Coating equipment

Abstract

The invention relates to coating equipment which comprises a chamber, a chamber door, a radio frequency plasma system and a gas deposition system, the chamber door is movably connected with the chamber, a sealing end face is arranged at an opening of the chamber, and the chamber door is tightly connected with the sealing end face to seal the chamber; the radio frequency plasma system comprises a leading-in electrode and a radio frequency power supply assembly, the radio frequency power supply assembly comprises an elastic electrode tip and an external radio frequency power supply, the leading-in electrode is electrically connected with an elastic connecting piece through a wire, the elastic connecting piece is arranged on the cavity door, and the external radio frequency power supply is arranged on the sealing end face of the cavity; the elastic connecting piece and an external radio frequency power supply are oppositely arranged, and disconnection and connection of the radio frequency power supply assembly are controlled through opening and closing of the cavity door on the sealing end face of the cavity; connection and disconnection of the radio frequency power supply assembly are realized through opening and closing of the cavity door on the cavity, so that the electrode coupling process is simpler, direct contact with the electrified radio frequency power supply assembly is not needed, and the safety risk is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of film coating, and in particular to a film coating device. Background Art

[0002] The first step of PECVD coating is to generate plasma by exciting the gas with external energy. Usually, RF power or microwave power is used to provide energy, so that the gas molecules are ionized to generate charged ions and free electrons. These charged particles are accelerated under the action of the external electric field to form plasma.

[0003] While the plasma is excited, the precursor gases for depositing thin films need to be introduced into the reaction chamber. These precursor gases can be organic compounds, inorganic gases or metal organic compounds, etc. These gases react chemically under the action of plasma to generate substances for depositing thin films; under the action of plasma, the precursor gas molecules undergo ionization, excitation, dissociation and other reactions to generate active species, such as free radicals and ions, etc. These active species are adsorbed on the surface and react chemically, eventually forming a uniform and dense film.

[0004] When introducing RF power, the coating equipment in the prior art needs to electrically connect the external RF power to the introduction electrode for generating plasma. The coupling process between the external RF power and the chamber electrode often uses a hard connection to introduce the RF power, and the electrode is controlled by an external switch. However, the process of opening and disconnecting the electrode in this connection method is cumbersome. In addition, since the external RF power is charged, if the switching time of the RF power and the opening and closing time of the chamber door are not coordinated properly, the chamber door may be charged when it is not closed, causing safety hazards. Summary of the invention

[0005] The first aspect of the present invention aims to solve the problem that the electrode coupling process in the prior art needs to set an external switch to control the connection and disconnection of the radio frequency current by hard connection. Since the coating equipment is energized, repeated control of the switch will easily lead to safety risks. A coating equipment is provided, which can realize the soft connection between the coupling electrode and the external radio frequency current component by setting the coupling electrode and the external radio frequency current component in the chamber door and the chamber respectively, and opening and closing the chamber door on the chamber. The main concept is:

[0006] A coating device, comprising a chamber, a chamber door, a radio frequency plasma system and a gas deposition system, wherein the chamber door is movably connected to the chamber, a sealing end surface is provided at the opening of the chamber, and the chamber door is tightly connected to the sealing end surface to achieve sealing of the chamber;

[0007] The radio frequency plasma system comprises an introduction electrode and a radio frequency power supply assembly, the radio frequency power supply assembly comprises an elastic electrode head and an external radio frequency power supply, the introduction electrode is electrically connected to the elastic connector through a wire, the elastic connector is arranged on the chamber door, and the external radio frequency power supply is arranged on the sealing end surface of the chamber;

[0008] The elastic connector and the external RF power supply are arranged relative to each other, and the opening and closing of the chamber door at the sealing end surface of the chamber controls the disconnection and connection of the RF power supply component;

[0009] The gas deposition system comprises a gas delivery pipe and a gas diffusion part. An air inlet installation port is provided in the middle of the chamber door. A gas flange is provided at the position where the gas delivery pipe is inserted into the chamber door. The gas diffusion part is used to evenly disperse the gas output by the gas delivery pipe.

[0010] In this solution, the RF power supply component that provides RF power for the introduced electrode is controlled to be on and off by means of a soft connection. The elastic connector is installed on the chamber door, and the external RF power supply is installed on the sealing end face of the chamber. When the chamber door and the chamber are closed, the chamber door and the sealing end face fit tightly, so that the elastic connector that is relatively matched is in contact with the external RF power supply, and then the elastic connector is connected to the external RF power supply. When the chamber door and the chamber are opened, the elastic connector is detached from the external RF power supply and then disconnected from the external RF power supply. The connection and disconnection of the RF power supply component of this solution can be achieved by opening and closing the chamber door on the chamber, which makes the electrode coupling process simpler and does not require direct contact with the energized RF power supply component, thereby reducing safety risks.

[0011] Preferably, the chamber door includes a coating area and a sealing area, the sealing area is matched with the sealing end face, the coating area is arranged at the position where the chamber door matches with the inside of the chamber, the sealing area is provided with a mounting hole 1 for installing an elastic connector, the coating area is provided with a mounting hole 2 for installing an electrode and an air inlet for installing a gas pipe, a sealing gasket is installed on the side of the sealing area of ​​the chamber door that is in close contact with the sealing end face, the chamber door is movably connected to the chamber through a hinge seat, and the hinge seat is arranged on one side of the chamber. The sealing area of ​​the chamber door is arranged in close contact with the sealing end face of the chamber, so that after the chamber door is closed under the action of the hinge seat, a sealed cavity can be formed for coating reaction, and the sealing gasket is installed in the sealing area of ​​the chamber door to enhance the sealing performance.

[0012] The second aspect of the present invention is to solve the technical problem that the RF power supply component controlled by the opening and closing of the cavity door is easily damaged by the abutment during electrode coupling. Furthermore, the elastic connecting part includes an elastic electrode head, a conductive screw and multiple insulating components. The elastic electrode head and the wire screw are connected to the mounting hole through multiple insulating components. The elastic electrode head can be compressed axially after being squeezed. One end of the conductive screw is connected to the elastic electrode head, and the other end of the conductive screw is connected to the wire introduced into the electrode.

