Display panel and display device

Abstract

The invention discloses a display panel and a display device.The display panel further comprises a substrate, a pixel definition layer, a suspension structure, a plurality of light-emitting units, a packaging layer, glass cement and a packaging cover plate, the pixel definition layer is arranged on the substrate, and the suspension structure is arranged on the pixel definition layer and surrounds an opening; the plurality of light emitting units are arranged in the plurality of openings; the packaging layer covers the light-emitting unit and the overhanging structure; the glass cement is arranged in the non-display area and surrounds the display area; the packaging cover plate is arranged on the inorganic packaging layer, is attached to the substrate through glass cement in the non-display area, and is supported through the suspension structure in the display area. The glass cement and the packaging cover plate are adopted to achieve packaging, water vapor and oxygen are prevented from entering the display area from the film layer interface, and the packaging capacity of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent device. It has attracted great attention due to its advantages of simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display. As a new generation of display method, OLED display technology has begun to gradually replace traditional liquid crystal display technology and will be widely used in electronic devices such as mobile phones, computers, full-color TVs, digital cameras, personal digital assistants, etc. OLED display technology is different from traditional liquid crystal display technology. The OLED device of the OLED display panel includes an anode, a cathode and a light-emitting layer placed between the anode and the cathode. When a voltage is applied between the anode and the cathode, holes and electrons move to the light-emitting layer, and the holes and electrons recombine in the light-emitting layer to emit light.

[0003] However, the cathode in the OLED display panel is an active metal, which is very sensitive to water vapor and oxygen in the air. It is very easy to react with water vapor and oxygen that penetrate from the outside, affecting the injection of charge. In addition, the infiltrated water vapor and oxygen will also chemically react with the organic light-emitting materials in the light-emitting layer, damaging the organic light-emitting materials, greatly reducing the luminous efficiency of the organic light-emitting materials, causing the performance of the OLED display panel to decline and the life to be shortened. Therefore, the OLED display panel has very high requirements for packaging. Summary of the invention

[0004] The purpose of the present application is to provide a display panel and a display device, which use glass glue and a packaging cover plate to achieve packaging, prevent water vapor and oxygen from entering the display area from the film layer interface, and are beneficial to improving the packaging capacity of the display panel.

[0005] The present application discloses a display panel, which includes a display area and a non-display area. The display panel also includes a base substrate, a pixel definition layer, a suspension structure, a plurality of light-emitting units, an encapsulation layer, glass glue and an encapsulation cover plate. The pixel definition layer is arranged on the base substrate and has a plurality of openings in the display area; the suspension structure is arranged on the pixel definition layer and surrounds the openings; a plurality of the light-emitting units are arranged in the plurality of openings; the encapsulation layer covers the light-emitting units and the suspension structure; the glass glue is arranged in the non-display area and surrounds the display area; the encapsulation cover plate is arranged on the encapsulation layer, is bonded to the base substrate by the glass glue in the non-display area, and is supported by the suspension structure in the display area.

[0006] Optionally, the encapsulation layer includes an inorganic encapsulation layer, and at the opening, the inorganic encapsulation layer and the encapsulation cover plate form a cavity, and at the overhang structure, an inorganic encapsulation layer is provided between the overhang structure and the encapsulation cover plate.

[0007] Optionally, the overhang structure includes a first conductive layer and a first insulating layer, the first conductive layer is arranged on the pixel definition layer, the first insulating layer is arranged on the conductive layer, and the width of the first insulating layer is greater than the width of the first conductive layer; the light-emitting unit includes a bottom electrode, a light-emitting layer and a top electrode, the top electrodes of adjacent light-emitting units are connected through the first conductive layer, and the light-emitting layers of adjacent light-emitting units are separated by the overhang structure; at each of the openings in the display area, the overhang structure and the packaging cover plate form a cavity.

