Laser cutting method and device

Abstract

The invention belongs to the technical field of laser cutting, and particularly discloses a laser cutting method and device. The laser cutting method comprises the steps that laser is emitted, and beam expanding and focusing are conducted on the laser; adjusting the focus point of the laser to the surface of the to-be-cut glass; the annular cutting channel to-be-cut glass is driven to rotate around the rotating axis, so that the annular cutting channel focus point moves relative to the annular cutting channel to-be-cut glass along the annular virtual line; the annular cutting channel focus point is controlled to move circularly along the cutting track, the cutting track of the annular cutting channel at least partially penetrates through the annular virtual line of the annular cutting channel, and an included angle is formed between the plane where the cutting track of the annular cutting channel is located and the thickness direction of the to-be-cut glass of the annular cutting channel; the focus point of the annular cutting channel is controlled to continuously or periodically move in the thickness direction of the to-be-cut glass; and after the to-be-cut glass is cut, the laser is turned off. The technical problem that the flatness of the cut end face of the glass tube can be reduced when the glass tube is cut through three laser beams can be solved.

Description

Technical Field

[0001] The present application belongs to the field of laser cutting technology, and specifically relates to a laser cutting method and device. Background Art

[0002] A glass tube is a long and thin glass product, usually cylindrical or conical; glass tubes need to be cut during processing. Compared with traditional cutting methods, laser cutting of glass has high precision and is less prone to microcracks, breakage or fragmentation. The edge of the glass has extremely high resistance to breakage. An existing laser cutting method for glass tubes is to provide three laser beams respectively, so that the focal points of the three laser beams scan one-third of the annular tube wall of the glass tube to be cut and cut the tube wall. The three laser beams are difficult to control on the same plane, which will reduce the flatness of the cut end face of the glass tube, and it is difficult to use on glass tubes with high requirements for end face flatness. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a laser cutting method and device to solve the technical problem in the prior art that three laser beams cutting a glass tube will reduce the flatness of the cut end surface of the glass tube.

[0004] To achieve the above-mentioned objectives, an embodiment of the first aspect of the present application provides a laser cutting method, including: emitting a laser and expanding and focusing the laser beam; adjusting the focal point of the laser to the surface of the glass to be cut; driving the glass to be cut on the annular cutting path to rotate around the rotation axis so that the focal point of the annular cutting path moves relative to the glass to be cut on the annular cutting path along a circular virtual line; controlling the focal point of the annular cutting path to move cyclically along a cutting trajectory, the annular cutting path cutting trajectory at least partially passes through the annular virtual line of the annular cutting path, and the plane where the annular cutting path cutting trajectory is located is set at an angle to the thickness direction of the glass to be cut on the annular cutting path; controlling the focal point of the annular cutting path to move continuously or periodically along the thickness direction of the glass to be cut; after the glass to be cut is cut, turning off the laser and controlling the annular cutting path glass to be cut to stop rotating.

[0005] In some embodiments, the step of controlling the circular cutting path focal point to move cyclically along the cutting trajectory includes: when the thickness direction of the glass to be cut by the circular cutting path is consistent with the direction of the rotation axis of the circular cutting path, the circular cutting path cutting trajectory is perpendicular to the rotation axis of the circular cutting path.

[0006] In some embodiments, the step of controlling the focusing point of the annular cutting path to move cyclically along the cutting trajectory includes: when the thickness direction of the glass to be cut by the annular cutting path is perpendicular to the direction of the rotation axis of the annular cutting path, the plane where the cutting trajectory of the annular cutting path is located is parallel to the rotation axis of the annular cutting path, and at least part of the cutting trajectory of the annular cutting path is set at an angle to the plane where the annular virtual line of the annular cutting path is located.

[0007] In some embodiments, the cutting trajectory of the annular cutting path includes a plurality of first cutting segments arranged at intervals along a direction perpendicular to the rotation axis of the annular cutting path. The first cutting segments of the annular cutting path pass through the annular virtual line of the annular cutting path. The first cutting segments of the annular cutting path are arranged at an angle to the plane where the annular virtual line of the annular cutting path is located.

[0008] In some embodiments, the cutting trajectory of the annular cutting path includes a plurality of second cutting segments spaced apart along the length direction of the first cutting segment of the annular cutting path, and the second cutting segments of the annular cutting path are perpendicular to the first cutting segments of the annular cutting path; the second cutting segments of the annular cutting path are connected end to end with the first cutting segments of the annular cutting path, and the second cutting segments of the annular cutting path and the first cutting segments of the annular cutting path form a plurality of nested rectangular trajectories.

[0009] In some embodiments, the distance between the first cutting segments of adjacent annular cutting lanes ranges from 0.06 mm to 0.08 mm.

[0010] In some embodiments, the step of controlling the periodic movement of the focal point of the annular cutting path along the thickness direction of the glass to be cut includes: turning off the laser at each interval T1, then controlling the focal point of the annular cutting path to move along the thickness direction of the glass to be cut, and then turning on the laser; T1 is equal to the time it takes for the annular cutting path to rotate one circle of the glass to be cut.

