Test equipment and control method thereof
By employing a graded heating technology for the temperature chamber and testing equipment, the problem of high cost of testing fixtures in high-temperature environments has been solved, enabling efficient testing of infrared focal plane array detectors under different temperature conditions and reducing fixture costs.
Patent Information
- Application Number
- CN202411308382.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2025-01-07
AI Technical Summary
In existing infrared focal plane array detector testing equipment, the testing fixtures need to meet high quality requirements in high-temperature environments, resulting in high costs.
A temperature chamber and testing device are used. The first heater is used to preheat the accommodating cavity, and the second heater is used to reheat the infrared focal plane array detector. This avoids the test fixture and detector being heated to high temperatures simultaneously, thus reducing the heat resistance parameters of the fixture.
By using a graded heating method, the cost of testing fixtures is reduced, while still meeting the testing requirements of infrared focal plane array detectors under different temperature environments.
Smart Images
Figure CN119268849A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of infrared focal plane array detector testing, and in particular to a testing device and a control method thereof. Background Art
[0002] Infrared Focal Plane Array (IRFPA) detector is one of the most widely used infrared detectors. It is a planar array composed of a series of tiny detectors that can simultaneously detect the temperature of each pixel in the infrared image. Infrared focal plane array detectors have important applications in many fields. For example, infrared focal plane array detectors can be used in security, medical, vehicles and other fields.
[0003] When using an infrared focal plane array detector, it is necessary to accurately understand the infrared focal plane array detector parameter information in order to maximize the performance of the infrared focal plane array detector. Since the infrared focal plane array detector will be used in different environments, the test system needs to be able to meet different test environments.
[0004] For example, when testing whether an infrared focal plane array detector can work normally under an ambient temperature of 105 degrees Celsius, it is generally necessary to place both the test fixture and the detector under test in a test device that can reach 105 degrees Celsius, so as to raise the temperature of the test device to 105 degrees Celsius to test the detector under test. During the test, the test fixture will also be raised to 105 degrees Celsius, so it is necessary to ensure that the test fixture can work normally under higher temperatures; this will increase the quality grade requirements of the test fixture, thereby making the cost of the test fixture higher. Summary of the invention
[0005] The embodiments of the present application provide a testing device and a control method thereof to solve the problem of how to reduce the cost of testing tooling.
[0006] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application provides a testing device.
[0007] The test equipment provided in the embodiment of the present application is used to test an infrared focal plane array detector, and the test equipment includes: an incubator and a test device; the incubator is provided with a containing cavity, and the incubator includes a first heater, and the first heater is used to heat the containing cavity; the test device is arranged in the containing cavity, and the test device includes a test fixture, and the test fixture includes a second heater, and the heating part of the second heater is used to be thermally connected to the infrared focal plane array detector; when the required test temperature is the second temperature, the first heater is used to increase the temperature in the containing cavity to the first temperature, and the second heater is used to increase the temperature of the infrared focal plane array detector from the first temperature to the second temperature.
[0008] Optionally, the second heater is a thermoelectric cooler, and the hot end of the thermoelectric cooler forms the heating part; the heating part is provided with a thermally conductive silicone sheet, and the heating part is thermally connected to the infrared focal plane array detector via the thermally conductive silicone sheet.
[0009] Optionally, the testing device further includes a light-shielding baffle and a driver; the light-shielding baffle is provided with a testing auxiliary area, the testing auxiliary area includes a light-shielding area and a light-transmitting area, the driver is drivingly connected to the light-shielding baffle to drive the light-shielding baffle to switch between a light-transmitting position and a blocking position; when the light-shielding baffle is located in the blocking position, the heating part is opposite to the light-shielding area; when the light-shielding baffle is located in the light-transmitting position, the heating part is opposite to the light-transmitting area.
[0010] Optionally, there are multiple test fixtures, and the multiple test fixtures are arranged at intervals; the number of the test auxiliary areas is equal to the number of the test fixtures, and the test auxiliary areas and the heating parts are arranged relatively in a one-to-one correspondence.
