Alignment processing device
By designing a wire-adjusting treatment device, the comb tooth on the paddle mechanism is used to remove impurities in the gaps of the silicon rod, solving the problem of relying on operators for wire-adjusting treatment after wire-out is broken, realizing automatic wire-adjusting and improving silicon wafer production Efficiency and quality.
Patent Information
- Application Number
- CN202411720938.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-01-10
AI Technical Summary
In the production of semiconductor silicon wafers, after the silicon rod is broken during cutting, the existing technology is difficult to effectively remove the viscous mortar, which makes it difficult for the silicon wafer to be completely opened, which easily causes silicon wafer rupture and product quality to decline, and the wiring processing is too dependent on operators. Capability and experience lead to silicon wafer damage and low production efficiency.
Design a wiring processing device, including a first driving mechanism and a paddle mechanism, remove impurities through the insertion of the comb teeth into the gap of the silicon rod, and realize automatic and accurate wiring, and avoid the difficulty of accurate wiring of steel wires due to impurities filling and blockage. question.
It realizes automatic and accurate wiring after the multi-wire cutting machine is disconnected, reduces silicon wafer damage, improves production efficiency and product quality, liberates manpower, and simplifies the wiring process.
Smart Images
Figure CN119283213A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and in particular to a line processing device. Background Art
[0002] In the semiconductor silicon wafer production industry, steel wire breakage often occurs due to fluctuations in the hardness and tension of the silicon rods themselves.
[0003] Once the silicon rod is broken during cutting, it must be pulled out of the wire mesh, rewound and aligned to resume cutting. However, alignment is the most important and difficult step. Since there is sticky mortar between the silicon wafers, it is easy for the silicon wafers to stick to each other. At this time, if a water gun or air gun is used to manually flush the silicon wafers, it is difficult to effectively remove the mortar, resulting in the silicon wafers still being difficult to fully open, which can easily cause the silicon wafers to break and cause large losses.
[0004] In the existing technology, the wire alignment after wire breakage is not good and is too dependent on the ability and experience of the operator, which can easily lead to silicon wafer damage and product quality degradation. At present, how to accurately align wires after wire breakage has become a particularly serious problem that plagues semiconductor silicon wafer manufacturers. Summary of the invention
[0005] The present invention provides a wire alignment processing device, which can accurately align the wires of silicon rods after they are cut and broken.
[0006] In order to achieve the above object, the technical solution adopted by the embodiment of the present invention is:
[0007] A line processing device, comprising:
[0008] ontology;
[0009] A first driving mechanism is mounted on the body;
[0010] A paddle mechanism connected to the first driving mechanism, wherein the paddle mechanism is provided with a plurality of comb teeth;
[0011] The first driving mechanism is used to drive the paddle mechanism to move toward the silicon rod to be processed, so that the comb teeth on the paddle mechanism are inserted into the gaps cut on the silicon rod to be processed to remove impurities in the gaps.
[0012] In some embodiments, the paddle mechanism includes:
[0013] The first plectrum comprises: a plectrum substrate and a plurality of comb-tooth pieces, wherein the plurality of comb-tooth pieces are evenly spaced and arranged on one side of the plectrum substrate;
[0014] a second paddle, the structure of the second paddle being the same as that of the first paddle;
[0015] Wherein, the first driving mechanism is connected to the paddle substrate of the first paddle and the paddle substrate of the second paddle respectively;
[0016] The first driving mechanism is used to drive the first paddle and the second paddle to move toward the silicon rod to be processed, so that the comb teeth of the first paddle and the comb teeth of the second paddle are respectively inserted into the gap on the silicon rod to be processed from both sides of the silicon rod to be processed.
[0017] In some embodiments, the first driving mechanism comprises:
[0018] A first motor, a second motor, a third motor, a fourth motor, a first drive assembly, and a second drive assembly;
[0019] The first driving assembly is connected to the first paddle, the first motor and the second motor respectively, the first motor is used to drive the first driving assembly to drive the first paddle to move horizontally, and the second motor is used to drive the first driving assembly to drive the first paddle to move longitudinally;
[0020] The second driving assembly is connected to the second paddle, the third motor and the fourth motor respectively. The third motor is used to drive the second driving assembly to drive the second paddle to move horizontally. The fourth motor is used to drive the second driving assembly to drive the second paddle to move longitudinally.
