Multifunctional glue curing device and use method thereof

Abstract

The invention relates to the technical field of electronic device packaging and curing equipment, in particular to a multifunctional glue curing device which is reasonable in structure, wide in adaptability and capable of meeting the curing requirements of various devices, particularly chip packaging glue curing in the field of thermal printing heads and improving the product curing and packaging quality and a using method of the multifunctional glue curing device. The front end and the rear end of the material conveying mechanism are each provided with a material disc position sensor, the positions, corresponding to the feeding end and the discharging end of the material conveying mechanism, of the curing bin are each provided with a material conveying opening, and sealing bin doors are arranged at the positions of the material conveying openings and connected with a bin door opening and closing control component. A heating mechanism located below the material conveying mechanism is further arranged in the curing cabin, the heating mechanism is provided with a circulating fan, an air supply pipeline, a heater and air inlet pipelines, the heater is a heating module composed of a PTC thermistor and cooling fins, the heating module is provided with at least two air inlet pipelines, and the air inlet ends of the air inlet pipelines are arranged below the material conveying mechanism.

Description

Technical field:

[0001] The present invention relates to the technical field of electronic device packaging and curing equipment, and specifically to a multifunctional glue curing device and a method for using the device, which has a reasonable structure and wide adaptability and can meet the curing requirements of various devices, especially the curing of chip packaging glue in the field of thermal print heads, and improve the quality of product curing and packaging. Background technology:

[0002] Existing thermal curing equipment for electronic device packaging and curing is usually divided into continuous curing furnaces, curing boxes, etc. The continuous curing furnace uses a transmission mechanism, and the curing device is placed on a conveyor belt, and passes through a preheating cavity, a curing cavity, and a cooling cavity along the conveyor belt to complete the production process of preheating, curing, and cooling of the cured device; the curing box type thermal curing equipment relies on internal hot air circulation, and realizes the curing and cooling of the packaging glue through program stage heating, constant temperature, and cooling. For high-viscosity packaging glue and devices such as thermal print heads with multi-layer bonding metal wires of IC, when the glue penetrates between the metal wires during IC packaging, the gas encapsulated by the glue is difficult to discharge. When the gas remains in the packaging glue to form pores, the product reliability is reduced, or the pores cause the product to be scrapped. In addition, some device packaging is sensitive to moisture, or the humidity in the packaging glue is high, and the packaging glue has a popcorn effect during welding or heating. Some devices use metal aluminum as an electrode material, which is prone to hydrolysis reaction. The product uses silver as an electrode, and moisture easily causes silver electromigration. Existing curing equipment cannot meet the above-mentioned packaging curing process with low pores and low moisture requirements. Summary of the invention:

[0003] In view of the shortcomings and deficiencies in the prior art, the present invention proposes a multifunctional glue curing device and a method of using the device, which has a reasonable structure, wide adaptability, can meet the curing requirements of various devices, and improve the quality of product curing and packaging.

[0004] The present invention is achieved by the following measures:

[0005] A multifunctional glue curing device is provided with a curing cabin, a material conveying mechanism is provided in the curing cabin, and the device is characterized in that a material tray position sensor is provided at the front end and the rear end of the material conveying mechanism, respectively, a material conveying port is provided at the curing cabin corresponding to the loading end and the unloading end of the material conveying mechanism, and a sealed cabin door is provided at the material conveying port, and the sealed cabin door is connected to the cabin door opening and closing control component; a heating mechanism is also provided in the curing cabin below the material conveying mechanism, and the heating mechanism is provided with a circulating fan, an air supply pipeline, a heater and an air intake pipeline, and the heater adopts a PTC thermistor and a heat dissipation fin The heating module is composed of at least two air inlet pipelines, the air inlet end of the air inlet pipeline is arranged below the material conveying mechanism, the air outlet of the air inlet pipeline is connected to the air inlet of the circulating fan, the air flow inlet of the air supply pipeline is connected to the air outlet of the circulating fan, the air outlet of the air supply pipeline sends the air flow into the heating module, and sends it out after heat conduction through the heat dissipation fins in the heating module; a negative pressure processing component is also provided on the curing cabin, the negative pressure processing component is provided with a vacuum pump, an exhaust pipeline and a vacuum sensor for detecting the negative pressure degree in the curing cabin, the exhaust pipeline is connected to the vacuum pump, and the air flow inlet of the exhaust pipeline is connected to the curing cabin.

[0006] The present invention is also provided with a protective atmosphere mechanism and a temperature and humidity control component, wherein the protective atmosphere mechanism is provided with an air pump for pumping protective gas into the curing cabin, and a protective gas storage tank connected to the air pump, the air pump and the storage tank are connected via a pipeline, and a pressure gauge and a control valve are provided on the pipeline to control the flow rate of dry protective gas entering the curing cabin, and the protective gas is selected from one of dry nitrogen, argon and carbon dioxide. Further, the protective atmosphere mechanism is also provided with an oxygen content sensor located in the curing cabin to detect the oxygen content in the cabin, and to link a negative pressure processing component to discharge the oxygen in the cavity and the waste gas generated by the curing of the glue, and preferably to control the oxygen content in the curing cabin to 0.1-1.5wt%, which has met the requirements of air-isolated curing of anaerobic adhesives; further, the curing cabin is also provided with a differential pressure sensor, which monitors the internal air pressure of the cabin through the differential pressure sensor, and maintains an appropriate positive pressure in the cabin through the protective atmosphere mechanism, and the air pressure in the curing cabin is 5-25Pa higher than the external air pressure to prevent external gas from entering the cabin, and the pressure difference is further 5-15Pa, which inhibits gas outside the curing cavity from entering the cavity.

