Clamping and fixing device for chip testing

Abstract

The invention discloses a clamping and fixing device for chip testing, and relates to the technical field of chip testing clamps. The device comprises a rack. One side of the rack is telescopically provided with a plurality of parallel chip clamps. The rack comprises two stand columns, a connecting beam is connected between the two stand columns, a supporting beam is arranged on one side of each stand column, and a rectangular inserting hole A communicating with the rectangular through hole is formed in the end of each supporting beam; the chip clamp comprises a carrying table used for placing a chip, side beams are arranged on the two sides of the carrying table respectively, rectangular insertion holes B used for insertion of the supporting beams are formed in the ends of the side beams, and insertion rods inserted into the rectangular insertion holes A are arranged in the rectangular insertion holes B. According to the invention, the plurality of parallel chip clamps are telescopically arranged on one side of the rack, when the chips are placed on the corresponding chip clamps, one ends of the corresponding chip clamps are controlled to extend out of the end parts of the remaining chip clamps, and then the chips are conveniently placed on the corresponding chip clamps during use.

Description

Technical Field

[0001] The invention belongs to the technical field of chip testing fixtures, and in particular relates to a clamping and fixing device for chip testing. Background Art

[0002] With the continuous development of electronic chip technology, the testing technology of packaged chips has also become an important technical key to ensure production quality and accelerate the production process in the electronics industry. Generally, the packaged electronic chips need to be electrically tested at a preset high temperature to understand the stability of the packaged chips. In the process of testing the chip, it is usually necessary to clamp the chip.

[0003] For example, CN109580999A discloses a chip testing fixture, including a test seat, wherein two groups of fixing plates are fixedly mounted on the upper surface of the test seat, and test probes are arranged on the front and rear surfaces of the fixing plates, contact pins are embedded and mounted on the inner side of the upper surface of the test seat, and two groups of supporting feet are fixedly mounted on the lower surface of the test seat, signal lines are arranged through the upper surface of the test seat, and fuses are arranged on the lower surface of the test seat at positions corresponding to the lower ends of the contact pins; when using the device, it is not convenient to manually place the chip on the test seat, and it is also not convenient to clamp and fix the chip placed thereon when in use. Summary of the invention

[0004] The purpose of the present invention is to provide a clamping and fixing device for chip testing, which solves the problem of the prior art that it is inconvenient to manually place the chip on the test seat during use by arranging a plurality of parallel chip clamps telescopically on one side of the frame.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a clamping and fixing device for chip testing, comprising a frame, one side of which is telescopically provided with a plurality of parallel chip clamps; the frame comprises two columns, a connecting beam is connected between the two columns, a support beam is arranged on one side of the column, a rectangular through hole is arranged on the support beam, the axial direction of the rectangular through hole is the vertical direction, and a rectangular plug hole A connected to the rectangular through hole is opened at the end of the support beam; the chip clamp comprises a carrier for placing the chip, side beams are respectively arranged on both sides of the carrier, a rectangular plug hole B for inserting the support beam is arranged at the end of the side beam, and a plug rod inserted into the rectangular plug hole A is arranged in the rectangular plug hole B;

[0007] Wherein, grooves A are respectively arranged on the two side walls of the end of the plug rod, and a movable block sliding along the inner wall of the groove A is connected to the groove A through multiple elastic telescopic sleeves A, and an opening A is arranged on the movable block in the vertical direction; an elastic telescopic sleeve B connected to the elastic telescopic sleeve A is arranged on the bottom side of the groove A; the two ends of the side beam are respectively threadedly connected with bolts A;

[0008] The bolt A is rotated to drive the elastic telescopic sleeve B to contract. When the elastic telescopic sleeve B contracts, the elastic telescopic sleeve A is pushed upward, thereby driving the movable block to slide upward along the inner wall of the groove A and be inserted into the rectangular socket A.

[0009] Furthermore, a convex ring is provided on the inner wall of the opening A, and one side of the convex ring is connected to a "cross" column sliding along the inner wall of the opening A through a spring A; when the bolt A is rotated, the end of the bolt A abuts against one end of the "cross" column, and the other end of the "cross" column abuts against the end of the elastic telescopic sleeve B.

[0010] Furthermore, the elastic telescopic sleeve A and the elastic telescopic sleeve B have the same structure, both comprising an inner sleeve and an outer sleeve that are sealed and sleeved with each other, and a spring B is connected between the inner sleeve and the outer sleeve.

