Back plate air conditioner heat exchanger, back plate air conditioner and control method

Abstract

The invention provides a backboard air conditioner heat exchanger, a backboard air conditioner and a control method.The backboard air conditioner heat exchanger comprises two or more micro-channel heat exchanger modules which are sequentially arranged from top to bottom, and each micro-channel heat exchanger module is provided with a flat pipe, a liquid distributing pipe communicating with one end of the flat pipe and an air collecting pipe communicating with the other end of the flat pipe; each micro-channel heat exchanger module is provided with an adjusting valve, and each adjusting valve is used for adjusting the liquid inlet flow of the liquid distribution pipe of the corresponding micro-channel heat exchanger module. According to the technical scheme, the liquid inlet flow of the liquid distribution pipe of the corresponding micro-channel heat exchanger module can be adjusted through the adjusting valve, so that the heat exchange efficiency of each micro-channel heat exchanger module is adjusted, and the purpose of adjusting the air outlet temperature of each micro-channel heat exchanger module is achieved; and the upper and lower air outlet temperature difference of the back plate air conditioner heat exchanger can be further reduced by controlling the adjusting valves, so that the upper and lower air outlet temperatures of the back plate air conditioner are more uniform.

Description

Technical Field

[0001] The present invention belongs to the technical field of backboard air conditioners, and in particular relates to a backboard air conditioner heat exchanger, a backboard air conditioner and a control method. Background Art

[0002] At present, with the rapid development of computer technology, the heat dissipation per unit area in the data center is getting larger and larger. In order to solve the heat dissipation of high heat density computer rooms, one way is to use cabinet door heat dissipation with back panel air conditioners. The back panel air conditioner is installed on the front side of the data center rack. The back panel air conditioner is close to the heat source and has a high heat dissipation efficiency. It also solves the heat dissipation problem of a single cabinet with a heat output of more than 20KW. At the same time, the back panel air conditioner does not take up additional space, so the limited space can be effectively used to cool the data center.

[0003] However, due to the effect of gravity, the heat transfer medium in the microchannel heat exchanger in the back panel air conditioner absorbs heat and evaporates into gas and flows upward. The upper medium is hotter than the lower one, and after the electronic equipment in the data center dissipates heat, the hot air in the computer room is also hotter at the upper part than at the lower part, which increases the temperature difference between the upper and lower parts. In short, there is a common problem of large temperature difference between the upper and lower air outlets of the back panel microchannel heat exchanger and uneven air outlet temperature. Summary of the invention

[0004] Therefore, the present invention provides a back plate air conditioner heat exchanger, a back plate air conditioner and a control method, which can solve the technical problem in the prior art that the upper and lower air outlet temperatures of the back plate air conditioner heat exchanger are large, resulting in uneven air outlet temperatures.

[0005] In order to solve the above problems, the present invention provides a back plate air conditioner heat exchanger, which includes two or more microchannel heat exchanger modules arranged in sequence from top to bottom, each microchannel heat exchanger module has a flat tube, a liquid distribution pipe connected to one end of the flat tube, and a gas collecting pipe connected to the other end of the flat tube;

[0006] Wherein, each microchannel heat exchanger module has a regulating valve, and each regulating valve is used to adjust the liquid inlet flow rate of the liquid distribution pipe of the corresponding microchannel heat exchanger module.

[0007] In some embodiments, the back plate air conditioning heat exchanger further includes a total liquid distribution pipe;

[0008] Wherein, the liquid distributing pipes of each of the microchannel heat exchanger modules are all supplied with liquid through the main liquid distributing pipe.

[0009] In some embodiments, the back plate air conditioning heat exchanger further includes a main collecting pipe;

[0010] Wherein, the gas collecting pipes of each of the microchannel heat exchanger modules exhaust gas through the main gas collecting pipe.

[0011] In some embodiments, each microchannel heat exchanger module is provided with fins, the fin density of each microchannel heat exchanger module is consistent, and the fin density of each microchannel heat exchanger module is different;

[0012] Wherein, for any two adjacent microchannel heat exchanger modules, the fin density of the upper microchannel heat exchanger module is greater than the fin density of the lower microchannel heat exchanger module.

[0013] In some embodiments, the fin pitches on each microchannel heat exchanger module are different; for a microchannel heat exchanger module with a greater fin density, the fin pitches thereon are smaller.