[0007] The present invention is respectively provided with a feed conveyor mechanism and a discharging conveyor mechanism outside the sealed cabin door of the curing cabin, and the feed conveyor mechanism and the discharging conveyor mechanism are used to realize the moving of the curing devices into and out of the curing cabin. Furthermore, in the present invention, when the feed conveyor mechanism and the discharging conveyor mechanism are in operation, the corresponding inlet and outlet sealed cabin doors are opened, and the feed and discharging conveyor structures work simultaneously. The feed and discharging conveyor mechanisms respectively adopt motor-driven transmission chains, and the chains are meshed with gears at the ends of the rollers. The chain-driven gears drive the rollers to operate, and the tray and the curing devices contained therein are moved on the rollers by means of friction with the rollers. The feed conveyor is dragged in and the discharging conveyor is pushed out. The two work together to realize the moving in and out of the tray and the devices contained therein. After the tray position sensor arranged inside the cabin detects that the tray has been transported to the set position, the transport mechanism stops moving.

[0008] The present invention also proposes a method for using a multifunctional glue curing device, which is characterized in that the device to be cured is placed on a tray, sent into a curing chamber by a feeding conveyor mechanism, and selected to undergo vacuum degassing treatment, low-temperature curing treatment, or high-temperature curing treatment, and then cooled and sent out of the curing chamber, and sent to the next process by a discharging conveyor mechanism, wherein when the material undergoes vacuum degassing treatment in the curing chamber, the following operations are performed: the material conveying mechanism moves the device to be cured to the center of the curing chamber and is located above the heating module, the heating module is turned on for preheating, the preheating temperature is 25-55°C to prevent the glue from curing before the bubbles are removed, the heating time is 5-30min, and the negative pressure treatment component is turned on at the same time to keep the vacuum degree in the curing chamber at 50Pa-100Kpa;

[0009] When the material is subjected to low-temperature curing treatment in the curing chamber, close the negative pressure treatment component to determine whether the current curing treatment requires a protective atmosphere. If necessary, introduce protective gas and turn on the heating mechanism at the same time. According to the curing characteristics of the glue, maintain the temperature range of 80-100°C and the heating time range of 30-120min;

[0010] When the material is subjected to high-temperature curing treatment in the curing chamber, close the negative pressure treatment component to determine whether the current curing treatment requires a protective atmosphere. If necessary, introduce protective gas and turn on the heating mechanism at the same time. According to the curing characteristics of the glue, maintain the temperature range of 120-180°C and the heating time range of 60-150min;

[0011] When the material is solidified and cooled, the protective atmosphere is turned off, the heating mechanism is adjusted, and temperature-controlled cooling is performed.

[0012] The temperature control cooling of the present invention means that when the encapsulation glue is cooled from above the glass transition temperature Tg to Tg, the cooling rate is 0.25-2°C / min, and more preferably 0.5-1°C / min; when the encapsulation glue is cooled to a temperature below Tg, the cooling rate is increased, and the cooling rate does not exceed 0.25-4°C / min, and more preferably does not exceed 0.5-2°C / min. During the cooling process, the cooling rate limit value is set by the temperature control instrument. If the cooling rate exceeds the set value, the heating mechanism and the circulating fan transfer the heat generated by the heating module through the internal air in the cabin to suppress the cooling rate from being too fast. When the cooling rate is lower than the set value, the heating system stops outputting and implements free cooling. This is because the thermal expansion coefficient of the thermal substrate of the thermal print head is 7±0.5×10 -6 / ℃, thermal print heads usually use epoxy encapsulation glue, and the thermal expansion coefficient is 80-120×10 above the glass transition temperature (hereinafter referred to as Tg, usually 80-180℃) -6 / ℃, thermal expansion coefficient below Tg temperature 20-30×10 -6 / ℃, due to the difference in material expansion coefficient, a cooling rate exceeding 5℃ / min will cause cracking at the interface between the packaging glue and the ceramic. When the packaging glue is cooled from above Tg to near Tg, the glue shrinks and deforms greatly. In order to prevent cracking at the interface between the glue and the ceramic substrate during the curing process, the cooling rate needs to be controlled. The temperature control instrument sets the temperature control cooling according to the program. The preferred cooling rate is 0.25-2℃ / min, and 0.5-1℃ / min is further preferred. Below the Tg temperature, the thermal expansion coefficient of the glue becomes lower, and the cooling rate can be appropriately increased, preferably ≤0.25-4℃ / min, and further preferably ≤0.5-2℃ / min. The cooling mode is to control the cooling rate not to exceed the specified limit. The cooling rate limit value is set by the temperature control instrument. If the cooling rate exceeds the set value, the hot air circulation device transfers the heat generated by the heater through the internal air in the cabin to suppress excessive cooling. When the cooling rate is lower than the set value, the heating system stops outputting and free cooling is implemented.

