Array electrospray self-adaptive conformal device and method

Abstract

The invention belongs to the related technical field of electrospray curved surface packaging, and discloses an array electrospray self-adaptive conformal device and method, and the device comprises a contour scanning module, an industrial personal computer, a nozzle movement module and an array electrospray module. The array electrospray module is arranged on the nozzle movement module, and the nozzle movement module is used for driving the array electrospray module to move up and down; the industrial personal computer is respectively connected to the nozzle movement module and the array electrospray module; the contour scanning module is used for scanning the curved surface shape of the electrospray substrate and transmitting curved surface point cloud data obtained through scanning to the industrial personal computer; the industrial personal computer is used for processing the received curved surface point cloud data and generating a height control signal according to a processing result, and the height control signal is transmitted to the nozzle movement module to dynamically control the nozzle movement module, so that the spraying height of the array electrospray module at each position point of the curved surface corresponds to the curved surface. The method has high universality and adaptability for different curved surfaces.

Description

Technical Field

[0001] The present invention belongs to the technical field related to electrospray curved surface packaging, and more specifically, relates to an arrayed electrospray adaptive conformal device and method. Background Art

[0002] In electronic packaging, polymer films are key components for protecting chips from harsh environmental conditions due to their electrical insulation properties. Electrostatic spraying, also known as electrospraying, is a new type of additive manufacturing technology. Compared with other film-making technologies (chemical vapor deposition (CVD), spin coating), it has the advantages of low cost, short process flow, wide source of materials (semiconductors, conductors, insulating materials can be used), low environmental requirements (no high temperature / high pressure required), and high processing accuracy. It is widely used in microelectronics, display, semiconductors, energy batteries and other fields.

[0003] Arraying electrospray nozzles can achieve high-efficiency film formation and can cope well with large-area film formation conditions, which is of great significance. Under flat conditions, the process parameters are easy to adjust, and the use of arrayed electrospray nozzles can meet the needs of high-efficiency, high-quality thin film packaging production. At present, the research on arrayed electrospray thin film packaging for curved surface conditions is not in-depth enough and there are many problems. For example: (1) In curved surface electronic thin film packaging, the nonlinear geometric characteristics of the curved surface structure cause uneven distribution of electrospray microdroplets, making it impossible to achieve high-quality production of curved surface thin film packaging; (2) The arrayed electrospray device has poor adaptability to different curved surfaces. Changes in the curved surface contour will result in multiple parameters to be adjusted and multi-port adjustment operations will be inconvenient and poorly coordinated; (3) The independent controllability of each nozzle is poor, and it is difficult to replace the electrospray solution, which cannot meet the needs of regional on-demand selective deposition in a single package. Summary of the invention

[0004] In view of the above defects or improvement needs of the prior art, the present invention provides an arrayed electrospray adaptive conformal device and method, which aims to solve the problem of poor adaptability of existing curved arrayed electrospray packaging.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present invention, there is provided an arrayed electrospray adaptive conformal device, which includes a contour scanning module, an industrial computer, a nozzle motion module and an arrayed electrospray module; the arrayed electrospray module is arranged on the nozzle motion module, and the nozzle motion module is used to drive the arrayed electrospray module to move up and down; the industrial computer is respectively connected to the nozzle motion module and the arrayed electrospray module; the contour scanning module is used to scan the curved surface shape of the electrospray substrate, and transmit the scanned curved surface point cloud data to the industrial computer; the industrial computer is used to process the received curved surface point cloud data and generate a height control signal according to the processing result, and the height control signal is transmitted to the nozzle motion module to dynamically control the nozzle motion module, so that the spray height of the arrayed electrospray module when it is located at each position point on the curved surface corresponds to the curved surface.

[0006] Furthermore, the industrial computer is also used to process the received film formation requirement information to send a control signal to the arrayed electrospray module to control the arrayed electrospray module to prepare a packaging layer liquid film on the curved surface of the electrospray substrate by electrospraying with corresponding process parameters.

[0007] Furthermore, the profile scanning module is a laser profile scanner or a structured light profile scanner.

[0008] Furthermore, the device also includes a frame; the nozzle motion module includes a linear guide, a linear motor and a motor drive plate, the motor drive plate and the linear guide are respectively arranged on two opposite sides of the frame, and a slider is slidably arranged on the linear guide; the slider is respectively connected to the linear motor and the electrospray nozzle of the arrayed electrospray module.

[0009] Furthermore, the arrayed electrospray module includes an electrospray solution container, a flow pump, a delivery software, an electrospray nozzle, an electrical switch and a high-voltage power supply; a plurality of the electrospray nozzles are connected in parallel to form an arrayed electrospray nozzle, each electrospray nozzle is connected to one of the linear machines, and is connected to the high-voltage power supply through the electrical switch, and the high-voltage power supply is grounded; the electrospray solution container is connected to the flow pump, and the flow pump is connected to the industrial computer; at the same time, the flow pump is connected to the plurality of the electrospray nozzles through a plurality of the delivery hoses.

