Display panel, preparation method of display panel and electronic equipment

Abstract

According to the display panel, the preparation method of the display panel and the electronic equipment provided by the invention, the thickness of the display panel can be reduced, and lightening and thinning of the display panel are facilitated. The display surface comprises a substrate, a light emitting layer, a cathode and an even number of metasurface layers, the light emitting layer, the cathode and the even number of metasurface layers are arranged on the same side of the substrate, the cathode is arranged on the side, away from the substrate, of the light emitting layer, at least one metasurface layer is arranged on the side, away from the substrate, of the light emitting layer, and at least one metasurface layer is arranged between the light emitting layer and the cathode; each metasurface layer comprises at least one insulating material layer and at least one metal material layer, the sum of the number of the insulating material layers and the number of the metal material layers is an odd number equal to or larger than 3, and the metal material layers and the insulating material layers are alternately stacked.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] With the development of virtual reality (VR) technology and augmented reality (AR) technology, people have higher and higher requirements for the pupil contrast (PPD), clarity (PPI) and portability of head-mounted display devices. In existing head-mounted display devices, organic light emitting diodes (OLED) are usually used as display panels. OLED display panels usually have micro-lenses to focus light beams, but the micro-lenses have a certain thickness, which makes the OLED display thicker, which is not conducive to the thin and light design of the OLED display. Summary of the invention

[0003] The present application provides a display panel, a method for manufacturing a display panel, and an electronic device, which can reduce the thickness of the display panel and help promote the thinness of the display panel.

[0004] In a first aspect, the present application provides a display panel, which includes a substrate, a light-emitting layer, a cathode and at least two supersurface layers, wherein the light-emitting layer, the cathode and an even-numbered supersurface layer are arranged on the same side of the substrate, the cathode is arranged on the side of the light-emitting layer away from the substrate, at least one supersurface layer is arranged on the side of the light-emitting layer away from the substrate, and at least one supersurface layer is arranged between the light-emitting layer and the cathode, wherein each of the supersurface layers includes at least one insulating material layer and at least one metal material layer, the sum of the number of layers of the insulating material layers and the metal material layers is an odd number equal to or greater than 3, and the metal material layers and the insulating material layers are alternately stacked. The technical solution provided in this embodiment, on the one hand, the super surface layer has a filtering function, so that there is no need to set up an additional color filter in the display panel, which can reduce the thickness of the display panel and reduce the weight of the display panel, which is conducive to promoting the thinness of the display panel and reducing the production cost of the display panel. On the other hand, the super surface layer of the even-numbered layers can reverse and fold the light output path of the light, so that the light output efficiency of the display panel is no longer limited by the process film thickness of the display panel, thereby improving the light output efficiency and further promoting the thinness of the display panel. At the same time, it can avoid the color filter from absorbing light and increase the light output intensity of the display panel. In addition, the super surface layer can cause the light output path of the light emitted by the light-emitting point source in the display panel to fold on the same side of the light-emitting point source, thereby avoiding crosstalk between the light outputs of different light-emitting point sources in the display panel.

[0005] In one possible implementation, each of the super surface layers is provided with a plurality of through holes, and the plurality of through holes penetrate the super surface layer along the thickness direction of the super surface layer, and the plurality of through holes are arranged in an array and spaced apart from each other, and the apertures of the plurality of through holes are equal. In this embodiment, by providing a plurality of through holes in the super surface layer and arranging the plurality of through holes in an array, the super surface layer can realize a light filtering function.

[0006] In a possible implementation, the apertures of the plurality of through holes are all between 1 / 2λ and 2λ, where λ refers to the average wavelength of red light, blue light and green light. In this embodiment, by setting the apertures of the plurality of through holes between 1 / 2λ and 2λ, a better filtering effect of the super surface layer can be ensured.

[0007] In a possible implementation, the distance between the centers of two adjacent through holes is between 3 / 2λ and 6λ, where λ refers to the average wavelength of red light, blue light, and green light. In this embodiment, by setting the distance between the centers of two adjacent through holes between 3 / 2λ and 6λ, it is possible to avoid the mechanical strength of the super surface layer from being reduced due to the distance between the centers of two adjacent through holes being too small, and it is also possible to avoid the filtering effect of the super surface layer from being reduced due to the distance between the centers of two adjacent through holes being too large.

[0008] In a possible implementation, the refractive index of each of the supersurface layers is between 1.8 and 2.2.

[0009] In a possible implementation, the extinction coefficient of each of the supersurface layers is between 0.1 and 1.6.

[0010] In this embodiment, by setting the refractive index of the super surface layer between 1.8 and 2.2 and the extinction coefficient between 0.1 and 1.6, the filtering effect of the super surface layer can be better.

[0011] In a possible implementation, the even-numbered super-surface layer includes at least one first super-surface layer and one second super-surface layer, wherein the first super-surface layer is disposed between the light-emitting layer and the cathode, and the second super-surface layer is disposed on the side of the cathode away from the light-emitting layer; the sum of the number of layers of the first super-surface layer and the second super-surface layer is an even number. In this embodiment, the sum of the number of layers of at least one first super-surface layer and the second super-surface layer is an even number, which can ensure that the light emitted from the light-emitting point source in the display panel can be folded on the same side of the light-emitting point source after passing through the first super-surface layer and the second super-surface layer, thereby avoiding crosstalk between the light emitted from different light-emitting point sources in the display panel.

[0012] In a possible implementation, the display panel further includes an anode, a hole injection layer, a hole conduction layer, an electron blocking layer, an electron conduction layer, an electron injection layer and a sealing layer, wherein the anode is arranged on the surface of the substrate and between the substrate and the light-emitting layer, the hole injection layer is arranged on the surface of the anode away from the substrate, the hole conduction layer is arranged on the surface of the hole injection layer away from the anode, the electron blocking layer is arranged on the surface of the hole conduction layer away from the hole injection layer, the electron conduction layer is located on the surface of the light-emitting layer away from the electron blocking layer, the electron injection layer is arranged on the surface of the electron conduction layer away from the light-emitting layer, and the sealing layer is arranged on the side of the cathode away from the substrate. In this embodiment, the holes of the anode are injected into the hole conduction layer through the hole injection layer under the action of the positive electrode voltage, and the hole conduction layer transfers the holes to the light-emitting layer. The electrons of the cathode are injected into the electron conduction layer through the electron injection layer under the action of the negative electrode voltage. The electron conduction layer transfers the electrons to the light-emitting layer. The electron blocking layer blocks the electrons of the cathode at the interface between the light-emitting layer and the electron blocking layer, so that the electrons and holes combine in the light-emitting layer to form excitons. In the process of excitons transitioning from the excited state to the ground state, energy is released in the form of light, so that the light-emitting layer can emit light, and then the display panel can achieve self-luminescence. The sealant layer can play a sealing role to prevent substances such as water vapor and oxygen in the air from entering the display panel, thereby ensuring that the display effect of the display panel is better.