[0011] Furthermore, a through hole is provided on the carrier, and an annular step portion is provided on the upper surface of the carrier located at the through hole; an avoidance opening is provided on one side of the through hole; four radially distributed rectangular openings are provided on the circumference of the through hole, and a telescopic cylinder A is provided on one side wall of the rectangular opening, and the end of the telescopic cylinder A is connected to a clamping block for clamping the chip placed on the annular step portion.

[0012] Furthermore, the clamping block includes a clamping block body, a groove B is provided on the side of the clamping block body away from the telescopic cylinder A, a pressure sensor is provided on the inner bottom side of the groove B, a plurality of recessed holes A are provided on the inner bottom side of the groove B located around the pressure sensor, an elastic telescopic sleeve C with the same structure as the elastic telescopic sleeve A is provided in the recessed hole A, and the end of the elastic telescopic sleeve C is connected to a stop plate movable along the inner wall of the groove B.

[0013] Furthermore, an installation cavity is provided on the upper end surface of the clamp body, a micro telescopic cylinder is provided on the bottom side surface of the installation cavity, an end of the micro telescopic cylinder is connected to a movable block, an end of the movable block is connected to a cross arm placed horizontally on the chip, and a spherical protrusion is provided on the bottom side surface of the cross arm to abut against the chip.

[0014] Furthermore, a detection mechanism for detecting whether a chip is placed thereon is provided on the annular step portion; the detection mechanism comprises an infrared transmitting module and an infrared receiving module provided on the annular step portions on both sides of the avoidance opening;

[0015] Two concentric mounting holes are arranged on the side walls of the through holes on both sides of the avoidance opening, and the infrared transmitting module and the infrared receiving module are respectively installed in the two mounting holes; the infrared transmitting module and the infrared receiving module are both connected to the power supply through the switch structure.

[0016] Furthermore, arc grooves are arranged on the annular step portions on both sides of the avoidance opening, a recessed hole B is arranged on the bottom side of the arc groove, an elastic telescopic sleeve D having the same structure as the elastic telescopic sleeve A is arranged in the recessed hole B, and a movable support plate is connected to the end of the elastic telescopic sleeve D; the mounting hole is connected to the corresponding arc groove.

[0017] Furthermore, the bottom side of the arc-shaped groove is provided with a recessed portion for installing a switch structure; the switch structure includes a first structure and a second structure respectively arranged on the bottom side of the arc-shaped groove and the bottom side of the movable support plate; the first structure includes a first ceramic sleeve, in which a conductive column is arranged, and the second structure includes a second ceramic sleeve sleeved in the first ceramic sleeve, in which a conductive sleeve is arranged.

[0018] Furthermore, it also includes a controller, which is connected to the telescopic cylinder A, the infrared receiving module, the pressure sensor, and the micro telescopic cylinder;

[0019] A method for using a clamping fixture for chip testing includes:

[0020] Step 1, pull out a chip fixture for placing a chip outward until one end thereof protrudes from the end of the remaining chip fixture;

[0021] Step 2: Place the chip on the annular step portion. At this time, the infrared receiving module receives the light emitted by the infrared transmitting module and generates a signal.

[0022] Step 3, control the telescopic cylinder A to extend until the abutment plate abuts against the outer peripheral side wall of the chip, and the pressure sensor generates a pressure signal;

[0023] Step 4, control the micro telescopic cylinder until the spherical protrusion arranged on the cross arm abuts against the upper surface of the chip;

[0024] Step 5: Push the chip holder with the chip inward.

[0025] The present invention has the following beneficial effects:

[0026] The present invention provides a plurality of parallel chip fixtures telescopically on one side of a frame. When placing a chip on a corresponding chip fixture, one end of the corresponding chip fixture is first controlled to protrude from the end of the remaining chip fixtures, thereby facilitating the placement of the chip on the corresponding chip fixture during use.

