopting the above-mentioned technical scheme are as follows: the wafer handling device provided by the embodiment of the present invention realizes the switching of the sealing state and the open state of the mobile cavity through the up and down movement of the linkage mechanism, and provides users with a handling device that can seal and place wafers, transport wafers, and cooperate with a robot to pick up and place wafers. It can be compatible with the existing wafer handling system to make up for the shortcomings of the existing automation equipment. It is not only small in size, flexible in use, low in cost, and highly reliable, but also can accurately limit the position of the wafer to be detected, which is convenient for the subsequent robot to quickly detect and locate the position of the wafer, thereby improving the overall wafer handling efficiency, and is particularly suitable for the scenario of small batch wafer handling. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0044] Figure 1 Schematic diagram of the overall structure of a wafer transport device in an embodiment of the present invention;

[0045] Figure 2 Another overall structural schematic diagram of a wafer transport device according to an embodiment of the present invention;

[0046] Figure 3 This is the internal structure diagram of the preload cavity;

[0047] Figure 4 A three-dimensional diagram of a wafer transport device according to an embodiment of the present invention;

[0048] Figure 5 This is an internal structural diagram of the bottom of the wafer transfer device in an embodiment of the present invention;

[0049] Figure 6 It is a structural schematic diagram of placing wafers on a wafer transport device according to an embodiment of the present invention;

[0050] Figure 7 It is a structural diagram of the lower end of the wafer transfer device in an embodiment of the present invention;

[0051] Figure 8 A partial enlarged view I of a wafer transport device according to an embodiment of the present invention;

[0052] Fig. 9 Another structural diagram of the lower end of the wafer transfer device in the embodiment of the present invention;

[0053] Fig.10 It is a partial enlarged view II of the wafer transfer device in the embodiment of the present invention;

[0054] Fig.11 is a three-dimensional diagram of an eccentric rod in an embodiment of the present invention;

[0055] Fig.12 A partial view of the eccentric rod at the limiting groove in an embodiment of the present invention;

[0056] Fig.13 AA sectional view of the eccentric rod in the embodiment of the present invention;

[0057] Fig.14 It is a partial enlarged view of the elastic force protection mechanism inside the eccentric rod in the embodiment of the present invention.

[0058] Numbers in the figure:

[0059] 1. Preload cavity; 101. Opening; 102. First accommodating cavity; 2. Moving cavity; 201. Mounting hole; 202. Dynamic seal; 203. Observation window; 204. Handle; 205. Second accommodating cavity; 206. Sealing port; 3. Sealing bottom plate; 301. Sealing O-ring; 4. Linkage mechanism; 401. Limiting frame; 402. Linkage frame; 403. First linkage rod; 404. Second linkage rod; 5. First actuating mechanism; 6. Second actuating mechanism; 601. First spring; 602. Sealing bellows; 603. Sealing flange; 604. Lower mounting plate; 605. Upper mounting plate; 7. Nitrogen interface; 8. Positioning mechanism; 801, driving rod; 802, connector; 803, first gear; 804, second gear; 805, eccentric rod; 8051, eccentric section; 8052, limiting groove; 8053, limiting groove bottom; 8054, negative pressure hole; 8055, hollow structure; 806, positioning sleeve; 807, positioning ring; 808, positioning ball; 809, positioning spring; 810, first positioning step; 9, wafer rack; 901, main connecting frame; 902, supporting frame; 903 or 903', positioning block; 904, second positioning step; 905, connecting hole; 10, wafer; 11, purge rod; 12, purge hole. DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0062] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0063] The wafer conveying device provided by the present invention needs to be used in conjunction with a pre-loaded cavity, wherein the pre-loaded cavity is a prior art and is relatively common in wafer conveying systems. Figures 1 to 3 The following is a common preload cavity. Figure 3 As shown, the pre-load chamber 1 is provided with a first accommodating chamber 102, and the first accommodating chamber 102 is used to provide an operating space for the robot to take and place the wafer. Figure 1 As shown, the side of the first accommodating cavity 102 (i.e. Figure 1 The left side shown in FIG. 1 is provided with an opening 101, and the opening 101 is used for the robot's manipulator to enter and exit. The robot and manipulator used to clamp the wafer and drive the wafer to enter and exit from the opening 101 belong to the prior art and will not be described in detail.

