Circuit board defect repairing method

Abstract

The invention discloses a circuit board defect repairing method, which comprises the following steps of: 1, scanning a circuit board, and identifying a defect position on the circuit board to obtain scanning file data; step 2, data comparison: comparing the scanning file data with preset file data of the circuit board to obtain defect position file data; 3, data conversion: converting the defect position file data into CCD edge milling data; and step 4, defect repair: according to the CCD edge milling data, the edge milling function of the CCD milling machine is utilized to mill off the defect position on the circuit board. Scanning file data are obtained by scanning the circuit board, then defect position file data obtained by comparing preset file data of the circuit board are converted into CCD edge milling data, and finally defect positions are milled off by a CCD milling machine. By means of the method, short circuits (residual copper, residual wires and the like) on the circuit board can be repaired, and therefore scrapping of the PCB in the manufacturing process is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing technology, and in particular to a circuit board defect repair method. Background Art

[0002] As a basic component of electronic equipment, printed circuit boards are the transmission carriers of current and signals. They play a vital role in electronic equipment, so higher requirements are placed on printed circuit boards.

[0003] However, during the PCB manufacturing process, circuit boards often have defects such as short circuits, incomplete etching, residual copper, and residual wires. The main way to repair these existing defects is to use a blade to manually repair them. However, for areas with large short circuit areas or large copper areas, manual repair is difficult or impossible. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a circuit board defect repair method, which can repair a circuit board with large area defects, thereby reducing the scrap rate of circuit board products.

[0005] According to the circuit board defect repairing method of the embodiment of the present invention, the circuit board defect repairing method comprises the following steps:

[0006] Step 1: Scan the circuit board, identify the defect location on the circuit board, and obtain scanned file data;

[0007] Step 2: Compare the data, compare the scanned file data with the preset file data of the circuit board to obtain the defect location file data;

[0008] Step 3: Convert data, convert the defect location file data into CCD edge milling data; and

[0009] Step 4: Defect repair: according to the CCD milling data, the defect position on the circuit board is milled out by using the milling function of the CCD milling machine.

[0010] The circuit board defect repair method according to the embodiment of the present invention has at least the following beneficial effects: scanning file data is obtained by scanning the circuit board, and then the preset file data of the circuit board is compared to obtain defect position file data, and then the defect data is converted into CCD milling data, and finally the defect position on the circuit board is milled out by using the milling function of the CCD milling machine. This repair method is suitable for some defects with large short circuit / multi-copper areas and difficult to repair manually. Through this method, short circuits (residual copper, residual wires, etc.) on the circuit board can be repaired, thereby effectively reducing the scrapping of PCB boards during the manufacturing process.

[0011] According to some embodiments of the present invention, step three includes the following steps:

[0012] Process data adjustment: adjust the process parameters of CCD edge milling according to the defect location file data;

[0013] Generating milling edge data: Based on the adjusted process parameters, using industrial software to generate the CCD milling edge data for guiding the operation of the CCD milling machine; and

[0014] Importing milling data: importing the CCD milling data into the CCD milling machine.

[0015] According to some embodiments of the present invention, the step three further includes the following steps: obtaining the copper thickness of the circuit board, and adjusting the depth control milling parameters of the CCD milling machine according to the copper thickness of the circuit board.

[0016] According to some embodiments of the present invention, step one includes scanning the circuit board for appearance defects using AOI equipment.

[0017] According to some embodiments of the present invention, the subsequent process of step four further includes the following steps: using AOI equipment to scan the circuit board again to confirm the defect location.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0021] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0022] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0023] According to the circuit board defect repair method of the embodiment of the present invention, the circuit board defect repair method includes the following steps: step one: scan the circuit board, identify the defect position on the circuit board, and obtain scan file data; step two: compare data, compare the scan file data with the circuit board preset file data, and obtain defect position file data; step three: convert data, convert the defect position file data into CCD milling data; and step four: defect repair, according to the CCD milling data, use the milling function of the CCD milling machine to mill off the defect position on the circuit board.

[0024] Specifically, the following is a description of the detailed implementation of the method provided by the embodiment of the present invention:

[0025] Step 1: Scan the board to identify defect locations. First, use a high-precision scanner to perform a comprehensive scan of the board. The scanner should have high resolution and deep scanning capabilities to ensure that all details on the board, including tiny defects, can be captured. During the scanning process, the scanner will generate a detailed image of the board and automatically identify potential defect locations through the built-in image recognition algorithm. These defects may include but are not limited to short circuits, unclean etched areas, residual copper fragments, and wire residues. After the scan is completed, the system will generate a scan file containing defect information.

