Chip Memory

Abstract

The present disclosure relates to the field of semiconductor manufacturing, and provides a wafer storage device. The wafer storage device includes a storage bin, an exchange chamber, an inner window plate, an inner window frame, and a handling device. A wafer box is sent from the external environment into the storage bin through the exchange chamber, and is sent from the storage bin to the external environment through the exchange chamber. The inner window plate opens and closes the inner window of the exchange chamber and the storage bin. When the inner window is opened, the wafer box can move between the exchange chamber and the storage bin through the inner window. The inner window frame includes an upper frame portion that matches the shape of the inner window plate, so that the inner window plate rises relative to the inner window frame to contact with the upper frame portion and closes the inner window. The handling device is used to carry the wafer box between the storage bin and the exchange chamber. In a top-down perspective, the inner window plate and the upper frame portion are recessed in a direction away from the main axis of the handling device. When the wafer box is carried between the storage bin and the exchange chamber, the distance that needs to be moved in the horizontal direction is reduced, thereby improving the handling efficiency of the wafer box.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing, and more particularly, to a chip memory. Background Art

[0002] In the semiconductor industry, the chip storage device is an automated storage device that realizes the flow of chips between different processes by working in conjunction with the automated material handling system. The chip storage device is equipped with a storage bin and an exchange chamber. The storage bin is used to store chip boxes. The chip boxes can be sent from the external environment to the storage bin through the exchange chamber, and can also be sent from the storage bin to the external environment through the exchange chamber. However, in the previous chip storage devices, the chip boxes had a long travel route and low handling efficiency. Summary of the invention

[0003] In view of this, the present disclosure provides a wafer storage device to improve the problem of low handling efficiency when a wafer box is transported into and out of the wafer storage device.

[0004] The wafer storage device includes a storage bin, an exchange chamber, an inner window plate, an inner window frame and a handling device. The storage bin is used to store wafer boxes. The wafer boxes are sent from the external environment into the storage bin through the exchange chamber, and are sent from the storage bin to the external environment through the exchange chamber. The inner window plate opens and closes the inner window of the exchange chamber and the storage bin. When the inner window is opened, the wafer box can move between the exchange chamber and the storage bin through the inner window. The inner window frame includes an upper frame portion that matches the shape of the inner window plate, so that the inner window plate rises relative to the inner window frame to contact with the upper frame portion and close the inner window. The handling device is used to carry the wafer box between the storage bin and the exchange chamber, and the handling device has a main axis extending in the up-down direction. In a top-down perspective, the inner window plate and the upper frame portion are recessed in a direction away from the main axis.

[0005] As a possible implementation manner, in a top view, both the inner window panel and the upper frame portion have an arc shape that is concave in a direction away from the main axis.

[0006] As a possible implementation manner, in a top-down perspective, the arc line is an arc line with the main axis as the center.

[0007] As a possible implementation, a plurality of temporary storage tables are provided in the exchange room, and in a top-down view, the plurality of temporary storage tables are arranged at intervals along an arc.

[0008] As a possible implementation manner, in a bird's-eye view, the distances from the multiple temporary storage tables to the arc are equal.

[0009] As a possible implementation manner, in a top view, the inner window panel and the upper frame portion both have a multi-segment line shape that is recessed in a direction away from the main axis.

[0010] As a possible implementation manner, in a top-down perspective, the distances between multiple straight line segments of the polyline and the main axis are equal.

[0011] As a possible implementation, a plurality of temporary storage tables are provided in the exchange room, the polyline includes a plurality of straight line segments, and the plurality of temporary storage tables correspond to the plurality of straight line segments respectively. In a top view, the plurality of temporary storage tables are arranged at intervals along the polyline, and each temporary storage table is opposite to the main axis across the corresponding straight line segment.

[0012] As a possible implementation manner, the distance between each temporary storage station and the corresponding straight line segment is equal.

[0013] As a possible implementation, a temporary storage table is provided in the exchange chamber. The wafer storage device further includes a driving mechanism. When the inner window is opened, the driving mechanism is used to drive the temporary storage table to move between a first position and a second position. When the temporary storage table is located at the first position, the wafer box is completely located in the exchange chamber. When the temporary storage table is located at the second position, the portion of the wafer box combined with the handling device crosses the inner window and extends into the storage bin.

