Island rigid-flex board manufacturing method and island rigid-flex board

Abstract

The invention discloses a manufacturing method of an island rigid-flex printed circuit board and the island rigid-flex printed circuit board. The manufacturing method comprises the following steps: step 1, pasting a PI film on one surface of a prepreg; 2, milling through the PI film along a first preset path, wherein the first preset path is matched with the outline of the flexible area; 3, PI films in the rigid area and the waste area are removed; and 4, milling through the prepreg along a second preset path, wherein the second preset path is matched with the contour of the rigid area. And removing the PI film in the rigid area and the waste area and then retaining the PI film. The PI film on the reserved flexible area isolates the prepreg from the flexible area of the flexible plate, so that prepreg-free bonding of the flexible area of the flexible plate is realized; and the prepreg is milled through along the second preset path, the isolated rigid area in the flexible area can be milled out, blanking of the uncovering procedure after lamination is conveniently achieved, and therefore the prepreg of the isolated rigid-flexible combined area on the flexible area is reserved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a manufacturing method of an isolated rigid-flexible board and an isolated rigid-flexible board. Background Art

[0002] With the continuous advancement of social science and technology, the requirements for printed circuit boards are getting higher and higher, especially the requirements for the size of printed circuit boards are getting smaller and smaller, and the functions they perform are required to be more powerful.

[0003] In order to meet the needs of the high-end market in terms of both functionality and volume, a rigid-flexible printed circuit board with an isolated rigid circuit board has been derived. The main structural feature of this circuit board is that the rigid circuit board is isolated in the flexible area. Since the flexible area has an isolated rigid-flexible combination area, the adhesive layer in the isolated rigid-flexible combination area is difficult to process, making the production of this circuit board extremely difficult. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing an isolated rigid-flexible board, which can be used to manufacture a rigid-flexible printed circuit board with an isolated rigid circuit board.

[0005] The present invention also provides an isolated rigid-flexible board manufactured by adopting the manufacturing method of the isolated rigid-flexible board.

[0006] According to the method for manufacturing an isolated rigid-flexible board according to the first aspect of the present invention, the method for manufacturing an isolated rigid-flexible board comprises the following steps:

[0007] Step 1: Grafting a PI film, pasting the PI film on one side of the prepreg after cutting, the prepreg having a rigid area, a flexible area and a waste area, and the side is a contact surface with the flexible board;

[0008] Step 2: Performing controlled depth milling once to mill through the PI film along a first preset path, wherein the first preset path coincides with the contour of the flexible area;

[0009] Step 3: removing the PI film, removing the PI film in the rigid area and the waste area; and

[0010] Step 4: secondary controlled depth milling, milling through the prepreg along a second preset path, wherein the second preset path coincides with the contour of the rigid region.

[0011] According to the method for manufacturing an isolated rigid-flexible board of an embodiment of the present invention, there are at least the following beneficial effects: the PI film is milled through along the first preset path, so that the PI film in the rigid area and the waste area can be removed, and the PI film on the flexible area can be retained. When the prepreg is stacked on the flexible board, the PI film retained on the flexible area can separate the prepreg from the flexible area of ​​the flexible board, so that the flexible area of ​​the flexible board is not bonded with the prepreg; and in the secondary controlled depth milling, the prepreg is milled through along the second preset path, so that the rigid area on the prepreg, including the isolated rigid-flexible area in the flexible area, can be milled out, so as to facilitate the blanking of the cover opening process after lamination, so as to retain the prepreg in the isolated rigid-flexible area on the flexible area, that is, the bonding layer of the isolated rigid-flexible area.

[0012] According to some embodiments of the present invention, the step 2 further includes the following steps: milling an alignment hole, wherein the alignment hole is milled out at a preset position of the prepreg.

[0013] According to some embodiments of the present invention, in step 4, the secondary controlled depth milling performs jump milling on the prepreg along the second preset path, and the jump milling interval is 0.7-1.3 mm.

[0014] According to some embodiments of the present invention, the method further includes step five: making a rigid board and step six: making a flexible board.

