Coating equipment, conductive film and preparation method of conductive film

Abstract

The invention discloses coating equipment, a conductive film and a preparation method of the conductive film. The coating equipment comprises an unwinding assembly, a first coating assembly, a second coating assembly and a winding assembly. The unwinding assembly is used for unwinding a base film layer, the first coating assemblies and the second coating assemblies are used for coating two surfaces of the base film layer respectively, and the at least one first coating assembly is at least used for coating a first metal layer on a first surface of the base film layer; the second coating assembly, away from the winding assembly, of the at least two second coating assemblies is at least used for plating a second metal layer on the second surface of the base film layer, and the second coating assembly, close to the winding assembly, of the at least two second coating assemblies is at least used for plating an anti-sticking layer on the second metal layer. The winding assembly is used for winding the base film layer plated with the first metal layer, the second metal layer and the anti-sticking layer. The conductive film can solve the problem that the metal layers on the two opposite surfaces of the conductive film in the prior art are easy to bond with each other, so that the metal layers fall off from the base film layer.

Description

Technical Field

[0001] The present invention relates to the field of thin film technology, and in particular to a coating device, a conductive film and a method for preparing the conductive film. Background Art

[0002] Conductive film is a thin film structure with a metal film layer plated on the surface of a polymer base film. It is widely used in lithium-ion batteries and is mainly used as a battery current collector in lithium-ion batteries. After the conductive film obtained by plating metal layers on the opposite sides of the polymer base film is rolled up and unrolled, the metal layers on the opposite sides of the conductive film are prone to sticking to each other or sticking to the film, resulting in adhesion failure of the metal layer of the film roll during the rolling or unrolling process, causing delamination defects, that is, the metal layer on the surface of the base film is partially or sporadically detached, which seriously affects the quality of the conductive film. Summary of the invention

[0003] The main purpose of the present invention is to provide a coating device, a conductive film and a method for preparing a conductive film, so as to solve the problem in the prior art that the metal layers on the two sides of the conductive film are prone to stick to each other, causing the metal layer to fall off the base film layer.

[0004] According to one aspect of the present invention, a coating device is provided, the coating device is used at least to coat a base film layer, and the coating device comprises:

[0005] An unwinding assembly, a first coating assembly, a second coating assembly and a winding assembly are sequentially arranged along the conveying path of the base film layer;

[0006] Among them, the unwinding component is used to unwind the base film layer, the first coating component and the second coating component respectively coat the two opposite surfaces of the base film layer, the first coating component includes at least one, at least one of the first coating components is at least used to coat the first metal layer on the first surface of the base film layer, the second coating component includes at least two, at least two of the second coating components are arranged in sequence along the conveying path direction of the base film layer, and the second coating component away from the winding component among the at least two second coating components is at least used to coat the second metal layer on the second surface of the base film layer opposite to the first surface, the second coating component close to the winding component among the at least two second coating components is at least used to coat the second metal layer with an anti-sticking layer, and the winding component is used to wind up the base film layer coated with the first metal layer, the second metal layer and the anti-sticking layer.

[0007] Further, the first coating component includes one, and the second coating component includes two;

[0008] Among them, the first coating component is used to coat the first metal layer on the first surface, the second coating component of the two second coating components far away from the winding component is used to coat the second metal layer on the second surface, and the second coating component of the two second coating components close to the winding component is used to coat the anti-sticking layer on the second metal layer.

[0009] Furthermore, the first coating assembly and the second coating assembly each include a plurality of first coating assemblies, the plurality of first coating assemblies are sequentially arranged along the conveying direction of the base film layer, and the plurality of second coating assemblies are sequentially arranged along the conveying direction of the base film layer;

[0010] Among them, a part of the first coating components far away from the winding component among the plurality of the first coating components is used to coat the first metal layer on the first surface, and at least one of the first coating components close to the winding component among the plurality of the first coating components is used to coat the anti-sticking layer on the first metal layer;

[0011] A portion of the second coating components among the multiple second coating components that are away from the winding component is used to coat the second metal layer on the second surface, and at least one of the multiple second coating components that is close to the winding component is used to coat the anti-sticking layer on the second metal layer.

[0012] Furthermore, the first coating assembly and the second coating assembly each include a plurality of first coating assemblies, the plurality of first coating assemblies are sequentially arranged along the conveying direction of the base film layer, and the plurality of second coating assemblies are sequentially arranged along the conveying direction of the base film layer; wherein the plurality of first coating assemblies are all used to coat the first metal layer on the first surface;

[0013] A portion of the second coating components among the multiple second coating components that are away from the winding component is used to coat the second metal layer on the second surface, and at least one of the multiple second coating components that is close to the winding component is used to coat the anti-sticking layer on the second metal layer.

[0014] Further, the first coating assembly includes a first cold roller and a first heating component, and along the first direction, the first heating component is located at the bottom of the first cold roller;

[0015] The second coating assembly includes a second cold roller and a second heating component. Along the first direction, the second heating component is located at the bottom of the first cold roller.

[0016] Further, the first heating component includes a first heating body and a first heating container, the first heating body has a plurality of first heating grooves arranged at intervals, each of the first heating grooves is provided with the first heating container, or the first heating body has a third heating groove arranged in a strip shape, and the third heating groove extends along the length direction of the first heating body;

[0017] The second heating component includes a second heating body and a second heating container, the second heating body is provided with a plurality of second heating grooves arranged at intervals, each of the second heating grooves is provided with the second heating container, or the second heating body is provided with fourth heating grooves arranged in strips, and the fourth heating grooves extend along the length direction of the second heating body.

[0018] Further, when the first coating assembly includes at least two, the number D1 of the first heating containers used for coating the first metal layer in at least two of the first coating assemblies corresponds to an evaporation liquid surface area S1 or an evaporation liquid surface area in the third heating tank used for coating the first metal layer is S1, and the number D2 of the first heating containers used for coating the anti-sticking layer in at least two of the first coating assemblies corresponds to an evaporation liquid surface area S2 or an evaporation liquid surface area in the third heating tank used for coating the anti-sticking layer is S2, wherein S1 and S2 satisfy the relationship: S2≤S1 / 15;

[0019] When the second coating component includes at least two, the number D3 of the second heating containers used for coating the second metal layer in at least two of the second coating components corresponds to an evaporation liquid surface area S3 or an evaporation liquid surface area S3 in the fourth heating tank used for coating the second metal layer, and the number D4 of the second heating containers used for coating the anti-sticking layer in at least two of the second coating components corresponds to an evaporation liquid surface area S4 or an evaporation liquid surface area S4 in the fourth heating tank used for coating the second metal layer, wherein S3 and S4 satisfy the relationship: S4≤S3 / 15.