[0013] During the vacuum degassing treatment of the present invention, the air pressure in the curing chamber is preferably 100-50Kpa. This is because the viscosity of the packaging glue is usually 100-300Pa·S. When the vacuum degree is low, the bubble overflow speed is slow, the degassing efficiency is low, and the degassing is insufficient. When the vacuum degree is high, the gas overflow speed is too fast, causing the glue to expand and the shape to change irregularly, resulting in the product not meeting the requirements. Degassing can be achieved at 50Pa-100Kpa. On the one hand, it has a moderate degassing rate, and on the other hand, the shape of the glue is kept good.

[0014] During the low-temperature curing process or high-temperature curing process described in the present invention, humidity control treatment is also required to control the humidity in the curing chamber. The humidity content in the cavity is preferably 0.1%RH~25%RH, and the humidity content in each cavity is further preferably controlled to 1%~5%RH. This is because some thermal print head chip wiring uses aluminum electrodes, and water vapor easily causes aluminum film hydrolysis and electrode corrosion. The heating substrate uses silver as the wire electrode. Water vapor easily causes silver migration when the device is charged. The lower the humidity during curing, the less the internal moisture content of the glue after curing, and the higher the product reliability. When the humidity content in the cavity is 0.1%RH~25%RH, the moisture content of the encapsulation glue after curing is less than 1%. Preferably, the humidity content in the cavity is 1%~5%RH, and the moisture content of the encapsulation glue after curing is less than 0.1wt%, which meets the high reliability requirements of the product.

[0015] The present invention uses a set of devices to achieve vacuum degassing treatment, low-temperature curing treatment, high-temperature curing treatment, cooling treatment and other processes according to the curing requirements of different products, and the multiple processes can be arbitrarily combined, including at least five combination states: humidity-controlled thermal curing, atmosphere-protected thermal curing, humidity-controlled combined with atmosphere-protected thermal curing, no humidity control, and no atmosphere-protected thermal curing. Compared with the prior art, the present invention can meet the curing of glue with special thermal curing process requirements such as low porosity, atmosphere protection, humidity control, etc., and can also meet the thermal curing process requirements of common glue that does not require vacuum degassing, atmosphere protection, and humidity control. The single cavity has flexible production, and vacuum degassing can be used to eliminate internal pores after glue curing, and atmosphere protection can reduce oxidation, adverse reactions of glue, and reduce moisture in glue, thereby improving packaging yield and product reliability. Description of the drawings:

[0016] Attached Figure 1 It is a structural schematic diagram of the present invention.

[0017] Figure 2 It is a schematic diagram of the use process of the present invention.

[0018] Figure 3 A graph showing the relationship between the viscosity of the packaging glue and the preheating temperature in an embodiment of the present invention.

[0019] Figure numerals: rack body 1, control unit 2, multi-stage temperature controller 2-2, vacuum gauge 2-3, oxygen content detection controller 2-4, humidity controller 2-5, differential pressure controller 2-6, timer 2-7, preparation unit 3, curing chamber 4, material conveying mechanism in curing chamber 4-1, sealing door 4-2-1, sealing door 4-2-2, vacuum sensor 4-3, vacuum pump 4-12-1, exhaust pipe 4-12-2, exhaust mechanism 4-5, thermocouple 4-6, protective gas control device 4-7, oxygen content sensor 4-8, humidity sensor 4-9, heating module 4-10, first air intake pipe 4-11-1, second air intake pipe 4-11-2, circulation fan 4-11-3, vacuum pump 4-12-1, exhaust pipe 4-12-2, storage unit 5, material conveying mechanism 5-1 of discharge storage unit, tray 6, first group of trays 6 -1 tray, the first group of components to be cured 7-1, the second group of trays 6-2, the second group of components to be cured 7-2, the third group of trays 6-3, the third group of components to be cured 7-3. Specific implementation method:

[0020] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] Example:

[0022] This example provides a Figure 1 The thermal curing device for encapsulating glue of a thermal print head shown in the figure comprises a frame body 1, a control unit 2, a preparation unit 3, a feeding and conveying mechanism 3-1, a curing cabin 4, and a storage unit 5, wherein the control unit 2 is centrally provided with temperature, atmosphere, vacuum, pressure, humidity, and time control instruments, including a multi-stage temperature controller 2-2, a vacuum gauge 2-3, an oxygen content detection controller 2-4, a humidity controller 2-5, a pressure difference controller 2-6, and a timer 2-7, so as to realize the control of process parameters at each stage of thermal curing;

[0023] The front end preparation part 3 of the curing chamber 4 is provided with a feeding conveying mechanism 3-1, a tray 6-1 for carrying the devices to be processed, and a thermal print head curing device 7-1; when working, the feeding and discharging conveying structures work simultaneously, the feeding conveying mechanism 3-1, the material conveying mechanism 4-1 in the curing chamber, and the material conveying mechanism 5-1 in the discharging storage part respectively adopt motor-driven transmission chains, the chains are meshed with the gears at the ends of the rollers, and the chain-driven gears drive the rollers to operate, the tray and the curing devices contained therein are moved on the rollers by means of friction with the rollers, the feeding conveying is dragged in, and the discharging conveying is pushed out, and the two work together to realize the moving in and out of the material tray and the devices contained therein, and the sensor arranged inside the chamber detects that the tray has been transported to the set position, and the transporting mechanism stops moving.