[0011] In some embodiments, the power of the controlled laser is in the range of 100 watts to 120 watts.

[0012] In some embodiments, the glass to be cut along the circular cutting path is a glass tube; when the glass to be cut along the circular cutting path is driven to rotate, the axis of the circular cutting path glass tube coincides with the rotation axis of the circular cutting path; when the focusing point of the circular cutting path is controlled to move along the thickness direction of the glass to be cut, the focusing point of the circular cutting path is controlled to move from the highest point of the inner surface of the circular cutting path glass tube to the highest point of the outer surface of the circular cutting path glass tube.

[0013] The embodiment of the second aspect of the present application provides a laser cutting device, the annular cutting path laser cutting device uses a method as any one of the embodiments of the first aspect to cut the annular cutting path to be cut glass, the annular cutting path laser cutting device includes: a laser, used to emit laser; a beam expander, arranged on the light-emitting side of the annular cutting path laser, the annular cutting path beam expander is used to change the diameter and divergence angle of the laser and transmit the laser; a galvanometer, arranged on the light-emitting side of the annular cutting path beam expander, the annular cutting path galvanometer is used to transmit the laser transmitted by the annular cutting path beam expander to the annular cutting path to be cut glass and control the laser to move cyclically along the annular cutting path cutting trajectory; a field mirror, arranged on the light-emitting side of the annular cutting path galvanometer, the annular cutting path field mirror is used to converge the laser transmitted by the annular cutting path galvanometer so that the laser forms a focal point; a rotating device, used to drive the annular cutting path to be cut glass to rotate around the annular cutting path rotation axis; a moving device, connected to the annular cutting path beam expander, the annular cutting path moving device is used to drive the annular cutting path beam expander to move relative to the annular cutting path rotating device.

[0014] The beneficial effects of the laser cutting method and laser cutting device provided by the present application are as follows: the embodiment of the present application uses one laser beam to cut the glass to be cut, and there is no need to dock the cutting tracks of multiple laser beams, which makes it easy to control the flatness of the cut end face, and can improve the flatness of the cut end face of the glass tube. The cutting track forms an angle with the thickness direction of the glass to be cut and intersects with the annular virtual line, which can increase the width of the annular cutting path, making it easier for the glass to fall after breaking, and stabilizing the cutting process. Compared with the method of cutting multiple circles in the direction of the annular virtual line and increasing the width of the annular cutting path, the embodiment of the present application controls the glass to be cut to rotate one circle to obtain a wider annular cutting path. At the same cutting speed, the embodiment of the present application controls the rotation speed of the glass to be cut to be slower, and it is easier to control the moving track formed by the laser relative to the glass to be cut. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 A schematic diagram of a laser cutting method provided in some embodiments of the present application;

[0017] Figure 2 A schematic diagram of a cutting trajectory provided for some embodiments of the present application;

[0018] Figure 3 A schematic diagram of laser cutting a glass tube provided in some embodiments of the present application;

[0019] Figure 4 Schematic diagram of a laser cutting device provided for some embodiments of the present application.

[0020] Among them, the reference numerals in the figure are:

[0021] 100, laser cutting device; 10, laser; 20, beam expander; 30, galvanometer; 40, field lens; 50, rotating device; 60, rotating axis; 70, focusing point; 80, cutting track; 81, first cutting section; 82, second cutting section; 90, annular virtual line;

[0022] 200. Glass to be cut. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] The embodiment of the present application provides a laser cutting method and a laser cutting device 100 for cutting glass products. The embodiment of the present application is described using the cutting of glass tubes as an example. It can be understood that the laser cutting method and the laser cutting device 100 can also cut other glass products such as glass plates and glass columns.

[0028] The first embodiment of the present application provides a laser cutting method. Figure 1 ,include:

[0029] S100: emit laser and expand and focus the laser beam.

[0030] After emitting the laser, the laser is first expanded and then focused. It can be understood that expanding the laser beam means controlling the laser divergence and increasing the laser beam diameter. Optionally, after expanding the laser beam, the laser is formed into a parallel beam. When a lens is used to focus the laser to form a focal point 70, the distance between the lens and the focal point 70 is equal to the focal length of the lens, which is convenient for adjusting the position of the focal point 70 by adjusting the position of the lens. It can be understood that focusing the laser means controlling the laser to converge at one point to form a focal point 70. Optionally, the laser uses a nanosecond laser, which has good beam quality, a small focused spot, and a small heat-affected zone, and can achieve precision cutting.

[0031] S200: Adjust the focal point 70 of the laser to the surface of the glass 200 to be cut.

[0032] Before cutting the glass 200 to be cut, the focus point 70 is first adjusted to the position to be cut first, that is, the focus point 70 is adjusted to a surface of the glass 200 to be cut along the thickness direction. Optionally, during the process of adjusting the focus point 70, the laser is adjusted to a lower power to prevent damage to the glass 200 to be cut. Optionally, for the same glass 200 to be cut, only the position of the focus point 70 relative to the first glass 200 to be cut can be adjusted, and the subsequent glass 200 to be cut can be directly cut after emitting the laser without adjusting the position of the focus point 70 again.

