Power module glue pouring jig

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a power module glue pouring jig which comprises a mold cover, a mold core and a mold base which are sequentially arranged from top to bottom. The upper surface of the mold base is provided with a mold core containing groove used for containing a mold core. A concave cavity is formed in the upper surface of the mold core, a plurality of mold cavities are formed in the concave cavity in an array mode and used for containing power modules, a sealing gasket is arranged at the inner bottom of each mold cavity, a fence is arranged at the opening of each mold cavity, and through glue overflowing grooves are formed between the outer sides of the fences and the side wall of the concave cavity and between the outer sides of every two adjacent fences; a plurality of glue filling ports distributed in an array are formed in the mold cover corresponding to the plurality of mold cavities; a plurality of air holes corresponding to each other in position are formed in the mold core placing groove, the mold cavity and the sealing gasket; and the die cover and the die holder are distributed at intervals along the vertical direction through the positioning piece. By adopting the scheme, the probability that glue is attached to the pins due to overflowing of the glue can be reduced, and the amount of air discharged by floating from the binding surface of the bottom surface of the power module and the die cavity along the wall of the die cavity is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a glue-filling fixture for a power module. Background Art

[0002] With the rapid development of electronic technology, digital pulse interval modulation modules (DPIM modules) have been widely used in home appliances, industrial control and other fields due to their high integration, high performance and low cost. However, in the production process of DPIM modules, the glue filling process is an important link. During the use of the existing DPIM module glue filling fixture, the DPIM module uses silicone direct plastic sealing, which has some problems in the plastic sealing process. These problems affect the product yield and production efficiency.

[0003] Specifically, Fig. 9 As shown, the existing DPIM module glue-filling jig comprises a mold cover 1', a mold core 2' and a mold base 3' which are arranged in sequence from top to bottom. The mold core 2' is sleeved in the mold base 1'. A plurality of mold cavities 21' are arranged in an array on the upper surface of the mold core 2' for placing a power module 4'. A sealing gasket is arranged on the inner bottom of the mold cavity 21'. The power module 4' comprises a DBC board 41' and a lead frame 42'. A plurality of pins 43' are arranged on the lead frame 42'. One end of the pin 43' away from the lead frame 42' is bonded to the DBC board 41'. The bottom surface of the DBC board 41' away from the pin 43' is bonded to the DBC board 41'. The upper surface of the sealing pad 22' is fitted; during the glue filling process of the existing DPIM module glue filling fixture, as shown in the left part of the mold core cross-sectional view, the silica gel 5' is easy to overflow, and the overflow glue 6' will adhere to the external pins and the pin frame, resulting in extremely poor welding performance between the pins and the PCB board, which not only affects the appearance quality of the product, but also may cause poor electrical connection and even cause malfunctions. In order to solve this problem, remedial measures have to be taken to remove the attached colloid, but this process is likely to cause damage to the power module, such as electrostatic discharge, excessive force, etc., which greatly affects the product yield and production efficiency.

[0004] In addition, the existing DPIM glue pouring jig has a vacuum port at the bottom. When the power module is poured, vacuum is drawn to fix the DBC board to prevent it from shifting during the pouring process. However, in actual application, there is still a small amount of air between the back of the DBC board and the fitting surface of the mold cavity. During vacuum degassing, Fig. 9As shown in the right part of the cross-sectional view of the middle mold core, the air needs to float up from the edge of the sealing gasket to the surface of the silicone 5' to form large bubbles 7' and be discharged. This process will easily cause a large number of bubbles 7' to explode, causing the silicone 5' to splash onto the back of the pin and cause the pin to be attached to the glue; in addition, since the fitting surface is located at the deepest part under the colloid, it takes a long time for the bubbles to completely float up from the gap and burst, which makes the degassing process time longer, further affecting the production efficiency.