[0010] Furthermore, a plurality of chambers are arranged in the electrospray solution container, and the plurality of chambers are used to store different types of electrospray solutions.

[0011] Furthermore, the electrospray substrate is a conductive substrate and is grounded.

[0012] Furthermore, the flow pump is controlled by the industrial computer to control the flow of the electrospray solution entering the delivery hose; the high-voltage power supply is a direct current high-voltage power supply or a pulse high-voltage power supply.

[0013] Furthermore, different electrospray solutions are stored in different chambers of the electrospray solution container, and combined with independently controllable electrospray nozzles to achieve on-demand composite electrospray film-forming packaging.

[0014] The present invention also provides an arrayed electrospray adaptive conformal method, which uses the arrayed electrospray adaptive conformal device as described above to prepare a packaging layer liquid film.

[0015] In general, compared with the prior art, the arrayed electrospray adaptive conformal device and method provided by the present invention mainly have the following beneficial effects:

[0016] 1. The present invention uses a contour scanning module to obtain surface point cloud information, which is highly versatile and adaptable to different surfaces. The industrial computer performs information processing and dynamic planning of electrospray height, so that the appropriate electrospray height can be maintained during the electrospray process, ensuring the surface flatness, thickness uniformity, surface porosity and other film parameter indicators of the spray film, and can meet the production requirements of high-quality film packaging.

[0017] 2. The present invention arrays the electrospray nozzles, which can be used for high-precision electrospray film formation on large-area structural surfaces with a high degree of automation. Both are of great significance for improving film-making efficiency and achieving high-precision film packaging. The industrial computer can realize independent multi-state injection of the electrospray nozzle by controlling the parameters of the electrical switch and the flow pump. Each independent chamber in the electrospray solution container can store different electrospray solutions, and with the independently controllable electrospray nozzle, on-demand composite spray film packaging can be realized, which greatly improves the scope of application of atomized thin film materials.

[0018] 3. Process parameters such as voltage and height can be adjusted in real time through the industrial computer, which can realize various printing modes such as continuous direct writing, on-demand electrospraying, electrostatic spinning, electrostatic spraying, etc. The device is highly versatile. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the surface profile scanning process of the arrayed electrospray adaptive conformal device provided by the present invention;

[0020] Figure 2 It is a schematic structural diagram of an arrayed electrospray adaptive conformal packaging device constructed in a preferred embodiment of the present invention using a conductive substrate as a substrate to be printed;

[0021] Figure 3It is a schematic structural diagram along another angle of an arrayed electrospray adaptive conformal packaging device constructed in a preferred embodiment of the present invention using a conductive substrate as a substrate to be printed.

[0022] In all the drawings, the same figure marks are used to represent the same elements or structures, including: 1-electrospray substrate, 2-contour scanning module, 3-industrial computer, 4-electrospray solution container, 5-flow pump, 6-delivery hose, 7-electrospray nozzle, 8-linear guide, 9-linear motor, 10-electrical switch, 11-high voltage power supply, 12-frame, 13-motor drive board. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] See also Figure 1 , Figure 2 and Figure 3 The present invention provides an arrayed electrospray adaptive conformal device, which can adjust the electrospray parameters in real time, has a high degree of automation, and has multiple working modes. It can meet the production needs of high-quality and high-efficiency film packaging, and is highly versatile. It solves the problems of low precision, poor adaptability, and poor parameter adjustment coordination of curved arrayed electrospray film packaging, and improves the production efficiency and production quality of curved electronic packaging.

[0025] The device scans the surface contour and transmits the scanned data to the industrial computer 3, which processes the received data and dynamically plans the spray packaging process according to the processing results, and transmits the control signal to the motor drive board 13 and the high-voltage power supply 11 to regulate the spray process. Therefore, the arrayed electrospray nozzle 7 can dynamically adjust the spray height according to the shape of the surface, and can independently spray and replace the spray solution, which can achieve precise process parameter control and ensure that the surface flatness, surface porosity, and thickness uniformity of the electrospray film packaging meet the index requirements. The entire device has high adaptability, and the arrayed nozzle layout ensures high production efficiency, and can meet complex surface conditions, and achieve high-efficiency and high-quality chip packaging production needs.