[0013] The contact point of the elastic connector for connecting to the N-type plug is set as an elastic electrode head, so that when the cavity door and the chamber are closed, the elastic electrode head abuts against the N-type plug of the external RF power supply to achieve electrode coupling. The elastic electrode head can be compressed after being squeezed, and can effectively absorb the vibration and impact force generated between the cavity door and the chamber and between the elastic connector and the plug of the external RF power supply during the closing process of the cavity door, thereby avoiding damage to the elastic electrode head due to vibration and impact force, and extending the service life of the elastic electrode head; and the elastic electrode head can also achieve a certain degree of adaptive adjustment during the electrode coupling process, and will not completely transmit the force to the conductive screw set at the upper end of the elastic electrode head, thereby improving the overall service life of the elastic electrode component.

[0014] Preferably, the introduced electrode includes a connecting electrode, an electrode plate and an insulating plate. The connecting electrode is arranged in the second mounting hole, the electrode plate is arranged in the coating area of ​​the chamber door, an insulating plate is arranged between the electrode plate and the chamber door, and the insulating plate is provided with a through hole for connecting the electrode to the electrode plate.

[0015] A connecting electrode is set on the chamber door through the second mounting hole. The electrode plate is installed on the end face of the coating area of ​​the chamber door to act on the product substrate in the chamber of the coating equipment after the chamber door is closed. The connecting electrode is connected to the electrode plate so that the electrode plate receives the external radio frequency current input by the connecting electrode. The electrode plate generates the plasma required for the process. The electrode plate is isolated from the chamber door by an insulating plate to prevent the chamber door from being electrified when the coating equipment is working, causing installation risks. The through hole of the insulating plate is opened at the position of the connecting electrode so that the connecting electrode can pass through the insulating class to be connected to the electrode plate.

[0016] The third aspect of the present invention aims to solve the technical problem of poor sealing performance at the mounting hole of the introduction electrode installed in the chamber door. Furthermore, the connecting electrode includes a sealing upper cover, a sealing lower cover, two conductive screws and an elastic contact. The sealing upper cover and the sealing lower cover are connected by fixing screws, and the elastic contact is arranged on the sealing lower cover. The sealing upper cover and the sealing lower cover are conductive structures, and the two conductive screws are connected to the wire. This scheme uses conductively connected introduction electrodes and radio frequency power supply components. When the radio frequency power supply component is energized, power is provided to the introduction electrode, and the current is transmitted to the sealing lower cover by the two conductive screws. The sealing lower cover then transmits the current to the elastic contact, and the elastic contact abuts against the electrode plate.

[0017] Preferably, the gas diffusion part is arranged at the lower end of the electrode plate, and the gas diffusion part includes a first flow-distributing plate and a second flow-distributing plate, and the first flow-distributing plate and the second flow-distributing plate are provided with a plurality of pores, and the first flow-distributing plate is arranged between the electrode plate and the second flow-distributing plate, and a primary diffusion layer is constructed between the electrode plate and the first flow-distributing plate, and a secondary diffusion layer is constructed between the first flow-distributing plate and the second flow-distributing plate, and the primary diffusion layer is connected to the secondary diffusion layer through the pores, and the secondary diffusion layer is connected to the chamber through the pores. The gas from the gas supply pipe enters the primary diffusion layer, and during the diffusion process, the gas will continuously flow into the secondary diffusion layer below through the pores, and then the gas will continue to be uniformly input downward into the chamber through the pores of the secondary diffusion layer. After passing through the primary diffusion layer and the secondary diffusion layer, the gas from the gas supply pipe can be more fully and uniformly diffused, thereby meeting the requirements for uniform gas input of large-volume coating equipment.

[0018] The fourth aspect of the present invention aims to solve the technical problem of insufficient coating on the outer side of the substrate caused by insufficient diffusion of the gas entering from the middle in the chamber. Furthermore, the electrode plate is provided with a guide groove extending from the center position, and the guide groove extends in the radial direction. The first flow-distributing plate is in close contact with the electrode plate, and the first pores are evenly distributed at the positions corresponding to the guide grooves. The electrode plate and the first flow-distributing plate of the present scheme respectively form a guide path capable of radial diffusion through the guide grooves and the corresponding first pore groups. The gas can diffuse outward from the center position along the guide path, so that the gas input from the air intake pipe can increase the radius of the diffusion circle and increase the diffusion area in the chamber.

[0019] Preferably, the interior of the chamber is structured with a reaction chamber for film coating, a sample stage is provided in the reaction chamber, a heating component is provided at the bottom of the sample stage, and the bottom of the chamber is connected to a molecular pump exhaust port.

[0020] Preferably, the side of the chamber is provided with a front-stage pump suction port, the front-stage pump suction port is connected to the front-stage pump, and a suction equalizer is provided on the side of the chamber. A suction equalizer is provided at the suction interface, and the suction equalizer is used to receive the gas from the outlet pipe during suction, so that when the coating chamber of the coating equipment is evacuated, the coating chamber is uniformly evacuated in the lateral direction through the multiple air holes provided on the suction equalizer on the side of the gas converging layer under the action of pressure, so as to avoid the formation of suction dead angles on both sides away from the suction interface, resulting in slow gas extraction.

[0021] Preferably, the molecular pump suction port is connected to a vacuum pumping structure, and the vacuum pumping structure is used to vacuum the chamber.

[0022] The beneficial effect of the present invention is that the connection and disconnection of the RF power supply component is achieved by opening and closing the chamber door on the chamber, making the electrode coupling process simpler and eliminating the need for direct contact with the powered RF power supply component, thereby reducing safety risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention.

[0024] Figure 2 It is a top view of the structure of the present invention.

[0025] Figure 3 It is a side sectional view of the structure of the present invention.

[0026] Figure 4 It is a structural schematic diagram of the hinged seat of the present invention.