[0008] Optionally, the light-emitting layer and the top electrode are formed by whole-surface evaporation, and at the position of the glass glue, a light-emitting redundant portion is formed synchronously with the light-emitting layer, and a top electrode redundant portion is formed synchronously with the top electrode. The glass glue is used to remove the light-emitting redundant portion and the top electrode redundant portion below the glass glue position during laser sintering.

[0009] Optionally, the pixel definition layer is formed of an inorganic material, the pixel definition layer extends from the display area to the non-display area, an inorganic extension portion is formed in the non-display area, one side of the glass glue is in contact with the packaging cover plate, and the other side of the glass glue is in contact with the inorganic extension portion.

[0010] Optionally, the display panel also includes an overhanging extension portion, which also includes a second conductive layer and a second insulating layer. The overhanging extension portion is arranged in the non-display area and is located on a side of the glass glue close to the display area. On a side of the glass glue close to the display area, the second insulating layer protrudes from the second conductive layer. The overhanging extension portion is used to separate the light-emitting redundant portion and the top electrode redundant portion.

[0011] Optionally, the display panel further includes a cathode connecting portion, the inorganic extension portion is further provided with a through hole, the cathode connecting portion is connected to the second conductive layer through the through hole, and the second conductive layer is connected to the first conductive layer.

[0012] Optionally, a gap is provided between the overhang extension portion and the glass glue; the overhang extension portion is provided around the display area and is formed in the same process as the overhang structure of the display area, and the first conductive layer is connected to the second conductive layer.

[0013] Optionally, the display panel also includes a pixel driving layer, which is arranged between the base substrate and the pixel definition layer. The pixel driving layer also includes a reflective metal layer, which is arranged under the glass glue and is used to reflect laser onto the glass glue when the glass glue is laser sintered.

[0014] The present application also discloses a display device, comprising a driving circuit and the above-mentioned display panel, wherein the driving circuit is used to drive the display panel to display.

[0015] The encapsulation of the display panel of the present application is mainly achieved by glass glue and encapsulation cover plate, wherein the glass glue is arranged around the display area, the non-display area of ​​the display panel is encapsulated by glass glue, and the encapsulation cover plate located in the display area is supported by a suspension structure. Compared with the thin film encapsulation technology in the exemplary technology, the glass glue encapsulation technology adopted in the present application has better encapsulation reliability and will not have the problem of water vapor intrusion existing in the thin film encapsulation technology. In particular, when the glass glue is sintered at high temperature, the organic material and cathode evaporated on the entire surface can be melted, the path of water and oxygen intrusion can be cut off, and water vapor and oxygen can be prevented from entering the display area from the interface of the film layer, which is beneficial to improving the encapsulation capacity of the display panel and improving the display effect and service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0017] Figure 1 is a schematic top view of a display panel of the present application;

[0018] Figure 2 yes Figure 1 Schematic diagram of the cross section along the cutting line AA;

[0019] Figure 3 yes Figure 1 Schematic diagram of the cross section along the cutting line BB;

[0020] Figure 4 is a schematic diagram of another cathode connection portion of the present application;

[0021] Figure 5 is a schematic diagram of a display device of the present application.

[0022] Among them, 100, display panel; 101, display area; 102, non-display area; 110, base substrate; 120, pixel definition layer; 121, opening; 122, inorganic extension; 123, through hole; 130, overhang structure; 131, first conductive layer; 132, first insulating layer; 133, overhang extension; 134, second conductive layer; 135, second insulating layer; 140, light-emitting unit; 141, bottom electrode; 142, light-emitting layer; 143, top electrode; 144, light-emitting redundant part; 145, top electrode redundant part; 150, inorganic encapsulation layer; 151, cavity; 160, glass glue; 170, encapsulation cover; 180, pixel driving layer; 181, cathode connecting part; 182, bottom electrode extension; 183, reflective metal layer; 200, display device; 210, driving circuit. DETAILED DESCRIPTION