[0005] Therefore, there is an urgent need for a power module glue filling fixture that can effectively control the height of the glue surface, reduce the probability of glue overflowing and causing glue to adhere to the pins, and reduce the amount of air discharged from the bottom surface of the power module and the mold cavity fitting surface along the mold cavity wall, thereby improving product yield and production efficiency. Summary of the invention

[0006] The present invention provides a power module glue pouring jig, which can effectively control the height of the glue surface, reduce the probability of glue attachment to pins due to glue overflow, and reduce the amount of air discharged from the bottom surface of the power module and the mold cavity fitting surface along the mold cavity wall, thereby improving product yield and production efficiency.

[0007] In order to achieve the above objectives, this application provides the following technical solutions:

[0008] A power module glue-filling jig comprises a mold cover, a mold core and a mold base arranged in sequence from top to bottom;

[0009] The upper surface of the mold base is provided with a mold core placement groove for placing the mold core;

[0010] A concave cavity is provided on the upper surface of the mold core, and a plurality of mold cavities are provided in an array in the concave cavity for placing power modules. A sealing gasket is provided at the inner bottom of the mold cavity, and a baffle is provided at the mouth of each mold cavity. Interconnected overflow grooves are formed between the outer side of the baffle and the side wall of the concave cavity, and between the outer sides of two adjacent baffles.

[0011] The mold cover is provided with a plurality of glue injection ports distributed in an array corresponding to the plurality of mold cavities;

[0012] The mold core placement groove, the mold cavity and the sealing gasket are all provided with a plurality of ventilation holes at corresponding positions;

[0013] It also includes a positioning piece, and the mold cover and the mold base are distributed at intervals along the vertical direction through the positioning piece.

[0014] The principles and advantages of the present invention are:

[0015] 1. Control the height of the glue surface and reduce the glue attached to the pins: Interconnected overflow grooves are formed between the outer side of the enclosure of the mold cavity and the side wall of the concave cavity, as well as between the outer sides of two adjacent enclosures. After the encapsulated colloid is poured into the mold cavity, the overflowed colloid can flow into the overflow groove, thereby effectively controlling the height of the glue surface, reducing the probability of glue attached to the pins due to colloid overflow, and reducing the need for subsequent manual cleaning of the colloid attached to the power pins, further improving production efficiency and product qualification rate.

[0016] 2. Reduce air retention and shorten degassing time: The mold core placement groove, mold cavity and sealing gasket are all provided with a number of corresponding air holes. This design effectively reduces the air retention in the fitting surface between the sealing gasket and the bottom surface of the power module by optimizing the sealing structure between the sealing gasket and the bottom surface of the power module. The corresponding air holes help the air between the bottom surface of the power module and the fitting surface of the mold cavity to be quickly discharged through these air holes, reducing the amount of air discharged from the fitting surface along the wall of the mold cavity, greatly reducing the possibility of pin attachment caused by bubble explosion, and improving product yield. At the same time, since the amount of air that needs to be discharged is reduced, the time required for the degassing process is also reduced accordingly, which is of great significance for improving production efficiency.

[0017] Further, the positioning members are provided in four numbers and are respectively provided at four corners of the mold base, the positioning members are positioning pins, and the positioning pins include an upper positioning step, a supporting step and a lower positioning step which are fixedly connected in sequence from top to bottom;

[0018] The diameters of the cross section of the upper positioning step and the cross section of the lower positioning step are equal, and the diameters of the cross section of the upper positioning step and the cross section of the lower positioning step are both smaller than the diameter of the cross section of the supporting step;

[0019] An upper positioning pin hole is provided on the mold cover corresponding to the upper positioning step, and the upper positioning step can extend into the upper positioning pin hole and be clamped with the upper positioning pin hole. A lower positioning pin hole is provided on the mold base corresponding to the lower positioning step, and the lower positioning step can extend into the lower positioning pin hole and be clamped with the lower positioning pin hole. The upper and lower surfaces of the supporting step can respectively abut against the lower surface of the mold cover and the upper surface of the mold base.