[0020] Further, a first target material is provided in the first heating container for coating the first metal layer and in the second heating container for coating the second metal layer, or in the third heating tank for coating the first metal layer and in the fourth heating tank for coating the second metal layer, and the first target material includes at least one of a copper target material and an aluminum target material; and / or,

[0021] A second target material is arranged in the first heating container for coating the anti-sticking layer and in the second heating container for coating the anti-sticking layer, or in the third heating tank for coating the anti-sticking layer and in the fourth heating tank for coating the anti-sticking layer. The second target material includes at least one of a nickel target material, a cobalt target material, a magnesium target material, a tin target material, a zinc target material, a chromium target material, and a boron trioxide target material.

[0022] On the other hand, the present invention further provides a method for preparing a conductive film, the method for preparing a conductive film is performed using the above-mentioned coating device, and the method for preparing a conductive film comprises:

[0023] Step S1: unwinding the base film layer to the first coating assembly through the unwinding assembly, and controlling the first coating assembly to coat the first metal layer on the first surface of the base film layer at a first temperature;

[0024] Step S2: transporting the base film layer along the conveying path direction to the second coating assembly, wherein the second coating assembly away from the winding assembly is controlled to coat the second metal layer on the second surface of the base film layer at a second temperature, and the second coating assembly close to the winding assembly is controlled to coat the anti-sticking layer on the second metal layer at a third temperature, and then, the base film layer coated with the first metal layer, the second metal layer and the anti-sticking layer is wound up by the winding assembly.

[0025] Furthermore, in the step S1, the first coating component coats the first metal layer on the first surface using a magnetron sputtering process or a thermal evaporation process;

[0026] In step S2, the second coating component uses a magnetron sputtering process or a thermal evaporation process to coat the second metal layer on the second surface, and the second coating component uses a magnetron sputtering process or a thermal evaporation process or an electron beam evaporation process to coat the anti-sticking layer on the second metal layer.

[0027] Further, the third temperature is lower than the first temperature and the second temperature; or,

[0028] The third temperature is greater than the first temperature and the second temperature.

[0029] In a third aspect, the present invention further provides a conductive film, which is prepared by the above-mentioned conductive film preparation method, and the conductive film comprises:

[0030] A base film layer, wherein along a thickness direction of the base film layer, the base film layer comprises a first surface and a second surface opposite to the first surface;

[0031] a first metal layer, the first metal layer being disposed on the first surface;

[0032] a second metal layer, the second metal layer being disposed on the second surface;

[0033] The anti-sticking layer is arranged on a side of the first metal layer away from the base film layer or a side of the second metal layer away from the base film layer.

[0034] Furthermore, along the thickness direction of the base film layer, the thickness of the first metal layer is T1, the thickness of the second metal layer is T2, and the thickness of the anti-sticking layer is T3;

[0035] Wherein, T1 and T2 satisfy the relationship: |T1-T2|<5nm, T3 satisfies the relationship: 0.2nm≤T3≤10nm; and / or,

[0036] The square resistance of the first metal layer is R1, and the square resistance of the second metal layer is R2, wherein R1 and R2 satisfy the relationship: |R1-R2|≤500mΩ.

[0037] In the present invention, after the base film layer is unwound by the unwinding assembly, it is sequentially subjected to double-sided coating by the first coating assembly and the second coating assembly, wherein at least one first coating assembly is at least used to coat the first metal layer on the first surface, and the second coating assembly far from the winding assembly among the at least two second coating assemblies is at least used to coat the second metal layer on the second surface, and the second coating assembly close to the winding assembly among the at least two second coating assemblies is at least used to coat the anti-sticking layer on the second metal layer, and then it is wound through the winding assembly. The entire coating equipment has a simple structure, high production efficiency, and low equipment manufacturing cost. At the same time, since the anti-sticking layer is provided on the surface of the second metal layer away from the base film layer in the present invention, when the conductive film is wound, the first metal layer and the second metal layer can be isolated by the anti-sticking layer, so that the first metal layer and the second metal layer will not stick to each other; when the wound conductive film is unwound, the first metal layer or the second metal layer will not fall off from the base film layer due to mutual adhesion, which can solve the problem of delamination of the metal layer of the conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0039] Figure 1 A schematic structural diagram of a first coating device disclosed in an embodiment of the present invention;

[0040] Figure 2A schematic structural diagram of a second coating device disclosed in an embodiment of the present invention;

[0041] Figure 3 It is a partial structural schematic diagram of the first heating component and the second heating component disclosed in the embodiment of the present invention;

[0042] Figure 4 A schematic diagram of the structure of a first conductive film disclosed in an embodiment of the present invention;

[0043] Figure 5 A schematic diagram of the structure of a second conductive film disclosed in an embodiment of the present invention;

[0044] Figure 6 A schematic structural diagram of a third conductive film disclosed in an embodiment of the present invention;

[0045] Figure 7 A schematic structural diagram of a fourth conductive film disclosed in an embodiment of the present invention;

[0046] Figure 8 The present invention is a flowchart of a method for preparing a conductive film disclosed in an embodiment of the present invention.

[0047] The above drawings include the following reference numerals:

[0048] 10. Unwinding assembly; 20. First coating assembly; 21. First cold roller; 22. First heating component; 221. First heating body; 222. First heating tank; 223. First heating container; 30. Second coating assembly; 31. Second cold roller; 32. Second heating component; 321. Second heating body; 322. Second heating tank; 323. Second heating container; 40. Winding assembly; 50. Conductive film; 501. First surface; 502. Second surface; 51. Base film layer; 52. First metal layer; 53. Second metal layer; 54. Anti-sticking layer; 55. Adhesion enhancing layer; 60. Conveying roller. DETAILED DESCRIPTION

[0049] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0050] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0051] Unless otherwise specifically stated, the relative arrangement of the components and steps, numerical expressions and numerical values ​​described in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but in appropriate cases, the techniques, methods and equipment should be regarded as part of the authorized specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in the subsequent figures. The illustrations of this patent are only the limitations of its main evaporation function module, and do not limit some familiar functional components such as conventional cooling devices and transmission roller systems in the industry.

[0052] As described in the background technology, during the preparation of the conductive film, a metal layer needs to be plated on two opposite sides of the polymer base film to form the conductive film, and then the film is rolled up and unrolled. However, during the process of rolling up and unrolling the conductive film, the metal layers on both sides of the base film layer will stick to each other, which can easily cause the metal layer to fall off the base film layer, seriously affecting the quality of the conductive film. To this end, the inventor of the present invention provides a new type of coating equipment, which can solve the problem in the prior art that the metal layers on the two opposite sides of the conductive film are prone to stick to each other, causing the metal layer to fall off the base film layer. The coating equipment of the present invention will be described in detail in conjunction with the accompanying drawings.