[0064] The wafer transport device provided by the present invention comprises: a moving chamber 2, a sealing bottom plate 3, a wafer rack 9 and a linkage mechanism. Among them, a possible specific structure of the moving chamber 2 is as follows: Figure 4 As shown. The shape of the mobile cavity 2 can be cylindrical or cubic. Preferably, in the present embodiment, the mobile cavity 2 is cylindrical. The mobile cavity 2 should be compatible with the first accommodating cavity 102. In the present embodiment, the shape of the first accommodating cavity 102 is cylindrical, and the diameter of the mobile cavity 2 is slightly smaller than the diameter of the first accommodating cavity 102, so that the mobile cavity 2 can be accommodated in the first accommodating cavity 102. In order to improve the positioning accuracy of the equipment and ensure the sealing effect during wafer transportation, the difference between the diameter of the mobile cavity 2 and the diameter of the first accommodating cavity 102 should be controlled within 1 mm.

[0065] like Figure 1 and Figure 4 As shown, the mobile cavity 2 is provided with a mounting hole 201. In this embodiment, the mounting hole 201 is arranged at the upper part of the mobile cavity 2, which is adapted to the specific structure of the linkage mechanism. Figure 1 In the embodiment, the number of the mounting holes 201 is 2, and the linkage mechanism is arranged on the mounting holes 201 .

[0066] like Figure 5 As shown, a second accommodating cavity 205 is provided inside the moving cavity 2. The second accommodating cavity 205 can have various shapes, and preferably, a cylindrical shape can be selected.

[0067] The bottom of the second accommodating cavity 205 is provided with a sealing opening 206, and the function of the sealing opening 206 is to cooperate with the sealing bottom plate 3 below to achieve the sealing of the second accommodating cavity 205. A possible structure of the sealing bottom plate 3 is as follows: Figure 4 and Figure 7 shown.

[0068] The sealing base plate 3 and the wafer rack 9 are both arranged on the linkage mechanism. Figure 4 and Figure 5 As shown, the linkage mechanism is mounted on the mounting hole 201 and extends through the mounting hole 201 into the second accommodating cavity 205. The wafer rack 9 is fixed at a higher position ( Figure 4 Perspective), the sealing bottom plate 3 is fixed to the bottom of the linkage mechanism ( Figure 4 The linkage mechanism can move up and down in the mounting hole 201 and can cooperate with the sealing opening 206 through the sealing bottom plate 3.

[0069] The linkage mechanism is provided with a dynamic seal 202 at the mounting hole 201. The function of the dynamic seal 202 is to cooperate with other structures to prevent the second accommodating cavity 205 from leaking at the mounting hole 201 due to the up and down movement of the linkage mechanism. Figure 4As shown, a lower mounting plate 604 is arranged at an appropriate position where the linkage mechanism and the mounting hole 201 cooperate with each other, a sealing flange 603 is arranged at the mounting hole 201, the sealing flange 603 is fixed at the mounting hole 201, and a sealing gasket can be arranged at the sealing flange 603 and the mounting hole 201 to improve the sealing effect, and a sealing bellows 602 is arranged between the lower mounting plate 604 and the sealing flange 603, wherein the upper end of the sealing bellows 602 is sealedly connected to the lower mounting plate 604, and the lower end of the sealing bellows 602 is sealedly connected to the sealing flange 603, and the retractable length of the sealing bellows 602 should be greater than the distance difference between the linkage mechanism moving to the highest point and the lowest point. Preferably, the retractable length of the sealing bellows 602 is greater than or equal to 1.5 times the distance difference. When the sealing flange 603 moves to the lowest end, it can cooperate with the dynamic seal 202 to achieve dynamic sealing at the mounting hole 201.

[0070] The wafer rack 9 and the sealing base plate 3 are fixed on the linkage mechanism. Figure 5 As shown. Figure 5 In the embodiment, the wafer rack 9 is directly fixed to the part of the linkage mechanism located in the second accommodating chamber 205, and the sealing bottom plate 3 is fixed to the bottom of the wafer rack 9, and further fixed to the linkage mechanism through the wafer rack 9.

[0071] One way to fix the sealing base plate 3 to the bottom of the wafer rack 9 is: set a connecting hole 905 (such as a threaded hole) at the bottom of the wafer rack 9, and then pass a connecting part (such as a bolt) through the sealing base plate 3 (a through hole should be set at the corresponding position), and fix the sealing base plate 3 on the connecting hole 905, so that the sealing base plate 3 is fixedly connected to the wafer rack 9.