[0015] According to some embodiments of the present invention, step five includes the following steps: cutting of the rigid board, circuit fabrication of the rigid board, and browning of the rigid board.

[0016] According to some embodiments of the present invention, the step six includes the following steps: cutting of the flexible board, circuit fabrication of the flexible board, grafting of the cover film, and browning of the flexible board.

[0017] According to some embodiments of the present invention, the following steps are also included:

[0018] Step 7: Laminating the flexible board, the prepreg and the rigid board according to the preset lamination requirements;

[0019] Step eight, pressing, laminating the stacked flexible board, the prepreg and the rigid board to obtain a main board structure.

[0020] According to some embodiments of the present invention, step eight further includes performing several post-processing steps on the mainboard structure.

[0021] According to some embodiments of the present invention, the post-processing step includes the following steps: drilling, electroplating, circuit fabrication, solder masking, surface treatment, decapping, molding, inspection, and packaging.

[0022] According to the rigid-flexible board of the second aspect embodiment of the present invention, the rigid-flexible board is manufactured by the method for manufacturing an isolated rigid-flexible board described in any one of the embodiments of the first aspect above, and the rigid-flexible board has a plurality of isolated rigid circuit boards, and the isolated rigid circuit boards are arranged in the flexible area of ​​the rigid-flexible board.

[0023] The rigid-flexible board according to the embodiment of the present invention has at least the following beneficial effects: the rigid-flexible printed circuit board with an isolated rigid circuit board can meet the high-end market requirements for both volume and performance.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 It is a schematic diagram of cutting a prepreg according to the first aspect of the present invention;

[0027] Figure 2 for Figure 1 Schematic diagram of the prepreg grafted to the PI film;

[0028] Figure 3 A schematic diagram of a trajectory of a first preset path according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of a prepreg in step 3 of an embodiment of the present invention;

[0030] Figure 5 A schematic diagram of a trajectory of a second preset path according to an embodiment of the present invention;

[0031] Figure 6 The isolated rigid-flex board of the second embodiment of the present invention;

[0032] Figure 7 for Figure 6 A cross-sectional schematic diagram of an isolated rigid-flex board is shown.

[0033] Reference numerals:

[0034] Prepreg 1; PI film 2; rigid area 3; flexible area 4; waste area 5; first preset path 6; second preset path 7; alignment hole 8; rigid board 9; flexible board 10. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0038] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0039] Reference Figures 1 to 7 According to the method for manufacturing an isolated rigid-flexible board according to the first aspect of the present invention, the method for manufacturing an isolated rigid-flexible board comprises the following steps: referring to Figure 1 To Figure 3, step 1: grafting PI film 2, attaching PI film 2 on one side of the prepreg 1 after cutting, the prepreg 1 has a rigid area 3, a flexible area 4 and a waste area 5, and the side is the contact surface with the flexible board 10; refer to Figure 3 to Figure 4 , Step 2: One-time controlled depth milling, milling through the PI film 2 along the first preset path 6, the first preset path 6 coincides with the contour of the flexible area 4; refer to Figure 4 , step three: removing the PI film 2, removing the PI film 2 in the rigid area 3 and the waste area 5; and referring to Figures 5 and 6, Step 4: Secondary controlled depth milling, milling through the prepreg 1 along the second preset path 7 , the second preset path 7 coincides with the contour of the rigid region 3 .

[0040] Specifically, the method for manufacturing an isolated rigid-flexible board provided by the present invention comprises the following steps:

[0041] Graft the PI film 2 and prepare the semi-cured sheet 1 after cutting. The semi-cured sheet 1 has a predetermined size and shape and includes a rigid area 3, a flexible area 4 and a waste area 5. A PI (polyimide) film is attached to one side of the semi-cured sheet 1. This side is the contact surface with the flexible board 10. The selection of the PI film 2 should ensure that it has good adhesion and heat resistance to adapt to the subsequent processing steps. Use appropriate pasting technology, such as hot pressing or vacuum bonding, to ensure that the PI film 2 is tightly attached to the semi-cured sheet 1 without bubbles or wrinkles.