[0013] In the second aspect, the present application also provides a display panel, which includes a substrate, a light-emitting layer, a cathode and a super surface layer, wherein the light-emitting layer, the cathode and the super surface layer are arranged on the same side of the substrate, the super surface layer is arranged on the side of the light-emitting layer away from the substrate, and is located between the light-emitting layer and the cathode, and the super surface layer is made of a polymer material that is transparent to visible light. The technical solution provided in this embodiment, on the one hand, can modulate the polarization state of the light emitted by the light-emitting point source in the display panel and the light-emitting path of the modulated light to achieve the convergence of the light beam, which helps to improve the light intensity of the display panel and enhance the display effect of the display panel. On the other hand, there is no need to set a polarizer in the display panel to modulate the light into a polarization state, which can avoid the loss of the light intensity of the display panel caused by the polarizer, increase the light output rate of the light emitted from the display panel, and is also conducive to the realization of the subsequent light path folding scheme of the display panel, thereby helping to enhance the light field intensity of the display panel.

[0014] In a possible implementation, the polymer material that is transparent to visible light is polyesteramide. In this embodiment, the polyesteramide material is used to prepare the super surface layer, so that the display panel can achieve the function of modulating the polarization state and light output path of the light to gather the light beam, thereby achieving the purpose of improving the light output intensity.

[0015] In a possible implementation, the metasurface layer includes a plurality of polarization holes, which are arranged in an array and spaced apart from each other. In this embodiment, by providing a plurality of polarization holes in the metasurface layer, light can be converted into polarized light, so that the metasurface layer can achieve the function of focusing light beams.

[0016] In a possible embodiment, the display panel further includes an anode, a hole injection layer, a hole conduction layer, an electron blocking layer, an electron conduction layer, an electron injection layer, a color filter layer and a sealing layer, wherein the anode is arranged on the surface of the substrate and between the substrate and the light-emitting layer, the hole injection layer is arranged on the surface of the anode away from the substrate, the hole conduction layer is arranged on the surface of the hole injection layer away from the anode, the electron blocking layer is arranged on the surface of the hole conduction layer away from the hole injection layer, the electron conduction layer is located on the surface of the light-emitting layer away from the electron blocking layer, the electron injection layer is arranged on the surface of the electron conduction layer away from the light-emitting layer, the cathode is arranged on the surface of the super surface layer away from the electron injection layer, the color filter layer is arranged on the surface of the cathode away from the super surface layer, and the sealing layer is arranged on the surface of the color filter layer away from the cathode. In this embodiment, the color filter layer is used to filter light of a specific color so that the display panel can display a color picture.

[0017] In a third aspect, the present application further provides an electronic device, comprising a housing, a driver, and a display panel as described in any one of the above items, wherein the driver and the display panel are both installed on the inner side of the housing, and the display panel is electrically connected to the driver. The electronic device provided in this embodiment can enhance the user experience by providing the display panel as described above.

[0018] In a fourth aspect, the present application also provides a method for preparing a display panel, including: providing a substrate, the substrate may include a substrate and a light-emitting layer, the light-emitting layer is arranged on one side of the substrate; forming a super surface layer on the side of the light-emitting layer away from the substrate; forming a cathode on the side of the super surface layer away from the light-emitting layer; forming another super surface layer on the surface of the cathode away from the super surface layer. In the method for preparing a display panel provided in this embodiment, on the one hand, the super surface layer has a light filtering function, so that there is no need to set an additional color filter in the display panel, which can reduce the thickness of the display panel and reduce the weight of the display panel, thereby promoting the thinness of the display panel and helping to reduce the production cost of the display panel. On the other hand, the super surface layer of the even number of layers can reverse and fold the light emission path of the light, so that the light emission efficiency of the display panel is no longer limited by the process film thickness of the display panel, thereby improving the light emission efficiency and further promoting the thinness of the display panel. At the same time, it can avoid the color filter from absorbing light and increase the light intensity of the display panel. In addition, the metasurface layer can cause the light output path of the light emitted from the light-emitting point source in the display panel to be folded on the same side of the light-emitting point source, thereby avoiding crosstalk between the light outputs of different light-emitting point sources in the display panel.

[0019] In a possible implementation manner, after the step of forming another super surface layer on the surface of the cathode away from the super surface layer, the method for preparing the display panel further comprises: forming a sealing layer on the surface of the other super surface layer away from the cathode. In this embodiment, by forming a sealing layer on the surface of the other super surface layer away from the cathode, the display panel can be protected and sealed to prevent water vapor and oxygen and other substances in the external environment from entering the display panel, thereby ensuring a better display effect of the display panel.

[0020] In a fifth aspect, the present application also provides a method for preparing a display panel, comprising: providing a substrate, the substrate may include a substrate and a light-emitting layer, the light-emitting layer being arranged on one side of the substrate; forming a super surface layer on the side of the light-emitting layer away from the substrate, the super surface layer may be made of polyester amide or other long-chain molecular polymers that can allow visible light to pass through; forming a cathode on the side of the super surface layer away from the light-emitting layer; forming a color filter layer on the surface of the cathode away from the super surface layer; forming a sealing layer on the surface of the color filter layer away from the cathode to obtain the display panel. The method for preparing the display panel provided in this embodiment, on the one hand, can modulate the polarization state of the light emitted by the light-emitting point source in the display panel and the light-emitting path of the modulated light to achieve the convergence of the light beam, which helps to improve the light-emitting intensity of the display panel and enhance the display effect of the display panel. On the other hand, there is no need to set a polarizer in the display panel to modulate the light into a polarization state, which can avoid the loss of the light intensity of the display panel caused by the polarizer, increase the light-emitting rate of the light emitted from the display panel, and also facilitate the realization of the subsequent light path folding scheme of the display panel, thereby helping to enhance the light field intensity of the display panel.

[0021] In a possible implementation, after the step of forming a cathode on the side of the super surface layer away from the light emitting layer, the method for preparing the display panel further includes: forming a color filter layer on the surface of the cathode away from the super surface layer. In this embodiment, by forming a color filter layer on the surface of the cathode away from the super surface layer, the display panel can display a color picture.