[0027] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0029] Figure 1 It is a schematic diagram of the structure of the clamping and fixing device of the present invention;

[0030] Figure 2 for Figure 1 The main view;

[0031] Figure 3 It is a schematic diagram of the frame structure of the present invention;

[0032] Figure 4 The chip fixture structure of the present invention is shown in FIG. Figure 1 ;

[0033] Figure 5 for Figure 4 A partial enlarged view of point B in the middle;

[0034] Figure 6 The chip fixture structure of the present invention is shown in FIG. Figure 2 ;

[0035] Figure 7 for Figure 6 A partial enlarged view of the middle part;

[0036] Figure 8 This is a schematic diagram of the structure of the groove A of the present invention;

[0037] Fig. 9 This is a schematic diagram of the structure of the clamping block of the present invention;

[0038] Fig.10 It is a structural schematic diagram of the arc groove of the present invention. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0041] See also Figure 1-2 As shown, the present invention is a clamping and fixing device for chip testing, which includes a frame 1, and a plurality of parallel chip clamps 2 are retractably arranged on one side of the frame 1, so that when in use, multiple chips 100 to be tested can be placed on the chip clamp 2 at the same time for subsequent side viewing. Based on this requirement, in order to facilitate the placement of chips 100 on different chip clamps 2 layer by layer during use, it is necessary to first control the corresponding chip clamp to be pulled outward from the frame until one end of the chip clamp 2 protrudes from the end of the remaining chip clamps 2, so that when in use, it is convenient to place the chip 100 on the corresponding chip clamp 2, and then control the chip clamp 2 with the chip 100 to be pushed inward.

[0042] In order to facilitate the assembly of the chip fixture 2 and the frame 1, as shown in FIG. Figure 3 The frame 1 provided includes two columns 10, a connecting beam 11 is connected between the two columns 10, a support beam 12 is arranged on one side of the column 10, a rectangular through hole 13 is arranged on the support beam 12, the axial direction of the rectangular through hole 13 is the vertical direction, and a rectangular plug hole A14 connected to the rectangular through hole 13 is opened at the end of the support beam 12; Figure 4 The chip fixture 2 includes a carrier 21 for placing the chip 100, and side beams 20 are respectively arranged on both sides of the carrier 21. The ends of the side beams 20 are provided with rectangular sockets B201 for inserting the support beam 12, and the rectangular sockets B201 are provided with insertion rods 202 inserted into the rectangular sockets A14, so that the chip fixture 2 can be conveniently controlled to be inserted into the rectangular sockets A14 by controlling the insertion rods 202 during use, so as to facilitate the assembly of the chip fixture 2 and the frame 1 during use, and the chip fixture 2 can be controlled to move along the length direction of the support beam 12 during use.

[0043] At the same time, when using Figure 5 and 8In order to avoid the chip fixture 2 from being damaged when the chip fixture 2 is moved along the length direction of the support beam 12, grooves A203 are respectively provided on the two side walls of the end of the insertion rod 202, and a movable block 204 sliding along the inner wall of the groove A203 is connected to the groove A203 through multiple elastic telescopic sleeves A206, and an opening A2041 is provided on the movable block 204 in the vertical direction; an elastic telescopic sleeve B207 connected to the elastic telescopic sleeve A206 is provided on the bottom side of the groove A203; the two ends of the side beam 20 are respectively threadedly connected with bolts A205; the bolts A205 are turned to , use the bolt A205 to drive the elastic telescopic sleeve B207 to contract. When the elastic telescopic sleeve B207 contracts, the elastic telescopic sleeve A206 is pushed upward, thereby driving the movable block 204 to slide upward along the inner wall of the groove A203 and insert into the rectangular socket A14. When in use, the bolt A205 is rotated to control the movable block 204 to protrude from the groove A203, and then the movable block 204 protruding outward is inserted into the rectangular socket A14. When in use, the movable block 204 is pressed against the inner wall of one end of the rectangular socket A14, thereby achieving blocking and limiting.

[0044] In order to better utilize the bolt A205 to drive the expansion and contraction of the elastic telescopic sleeve A206 and the elastic telescopic sleeve B207 during use, the elastic telescopic sleeve A206 and the elastic telescopic sleeve B207 provided by the present invention have the same structure, both include an inner sleeve and an outer sleeve that are sealed and sleeved with each other, and a spring B is connected between the inner sleeve and the outer sleeve, and at the same time, a convex ring 2042 is provided on the inner wall of the opening A2041, and one side of the convex ring 2042 is connected to a "cross" column 2044 that slides along the inner wall of the opening A2041 through a spring A2043; when the bolt A205 is rotated, the end of the bolt A205 abuts against one end of the "cross" column 2044, and the other end of the "cross" column 2044 abuts against the end of the elastic telescopic sleeve B207.