[0042] A controlled depth milling is performed to set the first preset path 6 according to the contour of the flexible area 4. The path should accurately match the shape and size of the flexible area 4. Use a CNC milling machine or a laser milling machine or similar precision processing equipment to perform controlled depth milling along the first preset path 6. The purpose of this step is to mill through the PI film 2 but not the prepreg 1. Monitoring the milling depth can ensure that only the PI film 2 is milled through, avoiding any unnecessary cutting or damage to the prepreg 1.

[0043] Remove the PI film 2. After completing a controlled depth milling, remove the PI film 2 on the rigid area 3 and the waste area 5. Use appropriate tools or chemical methods, such as peeling or dissolving, to ensure that the PI film 2 is completely removed from these two areas, so that the PI film 2 in the flexible area 4 is retained. When used for subsequent lamination, the prepreg 1 and the flexible board 10 are isolated by the PI film 2, so that the prepreg 1 in the flexible area 4 is not bonded. The subsequent process also includes cleaning the working area to ensure that there are no residual PI film 2 fragments or impurities.

[0044] Secondary controlled depth milling, according to the contour of the rigid area 3, set the second preset path 7. This path should accurately match the shape and size of the rigid area 3. Use CNC milling machines or laser milling machines and other similar precision processing equipment again to perform controlled depth milling along the second preset path 7. The purpose of this step is to mill through the semi-cured sheet 1. It should be emphasized that the second preset path 7 is not a continuous cut. The purpose is also to mill through part of the semi-cured sheet 1 while retaining the connection between some semi-cured sheets 1, which can ensure that in subsequent processes, the semi-cured sheet 1 in the rigid area 3 (including the isolated rigid area 3 in the flexible area 4) is retained between the rigid board 9 and the flexible board 10. Therefore, the structure of the rigid area 3 of the isolated rigid-flexible board is formed by secondary controlled depth milling, which also includes one or more isolated rigid areas 3 in the flexible area 4. Monitor the milling depth to ensure that the milling process is precisely controlled to achieve the required shape and size of the rigid-flexible board.

[0045] Through the above steps, the present invention provides an effective method for manufacturing an isolated rigid-flexible board, which can accurately control the attachment and removal of the PI film 2 and the milling of the prepreg 1, thereby facilitating the production of the prepreg 1 on the isolated island in the isolated rigid-flexible board.

[0046] Therefore, it can be understood that the method for manufacturing an isolated rigid-flexible board according to an embodiment of the present invention has at least the following beneficial effects: the PI film 2 is milled through along the first preset path 6, so that the PI film 2 in the rigid area 3 and the waste area 5 can be removed, and the PI film 2 on the flexible area 4 can be retained. When the semi-cured sheet 1 is stacked on the flexible board 10, the PI film 2 on the flexible area 4 that is retained can separate the semi-cured sheet 1 from the flexible area 4 of the flexible board 10, so that the flexible area 4 of the flexible board 10 is not bonded with the semi-cured sheet 1; and in the secondary controlled depth milling, the semi-cured sheet 1 is milled through along the second preset path 7, and the rigid-flexible bonding area on the semi-cured sheet 1, including the isolated rigid-flexible bonding area in the flexible area, can be milled out, so as to facilitate the blanking of the cover opening process after lamination, thereby retaining the semi-cured sheet 1 in the isolated rigid-flexible bonding area on the flexible area 4, that is, the bonding layer of the isolated rigid-flexible bonding area.