[0072] In order to improve the sealing effect of the second accommodating cavity 205, as Figure 7 As shown, a sealing groove (not numbered in the figure) can be opened at the edge of the sealing bottom plate 3, and a sealing O-ring 301 of a suitable type can be arranged in the sealing groove. When the sealing bottom plate 3 moves upward from bottom to top to the sealing opening 206 driven by the linkage mechanism, the sealing O-ring 301 and the sealing opening 206 are pressed against each other to achieve sealing of the second accommodating chamber 205.

[0073] The positional relationship between the wafer rack 9 and the wafer 10 can be referred to Figure 6 .

[0074] It should be noted that there are multiple implementation structures of the linkage mechanism. The function of the linkage mechanism is that it can drive the wafer rack 9 and the sealing bottom plate 3 to move up and down in the second accommodating chamber 205 and the first accommodating chamber 102. The linkage mechanism switches between the first state, i.e., the highest position, and the second state, i.e., the lowest position, so that the second accommodating chamber 205 switches between a sealed state (i.e., the wafer is sealed and placed in the second accommodating chamber 205) and an open state (i.e., the wafer is located at the opening 101 and can be picked up and placed by the robot).

[0075] by Figure 1 and Figure 2 For example, when the linkage mechanism is in the first state (i.e., the linkage mechanism moves to the highest position), the sealing bottom plate 3 is abutted against the sealing port 206, the second accommodating chamber 205 is in a sealed state, and the wafer rack 9 is located in the second accommodating chamber 205, thereby realizing the sealed placement of the wafer in the wafer conveying device provided by the present invention for the user to transport the wafer; when the linkage mechanism is in the second state (i.e., the linkage mechanism moves to the lowest position), the sealing bottom plate 3 is disengaged from the sealing port 206, the second accommodating chamber 205 is in an open state, and the wafer rack is located outside the second accommodating chamber 205, and corresponds to the position of the opening 101. At this time, the robot can place the wafer on the wafer rack 9 through the opening 101 or take the wafer out from the wafer rack 9.

[0076] The working principle of the wafer handling device provided in the embodiment of the present invention is: when the linkage mechanism moves up and down, the sealing bottom plate 3 and the wafer rack 9 are separated from or approached to the sealing port 206 under the drive of the linkage mechanism, so as to realize the switching of the state of the second accommodating chamber 205, and then the working state of the wafer handling device of this embodiment is switched. Specifically, when the linkage mechanism moves to the lowest point, the wafer rack 9 is located at the opening 101, and the manipulator can pass through the opening 101 to take and place the wafer, and the second accommodating chamber 205 is in an open state. For the wafer handling device of this embodiment, it is in a state to be taken and placed. At this time, the inside of the second accommodating chamber 205 can be operated by the manipulator through the opening 101. When the wafer handling device is in a state to be taken and placed, the wafer on the wafer rack 9 can be taken and placed by the manipulator. Further, the linkage mechanism continues to move upward, and the sealing bottom plate 3 is close to the sealing port 206 under the drive of the linkage mechanism, and the wafer rack 9 continues to move upward into the second accommodating chamber 205 under the drive of the linkage mechanism. When the linkage mechanism moves to the highest point, the sealing bottom plate 3 abuts against the sealing port 206, the wafer rack 9 is located in the second accommodating chamber 205, and the second accommodating chamber 205 is in a sealed state. For the wafer conveying device of this embodiment, it is in a sealed conveying state.

[0077] When the wafer handling device of the present embodiment is in a sealed handling state, if a wafer is placed on the wafer rack 9, the wafer can be sealed and even transported. During transportation, the wafer is sealed and stored inside the wafer handling device. The user lifts the handle 204 fixed on the mobile cavity 2 and moves the wafer handling device as a whole to a position where the manipulator can operate. During the process of taking, placing or transporting the wafer, the user can also observe the placement state of the wafer inside the second accommodating cavity 205 through the observation window 203 (usually made of transparent glass or organic material) provided on the mobile cavity 2 to confirm whether the wafer is in a state that can be detected and taken and placed by the manipulator.

