Integrated thin-wall lattice cooling plate and electronic component

Abstract

The invention discloses an integrated thin-wall dot matrix cooling plate and an electronic component, the integrated thin-wall dot matrix cooling plate comprises a hollow cold plate body, a cooling flow channel, a liquid inlet and a liquid outlet are arranged in the cold plate body, the liquid inlet and the liquid outlet are communicated with the cooling flow channel, the cooling flow channel is filled with a hollow heat exchange body, and the hollow heat exchange body is filled with a liquid outlet. The positions, except for the cooling flow channels, of the cold plate body are arranged to be of the hollowed-out structure, so that the whole cold plate body can achieve light weight, the hollowed-out heat exchange bodies are arranged in the cooling flow channels, the contact positions of cooling liquid and the heat exchange bodies have the larger specific surface area, and therefore the heat exchange effect of the cold plate is better.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic equipment cooling, and in particular relates to an integrated thin-wall lattice cooling plate and an electronic component. Background Art

[0002] As electronic devices have higher and higher demands on chip performance on plug-ins, chip size is getting smaller, power consumption is getting higher, and the heat flux density on the chip surface is significantly increased, which puts higher requirements on thermal control technology. Liquid-cooled cold plates are a commonly used thermal control product for high-power plug-ins. Due to the constraints of machining technology and three-dimensional modeling technology, the flow channel distribution inside the cold plate can only be horizontal, vertical, or in a relatively regular form. This form leads to a large overall flow resistance of the flow channel and the flow distribution is not easy to adjust from the design end, which limits the actual heat dissipation effect of the liquid-cooled cold plate. Although the document number CN115621608A "A protection and heat dissipation structure based on a mixed arrangement of open and closed hole negative Poisson's ratio cells" discloses a heat dissipation structure with a lattice cell structure, which is also composed of two lattice cell structures stacked into a matrix and a cooling channel respectively, the surface of its overall structure is small, so its actual heat dissipation effect is not good. Summary of the invention

[0003] In order to solve the above technical problems, one of the objectives of the present invention is to provide an integrated thin-walled lattice cooling plate which has a simple structure, good heat dissipation effect and is lightweight.

[0004] In order to achieve the above-mentioned purpose, the technical solution of the present invention is as follows: an integrated thin-walled lattice cooling plate, comprising a hollow cold plate body, in which a cooling channel and a liquid inlet and a liquid outlet connected to the cooling channel are arranged, and the cooling channel is filled with a hollow heat exchanger.

[0005] The beneficial effect of the above technical solution is that by setting the position of the cold plate body except the cooling channel as a hollow structure, the entire cold plate body can be lightweight, and a hollow heat exchanger is set in the cooling channel, so that the contact point between the coolant and the heat exchanger has a larger specific surface area, thereby achieving a better heat exchange effect.

[0006] The cold plate body and the heat exchange body described in the above technical solution are both formed by integrally stacking the lattice cell structure.

[0007] The beneficial effect of the above technical solution is that the gaps in the cold plate body and the heat exchanger are evenly distributed, especially for the heat exchanger, which is filled in the cooling channel so that the cooling channel can be arranged in a flexible manner, so that the position of the cooling zone on the entire cold plate body can be flexibly arranged.

[0008] The cold plate body in the above technical solution is formed by stacking lightweight lattice cells.

[0009] The beneficial effects of the above technical solution are: its structure is simple, and the entire cold plate body is lightweight, while the heat exchange effect with the heat source is good.

[0010] The heat exchanger described in the above technical solution is formed by stacking minimal surface lattice cells.

[0011] The beneficial effect of the above technical solution is that when the coolant flows through the heat exchanger, its flow resistance is small, and the specific surface area of ​​heat exchange between the coolant and the heat exchanger is large.

[0012] The cold plate body and the heat exchange body in the above technical solution are integrally manufactured using an additive manufacturing process.

[0013] The beneficial effects of the above technical solution are: it is easy to manufacture, and enables the cold plate body and the heat exchange body to be processed as an integral unit simultaneously, and makes the arrangement path of the cooling channel more flexible.

[0014] The cold plate body and the heat exchange body in the above technical solution are both made of metal.

[0015] The beneficial effect of the above technical solution is that its thermal conductivity is good, so that the heat exchange effect of the entire cooling plate is good and the cooling effect is good.

[0016] The cold plate body and the heat exchange body in the above technical solution are both made of aluminum or copper.

