Wafer transmission and electrical property detection system

Abstract

The invention relates to the technical field of wafer feeding detection, in particular to a wafer transmission and electrical performance detection system, which can realize wafer carrying and pre-alignment operation, automatic feeding for detection, manual operation saving and detection efficiency and accuracy improvement, and comprises wafer transmission equipment and wafer detection equipment, the wafer transmission equipment comprises a wafer loading and feeding mechanism, a wafer carrying mechanism and a pre-alignment mechanism, the wafer detection equipment comprises an equipment cover shell, a detection platform is arranged in the equipment cover shell, the detection platform is provided with a moving table connected with an XY two-axis driving mechanism II, and the moving table is provided with an X-axis driving mechanism II and a Y-axis driving mechanism II. A lifting table and a lower visual camera which are connected with a Z-axis lifting mechanism are mounted on the moving table, a wafer adsorption platform is mounted on the lifting table, a probe chuck is mounted on a top cover plate of the equipment housing, a probe circuit board is arranged on the probe chuck, an upper visual camera is arranged above the wafer adsorption platform, and a lower visual camera is arranged above the upper visual camera. And the upper visual camera is connected with a transverse movement driving mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer loading detection, and in particular to a wafer transmission and electrical performance detection system. Background Art

[0002] With the increasing application of integrated circuits, the demand for wafers, as the basic material for manufacturing semiconductor devices, has increased rapidly in the market, simultaneously promoting the development of the wafer manufacturing industry.

[0003] During the manufacturing and packaging process of wafers, the electrical performance parameters of the wafers need to be tested to ensure the quality of the wafers. In the traditional testing method, the wafers are manually taken out of the wafer box and loaded onto the wafer probe station. The test personnel manually calibrate, select points, and test them. Finally, they are manually recycled into the wafer basket for the next process. The above method has a long testing cycle and high labor intensity. In addition, there is a certain degree of uncertainty in manual testing, and the test results are unstable. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a wafer transmission and electrical performance detection system, which can realize wafer handling and pre-alignment operations, automatically load materials for detection, save manual operations, and improve detection efficiency and accuracy.

[0005] The technical scheme is as follows: a wafer transmission and electrical performance detection system, characterized in that it includes wafer transmission equipment and wafer detection equipment, characterized in that the wafer transmission equipment includes a wafer loading and feeding mechanism, a wafer conveying mechanism, and a pre-alignment mechanism, the wafer conveying mechanism includes a rotating table, the rotating table is connected to a lifting drive mechanism, a conveying seat is fixed on the rotating table, a wafer scanning mechanism and a wafer fetching mechanism are installed on the conveying seat, the wafer scanning mechanism includes a laser probe installed on a scanning moving plate, the scanning moving plate is connected to an XY two-axis drive mechanism, the wafer fetching mechanism includes a fetching moving plate, the fetching moving plate is connected to a fetching translation drive mechanism, and the upper end surface of the end of the fetching moving plate A suction port is opened; the pre-alignment mechanism includes an adjustment turntable, the bottom of the adjustment turntable is connected to the rotating mechanism, and the top is provided with a suction port, and a wafer code reader and a laser sensor are arranged next to the adjustment turntable; the wafer detection equipment includes an equipment cover, a detection platform is arranged in the equipment cover, a moving platform connected to an XY two-axis driving mechanism is arranged on the detection platform, a lifting platform connected to a Z-axis lifting mechanism and a lower visual camera are installed on the moving platform, a wafer adsorption platform is installed on the lifting platform, a probe chuck is installed on the top cover plate of the equipment cover, a probe circuit board is arranged on the probe chuck, an upper visual camera is arranged above the wafer adsorption platform, and the upper visual camera is connected to the lateral movement driving mechanism.