[0020] Beneficial effects: The locating pins are engaged with the corresponding locating pin holes on the mold cover and the mold base through the upper locating steps and the lower locating steps, ensuring precise alignment between the mold cover and the mold base. This precise positioning helps to maintain stability during the glue pouring process and reduce glue pouring defects caused by inaccurate positioning; the locating pins are simple in design and easy to operate, and can quickly complete the installation and disassembly of the mold cover and the mold base, thereby improving the production efficiency of mass production; the diameter of the cross-section of the upper locating step and the diameter of the cross-section of the lower locating step are both smaller than the diameter of the cross-section of the supporting step, so that the supporting step can make the mold cover and the mold base spaced apart vertically, so that a certain distance is maintained between the mold cover and the mold base, avoiding the lower surface of the mold cover from pressing on the upper surface of the power module, thereby causing damage to the product.

[0021] Furthermore, the length of the lower positioning step is greater than that of the upper positioning step, the length of the upper positioning step is less than the thickness of the mold cover, the length of the lower positioning step is greater than the thickness of the mold base, the upper positioning step can be snapped into the upper positioning pin hole of the mold cover, the lower positioning step can be snapped into the lower positioning pin hole of the mold base and the lower end of the lower positioning pin hole can pass through the mold base.

[0022] Beneficial effects: the lower positioning step can be snapped into the lower positioning pin hole of the mold base and the lower end of the lower positioning pin hole can pass through the mold base, so that when multi-layer molds are stacked, the part of the lower positioning step that exceeds the mold base can be used as a support point to ensure the stability and alignment accuracy of each layer of the mold; the part of the lower positioning step that exceeds the mold base makes the lower end of the air hole suspended in the air, so that during the degassing process, the air can be discharged more smoothly, avoiding the residue of bubbles and improving the quality of glue pouring; the upper positioning step is snapped into the upper positioning pin hole of the mold cover and the lower end of the lower positioning step passes through the mold base, so that multiple fixtures can be conveniently stacked together, which not only saves space but also improves production efficiency. In mass production, the glue pouring of multiple power modules can be completed at one time, reducing the time of repeated operations and reducing labor intensity.

[0023] Furthermore, it also includes screws. The four corners of the mold cover are respectively provided with screw limiting holes, and the mold base is provided with four threaded holes corresponding to the four screw limiting holes. The lower end of the screw can pass through the screw limiting hole downward and be threadedly connected with the threaded hole.

[0024] Beneficial effect: The mold cover and the mold base are threadedly connected and fixed together by setting screws, which has a simple structure and makes the connection between the mold cover and the mold base more stable, so that the overall fixture is compact and ensures that the semi-finished module does not shift during the glue pouring process.

[0025] Furthermore, the sealing gasket is made of polyurethane.

[0026] Beneficial effects: The sealing gasket is made of polyurethane, which, compared with other sealing materials, has fewer internal voids, adjustable hardness, certain elasticity, and is not easy to adhere to silicone. This ensures that after the sealing gasket fits tightly against the bottom surface of the DBC board of the DPIM module, silicone will almost never adhere to the bottom surface of the DBC board, eliminating the need for manual cleaning of the bottom surface of the DBC board, thereby improving product production efficiency.

[0027] Furthermore, a first gap is provided between the inner peripheral wall of the mold core placement groove and the outer peripheral wall of the mold core.

[0028] Beneficial effect: By setting a first gap between the inner peripheral wall of the core placement groove and the outer peripheral wall of the core, it is possible to avoid extrusion deformation failure caused by inconsistent thermal expansion coefficients of the core material and the mold base material, thereby ensuring the service life of the core.

[0029] Furthermore, a second gap is provided between the inner peripheral wall of the mold cavity and the outer peripheral wall of the sealing gasket.

[0030] Beneficial effect: During the glue pouring process, when the silicone is heated and cured, the second gap set between the inner wall of the mold cavity and the outer wall of the sealing gasket will be eliminated due to the expansion of the sealing gasket, thereby avoiding the formation of flash due to residual silicone between the second gap and reducing the time required for cleaning the flash.

[0031] Furthermore, the mold cover and the mold base are both made of mold steel.

