Manufacturing method of rectangular electronic ceramic chip

Abstract

The invention discloses a method for manufacturing a rectangular electronic ceramic chip, which comprises the following steps of: firstly, manufacturing a large-size (length and width are far greater than the length and width of the chip) electronic ceramic body, and then cutting the electronic ceramic body into a plurality of ceramic chip slices based on the thickness of the chip; according to the method, the electronic ceramic chips with the end face electrodes can be produced in batches, then a plurality of notches at equal intervals are formed in the ceramic chips on the basis of the length dimension requirement of the chips, electrode coating is carried out once, cutting is carried out on the basis of the length dimension requirement of the chips after coating, and then the electronic ceramic chips with the end face electrodes can be produced in batches. The manufacturing cost is reduced; and meanwhile, the size precision of mechanical cutting is obviously superior to that of a single green body after sintering shrinkage, so that the electrical parameter consistency of the electronic ceramic chip can be improved by the method.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic electronic components, and in particular to a method for manufacturing a rectangular electronic ceramic chip. Background Art

[0002] In the conventional manufacturing process of electronic ceramic chips, the powdered electronic ceramic raw materials that are evenly mixed according to the prescribed formula are usually pressed into independent ceramic chip green bodies, and the corresponding pressing process is completed by a mechanical multi-station rotary press through bidirectional pressure. The pressed green body is then sintered at high temperature, and then electrodes are coated on the end faces of the fired ceramic pieces to make chips. The advantage of this process is that the chip can be pressed and formed into the required size in just one press. The main disadvantages are: since the ceramic green body will shrink when sintered at high temperature, the shrinkage rate is between 10% and 20%, and because of the different positions of the ceramic green body in the firing kiln and the influence of the temperature difference, the outer size and flatness errors of the chip after firing are very large. It is generally believed that an error rate less than 5% is acceptable, otherwise the pass rate will be too low; the whole process seems simple, but in fact each step has a large number of auxiliary actions such as picking up and placing chips. Since they are all operated on a single chip, especially small chips with a size of less than 10mm, a large amount of manpower and labor time are required for large-scale manufacturing of huge quantities; the mechanical strength of the ceramic green body is very low. When a single product is manufactured in large quantities, it is easy to cause damage during the process of picking up and filling the kiln due to too fast operation, resulting in a decrease in the pass rate and poor product consistency. Summary of the invention

[0003] The purpose of the present invention is to overcome the problems of individually pressing a single ceramic chip green body in the existing electronic ceramic chip manufacturing process, repeated operations of picking up and swinging the chips, and low qualified rate. A method for manufacturing a rectangular electronic ceramic chip is provided, by first manufacturing a large-size electronic ceramic body (length and width are much larger than the length and width of the chip), and then cutting the electronic ceramic body into a plurality of ceramic slices based on the chip thickness, and then opening a plurality of equally spaced notches on the ceramic slices based on the length size requirements of the chip, and by coating an electrode once, cutting based on the length and width requirements of the chip after coating, so as to realize batch production of electronic ceramic chips with end face electrodes. The method effectively reduces auxiliary labor time, improves production efficiency, and reduces manufacturing costs; at the same time, the dimensional accuracy of mechanical cutting is significantly better than the dimensional accuracy of the single green body after sintering and shrinkage, so the method can improve the consistency of electrical parameters of electronic ceramic chips.

[0004] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0005] A method for manufacturing a rectangular electronic ceramic chip, wherein the rectangular electronic ceramic chip has a thickness of H, a length of A, and a width of B, and the method comprises:

[0006] S1. Obtaining an electronic ceramic body through a pressing and sintering process, wherein the electronic ceramic body has a thickness ≥ H, a length ≥ 2A, and a width ≥ 2B;

[0007] S2, cutting the electronic ceramic body along a preset direction to obtain ceramic slices with a thickness of H;

[0008] S3, with a spacing length of A, equidistant notches are provided on both sides of the ceramic slice, and double-sided full electrode coating is performed on the notched ceramic slice;

[0009] S4, cutting along the notch edge on the back side of the notch to the bottom of the notch so that the cut portion is disconnected from the bottom of the notch, and then cutting the cut portion between the two notches into a width of B to form a single rectangular electronic ceramic chip.

[0010] According to a specific implementation, in the method for manufacturing the rectangular electronic ceramic chip, in S3, the width of the equidistant notches is L, and the depth is D, wherein L is 0.3-2 mm, and D is 0.3H-0.7H.