[0024] The curing chamber 4 is provided with a material conveying mechanism 4-1, which is used to move in a tray 6-1, a thermal print head 7-1 to be cured after the encapsulation glue is applied, and to move out a tray 6-2, and a cured thermal print head 7-2. Sealing doors 4-2-1 and 4-2-2 are provided at both ends of the curing chamber to isolate the chamber from the outside during thermal curing, so as to achieve vacuum degassing, temperature, humidity and atmosphere stability in the cavity during thermal curing operation; the curing chamber is also provided with a vacuum sensor 4-3, a vacuum pump 4-12-1, an exhaust pipe 4-12-2 and a vacuum gauge 2-3, so as to achieve the curing chamber 4 The internal vacuum degassing function is realized by setting a thermocouple 4-6, a heater 4-10, an air intake pipe 4-11-1, an air intake pipe 4-11-2, a circulating fan 4-11-3, and an air supply pipe 4-11-4 to realize the heating function in the curing chamber 4; the protective gas control device 4-7 is set to control the protective gas to enter the curing chamber 4. The present invention is filled with one of the inert gases such as dry nitrogen, carbon dioxide, argon, etc. The exhaust device 4-5 realizes the discharge of the gas containing oxygen, moisture and waste gas generated by curing in the curing chamber 4, and the oxygen content sensor 4-8 is set The oxygen content in the curing chamber 4 is tested with the oxygen content detection controller 2-4, and the oxygen content control, i.e., atmosphere control, in the curing chamber 4 is realized together with the pressure difference sensor 4-4, the protective gas control device 4-7, the exhaust device 4-5, and the pressure difference controller 2-6; the humidity sensor 4-9 and the humidity detection controller 2-5 analyze the humidity in the curing chamber 4, and the humidity control in the curing chamber 4 is realized together with the protective gas control device 4-7 and the exhaust device 4-5, which is different from the usual freezing method or the method of using a desiccant to absorb moisture to control the humidity; the timer 2-7 is provided to realize The time control of vacuum degassing, the multi-stage temperature controller 2-2 is set to respectively realize the vacuum degassing preheating heating temperature and heating time, the vacuum preheating temperature to the low temperature curing section temperature heating rate, the low temperature curing section curing temperature and curing time, the low temperature curing temperature to the high temperature curing temperature heating rate, the high temperature curing section curing temperature and high temperature curing time, the cooling section temperature and cooling time parameter setting and control, the thermal print head 7-2 and the holding tray 6-2 can complete the different process stages of preheating vacuum degassing, low temperature curing, high temperature curing, and cooling of the glue curing in the curing chamber 4:

[0025] During the preheating vacuum degassing stage, the tray 6-2 and the thermal print head 7-2 enter the curing chamber 4, and the sealing doors 4-2-1 and 4-2-2 are closed. According to the program control, the heating system composed of the multi-stage temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake duct 4-11-1, the air intake duct 4-11-2, the circulating fan 4-11-3, and the air supply duct 4-11-4 realizes the preheating and degassing of the thermal print head glue to be cured in the curing chamber 4. The thermal print head chip packaging glue mostly adopts COB glue, and its viscosity is usually 100-300P. a·S, low fluidity at room temperature, the preheating degassing temperature of the multi-stage temperature controller 2-2 is set at 50°C, and appropriate heating reduces the viscosity of the glue, which is conducive to the bubbles wrapped in the glue and the densely bonded metal wires to overflow from the glue, and keeps the glue from flowing and increasing the glue width, resulting in the problem that the chip and the bonding wire cannot be effectively protected. The vacuum sensor 4-3, vacuum pump 4-12-1, exhaust pipe 4-12-2 and vacuum gauge 2-3 form a vacuum degassing system to control the vacuum of the curing chamber 4, and the vacuum degree is set to 1000Pa. The vacuum further improves the bubble overflow ability;

[0026] The thermal print head is generally composed of multiple driver ICs, which are arranged in a straight line. The epoxy encapsulation glue protecting the IC is usually in a strip shape. When the vacuum degree of degassing is improved, the bubbles will overflow quickly. When the bubbles overflow the glue, they expand, causing the linear glue to expand or leaving pits on the surface, resulting in a poor product appearance. In order to prevent the glue from solidifying before the bubbles are removed during preheating, the present invention tests the relationship curve between the glue viscosity and the temperature as shown in the figure. Figure 3 , set the preheating temperature ≤ 55°C, and set it at 50°C in this embodiment. Heating can reduce the viscosity of the glue of the thermal print head packaging IC, reduce the resistance of bubble overflow, and the packaging glue will not increase in curing viscosity. Set the timer 2-7 to 10min to control the preheating vacuum degassing time. After the preheating degassing is completed, enter the low-temperature thermal curing stage;