[0047] Further, refer to Figure 3 as well as Figure 4In some embodiments of the present invention, step 2 also includes the following steps: milling through the alignment hole 8, and milling out the alignment hole 8 at the preset position of the semi-cured sheet 1. Specifically, step 2 also includes the following specific steps: milling through the alignment hole 8, and marking the position of the alignment hole 8 at the preset position of the semi-cured sheet 1. These positions are predetermined according to the design requirements of the isolated rigid-flexible board to ensure the accuracy of subsequent processing and assembly. Use a CNC milling machine or similar precision processing equipment to mill out the alignment hole 8 at the marked position. This step needs to be performed at the same time or after milling through the PI film 2 to ensure the accuracy and position accuracy of the alignment hole 8. Monitor the milling process to ensure that the diameter, depth and shape of the alignment hole 8 meet the design requirements. The specific requirements are not limited and are subject to the actual product. The quality of the alignment hole 8 is crucial to the subsequent processing steps and the performance of the final product. Clean up the debris and impurities generated by milling to ensure the cleanliness of the area around the alignment hole 8 for subsequent processing and assembly.

[0048] Further, refer to Figure 5 In some embodiments of the present invention, in step 4, the secondary controlled depth milling performs jump milling on the prepreg 1 along the second preset path 7, and the jump milling spacing is 0.7-1.3 mm. In step 4, the specific implementation of the secondary controlled depth milling is as follows: the jump milling operation of the secondary controlled depth milling, before the secondary controlled depth milling, ensure that the prepreg 1 has been processed according to steps 1 to 3, including the steps of grafting PI film 2, primary controlled depth milling, and removing PI film 2. According to the contour of the rigid area 3, the second preset path 7 is set. This path is the basis for milling by a CNC milling machine or similar equipment. When performing the secondary controlled depth milling, the prepreg 1 is milled along the second preset path 7 by jump milling. Jump milling is a special milling method. By maintaining a certain spacing during the milling process, continuous cutting of the material can be avoided, thereby ensuring that the prepreg 1 on the cut rigid area 3 is retained on the prepreg 1, and finally the isolated rigid area 3 in the flexible area 4 The prepreg 1 is obtained, and the prepreg 1 at this location can be used for the lamination of the rigid board 9. The jump milling spacing is set to 0.7-1.3㎜. This spacing is determined based on the design requirements of the island rigid-flex board and the material properties of the prepreg 1 to ensure the stability of the milling process and the quality of the final product. It can also ensure that in the subsequent uncapping process after the pressing plate, the non-continuous jump milling and the jump milling spacing are kept between 0.7-1.3㎜, which can facilitate the removal of waste in the flexible area 4 during the uncapping process. Monitor the milling process to ensure that the jump milling spacing and depth meet the design requirements. At the same time, pay attention to check the surface quality of the prepreg 1 after milling to ensure that there are no cracks, burrs or other defects. Clean up the debris and impurities generated by milling to ensure the cleanliness of the working area for subsequent processing and assembly.

[0049] Furthermore, in some embodiments of the present invention, step 5: making a rigid board 9 and step 6: making a flexible board 10 are also included. The making of the rigid board 9 in step 5 and the making of the flexible board 10 in step 6 can be performed separately and simultaneously, thereby improving production efficiency.

[0050] Specifically, in some embodiments of the present invention, step five includes the following steps: cutting of the rigid board 9, circuit fabrication of the rigid board 9, and browning of the rigid board 9. Step five "fabrication of the rigid board 9" specifically includes the following steps:

[0051] Cutting of rigid board 9, material preparation: Select rigid board 9 materials that meet the design requirements, such as prepreg made of glass fiber cloth impregnated with epoxy resin. Size determination: Determine the cutting size of rigid board 9 according to the final size and design requirements of the isolated rigid-flex board. Cutting: Use precision cutting equipment, such as CNC cutting machine, to cut the rigid board 9 material according to the determined size. Edge trimming: Trim the edges of the cut rigid board 9 to ensure that the edges are flat and burr-free.

[0052] Circuit production and circuit design of rigid board 9: design the circuit pattern on rigid board 9 according to the circuit design requirements. Circuit pattern production: use photolithography or etching technology to produce the designed circuit pattern on rigid board 9. Inspection and correction: check the produced circuit pattern to ensure that the circuit is complete, without open circuit or short circuit, and make necessary corrections.