[0078] The beneficial effect achieved by the wafer handling device provided by the embodiment of the present invention is: through the up and down movement of the linkage mechanism, the sealed state and the open state of the mobile cavity 2 are switched, providing the user with a handling device that can seal and place wafers, transport wafers, and cooperate with a robot to pick up and place wafers. The handling device is compatible with the existing wafer handling system, making up for the shortcomings of the existing automation equipment. It is not only small in size, flexible in use, low in cost, and highly reliable, but also can accurately limit the position of the wafer to be detected in the handling device, facilitating the subsequent robot to quickly detect and locate the position of the wafer, thereby improving the overall handling efficiency of the wafer, and is particularly suitable for the scene of small batch wafer handling.

[0079] Optionally, based on the above-mentioned wafer transport device, the embodiment of the present invention further improves the linkage mechanism. Figure 1 and Figure 2 As shown, the linkage mechanism provided in the embodiment of the present invention specifically includes: a limit frame 401, a linkage frame 402 and a linkage rod. There can be multiple linkage rods, and this embodiment takes two linkage rods as an example for description. Figure 2 In the embodiment, the linkage rod includes a first linkage rod 403 and a second linkage rod 404 .

[0080] like Figure 2 As shown, the limit frame 401 is a horizontally arranged fixed frame, which is fixed on the mobile cavity 2. The fixing method can be to set several screws at the bottom of the limit frame 401 to fix the limit frame 401 to the upper part of the mobile cavity 2.

[0081] A limiting hole (not numbered in the figure) is provided on the limiting frame 401 for the linkage rod to move up and down. The first linkage rod 403 and the second linkage rod 404 are arranged in the limiting hole and can slide up and down.

[0082] The lower ends of the first linkage rod 403 and the second linkage rod 404 pass through the mounting hole 201 , extend into the second accommodating cavity 205 , and are connected to the wafer rack 9 and the sealing bottom plate 3 in sequence.

[0083] A horizontally arranged linkage frame 402 is arranged on the top of the first linkage rod 403 and the second linkage rod 404. The linkage frame 402 is used to move the first linkage rod 403 and the second linkage rod 404 up and down as a whole to avoid height inconsistency during the up and down movement, which causes the wafer 10 to shake left and right or even tilt on the wafer frame 9, making it impossible for the subsequent robot to quickly detect, position and clamp the wafer 10.

[0084] With the above structure, when the linkage frame 402 is located at the first height (i.e., the highest position), the linkage mechanism is in the first state (i.e., the highest position), the second accommodating chamber 205 is in a sealed state, and the wafer conveying device provided in this embodiment is in a sealed conveying state; when the linkage frame 402 is located at the second height (i.e., the lowest position), the linkage mechanism is in the second state (i.e., the lowest position), the second accommodating chamber 205 is in an open state, and the wafer conveying device provided in this embodiment is in a waiting-for-pickup and placement state.

[0085] The adoption of this technical solution provides a linkage mechanism with a simple structure, reliability and firmness, which is beneficial to improving the operating efficiency of users when using the wafer transport device.

[0086] Alternatively, if Figures 2 to 5 As shown, a possible linkage mechanism also includes: a first actuating mechanism 5. The lower end of the first actuating mechanism 5 is connected to the limit frame 401, and the upper end is connected to the linkage frame 402. The function of the first actuating mechanism 5 is to drive the linkage frame 402 to move up and down, thereby driving the linkage mechanism 4 to move up and down.

[0087] In order to improve the movement flexibility of the linkage mechanism 4, a possible actuating mechanism 5 is a gas spring. The gas spring is arranged vertically, and the movement direction is consistent with the up and down movement direction of the linkage mechanism 4. The lower end and the upper end of the gas spring can be fixedly connected by a connecting piece. Among them, the connecting piece is a prior art (such as a ball joint), and its function is to use the expansion and contraction of the gas spring to drive the linkage mechanism 4 to move up and down, which will not be repeated.

[0088] By adopting this technical solution, the linkage mechanism can be driven by the first actuating mechanism to move up and down, making it convenient for users to switch the state of the wafer handling equipment in this embodiment to improve efficiency. In particular, the use of gas springs can effectively reduce the probability of movement collision of the wafer handling equipment and improve the smoothness of the equipment use.

[0089] Alternatively, if Figure 4 As shown, the linkage mechanism further includes: a second actuating mechanism 6. One end of the second actuating mechanism 6 is connected to the limit frame 401, and the other end is connected to the linkage frame 402. The function of the second actuating mechanism 6 is to provide a reaction force so that the linkage mechanism has a force opposite to the force of the first actuating mechanism, so as to quickly switch the state.