[0011] Optionally, the testing device further includes a trigger, a first position sensor and a second position sensor; the trigger is connected to the light-shielding baffle; when the light-shielding baffle is in the blocking position, the trigger triggers the first position sensor; when the light-shielding baffle is in the light-transmitting position, the trigger triggers the second position sensor.
[0012] Optionally, the first position sensor is a first position switch, and the second position sensor is a second position switch.
[0013] Optionally, the test fixture includes an optical lens, and the light-shielding baffle is located on a side of the optical lens away from the heating portion, and when the light-shielding baffle is located at the light-transmitting position, the optical lens is opposite to the light-transmitting area.
[0014] Optionally, the test fixture further includes an optical lens mount, which is disposed around the outside of the heating portion, one end of the optical lens mount is detachably connected to the second heater, and the other end of the optical lens mount is connected to the optical lens.
[0015] Optionally, the test fixture further comprises a lock, wherein the lock is movably connected to the optical lens holder, and the lock is used to connect to the peripheral portion of the second heater.
[0016] Optionally, the test fixture further comprises a holding member, and the holding member is used to be connected to the second heater to limit the infrared focal plane array detector to the heating portion.
[0017] Optionally, the first temperature is greater than or equal to 70 degrees Celsius and less than or equal to 85 degrees Celsius, and the second temperature is greater than or equal to 105 degrees Celsius and less than or equal to 150 degrees Celsius.
[0018] In a second aspect, an embodiment of the present application provides a control method for a testing device.
[0019] An embodiment of the present application provides a control method for a testing device, comprising: determining whether it is necessary to perform a high temperature test on the infrared focal plane array detector thermally connected to the heating part, wherein the highest test temperature corresponding to the high temperature test is greater than the first temperature; when a high temperature test is required, controlling the first heater to operate so that the temperature in the accommodating cavity is increased to the first temperature, and the infrared focal plane array detector is increased to the first temperature; when the temperature in the accommodating cavity is the first temperature, controlling the second heater to operate so that the temperature of the infrared focal plane array detector is increased from the first temperature to the second temperature.
[0020] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: In an embodiment of the present application, the first heater can be used to perform the first stage heating on the accommodating cavity. When the test fixture and the infrared focal plane array detector are heated to the first temperature, the second heater is used to perform the second stage heating on the infrared focal plane array detector, so that the temperature of the infrared focal plane array detector is increased from the first temperature to the second temperature. In this way, when the infrared focal plane array detector is temperature tested, it is not necessary to heat the test fixture and the infrared focal plane array detector synchronously to the test temperature required for testing the infrared focal plane array detector. Therefore, the cost of the test fixture can be reduced by reducing the heat resistance parameters of the test fixture.
[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0023] Figure 1 A schematic diagram of a test device provided in an embodiment of the present application; Figure 2 A schematic diagram of a testing device provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of a testing device provided in an embodiment of the present application; Figure 4 A cross-sectional view of a test device provided in an embodiment of the present application, showing a situation where the light shielding baffle is located in a light-transmitting position; Figure 5 for Figure 4 A partial schematic diagram of the test device shown in FIG. Figure 6 A top view of a testing device provided in an embodiment of the present application, showing a situation where the light shielding baffle is located in a light-transmitting position; Figure 7 A cross-sectional view of a test device provided in an embodiment of the present application, showing a situation where the light shielding baffle is located in a light-transmitting position; Figure 8 A top view of a testing device provided in an embodiment of the present application, showing a situation where the light shielding baffle is located in a shielding position; Fig. 9 A flowchart of a control method for a test device provided in an embodiment of the present application.
[0024] Description of reference numerals: 1- Test equipment; 10- Thermostat; 20-test device; 21-test tool; 211-second heater; 212-optical lens; 213-optical lens holder; 214-lock; 215-pressing member; 22-light shielding baffle; 221-light shielding area; 222-light transmission area; 23-driver; 241-trigger; 242-first position sensor; 243-second position sensor; 251-base; 252-pillar; 30-host computer; 2-Infrared focal plane array detector. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.