[0033] During the laser cutting process of the glass 200 to be cut, the glass can absorb heat, the glass near the focal point 70 is heated, the glass near the focal point 70 has a temperature difference with the glass at a lower temperature, thermal stress is generated in the cut glass, and the glass at the heating position of the focal point 70 is broken by the thermal stress. Controlling the focal point 70 to a smaller size can reduce the range of glass breakage, and the smaller glass fragments can improve the flatness of the cut section. The broken glass falls under gravity or other methods such as a dust adsorption device are used to move the broken glass to make the glass fall, and multiple broken positions are connected to form lines and surfaces.

[0034] For the convenience of description, the first surface is defined as the side of the glass to be cut 200 close to the laser emission source along the thickness direction, and the second surface is defined as the side of the glass to be cut 200 away from the laser emission source along the thickness direction. It can be understood that the laser can be directly focused on the first surface of the glass to be cut 200 to form a focal point 70 on the first surface; because glass is light-transmissive, the laser can also pass through the glass to be cut 200 to be focused on the second surface of the glass to be cut 200 to form a focal point 70 on the second surface.

[0035] S300 : driving the glass 200 to be cut to rotate around the rotation axis 60 , so that the focus point 70 moves along the annular virtual line 90 relative to the glass 200 to be cut.

[0036] For the convenience of description, a rotation axis 60 and an annular virtual line 90 are defined. The annular virtual line 90 is the trajectory of the static focus point 70 on the glass 200 to be cut after the glass 200 to be cut rotates one circle. The plane where the annular virtual line 90 is located is perpendicular to the rotation axis 60, and the focus point 70 is located on the annular virtual line 90. When cutting the glass 200 to be cut, the laser cuts the glass 200 to be cut along the direction of the annular trajectory.

[0037] S400: Control the focus point 70 to move cyclically along the cutting track 80, wherein the cutting track 80 at least partially passes through the annular virtual line 90, and the plane where the cutting track 80 is located is set at an angle to the thickness direction of the glass 200 to be cut.

[0038] The cutting track 80 is the moving track of the focus point 70 relative to the stationary glass 200 to be cut. The cutting track 80 at least partially intersects with the annular virtual line 90, that is, the cutting track 80 at least partially does not touch and overlap with the annular virtual line 90. Optionally, the plane where the cutting track 80 is located is perpendicular to the thickness direction of the glass 200 to be cut. When the laser cuts the glass 200 to be cut along the direction of the annular track, it also cuts the glass 200 to be cut along the cutting track 80.

[0039] The moving track of the focus point 70 on the glass to be cut 200 is related to the cutting track 80 and the rotation track of the glass to be cut 200. When the moving speed of the focus point 70 is much greater than the rotation linear speed of the glass to be cut 200, the moving track shape of the focus point 70 is nearly consistent with the moving track of the focus point 70 on the glass to be cut 200. The focus point 70 is controlled to move cyclically along the cutting track 80, that is, after the focus point 70 is controlled to move along the cutting track 80 once, the focus point 70 is controlled to move along the cutting track 80 again, and this is repeated multiple times.

[0040] S500: Control the focus point 70 to move continuously or periodically along the thickness direction of the glass 200 to be cut.

[0041] While controlling the focus point 70 to move along the cutting trajectory 80, the focus point 70 can be controlled to move continuously along the thickness direction of the glass 200 to be cut, or the focus point 70 can be controlled to move periodically along the thickness direction of the glass 200 to be cut. Controlling the focus point 70 to move along the thickness direction of the glass 200 to be cut, that is, controlling the laser to cut the glass 200 to be cut along the thickness direction. Controlling the focus point 70 to move continuously along the thickness direction of the glass 200 to be cut, the laser continuously cuts the glass 200 to be cut, and the trajectory of the focus point 70 moving relative to the glass 200 to be cut is in the shape of a spiral line as a whole. Controlling the focus point 70 to move periodically, that is, controlling the focus point 70 to move once every certain period of time, the laser cuts the glass 200 to be cut layer by layer, and the trajectory of the focus point 70 moving relative to the glass 200 to be cut is in the shape of a nested ring as a whole.

[0042] After the glass 200 to be cut rotates one circle relative to the focusing point 70, the glass at the position where the focusing point 70 passes is broken, and an annular cutting path is formed on the glass 200 to be cut, and the depth direction of the annular cutting path is the thickness direction of the glass 200 to be cut. Since the cutting track 80 forms an angle with the thickness direction of the glass 200 to be cut and intersects with the annular virtual line 90, the focusing point 70 moves in the width direction of the annular cutting path when moving along the cutting track 80, increasing the width of the annular cutting path and filling the width direction of the annular cutting path. The focusing point 70 moves in the thickness direction of the glass 200 to be cut, that is, moves in the depth direction of the annular cutting path, so that the annular cutting path is deepened. When the depth of the annular cutting path is consistent with the thickness of the glass 200 to be cut, part of the glass is removed and the cutting is completed.

[0043] S600: After the glass 200 to be cut is cut, the laser is turned off and the glass 200 to be cut is controlled to stop rotating.