[0045] At the same time, when using Figure 6-7 In order to facilitate manual placement of the chip 100 on the carrier 21 smoothly and accurately, the present invention provides a through hole 211 on the carrier 21, and an annular step portion 212 is provided on the upper surface of the carrier 21 located at the through hole 211, so that the chip 100 is placed on the annular step portion 212 when in use, and a avoidance opening 213 is provided on one side of the through hole 211. The setting of the avoidance opening 213 facilitates fingers to pass through the avoidance opening 213.

[0046] Specifically, in order to facilitate the clamping and fixing of the chip 100 placed on the annular step portion 212 during use, four radially distributed rectangular openings 22 are arranged on the peripheral side of the through hole 211, and a telescopic cylinder A221 is arranged on one side wall of the rectangular opening 22. The end of the telescopic cylinder A221 is connected to a clamping block 23 for clamping the chip 100 placed on the annular step portion 212. When the chip 100 is placed on the annular step portion 212 during use, the telescopic cylinder A221 is controlled to extend, and the clamping block 23 is used to press against the outer peripheral side wall of the chip 100 to clamp and fix the chip 100.

[0047] In order to facilitate the detection of whether a chip 100 is placed on the annular step portion 212, a detection mechanism is provided on the annular step portion 212. When it is detected that a detection chip 100 is placed on the annular step portion 212, the telescopic cylinder A221 is controlled to extend.

[0048] Specifically, the detection mechanism provided by the present invention includes an arc groove 215 arranged on the annular step portion 212 on both sides of the avoidance opening 213, and two concentric mounting holes 214 arranged on the side walls of the through hole 211 on both sides of the avoidance opening 213, and an infrared transmitting module and an infrared receiving module are respectively installed in the two mounting holes 214, and the infrared transmitting module and the infrared receiving module are connected to the power supply through a switch structure, and the bottom side of the arc groove 215 is connected to a movable support plate 24 that moves along the axial direction of the arc groove 215 through an elastic telescopic sleeve D2151, such as Fig.10 The switch structure provided includes a first structure and a second structure respectively arranged on the bottom side of the arc groove 215 and the bottom side of the movable support plate 24; the first structure includes a first ceramic sleeve 251, and a conductive column 252 is arranged in the first ceramic sleeve 251, and the second structure includes a second ceramic sleeve 253 sleeved in the first ceramic sleeve 251, and a conductive sleeve 254 is arranged in the second ceramic sleeve 253, and the conductive column 252 is inserted into the conductive sleeve 254; and then in use, when the chip 100 is placed on the annular step portion 212, at this time, under the action of the gravity of the chip 100, the movable support plate 24 is controlled to move toward the side close to the bottom side of the arc groove 215, and at this time, the conductive column 252 is inserted into the conductive sleeve 254 for connection, and at this time, the infrared transmitting module and the infrared receiving module are both powered, and then at this time, the infrared receiving module receives the infrared light emitted by the infrared transmitting module, and then generates a signal.

[0049] A recessed portion 216 for mounting a switch structure is provided on the bottom side of the arc-shaped groove 215 .

[0050] That is, during use, in order to facilitate and better fix the chip 100 placed on the annular step portion 212, an installation cavity 2305 is provided on the upper end surface of the block body 230, and a micro-telescopic cylinder 2306 is provided on the bottom side surface of the installation cavity 2305, and the end of the micro-telescopic cylinder 2306 is connected to a movable block 231, and the end of the movable block 231 is connected to a cross arm 232 placed horizontally on the chip 100, and the bottom side surface of the cross arm 232 is provided with a spherical protrusion that presses against the chip 100, and then after the clamping block 23 is pressed against the outer peripheral side wall of the chip 100 to clamp and fix the chip 100, the micro-telescopic cylinder 2306 is controlled to retract, and at this time, the cross arm 232 with the spherical protrusion is used to fix the chip 100 placed on the annular step portion 212.

[0051] That is, when in use, the extension length of the telescopic cylinder A221 needs to be controlled, that is, when in use, the micro telescopic cylinder 2306 needs to be controlled to retract after the telescopic cylinder A221 is extended until the clamping block 23 abuts against the peripheral side wall of the chip 100. Fig. 9 The clamping block 23 provided by the present invention includes a clamping block body 230, and a groove B2301 is arranged on the side of the clamping block body 230 away from the telescopic cylinder A221, and a pressure sensor 2032 is arranged on the inner bottom side of the groove B2301. A plurality of recessed holes A are opened on the inner bottom side of the groove B2301 located on the peripheral side of the pressure sensor 2032, and an elastic telescopic sleeve C2033 with the same structure as the elastic telescopic sleeve A206 is arranged in the recessed hole A, and the end of the elastic telescopic sleeve C2033 is connected to a support plate 2034 that moves along the inner wall of the groove B2301; when the support plate 2034 is pressed against the outer peripheral side wall of the chip 100, the support plate 2034 shrinks into the groove B2301, and one side of the support plate 2034 is pressed against the pressure sensor 2032, and the pressure sensor 2032 generates a pressure signal.