[0017] The beneficial effects of the above technical solution are: it has good heat exchange effect and is easy to process through additive manufacturing technology.

[0018] In the above technical solution, the cooling channels are arranged in a mesh shape in the cold plate body.

[0019] The beneficial effect of the above technical solution is that the cooling area distribution of the entire cooling channel on the cold plate body is more flexible, and the cooling channel distribution density can also be flexibly arranged according to the concentration of the heat source distribution.

[0020] In the above technical solution, the edge of the cold plate body is provided with an edge strip.

[0021] The beneficial effect of the above technical solution is that the edge of the cold plate body is reinforced by the edge strip.

[0022] A second object of the present invention is to provide an electronic component with a simple structure and good heat dissipation effect.

[0023] In order to achieve the above-mentioned object, another technical solution of the present invention is as follows: an electronic component comprises the above-mentioned integrated thin-wall lattice cooling plate.

[0024] The beneficial effects of the above technical solution are: its structure is simple and its cooling effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is an exploded view of the heat exchanger and the cold plate body in Example 1 of the present invention;

[0026] Figure 2 This is a schematic diagram of the heat exchanger in Example 1 of the present invention being arranged in a cooling channel;

[0027] Figure 3 It is a vertical view of the minimal surface lattice cell described in Example 1 of the present invention;

[0028] Figure 4 A side view of one side of a minimal surface lattice cell described in Example 1 of the present invention;

[0029] Figure 5 A side view of the other side of the minimal surface lattice cell described in Example 1 of the present invention;

[0030] Figure 6 It is a vertical view of the lightweight lattice cell described in Example 1 of the present invention;

[0031] Figure 7 A side view of one side of the lightweight lattice cell described in Example 1 of the present invention;

[0032] Figure 8 A side view of the other side of the lightweight lattice cell described in Example 1 of the present invention;

[0033] Fig. 9 This is a schematic structural diagram of the integrated thin-wall lattice cooling plate described in Example 2 of the present invention;

[0034] Fig.10 This is a schematic structural diagram of the integrated thin-wall lattice cooling plate described in Example 3 of the present invention;

[0035] Fig.11 This is a schematic diagram of the structure of the electronic component described in Example 4 of the present invention.

[0036] In the figure: 1. cold plate body; 11. cooling channel; 12. liquid inlet; 13. liquid outlet; 14. lightweight lattice cell; 2. heat exchanger; 21. minimal surface lattice cell; 3. edging strip; 4. plate-shaped shell; 5. electronic components. DETAILED DESCRIPTION

[0037] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention. The present invention is described in more detail by way of example with reference to the accompanying drawings in the following paragraphs. The advantages and features of the present invention will become clearer according to the following description and claims. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0038] Example 1

[0039] like Figure 1 and Figure 2 As shown, this embodiment provides an integrated thin-walled lattice cooling plate, including a hollow cold plate body 1, in which a cooling channel 11 and a liquid inlet 12 and a liquid outlet 13 connected to the cooling channel 11 are arranged, and the cooling channel 11 is filled with a hollow heat exchange body 2. By setting the position of the cold plate body except the cooling channel as a hollow structure, the entire cold plate body can be lightweight, and a hollow heat exchange body is arranged in the cooling channel, so that the contact point between the coolant and the heat exchange body has a larger specific surface area, thereby improving the heat exchange effect.

[0040] In the above technical solution, the cold plate body 1 and the heat exchanger 2 are both formed by integrally stacking a lattice cell structure, so that the gaps in the cold plate body and the heat exchanger are evenly distributed. In particular, for the heat exchanger, it is filled in the cooling channel so that the cooling channel can be arranged in a flexible manner, thereby making the position of the cooling zone on the entire cold plate body flexibly arranged.

[0041] like Figure 6-Figure 8 As shown, the cold plate body 1 in the above technical solution is composed of lightweight lattice cells 14 stacked together, which has a simple structure and makes the entire cold plate body lightweight. At the same time, it has a good heat exchange effect with the heat source, wherein the lightweight lattice cell can adopt a simple cubic lattice cell structure (specifically, it can be an Octet lattice cell structure).

[0042] like Figure 3-Figure 5 As shown, the heat exchanger 2 in the above technical solution is composed of minimal surface lattice cells 21 stacked together, so that when the coolant flows through the heat exchanger, its flow resistance is small and the specific surface area of ​​heat exchange between the coolant and the heat exchanger is large.