[0044] The beneficial effects of the embodiment of the present application are as follows: the embodiment of the present application uses one laser beam to cut the glass 200 to be cut, and there is no need to dock the cutting tracks 80 of multiple laser beams, so it is easy to control the flatness of the cut end surface, and the flatness of the cut end surface of the glass tube can be improved. The cutting track 80 forms an angle with the thickness direction of the glass 200 to be cut and intersects with the annular virtual line 90, which can increase the width of the annular cutting path, making it easier for the glass to fall after breaking, and stabilizing the cutting process. Compared with the method of cutting multiple circles in the direction of the annular virtual line 90 and increasing the width of the annular cutting path, the embodiment of the present application controls the glass 200 to be cut to rotate one circle to obtain a wider annular cutting path. At the same cutting speed, the embodiment of the present application controls the glass 200 to be cut to rotate at a slower speed, and it is easier to control the moving track formed by the laser relative to the glass 200 to be cut.

[0045] In some embodiments, step S400 includes: when the thickness direction of the glass 200 to be cut is consistent with the direction of the rotation axis 60 , the cutting trajectory 80 is perpendicular to the rotation axis 60 , and at least part of the cutting trajectory 80 passes through part of the annular virtual line 90 .

[0046] In the case where the thickness direction of the glass to be cut 200 is consistent with the direction of the rotation axis 60 , the glass to be cut 200 may be a glass plate or the like.

[0047] The cutting track 80 is perpendicular to the rotation axis 60 , that is, the cutting track 80 does not extend along the thickness direction of the glass 200 to be cut.

[0048] At least part of the cutting track 80 passes through part of the annular virtual line 90, that is, at least part of the cutting track 80 has an intersection with the annular virtual line 90, and at least part of the cutting track 80 is on both sides of the inner and outer sides of the annular virtual line 90. When the laser cuts the glass 200 to be cut along the direction of the annular virtual line 90, it also cuts the glass 200 to be cut on both sides of the inner and outer sides of the annular virtual line 90. Optionally, the straight line on which at least part of the cutting track 80 is located passes through the rotation axis 60, so that the cutting track 80 has a larger size in the radial direction of the annular virtual line 90 to increase the width of the annular cutting path.

[0049] The beneficial effects of the embodiment of the present application are as follows: the cutting track 80 is perpendicular to the rotation axis 60, so that the focus point 70 does not move in the thickness direction of the glass 200 to be cut when moving along the cutting track 80, and the movement of the focus point 70 along the cutting track 80 has little effect on the depth of the annular cutting path, which facilitates the separate control of the movement of the focus point 70 in the thickness direction of the glass 200 to be cut. Compared with the laser cutting the glass 200 to be cut only along the direction of the annular virtual line 90, part of the cutting track 80 passes through part of the annular virtual line 90, so that the laser cuts the glass 200 to be cut on both the inner and outer sides of the annular virtual line 90, which can increase the width of the annular cutting path and make the glass easier to fall after breaking.

[0050] In some embodiments, step S400 includes: when the thickness direction of the glass 200 to be cut is perpendicular to the direction of the rotation axis 60, the plane where the cutting trajectory 80 is located is parallel to the rotation axis 60, and at least part of the cutting trajectory 80 is set at an angle to the plane where the annular virtual line 90 is located.

[0051] When the thickness direction of the glass 200 to be cut is perpendicular to the direction of the rotation axis 60 , the glass 200 to be cut may be a glass tube or a glass column, etc., and the thickness direction of the glass tube or glass column is its own radial direction.

[0052] The plane where the cutting track 80 is located is parallel to the rotation axis 60 , that is, the cutting track 80 does not extend along the thickness direction of the glass 200 to be cut.

[0053] At least part of the cutting track 80 is set at an angle to the plane where the annular virtual line 90 is located, that is, at least part of the cutting track 80 is on both sides of the plane where the annular virtual line 90 is located along the direction of the rotation axis 60. When the laser cuts the glass 200 to be cut along the direction of the annular virtual line 90, it also cuts the glass 200 to be cut on both sides of the annular virtual line 90 along the direction of the rotation axis 60. Optionally, the straight line where at least part of the cutting track 80 is located is parallel to the rotation axis 60, so that the cutting track 80 has a larger size in the direction of the rotation axis 60 to increase the width of the annular cutting path.

[0054] The beneficial effects of the embodiment of the present application are as follows: the plane where the cutting track 80 is located is parallel to the rotation axis 60, so that the focus point 70 does not move in the thickness direction of the glass 200 to be cut when moving along the cutting track 80, and the movement of the focus point 70 along the cutting track 80 has little effect on the depth of the annular cutting path, which facilitates the separate control of the movement of the focus point 70 in the thickness direction of the glass 200 to be cut. Compared with the laser cutting the glass 200 to be cut only along the direction of the annular virtual line 90, the partial cutting track 80 is set at an angle with the plane where the annular virtual line 90 is located, so that the laser cuts the glass 200 to be cut on both sides of the annular virtual line 90 along the direction of the rotation axis 60, which can increase the width of the annular cutting path and make the glass easier to fall after breaking.