[0052] An arc groove 215 is arranged on the annular step portion 212 located on both sides of the avoidance opening 213, a concave hole B is arranged on the bottom side surface of the arc groove 215, an elastic telescopic sleeve D2151 having the same structure as the elastic telescopic sleeve A206 is arranged in the concave hole B, and the end of the elastic telescopic sleeve D2151 is connected to a movable support plate 24; the mounting hole 214 is communicated with the corresponding arc groove 215.

[0053] Specifically, it also includes a controller, which is connected to the telescopic cylinder A221, the infrared receiving module, the pressure sensor 2032, and the micro telescopic cylinder 2306;

[0054] A method for using a clamping fixture for chip testing includes:

[0055] Step 1, pull out a chip fixture 2 for placing the chip 100 to the outside until one end thereof protrudes from the end of the remaining chip fixture 2;

[0056] Step 2: Place the chip 100 on the annular step portion 212. At this time, the infrared receiving module receives the light emitted by the infrared transmitting module and generates a signal;

[0057] Step 3, control the telescopic cylinder A221 to extend until the abutment plate 2034 abuts against the outer peripheral side wall of the chip 100, and at this time the pressure sensor 2032 generates a pressure signal;

[0058] Step 4, control the micro telescopic cylinder 2306 until the spherical protrusion provided on the cross arm 232 abuts against the upper surface of the chip 100;

[0059] Step 5: Push the chip holder 2 with the chip 100 inward.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0061] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A clamping device for chip testing, characterized in that: It comprises a frame (1), one side of which is telescopically provided with a plurality of parallel chip clamps (2); The frame (1) comprises two columns (10), a connecting beam (11) is connected between the two columns (10), a support beam (12) is arranged on one side of the column (10), a rectangular through hole (13) is arranged on the support beam (12), the axial direction of the rectangular through hole (13) is the vertical direction, and a rectangular plug hole A (14) connected to the rectangular through hole (13) is arranged at the end of the support beam (12); The chip fixture (2) comprises a carrier (21) for placing a chip (100), side beams (20) are respectively arranged on both sides of the carrier (21), and rectangular insertion holes B (201) for inserting a support beam (12) are arranged at the ends of the side beams (20), and an insertion rod (202) inserted into the rectangular insertion hole A (14) is arranged in the rectangular insertion hole B (201); Wherein, grooves A (203) are respectively arranged on the two side walls of the end of the insertion rod (202); a movable block (204) sliding along the inner wall of the groove A (203) is connected to the groove A (203) via a plurality of elastic telescopic sleeves A (206); and an opening A (2041) is arranged on the movable block (204) in the vertical direction; The bottom side of the groove A (203) is provided with an elastic telescopic sleeve B (207) which is in communication with the elastic telescopic sleeve A (206); The two ends of the side beam (20) are respectively threadedly connected with bolts A (205); The bolt A (205) is rotated and the elastic telescopic sleeve B (207) is driven to contract by the bolt A (205). When the elastic telescopic sleeve B (207) contracts, the elastic telescopic sleeve A (206) is pushed upward, thereby driving the movable block (204) to slide upward along the inner wall of the groove A (203) and be inserted into the rectangular insertion hole A (14).

2. A chip testing clamping and fixing device according to claim 1, characterized in that: The inner wall of the opening A (2041) is provided with a convex ring (2042), and one side of the convex ring (2042) is connected to a cross column (2044) that slides along the inner wall of the opening A (2041) via a spring A (2043); When the bolt A (205) is rotated, the end of the bolt A (205) abuts against one end of the cross column (2044), and the other end of the cross column (2044) abuts against the end of the elastic telescopic sleeve B (207).

3. A chip testing clamping and fixing device according to claim 1, characterized in that: The elastic telescopic sleeve A (206) and the elastic telescopic sleeve B (207) have the same structure, both comprising an inner sleeve and an outer sleeve which are sealed and sleeved with each other, and a spring B is connected between the inner sleeve and the outer sleeve.