[0053] It should be noted that the "thickness direction of the base film layer 51" in the present invention is the thickness direction of the base film layer 51. Figure 4 The direction indicated by the letter X.

[0054] See also Figures 1 to 3 As shown, according to an embodiment of the present invention, a coating device is provided, which is used at least to coat a base film layer 51. The coating device includes an unwinding component 10, a first coating component 20, a second coating component 30 and a winding component 40 which are sequentially arranged along the conveying path of the base film layer 51.

[0055] Among them, the unwinding component 10 is used to unwind the base film layer 51, the first coating component 20 and the second coating component 30 respectively coat the two opposite surfaces of the base film layer 51, the first coating component 20 includes at least one, at least one first coating component 20 is at least used to coat the first metal layer 52 on the first surface 501 of the base film layer 51, the second coating component 30 includes at least two, at least two second coating components 30 are arranged in sequence along the conveying path direction of the base film layer 51, and the second coating component 30 away from the winding component 40 among the at least two second coating components 30 is at least used to coat the second metal layer 53 on the second surface 502 of the base film layer 51 opposite to the first surface 501, the second coating component 30 close to the winding component 40 among the at least two second coating components 30 is at least used to coat the anti-sticking layer 54 on the second metal layer 53, and the winding component 40 is used to wind up the base film layer 51 coated with the first metal layer 52, the second metal layer 53 and the anti-sticking layer 54. It can be understood that in this embodiment, the base film layer 51 plated with the first metal layer 52 , the second metal layer 53 and the anti-sticking layer 54 constitutes the conductive film 50 structure.

[0056] Specifically, in this embodiment, after the base film layer 51 is unwound by the unwinding component 10, it passes through the first coating component 20 and the second coating component 30 in sequence for double-sided coating, wherein at least one first coating component 20 is at least used to coat the first metal layer 52 on the first surface 501, and the second coating component 30 far away from the winding component 40 among the at least two second coating components 30 is at least used to coat the second metal layer 53 on the second surface 502, and the second coating component 30 close to the winding component 40 among the at least two second coating components 30 is at least used to coat the anti-sticking layer 54 on the second metal layer 53, and then it is wound up through the winding component 40. The entire coating equipment has a simple structure, high production efficiency, and low equipment manufacturing cost. At the same time, since the second metal layer 53 in this embodiment is provided with an anti-sticking layer 54 on the surface facing away from the base film layer 51, when the conductive film 50 is rolled up, the first metal layer 52 and the second metal layer 53 can be isolated by the anti-sticking layer 54, so that the first metal layer 52 and the second metal layer 53 will not stick to each other; when the wound conductive film 50 is unwound, the first metal layer 52 or the second metal layer 53 will not fall off from the base film layer 51 due to mutual adhesion, which can solve the problem of delamination of the metal layer of the conductive film 50.

[0057] That is to say, the coating equipment in this embodiment can achieve double-sided coating within one working cycle, with high production efficiency, and through the setting of the anti-sticking layer 54, the isolation effect between the first metal layer 52 and the second metal layer 53 is improved, thereby reducing the adhesion between the first metal layer 52 and the second metal layer 53, so that the conductive film 50 will not stick when winding or unwinding, thereby improving the yield of the conductive film 50 to a certain extent, and effectively ensuring the performance of the finished conductive film 50.

[0058] Optionally, the "first coating component 20" in this embodiment includes one, two, three, four or more than four, and the "second coating component 30" includes two, three, four or more than four. The present invention does not make any specific limitations here. As long as it is other deformation methods under the conception of the present invention, they are within the protection scope of the present invention.

[0059] Specifically, see Figure 1 As shown, in one embodiment of the present invention, the first coating component 20 includes one, and the second coating component 30 includes two; wherein the first coating component 20 is used to coat the first metal layer 52 on the first surface 501, the second coating component 30 away from the winding component 40 of the two second coating components 30 is used to coat the second metal layer 53 on the second surface 502, and the second coating component 30 close to the winding component 40 of the two second coating components 30 is used to coat the anti-sticking layer 54 on the second metal layer 53.

[0060] Of course, in order to transfer the base film layer 51 from the unwinding assembly 10 to the first coating assembly 20, and then transfer the base film layer 51 from the first coating assembly 20 to the second coating assembly 30, and then transfer the base film layer 51 from the second coating assembly 30 to the winding assembly 40, the coating device provided in this embodiment also includes a transmission assembly. Among them, the transmission assembly includes a plurality of transmission rollers 60. In this embodiment, a plurality of transmission rollers 60 are installed on the transmission path of the base film layer 51, so as to transfer the base film layer 51 from the unwinding assembly 10 to the winding assembly 40 through the plurality of transmission rollers 60.

[0061] Specifically, the first coating component 20 and the second coating component 30 in the present embodiment adopt an asymmetric structure, that is, the number of the first coating components 20 is less than the number of the second coating components 30, so that when the base film layer 51 is unwound to the first coating component 20 via the unwinding component 10, the first coating component 20 can coat the first metal layer 52 on the first surface 501 of the base film layer 51, and when the base film layer 51 is transported from the first coating component 20 to the second coating component 30, the second coating component 30 away from the winding component 40 can coat the second metal layer 53 on the second surface 502 of the base film layer 51, and then, the second coating component 30 close to the winding component 40 can coat the anti-sticking layer 54 on the second metal layer 53 to achieve surface modification of the second metal layer 53. When the prepared conductive film 50 is rolled up or unrolled, the provision of the anti-sticking layer 54 can reduce the adhesion between the first metal layer 52 and the second metal layer 53, so that the conductive film 50 will not stick during slitting and rewinding.

[0062] Further, see Figure 2 As shown, in another embodiment of the present invention, the first coating component 20 and the second coating component 30 each include a plurality of first coating components 20, which are sequentially arranged along the conveying direction of the base film layer 51, and a plurality of second coating components 30 are sequentially arranged along the conveying direction of the base film layer 51; wherein, a portion of the first coating components 20 away from the winding component 40 among the plurality of first coating components 20 is used to coat the first metal layer 52 on the first surface 501, and at least one first coating component 20 close to the winding component 40 among the plurality of first coating components 20 is used to coat the anti-sticking layer 54 on the first metal layer 52; a portion of the second coating components 30 away from the winding component 40 among the plurality of second coating components 30 is used to coat the second metal layer 53 on the second surface 502, and at least one second coating component 30 close to the winding component 40 among the plurality of second coating components 30 is used to coat the anti-sticking layer 54 on the second metal layer 53. It can be understood that the first coating component 20 and the second coating component 30 in this embodiment can adopt a symmetrical structure (that is, the number of first coating components 20 is the same as the number of second coating components 30), or an asymmetrical structure (that is, the number of first coating components 20 is less than the number of second coating components 30 or the number of second coating components 30 is less than the number of first coating components 20).