[0090] A possible second actuating mechanism 6 is as follows: Figure 4 As shown, it includes a first spring 601 and an upper mounting plate 605. The two lower mounting plates 604 are respectively fixed on the first linkage rod 403 and the second linkage rod 404, and the upper mounting plate 605 is fixed on the limit frame 401. A through hole is provided in the center of the upper mounting plate 605, and the first linkage rod 403 and the second linkage rod 404 pass through the through hole respectively to realize up and down movement.

[0091] By adopting this technical solution, by setting up the second actuating mechanism 6, after the linkage mechanism 4 moves upward or downward, the first spring 601 is in a compressed or stretched state, cooperating with the first actuating mechanism 5 (with opposite forces), thereby reducing the operating difficulty, improving the operating efficiency, and quickly switching the state.

[0092] Optionally, the wafer transport device provided in the embodiment of the present invention further includes: a positioning mechanism 8.

[0093] The function of the positioning mechanism is to adjust the position of the wafer so that it has a more precise positioning or a predictable positioning, so as to facilitate the robot to pick up and place the wafer and improve the efficiency of picking up and placing.

[0094] A possible positioning mechanism 8, such as Figure 4 , Figure 6 , Figure 7 and Figure 8 As shown, it includes: a driving rod 801, a connector 802 and an eccentric rod 805.

[0095] The first linkage rod 403 has a first through hole (not numbered in the figure) inside, the driving rod 801 is disposed in the first through hole, and the portion where the driving rod 801 is connected to the first linkage rod 403 is sealed (a sealed bearing may be provided) to avoid affecting the sealing effect of the second accommodation chamber 205. Figure 4 As can be seen in the figure, the driving rod 801 is coaxially arranged with the first linkage rod 403.

[0096] The eccentric rod 805 is disposed on the wafer rack 9 .

[0097] The connection structure and self structure of the eccentric rod 805 can be referred to Figure 7 , Figure 8 and Fig.11 The lower end of the eccentric rod 805 is provided with an eccentric section 8051, and when the driving rod 801 rotates, the eccentric section 8051 at the lower end will rotate.

[0098] The eccentric rod 805 is connected to the lower end of the driving rod 801 through the connector 802, that is, the eccentric rod 805 can rotate under the action of the driving rod 801. A possible connector is: a magnetic coupling connector, the principle is to set two permanent magnets and rotate one of the permanent magnets to drive the other permanent magnet to rotate. There are mature magnetic coupling connectors on the market, which will not be described here.

[0099] In this embodiment, a connector 802 is provided at the lower end of the driving rod 801, a first gear 803 is provided on the connector 802, and a second gear 804 is provided at the upper end of the eccentric rod 805. The first gear 803 and the second gear 804 are meshed with each other. By rotating the driving rod 801, the eccentric rod 805 can be driven to rotate through the connector 802, the first gear 803 and the second gear 804. Since the eccentric rod 805 is provided at the edge of the wafer (the distance is preset according to the size of the wafer and the size of the eccentric rod), and the eccentric section 8051 is provided on the eccentric rod 805, when the eccentric rod 805 rotates, the distance between the eccentric section 8051 and the edge of the wafer 10 will change. When the eccentric rod 805 rotates to an appropriate angle, the eccentric section 8051 contacts the edge of the wafer 10, thereby achieving position adjustment or position restriction of the wafer 10.

[0100] By adopting the above technical solution, the position of the wafer can be adjusted or restricted by setting a positioning mechanism, thereby reducing the unpredictability of the wafer position, reducing the difficulty of wafer detection, and improving the efficiency of subsequent wafer placement by the robot.

[0101] On the basis of the above, this embodiment provides a wafer rack 9, such as Figures 5 to 9 As shown, it specifically includes: a main connecting frame 901, at least two groups of supporting frames 902 and at least two groups of positioning blocks 903. In this embodiment, in order to facilitate the description of the specific structure, the number of groups of supporting frames 902 and positioning blocks 903 is two. Figure 7 In the perspective shown, there is a set of support frames 902 and a set of positioning blocks 903 on each side.

[0102] like Figure 6 As shown, the main connecting frame 901 is connected to the first linkage rod 403 and the second linkage rod 404 .