[0014] In some embodiments, the number of flat tubes in each microchannel heat exchanger module is more than two;

[0015] Wherein, for any two adjacent microchannel heat exchanger modules, the flat tube spacing of the upper microchannel heat exchanger module is smaller than the flat tube spacing of the lower microchannel heat exchanger module.

[0016] The present invention also provides a back panel air conditioner, which comprises any one of the back panel air conditioner heat exchangers described above.

[0017] The present invention also provides a control method for any of the above-mentioned back plate air conditioner heat exchangers, characterized in that it includes:

[0018] Step S1: detecting the outlet air temperature T of each microchannel heat exchanger module;

[0019] Step S2: According to the outlet air temperature T of each microchannel heat exchanger module, the opening of the regulating valve of each microchannel heat exchanger module in the heat exchange group is adjusted to make the outlet air temperature T of each microchannel heat exchanger module in the heat exchange group within the range of [T3-b, T3+b]; wherein T3 is the outlet air temperature of the lowest microchannel heat exchanger module among the microchannel heat exchanger modules, b is a first preset value, and the microchannel heat exchanger modules other than the lowest microchannel heat exchanger module among the microchannel heat exchanger modules form the heat exchange group.

[0020] In some embodiments, for any two adjacent microchannel heat exchanger modules, if the outlet air temperature of the upper microchannel heat exchanger module is greater than the outlet air temperature of the lower microchannel heat exchanger module, the opening of the regulating valve of the upper microchannel heat exchanger module is increased.

[0021] In some embodiments, the opening of the regulating valve of each microchannel heat exchanger module in the heat exchange group is adjusted in step S2, specifically:

[0022] The opening of the regulating valve of each microchannel heat exchanger module in the heat exchange group is adjusted in sequence from bottom to top.

[0023] In some implementations, the method further includes step S20 before step S2:

[0024] The temperature Ta in the liquid dispensing tube of each microchannel heat exchanger module is detected; according to the air outlet temperature T of each microchannel heat exchanger module and the temperature Ta in the liquid dispensing tube, the opening of each regulating valve is adjusted so that T-Ta of each microchannel heat exchanger module is within a preset range of (0, A], where A is a second preset value.

[0025] In some embodiments, if T-Ta>A of a certain microchannel heat exchanger module, the opening of the regulating valve of the microchannel heat exchanger module is increased.

[0026] A back plate air conditioner heat exchanger, a back plate air conditioner and a control method provided by the present invention have the following beneficial effects:

[0027] 1. The present invention changes a large backplane air conditioner heat exchanger in the prior art into two or more small microchannel heat exchanger modules arranged in sequence from top to bottom, so that the upper and lower inlet and outlet distances of each microchannel heat exchanger module are shorter than those of a large backplane air conditioner heat exchanger in the prior art, thereby reducing the problem of uneven upper and lower temperatures of the backplane air conditioner heat exchanger due to gravity, and can also reduce the upper and lower air outlet temperature difference of the backplane air conditioner heat exchanger, making the upper and lower air outlet temperatures of the backplane air conditioner more uniform, thereby solving the problem of local hot spots appearing in the computer room of the data center and failing to meet usage requirements, causing user complaints or equipment failures, and other problems.

[0028] 2. By setting a regulating valve on each microchannel heat exchanger module, the liquid inlet flow rate of the liquid distribution pipe of the corresponding microchannel heat exchanger module can be adjusted by the regulating valve to adjust the heat exchange efficiency of each microchannel heat exchanger module, thereby achieving the purpose of adjusting the outlet air temperature of each microchannel heat exchanger module, and then by controlling each regulating valve, the outlet air temperature difference between the upper and lower parts of the back plate air conditioner heat exchanger can be further reduced, so that the upper and lower outlet air temperatures of the back plate air conditioner are more uniform.

[0029] 3. The present invention first fine-tunes each microchannel heat exchanger module and then adjusts the outlet air temperature of each microchannel heat exchanger module for consistency. This can fully utilize the heat exchange capacity of each microchannel heat exchanger module to maximize the heat exchange capacity of the back plate air conditioner heat exchanger, and can also make the upper and lower outlet air temperatures of the back plate air conditioner heat exchanger uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. The drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0031] Figure 1 It is a structural schematic diagram of a back plate air conditioning heat exchanger provided by one embodiment of the present invention;

[0032] Figure 2 It is a structural schematic diagram of the back side of a back panel air conditioner provided by one embodiment of the present invention;

[0033] Figure 3 It is a structural schematic diagram of the front side of a back panel air conditioner provided by one embodiment of the present invention;

[0034] Figure 4 It is a flow chart of a control method of a back plate air conditioning heat exchanger provided by one embodiment of the present invention.