[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0027] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.
[0028] Furthermore, it is required that the present application be understood not only by the actual terms used but also by the meanings connoted by each term.
[0029] Taking this as an example so that those skilled in the art can better understand the technical problems that can be solved by the solution provided by the implementation of this application, the following briefly introduces the infrared focal plane array detector detection solution in the related art in combination with specific examples.
[0030] When the infrared focal plane array detector is applied to the vehicle field, the automotive-grade test environment requirement corresponding to the infrared focal plane array detector is -40 degrees Celsius to 105 degrees Celsius. In order to achieve the test under this condition, the test tooling and the tested detector are generally placed in an environment of -40 degrees Celsius to 105 degrees Celsius to complete the test. If the test tooling and the tested detector are both placed in an environment of -40 degrees Celsius to 105 degrees Celsius to complete the test, the test tooling needs to meet the requirements of normal use under the test conditions of -40 degrees Celsius to 105 degrees Celsius. Since the test tooling needs to meet the requirements of normal use under the test conditions of -40 degrees Celsius to 105 degrees Celsius, this will make the cost of the test tooling higher. An embodiment of the present application provides a test device to solve the problem that the test tooling needs to be consistent with the quality grade of the infrared focal plane array detector, which makes the cost of the test tooling higher.
[0031] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.
[0032] The present application embodiment provides a testing device, which is used to test an infrared focal plane array detector. Figures 1 to 8 The test equipment 1 provided in the embodiment of the present application includes: an incubator 10 and a test device 20 .
[0033] The temperature box 10 is provided with a containing cavity, and the temperature box 10 includes a first heater, and the first heater is used to heat the containing cavity. The test device 20 is arranged in the containing cavity, and the test device 20 includes a test fixture 21, and the test fixture 21 includes a second heater 211, and the heating part of the second heater 211 is used to be thermally connected with the infrared focal plane array detector 2. When the required test temperature is the second temperature, the first heater is used to increase the temperature in the containing cavity to the first temperature, and the second heater 211 is used to increase the temperature of the infrared focal plane array detector 2 from the first temperature to the second temperature.
[0034] In this way, in the embodiment of the present application, the first heater can be used to perform the first stage heating on the accommodating cavity. When the test fixture 21 and the infrared focal plane array detector 2 are heated to the first temperature, the second heater 211 is used to perform the second stage heating on the infrared focal plane array detector 2, so that the temperature of the infrared focal plane array detector 2 is increased from the first temperature to the second temperature. In this way, when the infrared focal plane array detector 2 is subjected to a temperature test, it is not necessary to heat the test fixture 21 and the infrared focal plane array detector 2 synchronously to the test temperature required for testing the infrared focal plane array detector 2. Therefore, the cost of the test fixture 21 can be reduced by reducing the heat resistance parameters of the test fixture 21.
[0035] In some embodiments, the first temperature is greater than or equal to 70 degrees Celsius and less than or equal to 85 degrees Celsius, and the second temperature is greater than or equal to 105 degrees Celsius and less than or equal to 150 degrees Celsius. Exemplarily, the first temperature is 70 degrees Celsius or 85 degrees Celsius; the second temperature is 105 degrees Celsius, 125 degrees Celsius, or 150 degrees Celsius.
[0036] Taking the operating temperature range of industrial-grade devices as -40 degrees Celsius to 70 degrees Celsius and the operating temperature range of automotive-grade devices as -40 degrees Celsius to 105 degrees Celsius as an example, when the infrared focal plane array detector 2 needs to be tested at automotive-grade temperature, the temperature of the infrared focal plane array detector 2 needs to be adjusted within the temperature range of -40 degrees Celsius to 105 degrees Celsius. The temperature box 10 can be a temperature box that meets the requirements of industrial-grade testing. That is, the temperature box 10 can be adjusted within the temperature range of -40 degrees Celsius to 70 degrees Celsius.