[0103] The support frame 902 is arranged on both ends of the main connecting frame 901, and the positioning blocks 903 are horizontally arranged on the support frame 902. The support frame 902 can be arranged in multiple layers, and the positioning blocks 903 are arranged on each layer of the support frame 902 for supporting the placed wafer 10.

[0104] like Figure 8As shown, a second positioning step 904 is provided on the positioning block 903, and the second positioning step 904 is used to position the edge of the wafer 10. Generally speaking, the second positioning step 904 requires very high machining accuracy.

[0105] like Figure 7 As shown, the eccentric rod 805 is arranged on one side of the main connecting frame 901 and is close to the edge of the wafer 10 . When the eccentric rod 805 rotates to a certain position, the outer side surface of the eccentric segment 8051 can abut against the edge of the wafer 10 .

[0106] like Figure 7 As shown, the positioning block 903' arranged opposite to the eccentric rod 805 serves as the positioning reference of the wafer 10. As the positioning reference of the wafer 10, the positioning block 903' needs to have higher processing accuracy than other positioning blocks 903, specifically, the second positioning step 904 has higher processing accuracy.

[0107] The working principle of this technical solution is: only Fig. 9 The group of positioning blocks 903' shown in the figure is required to have higher processing accuracy than other groups of positioning blocks 903, and the positioning blocks 903' are used as the positioning reference of the wafer 10; by rotating the eccentric rod 805, the eccentric section 8051 thereof is brought into contact with the edge of the wafer 10, and the wafer 10 is pushed toward the positioning blocks 903', thereby making the positioning of the wafer 10 more accurate. The subsequent robot uses the positioning blocks 903' as a reference to detect the position of the wafer 10, which can improve the detection accuracy and efficiency.

[0108] In this case, only the positioning block 903 ′ needs to have a high processing accuracy, and the other positioning blocks 903 can be processed at a normal processing speed, which can reduce the processing cost.

[0109] Alternatively, if Figure 8 and Fig.11 As shown, a limiting groove 8052 is provided on the eccentric rod 805 , and the limiting groove 8052 is at the same horizontal position as the wafer 10 to be placed.

[0110] The function of the limit groove is to limit the wafer when the wafer needs to be restricted from moving up and down. The upper and lower widths of the limit groove 8052 are slightly thicker than the thickness of the wafer, and are adjusted according to the size of the wafer and the degree of transportation bumps.

[0111] Alternatively, if Fig.12 and Fig.13 As shown, the bottom of the limiting groove 8052, i.e., the limiting groove bottom 8053, is a curved surface structure. A possible curved surface structure is as follows Fig.13 Shown is a portion of a quarter ellipse.

[0112] Compared with the eccentric rod 805 with an eccentric structure, the limit groove 8052 is set to limit the up and down movement of the wafer 10, and the curved surface structure is further set at the bottom of the limit groove 8053, so that the position of the wafer 10 can be fine-tuned and limited, so that the bottom of the limit groove 8053 and the eccentric section 8051 cooperate with each other, thereby reducing the risk of damage to the wafer when the torque of the eccentric rod 805 is too large, and effectively avoiding the loosening of the wafer during transportation (in combination with the flexible clamping force of the magnetic coupling connector, the clamping force can be slightly adjusted at a microscopic angle), thereby reducing the risk of edge collapse.

[0113] By adopting this technical solution, the wafers can be effectively protected, especially during transportation, to effectively avoid wafer damage.

[0114] Optionally, it also includes: a nitrogen purge mechanism.

[0115] The nitrogen purge mechanism includes: a nitrogen source, a first pipeline and a purge rod 11 .

[0116] The nitrogen source is used to provide clean nitrogen to the wafer handling device. Figure 1 and Figure 2 Nitrogen is supplied to the internal first pipeline through the nitrogen interface 7, and then nitrogen is supplied to the purge rod 11 through the first pipeline.

[0117] The purge rod 11 is arranged near the positioning block 903' which serves as the positioning reference. Fig. 9 and Fig.10 As shown, a plurality of purge holes 12 are provided on the purge rod 11. A group of purge holes 12 are distributed on the upper and lower sides of the same wafer 10. Nitrogen is transmitted to the purge rod 11 through the first pipeline, and then used to purge both sides of the wafer 10 through the purge holes 11.

[0118] By adopting this technical solution, the wafer conveying device is equipped with the function of blowing nitrogen to the wafers.