[0011] According to a specific embodiment, in the method for manufacturing the rectangular electronic ceramic chip, the step S4 includes:

[0012] S41, cutting grooves on the corresponding surfaces of the grooves of the equidistant grooves, cutting the tile slices to form a plurality of strip-shaped tile slices; wherein the cutting groove width is ≥ L, and the cutting groove depth is D 1 , and HD≤D 1 ≤H;

[0013] S42, cutting the strip-shaped ceramic slices transversely, wherein the transverse cutting interval is set based on the width B of the rectangular electronic ceramic chip.

[0014] According to a specific embodiment, in the method for manufacturing the rectangular electronic ceramic chip, the method further comprises: forming a margin by grinding the edges before cutting and / or applying a mask to the electrodes. .

[0015] According to a specific embodiment, in the method for manufacturing the rectangular electronic ceramic chip, the S3 further includes a chamfering step before coating the double-sided full electrode;

[0016] The chamfering step includes: chamfering the edges of the equidistant notches.

[0017] According to a specific implementation, in the method for manufacturing the rectangular electronic ceramic chip, the radius R of the chamfer is 0.3-1.5 mm.

[0018] According to a specific implementation, in the method for manufacturing the rectangular electronic ceramic chip, the magnetron sputtering technology is used in S3 to perform double-sided full-electrode coating on the ceramic slice after the equidistant grooves are opened.

[0019] According to a specific implementation, in the method for manufacturing the rectangular electronic ceramic chip, the S3 uses a printing coating process to perform full-electrode coating on both sides of the ceramic slice after the equidistant notches are opened.

[0020] According to a specific implementation, in the method for manufacturing the rectangular electronic ceramic chip, in S1, an isostatic press is used to press-form the electronic ceramic body.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The method for manufacturing a rectangular electronic ceramic chip provided in an embodiment of the present invention is to first manufacture a large-sized (length and width are much larger than the length and width of the chip) electronic ceramic body, the thickness of the ceramic sheet is equal to the thickness of the chip, and then a plurality of equally spaced notches are opened on the ceramic sheet based on the length dimension of the chip, and double-sided electrode coating is performed (electrode coating is also performed on the groove surface). After coating, the chip is cut based on the length and width dimension requirements, so that batch production of electronic ceramic chips with end face electrodes can be achieved. This method effectively reduces auxiliary labor time, improves production efficiency, and reduces manufacturing costs; at the same time, the dimensional accuracy of mechanical cutting is significantly better than the dimensional accuracy of a single green body after sintering and shrinkage, so this method can improve the consistency of electrical parameters of electronic ceramic chips.

[0023] 2. The end surface electrodes of the electronic ceramic chip manufactured by this method extend to the preset edge and side, which is conducive to overlapping and placing several chips, connecting them in parallel on the side with connecting wires and then leading them out, thereby doubling the electrical parameter capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a flow chart of a method for manufacturing a rectangular electronic ceramic chip in one embodiment;

[0025] Figure 2 A schematic diagram of a large electronic ceramic body in one embodiment;

[0026] Figure 3 A schematic diagram of a tile slice groove in an embodiment;

[0027] Figure 4 A schematic diagram of a ceramic substrate with a processed electrode surface in an embodiment;

[0028] Figure 5a is a first schematic diagram of a single chip formed in one embodiment;

[0029] Figure 5b is a second schematic diagram of a single chip formed in one embodiment;

[0030] Figure 6 is a schematic diagram of chamfering processing in an embodiment;

[0031] Figure 7 is a schematic diagram of a multi-layer chip stack in one embodiment;

[0032] Figure numerals: 1 - electrode layer; 2 - chamfer R of substrate groove position. DETAILED DESCRIPTION

[0033] The present invention is further described in detail below in conjunction with test examples and specific implementation methods. However, this should not be understood as the scope of the above subject matter of the present invention being limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

[0034] Example

[0035] Example 1

[0036] Figure 1 A method for manufacturing a rectangular electronic ceramic chip according to an exemplary embodiment of the present invention is shown, wherein the rectangular electronic ceramic chip has a thickness of H, a length of A, and a width of B, and the method comprises:

[0037] S1. Obtain an electronic ceramic body through a pressing and sintering process, wherein the electronic ceramic body has a thickness ≥ H, a length ≥ 2A, and a width ≥ 2B; (e.g. Figure 2 As shown, the length and width of the electronic ceramic body are much larger than those of the rectangular electronic ceramic chip, usually 10 times or more, to improve chip manufacturing efficiency);

[0038] S2, cutting the electronic ceramic body along a preset direction to obtain ceramic slices with a thickness of H;

[0039] S3, with a spacing length of A, equidistant notches are provided on both sides of the ceramic slice, and double-sided full electrode coating is performed on the notched ceramic slice;

[0040] S4, cutting along the notch edge on the back side of the notch to the bottom of the notch so that the cut portion is disconnected from the bottom of the notch, and then cutting the cut portion between the two notches into a width of B to form a single rectangular electronic ceramic chip.