[0043] The lightweight lattice cell 14 and the minimal surface lattice cell 21 are both approximately rectangular or cube-shaped, so their side views are approximately square (e.g. Figure 4 , Figure 5 , Figure 7 and Figure 8 shown).

[0044] The cold plate body 1 and the heat exchanger 2 in the above technical solution are integrally manufactured by additive manufacturing, which is simple to manufacture, enables the cold plate body and the heat exchanger to be integrally formed simultaneously, and makes the arrangement path of the cooling channel more flexible.

[0045] In the above technical solution, the cold plate body 1 and the heat exchange body 2 are both made of metal materials with good thermal conductivity, so that the heat exchange effect and cooling effect of the entire cooling plate are good.

[0046] In the above technical solution, the cold plate body 1 and the heat exchange body 2 are both made of aluminum or copper, which have good heat exchange effect and are easy to process through additive manufacturing technology.

[0047] In the above technical solution, the cooling channels 11 are arranged in a mesh shape in the cold plate body 1, so that the cooling area distribution of the entire cooling channel on the cold plate body is more flexible, and the cooling channel distribution density can also be flexibly arranged according to the concentration of heat source distribution.

[0048] Among them, the cooling flow channel described in this embodiment may include multiple main flow channels and branch flow channels, the two ends of the multiple main flow channels merge and are respectively connected to the liquid inlet and the liquid outlet, and a branch flow channel can be set between two adjacent main flow channels (of course, multiple branch flow channels can be set between two adjacent main flow channels), and the directions of each main flow channel and branch flow channel can be irregular (both the main flow channel and the branch flow channel may not be in a horizontal or vertical state).

[0049] Although the cold plate body described in this embodiment is hollow, the cooling channel is closed relative to the cold plate body. The advantages of the cooling plate provided by this embodiment are reflected in the following aspects: the channel arrangement is more flexible, and complex-shaped channels can be realized to improve the heat dissipation effect; the lattice structure can be filled on the cooling plate as needed, which can reduce weight and improve the heat dissipation effect; the process flow is simplified. The traditional cooling plate is to mill the channel on the plate and then weld a cover plate to close the channel. The cooling plate provided in this embodiment is integrally formed.

[0050] Example 2

[0051] As shown in the figure, the difference is that Fig. 9 As shown, in the above technical solution, the edge of the cold plate body is provided with an edging strip 3, so that the edge of the cold plate body is reinforced by the edging strip, and the liquid inlet and the liquid outlet both pass through the outside of the edging strip, wherein the edging strip is a frame-shaped strip, and the cold plate body is just wrapped in the edging strip.

[0052] Example 3

[0053] Same as Example 1, except that Fig.10As shown, the outer side of the cold plate body may further include a plate-shaped shell 4 to wrap it, and the liquid inlet and the liquid outlet both pass through the outside of the plate-shaped shell 4.

[0054] Example 4

[0055] like Fig.11 As shown, this embodiment provides an electronic component, including an integrated thin-walled lattice cooling plate as described in Example 1, Example 2 or Example 3, which has a simple structure and a good cooling effect. The electronic component 5 described in this embodiment can be directly installed on the integrated thin-walled lattice cooling plate, and the network of cooling channels at the positions corresponding to the electronic components with high heat generation is denser, so that the heat dissipation effect is better.

[0056] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. An integrated thin-walled lattice cooling plate, characterized in that: It comprises a hollow cold plate body (1), wherein a cooling channel (11) and a liquid inlet (12) and a liquid outlet (13) connected to the cooling channel (11) are arranged in the cold plate body (1), and the cooling channel (11) is filled with a hollow heat exchange body (2).

2. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The cold plate body (1) and the heat exchange body (2) are both formed by integrally stacking a lattice cell structure.

3. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The cold plate body (1) is formed by stacking lightweight lattice cells (14).

4. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The heat exchanger (2) is formed by stacking minimal curved surface lattice cells (21).

5. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The cold plate body (1) and the heat exchange body (2) are integrally manufactured using an additive manufacturing process.

6. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The cold plate body (1) and the heat exchange body (2) are both made of metal.

7. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The cold plate body (1) and the heat exchange body (2) are both made of aluminum or copper.

8. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The cooling channels (11) are arranged in a mesh shape inside the cold plate body (1).

9. The integrated thin-walled lattice cooling plate according to claim 1, characterized in that: The edge of the cold plate body is provided with an edge strip (3).

10. An electronic component, characterized in that: It comprises an integrated thin-wall lattice cooling plate as described in any one of claims 1 to 9.

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