[0021] In some embodiments, the first drive assembly includes: a first screw rod and a second screw rod, wherein the first end of the second screw rod is connected to the second screw rod, and the second end of the second screw rod is connected to the first paddle;
[0022] The second driving assembly includes: a third screw rod and a fourth screw rod, wherein a first end of the fourth screw rod is connected to the third screw rod, and a second end of the fourth screw rod is connected to the second paddle;
[0023] Wherein, the first motor is used to drive the first screw rod to drive the first paddle to perform lateral movement;
[0024] The second motor is used to drive the second screw rod to drive the first paddle to move longitudinally;
[0025] The third motor is used to drive the third screw rod to drive the second paddle to perform lateral movement;
[0026] The fourth motor is used to drive the fourth screw rod to drive the second paddle to move longitudinally.
[0027] In some embodiments, the first driving mechanism further includes: a first connecting member and a second connecting member, both fixedly connected to the body;
[0028] Wherein, the first connecting member and the second connecting member are both provided with a transverse mounting through hole and a longitudinal mounting through hole;
[0029] The first screw rod is inserted into a transverse mounting through hole on the first connecting member, and the second screw rod is inserted into a longitudinal mounting through hole on the first connecting member;
[0030] The third screw rod is inserted into a transverse mounting through hole on the second connecting member, and the fourth screw rod is inserted into a longitudinal mounting through hole on the second connecting member.
[0031] In some embodiments, a thread matching the first screw rod is provided in the transverse mounting through hole on the first connecting member;
[0032] A thread matching the second screw rod is provided in the longitudinal mounting through hole on the first connecting member;
[0033] A thread matching the third screw rod is provided in the transverse mounting through hole on the second connecting member;
[0034] A thread matching the fourth screw rod is arranged in the longitudinal mounting through hole on the second connecting member.
[0035] In some embodiments, the line processing device further includes:
[0036] The transport mechanism is used to transport the silicon rods to be processed.
[0037] In some embodiments, the transport mechanism comprises:
[0038] A mechanical arm, wherein the mechanical arm is mounted on the body;
[0039] A carrier, fixedly connected to the mechanical arm, and used to fix the silicon rod to be processed;
[0040] The second driving mechanism is used to drive the mechanical arm to drive the carrier to move so as to transport the silicon rods to be processed.
[0041] The beneficial effects of the present invention are:
[0042] In this embodiment, the first driving mechanism can drive the paddle mechanism to move toward the silicon rod to be processed, so that the comb teeth on the paddle mechanism are inserted into the gaps on the silicon rod to be processed, thereby removing impurities (such as mortar) in the gaps. In this way, the impurities in the cutting gaps on the silicon rod to be processed can be processed after the multi-wire saw is broken, avoiding the problem of the steel wire on the multi-wire saw being difficult to accurately align due to impurities filling the gaps and causing damage to the silicon wafer, and realizing automatic and accurate alignment, thereby solving the problem of relying on the operator's ability and experience to align after the multi-wire saw is broken, freeing up manpower, simply and effectively improving production efficiency, and greatly improving the product quality of silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] Figure 1 A schematic diagram showing wire alignment processing after wire breakage of a multi-wire cutting machine in the prior art;
[0044] Figure 2 A schematic diagram showing line processing of a line processing device according to an embodiment of the present invention;
[0045] Figure 3 A schematic diagram showing the positions of the paddle mechanism and the silicon rods to be processed according to an embodiment of the present invention;
[0046] Figure 4 A schematic diagram showing a first driving mechanism controlling a paddle mechanism according to an embodiment of the present invention;
[0047] Figure 5 A schematic diagram showing the connection between the second connecting member and the third screw rod and the fourth screw rod according to an embodiment of the present invention. DETAILED DESCRIPTION
[0048] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.