[0041] The method for manufacturing a rectangular electronic ceramic chip provided in an embodiment of the present invention first manufactures a large-sized (length and width are much larger than the length and width of the chip) electronic ceramic body, then cuts the ceramic body into multiple ceramic slices based on the chip thickness, opens multiple equally spaced notches on the ceramic slices based on the length size requirements of the chip, performs double-sided electrode coating (electrode coating is also performed on the groove surface), and after coating, cuts based on the length and width requirements of the chip to achieve mass production of electronic ceramic chips with end face electrodes. This method effectively reduces auxiliary labor time, improves production efficiency, and reduces manufacturing costs; at the same time, the dimensional accuracy of mechanical cutting is significantly better than the dimensional accuracy of a single green body after sintering and shrinkage, so this method can improve the consistency of electrical parameters of electronic ceramic chips.

[0042] Example 2

[0043] In a possible implementation, the above S1 specifically includes: using an isostatic press to press-form the electronic ceramic body, and after high-temperature sintering to form the electronic ceramic body, forming a plurality of ceramic slices with a preset thickness H by using a slicing technology.

[0044] In a possible implementation, in the above S3, if Figure 3 As shown (the dotted lines in the figure are the same grooves on the back and front), after obtaining a ceramic slice with a preset thickness H, equal-distance grooves are opened on both sides of the ceramic slice according to the length requirements of the rectangular electronic ceramic chip, and the grooves are staggered in pairs.

[0045] Among them, Figure 3 As shown, the dimension M between the two grooves is determined by the product's tolerable flow rate, and is set based on the product's length A. The groove width L is 0.3-2 mm, and the groove depth D is determined by the product's thickness H, which is generally 30-70% of the thickness H.

[0046] In a possible implementation, S3 specifically includes: forming a double-sided grooved ceramic slice and then performing double-sided full electrode coating by printing coating or magnetron sputtering technology, wherein magnetron sputtering technology is preferred, which can quickly produce double-sided electrodes in one time. Figure 4 FIG. 1 shows a schematic diagram of a ceramic substrate having an electrode surface processed in this embodiment (the stripes in the figure are the electrode surface, Figure 4 In the figure, from top to bottom and from left to right are the top view and the main view of the ceramic substrate, and the one on the right is the left view). The electrode surface can be made into stripes with retention variables by sputtering double-sided mask, or it can be formed by screen printing process, or it can be all electrode surfaces on both sides. When cutting, the electrode is ground off in the direction of the stripes, and then cut into strips in the direction of L1, and then cut into products of the required size in the direction of L2 (in specific operations, it is also possible to cut in the direction of L2 first, and then cut in the direction of L1).

[0047] Specifically, the above S4 specifically includes: Figure 4 As shown, firstly, the grooves are cut on the corresponding surfaces of the grooves. The width of the cutting grooves should not be less than the width of the opposite grooves, that is, the width should be greater than the L value, and the depth should reach the opposite groove to achieve the purpose of cutting the ceramic slices, or it is about to be cut; after processing into strip-shaped ceramic slices, they are aligned and placed one by one for horizontal cutting at the same time. The cutting width is based on the size of the width B of the ceramic chip, and then the steps of the chip are formed as needed (or no steps are formed), so as to form multiple independent products at one time. Specifically, in the above S4, the cutting can also be carried out by first cutting vertically and then cutting horizontally.

[0048] In a possible implementation, the above S4 adopts the process of first grinding and then cutting to manufacture a single chip, specifically including: first grinding away the surface electrode portion corresponding to the groove L, with a width of 1.5 to 3 times the groove width, and then performing groove cutting in opposite directions, using the same method as above, with the groove width being slightly wider than the opposite groove width.

[0049] In a possible implementation, the method further includes: forming a margin of the chip product by grinding the edges before cutting and / or controlling the electrode coating size through the electrode coating mask. Specifically, when coating the electrode surface, the electrode coating size is controlled by the electrode coating mask to form a corresponding margin, that is, the electrode coating size must satisfy L<L1<A / 3, and / or, after forming the strip product, the electrode surface to be transversely cut is first ground off according to the required product size, and the width is 1.2 to 3 times the incision width, and then cutting is performed at the middle position of the ground electrode surface, such as Figure 5a , 5b As shown, a single independent chip product with a margin can be finally formed.

[0050] In this embodiment, the electrode layer plated on the edge of the chip is removed by grinding before cutting, and / or the electrode coating size is controlled to form a margin to increase the creepage distance.