[0063] Specifically, in this embodiment, the surface of the first metal layer 52 facing away from the base film layer 51 and the surface of the second metal layer 53 facing away from the base film layer 51 are both coated with an anti-sticking layer 54, that is, the conductive film 50 has anti-sticking layers 54 on both sides. In this way, when the conductive film 50 is rolled up, the first metal layer 52 and the second metal layer 53 can be isolated by two layers of anti-sticking layers 54, which further enhances the isolation effect between the first metal layer 52 and the second metal layer 53, making it less likely for the first metal layer 52 and the second metal layer 53 to stick together than when there is only one layer of anti-sticking layer 54; when the wound conductive film 50 is unwound, the first metal layer 52 or the second metal layer 53 will not fall off the base film layer 51 due to mutual adhesion, which can solve the problem of delamination of the metal layer of the conductive film 50 and effectively ensure the performance of the finished conductive film 50. It can be understood that the first coating component 20 for coating the anti-sticking layer 54 in this embodiment is located at the end position of multiple first coating components 20 along the conveying direction of the base film layer 51, and the second coating component 30 for coating the anti-sticking layer 54 is located at the end position of multiple second coating components 30 along the conveying direction of the base film layer 51.

[0064] Further, see Figure 2 As shown, in another embodiment of the present invention, the first coating component 20 and the second coating component 30 each include a plurality of first coating components 20 arranged in sequence along the conveying direction of the base film layer 51, and a plurality of second coating components 30 arranged in sequence along the conveying direction of the base film layer 51; wherein, the plurality of first coating components 20 are all used to coat the first metal layer 52 on the first surface 501; a portion of the second coating components 30 away from the winding component 40 among the plurality of second coating components 30 is used to coat the second metal layer 53 on the second surface 502, and at least one second coating component 30 close to the winding component 40 among the plurality of second coating components 30 is used to coat the anti-sticking layer 54 on the second metal layer 53.

[0065] Specifically, the first coating assembly 20 and the second coating assembly 30 in this embodiment can adopt a symmetrical structure (i.e., the number of the first coating assembly 20 is the same as the number of the second coating assembly 30), or an asymmetrical structure (i.e., the number of the first coating assembly 20 is less than the number of the second coating assembly 30 or the number of the second coating assembly 30 is less than the number of the first coating assembly 20). However, regardless of whether the first coating assembly 20 and the second coating assembly 30 adopt a symmetrical structure or an asymmetrical structure, one of the plurality of second coating assemblies 30 close to the winding assembly 40 is used to coat the anti-sticking layer 54 on the conductive film 50. The provision of the anti-sticking layer 54 in this embodiment can reduce the adhesion between the first metal layer 52 and the second metal layer 53 after winding, so that when the prepared conductive film 50 is wound or the wound conductive film 50 is unwound, the conductive film 50 will not be sticky during slitting and rewinding.

[0066] Further, see Figures 1 to 3 As shown, the first coating assembly 20 in this embodiment includes a first cold roller 21 and a first heating component 22. The first heating component 22 is located at the bottom of the first cold roller 21 along the first direction; the second coating assembly 30 includes a second cold roller 31 and a second heating component 32. The second heating component 32 is located at the bottom of the first cold roller 21 along the first direction. Specifically, when the base film layer 51 is unwound by the unwinding assembly 10 and wound around the first cold roller 21, the first metal layer 52 and the anti-sticking layer 54 are plated on the first surface 501 of the base film layer 51 through the multiple first heating components 22. Subsequently, when the base film layer 51 is wound around the second cold roller 31, the second metal layer 53 and the anti-sticking layer 54 are plated on the second surface 502 of the base film layer 51 through the multiple second heating components 32.

[0067] Further, see Figure 3 As shown, the first heating component 22 in this embodiment includes a first heating body 221 and a first heating container 223, the first heating body 221 has a plurality of first heating grooves 222 arranged at intervals, and each first heating groove 222 is provided with a first heating container 223, or the first heating body 221 has a third heating groove arranged in a strip shape (not shown in the drawings), and the third heating groove extends along the length direction of the first heating body 221; the second heating component 32 includes a second heating body 321 and a second heating container 323, the second heating body 321 has a plurality of second heating grooves 322 arranged at intervals, and each second heating groove 322 is provided with a second heating container 323, or the second heating body 321 has a fourth heating groove arranged in a strip shape (not shown in the drawings), and the fourth heating groove extends along the length direction of the second heating body 321.

[0068] Specifically, in this embodiment, the first heating body 221 and the second heating body 321 are used to heat the first heating container 223 and the second heating container 323, so that the metal target material or other impurity material in the first heating container 223 and the second heating container 323 is thermally evaporated, thereby achieving the plating of the first metal layer 52, the second metal layer 53 and the anti-sticking layer 54. Of course, in other embodiments of the present application, the first heating body 221 and the second heating body 321 are used to heat the third heating tank and the fourth heating tank, so that the metal or other impurity material in the third heating tank and the fourth heating tank can be thermally evaporated, thereby achieving the plating of the first metal layer 52, the second metal layer 53 and the anti-sticking layer 54.

[0069] Specifically, the "first heating body 221" in this embodiment is an electrode, and the "first heating container 223" and the "second heating container 323" include a graphite crucible or a high-temperature resistant metal crucible, wherein the metal crucible may specifically include one of a tungsten crucible, a molybdenum crucible, and the like.

[0070] Furthermore, in this embodiment, when the first coating component 20 includes at least two, the number D1 of the first heating containers 223 for coating the first metal layer 52 in the at least two first coating components 20 corresponds to an evaporation liquid surface area S1 or an evaporation liquid surface area S1 in the third heating tank for coating the first metal layer 52, and the number D2 of the first heating containers 223 for coating the anti-sticking layer 54 in the at least two first coating components 20 corresponds to an evaporation liquid surface area S2 or an evaporation liquid surface area S2 in the third heating tank for coating the anti-sticking layer 54, wherein S1 and S2 satisfy the relationship: S2≤S1 / 15, for example, S1 / 15, S1 / 17, S1 / 19, S1 / 20, S1 / 22, S1 / 24, S1 / 26, S1 / 28, S1 / 30, etc. That is to say, the number of first heating containers 223 used for coating the anti-sticking layer 54 in this embodiment does not exceed the number of first heating containers 223 used for coating the first metal layer 52. In this way, not only can the anti-sticking layer 54 be coated on the first metal layer 52 to reduce the adhesion between the first metal layer 52 and the second metal layer 53 during winding or unwinding, but the thickness of the coating of the anti-sticking layer 54 can also be controlled, so that the anti-sticking layer 54 has a thinner thickness, thereby preventing the anti-sticking layer 54 with too large thickness from having an adverse effect on the performance of the conductive film 50.