[0006] Its further feature is that the film sweeping moving plates include two symmetrically arranged plates, the XY two-axis driving mechanism includes an X-axis guide rail installed on the transport seat, a moving adjustment block slidably connected to the X-axis guide rail, the moving adjustment block is connected to the X-axis driving cylinder, a Y-axis guide rail is provided on the moving adjustment block, the two film sweeping moving plates are respectively slidably connected to the Y-axis guide rail, the two film sweeping moving plates are connected by a connecting rod mechanism, and one of the film sweeping moving plates is connected to the Y-axis driving cylinder; The wafer fetching mechanism comprises two wafer fetching movable plates arranged at intervals in the upper and lower parts, the two wafer fetching movable plates are respectively connected to independent wafer fetching driving mechanisms, the ends of the wafer fetching movable plates are U-shaped structures, and the upper end surfaces at both ends of the U-shape are respectively provided with the adsorption ports; The film-taking translation driving mechanism comprises a belt transmission mechanism arranged on both sides of the transport seat, the belt transmission mechanism comprises a pulley mechanism and a guide rail arranged on one side of the pulley, a film-taking moving frame is slidably mounted on the guide rail and the film-taking moving frame is connected to the belt of the pulley mechanism, and the film-taking moving plate is connected to the film-taking moving frame by screws; The wafer loading and feeding mechanism comprises a feeding seat, a feeding platform is installed on the feeding seat, a side bracket is installed on the side of the feeding seat close to the wafer handling mechanism, a pneumatic door that can be translated and lifted is installed on the side bracket, a rotating unlocking buckle and a vacuum suction cup are installed on the pneumatic door, and a cover shell that can be lifted and lowered is installed on the feeding seat; The wafer code reader and the laser sensor are mounted on the same adjustable bracket, and the lower part of the adjustable bracket is slidably connected to a linear guide rail and connected to an adjusting cylinder; A cache mechanism is disposed on one side of the pre-alignment mechanism. The cache mechanism comprises a cache rack. The cache rack is composed of multiple layers of cache plates. Support bars and suction cups are disposed on each layer of the cache plates.

[0007] At least three ejector pin holes are provided on the wafer adsorption platform, and retractable ejector pins are provided in the ejector pin holes. The wafer adsorption platform is rotatably connected to the lifting platform and connected to a θ-axis rotation driving mechanism. The top cover is a flip cover structure, a mounting hole is provided in the middle of the top cover, and the probe chuck is mounted at the mounting hole through a chuck fixing member; The second XY two-axis driving mechanism includes a second Y-axis guide rail fixed to the detection platform, a lower moving seat slidably connected to the second Y-axis guide rail, and a second X-axis guide rail fixed to the lower moving seat. The moving platform is slidably connected to the second X-axis guide rail, and the lower moving seat and the moving platform are respectively connected to corresponding screw drive mechanisms. The Z-axis lifting mechanism includes a Z-axis screw drive mechanism and a Z-axis guide rail arranged between the lifting platform and the moving platform. The lateral movement driving mechanism is a screw driving mechanism, the upper visual camera is mounted on a camera bracket and connected to the screw driving mechanism, a dotting device is also mounted on the camera bracket, and a needle grinding table is also mounted on the movable platform.

[0008] After the present invention is adopted, the wafer box is placed on the wafer loading and feeding mechanism, and the laser probe on the wafer scanning mechanism first scans the wafers in the wafer box to determine the number and position of the wafers in the wafer box, and then the wafer picking moving plate on the wafer picking mechanism adsorbs and takes the wafers from the wafer box and places them on the adjustment turntable of the pre-alignment mechanism for position pre-alignment and code scanning, and finally sends them to the wafer adsorption platform for testing. The position is first determined by the upper visual camera and the lower visual camera, and then the XY two-axis driving mechanism and the Z-axis lifting mechanism move the wafer to the probe circuit board for detection, without manual intervention, thereby realizing automatic transmission and detection of wafers and improving detection efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the wafer transfer device of the present invention from a first viewing angle (with the cover opened); Figure 2 A schematic diagram of the wafer transfer device of the present invention from a second viewing angle (with the cover closed); Figure 3 Schematic diagram of wafer loading and feeding mechanism (without the cover); Figure 4 It is a schematic diagram of the transport mechanism structure; Figure 5 This is a schematic diagram of the transport seat structure from the first perspective; Figure 6 This is a schematic diagram of the transport seat structure from a second viewing angle; Figure 7 It is a schematic diagram of the wafer scanning mechanism; Figure 8 is a schematic diagram of a pre-alignment mechanism; Fig. 9 is a schematic diagram of a cache mechanism; Fig.10 This is a schematic diagram of the external structure of the wafer inspection equipment of the present invention; Fig.11 This is a schematic diagram of the structure of the inspection platform inside the cover of the wafer inspection equipment of the present invention; Fig.12 It is a schematic diagram of the structure of a mobile station; Fig.13 It is a schematic diagram of the top cover structure; Fig.14 Schematic diagram of the visual camera structure. DETAILED DESCRIPTION