[0022] In a possible implementation manner, after the step of forming a color filter layer on the surface of the cathode away from the super surface layer, the method for preparing the display panel further includes: forming a sealing layer on the surface of the color filter layer away from the cathode to obtain the display panel. In this embodiment, by forming a sealing layer on the surface of the color filter layer away from the cathode, the display panel can be protected and sealed to prevent substances such as water vapor and oxygen in the external environment from entering the display panel, thereby ensuring a better display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0024] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0025] Figure 2 yes Figure 1 The structure diagram of the display panel in the electronic device shown is a first embodiment;

[0026] Figure 3yes Figure 2 A schematic diagram of a portion of the structure of the super surface layer in the display panel is shown;

[0027] Figure 4 yes Figure 2 A schematic diagram of a part of the structure of the insulating material layer and the metal material layer of the super surface layer in the display panel;

[0028] Figure 5 yes Figure 2 A schematic diagram of a portion of the structure of the super surface layer in the display panel at another angle;

[0029] Figure 6 yes Figure 2 A schematic diagram of the light emission path of the light in the display panel shown;

[0030] Figure 7 yes Figure 1 The structure diagram of the display panel in the electronic device shown in the second embodiment;

[0031] Figure 8 yes Figure 7 A schematic diagram of a light emission path of light in the display panel is shown;

[0032] Fig. 9 yes Figure 2 A schematic diagram of the preparation process of the display panel shown;

[0033] Fig.10 is a schematic diagram of the structure after an anode is formed on the surface of the substrate in step S111;

[0034] Fig.11 is a schematic diagram of the structure after a pixel material layer is formed on the surface of the substrate in step S112;

[0035] Fig.12 is a schematic diagram of the structure after a pixel definition layer is formed on the surface of the substrate in step S113;

[0036] Fig.13 is a schematic structural diagram after a hole injection layer is formed on the surface of the anode facing away from the substrate in step S114;

[0037] Fig.14 is a schematic structural diagram of forming a hole conduction layer on the surface of the hole injection layer facing away from the anode in step S115;

[0038] Fig.15 is a schematic structural diagram after an electron blocking layer is formed on the surface of the hole conducting layer away from the hole injection layer in step S116;

[0039] Fig.16 is a schematic structural diagram after a light-emitting layer is formed on the surface of the electron blocking layer away from the hole conducting layer in step S117;

[0040] Fig.17 is a schematic structural diagram after an electron conduction layer is formed on the surface of the light-emitting layer away from the electron blocking layer in step S118;

[0041] Fig.18 is a schematic diagram of the structure after an electron injection layer is formed on the surface of the electron conduction layer away from the light-emitting layer in step S119;

[0042] Fig.19 is a schematic structural diagram after the first metamaterial layer is formed on the surface of the electron injection layer away from the electron conduction layer in step S21;

[0043] Fig. 20 is a schematic structural diagram after the first super surface layer is formed on the surface of the electron injection layer away from the electron conduction layer in step S22;

[0044] Fig.21 is a schematic diagram of the structure after a cathode is formed on the surface of the first super surface layer away from the electron injection layer in step S3;

[0045] Fig. 22 is a schematic structural diagram after a second metamaterial layer is formed on a surface of the cathode away from the first metasurface layer in step S41;

[0046] Fig.23 is a schematic structural diagram after a second super surface layer is formed on a surface of the cathode away from the first super surface layer in step S42;

[0047] Fig.24 is a schematic diagram of the structure after a sealing layer is formed on the surface of the second super surface layer away from the cathode in step S5;

[0048] Fig.25 yes Figure 7 A schematic diagram of the preparation process of the display panel shown;

[0049] Fig.26 is a schematic structural diagram of forming a metamaterial layer on the surface of the electron injection layer away from the electron conduction layer in step S21';

[0050] Fig. 27 is a schematic structural diagram after a super surface layer is formed on the surface of the electron injection layer away from the electron conduction layer in step S22';

[0051] Fig.28 is a schematic structural diagram after a cathode is formed on the surface of the super surface layer away from the electron injection layer in step S3';

[0052] Fig.29 is a schematic diagram of the structure after a color filter layer is formed on the surface of the cathode away from the super surface layer in step S4';

[0053] Fig.30It is a schematic structural diagram after a sealing layer is formed on the surface of the color filter layer facing away from the cathode in step S5'. DETAILED DESCRIPTION

[0054] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0055] See also Figure 1 , Figure 1 It is a schematic diagram of the structure of the electronic device 1000 provided in an embodiment of the present application.

[0056] The electronic device 1000 may be, but is not limited to, a head mounted display (HMD), a mobile phone, a computer, a tablet computer, etc. The embodiment of the present application is described by taking the electronic device 1000 as a head mounted display device as an example. Exemplarily, the head mounted display device may be an AR head mounted display device, a VR head mounted display device, or an MR head mounted display device.

[0057] The electronic device 1000 may include a housing 400, a driver 200 and a display panel 100, wherein the driver 200 and the display panel 100 are both mounted on the inner side of the housing 400. The display panel 100 is electrically connected to the driver 200. The driver 200 is used to drive the display panel 100 to display text and images. Exemplarily, the display panel 100 may be an active-matrix organic light-emitting diode (AMOLED) display screen.

[0058] See also Figure 2 , Figure 2 yes Figure 1 The structure diagram of the display panel 100 in the electronic device 1000 is shown in the first embodiment.

[0059] In this embodiment, the display panel 100 may include a substrate 101, an anode 102, a pixel definition layer (PDL) 103, a hole injection layer (HIL) 104, a hole transport layer (HTL) 105, an electron block layer (EBL) 106, an emission layer (EL) 107, an electron transport layer (ETL) 108, an electron injection layer (EIL) 109, a cathode 110 and an even-numbered meta-surface layer 111. Exemplarily, the substrate 101 is a TFT (thin film transistor, TFT) substrate. Specifically, the substrate 101 may be a silicon-based complementary metal oxide semiconductor (CMOS) substrate. The pixel definition layer 103, the anode 102, the hole injection layer 104, the hole conduction layer 105, the electron blocking layer 106, the light emitting layer 107, the electron conduction layer 108, the electron injection layer 109, the cathode 110 and the even-numbered super surface layer 111 are arranged on the same side of the substrate 101.

[0060] The anode 102 is disposed on the surface of the substrate 101 and is electrically connected to the substrate 101 and to the positive electrode of the driver 200. The anode 102 can provide a higher work function and output a higher initial voltage to drive the display panel 100 to operate. At the same time, the holes of the anode 102 will move to the hole injection layer 104 under the action of the driver 200. Exemplarily, the anode 102 can be prepared from a Ti / Al / TiN composite material. Among them, the Ti metal layer 1021 is located on the surface of the substrate 101 and is connected to the Wu column (not shown) of the display panel 100. Exemplarily, the thickness of the Ti metal layer 1021 is 100 angstroms to ensure that the conductivity of the anode 102 is good. It should be noted that the Wu column is a connecting structure that can play a role in connecting other structures or devices. The TiN layer 1022 can be doped with compounds to ensure that the hole concentration of the anode 102 is large enough. Exemplarily, the thickness of the TiN layer 1022 is 10 angstroms. The Al metal layer 1023 may determine the output size of the work function of the anode 102. Exemplarily, the thickness of the Al metal layer 1023 is between 100 nm and 1 μm. In some other embodiments, the thickness of the Al metal layer 1023 may also be less than 100 nm.