[0071] Further, in this embodiment, when the second coating component 30 includes at least two, the number D3 of the second heating containers 323 used for coating the second metal layer 53 in the at least two second coating components 30 corresponds to the evaporation liquid surface area S3 or the evaporation liquid surface area S3 in the fourth heating tank for coating the second metal layer 53, and the number D4 of the second heating containers 323 used for coating the anti-sticking layer 54 in the at least two second coating components 30 corresponds to the evaporation liquid surface area S4 or the evaporation liquid surface area S4 in the fourth heating tank for coating the second metal layer 53, wherein S3 and S4 satisfy the relationship: S4≤S3 / 15, for example, S3 / 15, S3 / 17, S3 / 19, S3 / 20, S3 / 22, S3 / 24, S3 / 26, S3 / 28, S3 / 30, etc. That is to say, the number of second heating containers 323 for coating the anti-sticking layer 54 in this embodiment does not exceed the number of second heating containers 323 for coating the second metal layer 53. In this way, not only can the anti-sticking layer 54 be coated on the second metal layer 53 to reduce the adhesion between the second metal layer 53 and the first metal layer 52 during winding or unwinding, but the thickness of the coating of the anti-sticking layer 54 can also be controlled, so that the anti-sticking layer 54 has a thinner thickness, thereby preventing the anti-sticking layer 54 with too large thickness from having an adverse effect on the performance of the conductive film 50.

[0072] Further, in the present embodiment, the first heating container 223 for plating the first metal layer 52 and the second heating container 323 for plating the second metal layer 53, or the third heating tank for plating the first metal layer 52 and the fourth heating tank for plating the second metal layer 53 are both provided with a first target material, and the first target material includes at least one of a copper (Cu) target material and an aluminum (Al) target material (that is, the first metal layer 52 and the second metal layer 53 in the present embodiment both include at least one of a copper layer and aluminum). In other words, in the present embodiment, different material combinations can be selected as the base material of the first metal layer 52 and the second metal layer 53. Among them, the electrical conductivity of copper is extremely high, second only to silver. In the conductive film 50, copper can effectively transmit and collect the current generated by the electrode material, reduce resistance, and improve the battery charging and discharging efficiency and overall performance. In addition, copper has sufficient ductility and flexibility, and is easy to be processed into a foil-like material, which meets the requirements of different battery manufacturing processes such as winding and lamination, and ensures good contact and firm bonding between the conductive film 50 and the electrode active material. At the same time, since aluminum has good electrical and thermal conductivity, high chemical stability and good corrosion resistance, when aluminum is used as the base material of the first metal layer 52 and the second metal layer 53, the excellent performance of the conductive film 50 can be fully exerted, and the conductivity of the conductive film 50 is enhanced to a certain extent. Of course, in other embodiments of the present invention, the first metal layer 52 and the second metal layer 53 can also be copper alloy, aluminum alloy, etc., as long as other deformation methods under the concept of the present invention are within the protection scope of the present invention.

[0073] Furthermore, in the present embodiment, the first heating container 223 for coating the anti-sticking layer 54 and the second heating container 323 for coating the anti-sticking layer 54, or the third heating tank for coating the anti-sticking layer 54 and the fourth heating tank for coating the anti-sticking layer 54 are both provided with a second target material, and the second target material includes at least one of a nickel (Ni) target material, a cobalt (Co) target material, a magnesium (Mg) target material, a tin (Sn) target material, a zinc (Zn) target material, a chromium (Cr) target material, and a boron trioxide (B2O3) target material. That is to say, the anti-sticking layer 54 in the present embodiment can select different material components as the base material of the anti-sticking layer 54.

[0074] Among them, magnesium (Mg) can show advantages such as high sputtering rate, good substrate compatibility, excellent uniformity over a large area, and strong flexibility in multilayer structure and doping during magnetron sputtering; while in the thermal evaporation process, it shows high purity, good chemical stability, simple process and high cost-effectiveness, as well as easy control of film growth mode. In actual processing, you can choose according to actual needs.

[0075] Aluminum (Al) exhibits advantages such as high-efficiency sputtering, precise control, large-area uniformity, and preparation of multilayer structures and alloy films in the magnetron sputtering process; while in the thermal evaporation process, it exhibits the characteristics of high purity, low cost, low-temperature deposition and substrate compatibility, and easy alloying and multilayer structures. In actual processing, you can choose according to actual needs.

[0076] B2O3 has strong thermal stability, and the vapor pressure of B2O3 can increase significantly with increasing temperature, which is conducive to forming a stable vapor flow during vacuum evaporation or magnetron sputtering. During evaporation or magnetron sputtering, B2O3 can maintain a high purity, and the vacuum environment reduces the chance of B2O3 reacting with impurities in the air, which helps to generate a pure and uniform borate film. In addition, the melting point of B2O3 is relatively low (about 450°C), and it is easy to evaporate under appropriate heating conditions. Its high volatility means that a higher vapor pressure can be obtained at a lower evaporation temperature, which is conducive to reducing the energy consumption of the evaporation process and reducing the thermal stress effect on the substrate and equipment. In the actual preparation process of the anti-sticking layer 54, the thickness and composition distribution of the B2O3 layer can be accurately controlled by controlling the temperature of the evaporation source, the evaporation rate, and the distance between the substrate and the evaporation source, so as to facilitate the isolation of the first metal layer 52 and the second metal layer 53 during the winding process of the conductive film 50 and prevent the conductive film 50 from delaminating.

[0077] Zinc (Zn) can achieve efficient sputtering deposition in magnetron sputtering because it has a good sputtering response to argon ions and a high sputtering rate, so that a thin film can be formed on the first metal layer 52 or the second metal layer 53 more quickly. The zinc film prepared by magnetron sputtering usually has excellent density and purity, and good film uniformity, which is beneficial to improve the conductivity, mechanical properties and chemical stability of the film. Zinc has a relatively low melting point (419.5°C) and has good evaporation properties under suitable evaporation conditions. It can be quickly converted into steam and deposited as a thin film after condensation. It can be seen that whether it is magnetron sputtering or evaporation process, zinc shows good deposition performance and application prospects, especially in new energy batteries, thin film electronic devices, optical coatings and anti-corrosion coatings. It has significant advantages.

[0078] The sputtering rate of tin (Sn) is relatively fast compared to some high melting point metals, and a uniform thin film layer can be formed within a reasonable sputtering time. Due to the low melting point of tin (about 232°C), the heat generated during the magnetron sputtering process will not cause excessive heat load to many sensitive substrates, allowing thin film deposition to be completed at a lower temperature, reducing potential damage to the substrate material. Magnetron sputtering can finely control the chemical composition of the tin film. Tin (Sn) has a strong evaporation performance at an appropriate temperature, and can form a continuous and uniform vapor flow to deposit a continuous and thickness-controlled thin film. In short, whether it is magnetron sputtering or evaporation, tin, as a soft metal, is easy to be plated on the first metal layer 52 and the second metal layer 53 when preparing thin film materials due to its good deposition performance, film quality and process controllability.