[0119] Optionally, it further includes: a negative pressure source. The function of the negative pressure source is to provide negative pressure to cooperate with the nitrogen source to effectively purge the wafer.

[0120] like Fig.13 As shown, the eccentric rod 805 has a hollow structure 8055 inside, and the hollow structure 8055 is connected to the negative pressure source. The bottom of the limit groove 8052, that is, the limit groove bottom 8053, has two "eight"-shaped (i.e. Fig.13 The negative pressure holes 8054 are arranged in a convex shape (angle α in the middle, which is adjusted according to the wafer size). The negative pressure holes 8054 are connected to the negative pressure source through the hollow structure 8055, and negative pressure is formed at the bottom 8053 of the limiting groove.

[0121] By adopting this technical solution, the nitrogen after purge can be guided to be discharged from the negative pressure hole, which makes the surface purge effect of the entire wafer better than discharging nitrogen from other positions.

[0122] Alternatively, if Fig.14 As shown, it also includes: an elastic protection mechanism.

[0123] The elastic force protection mechanism includes: a positioning sleeve 806 , a positioning ring 807 , a positioning ball 808 and a positioning spring 809 .

[0124] like Fig.13 and Fig.14 As shown, the negative pressure hole 8054 is provided with a first positioning step 810 near the limiting groove bottom 8053 , and the positioning sleeve 806 is used to provide a track for the extension and retraction of the positioning spring 809 . The positioning sleeve is arranged in the negative pressure hole 8054 and located at the first positioning step 810 .

[0125] The positioning spring 809 is arranged in the positioning sleeve 806, and the elastic coefficient of the positioning spring 809 should be small enough to be compressed under negative pressure. The positioning ball 808 is arranged at the top of the positioning sleeve 806 and the positioning spring 809, and the positioning ball 808 is pressed against the positioning spring 809. When the negative pressure source does not provide negative pressure, the positioning spring 809 will make the positioning ball 808 protrude from the bottom of the limiting groove 8053 and abut against the edge of the wafer 10.

[0126] The positioning ring 807 is arranged at the top of the negative pressure hole 8054, and the arrangement method can be: an internal thread is arranged at the top of the negative pressure hole 8054, and an external thread is arranged on the outside of the positioning ring 807, and the positioning ring 807 is fixed to the top of the negative pressure hole 8054 through the internal and external threads. A groove can also be arranged at the top of the negative pressure hole 8054, and the positioning ring 807 adopts an elastic structure (such as an elastic gasket) so that the positioning ring 807 can be stuck in the groove, thereby being fixed to the top of the negative pressure hole 8054. The positioning ring 807 is used to limit the positioning ball 808 from popping out of the negative pressure hole 8054 under the action of the positioning spring 809.

[0127] By adopting the above-mentioned mechanism, when the negative pressure source does not provide negative pressure, the positioning spring 809 can provide a certain elastic force to enable the positioning ball 808 to maintain elastic contact with the edge of the wafer 10, especially in the process of twisting the driving rod 801 and driving the eccentric rod 805 to rotate and during transportation, providing a certain elastic space can avoid edge collapse of the wafer 10; on the other hand, when the negative pressure source provides negative pressure or the nitrogen pressure is too high, the nitrogen can be discharged smoothly, thereby playing a dual role of protection and nitrogen discharge.

[0128] It should be noted that there is still a small probability of edge collapse risk between the limiting groove bottom 8053 and the eccentric segment 8051 during rotation. The elastic protection mechanism can further cooperate with the limiting groove bottom 8053 and the eccentric segment 8051 to reduce the impact of the limiting groove bottom 8053 and the eccentric segment 8051 on the edge of the wafer, thereby playing a protective role.

[0129] In the present invention, unless otherwise clearly specified and limited, a first feature being “on” or “under” a second feature may mean that the first feature and the second feature are in direct contact, or the first feature and the second feature are in indirect contact via an intermediate medium.