[0037] Furthermore, when the test temperature required by the infrared focal plane array detector 2 is less than or equal to 70 degrees Celsius, the infrared focal plane array detector 2 can be heated to the required temperature by the temperature box 10. When the test temperature required by the infrared focal plane array detector 2 is greater than 70 degrees Celsius, for example, when the test temperature required by the infrared focal plane array detector 2 is 105 degrees Celsius, the temperature box 10 can first perform the first stage heating to heat the accommodating cavity to 70 degrees Celsius. As a result, the test fixture 21 and the second heater 211 located in the accommodating cavity are raised to 70 degrees Celsius.
[0038] Furthermore, the infrared focal plane array detector 2 can be further heated from 70 degrees Celsius to 105 degrees Celsius by the second heater 211 of the test fixture 21. In this way, the test fixture 21 can work normally only within the temperature range of -40 degrees Celsius to 70 degrees Celsius. Compared with the solution in which the test fixture and the infrared focal plane array detector are synchronously heated by the incubator to the test temperature required for testing the infrared focal plane array detector, the heat resistance parameters of the test fixture can be reduced, thereby reducing the cost of the test fixture.
[0039] It should be noted that the first temperature and the second temperature listed above are only examples. In the process of applying the solution provided in the embodiment of the present application, those skilled in the art can also flexibly adjust the first temperature and the second temperature according to actual conditions, which will not be listed here one by one.
[0040] In some embodiments, the second heater 211 is a thermoelectric cooler (TEC), the hot end of which forms a heating part, which is provided with a thermally conductive silicone sheet, and the heating part is thermally connected to the infrared focal plane array detector 2 via the thermally conductive silicone sheet.
[0041] It should be noted that the thermoelectric cooler is based on the thermoelectric effect for cooling. During the operation of the thermoelectric cooler, the temperature of one side decreases and the temperature of the other side increases. The end of the thermoelectric cooler where the temperature decreases can be called the cold end, and the end where the temperature increases can be called the hot end. In some embodiments, the infrared focal plane array detector 2 can be thermally connected to the hot end of the thermoelectric cooler by the thermoelectric cooler to perform second-stage heating of the infrared focal plane array detector 2. It should also be noted that although the cold end of the thermoelectric cooler needs to absorb heat during the second-stage heating of the infrared focal plane array detector 2 using the thermoelectric cooler, due to the large space of the accommodating cavity, the heat absorbed by the cold end of the thermoelectric cooler has little effect on the temperature in the accommodating cavity and can be ignored.
[0042] refer to Figure 1In some embodiments, the test device 20 further includes a detector interface board. The detector interface board is used to be electrically connected to the infrared focal plane array detector 2, so that the infrared focal plane array detector 2 is powered by the detector interface board. The test device 20 further includes a heater drive board. The heater drive board is used to be electrically connected to the second heater 211. The test device 20 further includes a controller. The controller is connected to the detector interface board and the heater drive board respectively. The test device 1 further includes a host computer 30. The host computer refers to a computer that can directly issue control commands. For example, the host computer 30 can be a computer. The host computer 30 can be connected to the detector interface board and the heater drive board respectively through the controller. The host computer 30 can control the temperature of the first heater and the second heater of the incubator 10, and can process the test data sent from the infrared focal plane array detector 2 through the detector interface board, so as to display the relevant test data on the display device of the host computer 30 after processing.
[0043] refer to Figures 2 to 8 In some embodiments, the test device 20 further includes a light-shielding baffle 22 and a driver 23. The light-shielding baffle 22 is provided with a test auxiliary area, and the test auxiliary area includes a light-shielding area 221 and a light-transmitting area 222. The driver 23 is drivingly connected to the light-shielding baffle 22 to drive the light-shielding baffle 22 to switch between the light-transmitting position and the blocking position. Exemplarily, the driver 23 is a linear motor. For example, the driver 23 is a stepping linear motor. Exemplarily, the driver 23 may also include: a device capable of outputting a rotational driving force, such as a rotary motor, an air motor or a hydraulic motor, and a transmission mechanism capable of converting a rotational motion into a linear motion, such as a lead screw thread transmission mechanism or a gear rack mechanism.