[0027] The low-temperature thermal curing stage includes four basic working modes: atmosphere protection combined with humidity control type low-temperature thermal curing, atmosphere protection type thermal curing, humidity control type thermal curing, and ordinary thermal curing. In the atmosphere protection combined with humidity control type thermal curing, the oxygen content is set to 100ppm, the humidity is set to 10%RH, the low-temperature curing temperature section of the 2-2 multi-stage temperature controller is set to 120℃, the curing time is set to 120min, the pressure difference controller 2-6 is set to 10Pa, the protective gas control device 4-7 is turned on, and one of the inert protective gases such as nitrogen, carbon dioxide, argon, etc. is introduced into the cavity, the exhaust device 4-5 is turned on, and the oxygen content detection system composed of the oxygen content analysis controller 2-4 and the oxygen content sensor 4-8 analyzes the residual oxygen content in the curing chamber 4, and the protective gas is continuously introduced to make the oxygen content in the curing chamber 4 reach the set value of 100. ppm, at the same time, the humidity detection system composed of the humidity detection controller 2-5 and the humidity sensor 4-9 detects the humidity in the curing chamber 4. When the humidity meets the set value of 10%RH, the air intake and exhaust device 4-5 is closed, the pressure difference detection controller 2-6 and the pressure difference sensor 4-4 detect that the pressure difference in the curing chamber 4 reaches the set value of 10Pa, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake pipe 4-11-1, the air intake pipe 4-11-2, the circulation fan 4-11-3, and the air supply pipe 4-11-4, the temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2, the temperature reaches the set value of 120℃, the internal timing of the temperature controller 2-2 is started, and the set time of 2-2 ends, completing the atmosphere protection combined with humidity controlled low temperature curing stage of the device 7-2 glue;

[0028] During atmosphere protection type thermal curing, the oxygen content is set to 100ppm, the low temperature curing temperature section of the 2-2 multi-stage temperature controller is set to 120℃, the curing time is set to 120min, the pressure difference controller 2-6 is set to 10Pa, the protective gas control device is turned on, and one of the inert protective gases such as nitrogen, carbon dioxide, argon, etc. is introduced into the cavity. The exhaust device 4-5 is turned on, and the oxygen content analysis controller 2-4 and the oxygen content sensor 4-8 composed of the oxygen content detection system analyze the residual oxygen content in the curing chamber 4. The protective gas is continuously introduced to make the oxygen content in the curing chamber 4 reach the set value of 100ppm, the air intake and exhaust devices 4-5 are closed, and the pressure The differential detection controller 2-6 and the differential pressure sensor 4-4 detect that the differential pressure in the curing chamber 4 reaches the set value of 10Pa, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake duct 4-11-1, the air intake duct 4-11-2, the circulating fan 4-11-3, and the air supply duct 4-11-4 is heated. The temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2, the temperature reaches the set value of 120°C, the internal timing of the temperature controller 2-2 is started, and the set time of 2-2 ends at 120min, completing the atmosphere protection low temperature curing stage of the device 7-2 packaging glue;

[0029] Humidity-controlled low-temperature thermal curing, humidity is set to 10% RH, 2-2 multi-stage temperature controller low-temperature curing temperature section is set to 120°C, curing time is set to 120min, pressure difference controller 2-6 is set to 10Pa, protective gas control device is turned on, dry nitrogen, carbon dioxide, argon and other inert protective gases are introduced into the cavity, and the humidity in the cabin is controlled by filling the curing chamber with dry inert gas to discharge the internal air and moisture. This is because the thin film thermal print head substrate usually uses metal aluminum wiring, water vapor easily reacts chemically with aluminum, resulting in hydrolysis of the aluminum film and corrosion of the aluminum electrode. In addition, some thermal print head substrates use silver as the wire electrode. After testing by the inventor, at room temperature and 35-55% RH humidity, the voltage difference between the silver electrodes is greater than 0.8V, and migration will occur between the electrodes in a short time, resulting in abnormal operation and damage of the product. The thermal print head of this embodiment uses silver electrodes to inhibit The occurrence of silver migration, during curing, the humidity value of this embodiment is set to 10% RH, the exhaust device 4-5 is turned on, the humidity detection system composed of the humidity controller 2-5 and the humidity sensor 4-9 detects the humidity in the curing chamber 4, and when the humidity meets the set value of 10% RH, the air intake and exhaust device 4-5 is closed, the pressure difference controller 2-6 and the pressure difference sensor 4-4 detect that the pressure difference in the curing chamber 4 reaches the set value of 10Pa, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake pipe 4-11-1, the air intake pipe 4-11-2, the circulating fan 4-11-3, and the air supply pipe 4-11-4 is heated, and the temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2, and the temperature reaches the set value of 120°C. The internal timing of the temperature controller 2-2 is started, and the set time of 2-2 ends at 120min, completing the humidity-controlled low-temperature thermal curing stage of the device 7-2 glue;

[0030] Ordinary heat curing, the low temperature curing temperature section of the multi-stage temperature controller 2-2 is set to 120℃, the curing time is set to 120min, the air intake and exhaust device 4-5 is opened, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake duct 4-11-1, the air intake duct 4-11-2, the circulation fan 4-11-3, and the air supply duct 4-11-4 is heated. The temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2. When the temperature reaches the set value of 120℃, the internal timing of the temperature controller 2-2 is started, and the set time of 2-2 ends at 120min, completing the ordinary heat curing stage of the device 7-2 glue; when the atmosphere protection system and the humidity control system are working, the pressure difference detection controller 2-