[0053] Browning of rigid board 9, Browning treatment: Browning treatment is performed on rigid board 9 with circuits to enhance its surface roughness and adhesion with subsequent materials. Cleaning and drying: After the browning treatment, the rigid board 9 is cleaned to remove residues and dried. Quality inspection: The quality of the rigid board 9 after the browning treatment is inspected to ensure that the browning layer is uniform and free of defects.

[0054] By implementing the above steps, the present invention completes the production of the rigid board 9 in the isolated rigid-flexible board.

[0055] Similarly, in some embodiments of the present invention, step six includes the following steps: cutting of the flexible board 10, circuit fabrication of the flexible board 10, grafting of the cover film, and browning of the flexible board 10. Step six "fabrication of the flexible board 10" specifically includes the following steps:

[0056] Cutting of flexible board 10, material preparation: Select flexible board 10 materials that meet the design requirements, such as polyimide (PI) film or polyester (PET) film. Size determination: Determine the cutting size of flexible board 10 according to the final size and design requirements of the isolated rigid-flexible board. Cutting: Use precision cutting equipment, such as CNC cutting machine or die punching machine, to cut the flexible board 10 material according to the determined size. Edge trimming: Trim the edges of the cut flexible board 10 to ensure that the edges are flat and burr-free, and remove any defects caused by the cutting process.

[0057] Circuit production and circuit design of the flexible board 10: Design the circuit pattern on the flexible board 10 according to the circuit design requirements. Circuit pattern production: Use photolithography, etching or printing technology to produce the designed circuit pattern on the flexible board 10. This may include wires, pads, contact points, etc. Inspection and correction: Check the produced circuit pattern to ensure that the circuit is complete, without open circuits or short circuits, and make necessary corrections. This may involve repairing circuit defects or reproducing part of the circuit.

[0058] Grafting cover film, cover film preparation: Select a cover film material suitable for grafting on the flexible board 10, which should have good insulation, heat resistance and adhesion. Grafting process: Graft the cover film precisely on the circuit pattern of the flexible board 10 to protect the circuit and prevent external interference. This may involve methods such as heat pressing, vacuum bonding or chemical bonding. Trimming and cleaning: Trim the grafted cover film, remove excess parts, and clean the surface of the flexible board 10 to ensure the smooth progress of subsequent steps.

[0059] Browning of the flexible board 10, browning treatment: The flexible board 10 with the circuit made and the cover film grafted is browned. This step is to enhance the roughness of the surface of the flexible board 10 and improve its adhesion with subsequent materials. Cleaning and drying: After the browning treatment, the flexible board 10 is cleaned to remove residues and dried to ensure the stability and reliability of the browning layer. Quality inspection: The quality of the flexible board 10 after the browning treatment is inspected to ensure that the browning layer is uniform and defect-free, and that it is firmly bonded to the cover film and the circuit pattern.

[0060] By implementing the above steps, the present invention completes the production of the flexible board 10 in the isolated rigid-flexible board.

[0061] Furthermore, in some embodiments of the present invention, the following steps are also included: Step 7: lamination, laminating the flexible board 10, the prepreg 1 and the rigid board 9 according to the preset lamination requirements; and Step 8: pressing, laminating the laminated flexible board 10, the prepreg 1 and the rigid board 9 to obtain a main board structure. Specifically, the present invention also includes the following two important steps:

[0062] Stacking and preparing materials: Ensure that the flexible board 10, prepreg 1 and rigid board 9 have been manufactured according to the previous steps and that the quality meets the design requirements. Stacking order: Determine the stacking order of the flexible board 10, prepreg 1 and rigid board 9 according to the preset stacking requirements. This order is determined based on the functional requirements and structural design of the isolated rigid-flexible board to ensure the correct docking and electrical connection between the layers. Stacking operation: In a clean working environment, stack the flexible board 10, prepreg 1 and rigid board 9 in sequence according to the determined stacking order. During the stacking process, pay attention to keeping the layers flat and aligned to avoid offset or wrinkles. At the same time, ensure that the side of the prepreg 1 with the PI film 2 faces the flexible board 10, while the other side is attached to the rigid board 9. Fixing and inspection: After the stacking is completed, use appropriate fixing tools or methods to fix the stacked boards together to prevent movement or separation during subsequent processing. At the same time, check the stacked boards to ensure that the alignment between the layers is accurate and there is no misalignment or damage.