[0044] Specific reference Figure 7 and Figure 8 , when the light shielding baffle 22 is in the shielding position, the heating part is opposite to the light shielding area 221. In this way, when the heating part is provided with the infrared focal plane array detector 2, the infrared focal plane array detector 2 is opposite to the light shielding area 221, so that the temperature of each pixel of the infrared focal plane array detector 2 is the same. It should be noted that the scene of testing the infrared focal plane array detector 2 with the light shielding baffle 22 in the shielding position can be called a blocking test.
[0045] Specific reference Figures 3 to 6, when the light shielding baffle 22 is in the light-transmitting position, the heating part is opposite to the light-transmitting area 222. When the heating part is provided with an infrared focal plane array detector 2, the infrared focal plane array detector 2 is opposite to the light-transmitting area 222. A target object can be set on the side of the light-transmitting area 222 away from the infrared focal plane array detector 2, so that the infrared focal plane array detector 2 can obtain an infrared image of the target object, and then the infrared focal plane array detector 2 is tested in this way. It should be noted that the scene in which the infrared focal plane array detector 2 is tested when the light shielding baffle 22 is in the light-transmitting position is called an imaging test.
[0046] refer to Figure 4 In some embodiments, the number of the test fixtures 21 is multiple, and the multiple test fixtures 21 are arranged at intervals. The number of the test auxiliary areas is equal to the number of the test fixtures 21, and the test auxiliary areas are arranged in a one-to-one correspondence with the heating parts. In this way, each test fixture 21 can be provided with an infrared focal plane array detector 2, and then, the infrared focal plane array detector 2 provided on each test fixture 21 can be tested synchronously by driving the light shielding baffle 22 to move.
[0047] refer to Figure 2 In some embodiments, the testing device 20 further includes a trigger 241, a first position sensor 242, and a second position sensor 243. The trigger 241 is connected to the light shielding baffle 22. When the light shielding baffle 22 is located at the blocking position, the trigger 241 triggers the first position sensor 242. When the light shielding baffle 22 is located at the light transmitting position, the trigger 241 triggers the second position sensor 243. In this way, the first position sensor 242 can be used to accurately stop the light shielding baffle 22 at the blocking position, and the second position sensor 243 can be used to accurately stop the light shielding baffle 22 at the light transmitting position.
[0048] In some embodiments, the first position sensor 242 is a first position switch, and the second position sensor 243 is a second position switch. It should be noted that the position switch is also called a travel switch or a limit switch. When the position switch is triggered, its contacts act to connect or disconnect the control circuit to achieve the control purpose.
[0049] refer to Figure 3 In some embodiments, the test fixture 21 includes an optical lens 212. The light shielding baffle 22 is located on a side of the optical lens 212 away from the heating portion. When the light shielding baffle 22 is located at the light-transmitting position, the optical lens 212 is opposite to the light-transmitting area 222.
[0050] refer to Figure 5In some embodiments, the test fixture 21 further includes an optical lens holder 213 , which is disposed outside the heating portion, one end of the optical lens holder 213 is detachably connected to the second heater 211 , and the other end of the optical lens holder 213 is connected to the optical lens 212 .
[0051] Exemplarily, the test fixture 21 further includes a lock 214 and a structural fixing frame, the lock 214 is movably connected to the optical lens holder 213, and the second heater 211 is arranged on the structural fixing frame. The lock 214 is used to connect with the peripheral part of the structural fixing frame. In this way, during the test process, before disassembling the infrared focal plane array detector 2, the optical lens 212 can be removed more conveniently to avoid the optical lens 212 interfering with the disassembly of the infrared focal plane array detector 2.
[0052] In some embodiments, the test fixture 21 further includes a holding member 215, which is used to connect with the second heater 211 to limit the infrared focal plane array detector 2 to the heating portion. It should be noted that a light-transmitting hole is provided at a portion of the holding member 215 that is opposite to the infrared focal plane array detector 2 to prevent the holding member 215 from blocking the infrared focal plane array detector 2.