[0061] In some other embodiments, the anode 102 may also be made of an Al / ITO composite material. It should be noted that ITO refers to indium tin oxide (Indium Tin Oxides), which is an N-type oxide semiconductor material with good conductivity and transparency.

[0062] In this embodiment, the pixel definition layer 103 is disposed on the surface of the substrate 101. The pixel definition layer 103 has an insulating function, which can prevent the anode 102 and the cathode 110 of the display panel 100 from accidentally touching each other. Exemplarily, the pixel definition layer 103 can be made of silicon dioxide. In some other embodiments, the pixel definition layer 103 can also be made of polystyrene.

[0063] In this embodiment, the pixel definition layer 103 includes two pixel separation parts 1031. Along the direction parallel to the substrate 101, the two pixel separation parts 1031 are spaced apart on opposite sides of the anode 102. Each pixel separation part 1031 is substantially in the shape of a cone column, and its thickness is between 100nm and 200nm. The pixel separation part 1031 can separate two adjacent sub-pixels in the display panel 100, so as to avoid the colors of the two adjacent sub-pixels from interfering with each other.

[0064] The hole injection layer 104, the hole conduction layer 105, the electron blocking layer 106, and the light emitting layer 107 are sequentially stacked on the side of the anode 102 away from the substrate 101. Specifically, the hole injection layer 104 is arranged on the side of the anode 102 away from the substrate 101. The hole conduction layer 105 is arranged on the surface of the hole injection layer 104 away from the anode 102. The electron blocking layer 106 is arranged on the surface of the hole conduction layer 105 away from the hole injection layer 104. The light emitting layer 107 is arranged on the surface of the electron blocking layer 106 away from the hole conduction layer 105. Among them, the energy level gap of the light emitting layer 107 can determine the actual light emission spectrum of the display panel 100.

[0065] It is understandable that when the anode 102 is electrically connected to the power supply of the driver 200 , the holes in the anode 102 are injected into the hole conduction layer 105 through the hole injection layer 104 under the action of the positive voltage. The hole conduction layer 105 transfers the holes to the light-emitting layer 107 .

[0066] In addition, the light-emitting layer 107 includes a blue light-emitting layer 107a, a spacer layer 107b, a green light-emitting layer 107c and a red light-emitting layer 107d which are stacked in sequence. Specifically, the blue light-emitting layer 107a is disposed on the surface of the hole conduction layer 105 away from the hole injection layer 104, the spacer layer 107b is disposed on the surface of the blue light-emitting layer 107a away from the hole conduction layer 105, the green light-emitting layer 107c is disposed on the surface of the spacer layer 107b away from the blue light-emitting layer 107a, and the red light-emitting layer 107d is disposed on the surface of the green light-emitting layer 107c away from the spacer layer 107b. Exemplarily, the blue light-emitting layer 107a can be formed by doping a hybrid of boron (B) and nitrogen (N) with a proportion of 5% in the main carrier of the blue light-emitting layer 107a. The red light-emitting layer 107d is formed by doping a complex containing iridium (Ir) with a proportion of 3% in the main carrier of the red light-emitting layer 107d. The green light emitting layer 107 c uses a complex containing iridium (Ir) doped into a main carrier of the green light emitting layer 107 c at a ratio of 6%.

[0067] The spacer layer 107b is used to adjust the charge in the light-emitting layer 107 to ensure that the light-emitting stability of the light-emitting layer 107 is better. Exemplarily, the spacer layer 107b is a charge regeneration layer (CGL). It can be understood that since the exciton binding channel of the blue light material is different from the exciton binding channel of the green light material and the red light material, the charge regeneration layer can regenerate electrons or holes, thereby ensuring that the partial pressure of the blue light-emitting layer 107a, the red light-emitting layer 107d, and the green light-emitting layer 107c is sufficient, ensuring that the light-emitting brightness of the display panel 100 is high. In some other embodiments, the spacer layer 107b can also be an interlayer (ITL).

[0068] In this embodiment, the electron conduction layer 108, the electron injection layer 109 and the cathode 110 are all arranged on the side of the light-emitting layer 107 away from the substrate 101. Among them, the electron conduction layer 108 is arranged on the surface of the light-emitting layer 107 away from the electron blocking layer 106. Specifically, the electron conduction layer 108 is arranged on the surface of the red light-emitting layer 107d away from the green light-emitting layer 107c. Exemplarily, the electron conduction layer 108 can be made of organic compounds. It should be noted that the preparation material of the electron conduction layer 108 can be adjusted according to the thickness and material of the light-emitting layer 107. The electron conduction layer 108 is used to conduct electrons to the interface between the light-emitting layer 107 and the electron conduction layer 108, so that the electrons can combine with holes to form excitons.

[0069] The electron injection layer 109 is disposed on the surface of the electron conduction layer 108 away from the light-emitting layer 107. Exemplarily, the thickness of the electron injection layer 109 is 10 angstroms. The electron injection layer 109 is used to provide a large amount of electrons to the electron conduction layer 108, and inject electrons into the electron conduction layer 108 along the direction of the electric field under the low voltage drive of the cathode 110. In this embodiment, the electron injection layer 109 may include a first metal layer 1091 and a second metal layer 1092. The first metal layer 1091 and the second metal layer 1092 are stacked. Among them, the first metal layer 1091 is disposed on the surface of the electron conduction layer 108 away from the light-emitting layer 107. Exemplarily, the first metal layer 1091 can be made of ytterbium (Yb) metal. The first metal layer 1091 can be used to improve the efficiency of electron injection of the electron injection layer 109. The second metal layer 1092 is disposed on the surface of the first metal layer 1091 away from the light-emitting layer 107. Exemplarily, the second metal layer 1092 may be made of magnesium (Mg) metal or silver (Ag) metal.

[0070] In this embodiment, the cathode 110 is arranged on the side of the electron injection layer 109 away from the electron conduction layer 108, and is electrically connected to the negative electrode of the driver 200. The cathode 110 can provide a work function in a low energy state and has a lower voltage. Exemplarily, the thickness of the cathode 110 is 200nm. In this embodiment, the cathode 110 can be made of indium zinc oxide (In-Zn-O) material. It should be noted that the indium zinc oxide material is a semiconductor material with good conductivity and transparency, and is widely used in display panels 100 that emit light upward.