[0031] 6. The differential pressure sensor 4-4 controls the curing chamber 4 to maintain a positive pressure, and inhibits external gas from entering the curing chamber 4. During the atmosphere protection thermal curing or atmosphere protection type thermal curing process, if the oxygen content is higher than the target value of 100ppm or the humidity is higher than the target value of 10%RH, the protective gas control device 4-7 automatically opens and fills the protective gas, and the exhaust device 4-5 opens to discharge the moisture, residual oxygen, etc. in the cavity until the oxygen content or humidity in the curing chamber 4 meets the set value. The humidity detection system, oxygen content detection system, pressure detection system, air intake and exhaust device 4-5, and protective gas control device 4-7 form a humidity and residual oxygen control system to realize automatic humidity control and atmosphere protection functions. The low-temperature curing period set by the temperature controller 2-2 ends, and the ordinary low-temperature curing stage of the device 7-2 glue is completed, and the high-temperature curing stage is entered;

[0032] In this example, the high temperature curing stage and the low temperature curing stage only differ in the parameters of curing temperature and curing time. The high temperature curing stage inherits the curing atmosphere control and humidity control of the low temperature curing stage, including 4 basic working modes: atmosphere protection + humidity control type high temperature thermal curing, atmosphere protection type high temperature thermal curing, humidity control type high temperature thermal curing, and ordinary type high temperature thermal curing. Among them, atmosphere protection combined with humidity control type high temperature thermal curing, the oxygen content is set to 100ppm, the humidity is set to 10%RH, the high temperature curing temperature section of the 2-2 multi-stage temperature controller is set to 180℃, the curing time is set to 100min, and the pressure difference controller 2-6 is set to 10Pa. If the oxygen content and humidity do not meet the set values, the protective gas control device 4-7 is opened, and one of the inert protective gases such as nitrogen, carbon dioxide, argon, etc. is introduced into the cavity. The exhaust device 4-5 is opened, and the oxygen content detection system composed of the oxygen content analysis controller 2-4 and the oxygen content sensor 4-8 analyzes the oxygen content in the curing chamber 4. Residual oxygen content, protective gas is continuously introduced to make the oxygen content in the curing chamber 4 reach the set value of 100ppm. At the same time, the humidity detection system composed of the humidity detection controller 2-5 and the humidity sensor 4-9 detects the humidity in the curing chamber 4. When the humidity meets the set value of 10%RH, the air intake and exhaust device 4-5 is closed, the pressure difference controller 2-6 and the pressure difference sensor 4-4 detect that the pressure difference in the curing chamber 4 reaches the set value of 10Pa, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake pipe 4-11-1, the air intake pipe 4-11-2, the circulation fan 4-11-3, and the air supply pipe 4-11-4 is heated. The temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2. When the temperature reaches the set value of 180℃, the internal timing of the temperature controller 2-2 starts, and the set time of 2-2 ends at 100min, completing the atmosphere protection + humidity control type high temperature curing stage of the device 7-2 glue;

[0033] Atmosphere protection type high temperature thermal curing, the oxygen content is set to 100ppm, the high temperature curing temperature section of the multi-stage temperature controller 2-2 is set to 180℃, the curing time is set to 100min, and the pressure difference detection controller 2-6 is set to 10Pa. If the oxygen content does not meet the set value, the protective gas control device is turned on, and one of the inert protective gases such as nitrogen, carbon dioxide, argon, etc. is introduced into the cavity. The exhaust device 4-5 is turned on, and the oxygen content detection system composed of the oxygen content analysis controller 2-4 and the oxygen content sensor 4-8 analyzes the residual oxygen content in the curing chamber 4. The protective gas is continuously introduced to make the oxygen content in the curing chamber 4 reach the set value of 100ppm, and the air intake and exhaust device 4-5 is turned on. Close, the pressure difference detection controller 2-6 and the pressure difference sensor 4-4 detect that the pressure difference in the curing chamber 4 reaches the set value of 10Pa, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake duct 4-11-1, the air intake duct 4-11-2, the circulating fan 4-11-3, and the air supply duct 4-11-4 is heated, and the temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2. When the temperature reaches the set value of 180°C, the internal timing of the temperature controller 2-2 starts, and the set time of the temperature controller 2-2 ends at 100min, completing the atmosphere protection high temperature curing stage of the packaging glue of the device 7-2;

[0034] Humidity-controlled high-temperature thermal curing, humidity is set to 10% RH, the high-temperature curing temperature section of the temperature controller 2-2 is set to 180°C, the curing time is set to 100min, the pressure difference controller 2-6 is set to 10Pa, the protective gas control device is turned on, and one of the inert protective gases such as dry nitrogen, carbon dioxide, argon, etc. is introduced into the cavity. The principle of filling the curing chamber with dry inert gas to discharge the internal air and moisture is used to control the humidity in the cabin. The air intake and exhaust device 4-5 is turned on, and the humidity detection system composed of the humidity detection controller 2-5 and the humidity sensor 4-9 detects the humidity in the curing chamber 4. When the humidity meets the set value of 10% RH, the air intake and exhaust device 4-5 is closed, the pressure difference detection controller 2-6 and the pressure difference sensor 4-4 detect that the pressure difference in the curing chamber 4 reaches the set value of 10Pa, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake duct 4-11-1, the air intake duct 4-11-2, the circulation fan 4-11-3, and the air supply duct 4-11-4 is heated, and the temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2. When the temperature reaches the set value of 120°C, the internal timing of the temperature controller 2-2 starts, and the temperature controller 2-2 ends at the set time of 100min, completing the humidity-controlled high-temperature thermal curing stage of the device 7-2 glue;