[0053] refer to Figure 3 and Figure 4 In some embodiments, the test device 20 further includes a base 251 and a plurality of pillars 252. The test fixture 21 is disposed on the base 251, each pillar 252 is disposed on the base 251, and the light shielding baffle 22 is supported on the pillars 252. Exemplarily, a ball bearing is disposed on one side of the pillar 252 facing the light shielding baffle 22. In this way, when the light shielding baffle 22 is driven, the ball bearing rolls in contact with the light shielding baffle 22 to reduce the friction resistance between the pillar 252 and the light shielding baffle 22.
[0054] It should be noted that in the related art, a light shielding baffle is arranged on the side of the optical lens facing the infrared focal plane array detector. In this way, each infrared focal plane array detector needs to be configured with a corresponding light shielding baffle. Therefore, it is not convenient to use a single driver to drive the synchronous movement of each light shielding baffle. Therefore, the related art is not convenient for testing multiple infrared focal plane array detectors at the same time. However, the solution provided in the embodiment of the present application is adopted, and the light shielding baffle 22 is located on the side of the optical lens 212 away from the infrared focal plane array detector 2. In this way, an integrated light shielding baffle 22 can be provided, so that a single driver 23 can be used to drive the synchronous movement of each test auxiliary area including the light shielding area 221 and the light transmitting area 222, so as to test each infrared focal plane array detector 2 at the same time, thereby improving the test efficiency.
[0055] The embodiment of the present application also provides a control method for a test device, and the control method for a test device is applied to any test device 1 provided in the embodiment of the present application.
[0056] refer to Fig. 9 , the control method of the test equipment also provided in the embodiment of the present application includes: Step 410, determining whether a high temperature test is required for the infrared focal plane array detector thermally connected to the heating unit, wherein the highest test temperature corresponding to the high temperature test is greater than the first temperature.
[0057] Step 420 , when a high temperature test is required, control the first heater to operate so that the temperature in the accommodating cavity is raised to a first temperature, and the infrared focal plane array detector is raised to the first temperature.
[0058] Step 430 , when the temperature in the accommodating cavity is the first temperature, control the second heater to operate, so as to increase the temperature of the infrared focal plane array detector from the first temperature to the second temperature.
[0059] It should be noted that "high temperature test" refers to a test temperature that is higher than the temperature that can be heated by the first heater of the incubator 10. Exemplarily, the first heater of the incubator 10 can increase the temperature in the accommodating chamber to 70 degrees Celsius; thereby, the test fixture 21 and the infrared focal plane array detector 2 arranged in the accommodating chamber can be heated to 70 degrees Celsius together. Corresponding to this example, the high temperature test means that the infrared focal plane array detector 2 needs to be heated to a temperature greater than 70 degrees Celsius. For example, the infrared focal plane array detector needs to be heated to 105 degrees Celsius. Therefore, after the infrared focal plane array detector is heated to 105 degrees Celsius, it can be determined whether the infrared focal plane array detector can work normally in a 105 degree Celsius environment.
[0060] In some embodiments, when high temperature testing is not required, heating can be performed by the first heater of the incubator 10. For example, when the preset test temperature is 60 degrees Celsius, the temperature in the accommodating cavity can be raised to 60 degrees Celsius by the first heater of the incubator 10, so that the infrared focal plane array detector 2 disposed in the accommodating cavity is raised to 60 degrees Celsius. In this case, the second heater 211 may not work.
[0061] In addition, the temperature box 10 also includes a refrigerator. For example, the refrigerator included in the temperature box 10 can reduce the temperature in the accommodating cavity to -40 degrees Celsius, so that after the temperature of the infrared focal plane array detector is reduced to -40 degrees Celsius, it can be determined whether the infrared focal plane array detector can work normally in a -40 degree Celsius environment.
[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0063] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.