[0023] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0024] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. indicating orientation or positional relationships are described based on the orientation or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0025] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0026] Figure 1 is a schematic top view of the display panel of the present application, Figure 2 yes Figure 1 Schematic diagram of the cross section along the cutting line AA, Figure 3 yes Figure 1 Schematic diagram of the cross section along the cutting line BB, see Figure 1-3As shown, the present application discloses a display panel 100, the display panel 100 includes a display area 101 and a non-display area 102, the display panel 100 also includes a base substrate 110, a pixel definition layer 120, a suspension structure 130, a plurality of light-emitting units 140, an encapsulation layer, a glass glue 160 and an encapsulation cover plate 170, the pixel definition layer 120 is arranged on the base substrate 110, and a plurality of openings 121 are arranged in the display area 101; the suspension structure 130 is arranged on the pixel definition layer 1 20, and is arranged around the opening 121; the plurality of light-emitting units 140 are arranged in the plurality of openings 121; the encapsulation layer covers the light-emitting units 140 and the overhang structure 130; the glass glue 160 is arranged in the non-display area 102, and is arranged around the display area 101; the encapsulation cover plate 170 is arranged on the encapsulation layer, and is bonded to the base substrate 110 in the non-display area 102 through the glass glue 160, and is supported in the display area 101 by the overhang structure 130.

[0027] The packaging of the display panel 100 of the present application is mainly achieved by glass glue 160 and packaging cover plate 170, wherein the glass glue 160 is arranged around the display area 101, and the non-display area 102 of the display panel 100 is packaged by glass glue 160, and the packaging cover plate 170 located in the display area 101 is supported by the overhanging structure 130. Compared with the thin film packaging technology in the exemplary technology, the glass glue 160 packaging technology adopted in the present application has better packaging reliability and will not have the water vapor intrusion problem existing in the thin film packaging technology. In particular, when the glass glue 160 is sintered at high temperature, the organic material and cathode evaporated on the entire surface can be melted, the path of water and oxygen intrusion can be cut off, and water vapor and oxygen can be prevented from entering the display area 101 from the interface of the film layer, which is conducive to improving the packaging capacity of the display panel 100 and improving the display effect and service life of the display panel 100.

[0028] Among them, the overhang structure 130 is a key structure in the maskless evaporation technology, that is, in the process of forming multiple light-emitting units 140, it is not necessary to use a metal mask to complete the evaporation. In the process of evaporating the organic light-emitting material on the entire surface, the organic light-emitting material in the light-emitting unit 140 in each opening 121 is separated by the overhang structure 130, so that the organic light-emitting materials in the multiple light-emitting units 140 are set separately, and there will be no crosstalk problem. The light-emitting unit 140 includes a bottom electrode 141, a light-emitting layer 142 and a top electrode 143. The light-emitting layer 142 is generally formed of an organic light-emitting material, and is also called an organic light-emitting layer 142, including an electron transport layer, a light-emitting layer 142 and a hole transport layer, which are all formed of different organic materials. The overhang structure 130 is mainly used to separate the above-mentioned organic light-emitting layer 142 and the top electrode 143.

[0029] Generally speaking, for a display panel 100 using maskless evaporation technology, the organic light-emitting material and the top electrode 143 in the light-emitting unit 140 are disposed on the entire surface, and in particular, no additional process is used to remove the redundant organic material and the top electrode 143 material in the non-display area 102. Therefore, during the subsequent thin film encapsulation, water vapor and oxygen can easily enter the interior of the display panel 100 through this part of the film layer, causing damage to the top electrode 143, the bottom electrode 141 and the organic light-emitting layer 142 of the display panel 100, resulting in abnormal light emission of the light-emitting unit 140.