[0014] The inner window plate and the upper frame of the exchange chamber in the chip storage device disclosed in the present invention are recessed in a direction away from the main axis, so that when the chip box is transported between the storage bin and the exchange chamber by the transport device, the distance required to be moved in the horizontal direction is reduced, thereby improving the transport efficiency of the chip box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be viewed as limiting the scope.

[0016] It should be understood that the same or similar reference numerals are used in the drawings to indicate the same or similar elements.

[0017] It should be understood that the drawings are merely schematic and that the sizes and proportions of elements in the drawings are not necessarily accurate.

[0018] Figure 1 FIG. 4 is a schematic diagram of the structure of a chip memory according to an embodiment of the present disclosure.

[0019] Figure 2a To show the normal viewing angle Figure 1 Schematic diagram of the structure when the inner window of the chip memory is opened.

[0020] Figure 2b To show the normal viewing angle Figure 1 Schematic diagram of the structure when the inner window of the chip memory is closed.

[0021] Figure 2c To show the side view Figure 1 Schematic diagram of the internal structure of the chip memory.

[0022] Figure 3 To show the top view Figure 1 Schematic diagram of the upper frame shape of the chip storage and the position of the temporary storage table.

[0023] Figure 4 for Figure 1 A schematic diagram of the structure of a transport device carrying a wafer box in a wafer storage device.

[0024] Figure 5 To show the top view Figure 1 Schematic diagram of the upper frame shape of the chip storage and the position of the temporary storage table.

[0025] Figure 6 To show the top view Figure 1 Schematic diagram of the second position of the chip memory in.

[0026] Figure 7 for Figure 1 Schematic diagram of the structure of the drive mechanism of the chip memory.

[0027] Figure 8 for Figure 1 A schematic diagram of the structure of a transport device carrying a wafer box in a wafer storage device.

[0028] Fig. 9 To show the top view Figure 1 A schematic diagram of the position of a wafer storage device when the wafer box is located at the second position.

[0029] Figures 1 to 9 Description of reference numerals:

[0030] 10-storage warehouse, 11-warehouse wall, 111-front warehouse wall, 1111-outer window, 112-outer window plate, 20-exchange chamber, 21-inner window plate, 22-inner window, 221-inner window frame, 2211-upper frame portion, 23-upper wall portion, 24-lower wall portion, 241-lower frame portion, 25-side wall portion, 30-carrying platform, 40-conveying device, 41-main axis, 42-main body, 43-robot arm, 44-actuator, 441-second joint portion, 50-wafer box, 51-first joint portion, 60-temporary storage table, 70-straight line segment, 80-driving mechanism, 81-sprocket, 82-chain. DETAILED DESCRIPTION

[0031] Numerous specific details will be listed below to provide an understanding of the structure, function, and use of the embodiments described in the specification and shown in the drawings. It is understood that the embodiments described and shown herein are non-limiting examples, so that it can be recognized that the specific structural and functional details disclosed herein may be representative and exemplary. Modifications and changes may be made to these embodiments without departing from the scope of the claims.

[0032] In the semiconductor industry, the chip storage device is an automated storage device that works in conjunction with the automated material handling system to enable the transfer of chips between different processes. The chip storage device has a storage bin inside, which is used to store chip boxes.

[0033] The wafer storage device is also provided with an exchange chamber. When the wafer box is sent into the wafer storage device, the wafer box is usually placed in the exchange chamber by a mobile device or a technician, and then the wafer box is taken out of the exchange chamber by a handling device and moved to the storage space above the exchange chamber. When taking out the wafer box, it is necessary to move the wafer box a certain distance in the horizontal direction to a designated position, and then take the wafer box out of the exchange chamber. The wafer box at this position does not overlap with the orthographic projection of the upper wall of the exchange chamber in the horizontal direction. At this time, the wafer box can move in the height direction without colliding and interfering with the upper wall of the exchange chamber. Therefore, when moving the wafer box in the exchange chamber to the top of the exchange chamber, it is necessary to first move the wafer box in the horizontal direction to cross the upper wall of the exchange chamber. The inventor found that in previous wafer storage devices, the upper frame portion of the upper wall side of the exchange chamber is usually close to the handling device, so that the wafer box in the exchange chamber needs to be moved a long distance in the horizontal direction before the wafer box can be taken out of the exchange chamber. The handling efficiency of the wafer box is reduced.