[0032] Beneficial effects: The mold cover and mold base are made of mold steel, which has high rigidity to ensure the consistency of clamping when multiple products are potted at the same time. Mold steel is a specially treated steel with high strength and good wear resistance. During the glue pouring process, when the glue is heated and cured, the mold steel has good thermal stability and can maintain its performance and dimensional stability in a high temperature environment, reducing the risk of dimensional deformation or performance degradation due to temperature changes.

[0033] Furthermore, a first taking groove is provided at the bottom of the mold base.

[0034] Beneficial effect: By arranging the first taking groove at the bottom of the mold base, it is convenient for the product after glue filling to be taken and placed through the first taking groove.

[0035] Furthermore, second taking grooves are provided on both left and right side walls of the mold cover.

[0036] Beneficial effect: By arranging the second picking groove on both the left and right side walls of the mold cover, the second picking groove provides the operator with an additional gripping point, making it more convenient and safer to pick up, move or install the mold cover. The second picking groove can complete the installation and disassembly of the mold cover more quickly, thereby speeding up the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is an exploded view of a first embodiment of a power module glue potting fixture of the present invention.

[0038] Figure 2 This is an assembly diagram of a first embodiment of a power module glue-potting fixture of the present invention.

[0039] Figure 3 for Figure 2 A partial cross-sectional view of .

[0040] Figure 4 The figure is a schematic diagram of the three-dimensional structure of a mold cover of a first embodiment of a power module glue-potting jig of the present invention.

[0041] Figure 5 The figure is a three-dimensional structural schematic diagram of a mold core of a first embodiment of a power module glue-potting jig of the present invention.

[0042] Figure 6 The figure is a schematic diagram of the three-dimensional structure of a mold base of a first embodiment of a power module glue-potting fixture of the present invention.

[0043] Figure 7 This is a partial cross-sectional view of the connection state of two glue potting jigs of Embodiment 1 of a power module glue potting jig of the present invention.

[0044] Figure 8 The figure is a schematic diagram of the three-dimensional structure of a power module according to Embodiment 1 of a power module glue-potting fixture of the present invention.

[0045] Fig. 9 It is a partial cross-sectional view of an existing glue potting fixture.

[0046] Fig.10 This is a schematic structural diagram of a mold core of a second embodiment of a power module glue-potting fixture of the present invention.

[0047] Fig.11 This is an assembly diagram of a second embodiment of a power module glue-potting fixture of the present invention (the mold cover and the positioning member are not shown in the figure).

[0048] Fig.12 for Fig.11 A partial cross-sectional view of . DETAILED DESCRIPTION

[0049] The following is further described in detail through specific implementation methods:

[0050] The markings of the existing glue filling fixture in the drawings of the specification include: mold cover 1', glue filling port 11', mold core 2', mold cavity 21', sealing gasket 22', mold base 3', power module 4', DBC board 41', lead frame 42', lead 43', silica gel 5', overflow glue 6', bubble 7';

[0051] The markings of this scheme in the drawings of the specification include: mold cover 1, glue filling port 11, upper positioning pin hole 12, screw limiting hole 13, second taking groove 14, mold core 2, concave cavity 21, mold cavity 22, sealing gasket 23, enclosure 24, glue overflow groove 25, mold base 3, mold core placement groove 31, lower positioning pin hole 32, threaded hole 33, first taking groove 34, power module 4, DBC board 41, pin frame 42, pin 43, air vent 5, positioning part 6, upper positioning step 61, support step 62, lower positioning step 63, screw 7, silicone 8, glue blocking assembly 9, glue blocking frame 91, glue blocking strip 92.