[0030] Specifically, the overhang structure 130 includes a first conductive layer 131 and a first insulating layer 132, wherein the first conductive layer 131 is disposed on the pixel definition layer 120, and the first insulating layer 132 is disposed on the conductive layer, and the width of the first insulating layer 132 is greater than the width of the first conductive layer 131. It is worth mentioning that the width of the first insulating layer 132 and the width of the first conductive layer 131 stated here refer to the width of the first insulating layer 132 and the width of the first conductive layer 131 between two adjacent light-emitting units 140, and when the width of the first insulating layer 132 is greater than the width of the first conductive layer 131, the first insulating layer 132 protrudes from the first conductive layer 131 to form the overhang structure 130. When the organic light-emitting material is vapor-deposited on the entire surface, the overhang structure 130 separates the continuous organic light-emitting material at different openings 121, so that the redundant organic light-emitting material (redundant light-emitting portion 144) vapor-deposited on the first insulating layer 132 is separated from the organic light-emitting material at the opening 121 by the overhang structure 130 and is no longer connected. As a result, when the multiple light-emitting units 140 emit light independently, the organic light-emitting material will not have electrical crosstalk, resulting in light-emitting problems.

[0031] Specifically, the light-emitting unit 140 includes a bottom electrode 141, a light-emitting layer 142 and the top electrode 143. The top electrodes 143 of adjacent light-emitting units 140 are connected through the first conductive layer 131, and the light-emitting layers 142 of adjacent light-emitting units 140 are separated by the overhanging structure 130. Taking the upright top light-emitting unit 140 as an example, the bottom electrode 141 of the light-emitting unit 140 is an anode, and the top electrode 143 is a cathode. Among them, the anode is generally formed of a metal material with high reflectivity, such as a silver material. The cathode is generally formed of a transparent conductive material, and the cathodes of multiple light-emitting units 140 are connected to the same driving electrode and have the same driving voltage.

[0032] Specifically, the light-emitting layer 142 and the top electrode 143 are formed by whole-surface evaporation. At the position of the glass glue 160, a light-emitting redundant portion 144 is formed synchronously with the light-emitting layer 142, and a top electrode redundant portion 145 is formed together with the top electrode 143. The glass glue 160 is used to remove the light-emitting redundant portion 144 and the top electrode redundant portion 145 below the position of the glass glue 160 during the laser sintering process.

[0033] The present application combines the two by using glass glue 160 packaging technology in the display panel 100 formed by maskless evaporation technology. First, the organic material and the top electrode 143 material under the glass glue 160 in the non-display area 102 are removed during the laser high-temperature sintering process by using the glass glue 160. The organic material and the top electrode 143 material under the glass glue 160 are directly melted during the laser high-temperature sintering process, while the inorganic material will not be melted. The reason is that the melting points of organic materials and inorganic materials are quite different, and the melting point of inorganic materials is higher. By controlling the temperature of laser sintering, the organic light-emitting material and the cathode material can be removed at the position below the glass glue 160.

[0034] In this embodiment, one side of the glass glue 160 directly contacts the inorganic material layer, and the other side directly contacts the packaging cover plate 170, forming a packaging method of the glass glue 160 and the packaging cover plate 170. The water vapor resistance of the outer side of the display panel 100 is better than the lamination method of the inorganic material layer and the organic material layer used in the thin film packaging. Secondly, the packaging cover plate 170 is supported by the overhanging structure 130 inside the display panel 100. Generally speaking, in the method of setting the glass glue 160 and the packaging cover plate 170, additional support columns need to be set inside the display panel 100 to process the packaging cover plate 170. In this embodiment, the overhanging structure 130 set in the display area 101 can be used to support the packaging cover plate 170.

[0035] Wherein, at each of the openings 121 in the display area 101, a cavity 151 is formed between the overhang structure 130 and the packaging cover plate 170. In the process of forming the cavity 151, it is necessary to attach the packaging cover plate 170 to the glass glue 160 under a vacuum environment, and then perform laser sintering on the glass glue 160, so that at the position of the overhang structure 130, the packaging cover plate 170 is supported by the overhang structure 130, and a cavity 151 is formed at the position of each opening 121. The overhang structure 130 in the display area 101 of the display panel is mainly used to support the upper packaging cover plate 170. The provision of the cavity 151 can reduce the box pressure between the packaging cover plate 170 and the base substrate 110, and reduce the possibility of cracking.