[0063] Lamination, preparation of lamination equipment: Select suitable lamination equipment, such as a hot press or a vacuum laminator, and ensure that the equipment is in good working condition. Lamination parameter setting: According to the design requirements and material properties of the isolated rigid-flexible board, set appropriate lamination parameters, including temperature, pressure and time. The setting of these parameters is crucial to ensure the lamination quality and the stability of the motherboard structure. Lamination: Put the stacked flexible board 10, prepreg 1 and rigid board 9 into the lamination equipment and laminate according to the set parameters. During the lamination process, keep the equipment running stably, and pay attention to the lamination to ensure the close bonding between the layers. Cooling and removal: After the lamination is completed, let the lamination equipment cool naturally or forcefully cool to reduce the temperature and fix the motherboard structure. After the temperature drops to a safe range, take out the laminated motherboard structure and perform necessary trimming and cleaning. Quality inspection: Perform quality inspection on the laminated motherboard structure, including appearance inspection, dimensional measurement, and electrical performance testing, to ensure that it meets the design requirements and usage standards.

[0064] Through the implementation of the above steps 7 and 8, the present invention completes the lamination and pressing process of the flexible board 10, the prepreg 1 and the rigid board 9 in the isolated rigid-flexible board. These two steps are key links in the production process of the isolated rigid-flexible board, ensuring the integrity and performance stability of the mainboard structure.

[0065] Further, in some embodiments of the present invention, after step 8, several post-processing steps are also performed on the mainboard structure. The several post-processing steps may be determined by the specific requirements of the product and are specifically limited in this embodiment.

[0066] In some embodiments of the present invention, the post-processing step may include the following steps: drilling, electroplating, circuit fabrication, solder masking, surface treatment, decapping, molding, inspection, and packaging.

[0067] Specifically, the post-processing steps include:

[0068] Drilling: Use precision drilling equipment to drill the required holes on the motherboard structure for subsequent plugging, connection or installation of other components. During the drilling process, ensure that the hole position is accurate, the hole diameter meets the design requirements, and does not cause damage to the motherboard structure.

[0069] Electroplating: The holes after drilling are electroplated to enhance their conductivity and corrosion resistance. The electroplating layer should be uniform, dense, and meet the relevant electrical and mechanical performance requirements.

[0070] Circuit production: Make the required circuit graphics on the surface of the motherboard structure, including wires, pads, vias, etc. Circuit production should use precise technology and equipment to ensure the integrity, clarity and accuracy of the circuit.

[0071] Solder mask: A solder mask is applied to the surface of the motherboard structure to protect the circuit pattern from erosion by the external environment. The solder mask should be uniform, defect-free, and have good insulation and heat resistance.

[0072] Surface treatment: Perform necessary treatment on the surface of the mainboard structure, such as cleaning, decontamination, roughening, etc., to improve its adhesion and solderability with other components. Surface treatment should ensure that the cleanliness and surface quality of the mainboard structure meet the requirements of subsequent processing and use.

[0073] Opening: Along the outline of the flexible area 4 on the mainboard structure, that is, the line of the first preset path 6, mechanical or laser opening is used to remove part of the packaging material in the flexible area 4. In the embodiment of the present invention, the packaging material may include the PI film 2 retained in the flexible area 4 of the prepreg 1, the prepreg 1 in the area, and the rigid board 9 material when stacked under the area. The opening process must ensure that the size, position and shape of the cover or window meet the design requirements and do not affect the overall performance of the mainboard structure.

[0074] Molding: The mainboard structure is molded according to the shape and size requirements of the final product. The molding process must ensure that the shape, size and appearance of the mainboard structure meet the design requirements and do not affect its electrical and mechanical properties. It can be understood that in this process, the waste area 5 on the prepreg 1 can be cut off to obtain the shape of the final product, such as Figure 6 shown.