[0035] The accompanying drawings are marked as follows:

[0036] 1. Microchannel heat exchanger module; 2. Main liquid distribution pipe; 3. Main air collecting pipe; 4. Air outlet panel; 5. Fan; 6. Display screen; 11. Flat tube; 12. Liquid distribution pipe; 13. Regulating valve; 14. Air collecting pipe; 15. Fin; 201. Liquid inlet; 301. Air outlet; 1a. First microchannel heat exchanger module; 1b. Second microchannel heat exchanger module; 1c. Third microchannel heat exchanger module. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0039] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0040] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0041] See also Figure 1 As shown, according to an embodiment of the present invention, a back plate air conditioner heat exchanger is provided, which includes two or more microchannel heat exchanger modules 1 arranged in sequence from top to bottom, each microchannel heat exchanger module 1 has a flat tube 11, a liquid distribution pipe 12 connected to one end of the flat tube 11, and a gas collecting pipe 14 connected to the other end of the flat tube 11. Among them, each microchannel heat exchanger module 1 has a regulating valve 13, and each regulating valve 13 is used to adjust the liquid inlet flow rate of the liquid distribution pipe 12 of the corresponding microchannel heat exchanger module 1.

[0042] In the above example, the present invention changes a large back panel air-conditioning heat exchanger in the prior art into two or more small microchannel heat exchanger modules 1 arranged in sequence from top to bottom, so that the upper and lower inlet and outlet distances of each microchannel heat exchanger module 1 are shortened compared to the distance of a large back panel air-conditioning heat exchanger in the prior art, thereby reducing the problem of uneven upper and lower temperatures of the back panel air-conditioning heat exchanger due to gravity, and can also reduce the upper and lower air outlet temperature difference of the back panel air-conditioning heat exchanger, making the upper and lower air outlet temperatures of the back panel air-conditioning more uniform, thereby solving the problem of local hot spots appearing inside the computer room of the data center and being unable to meet usage needs, causing user complaints or equipment failures.

[0043] In addition, by providing a regulating valve 13 on each microchannel heat exchanger module 1, the liquid inlet flow rate of the liquid distribution pipe 12 of the corresponding microchannel heat exchanger module 1 can be adjusted by the regulating valve 13 to adjust the heat exchange efficiency of each microchannel heat exchanger module 1, thereby achieving the purpose of adjusting the outlet air temperature of each microchannel heat exchanger module 1, and then by controlling each regulating valve 13, the outlet air temperature difference between the upper and lower parts of the back panel air conditioner heat exchanger can be further reduced, so that the upper and lower outlet air temperatures of the back panel air conditioner are more uniform.

[0044] It should be noted here that: Figure 1 As shown, the flat tubes 11 of the aforementioned microchannel heat exchanger modules 1 are all arranged vertically. Take any microchannel heat exchanger module 1 as microchannel heat exchanger module A, the liquid distribution pipe 12 of the microchannel heat exchanger module A is located at the lower side of the flat tubes 11 of the microchannel heat exchanger module A, and the gas collecting pipe 14 of the microchannel heat exchanger module A is located at the upper side of the flat tubes 11 of the microchannel heat exchanger module A.

[0045] In some embodiments, Figure 1 As shown, the number of the aforementioned microchannel heat exchanger modules 1 can be three.

[0046] In some embodiments, Figure 1 As shown, each of the aforementioned regulating valves 13 can be arranged at the liquid inlet of the liquid distribution pipe 12 of the corresponding microchannel heat exchanger module 1 .

[0047] In some embodiments, Figure 1 As shown, the aforementioned back plate air conditioning heat exchanger may further include a main liquid distribution pipe 2. Among them, the liquid distribution pipes 12 of each microchannel heat exchanger module 1 are all fed with liquid through the main liquid distribution pipe 2, so that the unified liquid feeding of each microchannel heat exchanger module 1 can be achieved, the liquid feeding structure is simplified, and the liquid feeding cost is reduced.