[0036] The display panel 100 of the present application is suitable for vehicle-mounted display panels 100 and display panels 100 with low flexibility requirements and high waterproof oxygen requirements. Relatively speaking, the vehicle-mounted display panel 100 has higher waterproof requirements, is in a greater humidity environment, and has higher reliability requirements. This embodiment uses glass glue 160 and cover plate packaging in combination with the overhang structure 130 to achieve the packaging of the display panel 100, which has a better packaging effect.

[0037] Continue to see Figure 2 As shown, the encapsulation layer in this embodiment is mainly used to protect the cathode of the light-emitting unit 140. When the material of the cathode is indium tin oxide material or indium zinc oxide material, the cathode material and the organic light-emitting material are easily corroded by water and oxygen, resulting in failure of the light-emitting unit 140. The encapsulation layer of this embodiment is mainly used to protect the light-emitting unit 140, and can be selected as an inorganic material. The inorganic material includes one or more of silicon nitride, silicon oxide or silicon oxynitride materials to form a layer of encapsulation layer. After the encapsulation layer is formed, after glass glue 160 is formed on the periphery, an encapsulation cover plate 170 is formed on the encapsulation layer. Among them, unlike thin film encapsulation, only one inorganic encapsulation layer 150 is formed in this embodiment, and there is no need to form a subsequent organic encapsulation layer and a multi-layer stacking method. On the one hand, the process is reduced, and on the other hand, the process structure complexity caused by the organic encapsulation layer process can be reduced.

[0038] Specifically, the encapsulation layer includes an inorganic encapsulation layer 150 . At the opening 121 , the inorganic encapsulation layer 150 and the encapsulation cover plate 170 form a cavity 151 . At the overhang structure 130 , the inorganic encapsulation layer 150 is disposed between the overhang structure 130 and the encapsulation cover plate 170 .

[0039] The inorganic encapsulation layer 150 in the present application covers the light-emitting unit 140 and the overhang structure 130, and extends from the display area 101 to the non-display area 102. The inorganic encapsulation layer 150 needs to be removed in the area where the glass glue 160 is formed to avoid incomplete removal in the subsequent process of removing the organic light-emitting material and the cathode material, resulting in residual problems. Among them, the first insulating layer 132 in the present embodiment is generally formed of one or more materials selected from silicon oxide, silicon nitride or silicon oxynitride, and an inorganic encapsulation layer 150 is also provided between the overhang structure 130 and the encapsulation cover plate. The inorganic encapsulation layer 150 is generally formed of silicon nitride material. The contact between the overhang structure 130 and the encapsulation cover plate is better, and it is not easy to cause the inorganic encapsulation layer 150 to crack and other problems.

[0040] It is worth mentioning that the sealing method of glass glue 160 and packaging cover plate 170 adopted in the present application also solves the leveling problem of the organic packaging layer when thin film packaging is used in the maskless evaporation technology. Specifically, when the light-emitting unit 140 adopts the maskless evaporation technology, the pixel definition layer 120 is generally selected to be formed of inorganic materials. When the pixel definition layer 120 is formed of inorganic materials, it is relatively thin, for example, at 0.1um and below. When the subsequent organic packaging layer is leveled, due to the thin thickness of the pixel definition layer 120, even combined with the flattening layer below, it is difficult to prevent the organic packaging layer from overflowing outward, thereby causing the problem of failure of the organic packaging layer. When the organic packaging layer overflows outward, at the same time, the organic light-emitting layer 142 material also has redundant areas of organic light-emitting materials due to the entire surface evaporation in the non-display area 102, resulting in an increased risk of water vapor and oxygen intrusion.