[0034] In response to the above problems, the inner window plate and the upper frame of the exchange chamber in the chip storage device of the present invention are recessed in the direction away from the main axis, so that when the chip box is transported between the storage bin and the exchange chamber by the transport device, the distance that needs to be moved in the horizontal direction is reduced, thereby improving the transport efficiency of the chip box.

[0035] The following is a more detailed introduction to the chip memory provided by the present disclosure.

[0036] The wafer storage device includes a storage bin 10, an exchange chamber 20, an inner window plate 21, an inner window frame 221 and a transport device 40. Figure 1 As shown, the wafer storage can be a rectangular cube formed by a plurality of bin walls 11, and the accommodation space inside the rectangular cube is used as a storage bin 10 for storing a wafer box 50. The exchange chamber 20 is located in the wafer storage, and the wafer box 50 is sent from the external environment to the storage bin 10 through the exchange chamber 20, and is sent from the storage bin 10 to the external environment through the exchange chamber 20. Figure 2aAs shown, the inner window plate 21 can open and close the inner window 22 of the exchange chamber 20 and the storage bin 10. When the inner window 22 is opened, the wafer box 50 can move between the exchange chamber 20 and the storage bin 10 through the inner window 22. Figure 2b As shown, the inner window frame 221 includes an upper frame portion 2211 that matches the shape of the inner window plate 21, so that the inner window plate 21 rises relative to the inner window frame 221 until it contacts the upper frame portion 2211 and closes the inner window 22. Figure 2c As shown, the transport device 40 is used to transport the wafer box 50 between the storage bin 10 and the exchange chamber 20, and the transport device 40 has a main axis 41 extending in the up-down direction. Figure 3 As shown, in a top view, the inner window panel 21 and the upper frame portion 2211 are recessed in a direction away from the main axis 41 .

[0037] In some embodiments, Figure 1 As shown, the wafer storage device may further include an outer window 1111 on the front warehouse wall 111. The outer window 1111 may be arranged opposite to the inner window 22, and the sizes or shapes of the two may be the same or different. The wafer box 50 may be sent from the external environment to the exchange chamber 20 through the outer window 1111. The wafer storage device may further include an outer window plate 112, which is used to close and open the outer window 1111. When the wafer box 50 is sent from the external environment to the storage warehouse 10, the outer window 1111 may be opened first to send the wafer box 50 into the exchange chamber 20, and then the outer window 1111 may be closed to open the inner window 22, and the handling device 40 may send the wafer box 50 into the storage warehouse 10. When the wafer box 50 is sent out from the storage warehouse 10 to the external environment, the inner window 22 may be opened first, and the handling device 40 may send the wafer box 50 into the exchange chamber 20, and then the inner window 22 may be closed to open the outer window 1111, and the wafer may be taken out from the exchange chamber 20. During this process, one of the inner window 22 and the outer window 1111 is always in a closed state, so as to prevent the storage bin 10 from being directly connected to the external environment and dust from the external environment from entering the storage bin 10 .

[0038] Specifically, Figure 1 , Figure 2c , Figure 3As shown, the exchange chamber 20 includes an upper wall portion 23, a lower wall portion 24, and two side wall portions 25. The four side edges of the upper wall portion 23, the lower wall portion 24, and the two side wall portions 25 close to the conveying device 40 constitute the inner window frame 221 of the inner window 22, and the four side edges away from the conveying device 40 constitute the outer window frame 1111 of the outer window. The side edge of the upper wall portion 23 close to the conveying device 40 is the upper frame portion 2211, and the side edge of the lower wall portion 24 close to the conveying device 40 is the lower frame portion 241. The shape of the upper frame portion 2211 matches the inner window plate 21. The inner window plate 21 can move in the height direction relative to the inner window frame 221, so that the inner window plate 21 rises relative to the inner window frame 221 to contact with the upper frame portion 2211 and close the inner window 22. Optionally, the inner window panel 21 can also be moved in other ways to close and open the inner window. For example, one side edge of the inner window panel 21 can be rotatably connected to any frame edge of the inner window frame 221 except the upper frame portion 2211, so that the inner window panel 21 rotates around the frame edge and the inner window panel 21 contacts the upper frame portion 2211 to close the inner window 22.