[0052] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0054] Basically as attached Figures 1 to 8 As shown: A power module glue filling fixture, such as Figures 1 to 3As shown in the figure, it includes a mold cover 1, a mold core 2 and a mold base 3 which are arranged in sequence from top to bottom; a core placement groove 31 is provided on the upper surface of the mold base 3 for placing the mold core 2, the mold core 2 is sleeved in the core placement groove 31, and the mold core 2 is clamped with the core placement groove 31; disassembly grooves are provided at the four corners of the inner wall of the core placement groove 31 for disassembling the mold core 2 from the core placement groove 31, and a first gap is provided between the inner circumferential wall of the core placement groove 31 and the outer circumferential wall of the core 2. In the present embodiment, the spacing of the first gap is 1 mm. By providing the first gap between the inner circumferential wall of the core placement groove 31 and the outer circumferential wall of the core 2, extrusion deformation failure caused by inconsistent thermal expansion coefficients of the core 2 material and the mold base 3 material is avoided, thereby ensuring the service life of the core 2. The bottom of the mold base 3 is provided with a first picking groove 34, which is convenient for the product after glue filling to be taken and placed through the first picking groove 34; the material of the mold cover 1 and the mold base 3 are both mold steel, which has high rigidity to ensure the consistency of clamping when multiple products are filled at the same time.

[0055] like Figure 5 As shown, a concave cavity 21 is provided on the upper surface of the mold core 2 , and a plurality of mold cavities 22 are provided in an array in the concave cavity 21 for placing the power module 4 , and a sealing gasket 23 is provided at the inner bottom of the mold cavity 22 .

[0056] In this embodiment, the power module 4 placed in the mold cavity 22 is a semi-finished product. Figure 3 and Figure 8 As shown, the power module 4 includes a DBC board 41, a lead frame 42 and a plurality of pins 43. The lead frame 42 is a rectangular frame structure. The lead frame 42 is provided with a plurality of array-distributed mounting ports corresponding to the plurality of mold cavities 22 for bonding the DBC board 41. A plurality of pins 43 are fixedly connected to the bonding points on each mounting port corresponding to the DBC board 41. The end of the pin 43 on each mounting port that is away from the lead frame 42 is bonded to the DBC board 41. The bottom surface of the DBC board 41 that is away from the pin 43 is in contact with the upper surface of the sealing pad 23. The sealing pad 23 is made of polyurethane. Compared with other sealing materials, the sealing pad 23 is made of polyurethane, which has less internal gaps, adjustable hardness, certain elasticity and is not easy to adhere to the silica gel 8. This makes it possible for the sealing pad 23 to be tightly attached to the bottom surface of the DBC board 41 of the DPIM module, and the silica gel 8 is almost completely not adhered to the bottom surface of the DBC board 41, so that there is no need to manually clean the bottom surface of the DBC board 41, thereby improving the production efficiency of the product. Furthermore, the material of the mold core 2 is preferably polytetrafluoroethylene, which is easy to process and not easy to adhere to the silicone 8.

[0057] In this embodiment, a second gap is provided between the inner peripheral wall of the mold cavity 22 and the outer peripheral wall of the sealing gasket 23. The spacing of the second gap is 0.05 mm; during the glue pouring process, because the expansion coefficient of polyurethane is greater than the expansion coefficient of polytetrafluoroethylene, when the silicone rubber 8 is heated and cured, the second gap provided between the inner peripheral wall of the mold cavity 22 and the outer peripheral wall of the sealing gasket 23 will be eliminated due to the expansion of the sealing gasket 23, thereby avoiding the formation of flash due to the residual silicone rubber 8 between the second gaps, and reducing the time required for cleaning the flash.

[0058] like Figure 5 As shown, the mouth of each mold cavity 22 is provided with a baffle 24, and an interlinked overflowing glue groove 25 is formed between the outer side of the baffle 24 and the side wall of the cavity 21, and between the outer sides of two adjacent baffles 24; the mold cover 1 is provided with a plurality of array-distributed glue injection ports 11 corresponding to the plurality of mold cavities 22; in this embodiment, there are eight glue injection ports 11 and mold cavities 22, and they are arranged one by one, and the glue injection ports 11 and mold cavities 22 are both rectangular structures, and the cross-sectional area of ​​each glue injection port 11 is smaller than the cross-sectional area of ​​the mold cavity 22, ensuring that the silica gel 8 can smoothly enter the mold cavity 22 through the glue injection port 11. After the encapsulated colloid is injected into the mold cavity 22 through the glue injection port 11 on the mold cover 1, the overflowing colloid can flow into the overflowing glue groove 25, thereby effectively controlling the height of the glue surface, reducing the probability of glue adhering to the pin 43 due to the overflow of the colloid, and reducing the need for subsequent manual cleaning of the colloid attached to the power pin 43, further improving the production efficiency and product qualification rate. In addition, a second picking groove 14 is provided on the left and right side walls of the mold cover 1; the second picking groove 14 provides an additional gripping point for the operator, making it more convenient and safer to pick up, move or install the mold cover 1, and the installation and disassembly of the mold cover 1 can be completed more quickly, thereby speeding up the production process.