[0026] Step 2: Compare data and locate defects. Next, compare the scanned file data obtained in step 1 with the preset file data of the circuit board. The preset file data is the original data when the circuit board is designed, including all the expected circuit paths, connection points and non-circuit areas. Through advanced image processing and data analysis technology, the system can accurately match the scanned file with the preset file to accurately locate the specific location of each defect. The output of this step is a detailed defect location file data, which clearly marks all defective areas that need to be repaired.

[0027] Step 3: Convert data and prepare for repair. Subsequently, the defect location file data is converted into milling edge data suitable for CCD milling machines. This conversion process involves converting information such as the coordinates, shape and size of the defect location into an instruction format that the milling machine can understand and execute. During the conversion process, parameters such as the size, shape and milling depth of the milling cutter must also be considered to ensure the accuracy and efficiency of the repair process. After the conversion is completed, the CCD milling edge data obtained will be directly used to guide subsequent defect repair work.

[0028] Step 4: Repair defects and restore the function of the circuit board. Finally, according to the CCD milling data generated in step 3, the milling function of the CCD milling machine is used to accurately mill the defective position on the circuit board. The CCD milling machine is equipped with a high-precision positioning system and a stable milling mechanism to ensure that the milling process is both accurate and efficient. During the milling process, the milling cutter will move along the preset path to accurately remove defective parts, such as short-circuited parts, unclean etched areas, residual copper fragments, and wire residues, thereby restoring the normal circuit structure and function of the circuit board. After the repair is completed, the circuit board will be re-inspected to confirm that all defects have been effectively removed and no new damage or defects have been introduced.

[0029] Therefore, it can be understood that the circuit board defect repair method according to the embodiment of the present invention has at least the following beneficial effects: by scanning the circuit board to obtain the scanned file data, and then comparing the circuit board preset file data, the defect position file data is obtained, and then the defect data is converted into CCD milling data, and finally the defect position on the circuit board is milled out by using the milling function of the CCD milling machine. This repair method is suitable for some defects with large short circuit / multi-copper areas and difficult to repair manually. Through this method, the short circuit (residual copper, residual wires, etc.) on the circuit board can be repaired, thereby effectively reducing the scrapping of PCB boards during the manufacturing process.

[0030] Furthermore, in some embodiments of the present invention, step three includes the following steps: process data adjustment: adjusting the process parameters of CCD milling according to the defect position file data; generating milling data: based on the adjusted process parameters, using industrial software to generate CCD milling data for guiding the operation of the CCD milling machine; and importing milling data: importing the CCD milling data into the CCD milling machine.

[0031] Specifically, step three is further refined into the following sub-steps to ensure the accuracy and effectiveness of the CCD milling process:

[0032] Process data adjustment: Before converting the defect location file data into CCD milling data, the process parameters of CCD milling need to be adjusted first. This adjustment process is based on the defect type, location, size and material characteristics of the circuit board provided in the defect location file data. The process parameters may include milling speed, milling depth, milling cutter type, milling path, etc. The purpose of the adjustment is to ensure that the milling process can accurately remove the defective part without causing unnecessary damage to other parts of the circuit board.

[0033] Generate milling data: After completing the process parameter adjustment, the next step is to use professional industrial software to generate CCD milling data for guiding the CCD milling machine. The software can automatically generate milling data including milling path, speed, depth and other instructions based on the adjusted process parameters and defect location file data. The generated data usually exists in the form of CNC code, which can be directly read and executed by the CCD milling machine.

[0034] Import milling data: Finally, the generated CCD milling data is imported into the CCD milling machine. This process is usually completed through the control system of the milling machine, which reads the instructions in the milling data and converts them into mechanical actions that the milling machine can understand and execute. After the import is completed, the milling machine can perform precise milling repairs on the defective positions on the circuit board according to these instructions.

[0035] Furthermore, in some embodiments of the present invention, step three further includes the following steps: obtaining the copper thickness of the circuit board, and adjusting the depth control milling parameters of the CCD milling machine according to the copper thickness of the circuit board. Specifically, step three further includes the following key sub-steps to ensure that the copper thickness of the circuit board is taken into account during the repair process, thereby achieving more accurate milling:

[0036] Get the copper thickness of the circuit board: Before generating CCD milling data, you first need to get the copper thickness information of the circuit board. This information can be obtained by using special measuring tools or equipment, such as using a copper thickness gauge to perform non-destructive measurement on the circuit board. Copper thickness is an important parameter of the circuit board, which directly affects the depth control setting of the milling cutter during the milling process. Adjust the depth control milling parameters of the CCD milling machine according to the copper thickness: After obtaining the copper thickness information of the circuit board, you need to adjust the depth control milling parameters of the CCD milling machine according to this information. The depth control milling parameter refers to the depth that the milling cutter cuts into the circuit board during the milling process, which directly affects the quality and effect of the milling. By adjusting the depth control milling parameters, it can be ensured that the milling cutter can completely remove the defective parts during the milling process, and will not cut too deep and damage other parts of the circuit board.