[0027] Figure 5 It is a partial enlarged view of the radio frequency power supply component of the present invention.

[0028] Figure 6 This is a partial enlarged view of the electrode introduced into the present invention.

[0029] Figure 7 It is a structural explosion diagram of the present invention.

[0030] Figure 8 It is a structural schematic diagram of the air intake path structure of the present invention.

[0031] The reference numerals include: 1, chamber; 11, sealing end face; 2, chamber door; 21, air inlet mounting port; 22, mounting hole one; 23, mounting hole two; 24, sealing gasket; 25, hinged seat; 3, electrode introduction; 31, electrode connection; 311, sealing upper cover; 312, sealing lower cover; 313, conductive screw two; 314, elastic contact point; 32, electrode plate; 33, insulating plate; 4, RF power supply assembly; 41, elastic connector; 411, elastic electrode head; 412, conductive screw one; 413, insulating assembly; 42, external RF power supply; 5, gas pipe; 51, gas flange; 52, air inlet gas path structure; 521, hazardous gas pulse gas path; 5211, hazardous gas feed pipeline; 5212, reaction source container; 5213, first carrier gas pipeline; 5214, safety pipeline; 5215, regulating three-way valve; 522, reducing agent gas circuit; 523, inert gas cleaning gas circuit; 52, air intake gas circuit structure; 5221, reducing agent pipeline; 5222, reducing agent container; 5223, second carrier gas pipeline; 523, inert gas cleaning gas circuit; 6, gas diffusion part; 61, first uniform flow plate; 62, second uniform flow plate; 63, air hole; 631, first air hole; 7, wire; 8, heating component; 81, heating tube; 9, front stage pump exhaust port; 91, front stage pump; 92, exhaust uniform flow plate; 10, molecular pump exhaust port; 101, molecular pump, 102, butterfly valve. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments more clear, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are only examples of devices and methods consistent with some aspects of the present disclosure as detailed in the attached claims.

[0033] It should be noted that all actions to obtain signals, information or data in this application are carried out in compliance with the relevant data protection laws and policies of the country where they are located, and with the authorization given by the owner of the corresponding device.

[0034] In the present disclosure, unless otherwise stated, the directional words used, such as "inside" and "outside", are defined according to the corresponding parts' own contours. The terms used in the present disclosure, such as "first" and "second", etc., are used to distinguish one element from another element and do not have order and importance.

[0035] Example 1

[0036] like Figure 1-Figure 6 As shown, a coating device of this embodiment includes a chamber 1, a chamber door 2, a radio frequency plasma system and a gas deposition system, wherein the chamber door 2 is movably connected to the chamber 1, a sealing end surface 11 is provided at the opening of the chamber 1, and the chamber door 2 is tightly connected to the sealing end surface 11 to achieve sealing of the chamber 1;

[0037] The RF plasma system includes an introduction electrode 3 and a RF power supply assembly 4, the RF power supply assembly 4 includes an elastic electrode head 41 and an external RF power supply 42, the introduction electrode 3 is electrically connected to the elastic connector 41 through a wire 7, the elastic connector 41 is arranged on the chamber door 2, and the external RF power supply 42 is arranged on the sealing end surface 11 of the chamber 1;

[0038] The elastic connector 41 and the external RF power source 42 are arranged opposite to each other, and the opening and closing of the chamber door 2 on the sealing end surface 11 of the chamber 1 controls the disconnection and connection of the RF power source component 4;

[0039] The gas deposition system includes a gas pipe 5 and a gas diffusion part 6. An air inlet installation port 21 is opened in the middle of the chamber door 2. A gas flange 51 is set at the position where the gas pipe 5 is inserted into the chamber door 2. The gas diffusion part 6 is used to evenly disperse the gas output by the gas pipe 5.

[0040] In this embodiment, the RF power supply component 4 that provides RF power for the introduced electrode 3 is controlled to be on and off by means of a soft connection. The elastic connector 41 is installed on the chamber door 2, and the external RF power supply 42 is installed on the sealing end face 11 of the chamber 1. When the chamber door 2 and the chamber 1 are closed, the chamber door 2 and the sealing end face 11 are tightly fitted, so that the relatively matched elastic connector 41 and the external RF power supply 42 are abutted, and the elastic connector 41 connects to the external RF power supply 42. When the chamber door 2 and the chamber 1 are opened, the elastic connector 41 is detached from the external RF power supply 42, and the elastic connector 41 is disconnected from the external RF power supply 42. The connection and disconnection of the RF power supply component 4 of this scheme can be achieved by opening and closing the chamber door 2 on the chamber 1, which makes the electrode coupling process simpler and does not require direct contact with the energized RF power supply component 4, thereby reducing safety risks.

[0041] like Figure 1-Figure 2 As shown, the chamber door 2 includes a coating area and a sealing area. The sealing area is matched with the sealing end face 11. The coating area is set at the position where the chamber door 2 matches with the inside of the chamber 1. The sealing area is provided with a mounting hole 1 22 for installing the elastic connector 31. The coating area is provided with a mounting hole 23 for installing the electrode 3 and an air inlet mounting port 21 for installing the gas pipe 5. The sealing area of ​​the chamber door 2 is installed on the side that is in close contact with the sealing end face 11. The chamber door 2 is movably connected with the chamber 1 through a hinge seat 25, and the hinge seat 25 is set on one side of the chamber 1. The sealing area of ​​the chamber door 2 is set in close contact with the sealing end face 11 of the chamber 1, so that after the chamber door 2 is closed under the action of the hinge seat 25, a sealed cavity can be formed for coating reaction, and the sealing gasket 24 is installed in the sealing area of ​​the chamber door 2 to enhance the sealing performance.

[0042] like Figure 2 As shown, a gas flange 51 is provided at the installation position of the gas supply pipe 5 and the gas inlet installation port 21, and the gas flange 51 can ensure the airtightness of the gas inlet installation port 21. One end of the gas supply pipe 5 inputs the precursor gas into the chamber 1 through the gas inlet installation port 21, and the other end of the gas supply pipe 5 is connected to the gas source component of the precursor gas.