[0010] See Figures 1 to 9As shown, a wafer transmission and electrical performance detection system includes a wafer transmission device and a wafer detection device 5. The wafer transmission device includes a wafer loading and feeding mechanism 2, a wafer handling mechanism 1, and a pre-alignment mechanism 3. The wafer loading and feeding mechanism 2 includes a feeding seat 21, a feeding platform 22 is installed on the feeding seat 21, a side bracket 23 is installed on the side of the feeding seat 21 close to the wafer handling mechanism 1, a pneumatic door 24 that can be moved and lifted is installed on the side bracket 23, and a rotary unlocking buckle 25 and a vacuum suction cup 26 are installed on the pneumatic door 24. When the wafer box 6 is placed on the feeding seat 21, the cover is opened first, the pneumatic door 24 is translated close to the box cover of the wafer box 6, two rotary unlocking buckles 25 are inserted into the lock holes of the box cover, and then the box cover is rotated to open, and at the same time, after the vacuum suction cup 26 absorbs the box cover, the pneumatic door 24 is translated backward and then descends to leave space for taking out the wafer, and a cover shell 27 that can be lifted and lowered is also installed on the feeding seat to play a protective effect.

[0011] The wafer handling mechanism 1 includes a rotating table 11, which is connected to a lifting drive mechanism. The rotating table 11 can be rotated and lifted, and is completed by a common motor and a lead screw and other devices. It is a common technical means in this field. A handling seat 12 is fixed on the rotating table 11, and a wafer scanning mechanism 13 and a wafer fetching mechanism 14 are installed on the handling seat 12. The wafer scanning mechanism 13 includes a laser probe 132 installed on a scanning moving plate 131. The scanning moving plate 131 includes two symmetrically arranged laser probes 132. The scanning moving plate 131 is connected to an XY two-axis driving mechanism. The XY two-axis driving mechanism includes an X-axis guide rail 133 installed on the handling seat 12, a sliding A movable adjustment block 134 is connected to an X-axis guide rail 133, and the movable adjustment block 134 is connected to an X-axis driving cylinder 135. A Y-axis guide rail 138 is provided on the movable adjustment block 134. Two scanning movable plates 131 are respectively slidably connected to the Y-axis guide rail 138. The two scanning movable plates 131 are connected via a connecting rod mechanism 136, and one of the scanning movable plates 131 is connected to a Y-axis driving cylinder 137. The center point of the connecting rod mechanism 136 is fixed. The connecting rod mechanism 136 cooperates with the Y-axis driving cylinder 137 to realize the synchronous approach or synchronous separation of the two scanning movable plates 131, so that the laser probe 132 can scan wafers of different sizes.

[0012] The wafer fetching mechanism 14 includes two fetching moving plates 141 arranged at intervals up and down, and the two fetching moving plates are respectively connected to independent fetching driving mechanisms, and the fetching translation driving mechanism includes a belt transmission mechanism 142 arranged on both sides of the transport seat 12, and the belt transmission mechanism 142 includes a pulley mechanism and a guide rail arranged on one side of the pulley, and a fetching moving frame 143 is slidably installed on the guide rail, and the fetching moving frame 143 is connected to the belt of the pulley mechanism, and the pulley structure can drive the moving frame 143 to move, thereby realizing the movement of the fetching moving plate 141, and the fetching moving plate 141 is connected to the fetching moving frame 143 by screws, and can be replaced according to different wafer sizes, and the end of the fetching moving plate 141 is a U-shaped structure, and the upper end surfaces of the two ends of the U-shape are respectively provided with suction ports 144. The existence of two fetching moving plates 141 can simultaneously perform the loading and unloading operations of the wafer probe station, thereby improving efficiency.