[0048] In a specific application example, the aforementioned total liquid dispensing pipe 2 is a blind pipe, that is, one end of the total liquid dispensing pipe 2 is closed, and the other end is a liquid inlet 201 (such as Figure 2 The liquid distribution pipes 12 of the aforementioned microchannel heat exchanger modules 1 are all connected to the side wall of the main liquid distribution pipe 2.

[0049] In some embodiments, Figure 1 As shown, the aforementioned back plate air conditioning heat exchanger also includes a main air collecting pipe 3. Among them, the air collecting pipes 14 of each microchannel heat exchanger module 1 all exhaust air through the main air collecting pipe 3, so that the unified air outlet of each microchannel heat exchanger module 1 can be achieved, the air outlet structure is simplified, and the air outlet cost is reduced.

[0050] In a specific application example, the aforementioned main gas collecting pipe 3 is a blind pipe, that is, one end of the main gas collecting pipe 3 is closed, and the other end is an outlet 301 (such as Figure 2 The gas collecting pipes 14 of the aforementioned microchannel heat exchanger modules 1 are all connected to the side wall of the main gas collecting pipe 3.

[0051] In some embodiments, Figure 1 As shown, each of the aforementioned microchannel heat exchanger modules 1 is provided with fins 15. The fin density of each microchannel heat exchanger module 1 may be equal or unequal. Preferably, the fin density of each microchannel heat exchanger module 1 is different. For any two adjacent microchannel heat exchanger modules 1, the fin density of the upper microchannel heat exchanger module is greater than the fin density of the lower microchannel heat exchanger module.

[0052] In the above example, the fin density of the upper microchannel heat exchanger module 1 is greater than the fin density of the lower microchannel heat exchanger module 1, so that the heat exchange area of ​​the upper microchannel heat exchanger module 1 is larger. When the heat exchange area is large, the heat exchange rate is large when the same air volume passes through it. Therefore, when the relatively hot indoor air above passes through the upper heat exchanger of the air conditioner, the heat exchange rate is larger than that of the lower part of the air conditioner, and the upper air outlet temperature of the air conditioner will be reduced, thereby reducing the temperature difference between the upper hot and lower cold air outlet temperatures of the back panel air conditioner, making the upper and lower air outlet temperatures of the back panel air conditioner more uniform.

[0053] In order to achieve the effect that the fin density of the upper microchannel heat exchanger module is greater than the fin density of the lower microchannel heat exchanger module for any two adjacent microchannel heat exchanger modules 1, in some embodiments, the fin spacings on the aforementioned microchannel heat exchanger modules 1 are different. For a microchannel heat exchanger module 1 with a larger fin density, the fin spacing thereon is smaller.

[0054] In the above example, by reducing the fin spacing of the upper micro-channel heat exchanger module 1, the fin density of the upper micro-channel heat exchanger module 1 can be made larger.

[0055] It should be noted here that: in some embodiments, the fin spacings of the aforementioned microchannel heat exchanger modules 1 may also be equal.

[0056] In some embodiments, the number of flat tubes 11 of each of the aforementioned microchannel heat exchanger modules 1 is more than two. Among them, for any two adjacent microchannel heat exchanger modules 1, the flat tube spacing of the upper microchannel heat exchanger module is smaller than the flat tube spacing of the lower microchannel heat exchanger module.

[0057] In the above example, the microchannel heat exchanger module 1 with a small flat tube spacing is arranged at the upper part, and the microchannel heat exchanger module 1 with a large flat tube spacing is arranged at the lower part. In the case where the microchannel heat exchanger modules 1 are of the same size, the smaller the flat tube spacing is, the more flat tubes 11 can be arranged, so that the heat exchange area of ​​the microchannel heat exchanger module 1 is relatively large. When the heat exchange area is large, the heat exchange amount is large when the same air volume passes through. Therefore, when the relatively hot indoor air at the upper part passes through the upper heat exchanger of the air conditioner, the heat exchange amount is larger than that of the lower part of the air conditioner, and the upper air outlet temperature of the air conditioner will be reduced, thereby reducing the temperature difference between the upper hot and lower cold air outlet temperatures of the back plate air conditioner, and making the upper and lower air outlet temperatures of the back plate air conditioner more uniform.