[0071] In this embodiment, when the cathode 110 is electrically connected to the power supply of the driver 200, the electrons of the cathode 110 are injected into the electron conduction layer 108 through the electron injection layer 109 under the action of the negative voltage. The electron conduction layer 108 transmits the electrons to the light-emitting layer 107. The electron blocking layer 106 blocks the electrons of the cathode 110 at the interface between the light-emitting layer 107 and the electron blocking layer 106, so that the electrons and holes are combined in the light-emitting layer 107 to form excitons. In the process of the excitons transitioning from the excited state to the ground state, energy is released in the form of light, so that the light-emitting layer 107 can emit light, and then the display panel 100 can achieve self-luminescence.

[0072] It is understandable that, since the electron blocking layer 106 can intercept electrons and block the electrons in the light-emitting layer 107, the concentration of electrons in the light-emitting layer 107 can be increased, the probability of electrons and holes combining can be increased, and the light-emitting efficiency of the display panel 100 can be improved. At the same time, it can also ensure that electrons and holes are coupled in the light-emitting layer 107, so that the energy band gap of the obtained excitons corresponds to the energy band gap of the light-emitting layer 107.

[0073] Please refer to Figure 2 , Figure 3and Figure 4 , Figure 3 yes Figure 2 The schematic diagram of a part of the structure of the super surface layer 111 in the display panel 100 is shown. Figure 4 yes Figure 2 A partial structural schematic diagram of the insulating material layer 1112a and the metal material layer 1112b of the super surface layer 111 in the display panel 100 is shown.

[0074] In this embodiment, each super surface layer 111 is made of a metamaterial. It should be noted that a metamaterial refers to a material composed of metal atoms. In the preparation process of the super surface layer 111, a super surface micro unit structure is usually formed by using a metamaterial, and then the super surface micro unit structure is repeatedly arrayed to form the super surface layer 111. Exemplarily, the thickness of each super surface layer 111 is 100 angstroms.

[0075] Each super surface layer 111 includes m sub-material layers 1112, and the m sub-material layers 1112 are stacked. Wherein, m is an odd number equal to or greater than 3. Exemplarily, the m sub-material layers 1112 can be prepared by chemical vapor deposition or physical vapor deposition. The thickness of each sub-material layer 1112 is less than or equal to 10 angstroms. It should be noted that the material and thickness of each sub-material layer 1112 are determined according to the wavelength band of light actually required by the display panel 100, and the embodiments of the present application are not limited to this.

[0076] In this embodiment, the m sub-material layers 1112 can be divided into at least one insulating material layer 1112a and at least one metal material layer 1112b. The sum of the number of layers of at least one insulating material layer 1112a and at least one metal material layer 1112b is an odd number equal to or greater than 3. The metal material layers 1112b and the insulating material layers 1112a are alternately stacked. Exemplarily, there are seven sub-material layers 1112. The seven sub-material layers 1112 can be divided into four insulating material layers 1112a and three metal material layers 1112b. Among them, one metal material layer 1112b is arranged between two insulating material layers 1112a. In some other embodiments, the seven sub-material layers 1112 can also be divided into four metal material layers 1112b and three insulating material layers 1112a. Among them, one insulating material layer 1112a is located between two metal material layers 1112b. It should be noted that the material used to prepare the insulating material layer 1112 a and the material used to prepare the metal material layer 1112 b do not chemically react with the material used to prepare the electron injection layer 109 .

[0077] See also Figure 5 , Figure 5 yes Figure 2 The diagram is a partial structural diagram of the super-surface layer 111 in the display panel 100 at another angle.

[0078] Each super surface layer 111 is provided with a plurality of through holes 1111, and the plurality of through holes 1111 penetrate the super surface layer 111 along the thickness direction of the super surface layer 111. The plurality of through holes 1111 are arranged in an array and are spaced apart from each other. The apertures d of the plurality of through holes 1111 are all equal. Among them, the apertures d of the plurality of through holes 1111 are all between 1 / 2λ and 2λ. Exemplarily, the distance l between the centers of two adjacent through holes 1111 is 3d. That is, the distance l between the centers of two adjacent through holes 1111 is between 3 / 2λ and 6λ. Among them, λ refers to the average wavelength of red light, blue light and green light.

[0079] In this embodiment, by adjusting the optical constants of the super surface layer 111, the super surface layer 111 can realize the function of filtering. Among them, the optical constants of the super surface layer 111 can be jointly determined by the refractive index (n value) and the extinction coefficient (k value) of the super surface layer 111. Exemplarily, the refractive index of each super surface layer 111 is between 1.8 and 2.2, and the extinction coefficient of each super surface layer 111 is between 0.1 and 1.6. In some other embodiments, the refractive index of each super surface layer 111 can also be less than 1.8 or greater than 2.2, and the extinction coefficient of each super surface layer 111 can also be less than 0.1 or greater than 1.6.

[0080] It can be understood that, since the super surface layer 111 has the function of filtering light, there is no need to set an additional color filter in the display panel 100, which can reduce the thickness of the display panel 100 and reduce the weight of the display panel 100, thereby promoting the thinness of the display panel 100 and reducing the production cost of the display panel 100. At the same time, it can also avoid the color filter from absorbing light and increase the light intensity of the display panel 100. Exemplarily, the ratio of the thickness of the display panel 100 described in this embodiment to the thickness of the display panel using the color filter in the prior art is 2 / 3, and the ratio of the light intensity of the display panel 100 described in this embodiment to the light intensity of the display panel 100 using the color filter in the prior art is equal to or greater than 2.

[0081] In this embodiment, the even-numbered super surface layer 111 includes at least one first super surface layer 111a and one second super surface layer 111b, wherein the first super surface layer 111a is disposed between the electron injection layer 109 and the cathode 110, and the second super surface layer 111b is disposed between the cathode 110 and the sealing layer.

[0082] The sum of the number of the first supersurface layer 111a and the second supersurface layer 111b is an even number. Exemplarily, the first supersurface layer 111a has one.

[0083] See also Figure 6 , Figure 6 yes Figure 2 A schematic diagram of the light emission path of light in the display panel 100 is shown.

[0084] In this embodiment, the light-emitting layer 107 of the display panel 100 has a plurality of light-emitting point sources 1071. The following description will be made by taking one light-emitting point source 1071 as an example. In a direction parallel to the metasurface layer 111, each light-emitting point source 1071 may include a first side 1071a and a second side 1071b disposed opposite to each other. Each light-emitting point source 1071 may emit a first incident light 1072 toward the first side 1071a and a second incident light 1073 toward the second side 1071b.