[0055] In some embodiments, in step S400, the cutting trajectory 80 includes a plurality of first cutting segments 81 spaced apart along a direction perpendicular to the rotation axis 60, the first cutting segments 81 pass through the annular virtual line 90, and the first cutting segments 81 are arranged at an angle to the plane where the annular virtual line 90 is located.

[0056] The first cutting segments 81 are arranged at intervals relative to the stationary glass 200 to be cut in a direction perpendicular to the rotation axis 60. Since the glass 200 to be cut rotates around the rotation axis 60, the first cutting segments 81 are arranged at intervals on the glass 200 to be cut in a direction approximately along the annular virtual line 90. The laser cuts the glass 200 to be cut in the direction of the annular virtual line 90, that is, the first cutting segments 81 cut the glass 200 to be cut in the direction of the annular virtual line 90. Optionally, the first cutting segments 81 are perpendicular to the plane where the annular virtual line 90 is located, that is, the first cutting segments 81 are perpendicular to the thickness direction of the glass 200 to be cut. When the glass 200 to be cut is cut along the first cutting segments 81, the influence on the cutting of the thickness direction of the glass 200 to be cut is reduced, and it is convenient to control the laser to cut the glass 200 to be cut in the thickness direction alone. When cutting the glass 200 to be cut, the glass is broken to a certain extent with the focus 70 as the center. Optionally, the distance between the first cutting segments 81 is equal to the length or width of the range of glass breakage, so that the broken glass around two adjacent first cutting segments 81 can cover the glass between the two first cutting segments 81. During laser cutting, jumps are made between adjacent first cutting segments 81 and between adjacent cutting tracks 80.

[0057] The beneficial effects of the embodiments of the present application are as follows: the focusing point 70 can heat the surrounding glass. After the focusing point 70 cuts the glass along the first cutting segment 81, the glass around the first cutting segment 81 is also heated. The first cutting segments 81 are arranged at intervals so that when the laser cuts the glass 200 to be cut along the first cutting segment 81, it can avoid the already heated glass around the adjacent first cutting segment 81, thereby reducing the situation of secondary heating of the glass that has not fallen off after heating, and reducing the situation of the glass melting and adhering to the glass 200 to be cut after the secondary heating.

[0058] In some embodiments, please refer to Figure 2 The cutting track 80 includes a plurality of second cutting segments 82 spaced apart along the length direction of the first cutting segment 81, and the second cutting segments 82 are perpendicular to the first cutting segment 81; the second cutting segments 82 are connected end to end with the first cutting segment 81, and the second cutting segments 82 and the first cutting segments 81 form a plurality of nested rectangular tracks.

[0059] It can be understood that the lengths of the multiple first cutting segments 81 in the same cutting trajectory 80 are different, and the lengths of the multiple second cutting segments 82 in the same cutting trajectory 80 are different.

[0060] Optionally, the first cutting segment 81 is parallel to the rotation axis 60, so that the cutting track 80 has a larger size in the direction of the rotation axis 60, so as to increase the width of the annular cutting path.

[0061] Optionally, the distance between adjacent second cutting segments 82 ranges from 0.06 mm to 0.08 mm, so as to adapt to the situation where the length, width and height dimensions of the broken glass at the heating position range from 0.06 mm to 0.08 mm.

[0062] The beneficial effects of the embodiment of the present application are as follows: two adjacent rectangular tracks in the same cutting track 80 can both break the glass between the two rectangular tracks, and can complete the cutting of the area between the two adjacent rectangular tracks, thereby ensuring the cutting effect.

[0063] In other embodiments, the second cutting segment 82 and the first cutting segment 81 are sequentially connected to form a serpentine shape.

[0064] In some embodiments, the distance between adjacent first cutting segments 81 ranges from 0.06 mm to 0.08 mm.

[0065] It can be understood that the distance between two adjacent first cutting segments in the same cutting track 80 ranges from 0.06 mm to 0.08 mm. The distance between adjacent first cutting segments in adjacent cutting tracks 80 also ranges from 0.06 mm to 0.08 mm.

[0066] In the case where the cutting track includes the first cutting segment, the distance between adjacent cutting tracks 80 is also the distance between two adjacent first cutting segments 81, and the distance ranges from 0.06 mm to 0.08 mm.

[0067] In the case where the cutting track includes nested rectangular tracks, the distance between adjacent cutting tracks 80 is also the distance between two adjacent first cutting segments 81, and the distance ranges from 0.06 mm to 0.08 mm.

[0068] Optionally, the distance between adjacent first cutting segments 81 may be set to 0.06 mm, 0.07 mm or 0.08 mm.

[0069] The focusing point 70 is controlled at a smaller size so that the length, width and height of the broken glass at the heating position range from 0.06mm to 0.08mm. In the embodiment of the present application, the distance between adjacent first cutting segments 81 is set to 0.06mm to 0.08mm so that the glass between the spaced cutting tracks 80 can be broken, thereby ensuring the cutting effect.

[0070] In some embodiments, in step S500, the step of controlling the focusing point 70 to move periodically along the thickness direction of the glass to be cut 200 includes: turning off the laser at each interval T1, then controlling the focusing point 70 to move along the thickness direction of the glass to be cut 200, and then turning on the laser; T1 is equal to the time it takes for the glass to be cut 200 to rotate one circle.