[0043] like Figure 1-Figure 3 As shown, a mounting ear plate is provided on the upper end surface of the chamber 1, and the mounting ear plate extends to one side outside the chamber 1, and a hinge seat 25 is provided on the mounting ear plate. A connecting plate is installed on one side of the chamber door 2, and the connecting plate is rotatably connected to the hinge seat 25 by setting a rotating shaft. The chamber door 2 rotates synchronously around the hinge seat 25 under the action of the connecting plate, thereby completing the opening and closing of the chamber door 2 on the chamber 1.

[0044] In order to further improve the sealing performance of the opening and closing between the chamber 1 and the chamber door 2, an implementation method is also provided. Figure 4As shown, a strip shaft hole is opened on the connecting plate on one side of the chamber door 2, and the shaft is inserted into the strip shaft hole. The height extension direction of the strip shaft hole is perpendicular to the direction of the mounting surface of the sealing area of ​​the chamber door 2, and the height of the strip shaft hole is greater than the outer diameter of the shaft; the connecting plate has adjustment holes opened at both ends of the strip shaft hole in the extension direction of the height, and the adjustment holes are through holes. Adjustment screws are inserted into the adjustment holes, and the adjustment screws can extend into the strip shaft hole. When the shaft is inserted into the strip shaft hole, the adjustment screws at both ends of the connecting plate extend into the strip shaft holes, and the adjustment screws at both ends abut against the shaft.

[0045] In actual operation, by adjusting the upper adjustment screw and the lower adjustment screw respectively, the height position of the shaft inside the strip shaft hole can be positioned, so that the shaft can be adjusted to a suitable height in the strip shaft hole. When the chamber door 2 is closed on the chamber 1, by adjusting the height position of the shaft in the strip shaft hole, the gap between the sealing area of ​​the chamber door 2 and the sealing end surface 11 of the chamber 1 when they are parallel can be further adjusted, so that the gap of the chamber door 2 when sealing the chamber 1 can be adjusted to the optimal state, ensuring the position accuracy of the chamber door 2 on the chamber 1 and improving the sealing strength.

[0046] Example 2

[0047] like Figure 5 As shown, the elastic connecting member 41 of this embodiment includes an elastic electrode head 411, a conductive screw 412 and a plurality of insulating components 413. The elastic electrode head 411 and the wire screw 412 are connected to the mounting hole 22 through the plurality of insulating components 413. The elastic electrode head 411 can be compressed axially after being squeezed. One end of the conductive screw 412 is connected to the elastic electrode head 411, and the other end of the conductive screw 412 is connected to the wire 7 introduced into the electrode 3.

[0048] The contact point of the elastic connector 41 for connecting to the N-type plug is set as an elastic electrode head, so that when the cavity door and the chamber are closed, the elastic electrode head 411 abuts against the N-type plug of the external RF power supply 42 to realize electrode coupling. The elastic electrode head 411 can be compressed after being squeezed, and can effectively absorb the vibration and impact force generated between the cavity door 2 and the chamber 1 and between the elastic connector 41 and the plug of the external RF power supply 42 during the closing process of the cavity door 2, thereby avoiding damage to the elastic electrode head 411 due to vibration and impact force, and extending the service life of the elastic electrode head 411; and the elastic electrode head 411 can also achieve a certain degree of adaptive adjustment during the electrode coupling process, and will not completely transmit the force to the conductive screw 412 set at the upper end of the elastic electrode head 411, thereby improving the overall service life of the elastic electrode member 41.

[0049] In this embodiment, if Figure 5As shown, the insulating component 413 includes a ceramic ring, and a positioning boss is provided at the upper end of the ceramic ring. The inner wall of the mounting hole 22 opened by the cavity door 2 is provided with a convex boss. When the ceramic ring is set in the mounting hole 22, the ceramic ring is limitedly abutted with the convex boss in the mounting hole 22 through the positioning boss, so that the ceramic ring can be stably set in the mounting hole 22. Ceramic material is used because ceramic has high resistivity and high dielectric strength, which can effectively prevent current from passing through, prevent the cavity door from being charged, and improve safety performance. In addition, ceramic has high strength and high hardness, which can stably install the elastic connector 41.

[0050] The inside of the ceramic ring is provided with an internal thread, and the outside of the elastic electrode head 411 is provided with an external thread. The elastic electrode head 411 is installed in the middle position of the ceramic ring through a threaded connection. The installation position of the elastic electrode head 411 in the installation hole 22 can also be adjusted by rotating the elastic electrode head 411.

[0051] like Figure 5 As shown, the insulating component 413 also includes an insulating cover, which is arranged above the mounting hole 22 and between the conductive screw 412 and the mounting hole 22, so as to insulate the conductive screw 412 from the cavity door 2.

[0052] The insulating cover and the mounting hole 22 are stably connected. The insulating cover can be provided with external threads on the outside, and the upper end of the inner wall of the mounting hole 22 can be provided with internal threads, so that the insulating cover and the mounting hole 22 of the chamber door 2 are connected through threads. A through hole is provided in the middle of the insulating cover, and an internal thread is also provided on the inner wall of the through hole, so that the conductive screw 412 can be inserted into the insulating cover and enter the interior of the mounting hole 22 to abut against the elastic electrode head 411.

[0053] In addition, in order to make the conductive screw 412 safer, an insulating cover can be set on the top of the conductive screw 412. The bottom surface of the insulating cover can be provided with a hexagonal groove, and the nut of the conductive screw 412 is embedded in the insulating cover through the hexagonal groove, so that the top of the conductive screw 412 is also provided with an insulating cover for insulation treatment.

[0054] Embodiment 3:

[0055] like Figure 6 As shown, in this embodiment, the introduced electrode 3 includes a connecting electrode 31, an electrode plate 32 and an insulating plate 33. The connecting electrode 31 is arranged in the mounting hole 23, the electrode plate 32 is arranged in the coating area of ​​the chamber door 2, and the insulating plate 33 is arranged between the electrode plate 32 and the chamber door 2. The insulating plate 33 is provided with a through hole for connecting the electrode 31 to the electrode plate 32.