[0049] like Figure 1 As shown, the multi-wire saw 001 breaks the wire when cutting the silicon rod 002. After rewinding the wire, manual alignment is required to align the steel wire with the cutting gap on the silicon rod 002, wherein the carrier 003 is used to fix the silicon rod 002 and control the up and down movement of the silicon rod 002. This manual alignment processing method is too dependent on the ability and experience of the operator, which can easily cause damage to the silicon wafer and reduce product quality.
[0050] In order to solve the above technical problems, an embodiment of the present invention provides a wire alignment processing device, which can accurately align the silicon rods after they are cut and broken.
[0051] like Figure 2-Figure 5 As shown, an embodiment of the present invention provides a wire processing device, comprising: a body, a first driving mechanism 1 and a paddle mechanism 2. The first driving mechanism 1 is mounted on the body; the paddle mechanism 2 is connected to the first driving mechanism 1, and a plurality of comb teeth 2001 are arranged on the paddle mechanism 2; the first driving mechanism 1 is used to drive the paddle mechanism 2 to move toward the silicon rod 3 to be processed, so that the comb teeth 2001 on the paddle mechanism 2 are inserted into the slits 301 cut on the silicon rod 3 to be processed, so as to remove impurities in the slits 301.
[0052] It should be noted that by cleaning the gaps 301 of the silicon rods 3 to be processed through the alignment processing device, the problem of impurities (such as sticky mortar) in the gaps 301 causing the cut parts to stick to each other and thus being unable to align can be solved.
[0053] In this embodiment, the first driving mechanism 1 can drive the paddle mechanism 2 to move toward the silicon rod 3 to be processed, so that the comb teeth 2001 on the paddle mechanism 2 are inserted into the gap 301 on the silicon rod 3 to be processed, thereby removing impurities (such as mortar) in the gap 301. In this way, the impurities in the cutting gap on the silicon rod to be processed can be processed after the multi-wire saw is broken, avoiding the problem that the steel wire on the multi-wire saw is difficult to accurately align due to impurities filling the gap and causing damage to the silicon wafer, and realizing automatic accurate alignment, thereby solving the problem that the multi-wire saw needs to rely on the operator's ability and experience to align the wire after the wire is broken, freeing up manpower, simply and effectively improving production efficiency, and greatly improving the product quality of silicon wafers.
[0054] like Figure 3-Figure 4 As shown, in some embodiments, the paddle mechanism 2 includes: a first paddle 201 and a second paddle 202 .
[0055] The first paddle 201 includes: a paddle substrate 2002 and a plurality of comb teeth 2001 , wherein the plurality of comb teeth 2001 are evenly spaced and arranged on one side of the paddle substrate 2002 ; the structure of the second paddle 202 is the same as that of the first paddle 201 .
[0056] Among them, the first driving mechanism 1 is respectively connected to the paddle substrate 2002 of the first paddle 201 and the paddle substrate 2002 of the second paddle 202; the first driving mechanism 1 is used to drive the first paddle 201 and the second paddle 202 to move toward the silicon rod 3 to be processed, so that the comb teeth 2001 of the first paddle 201 and the comb teeth 2001 of the second paddle 202 are respectively inserted into the gap 301 on the silicon rod 3 to be processed from both sides of the silicon rod 3 to be processed.
[0057] In some embodiments, the first driving mechanism 1 includes: a first motor 101, a second motor 102, a third motor 103, a fourth motor 104, a first driving assembly and a second driving assembly.
[0058] Among them, the first driving assembly is respectively connected to the first paddle 201, the first motor 101 and the second motor 102, the first motor 101 is used to drive the first driving assembly to drive the first paddle 201 to make a lateral movement, and the second motor 102 is used to drive the first driving assembly to drive the first paddle 201 to make a longitudinal movement; the second driving assembly is respectively connected to the second paddle 202, the third motor 103 and the fourth motor 104, the third motor 103 is used to drive the second driving assembly to drive the second paddle 202 to make a lateral movement, and the fourth motor 104 is used to drive the second driving assembly to drive the second paddle 202 to make a longitudinal movement.