[0079] On the other hand, see Figure 8 As shown, the embodiment of the present invention also provides a method for preparing a conductive film, and the method for preparing a conductive film is performed by the above-mentioned coating device, so the method for preparing a conductive film includes all the technical effects of the above-mentioned coating device. Since the technical effects of the coating device have been described in detail above, they will not be repeated here.

[0080] Further, see Figure 8 As shown, the method for preparing the conductive film in this embodiment includes the following steps:

[0081] Step S1: unwinding the base film layer 51 to the first coating assembly 20 through the unwinding assembly 10, and controlling the first coating assembly 20 to coat the first metal layer 52 on the first surface 501 of the base film layer 51 at a first temperature;

[0082] Specifically, in step S1 , the first coating assembly 20 coats the first metal layer 52 on the first surface 501 using a magnetron sputtering process or a thermal evaporation process.

[0083] In the step S1, the equipment for performing the magnetron sputtering process and the equipment for performing the thermal evaporation process are the equipment currently available on the market for performing thermal evaporation coating or vacuum magnetron sputtering coating, which will not be specifically introduced in this embodiment.

[0084] In the actual execution of step S1, the base film layer 51 is first unwound to the first coating assembly 20 via the unwinding assembly 10, and then the first coating assembly 20 is used to plate the first surface 501 of the base film layer 51 at a first temperature to obtain the first metal layer 52, and then step S2 is executed. The first metal layer 52 in this embodiment can be a copper layer or an aluminum layer.

[0085] Step S2: The base film layer 51 is transported to the second coating component 30 along the conveying path, wherein the second coating component 30 away from the winding component 40 is controlled to coat the second metal layer 53 on the second surface 502 of the base film layer 51 at a second temperature, and the second coating component 30 close to the winding component 40 is controlled to coat the anti-sticking layer 54 on the second metal layer 53 at a third temperature. Subsequently, the base film layer 51 coated with the first metal layer 52, the second metal layer 53 and the anti-sticking layer 54 is wound up by the winding component 40.

[0086] Further, in step S2, the second coating component 30 uses a magnetron sputtering process or a thermal evaporation process to coat the second metal layer 53 on the second surface 502, and the second coating component 30 uses a magnetron sputtering process or a thermal evaporation process or an electron beam evaporation process to coat the anti-sticking layer 54 on the second metal layer 53.

[0087] In step S2, the equipment for performing the magnetron sputtering process and the equipment for performing the thermal evaporation process are the equipment currently available on the market for performing thermal evaporation coating or vacuum magnetron sputtering coating, which will not be specifically introduced in this embodiment.

[0088] In the actual implementation of step S2, the base film layer 51 coated with the first metal layer 52 is transported to the second coating component 30, and then the second metal layer 53 is coated on the second surface 502 of the base film layer 51 at a second temperature by the second coating component 30, and then the anti-sticking layer 54 is coated on the second metal layer 53 by the second coating component 30 at a third temperature, and then the base film layer 51 coated with the first metal layer 52, the second metal layer 53 and the anti-sticking layer 54 is rolled up by the winding component 40.

[0089] Furthermore, before executing step S1, an adhesion enhancing layer 55 may be deposited on both the first surface 501 and the second surface 502 of the base film layer 51 by a magnetron sputtering process or a thermal evaporation process, so as to enhance the adhesion between the first metal layer 52 and the base film layer 51, and enhance the adhesion between the second metal layer 53 and the base film layer 51 in the subsequent coating process. Specifically, the provision of the adhesion enhancing layer 55 enhances the adhesion between the first metal layer 52 and the base film layer 51, and between the second metal layer 53 and the base film layer 51, so that the adhesion between the first metal layer 52 and the base film layer 51, and the adhesion between the second metal layer 53 and the base film layer 51 are greater than the adhesion between the first metal layer 52 and the second metal layer 53 during winding or unwinding, effectively preventing the first metal layer 52 or the second metal layer 53 from detaching from the base film layer 51.

[0090] Furthermore, in this embodiment, the third temperature is lower than the first temperature and the second temperature; or, the third temperature is higher than the first temperature and the second temperature. In other words, the melting point of the anti-adhesion layer 54 in this embodiment can be lower than or equal to the melting points of the first metal layer 52 and the second metal layer 53, or can be higher than the melting points of the first metal layer 52 and the second metal layer 53.

[0091] On the other hand, the present invention further provides a conductive film 50, which is prepared by the above-mentioned method for preparing the conductive film. Therefore, the conductive film 50 includes all the technical effects of the above-mentioned method for preparing the conductive film. Since the technical effects of the method for preparing the conductive film have been described in detail above, they will not be repeated here.

[0092] Further, see Figures 4 to 7 As shown, the conductive film 50 in this embodiment includes a base film layer 51 , a first metal layer 52 , a second metal layer 53 and an anti-sticking layer 54 .

[0093] In the thickness direction of the base film layer 51, the base film layer 51 includes a first surface 501 and a second surface 502 opposite to the first surface 501; the first metal layer 52 is arranged on the first surface 501; the second metal layer 53 is arranged on the second surface 502; the anti-sticking layer 54 is arranged on the side of the first metal layer 52 away from the base film layer 51 or the side of the second metal layer 53 away from the base film layer 51. Figure 4 The anti-adhesion layer 54 is shown in FIG. 5 , when it is disposed on the side of the second metal layer 53 away from the base film layer 51; Figure 5 The situation where the anti-sticking layer 54 is arranged on the side of the first metal layer 52 facing away from the base film layer 51 is shown.

[0094] Further, along the thickness direction of the base film layer 51, the thickness of the first metal layer 52 in this embodiment is T1, the thickness of the second metal layer 53 is T2, and the thickness of the anti-sticking layer 54 is T3; wherein, T1 and T2 satisfy the relationship: |T1-T2|<5nm, for example, 4.9nm, 4.8nm, 4.6nm, 4.4nm, 4.2nm, 4nm, 3.8nm, 3.6nm, 3.4nm, 3.2nm, 3nm, etc., and T3 satisfies the relationship: 0.2nm≤T3≤10nm, for example, 0.2nm, 0.4nm, 0.8nm, 1nm, 2nm, 3nm, 4nm, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm, etc. Since the conductive film 50 is usually applied to lithium batteries in this embodiment, when the difference between the thickness T1 of the first metal layer 52 and the thickness T2 of the second metal layer 53 is greater than 5nm, it is easy to cause uneven lithium ion deposition, thereby promoting the formation of lithium dendrites and shortening the service life of the battery. At the same time, the first metal layer 52 and the second metal layer 53 with too large a thickness difference are easy to cause stress concentration during the charging and discharging process of the lithium battery, causing the lithium battery to deform or break, thereby reducing the service life of the lithium battery. It can be understood that no matter how many the first coating assembly 20 and the second coating assembly 30 are in this embodiment, the difference between the thickness of the first metal layer 52 plated by the first coating assembly 20 and the thickness of the second metal layer 53 plated by the second coating assembly 30 must be less than 5nm. That is to say, in this embodiment, by satisfying the relationship between T1 and T2: |T1-T2|<5nm, the performance of the finished product of the conductive film 50 can be guaranteed, and the service life of the conductive film 50 can be extended to a certain extent.