[0026] The device includes a contour scanning module 2, an industrial computer 3, a nozzle motion module, an arrayed electrospray module and a frame 12. The arrayed electrospray module and the nozzle motion module are arranged on the frame 12, and the arrayed electrospray module is arranged on the nozzle motion module. The nozzle motion module is used to drive the arrayed electrospray module to move up and down. The industrial computer is connected to the nozzle motion module and the arrayed electrospray module respectively. The contour scanning module 2 is used to scan the curved surface shape of the electrospray substrate, and transmit the scanned curved surface point cloud data to the industrial computer. The industrial computer is used to process the received curved surface point cloud data and generate a height control signal according to the processing result. The height control signal is transmitted to the nozzle motion module to dynamically control the nozzle motion module, so that the spray height of the arrayed electrospray module when it is located at each position point on the curved surface corresponds to the curved surface. The industrial computer is also used to process the received film formation requirement information to send a control signal to the arrayed electrospray module to control the arrayed electrospray module to prepare a packaging layer liquid film on the curved surface of the electrospray substrate by electrospray with corresponding process parameters. The process parameters include voltage, electrospray solution flow rate, working mode, etc.

[0027] The contour scanning module 2 may be a laser contour scanner or a structured light contour scanner, which scans the electrospray substrate 1 to be packaged to obtain contour data of the electrospray substrate surface and transmits it to the industrial computer in the form of a point cloud.

[0028] The nozzle motion module includes a linear guide 8, a linear motor 9 and a motor drive plate 13. The motor drive plate 13 and the linear guide 8 are respectively arranged on opposite sides of the frame 12, and a slider is slidably arranged on the linear guide 8. The slider is respectively connected to the linear motor 9 and the electrospray nozzle 7 of the arrayed electrospray module. The linear motor 9 drives the slider to slide along the linear guide 8, and the slider drives the electrospray nozzle 7 to move. The linear guide is used to provide guidance for the movement of the slider to ensure the Z-direction motion accuracy.

[0029] The industrial computer processes the received surface contour point cloud data, and performs highly dynamic planning on the electrospray nozzle 7 according to the processing result to obtain the control data (height control signal) of the linear motor 9, and transmits the obtained control data to the motor drive board 13. Then the motor drive board 13 uses servo control to adjust the displacement of the linear motor 9, thereby ensuring that the film parameter indicators such as surface flatness, thickness uniformity and surface porosity of the spray film meet the requirements.

[0030] The arrayed electrospray module includes an electrospray solution container 4, a flow pump 5, a delivery software, an electrospray nozzle 7, an electrical switch 10 and a high-voltage power supply 11. A plurality of the electrospray nozzles are connected in parallel to form an arrayed electrospray nozzle. Each electrospray nozzle is connected to a linear machine and is connected to the high-voltage power supply 11 through the electrical switch 10. The high-voltage power supply 11 is grounded. The electrospray solution container 4 is connected to the flow pump 5, and the flow pump 5 is connected to the industrial computer. At the same time, the flow pump 5 is connected to the plurality of electrospray nozzles through a plurality of the delivery hoses 6.

[0031] The electrospray solution is delivered from the electrospray solution container 4 to the corresponding electrospray nozzle via the flow pump 5 and the delivery software. The electrospray solution container 4 is provided with a plurality of chambers, and the plurality of chambers are used to store different types of electrospray solutions. The flow pump 5 is controlled by the industrial computer to control the flow of the electrospray solution entering the delivery hose 6. The high-voltage power supply 11 is a DC high-voltage power supply or a pulsed high-voltage power supply. The electrospray substrate is a conductive substrate and needs to be grounded.

[0032] The industrial computer controls the electrical switch 10 to disconnect the high voltage power supply from the corresponding electrospray nozzle, the flow pump 5 is turned off, the delivery hose 6 stops delivering the electrospray solution, and the electrospray nozzle stops electrospraying, thereby realizing the individual control of each electrospray nozzle in the arrayed electrospray adaptive conformal device. Different electrospray solutions are stored in different chambers of the electrospray solution container, and combined with independently controllable electrospray nozzles, on-demand composite electrospray film packaging can be realized.

[0033] During operation, the industrial computer controls the electrical switch 10 to close, the high-voltage power supply is started, a high-voltage electric field is formed between the electrospray nozzle and the grounded electrospray substrate, and the flow pump opens the delivery hose 6 to supply the electrospray solution to the electrospray nozzle. The electrospray solution breaks through the Rayleigh limit under the action of the high-voltage electric field to form a Taylor cone, and then breaks into micro droplets under the action of the electric field force, thereby achieving electrospraying.