[0071] It can be understood that the laser continuous emission time is preset according to the time required for the glass 200 to be cut to rotate one circle, so that the laser cuts the glass 200 to be cut once and then pauses to complete the first layer cutting of the glass 200 to be cut. After the focus point 70 is controlled to move a certain distance in the thickness direction of the glass 200 to be cut, the laser is turned on again to perform the second layer cutting of the glass 200 to be cut, and the depth of the annular cutting path is increased; the above process is repeated to perform periodic cutting until the cutting is completed.

[0072] Optionally, the distance range of each time the focusing point 70 is controlled to move along the thickness direction of the glass 200 to be cut is 0.06 mm to 0.08 mm, so as to adapt to the situation that the length, width and height of the broken glass at the heating position range from 0.06 mm to 0.08 mm. The number of times the focusing point 70 is controlled to move along the thickness direction of the glass 200 to be cut is set according to the thickness of the glass 200 to be cut.

[0073] The beneficial effect of the embodiment of the present application is that turning off the laser when moving the focusing point 70 along the thickness direction of the glass 200 to be cut can prevent the laser from repeatedly heating the glass remaining at the cut position and prevent the glass from melting and adhering to the glass 200 to be cut.

[0074] In some embodiments, the power of the controlled laser is in the range of 100 watts to 120 watts.

[0075] Optionally, the power of the laser can be controlled at 100 W, 110 W or 120 W. Controlling the laser power at 100 W can reduce the risk of glass melting, controlling the laser power at 120 W can reduce the risk of insufficient thermal stress in the glass 200 to be cut, and controlling the laser power at 110 W can reduce both the risk of glass melting and the risk of insufficient thermal stress in the glass 200 to be cut.

[0076] The beneficial effect of the embodiment of the present application is that the laser power is controlled within the range of 100 watts to 120 watts to heat the glass 200 to be cut to a suitable temperature, so that the thermal stress in the glass 200 to be cut breaks the glass and prevents the glass from being melted.

[0077] In some embodiments, please refer to Figure 3 , the glass 200 to be cut is a glass tube; when the glass 200 to be cut is driven to rotate, the axis of the glass tube coincides with the rotation axis 60; when the focusing point 70 is controlled to move along the thickness direction of the glass 200 to be cut, the focusing point 70 is controlled to move from the highest point of the inner surface of the glass tube to the highest point of the outer surface of the glass tube.

[0078] It can be understood that when cutting the glass tube, the focus point 70 is adjusted to the highest point of the inner surface of the glass tube, the glass tube is cut from the inner surface first, and the annular cutting path is deepened from the inner surface to the outer surface along the thickness direction of the glass tube. The cutting track 80 is always near the highest point of the inner surface of the glass tube.

[0079] The beneficial effects of the embodiment of the present application are: the focusing point 70 is adjusted to the highest point on the inner surface of the glass tube, the glass on the glass tube is not blocked after being broken, and the glass can fall directly, reducing the influence of glass fragments and dust and plasma formed by cutting on the laser.

[0080] In some embodiments, please refer to Figure 1 The glass 200 to be cut is a glass tube, and the laser cutting method includes:

[0081] S100: emit laser and expand and focus the laser beam.

[0082] S200: Adjust the focal point 70 of the laser to the highest point of the inner surface of the glass 200 to be cut.

[0083] S300 : driving the glass 200 to be cut to rotate around the rotation axis 60 , with the thickness direction of the glass 200 to be cut being perpendicular to the direction of the rotation axis 60 , so that the focus point 70 moves along the annular virtual line 90 relative to the glass 200 to be cut.

[0084] S400: Control the focus point 70 to move cyclically along the cutting track 80, and the plane where the cutting track 80 is located is parallel to the rotation axis 60. The cutting track 80 includes a plurality of first cutting segments 81 arranged at intervals in a direction perpendicular to the rotation axis 60, the first cutting segments 81 are perpendicular to the plane where the annular virtual line 90 is located, and the first cutting segments 81 pass through the annular virtual line 90; the cutting track 80 also includes a plurality of second cutting segments 82 arranged at intervals in the length direction of the first cutting segments 81, and the second cutting segments 82 are parallel to the rotation axis 60; the second cutting segments 82 are connected end to end with the first cutting segments 81, and the second cutting segments 82 and the first cutting segments 81 form a plurality of nested rectangular tracks, the distance range between adjacent rectangular tracks is 0.07 mm, and the distance between adjacent cutting tracks 80 is 0.07 mm.

[0085] S500: Control the focus point 70 to move periodically along the thickness direction of the glass 200 to be cut; at each interval T1, turn off the laser, then control the focus point 70 to move along the thickness direction of the glass 200 to be cut, the moving distance is 0.07mm, and then turn on the laser; T1 is equal to the time it takes for the glass 200 to be cut to rotate one circle.

[0086] S600: After the glass 200 to be cut is cut, the laser is turned off and the glass 200 to be cut is controlled to stop rotating.