[0059] It should be noted that when the silicon rod 3 to be processed needs to be processed, the first drive assembly and the second drive assembly are driven by the second motor 102 and the fourth motor 104 respectively, so that the first drive assembly and the second drive assembly move longitudinally (that is, move in a direction perpendicular to the horizontal plane), thereby driving the first paddle 201 and the second paddle 202 to move to the wire-breaking position on the silicon rod 3 to be processed; and then the first motor 101 and the third motor 103 are driven by the first drive assembly and the second drive assembly respectively, so that the first drive assembly and the second drive assembly move longitudinally (that is, move in a direction perpendicular to the horizontal plane). The assembly performs lateral movement (i.e., movement in a direction parallel to the horizontal plane), thereby driving the first paddle 201 and the second paddle 202 to approach the silicon rod 3 to be processed from both sides thereof, and further moves so that the comb-toothed pieces 2001 on the first paddle 201 and the second paddle 202 are inserted into the gap 301 formed by the steel wire (the steel wire on the multi-wire saw) on the silicon rod 3 to be processed; then, the first driving assembly is driven by the first motor 101 and the second motor 102, driving the first paddle 201 to perform a composite movement (including lateral movement and movement in parallel to the horizontal plane). The first paddle 201 is driven by the third motor 103 and the fourth motor 104 to drive the second paddle 202 to perform a composite motion (including lateral motion and longitudinal motion), so that the comb-toothed piece 2001 on the first paddle 201 moves a certain distance along the insertion direction, and the third motor 103 and the fourth motor 104 drive the third driving assembly to drive the second paddle 202 to perform a composite motion (including lateral motion and longitudinal motion), so that the comb-toothed piece 2001 on the second paddle 202 moves a certain distance along the insertion direction. In this way, the first paddle 201 and the second paddle 202 can be continuously driven to move downward to the lower edge of the silicon rod 3 to be processed; finally, the silicon rod 3 to be processed is moved downward, and at the same time, The first motor 101, the second motor 102, the third motor 103 and the fourth motor 104 can continue to drive the paddle mechanism 2, so that the paddle mechanism 2 gradually moves away from the silicon rod 3 to be processed, until the steel wire on the multi-wire saw enters the gap in the silicon rod 3 to be processed to complete the alignment. At this time, the first motor 101, the second motor 102, the third motor 103 and the fourth motor 104 can continue to drive the first paddle 201 and the second paddle 202 on the paddle mechanism 2 away from the silicon rod 3 to be processed, and restart the multi-wire saw to cut the silicon rod 3 to be processed. In this way, after the multi-wire saw is disconnected, the alignment processing device can be used to automatically align the silicon rod 3 to minimize the loss of silicon wafers.
[0060] In some embodiments, the first drive component includes: a first screw rod 105 and a second screw rod 106, the first end of the second screw rod 106 is connected to the second screw rod 106, and the second end of the second screw rod 106 is connected to the first paddle 201; the second drive component includes: a third screw rod 107 and a fourth screw rod 108, the first end of the fourth screw rod 108 is connected to the third screw rod 107, and the second end of the fourth screw rod 108 is connected to the second paddle 202.
[0061] Among them, the first motor 101 is used to drive the first screw rod 105 to drive the first paddle 201 to make lateral movement; the second motor 102 is used to drive the second screw rod 106 to drive the first paddle 201 to make longitudinal movement; the third motor 103 is used to drive the third screw rod 107 to drive the second paddle 202 to make lateral movement; the fourth motor 104 is used to drive the fourth screw rod 108 to drive the second paddle 202 to make longitudinal movement.
[0062] like Figure 5 As shown, in some embodiments, the first driving mechanism 1 also includes: a first connecting member and a second connecting member 109, both of which are fixedly connected to the main body; wherein, the first connecting member and the second connecting member 109 are both penetrated with a transverse mounting through hole and a longitudinal mounting through hole; the first screw rod 105 is penetrated into the transverse mounting through hole on the first connecting member, and the second screw rod 106 is penetrated into the longitudinal mounting through hole on the first connecting member; the third screw rod 107 is penetrated into the transverse mounting through hole on the second connecting member 109, and the fourth screw rod 108 is penetrated into the longitudinal mounting through hole on the second connecting member 109.