[0058] The present invention also provides a backplane air conditioner, which includes any of the backplane air conditioner heat exchangers described above. Among them, because the backplane air conditioner adopts the backplane air conditioner heat exchanger described above, the problem of uneven upper and lower temperatures of the backplane air conditioner heat exchanger due to gravity can be reduced, and the upper and lower air outlet temperature difference of the backplane air conditioner heat exchanger can be reduced, making the upper and lower air outlet temperatures of the backplane air conditioner more uniform, thereby solving the problem of local hot spots appearing inside the computer room of the data center and failing to meet usage requirements, causing user complaints or equipment failures, and other problems.

[0059] It should be noted here that: Figure 2 and Figure 3 As shown, the aforementioned backboard air conditioner also includes a fan 5, which can be an axial flow fan or the like. The fan 5 is used to drive the airflow through each microchannel heat exchanger module 1 of the backboard air conditioner heat exchanger, so that the wind exchanges heat with each microchannel heat exchanger module 1. The backboard air conditioner also includes an air outlet panel 4 and a display screen 6 arranged on the air outlet panel 4. The air outlet panel 4 is provided with an air outlet, and the fan 5 is arranged at the air outlet. The display screen 6 is arranged on the front of the air outlet panel 4, and the aforementioned backboard air conditioner heat exchanger is located on the back of the air outlet panel 4.

[0060] like Figure 4 As shown, the present invention also provides a control method for any of the above-mentioned back plate air conditioner heat exchangers, which comprises:

[0061] Step S1: detecting the outlet air temperature T of each microchannel heat exchanger module 1 .

[0062] Specifically, a temperature sensing package can be used to detect the outlet air temperature of each microchannel heat exchanger module 1. The number of temperature sensing packages is equal to the number of microchannel heat exchanger modules 1, and they are arranged on the outlet air side of the corresponding microchannel heat exchanger modules 1 in a one-to-one correspondence.

[0063] Step S2: According to the outlet air temperature T of each microchannel heat exchanger module 1, adjust the opening of the regulating valve 13 of each microchannel heat exchanger module 1 in the heat exchange group, so that the outlet air temperature T of each microchannel heat exchanger module 1 in the heat exchange group is within the range of [T3-b, T3+b]. Wherein, T3 is the outlet air temperature of the lowest microchannel heat exchanger module in each microchannel heat exchanger module 1, and b is the first preset value. Each microchannel heat exchanger module other than the lowest microchannel heat exchanger module in each microchannel heat exchanger module 1 forms the above-mentioned heat exchange group. In some embodiments, b can be 2°C.

[0064] For the back panel air conditioner heat exchanger in the prior art, the air outlet temperature of the upper part is greater than that of the lower part, that is, the air outlet temperature of the lowest part is the lowest. Therefore, in the example of the present invention, by taking the air outlet temperature T3 of the lowest microchannel heat exchanger module as a reference, the opening of the regulating valve 13 of other microchannel heat exchanger modules is adjusted, so that the air outlet temperatures of other microchannel heat exchanger modules are all within the range of [T3-b, T3+b]. In this way, the air outlet temperatures of each microchannel heat exchanger module 1 can be equal or approximately equal, thereby achieving uniform upper and lower air outlet temperatures of the back panel air conditioner, solving the problem of local hot spots appearing inside the computer room of the data center and failing to meet usage needs, causing user complaints or electronic equipment failures.

[0065] In order to make the outlet air temperatures of each microchannel heat exchanger module 1 equal or approximately equal, in some embodiments, for any two adjacent microchannel heat exchanger modules 1, if the outlet air temperature of the upper microchannel heat exchanger module is greater than the outlet air temperature of the lower microchannel heat exchanger module, the opening of the regulating valve 13 of the upper microchannel heat exchanger module is increased.

[0066] The following is an example of three microchannel heat exchanger modules 1. The three microchannel heat exchanger modules 1 are sequentially a first microchannel heat exchanger module 1a, a second microchannel heat exchanger module 1b, and a third microchannel heat exchanger module 1c from top to bottom. The outlet air temperatures of the three microchannel heat exchanger modules 1 are sequentially T1, T2, and T3 from top to bottom.