[0039] In some embodiments, Figure 4 As shown, the handling device 40 may include a main body 42, a mechanical arm 43, and an actuator 44 at the end of the mechanical arm 43. The main body 42 can drive the mechanical arm 43 to move, and the mechanical arm 43 drives the actuator 44 to reach a specified position, and the actuator 44 can grab and place the wafer box 50. The handling device 40 has a main axis 41 extending in the up-down direction. The main axis 41 can be the centroid of the orthographic projection of the handling device 40 on the horizontal plane, or the centroid of the orthographic projection of the working range of the handling device 40 on the horizontal plane, wherein the working range of the handling device 40 refers to the position that the actuator 44 can reach. The handling device 40 can carry the wafer box 50 between the storage bin 10 and the exchange chamber 20.

[0040] Specifically, Figure 2c As shown, there are a plurality of carriers 30 in the storage bin 10 for placing the wafer box 50, and the carriers 30 are arranged on the bin wall 11 and are located above the exchange chamber 20. When the handling device 40 carries the wafer box 50 from the exchange chamber 20 to the carrier 30, the wafer box 50 needs to be taken out of the exchange chamber 20 first. This means that the handling device 40 needs to first move the wafer box 50 to a safe position in the horizontal direction, and the wafer box 50 at this position does not overlap with the orthographic projection of the upper wall portion 23 or the upper frame portion 2211 of the exchange chamber 20 on the horizontal plane. At this time, the handling device 40 can move the wafer box 50 in the height direction. Subsequently, the handling device 40 moves the wafer box 50 upward, over the upper wall portion 23, to the height where the carrier 30 is located, and then places the wafer box 50 on the carrier 30. When the handling device 40 carries the wafer box 50 on the carrier 30 to the exchange chamber 20, the opposite operation is performed.

[0041] In the above embodiment, when the transport device 40 transports the wafer box 50 between the exchange chamber 20 and the storage bin 10, the wafer box 50 needs to be moved a certain distance in the horizontal direction to a safe position. The length of the moving distance affects the transport efficiency of the transport device 40. Therefore, in some embodiments, such as Figure 3 As shown, in a top view, the inner window plate 21 and the upper frame portion 2211 are recessed in a direction away from the main axis 41. Since the upper frame portion 2211 is recessed in a direction away from the main axis 41, when the transport device 40 takes the wafer box 50 out of the exchange chamber 20, the distance that the wafer box 50 needs to move in the horizontal direction is shortened, thereby improving the transport efficiency of the wafer box 50.

[0042] The present disclosure does not limit the shape of the inner window plate 21 and the upper frame portion 2211 that are concave in a direction away from the main axis 41. In some embodiments, as Figure 3 As shown, in a top view, the inner window plate 21 and the upper frame portion 2211 both have the shape of an arc that is concave in a direction away from the main axis 41. Optionally, the arc can be an arc with the main axis 41 as the center. In the above embodiment, when the handling device 40 clamps the wafer box 50 and passes over the upper wall portion 23, that is, when the wafer box 50 intersects with the orthographic projection of the upper wall portion 23 on the front warehouse wall 111, the handling device 40 can rotate the wafer box 50 on the horizontal plane with the main axis 41 as the center, and adjust the position of the wafer box 50 on the horizontal plane without colliding with the upper frame portion 2211.

[0043] In some embodiments, Figure 3 As shown, a plurality of temporary storage tables 60 are provided in the exchange chamber 20, and the temporary storage tables 60 can be arranged on the lower wall portion 24 for placing the wafer box 50. In a top view, the plurality of temporary storage tables 60 are arranged at intervals along the arc. This makes the distance between the orthographic projections of the plurality of temporary storage tables 60 on the horizontal plane and the orthographic projections of the upper frame portion 2211 on the horizontal plane shorter. The wafer box 50 can be brought to a safe position by simply moving the wafer box 50 on the temporary storage table 60 a short distance in the horizontal direction, that is, a position where the orthographic projections of the wafer box 50 and the upper frame portion 2211 on the horizontal plane do not overlap. This improves the handling efficiency.