[0059] like Figures 1 to 6As shown, the core placement groove 31, the mold cavity 22 and the sealing gasket 23 are all provided with a plurality of air holes 5 corresponding to the positions; in this embodiment, each mold cavity 22 and the sealing gasket 23 are provided with nine air holes 5 in an array, and the core placement groove 31 is provided with air holes 5 corresponding to the air holes 5 in each mold cavity 22 and the sealing gasket 23 at the same position. By optimizing the sealing structure between the sealing gasket 23 and the bottom surface of the power module 4, the retention of air in the fitting surface between the sealing gasket 23 and the bottom surface of the power module 4 is effectively reduced, and the air holes 5 corresponding to the positions help the air between the bottom surface of the power module 4 and the fitting surface of the sealing gasket 23 to be quickly discharged downward through the air holes 5 on the sealing gasket 23, the air holes 5 on the mold cavity 22, and the air holes 5 on the core placement groove 31 in turn, reducing the amount of air discharged from the fitting surface along the wall of the mold cavity 22, greatly reducing the possibility of bubble explosion causing the pin 43 to be attached with glue, and improving the product yield. At the same time, since the amount of air that needs to be removed is reduced, the time required for the degassing process is also reduced accordingly, which is of great significance for improving production efficiency.

[0060] like Figure 1 and Figure 2 As shown, it also includes a positioning member 6, and the mold cover 1 and the mold base 3 are spaced apart vertically through the positioning member 6; four positioning members 6 are provided and are respectively arranged at the four corners of the mold base 3, and the positioning member 6 is a positioning pin, and the positioning pin includes an upper positioning step 61, a supporting step 62 and a lower positioning step 63 fixedly connected in sequence from top to bottom; the upper positioning step 61, the supporting step 62 and the lower positioning step 63 are all cylindrical structures.

[0061] like Figure 7As shown, the diameters of the cross sections of the upper positioning step 61 and the lower positioning step 63 are equal, and the diameters of the cross sections of the upper positioning step 61 and the lower positioning step 63 are both smaller than the diameter of the cross section of the supporting step 62; the diameters of the cross sections of the upper positioning step 61 and the lower positioning step 63 are equal, and the diameters of the cross sections of the upper positioning step 61 and the lower positioning step 63 are both smaller than the diameter of the cross section of the supporting step 62; an upper positioning pin hole 12 is provided on the mold cover 1 corresponding to the upper positioning step 61, and the upper positioning step 61 can extend into the upper positioning pin hole 12 and be engaged with the upper positioning pin hole 12, and a lower positioning pin hole 32 is provided on the mold base 3 corresponding to the lower positioning step 63, and the lower positioning step 63 can extend into the lower positioning pin hole 32 and be engaged with the lower positioning pin hole 32, and the upper and lower surfaces of the supporting step 62 can respectively abut against the lower surface of the mold cover 1 and the upper surface of the mold base 3. The length of the lower positioning step 63 is greater than that of the upper positioning step 61, the length of the upper positioning step 61 is less than the thickness of the mold cover 1, the length of the lower positioning step 63 is greater than the thickness of the mold base 3, the upper positioning step 61 can be snapped into the upper positioning pin hole 12 of the mold cover 1, the lower positioning step 63 can be snapped into the lower positioning pin hole 32 of the mold base 3 and the lower end of the lower positioning pin hole 32 can pass through the mold base 3.