[0056] A connecting electrode 31 is set on the chamber door 2 through the mounting hole 23. The electrode plate 23 is installed on the end face of the coating area of ​​the chamber door 2 to act on the product substrate in the chamber 1 of the coating equipment after the chamber door 2 is closed. The connecting electrode 31 is connected to the electrode plate 32, so that the electrode plate 32 receives the external radio frequency current input by the connecting electrode 31, and the electrode plate 32 generates the plasma required for the process. The electrode plate 32 is isolated from the chamber door 2 by the insulating plate 33 to prevent the chamber door 2 from being electrified when the coating equipment is working, causing installation risks. The through hole of the insulating plate 33 is opened at the position of the connecting electrode 31, so that the connecting electrode 31 can pass through the insulating class 33 to connect with the electrode plate 32.

[0057] like Figure 6 As shown, the connecting electrode 31 of this embodiment includes a sealed upper cover 311, a sealed lower cover 312, a conductive screw 2 313 and an elastic contact 314. The sealed upper cover 311 and the sealed lower cover 312 are connected by fixing screws 313, and the elastic contact 314 is arranged on the sealed lower cover 312. The sealed upper cover 311 and the sealed lower cover 312 are conductive structures, and the conductive screw 2 313 is connected to the wire 7.

[0058] In this solution, the introduction electrode 3 and the RF power supply component 4 are connected by a wire 7. When the RF power supply component 4 is powered on, it provides power to the introduction electrode 3. The current is transmitted to the sealing lower cover 312 by the conductive screw 2 313. The sealing lower cover 312 then transmits the current to the elastic contact 314, and the elastic contact 314 abuts against the electrode plate.

[0059] In this embodiment, the sealing upper cover 311 and the sealing lower cover 312 are configured as a T-shaped structure, and the small-diameter ends of the sealing upper cover 311 and the sealing lower cover 312 are relatively arranged in the mounting hole 23, and a sealing ring is also arranged between the sealing upper cover 311 and the sealing lower cover 312 and the end surface of the chamber door 2, and the sealing ring can realize the sealing of the connecting electrode 31 introduced into the electrode 3 in the mounting hole 23 of the chamber door 2.

[0060] A threaded through hole is provided in the middle position of the end face of the sealing upper cover 311, a threaded hole is provided at the small diameter end of the sealing lower cover 312, a conductive screw 313 penetrates the sealing upper cover 311, and the bottom of the conductive screw 313 is connected to the sealing lower cover 312; by inserting the conductive screw 313 into the sealing upper cover 311, the outer wall of the conductive screw 313 is connected to the sealing upper cover 311 through the threaded through hole, and the bottom of the conductive screw 313 is connected to the sealing lower cover 312 through the threaded hole, then the distance between the sealing upper cover 311 and the sealing lower cover 312 can be adjusted by rotating the sealing lower cover 312 or the sealing upper cover 311, and the sealing upper cover 311 and the sealing lower cover 312 squeeze the sealing ring set in the mounting hole 23 of the chamber door 2. On the one hand, by adjusting the distance between the sealing upper cover 311 and the sealing lower cover 312, the squeezing force of the sealing upper cover 311 and the sealing lower cover 312 on the sealing ring can be further achieved, thereby improving the sealing performance; on the other hand, the wire 7 is installed on the sealing upper cover 311, so that the wire 7 can be electrically connected to the conductive screw 2 313, and the current can be transmitted to the sealing lower cover 312 through the conductive screw 2 313, so that the elastic electric contact 314 connected to the sealing lower cover 312 is charged.

[0061] Embodiment 4:

[0062] like Figure 7 As shown, the gas diffusion part 6 is arranged at the lower end of the electrode plate 32, and the gas diffusion part 6 includes a first flow-distributing plate 61 and a second flow-distributing plate 62. The gas diffusion part 6 is provided with a plurality of pores 63. The first flow-distributing plate is arranged between the electrode plate and the second flow-distributing plate. A primary diffusion layer is constructed between the electrode plate 32 and the first flow-distributing plate 61, and a secondary diffusion layer is constructed between the first flow-distributing plate 61 and the second flow-distributing plate 62. The primary diffusion layer is connected to the secondary diffusion layer through the pores 63, and the secondary diffusion layer is connected to the chamber through the pores 63.

[0063] The gas from the gas pipe 5 enters the primary diffusion layer, and during the diffusion process, it continuously flows into the secondary diffusion layer below through the pores 63, and then continues to evenly input the gas downward into the chamber 1 through the pores 63 of the secondary diffusion layer. The gas from the gas pipe 5 can be more fully and evenly diffused after passing through the primary diffusion layer and the secondary diffusion layer, thus meeting the requirements for uniform gas input of large-volume coating equipment.

[0064] like Figure 7 As shown, the electrode plate 32 of this embodiment is provided with a guide groove 321 extending from the center position, the guide groove extends in the radial direction, the first flow equalizer plate 61 is in close contact with the electrode plate, and the first air holes 631 are evenly distributed at the positions corresponding to the guide groove of the first flow equalizer plate 61.

[0065] The electrode plate 32 and the first flow uniforming plate 61 respectively form a guide path capable of radial diffusion through the guide groove 321 and the corresponding first air hole 631 group. The gas can diffuse outward from the center position along the guide path, so that the gas input by the intake pipe 5 can increase the radius of the diffusion circle and increase the diffusion area in the chamber.

[0066] In one embodiment, since the pressure of the air inlet hole opened in the middle of the electrode plate 32 is the largest, in order to ensure that the diffusion rate and gas output inside the gas diffusion part 6 connected to the electrode plate 32 can remain uniform, the apertures of the pores 63 of the first flow uniform plate 61 and the second flow uniform plate 62 of the gas diffusion part 6 are continuously increased along the radial direction, so that the pores 63 with higher pressure in the middle position adopt small apertures, and the pores 63 with lower pressure at the edge position adopt large apertures.