[0044] In some embodiments, Figure 3As shown, in a top-down perspective, the distances d from multiple temporary storage tables 60 to the arc are equal. There is a connecting line between the centroid of the orthographic projection of the temporary storage table 60 on the horizontal plane and the arc center of the orthographic projection of the arc on the horizontal plane. The connecting line and the arc have an intersection. The distance between the intersection and the centroid of the orthographic projection of the temporary storage table 60 on the horizontal plane is the distance d from the temporary storage table 60 to the arc. When the transport device 40 takes out the wafer box 50 from different temporary storage tables 60, the wafer box 50 moves the same distance in the horizontal direction. And when the arc is a circular arc with the main axis 41 as the center, when the wafer box 50 is transported between the temporary storage tables 60, there is no need to adjust the distance from the wafer box 50 to the main axis 41. The setting of the control program for the transport device 40 is simpler.

[0045] In some embodiments, Figure 5 As shown, in a top view, the inner window panel 21 and the upper frame portion 2211 both have a polyline shape that is concave in a direction away from the main axis 41. The concave polyline has a simpler structure than an arc-shaped concave structure and has a lower manufacturing cost. Optionally, the distances between the multiple straight line segments 70 of the polyline and the main axis 41 are equal. Each line segment includes a perpendicular line L passing through the main axis 41, and the vertical distance between the foot P of the perpendicular line L and the main axis 41 is the distance between the straight line segment 70 and the main axis 41.

[0046] In some embodiments, Figure 5 As shown, a plurality of temporary storage tables 60 are provided in the exchange chamber 20, and the temporary storage tables 60 can be arranged on the lower wall portion 24 for placing the wafer box 50. The polyline includes a plurality of straight line segments 70, and the plurality of temporary storage tables 60 correspond to the plurality of straight line segments 70 respectively. In a top view, the plurality of temporary storage tables 60 are arranged at intervals along the polyline. When the handling device 40 takes out the wafer box 50 from the exchange chamber 20, the wafer box 50 on the temporary storage table 60 is moved on the horizontal plane toward the corresponding straight line segment 70. After moving to a safe position, the wafer box 50 can be moved upward to cross the corresponding straight line segment 70. And each temporary storage table 60 is opposite to the main axis 41 across the corresponding straight line segment 70. The temporary storage table 60 being opposite to the main axis 41 means that the wafer box 50 on the temporary storage table 60 is facing the handling device 40, that is, the vertical line between the centroid of the wafer inside the wafer box 50 and the main axis 41 is perpendicular to the front end face of the wafer box 50. When the transport device 40 grabs the wafer box 50, unnecessary adjustment and positioning time of the transport device 40 can be reduced. When the transport device 40 transports the wafer box 50 between the temporary storage tables 60, the wafer box 50 is always facing the main axis 41 during the transport process, and there is no need to adjust the angle between the wafer box 50 and the transport device 40.

[0047] In some embodiments, Figure 5As shown, the distance d from each temporary storage table 60 to the corresponding straight line segment 70 is equal. The vertical distance from the centroid of the orthographic projection of the temporary storage table 60 on the horizontal plane to the orthographic projection of the corresponding straight line segment 70 on the horizontal plane is the distance d from the temporary storage table 60 to the corresponding straight line segment 70. When the handling device 40 takes out the wafer box 50 from different temporary storage tables 60, the wafer box 50 moves the same distance in the horizontal direction. The setting of the control program for the handling device 40 is simpler.

[0048] In some embodiments, Figure 5-Figure 7 As shown, the wafer storage device further includes a driving mechanism 80. When the inner window 22 is opened, the driving mechanism 80 is used to drive the temporary storage table 60 to move between the first position and the second position. When the temporary storage table 60 is located at the first position, the wafer box 50 is completely located in the exchange chamber 20. When the temporary storage table 60 is located at the second position, the portion of the wafer box 50 combined with the handling device 40 crosses the inner window 22 and extends into the storage bin 10.