[0041] In this embodiment, after the organic encapsulation layer is removed, there is no risk of overflow of the organic encapsulation layer during leveling, so there is no need to form a barrier dam at the leveling barrier position, reducing the process of organic encapsulation and the second inorganic encapsulation in the thin film encapsulation. It can be understood that the encapsulation layer in this embodiment is an inorganic encapsulation layer 150, and the process of the first inorganic encapsulation in the thin film encapsulation technology can be adopted. The inorganic encapsulation layer 150 covers the light-emitting unit 140 and the overhang structure 130, and plays a good encapsulation role.

[0042] Specifically, the glass glue 160 is arranged in a ring shape, surrounding the display area 101, and can also be called a frame sealant. At the outermost position of the non-display area 102, it is generally "track-shaped" or a rectangle with rounded corners under the projection of the base substrate 110. One side of the glass glue 160 is bonded to the package cover plate 170, and the other side is bonded to the base substrate 110. Of course, a film layer is also specifically arranged on the base substrate 110, which is actually bonded to the film layer on the base substrate 110.

[0043] Specifically, the display panel 100 generally also includes a pixel driving layer 180, which is arranged on the base substrate 110. The pixel driving layer 180 generally includes multiple metal layers and insulating layers. By utilizing multiple metal layers and insulating layers to form thin film transistor devices, data driving lines, etc., a driving circuit is formed to achieve individual control of each light-emitting unit 140.

[0044] Specifically, the display panel 100 also includes a pixel driving layer 180, which is arranged between the base substrate 110 and the pixel definition layer 120. The pixel driving layer 180 also includes a reflective metal layer 183, which is arranged under the glass glue 160 and is used to reflect laser onto the glass glue 160 when the glass glue 160 is laser sintered.

[0045] In this embodiment, the pixel driving layer 180 is provided with a reflective metal layer 183 under the glass glue 160. The reflective metal layer 183 mainly reflects the laser when the glass glue 160 is laser sintered, so that the heat is concentrated on the glass glue 160, so that the packaging cover plate 170 and the pixel driving layer 180 can be bonded after the glass glue 160 is sintered. The reflective metal layer 183 can be formed synchronously with the metal layer in the pixel driving layer used to form thin film transistors or scanning lines or data lines using the same material.

[0046] It can be understood that in the process of forming the organic light-emitting layer 142 and the cathode, since the whole-surface evaporation technology is used, when the glass glue 160 is not subjected to laser high-temperature sintering, a light-emitting redundant part 144 and a top electrode redundant part 145 are arranged between the glass glue 160 and the pixel driving layer 180. At this time, there is no need to remove the light-emitting redundant part 144 and the top electrode redundant part 145 under the glass glue 160 by etching. During the laser sintering process, the organic light-emitting material and cathode material of the light-emitting redundant part 144 are directly melted, so that the light-emitting redundant part 144 and the top electrode redundant part 145 are isolated at the glass glue 160, and the light-emitting redundant part 144 on the outside of the glass glue 160 is no longer connected to the light-emitting redundant part 144 on the inside of the glass glue 160, and the top electrode redundant part 145 on the outside of the glass glue 160 is no longer connected to the top electrode redundant part 145 on the inside of the glass glue 160.

[0047] Specifically, the pixel definition layer 120 is formed of an inorganic material, and the pixel definition layer 120 extends from the display area 101 to the non-display area 102 , forming an inorganic extension portion 122 in the non-display area 102 , one side of the glass glue 160 contacts the packaging cover plate 170 , and the other side of the glass glue 160 contacts the inorganic extension portion 122 .