[0085] When the first incident light 1072 is incident on the first super surface layer 111a, the first refraction occurs, and the first refracted light 1074 is emitted from the first side 1071a to the second side 1071b. The first refracted light 1074 is incident on the second super surface layer 111b, the second refraction occurs, and the second refracted light 1075 is emitted from the second side 1071b to the first side 1071a. The second refracted light 1075 and the first refracted light 1074 are both located on the first side 1071a of the light emitting point source 1071. The second incident light 1073 is incident on the first super surface layer 111a, the first refraction occurs, and the third refracted light 1076 is emitted from the second side 1071b to the first side 1071a. The third refracted light 1076 is incident on the second super surface layer 111b, the second refraction occurs, and the fourth refracted light 1077 is emitted from the first side 1071a to the second side 1071b. The fourth refracted light 1077 and the third refraction light are both located at the second side 1071 b of the light emitting point source 1071 .

[0086] In this embodiment, by setting two super surface layers 111, the light emitting path of the light emitting point source 1071 is reversed and folded, which is equivalent to moving the light emitting point source 1071 in the display panel 100 to the second super surface layer 111b, and making the light emitted by the light emitting point source 1071 directly emitted after being refracted once in the second super surface layer 111b. Under this setting, the light emitting angle of the display panel 100 is not limited by the physical size of the opening of the display panel 100 and the physical depth of the light emitting layer 107. On the one hand, the light emitting angle of the display panel 100 can reach 2π, so that the light emitting efficiency of the display panel 100 is no longer limited by the process film thickness of the display panel 100, thereby improving the light emitting efficiency and promoting the thinness of the display panel 100 and reducing the production cost. On the other hand, it also helps to improve the uniformity of the light emitting field of the display panel 100, so that the display effect of the display panel 100 is better. At the same time, the super-surface layer 111 can cause the light output path of the light emitted from the light-emitting point source 1071 in the display panel 100 to be folded on the same side of the light-emitting point source 1071, thereby avoiding crosstalk between the light outputs of different light-emitting point sources 1071 in the display panel 100.

[0087] Please refer again Figure 2 The display panel 100 further includes a sealing layer 112, which is disposed on the side of the cathode 110 away from the substrate 101. Specifically, the sealing layer 112 is disposed on the surface of the second super surface layer 111b away from the cathode 110. The sealing layer 112 can play a sealing role to prevent water vapor and oxygen in the air from entering the display panel 100, thereby ensuring that the display effect of the display panel 100 is better.

[0088] See also Figure 7 and Figure 8 , Figure 7 yes Figure 1 The structure diagram of the display panel 100 in the electronic device 1000 in the second embodiment is shown. Figure 8 yes Figure 7 A schematic diagram of the light emission path of light in the display panel 100 is shown.

[0089] The display panel 100 shown in this embodiment is different from the display panel 100 shown in the first embodiment described above in that there is one supersurface layer 113, and the supersurface layer 113 is arranged between the light-emitting layer 107 and the cathode 110. Specifically, the supersurface layer 113 is arranged on the surface of the electron injection layer 109 away from the light-emitting layer 107. In this embodiment, the supersurface layer 113 can be made of a polymer material that is transparent to visible light. Exemplarily, the supersurface layer 113 can be made of a polyesteramide material. It should be noted that the polymer material for preparing the supersurface layer 113 is determined by the wavelength band of visible light that the display panel 100 actually needs to transmit. In this embodiment, the supersurface layer 113 is used to modulate the polarization state of the light emitted by the light-emitting point source 1071 and the light output path of the modulated light to focus the light beam.

[0090] The metasurface layer 113 includes a plurality of polarization holes 1131, which are arranged in an array and spaced apart from each other. Exemplarily, each polarization hole 1131 is in the shape of a rectangular strip. The extension direction of each polarization hole 1131 is the same. Each polarization hole 1131 is used to convert the light emitted by the light source 1071 into linearly polarized light. The vibration direction of the linearly polarized light is parallel to the extension direction of the polarization hole 1131.

[0091] like Figure 6 As shown, in this embodiment, the first incident light 1072 emitted by the light-emitting point source 1071 is incident on the metasurface layer 113, and the first refracted light 1078 is emitted from the first side 1071a of the light-emitting point source 1071 to the direction of the second side 1071b. The refraction angle of the first refracted light 1078 is smaller than the incident angle of the first incident light 1072. At least part of the first refracted light 1078 passes through the polarization hole 1131 and emits a first linearly polarized light 1078a. The first linearly polarized light 1078a is emitted in a direction perpendicular to the metasurface layer 113. The second incident light 1073 emitted by the light-emitting point source 1071 is incident on the metasurface layer 113, and the second refracted light 1079 is emitted from the second side 1071b of the light-emitting point source 1071 to the direction of the first side 1071a. At least part of the second refracted light 1079 passes through the polarization hole 1131 and emits a second linearly polarized light 1079a. The second linearly polarized light 1079a is emitted in a direction perpendicular to the supersurface layer 113. The refraction angle of the second refracted light 1079 is smaller than the incident angle of the second incident light 1073.

[0092] In this embodiment, after the light emitted by the light-emitting point source 1071 is incident on the super surface layer 113, at least part of the light emitted by the light-emitting point source 1071 is modulated and converted into a polarization state by the super surface layer 113, and there is no need to set a polarizer in the display panel 100 to modulate the light into a polarization state, which can avoid the polarizer from causing loss of light intensity of the display panel 100, increase the light output rate of the light emitted from the display panel 100, and also facilitate the realization of the subsequent optical path folding scheme of the display panel 100, thereby helping to enhance the light field intensity of the display panel 100. At the same time, after the light emitted by the light-emitting point source 1071 is refracted in the super surface layer 113, the refraction angle of the light emitted by the light-emitting point source 1071 is less than the incident angle of the light emitted by the light-emitting point source 1071, so that the light emitted by the display panel 100 is gathered, which helps to improve the light output intensity of the display panel 100 and enhance the display effect of the display panel 100.

[0093] In addition, the display panel 100 further includes a color filter layer 114 and a sealing layer 115. The color filter layer 114 is disposed on the surface of the cathode 110 away from the super surface layer 113. The color filter layer 114 is used to filter light of a specific color so that the display panel 100 can display a color picture. The sealing layer 115 is disposed on the surface of the color filter layer 114 away from the cathode 110. Exemplarily, the sealing layer 115 can be a glass cover plate. The sealing layer 115 is used to protect and seal the display panel 100 to prevent substances such as water vapor and oxygen in the external environment from entering the display panel 100, thereby ensuring that the display effect of the display panel 100 is better.

[0094] Please refer to Figures 9 to 24 The embodiment of the present application also provides a method for preparing a first display panel 100 , which is used to prepare the display panel 100 shown in the first embodiment above.

[0095] Step S1 , providing a substrate (not shown in the figure), the substrate may include a substrate 101 and a light-emitting layer 107 , and the light-emitting layer 107 is disposed on one side of the substrate 101 .