[0095] In addition, when T3 is less than 0.2nm, the thickness of the anti-adhesion layer 54 is too thin, so that the conductive film is easily worn when subjected to external force, reducing the anti-adhesion performance of the anti-adhesion layer 54; when T3 is greater than 10nm, the overall weight of the conductive film is increased, and the manufacturing cost of the conductive film is increased. That is to say, in this embodiment, by making T3 satisfy the relationship: 0.2nm≤T3≤10nm, the performance of the anti-adhesion layer 54 can be effectively guaranteed.

[0096] Furthermore, in this embodiment, the square resistance of the first metal layer 52 is R1, and the square resistance of the second metal layer 53 is R2; wherein, R1 and R2 satisfy the relationship: |R1-R2|≤500mΩ, for example, 500mΩ, 450mΩ, 400mΩ, 350mΩ, 300mΩ, 250mΩ, 200mΩ, 180mΩ, 160mΩ, 140mΩ, 120mΩ, 100mΩ, 80mΩ, 60mΩ, 40mΩ, 20mΩ, etc. When the difference between the square resistance R1 of the first metal layer 52 and the square resistance R2 of the second metal layer 53 is greater than 500mΩ, the conductivity of the first metal layer 52 and the second metal layer 53 is easily reduced, thereby reducing the overall conductivity of the conductive film 50. At the same time, when the conductive film 50 is applied to a battery, the difference between the square resistance of the first metal layer 52 and the square resistance of the second metal layer 53 is too large, which will cause uneven lithium ion deposition, thereby reducing the service life of the lithium battery. That is to say, in this embodiment, by satisfying the relationship between R1 and R2: |R1-R2|≤500mΩ, the performance of the finished product of the conductive film 50 can be guaranteed, and the service life of the conductive film 50 can be extended to a certain extent.

[0097] Further, see Figures 4 to 5 As shown, in this embodiment, an adhesion enhancing layer 55 is provided between the first metal layer 52 and the base film layer 51 , and between the second metal layer 53 and the base film layer 51 .

[0098] Optionally, the adhesion improving layer in this embodiment includes any one of a copper alloy layer, a nickel alloy layer, a titanium alloy layer, an aluminum alloy layer, an aluminum oxide layer, a silicon nitride layer, a silicon carbide layer, a polyethylene glycol layer, etc. That is, this embodiment can select different material combinations as the base material of the adhesion improving layer.

[0099] Specifically, in the actual process of preparing the conductive film 50, the first metal layer 52 and the second metal layer 53 can be plated on the first surface 501 and the second surface 502 of the base film layer 51 by means of a magnetron sputtering process or a thermal evaporation process, and then the anti-sticking layer 54 is plated on the surface of the first metal layer 52 away from the base film layer 51 and / or the surface of the second metal layer 53 away from the base film layer 51 by means of a magnetron sputtering process, a thermal evaporation process or an electron beam evaporation process. In addition, before depositing the first metal layer 52 and the second metal layer 53, a magnetron sputtering process or a thermal evaporation process can be used to deposit an adhesion enhancing layer 55 between the base film layer 51 and the first metal layer 52, and between the base film layer 51 and the second metal layer 53, so as to enhance the adhesion between the first metal layer 52 and the base film layer 51, and between the second metal layer 53 and the base film layer 51.

[0100] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0101] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0102] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A coating device, the coating device is used at least to coat a base film layer (51), characterized in that: The coating equipment comprises: An unwinding assembly (10), a first coating assembly (20), a second coating assembly (30) and a winding assembly (40) are sequentially arranged along a conveying path of the base film layer (51); The unwinding assembly (10) is used to unwind the base film layer (51); the first coating assembly (20) and the second coating assembly (30) respectively coat the two opposite surfaces of the base film layer (51); the first coating assembly (20) includes at least one, at least one of the first coating assemblies (20) is at least used to coat the first metal layer (52) on the first surface (501) of the base film layer (51); the second coating assembly (30) includes at least two, at least two of the second coating assemblies (30) are arranged in sequence along the conveying path direction of the base film layer (51), and at least two of the second coating assemblies (30) are arranged in sequence along the conveying path direction of the base film layer (51); The second coating component (30) in the film component (30) far away from the winding component (40) is at least used to coat a second metal layer (53) on a second surface (502) of the base film layer (51) opposite to the first surface (501), and the second coating component (30) close to the winding component (40) among at least two of the second coating components (30) is at least used to coat an anti-sticking layer (54) on the second metal layer (53), and the winding component (40) is used to wind up the base film layer (51) coated with the first metal layer (52), the second metal layer (53) and the anti-sticking layer (54).

2. The coating device according to claim 1, characterized in that: The first coating component (20) includes one, and the second coating component (30) includes two; Wherein, the first coating component (20) is used to coat the first metal layer (52) on the first surface (501), the second coating component (30) far away from the winding component (40) among the two second coating components (30) is used to coat the second metal layer (53) on the second surface (502), and the second coating component (30) close to the winding component (40) among the two second coating components (30) is used to coat the anti-sticking layer (54) on the second metal layer (53).

3. The coating device according to claim 1, characterized in that: The first coating assembly (20) and the second coating assembly (30) each comprise a plurality of them, wherein the plurality of the first coating assemblies (20) are sequentially arranged along the conveying direction of the base film layer (51), and the plurality of the second coating assemblies (30) are sequentially arranged along the conveying direction of the base film layer (51); Wherein, a portion of the first coating components (20) far from the winding component (40) among the plurality of the first coating components (20) is used to coat the first metal layer (52) on the first surface (501), and at least one of the first coating components (20) close to the winding component (40) among the plurality of the first coating components (20) is used to coat the anti-sticking layer (54) on the first metal layer (52); A portion of the second coating components (30) away from the winding component (40) among the plurality of second coating components (30) is used to coat the second metal layer (53) on the second surface (502), and at least one of the second coating components (30) close to the winding component (40) among the plurality of second coating components (30) is used to coat the anti-sticking layer (54) on the second metal layer (53).