[0063] In some embodiments, the transverse mounting through hole on the first connecting member is provided with a thread matching the first screw rod 105; the longitudinal mounting through hole on the first connecting member is provided with a thread matching the second screw rod 106; the transverse mounting through hole on the second connecting member 109 is provided with a thread matching the third screw rod 107; and the longitudinal mounting through hole on the second connecting member 109 is provided with a thread matching the fourth screw rod 108.
[0064] It should be noted that the outer walls of the first screw rod 105, the second screw rod 106, the third screw rod 107 and the fourth screw rod 108 are all provided with threads. When the first motor 101 drives the first screw rod 105 to rotate on the first connecting member, the lateral linear motion is realized through the thread transmission, thereby driving the first paddle 201 to move lateral. Similarly, when the second motor 102 drives the second screw rod 106 to rotate on the first connecting member, the longitudinal linear motion is realized through the thread transmission, thereby driving the first paddle 201 to move longitudinally. In addition, the principle of the third screw rod 107 and the fourth screw rod 108 driving the second paddle 202 to move is similar to that of the first screw rod 105 and the second screw rod 106, which will not be repeated here.
[0065] In some embodiments, the in-line processing device further includes: a transport mechanism for transporting the silicon rods 3 to be processed.
[0066] In this embodiment, after removing impurities in the gap 301 on the silicon rod 3 to be processed, the silicon rod 3 to be processed can be transported to the target position by the transport mechanism, so that the steel wire on the multi-wire saw enters the gap in the silicon rod 3 to be processed, and continues to drive the silicon rod 3 to be processed to move until the silicon rod 3 to be processed moves to the wire-breaking position, and the wire alignment is completed. In this way, the silicon rod 3 to be processed can be wire-aligned after the multi-wire saw breaks, so as to minimize the loss of silicon wafers and improve the efficiency of handling abnormalities after the multi-wire saw breaks.
[0067] In some specific embodiments, the transport mechanism includes: a mechanical arm, a platform 4, and a second driving mechanism. The mechanical arm is mounted on the body; the platform 4 is fixedly connected to the mechanical arm, and the platform 4 is used to fix the silicon rod 3 to be processed; the second driving mechanism is used to drive the mechanical arm to drive the platform 4 to move, so as to transport the silicon rod 3 to be processed.
[0068] It should be noted that the first paddle 201 and the second paddle 202 are respectively located on two sides of the carrier 4 , and are equivalent to the symmetrical arrangement of the carrier 4 .
[0069] In this embodiment, the first driving mechanism 1 can drive the paddle mechanism 2 to move toward the silicon rod 3 to be processed, so that the comb teeth 2001 on the paddle mechanism 2 are inserted into the gap 301 on the silicon rod 3 to be processed, thereby removing impurities (such as mortar) in the gap 301. In this way, the impurities in the cutting gap on the silicon rod to be processed can be processed after the multi-wire saw is broken, avoiding the problem that the steel wire on the multi-wire saw is difficult to accurately align due to impurities filling the gap and causing damage to the silicon wafer, and realizing automatic accurate alignment, thereby solving the problem that the multi-wire saw needs to rely on the operator's ability and experience to align the wire after the wire is broken, freeing up manpower, simply and effectively improving production efficiency, and greatly improving the product quality of silicon wafers.
[0070] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.
[0071] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0072] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.
[0073] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.
[0074] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A line processing device, characterized in that: include: ontology; A first driving mechanism (1) is mounted on the body; A paddle mechanism (2) connected to the first driving mechanism (1), wherein the paddle mechanism (2) is provided with a plurality of comb teeth (2001); The first driving mechanism (1) is used to drive the paddle mechanism (2) to move toward the silicon rod (3) to be processed, so that the comb teeth (2001) on the paddle mechanism (2) are inserted into the slits (301) formed by cutting on the silicon rod (3) to be processed, so as to remove impurities in the slits (301).