[0013] The pre-alignment mechanism 3 includes an adjustment turntable 31, the bottom of which is connected to a rotating mechanism and the top of which is provided with a suction port. A wafer barcode reader 32 and a laser sensor 33 are arranged next to the adjustment turntable 31. The wafer barcode reader 32 and the laser sensor 33 are installed on the same adjustable bracket 34. The lower part of the adjustable bracket 34 is slidably connected to a linear guide rail 35 and is connected to an adjusting cylinder 36. The wafer barcode reader 32 and the laser sensor 33 can be adjusted in position according to wafers of different sizes.

[0014] A cache mechanism 4 is provided on one side of the pre-alignment mechanism 3. The cache mechanism 4 includes a cache rack 41. The cache rack 41 is composed of multiple layers of cache plates 42. Each layer of cache plates 42 is provided with support bars 43 and suction cups 44. The pre-aligned wafers can be placed on the cache plates 42 for caching.

[0015] See Figure 10-14 As shown, the wafer detection equipment 5 includes an equipment cover 51, the lower half of the equipment cover 51 is a casting frame 54, and a foot 56 is installed at the bottom. A column 55 is installed on the casting frame 54, and a cover mechanism is installed on the column 55. The cover mechanism includes a cover fixing 514 and a top cover 515. The top cover 515 is a flip-up structure, and a mounting hole is opened in the middle of the top cover 515. The probe chuck 517 is installed at the mounting hole through the chuck fixing 516. A probe circuit board is arranged on the probe chuck 517. The top cover 515 can be flipped up to open, and the probe chuck 517 can also be replaced according to different wafers.

[0016] A detection platform 52 is arranged in the equipment cover 51, and a moving platform 53 connected to the X-axis and Y-axis driving mechanisms is arranged on the detection platform 52. The X-axis and Y-axis driving mechanisms include a Y-axis guide rail 59 fixed to the detection platform 52, a lower moving seat 522 slidably connected to the Y-axis guide rail 59, and an X-axis guide rail 58 fixed to the lower moving seat 522. The moving platform 53 is slidably connected to the X-axis guide rail 58, and the lower moving seat 522 and the moving platform 53 are respectively connected to corresponding screw driving mechanisms, so that displacement adjustment in the X-axis and Y-axis directions can be realized.

[0017] A lifting platform connected to a Z-axis lifting mechanism and a lower visual camera 512 are installed on the movable platform 53. The Z-axis lifting mechanism includes a Z-axis screw drive mechanism 523 and a Z-axis guide rail 57 arranged between the lifting platform and the movable platform 53; a wafer adsorption platform 511 is installed on the lifting platform, and an upper visual camera 520 installed on a camera bracket 521 is arranged above the wafer adsorption platform 511. The camera bracket 521 is connected to a transverse driving mechanism 519. The transverse driving mechanism 519 adopts a screw drive mechanism and is installed on an upper visual fixing frame 518. The upper visual fixing frame 518 is installed on the casting frame 54, and a dotting device is also installed on the camera bracket 521.

[0018] In order to achieve fine adjustment of the wafer angle in the planar direction, the wafer adsorption platform 511 is rotatably connected to the lifting platform and connected to the θ-axis rotation drive mechanism 510, so that the wafer adsorption platform 511 can be rotated to an appropriate angle to align the wafer.

[0019] Generally, wafers are placed on the wafer adsorption platform 511 by bottom adsorption. Therefore, three ejector pin holes 524 are opened on the wafer adsorption platform 511. Retractable ejector pins are arranged in the ejector pin holes 524. When the wafer is sent over, the ejector pins rise and exceed the thickness of the robot that adsorbs the wafer, so that the wafer can be smoothly supported on the ejector pins. After the robot moves away, the ejector pins fall, and the wafer can fall steadily on the wafer adsorption platform 511 for adsorption.

[0020] A needle grinding platform 513 is also installed on the moving platform 53 to clean the probes on the probe circuit board.