4. A chip testing clamping and fixing device according to any one of claims 1 to 3, characterized in that: A through hole (211) is provided on the carrier (21); an annular step portion (212) is provided on the upper surface of the carrier (21) located at the through hole (211); and a relief opening (213) is provided on one side of the through hole (211); Four radially distributed rectangular openings (22) are arranged around the through hole (211), a telescopic cylinder A (221) is arranged on a side wall of the rectangular opening (22), and a clamping block (23) for clamping a chip (100) placed on the annular step portion (212) is connected to the end of the telescopic cylinder A (221).

5. A chip testing clamping and fixing device according to claim 4, characterized in that: The clamping block (23) comprises a clamping block body (230), a groove B (2301) is arranged on a side of the clamping block body (230) away from the telescopic cylinder A (221), a pressure sensor (2032) is arranged on the inner bottom side of the groove B (2301), a plurality of recessed holes A are opened on the inner bottom side of the groove B (2301) around the pressure sensor (2032), an elastic telescopic sleeve C (2033) having the same structure as the elastic telescopic sleeve A (206) is arranged in the recessed hole A, and the end of the elastic telescopic sleeve C (2033) is connected to a stop plate (2034) movable along the inner wall of the groove B (2301).

6. A chip testing clamping and fixing device according to claim 5, characterized in that: The upper end surface of the clamp body (230) is provided with a mounting cavity (2305), the bottom side surface of the mounting cavity (2305) is provided with a micro telescopic cylinder (2306), the end of the micro telescopic cylinder (2306) is connected to a movable block (231), the end of the movable block (231) is connected to a cross arm (232) placed horizontally on the chip (100), and the bottom side surface of the cross arm (232) is provided with a spherical protrusion that abuts against the chip (100).

7. A chip testing clamping and fixing device according to claim 6, characterized in that: The annular step portion (212) is provided with a detection mechanism for detecting whether the chip (100) is placed thereon; The detection mechanism comprises an infrared transmitting module and an infrared receiving module arranged on the annular step portions (212) on both sides of the avoidance opening (213); Two concentrically structured mounting holes (214) are provided on the side walls of the through holes (211) on both sides of the avoidance opening (213), and the infrared transmitting module and the infrared receiving module are respectively mounted in the two mounting holes (214); The infrared transmitting module and the infrared receiving module are both connected to a power source via a switch structure.

8. A chip testing clamping and fixing device according to claim 7, characterized in that: An arc-shaped groove (215) is provided on the annular step portion (212) located on both sides of the avoidance opening (213); a concave hole B is provided on the bottom side of the arc-shaped groove (215); an elastic telescopic sleeve D (2151) having the same structure as the elastic telescopic sleeve A (206) is provided in the concave hole B; and an end of the elastic telescopic sleeve D (2151) is connected to a movable support plate (24); The mounting hole (214) is communicated with the corresponding arc-shaped groove (215).

9. A chip testing clamping and fixing device according to claim 8, characterized in that: The bottom side surface of the arc-shaped groove (215) is provided with a recessed portion for installing a switch structure; The switch structure comprises a first structure and a second structure respectively arranged on the bottom side of the arc-shaped groove (215) and the bottom side of the movable support plate (24); The first structure comprises a first ceramic sleeve (251), wherein a conductive column (252) is arranged inside the first ceramic sleeve (251), and the second structure comprises a second ceramic sleeve (253) sleeved inside the first ceramic sleeve (251), wherein a conductive sleeve (254) is arranged inside the second ceramic sleeve (253).

10. A chip testing clamping and fixing device according to claim 9, characterized in that: It also includes a controller, wherein the controller is connected to the telescopic cylinder A (221), the infrared receiving module, the pressure sensor (2032), and the micro telescopic cylinder (2306); A method for using a clamping fixture for chip testing includes: Step 1, pulling out a chip fixture (2) for placing a chip (100) to the outside until one end thereof protrudes from the end of the remaining chip fixture (2); Step 2: Take the chip (100) and place it on the annular step portion (212), and the infrared receiving module receives the light emitted by the infrared transmitting module and generates a signal; Step 3, control the telescopic cylinder A (221) to extend until the abutment plate (2034) abuts against the outer peripheral side wall of the chip (100), and at this time the pressure sensor (2032) generates a pressure signal; Step 4, controlling the micro telescopic cylinder (2306) until the spherical protrusion provided on the cross arm (232) abuts against the upper surface of the chip (100); Step 5: Push the chip holder (2) with the chip (100) inward.

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