[0048] The pixel definition layer 120 in this embodiment also extends to the bottom of the glass glue 160 and extends to the non-display area 102 as an inorganic extension 122. Considering that a passivation layer will be arranged above the pixel driving layer 180, and the passivation layer is generally formed of organic materials, it is easy to fuse the flat layer on the pixel driving layer 180 when the laser sintering organic light-emitting materials and cathode materials. Therefore, in this embodiment, an inorganic extension 122 formed of an inorganic material is arranged to separate the glass glue 160 from the passivation layer. The above-mentioned reflective metal layer 183 is arranged below the passivation layer and below the glass glue 160, which is consistent with the projection of the glass glue 160 on the base substrate 110.

[0049] Considering that only the inorganic extension part 122 is provided on the pixel driving layer 180 at the position of the glass glue 160 and the cathode wiring cannot be transmitted to the binding connection of the display panel 100, the cathode signal can be provided by an external circuit board by connecting the cathode to the pixel driving layer 180.

[0050] Specifically, the display panel 100 further includes a cathode connecting portion 181 , and the inorganic extension portion 122 is further provided with a plurality of through holes 123 . The cathode connecting portion 181 is connected to the first conductive layer 131 through the through holes 123 , and the first conductive layer 131 is connected to the cathode.

[0051] In this embodiment, the first conductive layer 131 connected to the cathode is connected to the cathode connecting portion 181 through the through hole 123, the cathode connecting portion 181 is arranged in the pixel driving layer 180, and is formed by a metal layer or a conductive layer in the pixel driving layer 180, and a through hole 123 is formed on the inorganic extension portion 122, so that the first conductive layer 131 of the overhang structure 130 can be connected to the cathode connecting portion 181 in the pixel driving layer 180 through the via hole, thereby realizing the driving of the cathode.

[0052] Of course, in order to prevent the water vapor from extending from the organic light-emitting material and the cathode material to the display area 101 , in this embodiment, the overhanging structure 130 disposed in the non-display area 102 may be used to block them.

[0053] Specifically, the display panel 100 further includes an overhang extension 133, and the overhang extension 133 also includes a second conductive layer 134 and a second insulating layer 135. The overhang extension 133 is disposed in the non-display area 102 and is located on a side of the glass glue 160 close to the display area 101. On a side of the glass glue 160 close to the display area 101, the second insulating layer 135 protrudes from the second conductive layer 134. The overhang extension 133 is used to separate the redundant light-emitting portion 144 and the redundant top electrode portion 145. Specifically, a gap is provided between the overhang extension 133 and the glass glue 160.

[0054] In this embodiment, the overhang extension 133 is arranged around the display area 101 and is formed in the same process as the overhang structure 130 of the display area 101, and the first conductive layer 131 is connected to the second conductive layer 134. In addition to supporting the package cover plate 170, the overhang extension 133 also serves to isolate the redundant light emitting part 144 and the redundant top electrode part 145 of the non-display area 102. Specifically, at the edge of the overhang extension 133, the redundant light emitting parts 144 on both sides are isolated, and the redundant top electrode part 145 is isolated to prevent water vapor from being transferred between the two.

[0055] Figure 4 is a schematic diagram of another cathode connection portion of the present application, see Figure 4 As shown, considering that the wiring space of the non-display area 102 close to the display area 101 is limited, the second conductive layer 134 can also be used for connection. Specifically, the cathode connecting portion 181 is connected to the second conductive layer 134 through the through hole 123, the second conductive layer 134 is connected to the first conductive layer 131, and the first conductive layer 131 is connected to the cathode.

[0056] The cathode in this embodiment is connected to the cathode connecting portion 181 in the pixel driving layer 180 through the first conductive layer 131 and the second conductive layer 134 from the through hole 123 below the overhanging extension portion 133, without relying on the layout space of the display area 101 or the non-display area 102 close to the display area 101.

[0057] In another embodiment, after the inorganic extension portion 122 forms the through hole 123 , the bottom electrode extension portion 182 may be fabricated in the same layer as the bottom electrode 141 , and the signal may be transmitted to the cathode extension portion through the bottom electrode extension portion 182 .