[0062] like Figure 7 As shown, when installing the mold cover 1 and the mold base 3, the upper positioning step 61 is extended into the upper positioning pin hole 12 and clamped with the upper positioning pin hole 12, the upper end of the upper positioning step 61 is located in the upper positioning pin hole 12, the length of the lower positioning step 63 is greater than the length of the upper positioning step 61, the lower positioning step 63 is extended into the lower positioning pin hole 32 and clamped with the lower positioning pin hole 32, the lower end of the lower positioning step 63 penetrates the mold base 3 and extends out of the bottom of the mold base 3, the length of the lower end of the lower positioning step 63 extending out of the bottom of the mold base 3 is 5 mm, and the length of the lower positioning step 63 extending out of the bottom of the mold base 3 can be extended into the upper positioning pin hole 12 of another glue potting jig mold cover 1, which can be used for stacking and positioning of multiple glue potting jigs and making the lower end of the air vent 5 suspended to make the exhaust more efficient during degassing.

[0063] The upper and lower surfaces of the support step 62 are respectively abutted against the lower surface of the mold cover 1 and the upper surface of the mold base 3, so that the support step 62 can make the mold cover 1 and the mold base 3 spaced apart in the vertical direction, so that a certain distance is maintained between the mold cover 1 and the mold base 3, avoiding the lower surface of the mold cover 1 from pressing against the upper surface of the power module 4, thereby causing damage to the product.

[0064] It also includes screws 7. The four corners of the mold cover 1 are respectively provided with screw limiting holes 13. The mold base 3 is provided with four threaded holes 33 corresponding to the four screw limiting holes 13. The lower end of the screw 7 can penetrate the screw limiting holes 13 downward and be threadedly connected with the threaded holes 33. The mold cover 1 and the mold base 3 are threadedly connected and fixed together by setting screws 7. The structure is simple, and the connection between the mold cover 1 and the mold base 3 is more stable, so that the fixture is compact as a whole, and the semi-finished module is guaranteed not to shift during the glue pouring process. In this embodiment, the top of the screw 7 is located in the screw limiting hole 13 to avoid interference when multiple glue pouring fixtures are stacked.

[0065] Embodiment 2:

[0066] Embodiment 2 is basically as attached Figures 10 to 12 As shown:

[0067] The basic principle of embodiment 2 is the same as that of embodiment 1, except that in embodiment 2, Fig.10 As shown, it also includes a glue blocking component 9, which includes a glue blocking frame 91 and several connecting parts, such as Fig.11 As shown, the shape of the rubber blocking frame 91 is the same as the lead frame 42, and a plurality of connecting members are arranged in an array corresponding to the positions of a plurality of enclosures 24. The connecting members include a plurality of rubber blocking strips 92, and the lower ends of the plurality of rubber blocking strips 92 are fixedly connected to the upper surface of the enclosure 24. The rubber blocking strips 92 are bent in structure corresponding to the pins 43, and the positions of the plurality of rubber blocking strips 92 corresponding to the plurality of pins 43 of the power module 4 in the mold cavity 22 are arranged in an array, and the number of the rubber blocking strips 92 is the same as the number of the pins 43, as shown in FIG. Fig.12 As shown, the top of the rubber strip 92 can fit with the lower surface of the top of the corresponding pin 43, the outer end of the rubber strip 92 is fixedly connected to the inner wall of the rubber blocking frame 91, and the upper surface of the rubber blocking frame 91 can fit with the lower surface of the lead frame 42, which can further reduce the probability of colloid overflow causing glue to adhere to the upper part of the pin 43 and the lead frame 42, and can effectively prevent the silicone rubber 8 from overflowing from the mold cavity 22 to the upper part of the pin 43 and the lead frame 42.