2. The line processing device according to claim 1, characterized in that: The paddle mechanism (2) comprises: A first plectrum (201) comprises: a plectrum substrate (2002) and a plurality of comb teeth (2001), wherein the plurality of comb teeth (2001) are evenly spaced and arranged on one side of the plectrum substrate (2002); A second paddle (202), wherein the structure of the second paddle (202) is the same as that of the first paddle (201); Wherein, the first driving mechanism (1) is respectively connected to a paddle substrate (2002) of the first paddle (201) and a paddle substrate (2002) of the second paddle (202); The first driving mechanism (1) is used to drive the first paddle (201) and the second paddle (202) to move toward the silicon rod (3) to be processed, so that the comb teeth (2001) of the first paddle (201) and the comb teeth (2001) of the second paddle (202) are respectively inserted into the slit (301) on the silicon rod (3) to be processed from both sides of the silicon rod (3) to be processed.
3. The line processing device according to claim 2, characterized in that: The first driving mechanism (1) comprises: A first motor (101), a second motor (102), a third motor (103), a fourth motor (104), a first drive assembly and a second drive assembly; The first driving assembly is respectively connected to the first paddle (201), the first motor (101) and the second motor (102); the first motor (101) is used to drive the first driving assembly to drive the first paddle (201) to move horizontally; and the second motor (102) is used to drive the first driving assembly to drive the first paddle (201) to move longitudinally; The second driving assembly is respectively connected to the second paddle (202), the third motor (103) and the fourth motor (104); the third motor (103) is used to drive the second driving assembly to drive the second paddle (202) to move horizontally; and the fourth motor (104) is used to drive the second driving assembly to drive the second paddle (202) to move longitudinally.
4. The line processing device according to claim 3, characterized in that: The first driving assembly comprises: a first screw rod (105) and a second screw rod (106), wherein a first end of the second screw rod (106) is connected to the second screw rod (106), and a second end of the second screw rod (106) is connected to the first paddle (201); The second driving assembly comprises: a third screw rod (107) and a fourth screw rod (108), wherein a first end of the fourth screw rod (108) is connected to the third screw rod (107), and a second end of the fourth screw rod (108) is connected to the second paddle (202); Wherein, the first motor (101) is used to drive the first screw rod (105) to drive the first paddle (201) to perform lateral movement; The second motor (102) is used to drive the second screw rod (106) to drive the first paddle (201) to move longitudinally; The third motor (103) is used to drive the third screw rod (107) to drive the second paddle (202) to move horizontally; The fourth motor (104) is used to drive the fourth screw rod (108) to drive the second paddle (202) to move longitudinally.
5. The line processing device according to claim 4, characterized in that: The first driving mechanism (1) further comprises: a first connecting member and a second connecting member (109), both of which are fixedly connected to the body; Wherein, the first connecting member and the second connecting member (109) are both provided with a transverse mounting through hole and a longitudinal mounting through hole; The first screw rod (105) is inserted into a transverse mounting through hole on the first connecting member, and the second screw rod (106) is inserted into a longitudinal mounting through hole on the first connecting member; The third screw rod (107) is inserted into a transverse mounting through hole on the second connecting member (109), and the fourth screw rod (108) is inserted into a longitudinal mounting through hole on the second connecting member (109).
6. The line processing device according to claim 5, characterized in that: A thread matching the first screw rod (105) is provided in the transverse mounting through hole on the first connecting member; A thread matching the second screw rod (106) is provided in the longitudinal mounting through hole on the first connecting member; A thread matching the third screw rod (107) is provided in the transverse mounting through hole on the second connecting member (109); A thread matching the fourth screw rod (108) is provided in the longitudinal mounting through hole on the second connecting member (109).
7. The line processing device according to claim 1, characterized in that: Also includes: The transport mechanism is used to transport the silicon rods (3) to be processed.
8. The line processing device according to claim 7, characterized in that: The transport agencies include: A mechanical arm, wherein the mechanical arm is mounted on the body; A carrier (4) is fixedly connected to the mechanical arm, and the carrier (4) is used to fix the silicon rod (3) to be processed; The second driving mechanism is used to drive the mechanical arm to drive the carrier (4) to move so as to transport the silicon rod (3) to be processed.