[0087] The second embodiment of the present application provides a laser cutting device 100, please refer to Figure 4 The laser cutting device 100 cuts the glass 200 to be cut by any one of the methods in the first aspect of the embodiment. The laser cutting device 100 includes a laser 10, a beam expander 20, a galvanometer 30, a field lens 40, a rotating device 50 and a moving device. The laser 10 is used to emit laser light; the beam expander 20 is arranged on the light-emitting side of the laser 10, and the beam expander 20 is used to change the diameter and divergence angle of the laser light and transmit the laser light; the galvanometer 30 is arranged on the light-emitting side of the beam expander 20, and the galvanometer 30 is used to transmit the laser light transmitted by the beam expander 20 to the glass 200 to be cut and control the laser light to move cyclically along the cutting track 80; the field lens 40 is arranged on the light-emitting side of the galvanometer 30, and the field lens 40 is used to converge the laser light transmitted by the galvanometer 30 so that the laser light forms a focusing point 70; the rotating device 50 is used to drive the glass 200 to be cut to rotate around the rotation axis 60; the moving device is connected to the beam expander 20, and the moving device is used to drive the beam expander 20 to move relative to the rotating device 50.

[0088] Optionally, the laser 10 uses an infrared nanosecond laser, which has high precision, high speed, and high quality effects at a low cost.

[0089] Optionally, the beam expander 20 is connected to the laser 10 via an output head. Optionally, the output head is connected to the laser 10 via an optical fiber cable, which facilitates the movement of the output head and the beam expander 20. Optionally, the beam expander 20 expands the laser beam into a parallel beam, and when the field lens 40 is used to focus the laser to form a focal point 70, the distance between the field lens 40 and the focal point 70 is equal to the focal length of the lens, so that the position of the focal point 70 can be adjusted by adjusting the position of the field lens 40.

[0090] The galvanometer 30 can control the laser to deflect on the plane, so that the laser moves cyclically along the cutting track 80. The galvanometer 30 can receive the laser expanded by the beam expander 20 and change the direction of the laser so that the laser can be directed toward the glass 200 to be cut.

[0091] Optionally, the field lens 40 may be fixedly connected to the galvanometer mirror 30, or may not be connected to the galvanometer mirror 30. The optical axis direction of the field lens 40 is consistent with the thickness direction of the glass 200 to be cut.

[0092] The rotating device 50 can fix the glass 200 to be cut. Optionally, the rotating device 50 includes a power part such as a motor. Optionally, the galvanometer 30, the field lens 40 and the rotating device 50 are arranged in sequence from top to bottom, and the falling of the broken glass will not affect the laser beam. Optionally, the rotating axis 60 is perpendicular to the thickness direction of the glass 200 to be cut, which is convenient for cutting the glass tube. Optionally, the rotating device 50 can be connected to the glass 200 to be cut through a structure such as an electric push rod or a hydraulic lever to adjust the position of the glass 200 to be cut in the direction perpendicular to the thickness of the glass 200 to be cut, thereby changing the cutting position.

[0093] When the parallel laser beam passes through the field lens 40, a focal point 70 is formed. The distance between the focal point 70 and the field lens 40 is equal to the focal length of the field lens 40. The moving device can control the movement of the laser focal point 70 by driving the field lens 40 to move. The moving device can drive the field lens 40 to move along the thickness direction of the glass 200 to be cut, so that the laser focal point 70 can move relative to the thickness direction of the glass 200 to be cut. Optionally, the moving device can also be connected to the output head, the beam expander 20 and the galvanometer 30 to drive the output head, the beam expander 20 and the galvanometer 30 to move synchronously with the field lens 40.

[0094] Optionally, the laser cutting device 100 further includes a dust adsorption device, which is used to absorb broken glass chips.

[0095] The beneficial effects of the embodiments of the present application are as follows: the laser 10 and the beam expander 20 can be combined to emit parallel lasers, the moving device drives the field lens 40 to move to control the focusing point 70 to move in the thickness direction of the glass to be cut 200, the galvanometer 30 can control the focusing point 70 to move in a circular motion along the cutting trajectory 80, and the rotating device 50 can drive the cut glass to rotate around the rotation axis 60, so that the focusing point 70 moves in the direction of the circular virtual line 90 relative to the glass to be cut 200. Therefore, the laser cutting device 100 can use any one of the methods in the first aspect of the embodiments to cut the glass 200 to make the cross-section of the cut glass smooth.

[0096] In some embodiments, the glass 200 to be cut is a glass tube with a diameter of 40 mm and a wall thickness of 5 mm as an example for detailed description. Before cutting the glass tube, the laser 10 is set to an infrared nanosecond fiber laser and the laser 10 exit spot is 7 mm; the beam expander 20 is set to a fixed-magnification beam expander 20 and the beam expansion multiple is 1.54 times; the focal length of the field lens 40 is set to f=160 mm; and the marking speed of the galvanometer 30 (controlling the moving speed of the focus point 70) is set to 4000 mm / s. The laser cutting trajectory 80 is set to a square of 0.6 mm*0.6 mm through the marking software, and the cutting trajectory 80 is a nested rectangle with a spacing of 0.07 mm between adjacent rectangles. A moving device is set to drive the field lens 40 to move periodically along the thickness direction of the glass tube, with a single moving distance of 0.07 mm and a moving number of 70 times. According to the step S200, the position of the field lens 40 is adjusted in advance using the moving device so that the laser can converge at the highest point position on the inner surface of the glass tube after being emitted.