[0035] Ordinary high-temperature thermal curing, the high-temperature curing temperature section of the 2-2 multi-stage temperature controller is set to 180°C, the curing time is set to 100 minutes, the exhaust device 4-5 is opened, the protective gas control device 4-7 is closed, and the heating system composed of the temperature controller 2-2, the thermocouple 4-6, the heater 4-10, the air intake duct 4-11-1, the air intake duct 4-11-2, the circulating fan 4-11-3, and the air supply duct 4-11-4 is heated, and the temperature signal detected by the thermocouple 4-6 is transmitted to the temperature controller 2-2. When the temperature reaches the set value of 180°C, the internal timing of the temperature controller 2-2 is started, and the set time of 2-2 ends at 100 minutes, completing the ordinary high-temperature thermal curing stage of the device 7-2 packaging glue;

[0036] During the cooling stage, the heating, atmosphere protection and humidity control functions of the curing chamber 4 are turned off. The curing chamber 4 is kept sealed and the temperature inside the cavity and the curing device is cooled by 60°C / 60min according to the program. When the cooling rate exceeds the set value, the heater 4-10 is turned on and the generated heat is sent to the curing chamber via the air supply pipe 4-11-4 to suppress the cooling rate from being too fast. When the cooling rate is lower than the set value, the cabin is cooled freely until it is cooled to the specified temperature. The sealing doors 4-1-1 and 4-1-2 are opened and the transport devices 4-1 and 5-1 jointly move the tray 6-2 and the device 7-2 to the storage section 7-3.

[0037] According to the curing device of the present invention, the curing process is to perform the following steps in sequence: curing preparation → preheating vacuum degassing stage → low temperature curing stage → high temperature curing stage → cooling stage → storage. The present invention is mainly implemented for the preheating vacuum degassing stage → low temperature curing stage → high temperature curing stage → cooling stage. According to the process and the characteristics of the glue, preheating vacuum degassing, humidity control, and atmosphere protection can be selected. The curing control of the glue is as follows: Figure 2 As shown in the flow chart, there are multiple operating modes: ① Basic thermal curing mode consisting of low-temperature curing + high-temperature curing + cooling without vacuum degassing, atmosphere protection and humidity control; ② Atmosphere protection type thermal curing mode consisting of low-temperature thermal curing with atmosphere protection + high-temperature thermal curing with atmosphere protection + cooling without preheating vacuum degassing and humidity control; ③ Degassing atmosphere protection type thermal curing consisting of preheating vacuum degassing + atmosphere protection low-temperature curing + atmosphere protection high-temperature curing + cooling; ④ Humidity controlled thermal curing consisting of preheating vacuum degassing + humidity control low-temperature curing + humidity control high-temperature curing + cooling; ⑤ Degassing, atmosphere protection and humidity controlled thermal curing mode consisting of preheating vacuum degassing + humidity control, low-temperature thermal curing with atmosphere protection + humidity control, high-temperature thermal curing with atmosphere protection + cooling.

[0038] In addition, according to the present invention, the curing mode is not limited thereto. According to the present invention, by setting different curing parameters, other operating modes of the combination of preheating vacuum degassing, atmosphere protection, and humidity control all fall within the scope of the present invention.

Claims

1. A multifunctional glue curing device, provided with a curing cabin, in which a material conveying mechanism is provided, characterized in that: The front and rear ends of the material conveying mechanism are respectively provided with material tray position sensors, and the curing cabin is respectively provided with material conveying ports at the loading and unloading ends of the material conveying mechanism corresponding to the material conveying mechanism, and a sealed hatch is provided at the material conveying port, and the sealed hatch is connected to the hatch opening and closing control component; a heating mechanism is also provided in the curing cabin below the material conveying mechanism, and the heating mechanism is provided with a circulating fan, an air supply pipeline, a heater and an air intake pipeline, and the heater adopts a heating module composed of a PTC thermistor and a heat dissipation fin, and is provided with at least two air intake pipelines. The air inlet end of the air inlet pipeline is arranged below the material conveying mechanism, the air outlet of the air inlet pipeline is connected to the air inlet of the circulating fan, the air flow inlet of the air supply pipeline is connected to the air outlet of the circulating fan, and the air outlet of the air supply pipeline sends the air flow into the heating module, and sends it out after heat conduction through the heat dissipation fins in the heating module; a negative pressure processing component is also provided on the curing cabin, and the negative pressure processing component is provided with a vacuum pump, an exhaust pipeline and a vacuum sensor for detecting the negative pressure degree in the curing cabin, the exhaust pipeline is connected to the vacuum pump, and the air flow inlet of the exhaust pipeline is connected to the curing cabin.