[0067] In this embodiment, an air inlet for inserting the gas delivery pipe 5 is arranged at the center of the guide groove 321, and the air inlet is arranged coaxially with the air inlet installation port 21 of the chamber door 2. A radial path and a circumferential path are arranged on the electrode plate 32 at the center of the air inlet, on a side of the electrode plate 32 that matches the gas diffusion portion 6; the radial path is a linear path, and the circumferential path is a circular path. At least one circumferential path is opened in the radial direction of the air inlet, and the air inlet is connected to the circumferential path through the radial path, and multiple circumferential paths can be arranged to be connected through the radial path.

[0068] In addition, when the gas pipe is inserted into the primary diffusion layer formed by the coating plate 32 and the first flow homogenizer 61, the outlet position of the gas pipe 5 is set at the middle height position of the primary diffusion layer. On the one hand, the outlet of the gas pipe 5 can avoid abutting against the first flow homogenizer 61, and the air intake of the gas pipe 5 will not be blocked; on the other hand, the outlet of the gas pipe 5 can generate a certain resistance for buffering in the primary diffusion layer, which is convenient for the input gas to flow in the primary diffusion layer along the continuously radially extending guide grooves 321 opened on the coating plate 32. The gas input by the gas pipe 5 can be evenly diffused in the surrounding directions of the chamber, so that it can be applied to large-volume or large-area coating equipment, avoiding the problem of uneven coating caused by insufficient diffusion path of the diffusion part.

[0069] The electrode plate 32 is fitted and abutted against the first flow equalizer plate 61. The electrode plate 32 is above the first flow equalizer plate 61. The first diffusion layer can be connected with the secondary diffusion layer arranged below the first flow equalizer plate 61 through the first air hole 631. The second diffusion layer then inputs the gas into the chamber 1 through the air hole 63 arranged on the second flow equalizer plate 62.

[0070] Embodiment 5:

[0071] To solve the technical problem that when the dangerous reaction source leaks into other pipelines under pressure, the operator cannot directly handle and close it. Figure 8 As shown, the gas delivery pipe 5 of this embodiment further includes an air inlet path structure 52 , and the air inlet path structure 52 inputs gas into the chamber 1 through a gas flange 51 provided on the chamber door 2 .

[0072] The intake air path structure 52 includes a hazardous gas pulse air path 521 , a reducing agent air path 522 and an inert gas cleaning air path 523 .

[0073] The reaction source container 5212 of the hazardous gas pulse gas circuit 521 is filled with hazardous chemical liquid. The liquid medium, as a reaction source, needs to be input into the chamber through the hazardous gas feed pipeline 5211. The reaction source needs to be carried into the hazardous gas feed pipeline 5211 by a carrier gas. The reaction source container 5212 is also connected to the first carrier gas pipeline 5213, so that the first carrier gas pipeline 5213 first inputs the carrier gas into the reaction source container 5212, so that the reaction source in the reaction source container 5212 enters the hazardous gas pulse gas circuit 521 by bubbling under the action of pressure, and then the hazardous gas pulse gas circuit 521 carries the reaction source to the reaction chamber of the coating equipment to undergo a chemical reaction with the surface of the substrate.

[0074] The hazardous gas pulse gas circuit 521 of the present embodiment is further provided with a safety pipeline 5214 , and the two ends of the safety pipeline 5214 are respectively connected to the hazardous gas feed pipeline 5211 and the first carrier gas pipeline 5213 .

[0075] When the reaction source container 5212 in the hazardous gas pulse gas circuit 521 leaks back to the first carrier gas pipeline 5213 under the action of pressure, the hazardous chemicals are cleaned up through the safety pipeline 5214 provided in this embodiment; the safety pipeline 5214 is opened so that the safety pipeline 5214 can bypass the reaction source container 5212 and be directly connected to the first carrier gas pipeline 5213 and the hazardous gas feed pipeline 5211, and the vacuum pumping structure provided in the chamber 1 is opened so that the vacuum pumping structure evacuates the first carrier gas pipeline 5213 from the chamber 1 along the hazardous gas feed pipeline 5211, and the reaction source after leakage entering the first carrier gas pipeline 5213 is cleaned up. The method of cleaning the first carrier gas pipeline 5213 by providing the safety pipeline 5214 does not require the reaction source container 5212 and the first carrier gas pipeline 5213 to be disassembled separately, and the pipeline can be directly cleaned, thereby avoiding the safety hazard caused by the direct contact of the reaction source with people and air and improving the cleaning efficiency.

[0076] A regulating three-way valve 5215 is provided at the connection between the safety pipeline 5214 and the first carrier gas pipeline 5213 , and the regulating three-way valve 5215 is used to adjust the direction in which the safety pipeline 5214 and the first carrier gas pipeline 5213 are connected.

[0077] By adjusting the three-way valve 5215, during normal use, by closing the interface between the adjusting three-way valve 5215 and the safety line 5214, the first carrier gas line 5213 can normally input carrier gas to the reaction source container 5212; when the reaction source container 5212 overflows into the first carrier gas line 5213 due to the pressure, by cutting off the rear end pipeline of the first carrier gas line 5213 connecting the reaction source container 5212 by adjusting the three-way valve 5215, the reaction source in the reaction source container 5212 is prevented from continuously leaking, and the vacuum pumping structure of the chamber 1 is opened to pump air, so that the pumping path is evacuated along the safety line 5214 to the front end pipeline of the first carrier gas line 5213.

[0078] The hazardous gas pulse gas circuit 521 is connected to the inert gas cleaning gas circuit 523 through a confluence interface. The inert gas cleaning gas circuit 523 is connected to the hazardous gas feed pipeline 5211 . The inert gas cleaning gas circuit 523 is used to purge the interior of the chamber 1 .

[0079] During the coating process, inert gases such as argon and nitrogen are often used as protective gases to prevent the substrate or coating material from being oxidized or contaminated during the heating process of the chamber. By filling the chamber with an appropriate amount of inert gas, a protective barrier can be formed during the coating process to effectively isolate oxygen and other impurities in the air, and prevent gases carrying different chemical substances from remaining in the reaction chamber and affecting the coating effect.