[0049] The present disclosure does not limit the driving method of the driving mechanism 80, as long as it can drive the temporary storage table 60 to move between the first position and the second position, for example, hydraulic driving, electric driving, etc. can be used. Figure 7 As shown, the driving mechanism 80 may include a power source (not shown in the figure), a sprocket 81 and a chain 82. The chain 82 is coupled to the sprocket 81, and the temporary storage table 60 is fixedly connected to the chain 82. For example, the power source may be an electric motor. The power source drives the sprocket 81 to rotate, driving the chain 82 to move, and then the chain 82 drives the temporary storage table 60 to move between the first position and the second position. In another embodiment, the driving mechanism 80 may include a slider, a guide rail, a screw, and a motor. The screw is arranged in the guide rail, and one end of the slider is connected to the temporary storage table 60, and the other end is connected to the screw. The motor drives the screw to rotate, driving the slider to move along the guide rail, and then the temporary storage table 60 can move along the guide rail.

[0050] In some embodiments, Figure 8 As shown, the wafer box 50 includes a first coupling portion 51 that is releasably coupled to the handling device 40. The handling device 40 has a second coupling portion 441 that cooperates with the first coupling portion 51. The handling device 40 grabs the wafer box 50 through the cooperation between the first coupling portion 51 and the second coupling portion 441. Figure 6 and Fig. 9As shown, when the temporary storage table 60 is located at the second position, the first coupling portion 51 of the wafer box 50 crosses the inner window 22 and extends into the storage bin 10. That is, the orthographic projection of the wafer box 50 on the horizontal plane intersects with the orthographic projections of the upper frame portion 2211 and the lower frame portion 241 on the horizontal plane, and the orthographic projection of the first coupling portion 51 on the horizontal plane is located on the side of the orthographic projections of the upper frame portion 2211 and the lower frame portion 241 on the horizontal plane close to the main axis 41. Since the first coupling portion 51 crosses the inner window 22 and extends into the storage bin 10, when the handling device 40 grabs the wafer box 50, the second coupling portion 441 does not need to extend into the exchange chamber 20, that is, it does not need to extend onto the lower wall portion 24. That is, when the handling device 40 grabs the wafer box 50, the orthographic projection of the handling device 40 on the horizontal plane does not overlap with the orthographic projection of the exchange chamber 20 on the horizontal plane. Therefore, when the handling device 40 of the above embodiment grabs the wafer box 50, even if the second joint portion 441 is partially lower than the lower wall portion 24, it will not collide with the lower wall portion 24. When the handling device 40 grabs the wafer box 50, the height of the second joint portion 441 can be more flexible, and it is not strictly required that the second joint portion 441 is higher than the lower wall portion 24. In addition, since the actuator 44 does not need to extend into the exchange chamber 20, the risk of the actuator 44 colliding with the exchange chamber 20 is reduced.

[0051] The present disclosure is described in more detail below in conjunction with specific examples. It should be noted that this example is only to help those skilled in the art understand the present disclosure, rather than to limit the present disclosure to the specific numerical values ​​or specific scenarios illustrated. Those skilled in the art can obviously make various equivalent modifications or changes based on the examples given below, and such modifications or changes also fall within the scope of the present disclosure.

[0052] In some embodiments, Figure 1-Figure 9As shown, the wafer storage device can be a rectangular cube formed by a plurality of warehouse walls 11, and the accommodation space inside the rectangular cube is used as a storage warehouse 10 for storing a wafer box 50. There is an outer window 1111 on the front warehouse wall 111 of the wafer storage device, and the wafer box 50 can be sent from the external environment to the exchange chamber 20 through the outer window 1111. The exchange chamber 20 includes an upper wall portion 23, a lower wall portion 24, and two side wall portions 25. Three temporary storage tables 60 located on the lower wall portion are arranged in the exchange chamber 20. The four side edges of the upper wall portion 23, the lower wall portion 24, and the two side wall portions 25 of the exchange chamber 20 close to the handling device 40 constitute the inner window frame 221 of the inner window 22. The side edge of the upper wall portion 23 close to the handling device 40 is the upper frame portion 2211, and the side edge of the lower wall portion 24 close to the handling device 40 is the lower frame portion 241. The wafer storage device further includes an inner window plate 21 and an outer window plate 112, which are used to open and close the inner window 22 and the outer window 1111, respectively. The wafer storage device further includes a transport device 40, which is used to transport the wafer box 50 between the storage bin 10 and the exchange chamber 20. The transport device 40 includes a main body 42, a mechanical arm 43, and an actuator 44 at the end of the mechanical arm 43, and the actuator 44 has a second coupling portion 441 that can be releasably coupled with the wafer box 50. The transport device 40 has a main axis 41 extending in the up-down direction. The inner window plate 21 and the upper frame portion 2211 both have a polyline shape that is concave in a direction away from the main axis 41. The polyline includes three straight line segments 70, and the three temporary storage tables 60 correspond to the three straight line segments 70, respectively. In a top view, the three temporary storage tables 60 are arranged at intervals along the polyline. Each temporary storage table 60 is opposite to the main axis 41 across the corresponding straight line segment 70. The wafer box 50 on the temporary storage table 60 is facing the transport device 40. The distance from each temporary storage table 60 to the corresponding straight line segment 70 is equal. The wafer storage device further includes a driving mechanism 80, which is used to drive the temporary storage table 60 to move between the first position and the second position when the inner window 22 is opened. When the temporary storage table 60 is located at the first position, the wafer box 50 is completely located in the exchange chamber 20; when the temporary storage table 60 is located at the second position, the first joint portion 51 of the wafer box 50 and the handling device 40 crosses the inner window 22 and extends into the storage bin 10.