[0034] The present invention also provides an arrayed electrospray adaptive conformal method, which uses the arrayed electrospray adaptive conformal device as described above to prepare a liquid film of an encapsulation layer, and specifically comprises the following steps:

[0035] S1. Use a profile scanner to scan the electrospray substrate to obtain point cloud information of the substrate, and transmit the information to an industrial computer;

[0036] S2, the industrial computer processes the point cloud information of the electrospray substrate, plans the height of the electrospray nozzle at different positions to form a control signal and transmits it to the motor drive board. The motor drive board controls the displacement of the linear motor in a servo manner, and the linear motor drives the electrospray nozzle located on the linear guide rail to move, and finally realizes the regulation of the spray height during the electrospray process;

[0037] S3. According to the packaging requirements, the working mode of the arrayed electrospray nozzle can be selected: working alone or working simultaneously, and the control information is transmitted to the electrical switch 10 and the flow pump. At the same time, according to the packaging requirements, different types of electrospray solutions can be selected in the electrospray solution container, and combined with the different working modes of the arrayed electrospray nozzle, composite electrospray packaging can be performed;

[0038] S4. The electrical switch is closed, the high-voltage power supply is started, a high-voltage electric field is formed between the electrospray nozzle and the grounded electrospray substrate, the flow pump opens the delivery hose to supply the electrospray solution to the electrospray nozzle, and the electrospray solution at the electrospray nozzle breaks through the Rayleigh limit under the action of the high-voltage electric field to form a jet. The jet breaks under the action of the electric field to form micro-droplets, and the micro-droplets land on the substrate. After accumulation, film packaging is achieved.

[0039] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An arrayed electrospray adaptive conformal device, characterized in that: The device includes a contour scanning module, an industrial computer, a nozzle motion module and an arrayed electrospray module; the arrayed electrospray module is arranged on the nozzle motion module, and the nozzle motion module is used to drive the arrayed electrospray module to move up and down; the industrial computer is respectively connected to the nozzle motion module and the arrayed electrospray module; the contour scanning module is used to scan the curved surface shape of the electrospray substrate, and transmit the scanned curved surface point cloud data to the industrial computer; the industrial computer is used to process the received curved surface point cloud data and generate a height control signal according to the processing result, and the height control signal is transmitted to the nozzle motion module to dynamically control the nozzle motion module, so that the spray height of the arrayed electrospray module when it is located at each position point on the curved surface corresponds to the curved surface.

2. The arrayed electrospray adaptive conformal device according to claim 1, characterized in that: The industrial computer is also used to process the received film forming requirement information to send a control signal to the arrayed electrospray module to control the arrayed electrospray module to prepare a packaging layer liquid film on the curved surface of the electrospray substrate by electrospraying with corresponding process parameters.

3. The arrayed electrospray adaptive conformal device according to claim 1, characterized in that: The profile scanning module is a laser profile scanner or a structured light profile scanner.

4. The arrayed electrospray adaptive conformal device according to claim 1, characterized in that: The device also includes a frame; the nozzle motion module includes a linear guide, a linear motor and a motor drive plate, the motor drive plate and the linear guide are respectively arranged on two opposite sides of the frame, and a slider is slidably arranged on the linear guide; the slider is respectively connected to the linear motor and the electrospray nozzle of the arrayed electrospray module.

5. The arrayed electrospray adaptive conformal device according to claim 4, characterized in that: The arrayed electrospray module includes an electrospray solution container, a flow pump, a delivery software, an electrospray nozzle, an electrical switch and a high-voltage power supply; a plurality of the electrospray nozzles are connected in parallel to form an arrayed electrospray nozzle, each electrospray nozzle is connected to one of the linear machines, and is connected to the high-voltage power supply through the electrical switch, and the high-voltage power supply is grounded; the electrospray solution container is connected to the flow pump, and the flow pump is connected to the industrial computer; at the same time, the flow pump is connected to the plurality of the electrospray nozzles through a plurality of the delivery hoses.

6. The arrayed electrospray adaptive conformal device according to claim 5, characterized in that: A plurality of chambers are arranged in the electrospray solution container, and the plurality of chambers are used to store different types of electrospray solutions.

7. The arrayed electrospray adaptive conformal device according to claim 6, characterized in that: The electrospray substrate is a conductive substrate and is grounded.

8. The arrayed electrospray adaptive conformal device according to claim 6, characterized in that: The flow pump is controlled by the industrial computer to control the flow of the electrospray solution entering the delivery hose; the high-voltage power supply is a direct-current high-voltage power supply or a pulse high-voltage power supply.

9. The arrayed electrospray adaptive conformal device according to claim 6, characterized in that: Different electrospray solutions are stored in different chambers of the electrospray solution container, and are used in conjunction with independently controllable electrospray nozzles to achieve on-demand composite electrospray film-forming packaging.

10. An arrayed electrospray adaptive conformal method, characterized in that: The method adopts the arrayed electrospray adaptive conformal device described in any one of claims 1 to 9 to prepare the encapsulation layer liquid film.

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