[0037] During the specific adjustment process, different milling depths can be set according to the different copper thicknesses. For example, for a circuit board with a thicker copper thickness, the milling depth can be appropriately increased to ensure that the defective part is completely removed; while for a circuit board with a thinner copper thickness, the milling depth needs to be reduced to avoid cutting too deep and damaging the circuit board.

[0038] In some embodiments of the present invention, the specific implementation of step 1 further includes using AOI (Automated Optical Inspection) equipment to scan the appearance defects of the circuit board. The following is a detailed implementation of this step:

[0039] Scanning the circuit board with AOI equipment: In step 1, in order to identify the defect location on the circuit board, AOI equipment is used for scanning. AOI equipment is a high-precision optical inspection equipment that can automatically scan and inspect the surface of the circuit board and identify various appearance defects.

[0040] Identify appearance defects: During the scanning process, the AOI device captures the surface image of the circuit board and analyzes the image through the built-in image processing algorithm. Through analysis, the device can automatically identify appearance defects on the circuit board, such as short circuits, incomplete etching, residual copper, wire residue, etc. These defects will show specific shapes, colors and texture features in the image, allowing the device to accurately identify them.

[0041] Generate scanned files: After identifying defects, the AOI equipment will generate scanned files containing defect information. These files usually include detailed information such as the location, type, size, and image of the defect, providing an accurate basis for subsequent defect repair.

[0042] In some embodiments of the present invention, the subsequent process of step 4 further includes the following steps: using AOI equipment to scan the circuit board again to confirm the defect location.

[0043] Specifically, in the subsequent process of step 4, the AOI equipment is used to scan the circuit board again to confirm the defect location. The following is a detailed implementation of the subsequent process:

[0044] Use AOI equipment to scan the circuit board again: After completing the defect repair in step 4, in order to confirm the repair effect, it is necessary to use AOI equipment to scan the circuit board again. The purpose of this step is to verify whether the previously identified defect location has been correctly repaired through high-precision optical inspection.

[0045] Confirm the defect location: During the re-scanning process, the AOI device will capture the surface image of the circuit board and analyze the image through the image processing algorithm. The device will compare the scan results with the previous scan file data to confirm whether the previously identified defect location has been completely removed or repaired. If the defect location still exists or the repair is incomplete, the device will give a corresponding prompt for further repair or adjustment.

[0046] Furthermore, generate a confirmation report: After the confirmation is completed, the AOI equipment can also generate a confirmation report, which includes the scanning results of the circuit board, the confirmation of the defect location and the evaluation of the repair effect. This report provides important data support for subsequent quality control and process improvement.

[0047] Through the above implementation, the present invention introduces the re-scanning of the AOI equipment and the defect location confirmation step in the subsequent process of step 4. The introduction of this method ensures the accuracy and reliability of the repair effect and improves the production quality and yield of the circuit board. At the same time, by generating a confirmation report, it also provides strong data support for subsequent quality control and process improvement.

[0048] The embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A circuit board defect repair method, characterized in that: The following steps are involved: Step 1: Scan the circuit board, identify the defect location on the circuit board, and obtain scanned file data; Step 2: Compare the data, compare the scanned file data with the preset file data of the circuit board to obtain the defect location file data; Step 3: Convert data, convert the defect location file data into CCD edge milling data; and Step 4: Defect repair: according to the CCD milling data, the defect position on the circuit board is milled out by using the milling function of the CCD milling machine.

2. The circuit board defect repair method according to claim 1, characterized in that: The step three comprises the following steps: Process data adjustment: adjust the process parameters of CCD edge milling according to the defect location file data; Generating milling edge data: Based on the adjusted process parameters, using industrial software to generate the CCD milling edge data for guiding the operation of the CCD milling machine; and Importing milling data: importing the CCD milling data into the CCD milling machine.

3. The circuit board defect repair method according to claim 2, characterized in that: The step three also includes the following steps: obtaining the copper thickness of the circuit board, and adjusting the depth control milling parameters of the CCD milling machine according to the copper thickness of the circuit board.

4. The circuit board defect repair method according to claim 1, characterized in that: The step 1 includes using AOI equipment to scan the appearance defects of the circuit board.

5. The circuit board defect repair method according to claim 1, characterized in that: The subsequent process of step 4 also includes the following steps: using AOI equipment to scan the circuit board again to confirm the defect location.