[0067] Among them, when T1>T2, the temperature T1 needs to be lowered, that is, the heat exchange capacity Q1 of the first microchannel heat exchanger module 1a is increased. At this time, the opening of the regulating valve 13 of the first microchannel heat exchanger module 1a can be gradually increased to increase the liquid inlet flow M1 of the liquid distribution pipe 12 of the first microchannel heat exchanger module 1a until the temperature difference between T1 and T2 is within the preset range, so that T1≈T2.

[0068] Similarly, when T2>T3, the temperature T2 needs to be lowered, that is, the heat exchange capacity Q2 of the second microchannel heat exchanger module 1b is increased. At this time, the opening of the regulating valve 13 of the second microchannel heat exchanger module 1b can be gradually increased to increase the liquid inlet flow M2 of the liquid distribution pipe 12 of the second microchannel heat exchanger module 1b until the temperature difference between T2 and T3 is within the preset range, so that T2≈T3.

[0069] This adjustment is repeated until T1 and T2 are both within the range of [T3-b, T3+b], making T1≈T2≈T3.

[0070] In some embodiments, the opening of the regulating valve 13 of each microchannel heat exchanger module 1 in the heat exchange group is adjusted in the aforementioned step S2, specifically: the opening of the regulating valve 13 of each microchannel heat exchanger module in the heat exchange group is adjusted in sequence from bottom to top.

[0071] In the above example, since the outlet air temperature T1 of the lowest microchannel heat exchanger module is used as a reference, and if the outlet air temperature of the upper microchannel heat exchanger module is greater than the outlet air temperature of the adjacent lower microchannel heat exchanger module, the opening of the regulating valve 13 of the upper microchannel heat exchanger module is increased; in this way, by adjusting the opening of the regulating valve 13 of each microchannel module in the heat exchange group from bottom to top, the outlet air temperature of each microchannel heat exchanger module in the heat exchange group can be in the range of [T3-b, T3+b] from bottom to top, thereby improving the adjustment efficiency and avoiding repeated adjustment.

[0072] In some embodiments, Figure 4 As shown, before step S2, step S20 is also included: detecting the temperature Ta in the liquid dispensing tube 12 of each microchannel heat exchanger module 1; adjusting the opening of each regulating valve 13 according to the air outlet temperature T of each microchannel heat exchanger module 1 and the temperature Ta in the liquid dispensing tube 12, so that T-Ta of each microchannel heat exchanger module 1 is within a preset range of (0, A], where A is a second preset value. In some embodiments, A can be 5°C.

[0073] In the above example, if the T-Ta of a certain microchannel heat exchanger module 1 is greater than A, it means that the heat exchange capacity of the microchannel heat exchanger module 1 is insufficient. Among them, the greater the amplitude of T-Ta being greater than A, the less sufficient the heat exchange capacity of the microchannel heat exchanger module 1. If the T-Ta of a certain microchannel heat exchanger module 1 is greater than A, the opening of the regulating valve 13 of the microchannel heat exchanger module 1 is increased to increase the liquid inlet flow M of the liquid distribution pipe 12 of the microchannel heat exchanger module 1, so as to maximize the heat exchange of the microchannel heat exchanger module 1, which is conducive to fully utilizing the heat exchange area of ​​the microchannel heat exchanger module 1 and improving the heat exchange efficiency.

[0074] Compared with step S2, step S20 is a fine-tuning stage. Through the adjustment of step S20, the heat exchange capacity of each microchannel heat exchanger module 1 can be maximized. Then enter step S2. Since the outlet air temperature T3 of the bottom microchannel heat exchanger module is generally the lowest, the outlet air temperature T3 of the bottom microchannel heat exchanger module is used as a reference in step S2 to adjust the outlet air temperature of each upper microchannel heat exchanger module, so that the outlet air temperature of each upper microchannel heat exchanger module is equal to or approximately equal to T3. Among them, the present invention first fine-tunes each microchannel heat exchanger module 1, and then adjusts the consistency of the outlet air temperature of each microchannel heat exchanger module 1. In this way, the heat exchange capacity of each microchannel heat exchanger module 1 can be fully utilized to maximize the heat exchange capacity of the backboard air conditioner heat exchanger, and the upper and lower outlet air temperatures of the backboard air conditioner heat exchanger can be uniform, thereby solving the problem that local hot spots appear inside the computer room of the data center and cannot meet the use needs, causing user complaints or electronic equipment failures.