[0053] It should be noted that the various elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0054] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into separate multiple components and / or parts. The disclosure "one" or "an" used to describe a component or part is not intended to exclude other components or parts.

[0055] It should be understood that although the terms “first” or “second” etc. may be used in the present disclosure to describe various elements (such as a first position and a second position), these elements are not defined by these terms, and these terms are only used to distinguish one element from another.

[0056] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0057] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A chip memory, characterized in that: The chip memory comprises: A storage bin, the storage bin being used to store wafer boxes; An exchange chamber, through which the wafer box is conveyed from the external environment into the storage bin and from the storage bin to the external environment through the exchange chamber; An inner window plate, the inner window plate opens and closes an inner window for the exchange chamber to interact with the storage bin; when the inner window is opened, the wafer box can move between the exchange chamber and the storage bin through the inner window; an inner window frame, the inner window frame comprising an upper frame portion matching the shape of the inner window panel, so that the inner window panel rises relative to the inner window frame to contact the upper frame portion to close the inner window; and A transport device is used to transport the wafer box between the storage bin and the exchange chamber, and the transport device has a main axis extending in the up-down direction; in a top view, the inner window plate and the upper frame are recessed in a direction away from the main axis.

2. The chip memory according to claim 1, characterized in that: In a plan view, the inner window panel and the upper frame portion both have an arc shape that is recessed in a direction away from the main axis.

3. The chip memory according to claim 2, characterized in that: In a top view, the arc line is a circular arc line with the main axis as the center.

4. The chip memory according to claim 2, characterized in that: A plurality of temporary storage tables are arranged in the exchange room, and in a top view, the plurality of temporary storage tables are arranged at intervals along the arc.

5. The chip memory according to claim 4, characterized in that: In a top-down perspective, the distances between the multiple temporary storage tables and the arc are equal.

6. The chip memory according to claim 1, characterized in that: In a plan view, the inner window panel and the upper frame portion both have a multi-segment line shape that is recessed in a direction away from the main axis.

7. The chip memory according to claim 6, characterized in that: In a top-down perspective, the distances between the multiple straight line segments of the polyline and the main axis are equal.

8. The chip memory according to claim 6, characterized in that: A plurality of temporary storage tables are arranged in the exchange room, the polyline includes a plurality of straight line segments, and the plurality of temporary storage tables correspond to the plurality of straight line segments respectively; in a top view, the plurality of temporary storage tables are arranged at intervals along the polyline, and each temporary storage table is opposite to the main axis across a corresponding straight line segment.

9. The chip memory according to claim 8, characterized in that: The distance from each temporary storage station to the corresponding straight line segment is equal.

10. The chip memory according to claim 1, characterized in that: The exchange chamber is provided with a temporary storage table; it also includes a driving mechanism; when the inner window is opened, the driving mechanism is used to drive the temporary storage table to move between a first position and a second position; when the temporary storage table is located at the first position, the wafer box is completely located in the exchange chamber; when the temporary storage table is located at the second position, the portion of the wafer box combined with the transport device crosses the inner window and extends into the storage bin.

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