[0075] Inspection: Conduct a comprehensive inspection of the post-processed motherboard structure, including appearance inspection, dimension measurement, electrical performance test, etc. The inspection process ensures that the quality of the motherboard structure meets the design requirements and usage standards, and promptly detects and repairs any potential problems or defects.

[0076] Packaging: The motherboard structure that has passed the inspection will be packaged to protect it from damage during transportation and storage.

[0077] The packaging material should meet environmental protection requirements and be able to effectively protect the mainboard structure from erosion and damage by the external environment. Through the implementation of the above post-processing steps, the present invention completes the final stage of the production of the isolated rigid-flexible board, ensuring that the quality and performance of the final product meet the design requirements and usage standards.

[0078] Reference Figure 6 to Figure 7 According to the rigid-flex board of the second embodiment of the present invention, the rigid-flex board is manufactured by the manufacturing method of the isolated rigid-flex board of any one of the embodiments of the first aspect, and the rigid-flex board has a plurality of isolated rigid circuit boards, and the isolated rigid circuit boards are arranged in the flexible area 4 of the rigid-flex board. The rigid-flex printed circuit board with the isolated rigid circuit boards can meet the high-end market requirements of volume and performance at the same time.

[0079] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for manufacturing an isolated rigid-flexible board, characterized in that: The following steps are involved: Step 1: Grafting the PI film, pasting the PI film on one side of the prepreg after cutting, the prepreg has a rigid area, a flexible area and a waste area, and the side of the prepreg pasted with the PI film is the contact surface with the flexible board; Step 2: Performing controlled depth milling once to mill through the PI film along a first preset path, wherein the first preset path coincides with the contour of the flexible area; Step 3: removing the PI film, removing the PI film in the rigid area and the waste area; as well as Step 4: secondary controlled depth milling, milling through the prepreg along a second preset path, wherein the second preset path coincides with the contour of the rigid region.

2. The method for manufacturing an isolated rigid-flexible board according to claim 1, characterized in that: The step 2 also includes the following steps: milling through alignment holes, and milling out the alignment holes at preset positions of the prepreg.

3. The method for manufacturing an isolated rigid-flexible board according to claim 1, characterized in that: In the step 4, the secondary controlled depth milling performs jump milling on the prepreg along the second preset path, and the jump milling interval is 0.7-1.3 mm.

4. The method for manufacturing an isolated rigid-flexible board according to claim 1, characterized in that: It also includes step five: making a rigid board and step six: making a flexible board.

5. The method for manufacturing an isolated rigid-flexible board according to claim 4, characterized in that: The step five includes the following steps: cutting of the rigid board, circuit fabrication of the rigid board, and browning of the rigid board.

6. The method for manufacturing an isolated rigid-flexible board according to claim 4, characterized in that: The step six includes the following steps: cutting of the flexible board, circuit production of the flexible board, grafting of the cover film and browning of the flexible board.

7. The method for manufacturing an isolated rigid-flexible board according to claim 4, characterized in that: The following steps are also included: Step 7: Laminating the flexible board, the prepreg and the rigid board according to the preset lamination requirements; Step eight, pressing, laminating the stacked flexible board, the prepreg and the rigid board to obtain a main board structure.

8. The method for manufacturing an isolated rigid-flexible board according to claim 7, characterized in that: After step eight, several post-processing steps are also performed on the mainboard structure.

9. The method for manufacturing an isolated rigid-flexible board according to claim 8, characterized in that: The post-processing steps include the following steps: drilling, electroplating, circuit making, solder masking, surface treatment, decapping, molding, inspection and packaging.

10. An isolated rigid-flex board, characterized in that: The isolated rigid-flexible board is manufactured by the manufacturing method of any one of claims 1 to 9, wherein the isolated rigid-flexible board has a plurality of isolated rigid circuit boards, and the isolated rigid circuit boards are arranged in the flexible area of ​​the rigid-flexible board.

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