4. The coating device according to claim 1, characterized in that: The first coating assembly (20) and the second coating assembly (30) each comprise a plurality of first coating assemblies (20) arranged in sequence along the conveying direction of the base film layer (51), and the second coating assemblies (30) are arranged in sequence along the conveying direction of the base film layer (51); wherein the plurality of first coating assemblies (20) are all used to coat the first metal layer (52) on the first surface (501); A portion of the second coating components (30) away from the winding component (40) among the plurality of second coating components (30) is used to coat the second metal layer (53) on the second surface (502), and at least one of the second coating components (30) close to the winding component (40) among the plurality of second coating components (30) is used to coat the anti-sticking layer (54) on the second metal layer (53).

5. The coating device according to any one of claims 1 to 4, characterized in that: The first coating assembly (20) comprises a first cold roller (21) and a first heating component (22), and along a first direction, the first heating component (22) is located at the bottom of the first cold roller (21); The second coating assembly (30) comprises a second cold roller (31) and a second heating component (32); along the first direction, the second heating component (32) is located at the bottom of the first cold roller (21).

6. The coating device according to claim 5, characterized in that: The first heating component (22) comprises a first heating body (221) and a first heating container (223); the first heating body (221) is provided with a plurality of first heating grooves (222) arranged at intervals, each of the first heating grooves (222) is provided with the first heating container (223); or the first heating body (221) is provided with a third heating groove arranged in a strip shape, and the third heating groove extends along the length direction of the first heating body (221); The second heating component (32) comprises a second heating body (321) and a second heating container (323), the second heating body (321) having a plurality of second heating grooves (322) arranged at intervals, each of the second heating grooves (322) being provided with a second heating container (323), or the second heating body (321) having a fourth heating groove arranged in a strip shape, and the fourth heating groove extending along the length direction of the second heating body (321).

7. The coating device according to claim 6, characterized in that: When the first coating assembly (20) includes at least two, the number D1 of the first heating containers (223) used for coating the first metal layer (52) in at least two of the first coating assemblies (20) corresponds to an evaporation liquid surface area S1 or an evaporation liquid surface area in the third heating tank used for coating the first metal layer (52) is S1, and the number D2 of the first heating containers (223) used for coating the anti-sticking layer (54) in at least two of the first coating assemblies (20) corresponds to an evaporation liquid surface area S2 or an evaporation liquid surface area in the third heating tank used for coating the anti-sticking layer (54) is S2, wherein S1 and S2 satisfy the relationship: S2≤S1 / 15; When the second coating assembly (30) includes at least two, the number D3 of the second heating containers (323) used for coating the second metal layer (53) in at least two of the second coating assemblies (30) corresponds to an evaporation liquid surface area S3 or an evaporation liquid surface area S3 in the fourth heating tank used for coating the second metal layer (53), and the number D4 of the second heating containers (323) used for coating the anti-sticking layer (54) in at least two of the second coating assemblies (30) corresponds to an evaporation liquid surface area S4 or an evaporation liquid surface area S4 in the fourth heating tank used for coating the second metal layer (53), wherein S3 and S4 satisfy the relationship: S4≤S3 / 15.

8. The coating device according to claim 6 or 7, characterized in that: A first target material is disposed in the first heating container (223) for coating the first metal layer (52) and in the second heating container (323) for coating the second metal layer (53), or in the third heating tank for coating the first metal layer (52) and in the fourth heating tank for coating the second metal layer (53), wherein the first target material comprises at least one of a copper target material and an aluminum target material; and / or, A second target material is arranged in the first heating container (223) for coating the anti-sticking layer (54) and in the second heating container (323) for coating the anti-sticking layer (54), or in the third heating tank for coating the anti-sticking layer (54) and in the fourth heating tank for coating the anti-sticking layer (54), and the second target material includes at least one of a nickel target material, a cobalt target material, a magnesium target material, a tin target material, a zinc target material, a chromium target material, and a boron trioxide target material.

9. A method for preparing a conductive film, characterized in that: The method for preparing the conductive film is performed using the coating equipment described in any one of claims 1 to 8, and the method for preparing the conductive film comprises: Step S1: unwinding the base film layer (51) to the first coating component (20) through the unwinding component (10), and controlling the first coating component (20) to coat the first metal layer (52) on the first surface (501) of the base film layer (51) at a first temperature; Step S2: The base film layer (51) is transported along the conveying path to the second coating component (30), wherein the second coating component (30) away from the winding component (40) is controlled to coat the second metal layer (53) on the second surface (502) of the base film layer (51) at a second temperature, and the second coating component (30) close to the winding component (40) is controlled to coat the anti-sticking layer (54) on the second metal layer (53) at a third temperature, and then the base film layer (51) coated with the first metal layer (52), the second metal layer (53) and the anti-sticking layer (54) is wound up by the winding component (40).

10. The method for preparing a conductive film according to claim 9, characterized in that: In the step S1, the first coating component (20) coats the first metal layer (52) on the first surface (501) using a magnetron sputtering process or a thermal evaporation process; In the step S2, the second coating component (30) uses a magnetron sputtering process or a thermal evaporation process to coat the second metal layer (53) on the second surface (502), and the second coating component (30) uses a magnetron sputtering process or a thermal evaporation process or an electron beam evaporation process to coat the anti-sticking layer (54) on the second metal layer (53).

11. The method for preparing a conductive film according to claim 9 or 10, characterized in that: The third temperature is lower than the first temperature and the second temperature; or, The third temperature is greater than the first temperature and the second temperature.

12. A conductive film, characterized in that: The conductive film is prepared by the method for preparing a conductive film according to any one of claims 9 to 11, and the conductive film comprises: A base film layer (51), wherein along a thickness direction of the base film layer (51), the base film layer (51) comprises a first surface (501) and a second surface (502) opposite to the first surface (501); A first metal layer (52), the first metal layer (52) being disposed on the first surface (501); A second metal layer (53), the second metal layer (53) being disposed on the second surface (502); An anti-sticking layer (54), wherein the anti-sticking layer (54) is arranged on a side of the first metal layer (52) facing away from the base film layer (51) or a side of the second metal layer (53) facing away from the base film layer (51).

13. The conductive film according to claim 12, characterized in that: Along the thickness direction of the base film layer (51), the thickness of the first metal layer (52) is T1, the thickness of the second metal layer (53) is T2, and the thickness of the anti-sticking layer (54) is T3; Wherein, T1 and T2 satisfy the relationship: |T1-T2|<5nm, T3 satisfies the relationship: 0.2nm≤T3≤10nm; and / or, The square resistance of the first metal layer (52) is R1, and the square resistance of the second metal layer (53) is R2, wherein R1 and R2 satisfy the relationship: |R1-R2|≤500mΩ.

Images