2. The multifunctional glue curing device according to claim 1, characterized in that: A protective atmosphere mechanism and a temperature and humidity control component are also provided. The protective atmosphere mechanism is provided with an air pump for pumping protective gas into the curing chamber, and a protective gas storage tank connected to the air pump. The air pump and the storage tank are connected via a pipeline. A pressure gauge and a control valve are provided on the pipeline to control the flow of dry protective gas entering the curing chamber. The protective gas is selected from one of dry nitrogen, argon and carbon dioxide.

3. The multifunctional glue curing device according to claim 2, characterized in that: The protective atmosphere mechanism is also equipped with an oxygen content sensor located in the curing chamber to detect the oxygen content in the chamber, and to link the negative pressure treatment component to discharge the oxygen in the cavity and the waste gas generated by the glue curing, and control the oxygen content inside the curing chamber to 0.1-1.5wt% to meet the air-isolated curing requirements of anaerobic adhesives.

4. The multifunctional glue curing device according to claim 2, characterized in that: The curing chamber is also equipped with a differential pressure sensor, which monitors the internal air pressure of the cabin and maintains an appropriate positive pressure in the cabin through a protective atmosphere mechanism. The air pressure in the curing chamber is 5-25Pa higher than the external air pressure to prevent external gas from entering the cabin.

5. The multifunctional glue curing device according to claim 1, characterized in that: A feed conveyor mechanism and a discharging conveyor mechanism are respectively provided outside the sealed cabin door of the curing cabin, and the feed conveyor mechanism and the discharging conveyor mechanism are used to realize the moving of the curing devices into and out of the curing cabin. When the feed conveyor mechanism and the discharging conveyor mechanism are in operation, the corresponding inlet and outlet sealed cabin doors are opened, and the feed and discharging conveyor structures work simultaneously. The feed and discharging conveyor mechanisms respectively adopt motor-driven transmission chains, and the chains are meshed with gears at the ends of the rollers. The chain-driven gears drive the rollers to operate, and the tray and the curing devices contained therein are moved on the rollers by means of friction with the rollers. The feed conveyor is dragged in and the discharging conveyor is pushed out. The two work together to realize the moving in and out of the tray and the devices contained therein. After the tray position sensor arranged inside the cabin detects that the tray has been transported to the set position, the transport mechanism stops moving.

6. A method for using the multifunctional glue curing device according to any one of claims 1 to 5, characterized in that: The device to be cured is placed on a tray and sent into the curing chamber by a feeding conveyor mechanism. After vacuum degassing, low-temperature curing or high-temperature curing, it is cooled and sent out of the curing chamber. It is sent to the next process by a discharging conveyor mechanism. When the material is subjected to vacuum degassing in the curing chamber, the following operations are performed: the material conveyor mechanism moves the device to be cured to the center of the curing chamber and is located above the heating module. The heating module is turned on for preheating. The preheating temperature is 25-55°C to prevent the glue from curing before the bubbles are removed. The heating time is 5-30 minutes. At the same time, the negative pressure treatment component is turned on to keep the vacuum degree in the curing chamber at 50Pa-100Kpa. When the material is subjected to low-temperature curing treatment in the curing chamber, close the negative pressure treatment component to determine whether the current curing treatment requires a protective atmosphere. If necessary, introduce protective gas and turn on the heating mechanism at the same time. According to the curing characteristics of the glue, maintain the temperature range of 80-100°C and the heating time range of 30-120min; When the material is subjected to high-temperature curing treatment in the curing chamber, close the negative pressure treatment component to determine whether the current curing treatment requires a protective atmosphere. If necessary, introduce protective gas and turn on the heating mechanism at the same time. According to the curing characteristics of the glue, maintain the temperature range of 120-180°C and the heating time range of 60-150min; When the material is solidified and cooled, the protective atmosphere is turned off, the heating mechanism is adjusted, and temperature-controlled cooling is performed.

7. The method for using the multifunctional glue curing device according to claim 6, characterized in that: The temperature-controlled cooling means that when the encapsulation glue is cooled from above the glass transition temperature Tg to Tg, the cooling rate is 0.25-2°C / min; when the encapsulation glue is cooled to a temperature below Tg, the cooling rate is increased, and the cooling rate does not exceed 0.25-4°C / min. During the cooling process, the cooling rate limit value is set by the temperature control instrument. If the cooling rate exceeds the set value, the heating mechanism and the circulating fan transfer the heat generated by the heating module in the cabin through the internal air to suppress the cooling speed from being too fast. When the cooling rate is lower than the set value, the heating system stops outputting and implements free cooling.

8. The method for using the multifunctional glue curing device according to claim 6, characterized in that: During the vacuum degassing treatment, the air pressure in the curing chamber is preferably 100-50KPa. This is because the viscosity of the encapsulation glue is usually 100-300Pa·S. When the vacuum degree is low, the bubble overflow speed is slow, the degassing efficiency is low, and the degassing is insufficient. When the vacuum degree is high, the gas overflow speed is too fast, causing the glue to expand and the shape to change irregularly, resulting in the product not meeting the requirements. 50Pa-100KPa can achieve degassing. On the one hand, it has a moderate degassing rate, and on the other hand, the shape of the glue is well maintained.

9. The method for using the multifunctional glue curing device according to claim 6, characterized in that: During the low temperature curing process or the high temperature curing process, humidity control is also required to control the humidity in the curing chamber, and the humidity content in the cavity is 0.1% RH to 25% RH.

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