[0075] When the number of microchannel heat exchanger modules 1 is 3, and the 3 microchannel heat exchanger modules 1 are the first microchannel heat exchanger module 1a, the second microchannel heat exchanger module 1b and the third microchannel heat exchanger module 1c from top to bottom, the temperatures Ta in the liquid distribution tubes 12 of the 3 microchannel heat exchanger modules 1 are Ta1, Ta2 and Ta3 from top to bottom.

[0076] When T1-Ta1>A, the greater the temperature difference, the less sufficient the heat exchange capacity of the first microchannel heat exchanger module 1a is, and the refrigerant flow of the first microchannel heat exchanger module 1a needs to be increased. By increasing the opening of the regulating valve 13 of the first microchannel heat exchanger module 1a, the liquid inlet flow M1 of the liquid distribution pipe 12 of the first microchannel heat exchanger module 1a is increased to make 0℃<T1-Ta1≤A.

[0077] When T2-Ta2>A, the greater the temperature difference, the less sufficient the heat exchange capacity of the second microchannel heat exchanger module 1b is, and the refrigerant flow of the second microchannel heat exchanger module 1b needs to be increased. By increasing the opening of the regulating valve 13 of the second microchannel heat exchanger module 1b, the liquid inlet flow M2 of the liquid distribution pipe 12 of the second microchannel heat exchanger module 1b is increased to make 0℃<T2-Ta2≤A.

[0078] When T3-Ta3>A, the greater the temperature difference, the less sufficient the heat exchange capacity of the third microchannel heat exchanger module 1c is, and the refrigerant flow of the third microchannel heat exchanger module 1c needs to be increased. By increasing the opening of the regulating valve 13 of the third microchannel heat exchanger module 1c, the liquid inlet flow M3 of the liquid distribution pipe 12 of the third microchannel heat exchanger module 1c is increased to make 0℃<T3-Ta3≤A.

[0079] For ease of understanding, the overall structure of the present invention is described below, and its working principle is explained.

[0080] The following is an example in which the number of microchannel heat exchanger modules 1 is three. The three microchannel heat exchanger modules 1 are sequentially a first microchannel heat exchanger module 1a, a second microchannel heat exchanger module 1b and a third microchannel heat exchanger module 1c from top to bottom.

[0081] A temperature sensing package is provided on the air outlet side of each microchannel heat exchanger module 1. According to the law of conservation of energy, the heat exchange capacity of the microchannel heat exchanger module 1 is Q. For the refrigerant, the flow rate at the inlet of the liquid distributor 12 of the microchannel heat exchanger module 1 is M. Under the condition that other conditions remain unchanged, M is proportional to Q. That is, by adjusting the flow rate M at the inlet of the liquid distributor 12 of the microchannel heat exchanger module 1, the purpose of adjusting the heat exchange capacity Q of the microchannel heat exchanger module 1 can be achieved. Specifically, if M becomes smaller, Q becomes smaller, and if M becomes larger, Q becomes larger.

[0082] As for the air inlet and outlet of the air conditioner, Q = C*M 风 *(T 进风 -T 出风 ), C is the coefficient, air volume M 风 The heat exchange Q and the outlet air temperature T remain unchanged. 出风 Inversely proportional, that is, when the heat transfer Q is small, T 出风 For example, the heat exchange rate Q1 of the area corresponding to the first microchannel heat exchanger module 1a is inversely proportional to its outlet air temperature T1. Similarly, the heat exchange rate Q2 of the area corresponding to the second microchannel heat exchanger module 1b is inversely proportional to its outlet air temperature T2. The heat exchange rate Q3 of the area corresponding to the third microchannel heat exchanger module 1c is inversely proportional to its outlet air temperature T3.

[0083] After the back panel air conditioner starts to run, because the temperature is T1>T2>T3, each regulating valve 13 is controlled one by one to adjust the liquid inlet flow rate of the liquid distribution pipe 12 of each microchannel heat exchanger module 1, and the aforementioned steps S20 and S2 are sequentially passed through, and finally T1≈T2≈T3 is made, thereby achieving uniform upper and lower air outlet temperatures of the back panel air conditioner heat exchanger, solving the problem of local hot spots inside the computer room of the data center failing to meet usage needs, causing user complaints or electronic equipment failures, and other problems.