[0080] Furthermore, the hazardous gas pulse gas circuit 521 is connected to the inert gas cleaning gas circuit 523 through a confluence interface, so that when the inert gas cleaning gas circuit 523 is in the cleaning chamber 1, it can also clean the hazardous gas feed pipeline 5211, thereby improving safety performance.

[0081] The reducing agent gas circuit 522 includes a second carrier gas pipeline 5223, a reducing agent pipeline 5221 and a reducing agent container 5222, and the second carrier gas pipeline 5223 is connected to the reducing agent pipeline 5221 through the reducing agent container 5222. The second carrier gas pipeline 5223 is connected to the reducing agent pipeline 5221 through the reducing agent container 5222, and the input end of the second carrier gas pipeline 5223 is connected to a carrier gas source, so that the carrier gas is rushed into the reducing agent container 5222 through the second carrier gas pipeline 5223. The reducing agent in the reducing agent container 5222 enters the reducing agent pipeline 5221 under the pressure of the carrier gas and is input into the chamber for the coating reaction. In order to allow the reducing agent in the reducing agent container 5222 to be able to enter the pipeline together with the carrier gas, the reducing agent uses deionized water.

[0082] Through this embodiment, multiple gases, reaction sources and reducing agents can be alternately introduced into the chamber for chemical reactions; the reaction mode of each process step saturates the current substrate surface. When the reaction stops, the alternative source can react with the surface in the same way. Between the reactions of these coating processes, the reaction chamber is purged and cleaned with an inert gas.

[0083] Embodiment 6:

[0084] In this embodiment, the interior of the chamber 1 is configured with a reaction chamber 12 for coating, a sample stage 13 is provided in the reaction chamber 12, a heating assembly 8 is provided at the bottom of the sample stage 13, and the bottom of the chamber 1 is connected to a molecular pump exhaust port 10.

[0085] A front-stage pump suction port 9 is provided on the side of the chamber 1 , the front-stage pump suction port 9 is connected to a front-stage pump 91 , and a suction flow equalizing plate 92 is provided on the side of the chamber 1 .

[0086] The exhaust flow equalizer plate 92 of the present embodiment is used to receive the gas at the exhaust port 9 of the front-stage pump during exhaust. A plurality of exhaust holes are evenly distributed on the exhaust flow equalizer plate 92. A flow equalizer cavity is formed between the exhaust flow equalizer plate 92 and the inner wall of the chamber 1 provided with the exhaust port 9 of the front-stage pump. When the chamber 1 of the coating equipment is exhausted, under the action of pressure, the side of the gas converging layer will exhaust the coating chamber evenly in the lateral direction through the plurality of exhaust holes provided on the exhaust flow equalizer plate 9, thereby avoiding the formation of exhaust dead corners on both sides away from the exhaust port 9 of the front-stage pump, which causes slow exhaust of gas.

[0087] The molecular pump exhaust port 10 is connected to a vacuum pumping structure, and the vacuum pumping structure is used to vacuum the chamber 1 .

[0088] In this embodiment, the vacuum pumping structure includes a vacuum pump, a compound vacuum gauge, an angle valve and a butterfly valve. Start the vacuum pump, open the bypass exhaust valve for rough extraction, and after the pressure drops to 500mbar, the main exhaust angle valve is opened, and the system is evacuated to a low vacuum. The compound vacuum gauge has a full-range measurement capability as a system vacuum pressure measurement device. The capacitive film vacuum gauge is mainly used for pressure detection in the process and has higher accuracy. During the process, the detected vacuum value is fed back to the butterfly valve. The butterfly valve controls the valve opening according to the difference between the current pressure and the set pressure, thereby achieving the function of stabilizing the system pressure to the set pressure value.

[0089] The present invention can realize a variety of processes, and the specific processes include:

[0090] Deposition process of silicon nitride thin film: use 8-inch silicon wafer as substrate, put the silicon wafer into the sample table 13 in the reaction chamber 12, close the chamber door 2, evacuate the chamber 1 through the vacuum structure, set the silicon nitrogen ratio parameter on the interface, and adjust the pressure, temperature, power and time in the reaction chamber 12; start the process after debugging, and the system starts to evacuate and heat up. The coating effect can be effectively improved by the coating equipment. After the heating component 8 reaches the temperature of 300°C, the heating component 8 can maintain a constant temperature for 10-30 minutes, and the vacuum structure can automatically adjust the opening to control the pressure to 200Pa; start the RF power supply to generate plasma, and then pass SIH 4 Reaction, depositing Si3N4 film on the substrate surface. After coating by this coating equipment, a film with a thickness of 1000nm is finally obtained on a 200mm silicon wafer, and the refractive index is 2.17-2.20, and the uniformity is about 3%.

[0091] Silicon oxide thin film process: Use 8-inch silicon wafer as substrate, place the silicon wafer on the sample stage 13 in the reaction chamber 12, close the chamber door 2, evacuate the chamber 1 through the vacuum structure, set the silicon oxygen ratio parameter on the interface, and adjust the pressure, temperature, power and time in the reaction chamber 12; start the process after debugging, and the system starts to evacuate and heat up. The coating effect can be effectively improved by the coating equipment. After the heating component 8 reaches the temperature of 300°C, the heating component 8 can maintain the temperature for 10-30 minutes. After the temperature is maintained, 80 sccm N is introduced at the same time. 2 O and 20 sccm SiH 4 The butterfly valve of the vacuum structure can automatically adjust the opening to control the pressure to 200pa; after the pressure stabilizes, the RF power supply is started to generate plasma to deposit SiO on the substrate surface. 2 After coating with this coating equipment, a 1000nm thick SiO film is finally obtained on a 200mm silicon wafer. 2 The film has a refractive index of 1.44-1.45 and a uniformity of about 2%.