[0096] In the above step S1, step S11 is also included, providing a substrate 101, forming an anode 102, a pixel definition layer 103, a hole injection layer 104, a hole conduction layer 105, an electron blocking layer 106, a light-emitting layer 107, an electron conduction layer 108 and an electron injection layer 109 on one side of the substrate 101 to obtain a substrate. In this embodiment, step S11 can be completed through steps S111 to S119.

[0097] Step S111, forming an anode 102 on the surface of the substrate 101. Exemplarily, a physical vapor deposition (PVD) method can be used to sequentially form a Ti metal layer 1021, an Al metal layer 1023 and a TiN layer 1022 on the surface of the substrate 101 to form an anode material layer 102a. The pressure during the physical vapor deposition process is 0.2 Pa, and the DC power supply power is 300 W. Then, the anode material layer 102a can be etched according to the morphology of the sub-pixel and the spacing between two adjacent sub-pixels, so as to form an anode 102 on the surface of the substrate 101. Exemplarily, a dry etching process can be used to etch the anode material layer 102a to ensure that the flatness of the anode 102 is high. The gas used in the dry etching process is a mixed gas of chlorine (Cl2) and oxygen (O2).

[0098] Step S112, forming a pixel material layer 103a on the surface of the substrate 101. The pixel material layer 103a covers the surface of the anode 102 away from the substrate 101. Exemplarily, the pixel material layer 103a can be formed on the surface of the substrate 101 by chemical vapor deposition.

[0099] Step S113, removing the portion of the pixel material layer 103a located on the surface of the anode 102 away from the substrate 101, to obtain the pixel definition layer 103. The pixel definition layer includes two pixel separation portions 1031. In a direction parallel to the substrate, the two pixel separation portions 1031 are spaced apart on opposite sides of the anode 102. Exemplarily, a wet etching process can be used to remove the portion of the pixel material layer 103a located on the surface of the anode 102 away from the substrate 101. The etching solvent used in the wet etching process can be ETC-1.

[0100] Step S114, forming a hole injection layer 104 on the surface of the anode 102 facing away from the substrate 101. For example, NDP-9 can be used as a dopant.

[0101] Step S115, forming a hole conduction layer 105 on the surface of the hole injection layer 104 facing away from the anode 102. For example, α-PND can be used as a dopant.

[0102] Step S116 , forming an electron blocking layer 106 on a surface of the hole conducting layer 105 away from the hole injection layer 104 .

[0103] Step S117, forming a light-emitting layer 107 on the surface of the electron blocking layer 106 away from the hole conducting layer 105. The light-emitting layer 107 includes a blue light-emitting layer 107a, a spacer layer 107b, a green light-emitting layer 107c and a red light-emitting layer 107d stacked in sequence. The blue light-emitting layer 107a is disposed on the surface of the hole conducting layer 105 away from the hole injection layer 104.

[0104] In the above steps S114 to S117, the hole injection layer 104, the hole conduction layer 105, the electron blocking layer 106 and the light-emitting layer 107 can be formed by evaporation. The temperature during the evaporation is less than or equal to 340° C. Exemplarily, the temperature during the evaporation is between 200° C. and 300° C. In addition, the preparation materials used in the above steps can be determined according to the specific structural design of the display panel 100.

[0105] Step S118, forming an electron conducting layer 108 on the surface of the light emitting layer 107 away from the electron blocking layer 106. For example, the electron conducting layer 108 may be formed by evaporation. Li-OH or Li may be used for doping, and the doping ratio may be 50%.

[0106] Step S119, forming an electron injection layer 109 on the surface of the electron conduction layer 108 away from the light emitting layer 107, to obtain a substrate. Exemplarily, a first metal layer 1091 and a second metal layer 1092 can be sequentially formed on the surface of the electron conduction layer 108 away from the light emitting layer 107 by physical vapor deposition, thereby obtaining the electron injection layer 109.

[0107] Step S2, forming a super surface layer 111 on the side of the light emitting layer 107 facing away from the substrate 101. The super surface layer 111 is a first super surface layer 111a.

[0108] In this embodiment, step S2 can be completed through steps S21 to S22.

[0109] Step S21 , forming a first metamaterial layer 111 c on a side of the light emitting layer 107 away from the substrate 101 . Specifically, the first metamaterial layer 111 c is located on a surface of the electron injection layer 109 away from the electron conduction layer 108 .

[0110] Step S22, etching the first metamaterial layer 111c to obtain a first metasurface layer 111a.

[0111] Step S3, forming a cathode 110 on a side of the super surface layer 111 away from the light emitting layer 107. Specifically, the cathode 110 is located on the surface of the first super surface layer 111a away from the electron injection layer 109. Exemplarily, the cathode 110 can be formed on the surface of the first super surface layer 111a away from the electron injection layer 109 by physical vapor deposition.

[0112] Step S4, forming another super surface layer 111 on the surface of the cathode 110 away from the super surface layer 111. The other super surface layer 111 is a second super surface layer 111b. Specifically, the second super surface layer 111b is located on the surface of the cathode 110 away from the first super surface layer 111a.

[0113] In this embodiment, step S4 can be completed through steps S41 to S42.

[0114] Step S41 , forming a second metamaterial layer 111 d on a surface of the cathode 110 away from the first metasurface layer 111 a .

[0115] Step S42, etching the second metamaterial layer 111d to obtain a second metasurface layer 111b.

[0116] After step S4, the first method for preparing a display panel further includes step S5, forming a sealing layer 112 on the surface of another super surface layer 111 away from the cathode 110, to obtain a display panel 100. Specifically, the sealing layer 112 is located on the surface of the second super surface layer 111b away from the cathode 110.

[0117] The embodiment of the present application also provides a method for preparing a second display panel 100 , which is used to prepare the display panel 100 shown in the second embodiment above.

[0118] See also Figures 25 to 30 . The method for preparing the second display panel 100 provided in the embodiment of the present application includes steps S1' to S5'. Among them, step S1' is the same as step S1 of the method for preparing the first display panel 100 mentioned above. The difference between the method for preparing the second display panel 100 provided in the embodiment of the present application and the method for preparing the first display panel 100 mentioned above is that, in step S2', a super surface layer 113 is formed on the side of the light-emitting layer 107 away from the substrate 101. Specifically, the super surface layer 113 is located on the surface of the electron injection layer 109 away from the electron conduction layer 108. Exemplarily, the super surface layer 113 can be made of polyester amide or other long-chain molecular polymers that can transmit visible light.

[0119] In this embodiment, step S2' can be completed through steps S21' to S22'.

[0120] Step S21 ′, forming a metamaterial layer 113 a on the side of the light emitting layer 107 away from the substrate 101 . Specifically, the metamaterial layer 113 a is located on the surface of the electron injection layer 109 away from the electron conduction layer 108 .

