Wafer stage device

By designing a wafer stage device using magnetic fluid structure and electrostatic chuck, the mechanical damage and temperature control problems caused by traditional clamping technology to the wafer are solved, and lower waste rate and better temperature control are achieved Effect.

CN222462871UActive Publication Date: 2025-02-11JIANGSU LEUVEN INSTR CO LTD
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Patent Information

Application Number
CN202323417623.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-14
Publication Date
2025-02-11
Estimated Expiration
2033-12-14

AI Technical Summary

Technical Problem

During the manufacturing process of advanced integrated circuits, traditional wafer clamping technology causes irreparable damage to the wafer due to mechanical reasons such as pressure or collision, resulting in an increase in wafer scrap rate, and the vacuum suction cup cannot be used in low-voltage environments. The wafer is subject to effective temperature control.

Method used

A wafer stage device was designed, using a magnetic fluid structure to separate the internal structure into the vacuum environment side and the atmospheric environment side, and using an electrostatic chuck to fix the wafer through conductive connections to avoid mechanical damage, and achieve the cooling air path. Wafer temperature control.

Benefits of technology

It effectively reduces irreparable damage caused by the wafer due to clamping, reduces the scrap rate, improves the economic benefits of the enterprise, and solves the problem of vacuum suction cups being unable to use and cannot control the wafer temperature in low-voltage environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer carrying table device. The wafer carrying table device comprises a magnetofluid structure, the magnetofluid structure comprises a magnetofluid fixed shaft and a magnetofluid rotating shaft, the magnetofluid rotating shaft is rotationally arranged in a center hole of the magnetofluid fixed shaft, and the magnetofluid fixed shaft divides the internal structure of the wafer carrying table device into a vacuum environment side and an atmospheric environment side. The end, located on the atmospheric environment side, of the magnetofluid rotating shaft can be communicated with an external power source. The electrostatic chuck is conductively connected with one end of the magnetofluid rotating shaft positioned on the vacuum environment side; the cooling gas circuit comprises a first gas circuit arranged on the magnetofluid fixed shaft, a second gas circuit arranged on the magnetofluid rotating shaft and a gas groove formed in the electrostatic chuck, and the first gas circuit, the second gas circuit and the gas groove are sequentially communicated. According to the wafer carrying table device, the wafer is fixed through the adsorption effect of the electrostatic chuck, irreparable damage to the wafer is avoided, heat on the wafer can be conducted out through airflow flowing through the back face of the wafer, and the effect of cooling the wafer is achieved.
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Citation Information

Cited By

  • Carrying table mechanism and coating equipment

    CN122013132A

  • Carrying mechanism and coating equipment

    CN122013132B