[0130] Moreover, the first feature being “above”, “above”, and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “below”, “below”, and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0131] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer transfer device, used in conjunction with a pre-loading chamber, wherein the pre-loading chamber is provided with a first accommodating chamber, and a side of the first accommodating chamber is provided with an opening, characterized in that: include: Moving chamber, sealing base plate, wafer rack and linkage mechanism; The shape of the movable cavity is adapted to the first accommodating cavity, and the movable cavity can be accommodated in the first accommodating cavity; The movable cavity is provided with a mounting hole, and the linkage mechanism is arranged on the mounting hole; A second accommodating chamber is provided inside the movable cavity, and a sealing opening is provided at the bottom of the second accommodating chamber; The sealing bottom plate and the wafer rack are arranged on the linkage mechanism; When the linkage mechanism is in the first state, the sealing bottom plate abuts against the sealing port, the second accommodating cavity is in a sealed state, and the wafer rack is located in the second accommodating cavity; When the linkage mechanism is in the second state, the sealing bottom plate is separated from the sealing port, the second accommodating cavity is in an open state, and the wafer rack is located outside the second accommodating cavity and corresponds to the position of the opening.

2. The wafer transfer device according to claim 1, characterized in that: The linkage mechanism comprises: a limit frame, a linkage frame and a linkage rod; The limiting frame is fixedly arranged on the moving cavity, and the linkage rod is slidably arranged on the limiting frame; The lower end of the linkage rod is connected to the wafer rack, and the upper end of the linkage rod is connected to the linkage rack; When the linkage frame is located at a first height, the linkage mechanism is in the first state, and when the linkage frame is located at a second height, the linkage mechanism is in the second state.

3. The wafer transfer device according to claim 2, characterized in that: The linkage mechanism further comprises: a first actuating mechanism, one end of which is connected to the limiting frame, and the other end of which is connected to the linkage frame.

4. The wafer transfer device according to claim 3, characterized in that: The linkage mechanism further comprises: a second actuating mechanism, one end of the second actuating mechanism is connected to the limiting frame, and the other end of the second actuating mechanism is connected to the linkage frame.

5. The wafer transfer device according to claim 3, characterized in that: Also includes: Positioning mechanism; The positioning mechanism further comprises: a driving rod, a connector and an eccentric rod; The linkage rod is provided with a first through hole, and the driving rod is arranged in the first through hole; The eccentric rod is arranged on the wafer rack, and the eccentric rod is connected to the lower end of the driving rod through the connector.

6. The wafer transfer device according to claim 5, characterized in that: The wafer rack comprises: a main connecting frame, at least two groups of supporting frames and at least two groups of positioning blocks; The main connecting frame is connected to the linkage rod; The support frame is arranged on the main connecting frame, the positioning block is horizontally arranged on the support frame, and the support frame and the positioning block are used to support the placed wafer; The eccentric rod is arranged on one side of the main connecting frame; A group of the positioning blocks arranged opposite to the eccentric rod serves as a positioning reference for the wafer and has higher processing accuracy than other positioning blocks.

7. The wafer transfer device according to claim 6, characterized in that: The eccentric rod is provided with a limiting groove, and the limiting groove and the wafer to be placed are at the same horizontal position.

8. The wafer transfer device according to claim 7, characterized in that: The bottom of the limiting groove is a curved structure.

9. The wafer transfer device according to claim 8, characterized in that: Also includes: Nitrogen purge mechanism; The nitrogen purge mechanism comprises: a nitrogen source, a first pipeline and a purge rod; The purge rod is arranged near the wafer positioning block serving as a positioning reference, and a plurality of purge holes are arranged on the purge rod; The nitrogen source is connected to the purge rod through the first pipeline, and is used to provide nitrogen to the purge hole.

10. The wafer transfer device according to claim 9, characterized in that: Also includes: Negative pressure source; A hollow structure is provided inside the eccentric rod, and two negative pressure holes arranged in an "eight" shape are provided at the bottom of the eccentric rod located at the limiting groove. The negative pressure holes are connected to the negative pressure source through the hollow structure.

11. The wafer transfer device according to claim 10, characterized in that: Also includes: Elastic protection mechanism; The elastic force protection mechanism comprises: a positioning sleeve, a positioning ring, a positioning ball and a positioning spring; The negative pressure hole is provided with a first positioning step near the bottom of the limiting groove; The positioning sleeve is arranged in the negative pressure hole and is located at the first positioning step; The positioning spring is arranged in the positioning sleeve, the positioning ball is arranged at the top end of the positioning spring, and the positioning ball protrudes from the bottom of the limiting groove; The positioning ring is arranged at the top end of the negative pressure hole, and the positioning ring is used to limit the positioning ball from popping out of the negative pressure hole.

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