[0121] Step S22 ′, etching the metamaterial layer 113 a to obtain the metasurface layer 113 .

[0122] Step S3 ′, forming a cathode 110 on the side of the super surface layer 113 away from the light emitting layer 107 . Specifically, the cathode 110 is located on the surface of the super surface layer 113 away from the electron injection layer 109 .

[0123] After step S3 ′, the second method for manufacturing a display panel further includes step S4 ′, forming a color filter layer 114 on the surface of the cathode 110 away from the super-surface layer 113 .

[0124] In step S5 ′, a sealing layer 115 is formed on the surface of the color filter layer 114 facing away from the cathode 110 to obtain the display panel 100 .

[0125] The above are only some embodiments and implementation methods of the present application, and the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A display panel, characterized in that: It includes a substrate, a light-emitting layer, a cathode and an even-numbered super-surface layer, wherein the light-emitting layer, the cathode and the even-numbered super-surface layer are arranged on the same side of the substrate, the cathode is arranged on the side of the light-emitting layer away from the substrate, at least one super-surface layer is arranged on the side of the light-emitting layer away from the substrate, and at least one super-surface layer is arranged between the light-emitting layer and the cathode, wherein each of the super-surface layers includes at least one insulating material layer and at least one metal material layer, the sum of the number of layers of the insulating material layers and the metal material layers is an odd number equal to or greater than 3, and the metal material layers and the insulating material layers are alternately stacked.

2. The display panel according to claim 1, characterized in that: Each of the super surface layers is provided with a plurality of through holes, and the plurality of through holes penetrate the super surface layer along the thickness direction of the super surface layer. The plurality of through holes are arranged in an array and spaced apart from each other, and the apertures of the plurality of through holes are equal.

3. The display panel according to claim 2, characterized in that: The apertures of the plurality of through holes are all between 1 / 2λ and 2λ, wherein λ refers to the average wavelength of red light, blue light and green light.

4. The display panel according to claim 2, characterized in that: The distance between the centers of two adjacent through holes is between 3 / 2λ and 6λ, wherein λ refers to the average wavelength of red light, blue light and green light.

5. The display panel according to claim 1, characterized in that: The refractive index of each of the supersurface layers is between 1.8 and 2.

2.

6. The display panel according to claim 1, characterized in that: The extinction coefficient of each of the supersurface layers is between 0.1 and 1.

6.

7. The display panel according to claim 1, characterized in that: The even-numbered super surface layer comprises at least one first super surface layer and one second super surface layer, wherein the first super surface layer is arranged between the light-emitting layer and the cathode, and the second super surface layer is arranged on a side of the cathode away from the light-emitting layer; The sum of the number of layers of the first supersurface layer and the second supersurface layer is an even number.

8. The display panel according to claim 1, characterized in that: The display panel also includes an anode, a hole injection layer, a hole conduction layer, an electron blocking layer, an electron conduction layer, an electron injection layer and a sealing layer. The anode is arranged on the surface of the substrate and is located between the substrate and the light-emitting layer. The hole injection layer is arranged on the surface of the anode away from the substrate, the hole conduction layer is arranged on the surface of the hole injection layer away from the anode, the electron blocking layer is arranged on the surface of the hole conduction layer away from the hole injection layer, the electron conduction layer is located on the surface of the light-emitting layer away from the electron blocking layer, the electron injection layer is arranged on the surface of the electron conduction layer away from the light-emitting layer, and the sealing layer is arranged on the side of the cathode away from the substrate.

9. A display panel, characterized in that: The invention comprises a substrate, a light-emitting layer, a cathode and a supersurface layer, wherein the light-emitting layer, the cathode and the supersurface layer are arranged on the same side of the substrate, the cathode is located on the side of the light-emitting layer away from the substrate, the supersurface layer is located between the light-emitting layer and the cathode, and the supersurface layer is made of a polymer material that is transparent to visible light.

10. The display panel according to claim 9, characterized in that: The polymer material that is transparent to visible light is polyester amide.

11. The display panel according to claim 9, characterized in that: The super surface layer is provided with a plurality of polarization holes, and the plurality of polarization holes are arranged in an array and spaced apart from each other.

12. The display panel according to claim 9, characterized in that: The display panel also includes an anode, a hole injection layer, a hole conduction layer, an electron blocking layer, an electron conduction layer, an electron injection layer, a color filter layer and a sealing layer. The anode is arranged on the surface of the substrate and is located between the substrate and the light-emitting layer. The hole injection layer is arranged on the surface of the anode away from the substrate, the hole conduction layer is arranged on the surface of the hole injection layer away from the anode, the electron blocking layer is arranged on the surface of the hole conduction layer away from the hole injection layer, the electron conduction layer is located on the surface of the light-emitting layer away from the electron blocking layer, the electron injection layer is arranged on the surface of the electron conduction layer away from the light-emitting layer, the cathode is arranged on the surface of the super-surface layer away from the electron injection layer, the color filter layer is arranged on the surface of the cathode away from the super-surface layer, and the sealing layer is arranged on the surface of the color filter layer away from the cathode.

13. An electronic device, characterized in that: It comprises a shell and a display panel as described in any one of claims 1 to 11, wherein the display panel is mounted on the shell.

14. A method for preparing a display panel, characterized in that: include: Providing a substrate, the substrate may include a base plate and a light-emitting layer, wherein the light-emitting layer is disposed on one side of the base plate; forming a super surface layer on a side of the light emitting layer away from the substrate; forming a cathode on a side of the super surface layer away from the light emitting layer; Another super surface layer is formed on the surface of the cathode away from the one super surface layer.

15. The method for preparing a display panel according to claim 14, characterized in that: After the step of forming another super surface layer on the surface of the cathode away from the super surface layer, the method for preparing the display panel further includes: A sealing layer is formed on the surface of the other super surface layer facing away from the cathode.

16. A method for preparing a display panel, characterized in that: include: Providing a substrate, the substrate may include a base plate and a light-emitting layer, wherein the light-emitting layer is disposed on one side of the base plate; A super surface layer is formed on the side of the light emitting layer facing away from the substrate, wherein the super surface layer can be made of polyester amide or other long-chain molecular polymers that can transmit visible light; A cathode is formed on a side of the super surface layer away from the light emitting layer.

17. The method for manufacturing a display panel according to claim 16, characterized in that: After the step of forming a cathode on a side of the super surface layer away from the light emitting layer, the method for preparing the display panel further includes: A color filter layer is formed on the surface of the cathode facing away from the super surface layer.

18. The method for preparing a display panel according to claim 17, characterized in that: After the step of forming a color filter layer on the surface of the cathode away from the super surface layer, the method for preparing the display panel further includes: A sealing layer is formed on the surface of the color filter layer away from the cathode.

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