[0068] In this embodiment, the material of the glue blocking frame 91 and the glue blocking strip 92 are both polytetrafluoroethylene. Polytetrafluoroethylene is not easy to adhere to the silicone 8 and has a certain supporting force. It has hard physical properties and chemical stability. It can maintain stable performance under high temperature, low temperature and various harsh environments. After glue filling, the silicone 8 attached to the glue blocking strip 92 and the glue blocking frame 91 and cured can be more easily removed, which simplifies the production process and reduces the difficulty of cleaning and maintenance.

[0069] The above are only embodiments of the present invention. Common knowledge such as the known specific structures and characteristics in the scheme is not described in detail here. Ordinary technicians in the relevant field know all the common technical knowledge in the technical field to which the invention belongs before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply conventional experimental means before that date. Ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the scope of protection of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A power module glue filling fixture, characterized by: It includes a mold cover, a mold core and a mold base which are arranged in sequence from top to bottom; The upper surface of the mold base is provided with a mold core placement groove for placing the mold core; A concave cavity is provided on the upper surface of the mold core, and a plurality of mold cavities are provided in an array in the concave cavity for placing power modules. A sealing gasket is provided at the inner bottom of the mold cavity, and a baffle is provided at the mouth of each mold cavity. Interconnected overflow grooves are formed between the outer side of the baffle and the side wall of the concave cavity, and between the outer sides of two adjacent baffles. The mold cover is provided with a plurality of glue injection ports distributed in an array corresponding to the plurality of mold cavities; The mold core placement groove, mold cavity and sealing gasket are all provided with a plurality of ventilation holes at corresponding positions; It also includes a positioning piece, and the mold cover and the mold base are distributed at intervals along the vertical direction through the positioning piece.

2. The power module glue potting fixture according to claim 1, characterized in that: There are four positioning members, which are respectively arranged at the four corners of the mold base. The positioning members are positioning pins, which include an upper positioning step, a supporting step and a lower positioning step which are fixedly connected in sequence from top to bottom. The diameters of the cross section of the upper positioning step and the cross section of the lower positioning step are equal, and the diameters of the cross section of the upper positioning step and the cross section of the lower positioning step are both smaller than the diameter of the cross section of the supporting step; An upper positioning pin hole is provided on the mold cover corresponding to the upper positioning step, and the upper positioning step can extend into the upper positioning pin hole and be clamped with the upper positioning pin hole. A lower positioning pin hole is provided on the mold base corresponding to the lower positioning step, and the lower positioning step can extend into the lower positioning pin hole and be clamped with the lower positioning pin hole. The upper and lower surfaces of the supporting step can respectively abut against the lower surface of the mold cover and the upper surface of the mold base.

3. The power module glue-filling fixture according to claim 2, characterized in that: The length of the lower positioning step is greater than that of the upper positioning step, the length of the upper positioning step is less than the thickness of the mold cover, the length of the lower positioning step is greater than the thickness of the mold base, the upper positioning step can be snapped into the upper positioning pin hole of the mold cover, the lower positioning step can be snapped into the lower positioning pin hole of the mold base and the lower end of the lower positioning pin hole can pass through the mold base.

4. The power module glue potting fixture according to claim 1, characterized in that: It also includes screws. The four corners of the mold cover are respectively provided with screw limiting holes. The mold base is provided with four threaded holes corresponding to the four screw limiting holes. The lower end of the screw can pass through the screw limiting hole downward and be threadedly connected with the threaded hole.

5. The power module glue potting fixture according to claim 1, characterized in that: The sealing pad is made of polyurethane.

6. The power module glue-filling fixture according to claim 1, characterized in that: A first gap is provided between the inner peripheral wall of the mold core placement groove and the outer peripheral wall of the mold core.

7. The power module glue potting fixture according to claim 1, characterized in that: A second gap is provided between the inner peripheral wall of the mold cavity and the outer peripheral wall of the sealing gasket.

8. The power module glue potting fixture according to claim 1, characterized in that: The mold cover and the mold base are both made of mold steel.

9. The power module glue-filling fixture according to claim 1, characterized in that: The bottom of the mold base is provided with a first taking groove.

10. The power module glue potting fixture according to claim 1, characterized in that: The left and right side walls of the mold cover are both provided with second taking grooves.

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