[0051] In a possible implementation, in the method for manufacturing the rectangular electronic ceramic chip, the step S3 further includes: a chamfering step after the equidistant notches are formed, such as Figure 6 As shown, the chamfering step includes: chamfering the edges of the equidistant notches. Further, the chamfer R is preferably 0.3-1.5 mm.

[0052] In this embodiment, edge chamfering is performed to ensure that the end face and the side electrode surface of the formed ceramic slice can be smoothly connected. There is a transition surface in the middle of the chamfered ceramic slice, which can ensure that a large current is transmitted to the effective electrode layer on the end face through the side electrode, and can effectively prevent the defect that the thickness of the interface conductive layer on both sides is insufficient and an effective connection cannot be formed during the processing process.

[0053] In a possible implementation, the method for manufacturing the rectangular electronic ceramic chip further includes stacking each single chip in parallel to increase the electrical parameter capacity of the product. Figure 7 As shown, by stacking single chips in parallel, a multi-layer chip with multiplied electrical parameter capacity can be formed.

[0054] In summary, the manufacturing method provided in this embodiment has the following advantages:

[0055] 1. It can process several electronic ceramic chips of the same size at one time, which can greatly improve manufacturing efficiency and reduce manufacturing costs;

[0056] 2. Since the dimensional accuracy of mechanical cutting is significantly better than the dimensional accuracy of the single green body after sintering and shrinkage, this method can improve the consistency of electrical parameters of electronic ceramic chips;

[0057] 3. The end electrodes of the electronic ceramic chip extend to the edge and connect to the side electrodes, which is conducive to overlapping and placing several chips, connecting them in parallel on the side with connecting wires and then leading them out, thereby doubling the electrical parameter capacity.

[0058] 4. Introduce advanced isostatic pressing technology to press ceramic green bodies to improve density and uniformity, thereby improving the electrical parameters of electronic ceramic chips.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a rectangular electronic ceramic chip, wherein the thickness of the rectangular electronic ceramic chip is H, the length is A, and the width is B, characterized in that: The method comprises: S1. Obtaining an electronic ceramic body through a pressing and sintering process, wherein the electronic ceramic body has a thickness ≥ H, a length ≥ 2A, and a width ≥ 2B; S2, cutting the electronic ceramic body along a preset direction to obtain ceramic slices with a thickness of H; S3, with a spacing length of A, equidistant notches are provided on both sides of the ceramic slice, and double-sided full electrode coating is performed on the notched ceramic slice; S4, cutting along the notch edge on the back side of the notch to the bottom of the notch so that the cut portion is disconnected from the bottom of the notch, and then cutting the cut portion between the two notches into a width of B to form a single rectangular electronic ceramic chip.

2. The method for manufacturing a rectangular electronic ceramic chip according to claim 1, characterized in that: In S3, the groove width of the equidistant grooves is L, and the groove depth is D, wherein L is 0.3-2 mm, and D is 0.3H-0.7H.

3. The method for manufacturing a rectangular electronic ceramic chip according to claim 2, characterized in that: The S4 comprises: S41, performing groove cutting on the groove corresponding surfaces of the equidistant grooves, cutting the tile slices to form a plurality of strip-shaped tile slices; wherein the cutting groove width is ≥ L, the cutting groove depth is D1, and HD≤D1≤H is satisfied; S42, cutting the strip-shaped ceramic slices transversely, wherein the transverse cutting interval is set based on the width B of the rectangular electronic ceramic chip.

4. The method for manufacturing a rectangular electronic ceramic chip according to any one of claims 1 to 3, characterized in that: The method further comprises: forming a margin by means of edge grinding before cutting and / or electrode coating mask.

5. The method for manufacturing a rectangular electronic ceramic chip according to any one of claims 1 to 3, characterized in that: The S3 also includes a chamfering step before double-sided full electrode coating; The chamfering step includes: chamfering the edges of the equidistant notches.

6. The method for manufacturing a rectangular electronic ceramic chip according to claim 5, characterized in that: The R of the chamfer is 0.3-1.5 mm.

7. The method for manufacturing a rectangular electronic ceramic chip according to any one of claims 1 to 3, characterized in that: In the S3, magnetron sputtering technology is used to perform double-sided full electrode coating on the ceramic slices after equidistant grooves are opened.

8. The method for manufacturing a rectangular electronic ceramic chip according to any one of claims 1 to 3, characterized in that: In S3, a printing coating process is used to perform double-sided full-electrode coating on the ceramic slices after the equidistant grooves are opened.

9. The method for manufacturing a rectangular electronic ceramic chip according to any one of claims 1 to 3, characterized in that: In S1, an isostatic press is used to press-form the electronic ceramic body.

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