[0058] Figure 5 is a schematic diagram of the display device of the present application, see Figure 5 As shown, the present application further discloses a display device, wherein the display device 200 includes a driving circuit 210 and any one of the above-mentioned display panels 100 , and the driving circuit 210 is used to drive the display panel 100 to display.

[0059] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0060] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, and further includes: substrate substrate; A pixel definition layer is disposed on the base substrate and has a plurality of openings in the display area; A hanging structure is arranged on the pixel definition layer and surrounds the opening; A plurality of light emitting units are arranged in the plurality of the openings; An encapsulation layer, covering the light-emitting unit and the overhanging structure; Glass glue is disposed in the non-display area and surrounds the display area; and The packaging cover plate is arranged on the packaging layer, is bonded to the base substrate via the glass glue in the non-display area, and is supported by the overhanging structure in the display area.

2. The display panel according to claim 1, characterized in that: The encapsulation layer includes an inorganic encapsulation layer. At the opening, the inorganic encapsulation layer and the encapsulation cover plate form a cavity. At the overhang structure, an inorganic encapsulation layer is disposed between the overhang structure and the encapsulation cover plate.

3. The display panel according to claim 1, characterized in that: The overhang structure includes a first conductive layer and a first insulating layer, wherein the first conductive layer is disposed on the pixel definition layer, the first insulating layer is disposed on the conductive layer, and a width of the first insulating layer is greater than a width of the first conductive layer; The light-emitting unit comprises a bottom electrode, a light-emitting layer and a top electrode, the top electrodes of adjacent light-emitting units are connected through the first conductive layer, and the light-emitting layers of adjacent light-emitting units are separated by the overhanging structure; At each of the openings in the display area, a cavity is formed between the overhanging structure and the packaging cover plate.

4. The display panel according to claim 3, characterized in that: The light-emitting layer and the top electrode are formed by whole-surface evaporation. At the position of the glass glue, a light-emitting redundant portion is formed synchronously with the light-emitting layer, and a top electrode redundant portion is formed synchronously with the top electrode. The glass glue is used to remove the light-emitting redundant portion and the top electrode redundant portion below the glass glue position during laser sintering.

5. The display panel according to claim 4, characterized in that: The pixel definition layer is formed of inorganic material, and the pixel definition layer extends from the display area to the non-display area, forming an inorganic extension portion in the non-display area, one side of the glass glue contacts the packaging cover plate, and the other side of the glass glue contacts the inorganic extension portion.

6. The display panel according to claim 5, characterized in that: The display panel also includes an overhanging extension portion, which also includes a second conductive layer and a second insulating layer. The overhanging extension portion is arranged in the non-display area and is located on a side of the glass glue close to the display area. On the side of the glass glue close to the display area, the second insulating layer protrudes from the second conductive layer. The overhanging extension portion is used to separate the light-emitting redundant portion and the top electrode redundant portion.

7. The display panel according to claim 6, characterized in that: The display panel further includes a cathode connecting portion, the inorganic extension portion is further provided with a through hole, the cathode connecting portion is connected to the second conductive layer through the through hole, and the second conductive layer is connected to the first conductive layer.

8. The display panel according to claim 6, characterized in that: A gap is provided between the overhang extension part and the glass glue; the overhang extension part is provided around the display area and is formed in the same process as the overhang structure of the display area, and the first conductive layer is connected to the second conductive layer.

9. The display panel according to claim 1, characterized in that: The display panel also includes a pixel driving layer, which is arranged between the base substrate and the pixel definition layer. The pixel driving layer also includes a reflective metal layer, which is arranged under the glass glue and is used to reflect laser onto the glass glue when the glass glue is laser sintered.

10. A display device, characterized in that: It comprises a driving circuit and the display panel according to any one of claims 1 to 9, wherein the driving circuit is used to drive the display panel to display.

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