[0084] It is easy for those skilled in the art to understand that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention. These improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A back plate air conditioning heat exchanger, characterized in that: It comprises two or more microchannel heat exchanger modules (1) arranged in sequence from top to bottom, each microchannel heat exchanger module (1) having a flat tube (11), a liquid distribution tube (12) connected to one end of the flat tube (11), and a gas collecting tube (14) connected to the other end of the flat tube (11); Each microchannel heat exchanger module (1) has a regulating valve (13), and each regulating valve (13) is used to regulate the liquid inlet flow rate of the liquid distribution pipe (12) of the corresponding microchannel heat exchanger module (1).

2. The back plate air conditioning heat exchanger according to claim 1, characterized in that: Also includes a total liquid dispensing tube (2); Wherein, the liquid distribution pipe (12) of each microchannel heat exchanger module (1) is supplied with liquid through the main liquid distribution pipe (2).

3. The back plate air conditioning heat exchanger according to claim 1, characterized in that: It also includes a main gas collecting pipe (3); Wherein, the gas collecting pipes (14) of each of the microchannel heat exchanger modules (1) all discharge gas through the main gas collecting pipe (3).

4. The back plate air conditioning heat exchanger according to any one of claims 1 to 3, characterized in that: Each microchannel heat exchanger module (1) is provided with fins (15), and the fin densities of each microchannel heat exchanger module (1) are different; Wherein, for any two adjacent microchannel heat exchanger modules (1), the fin density of the upper microchannel heat exchanger module is greater than the fin density of the lower microchannel heat exchanger module.

5. The back plate air conditioning heat exchanger according to claim 4, characterized in that: The fin spacings on each microchannel heat exchanger module (1) are different; for a microchannel heat exchanger module (1) with a greater fin density, the fin spacings thereon are smaller.

6. The back plate air conditioning heat exchanger according to any one of claims 1 to 3 and 5, characterized in that: The number of the flat tubes (11) of each microchannel heat exchanger module (1) is more than two; Wherein, for any two adjacent microchannel heat exchanger modules (1), the flat tube spacing of the upper microchannel heat exchanger module is smaller than the flat tube spacing of the lower microchannel heat exchanger module.

7. A back panel air conditioner, characterized in that: A back plate air conditioning heat exchanger comprising any one of claims 1-6.

8. A control method for a back plate air conditioner heat exchanger according to any one of claims 1 to 6, characterized in that: include: Step S1: detecting the air outlet temperature T of each microchannel heat exchanger module (1); Step S2: According to the air outlet temperature T of each microchannel heat exchanger module (1), the opening of the regulating valve (13) of each microchannel heat exchanger module (1) in the heat exchange group is adjusted so that the air outlet temperature T of each microchannel heat exchanger module (1) in the heat exchange group is within the range of [T3-b, T3+b]; wherein T3 is the air outlet temperature of the lowest microchannel heat exchanger module among the microchannel heat exchanger modules (1), b is a first preset value, and the microchannel heat exchanger modules other than the lowest microchannel heat exchanger module among the microchannel heat exchanger modules (1) form the heat exchange group.

9. The control method according to claim 8, characterized in that: For any two adjacent microchannel heat exchanger modules (1), if the air outlet temperature of the upper microchannel heat exchanger module is greater than the air outlet temperature of the lower microchannel heat exchanger module, the opening of the regulating valve (13) of the upper microchannel heat exchanger module is increased.

10. The control method according to claim 9, characterized in that: The step S2 of adjusting the opening of the regulating valve (13) of each microchannel heat exchanger module (1) in the heat exchange group is specifically as follows: The openings of the regulating valves (13) of the microchannel heat exchanger modules (1) in the heat exchange group are adjusted in sequence from bottom to top.

11. The control method according to any one of claims 8 to 10, characterized in that: Before step S2, the method further includes step S20: The temperature Ta in the liquid dispensing pipe (12) of each microchannel heat exchanger module (1) is detected; and the opening of each regulating valve (13) is adjusted according to the air outlet temperature T of each microchannel heat exchanger module (1) and the temperature Ta in the liquid dispensing pipe (12), so that T-Ta of each microchannel heat exchanger module (1) is within a preset range of (0, A], wherein A is a second preset value.

12. The control method according to claim 11, characterized in that: If T-Ta of a certain microchannel heat exchanger module (1)>A, the opening of the regulating valve (13) of the microchannel heat exchanger module (1) is increased.

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