[0097] After the above parameters are set, the laser emits light and the galvanometer 30 starts cutting according to the set cutting trajectory 80, and the rotating device 50 drives the glass tube to start rotating.

[0098] In step S100, the laser 10 emits laser light with a power of 100 watts, a frequency of 150 KHZ, and a pulse width of 10 nanoseconds; the beam expander 20 diffuses the laser light into a parallel beam, the galvanometer 30 deflects the laser light and directs it toward the field lens 40, and the field lens 40 converges the laser light at its focus.

[0099] In step S300 , the rotation speed of the glass tube is controlled to be 40 r / min by the control software of the rotating device 50 .

[0100] In step S400 , the galvanometer is controlled by the marking software so that the focus point moves cyclically along the set cutting track 80 .

[0101] In step S500, the marking software controls the moving device to drive the field lens 40 to move periodically along the thickness direction of the glass tube. Whenever the laser cutting time is equal to the time for the glass tube to rotate one circle, the moving device controls the field lens 40 to lift 0.07 mm until it is lifted to the set number of times and the cut part of the glass tube falls off.

[0102] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A laser cutting method, characterized in that: include: Emitting laser and expanding and focusing the laser beam; Adjust the focus of the laser to the surface of the glass to be cut; Driving the glass to be cut to rotate around the rotation axis so that the focal point moves along a circular virtual line relative to the glass to be cut; Controlling the focus point to move cyclically along a cutting track, wherein the cutting track at least partially passes through the annular virtual line, and a plane where the cutting track is located is arranged at an angle to a thickness direction of the glass to be cut; Controlling the focus point to move continuously or periodically along the thickness direction of the glass to be cut; After the glass to be cut is cut, the laser is turned off and the glass to be cut is controlled to stop rotating.

2. The laser cutting method according to claim 1, characterized in that: The step of controlling the focusing point to move cyclically along the cutting track includes: when the thickness direction of the glass to be cut is consistent with the direction of the rotation axis, the cutting track is perpendicular to the rotation axis.

3. The laser cutting method according to claim 1, characterized in that: The step of controlling the focusing point to move cyclically along the cutting trajectory includes: when the thickness direction of the glass to be cut is perpendicular to the direction of the rotation axis, the plane where the cutting trajectory is located is parallel to the rotation axis, and at least part of the cutting trajectory is set at an angle to the plane where the circular virtual line is located.

4. The laser cutting method according to claim 3, characterized in that: The cutting track includes a plurality of first cutting segments spaced apart in a direction perpendicular to the rotation axis, the first cutting segments passing through the annular virtual line, and the first cutting segments forming an angle with the plane where the annular virtual line is located.

5. The laser cutting method according to claim 4, characterized in that: The cutting track includes a plurality of second cutting segments spaced apart along the length direction of the first cutting segment, the second cutting segments being perpendicular to the first cutting segment; the second cutting segments are connected end to end with the first cutting segment, and the second cutting segments and the first cutting segment form a plurality of nested rectangular tracks.

6. The laser cutting method according to claim 4 or 5, characterized in that: The distance between adjacent first cutting segments ranges from 0.06 mm to 0.08 mm.

7. The laser cutting method according to any one of claims 1 to 5, characterized in that: The step of controlling the focal point to move periodically along the thickness direction of the glass to be cut includes: turning off the laser at each interval T1, then controlling the focal point to move along the thickness direction of the glass to be cut, and then turning on the laser; T1 is equal to the time it takes for the glass to be cut to rotate one circle.

8. The laser cutting method according to any one of claims 1 to 5, characterized in that: The power range of the controlled laser is 100 watts to 120 watts.

9. The laser cutting method according to any one of claims 3 to 5, characterized in that: The glass to be cut is a glass tube; when the glass to be cut is driven to rotate, the axis of the glass tube coincides with the rotation axis; when the focusing point is controlled to move along the thickness direction of the glass to be cut, the focusing point is controlled to move from the highest point of the inner surface of the glass tube to the highest point of the outer surface of the glass tube.

10. A laser cutting device, characterized in that: The laser cutting device cuts the glass to be cut by the method according to any one of claims 1 to 9, and the laser cutting device comprises: Laser, used for emitting laser light; A beam expander, disposed on the light-emitting side of the laser, and used to change the diameter and divergence angle of the laser and transmit the laser; A galvanometer, disposed on the light-emitting side of the beam expander, the galvanometer is used to transmit the laser transmitted by the beam expander to the glass to be cut and control the laser to move cyclically along the cutting track; A field lens is provided on the light-emitting side of the galvanometer, and is used to converge the laser light transmitted by the galvanometer so as to form a focal point of the laser light; A rotating device, used for driving the glass to be cut to rotate around the rotating axis; A moving device is connected to the beam expander, and the moving device is used to drive the beam expander to move relative to the rotating device.

Images