[0021] The wafer taking detection process is as follows: after the cover of the wafer box 6 is opened, the rotating table 11 is raised and lowered to a suitable height, and the scanning moving plate 131 is extended. According to the raising and lowering of the rotating table 11, the laser probe 132 completes the scanning operation of all the wafers in the wafer box 6 to determine the number and position of the wafers in the wafer box; after the scanning is completed, one of the wafer taking moving plates 141 is extended to take the wafer out of the wafer box, and then the rotating table 11 is rotated to align the wafer with the direction of the pre-alignment mechanism 3, and the wafer taking moving plate 141 is arranged on the rotating table 11. Close the wafer and place it on the adjustment turntable 31. Adjust the cylinder 36 to drive the adjustable bracket 34 so that the wafer reader 32 and the laser sensor 33 are located at the appropriate scanning position. The adjustment turntable 31 can rotate after adsorbing the wafer. The laser sensor 33 captures the laser through the notch on the wafer and obtains the position information of the wafer through calculation. After the wafer position information is determined, rotate it a certain angle so that the wafer code is under the wafer reader 32. The wafer reader 32 reads the wafer code to achieve traceability of the wafer. After the pre-alignment is completed, the wafer taking movable plate 141 takes the wafer off the adjustment turntable 31. After the turntable rotates a certain angle, the wafer is fed into the direction of the wafer detection equipment 5 from the feed port A; if there is a tested wafer on the detection platform 52 in the equipment cover 51, the wafer is first taken out by another empty wafer taking movable plate 141, and then the wafer to be tested is placed on it. After the wafer is placed, the wafer taking movable plate 141 retracts. If this wafer needs to be cached, it can be placed on the cache plate 42 of the cache rack 41, and the laser probe 132 senses the cache status of each layer; if the wafer does not need to be cached, the wafer is placed in the empty space of the wafer box, and a wafer taking and placing workflow is completed. After the wafer is adsorbed on the wafer adsorption platform 511, the inspection can begin. The upper visual camera 520 moves to the top of the wafer, captures the position information of the wafer mark point, and generates a wafer MAP. At the same time, the lower visual camera 512 moves to the bottom of the probe chuck 517 and the dotting device, captures the position of the probe and the dotting device, and compares them with the position coordinates of the wafer to generate a complete position coordinate system. The XY two-axis drive mechanism moves the wafer adsorption platform 511 to the inspection position with the wafer according to the generated wafer MAP. The Z-axis lifting mechanism drives the wafer adsorption platform 511 to rise, so that the chip pins (PAD) on the wafer contact the probe. The test machine connected to the probe chuck 517 measures the electrical properties and other parameters of each chip. The industrial computer generates the inspection result map of all chips on the wafer according to the inspection results. Then, the wafer adsorption platform 511 moves to the bottom of the dotting device, and the dotting device marks the defective chips on the wafer. After the inspection is completed, the wafer removal moving plate 141 removes the wafer from the wafer adsorption platform 511 and returns it to the wafer box 6 or the buffer rack 41 .

Claims

1. A wafer transmission and electrical performance detection system, characterized in that: It includes wafer transmission equipment and wafer detection equipment, characterized in that the wafer transmission equipment includes a wafer loading and feeding mechanism, a wafer conveying mechanism, and a pre-alignment mechanism, the wafer conveying mechanism includes a rotating table, the rotating table is connected to a lifting drive mechanism, a conveying seat is fixed on the rotating table, a wafer scanning mechanism and a wafer fetching mechanism are installed on the conveying seat, the wafer scanning mechanism includes a laser probe installed on a scanning moving plate, the scanning moving plate is connected to an XY two-axis drive mechanism, the wafer fetching mechanism includes a fetching moving plate, the fetching moving plate is connected to a fetching translation drive mechanism, and an adsorption port is provided on the end surface of the end of the fetching moving plate; the pre-alignment mechanism includes a wafer fetching moving plate, the wafer ... lifting drive mechanism, and an adsorption port is provided on the end surface of the end of the wafer fetching moving plate; the pre-alignment mechanism includes a wafer fetching moving plate, the wafer fetching moving plate is connected to a lifting drive mechanism, and an adsorption port is provided on the end surface of the pre-alignment mechanism. The invention discloses an adjusting turntable, wherein the bottom of the adjusting turntable is connected to a rotating mechanism, and the top is provided with an adsorption port, and a wafer code reader and a laser sensor are arranged next to the adjusting turntable; the wafer detection equipment comprises an equipment cover, and a detection platform is arranged in the equipment cover, and a moving platform connected to an XY two-axis driving mechanism is arranged on the detection platform, and a lifting platform connected to a Z-axis lifting mechanism and a lower visual camera are installed on the moving platform, and a wafer adsorption platform is installed on the lifting platform, and a probe chuck is installed on the top cover plate of the equipment cover, and a probe circuit board is arranged on the probe chuck, and an upper visual camera is arranged above the wafer adsorption platform, and the upper visual camera is connected to the transverse driving mechanism.