Claims
1. A testing device for testing an infrared focal plane array detector (2), characterized in that: The testing equipment comprises: a temperature box (10) and a testing device (20); The temperature box (10) is provided with a containing cavity, and the temperature box (10) comprises a first heater, and the first heater is used to heat the containing cavity; The testing device (20) is arranged in the accommodating cavity, the testing device (20) comprises a testing fixture (21), the testing fixture (21) comprises a second heater (211), and a heating portion of the second heater (211) is used for thermally connecting to the infrared focal plane array detector (2); When the required test temperature is a second temperature, the first heater is used to increase the temperature in the accommodating cavity to the first temperature, and the second heater (211) is used to increase the temperature of the infrared focal plane array detector (2) from the first temperature to the second temperature.
2. The test device according to claim 1, characterized in that The second heater (211) is a thermoelectric cooler, and the hot end of the thermoelectric cooler forms the heating part; The heating part is provided with a heat-conducting silicone sheet, and the heating part is thermally connected to the infrared focal plane array detector (2) via the heat-conducting silicone sheet.
3. The testing device according to claim 1, characterized in that The testing device (20) further comprises a light shielding baffle (22) and a driver (23); The light shielding baffle (22) is provided with a test auxiliary area, the test auxiliary area comprising a light shielding area (221) and a light transmission area (222), and the driver (23) is drivingly connected to the light shielding baffle (22) to drive the light shielding baffle (22) to switch between a light transmission position and a shielding position; When the light-shielding baffle (22) is located at the shielding position, the heating portion is opposite to the light-shielding area (221); when the light-shielding baffle (22) is located at the light-transmitting position, the heating portion is opposite to the light-transmitting area (222).
4. The testing device according to claim 3, characterized in that The number of the test fixtures (21) is multiple, and the multiple test fixtures (21) are arranged at intervals; the number of the test auxiliary areas is equal to the number of the test fixtures (21), and the test auxiliary areas and the heating parts are arranged in a one-to-one correspondence.
5. The testing device according to claim 3, characterized in that The testing device (20) further comprises a triggering member (241), a first position sensor (242) and a second position sensor (243); the triggering member (241) is connected to the light shielding baffle (22); When the light shielding baffle (22) is located at the shielding position, the triggering member (241) triggers the first position sensor (242); when the light shielding baffle (22) is located at the light transmitting position, the triggering member (241) triggers the second position sensor (243).
6. The testing device according to claim 3, characterized in that The testing fixture (21) comprises an optical lens (212), the light shielding baffle (22) being located on a side of the optical lens (212) facing away from the heating portion, and when the light shielding baffle (22) is located at the light-transmitting position, the optical lens (212) is opposite to the light-transmitting area (222).
7. The testing device according to claim 6, characterized in that The testing fixture (21) further comprises an optical lens holder (213), wherein the optical lens holder (213) is disposed around the outside of the heating portion, one end of the optical lens holder (213) is detachably connected to the second heater (211), and the other end of the optical lens holder (213) is connected to the optical lens (212).
8. The testing device according to claim 7, characterized in that The testing tool (21) further comprises a lock (214) and a structural fixing frame, the lock (214) being movably connected to the optical lens holder (213), the second heater (211) being arranged on the structural fixing frame, and the lock (214) being used to connect to a peripheral portion of the structural fixing frame.
9. The testing device according to claim 1, characterized in that The first temperature is greater than or equal to 70 degrees Celsius and less than or equal to 85 degrees Celsius, and the second temperature is greater than or equal to 105 degrees Celsius and less than or equal to 150 degrees Celsius.
10. A control method for a test device, applied to the test device according to any one of claims 1 to 9, characterized in that: The control method comprises: Determining whether it is necessary to perform a high temperature test on the infrared focal plane array detector (2) thermally connected to the heating portion, wherein a maximum test temperature corresponding to the high temperature test is greater than the first temperature; When a high temperature test is required, controlling the first heater to operate so that the temperature in the accommodating cavity is raised to the first temperature, and the infrared focal plane array detector (2) is raised to the first temperature; When the temperature in the accommodating cavity is the first temperature, the second heater (211) is controlled to operate, so as to increase the temperature of the infrared focal plane array detector (2) from the first temperature to the second temperature.