[0092] Chamber cleaning process: Chamber 1 cleaning uses fluorine-containing gas as a reaction source to etch the silicon-containing film in the chamber to achieve the function of chamber cleaning. During operation, first confirm that chamber 1 is free of substrate, then evacuate it through the vacuum structure, and then heat it to between 100-400°C through the heating component 8, set the pressure to 150pa, and introduce a certain proportion of fluorine-containing gas. After the pressure stabilizes, turn on the RF power supply with a power of 500W to start cleaning. Usually, a film with a thickness of about 4um can be cleaned in 1 hour.

[0093] The above is only an embodiment of the present invention, and the common knowledge such as the known specific structure and characteristics in the scheme is not described in detail here. It should be pointed out that for those skilled in the art, several deformations and improvements can be made without departing from the structure of the present invention, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A coating device, characterized in that: The invention comprises a chamber (1), a chamber door (2), a radio frequency plasma system and a gas deposition system, wherein the chamber door (2) is movably connected to the chamber (1), a sealing end surface (11) is provided at the opening of the chamber (1), and the chamber door (2) and the sealing end surface (11) are tightly connected to achieve sealing of the chamber (1); The radio frequency plasma system comprises an introduction electrode (3) and a radio frequency power supply assembly (4), the radio frequency power supply assembly (4) comprises an elastic electrode head (41) and an external radio frequency power supply (42), the introduction electrode (3) and the elastic connecting piece (41) are electrically connected via a wire (7), the elastic connecting piece (41) is arranged on the chamber door (2), and the external radio frequency power supply (42) is arranged on the sealing end surface (11) of the chamber (1); The elastic connecting member (41) and the external radio frequency power source (42) are arranged opposite to each other, and the opening and closing of the radio frequency power source component (4) is controlled by opening and closing the chamber door (2) at the sealing end surface (11) of the chamber (1); The gas deposition system comprises a gas delivery pipe (5) and a gas diffusion part (6); a gas inlet installation port (21) is provided in the middle of the chamber door (2); a gas flange (51) is provided at the position where the gas delivery pipe (5) is inserted into the chamber door (2); and the gas diffusion part (6) is used to evenly disperse the gas output by the gas delivery pipe (5).

2. A coating device according to claim 1, characterized in that: The chamber door (2) comprises a coating area and a sealing area. The sealing area is a position connected to the sealing end surface. The coating area is arranged in the middle of the sealing area. The sealing area is provided with a first mounting hole (22) for mounting an elastic connector (31). The coating area is provided with a second mounting hole (23) for mounting an electrode (3) and an air inlet mounting port (21) for mounting an air pipe (5). A sealing gasket (24) is installed on the side of the sealing area of ​​the chamber door (2) that is in close contact with the sealing end surface (11).

3. A coating device according to claim 2, characterized in that: The elastic connecting member (31) comprises an elastic electrode head (311), a conductive screw (312) and a plurality of insulating components (313); the elastic electrode head (311) and the conductive screw (312) are connected to the mounting hole (22) via the plurality of insulating components (313); the elastic electrode head (311) can be compressed in the axial direction after being squeezed; one end of the conductive screw (312) is connected to the elastic electrode head (311); and the other end of the conductive screw (312) is connected to the conductive wire (7) introduced into the electrode (3).

4. A coating device according to claim 1, characterized in that: The introduction electrode (3) comprises a connecting electrode (31), an electrode plate (32) and an insulating plate (33); the connecting electrode (31) is arranged in the second mounting hole (23); the electrode plate (32) is arranged in the coating area of ​​the chamber door (2); the insulating plate (33) is arranged between the electrode plate (32) and the chamber door (2); the insulating plate (33) is provided with a through hole for connecting the connecting electrode (31) to the electrode plate (32).

5. A coating device according to claim 4, characterized in that: The connecting electrode (31) comprises a sealed upper cover (311), a sealed lower cover (312), a second conductive screw (313) and an elastic contact (314); the sealed upper cover (311) and the sealed lower cover (312) are connected via a fixing screw (313); the elastic contact (314) is arranged on the sealed lower cover (312); the sealed upper cover (311) and the sealed lower cover (312) are conductive structures; and the second conductive screw (313) is connected to a wire (7).

6. The coating device according to claim 1, characterized in that: The gas diffusion part (6) is arranged at the lower end of the electrode plate (32), and the gas diffusion part (6) comprises a first flow-distributing plate (61) and a second flow-distributing plate (62). The first flow-distributing plate (61) and the second flow-distributing plate (62) are provided with a plurality of pores (63). The first flow-distributing plate is arranged between the electrode plate and the second flow-distributing plate. A primary diffusion layer is constructed between the electrode plate (32) and the first flow-distributing plate (61), and a secondary diffusion layer is constructed between the first flow-distributing plate (61) and the second flow-distributing plate (62). The primary diffusion layer is connected to the secondary diffusion layer through the pores (63), and the secondary diffusion layer is connected to the chamber (1) through the pores (63).

7. A coating device according to claim 6, characterized in that: The electrode plate (32) is provided with a flow guide groove (321) extending from a central position, the flow guide groove extending in a radial direction, the first flow equalizer plate (61) is in close contact with the electrode plate, and first air holes (631) are evenly distributed at positions of the first flow equalizer plate (61) corresponding to the flow guide groove.

8. The coating device according to claim 1, characterized in that: The chamber (1) is internally structured with a reaction chamber (12) for coating, a sample stage (13) is provided in the reaction chamber (12), a heating component (8) is provided at the bottom of the sample stage (13), and the bottom of the chamber (1) is connected to a molecular pump exhaust port (10).

9. A coating device according to claim 8, characterized in that: A front-stage pump air suction port (9) is arranged on the side of the chamber (1), the front-stage pump air suction port (9) is connected to the front-stage pump (91), and an air suction flow equalizing plate (92) is arranged on the side of the chamber (1).

10. The coating device according to claim 8, characterized in that: The molecular pump air suction port (10) is connected to a vacuum pumping structure, and the vacuum pumping structure is used to vacuum the chamber (1).

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