2. A wafer transmission and electrical performance detection system according to claim 1, characterized in that: The film sweeping movable plate includes two symmetrically arranged plates, the XY two-axis driving mechanism includes an X-axis guide rail installed on the transport seat, a movable adjustment block slidably connected to the X-axis guide rail, the movable adjustment block is connected to the X-axis driving cylinder, and a Y-axis guide rail is arranged on the movable adjustment block. The two film sweeping movable plates are respectively slidably connected to the Y-axis guide rail, the two film sweeping movable plates are connected by a connecting rod mechanism, and one of the film sweeping movable plates is connected to the Y-axis driving cylinder.

3. A wafer transmission and electrical performance detection system according to claim 1, characterized in that: The wafer picking mechanism includes two wafer picking movable plates arranged at intervals in the upper and lower parts, the two wafer picking movable plates are respectively connected to independent wafer picking driving mechanisms, the ends of the wafer picking movable plates are U-shaped structures and the upper end surfaces at both ends of the U are respectively provided with the adsorption ports.

4. A wafer transmission and electrical performance detection system according to claim 1, characterized in that: The film-taking translation driving mechanism includes a belt transmission mechanism arranged on both sides of the transport seat, and the belt transmission mechanism includes a pulley mechanism and a guide rail arranged on one side of the pulley. A film-taking mobile frame is slidably installed on the guide rail and the film-taking mobile frame is connected to the belt of the pulley mechanism. The film-taking mobile plate is connected to the film-taking mobile frame by screws.

5. The wafer transmission and electrical performance detection system according to claim 1, characterized in that: The wafer loading and feeding mechanism includes a feeding seat, a feeding platform is installed on the feeding seat, a side bracket is installed on the side of the feeding seat close to the wafer transport mechanism, a pneumatic door that can be moved horizontally and raised and lowered is installed on the side bracket, a rotating unlocking buckle and a vacuum suction cup are installed on the pneumatic door, and a cover shell that can be raised and lowered is installed on the feeding seat.

6. The wafer transmission and electrical performance detection system according to claim 1, characterized in that: The wafer code reader and the laser sensor are installed on the same adjustable bracket, and the lower part of the adjustable bracket is slidably connected to a linear guide rail and is connected to an adjusting cylinder.

7. The wafer transmission and electrical performance detection system according to claim 1, characterized in that: A cache mechanism is disposed on one side of the pre-alignment mechanism. The cache mechanism comprises a cache rack. The cache rack is composed of multiple layers of cache plates. Support bars and suction cups are disposed on each layer of the cache plates.

8. The wafer transmission and electrical performance detection system according to claim 1, characterized in that: At least three ejector pin holes are provided on the wafer adsorption platform, and retractable ejector pins are arranged in the ejector pin holes. The wafer adsorption platform is rotatably connected to the lifting platform and is connected to a θ-axis rotation driving mechanism.

9. The wafer transmission and electrical performance detection system according to claim 1, characterized in that: The top cover plate is a flip cover structure, a mounting hole is provided in the middle of the top cover plate, and the probe chuck is mounted at the mounting hole through a chuck fixing piece.

10. The wafer transmission and electrical performance detection system according to claim 1, characterized in that: The second XY two-axis driving mechanism includes a second Y-axis guide rail fixed to the detection platform, a lower moving seat slidably connected to the second Y-axis guide rail, and a second X-axis guide rail fixed to the lower moving seat. The moving platform is slidably connected to the second X-axis guide rail, and the lower moving seat and the moving platform are respectively connected to corresponding screw drive mechanisms. The Z-axis lifting mechanism includes a Z-axis screw drive mechanism and a Z-axis guide rail arranged between the lifting platform and the moving platform; the lateral movement drive mechanism is a screw drive mechanism, the upper visual camera is installed on the camera bracket and connected to the screw drive mechanism, a dotting device is also installed on the camera bracket, and a needle grinding table is also installed on the moving platform.

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