Computing server

Abstract

The invention discloses a computing server. The computing server comprises a memory and a first wind scooper structure located at the top of the memory, the first wind scooper structure comprises a first wind guide groove and a plurality of second wind guide grooves arranged in the first direction (X), orthographic projections of the first wind guide grooves on the plane where the memory is located are overlapped, and the network card and the second wind scooper structure are arranged in the first direction (X). The first end of the second wind scooper structure is connected with the first wind scooper structure, the second end of the second wind scooper structure is installed on the peripheral side of the network card, the second wind scooper structure at least comprises a wind guiding channel with the two ends communicated, one end of the wind guiding channel is communicated with the first wind guiding groove and at least part of the second wind guiding groove, and the other end of the wind guiding channel is communicated with the second wind guiding groove. And the other end of the air guide channel is communicated to the peripheral area of the network card. Therefore, the heat dissipation difficulty of the network card is reduced, local overheating of the network card is avoided, and the risk of damage to the network card is reduced.

Description

Technical Field

[0001] The present application belongs to the field of server technology, and specifically relates to a computing server. Background Art

[0002] With the development of science and technology, the functions of computing servers are increasing. With the increase of functions, the overall power consumption of computing servers is increasing, and the heat generated by computing servers is also increasing. Especially after the main components of the computing server are preheated, the temperature rises further when it reaches the back of the computing server components. As the data that computing servers need to transmit continues to increase with the development of information technology, the network cards are getting bigger and bigger, and the power consumption is getting higher and higher. The network cards are located at the back end of the computing server, which further increases the difficulty of cooling the network cards, which easily leads to local overheating of the network cards, and thus easily increases the risk of damage to the network cards. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a computing server that at least solves the problem of the difficulty in heat dissipation of the network card.

[0004] An embodiment of the present application provides a computing server, the computing server comprising:

[0005] A memory and a first air guide cover structure located on the top of the memory, wherein the first air guide cover structure includes a first air guide slot and a plurality of second air guide slots arranged along a first direction, wherein the orthographic projections of the first air guide slots on the plane where the memory is located overlap, and the first direction is a direction intersecting with a flow direction of airflow in the first air guide slots;

[0006] A network card and a second air guide cover structure, wherein a first end of the second air guide cover structure is connected to the first air guide cover structure, a second end of the second air guide cover structure is installed on the peripheral side of the network card, and the second air guide cover structure includes at least one air guide channel with two ends connected, one end of the air guide channel is connected to the first air guide groove and at least part of the second air guide groove, and the other end of the air guide channel is connected to the peripheral area of ​​the network card.

[0007] Optionally, the first end of the second air guide cover structure is provided with a flared air induction structure;

[0008] The flared air induction structure includes a wind shield plate, which extends in a second direction to the second air guide groove adjacent to the first air guide groove, wherein the second direction is a direction consistent with a flow direction of the airflow in the second air guide groove.

[0009] Optionally, the wind shield includes a first baffle and a second baffle;

[0010] The second baffle is connected between the first baffle and the first end of the second air guide cover structure, the first baffle and the second baffle are bent, the first baffle extends along the second direction, the distance between the second baffle and the first air guide groove decreases from the first end of the second baffle to the second end of the second baffle, the first end of the second baffle is connected to the first baffle, and the second end of the second baffle is connected to the first end of the second air guide cover structure.

[0011] Optionally, the distance between the first baffle and the partition between the first air guide groove and the second air guide groove is greater than a first value, and the first value is greater than or equal to one-half of the size of the second air guide groove in the first direction and less than or equal to three-quarters of the size of the second air guide groove in the first direction.

[0012] Optionally, the second air guide cover structure includes a first air induction structure and a second air induction structure;

[0013] The first air induction structure includes a first air induction cavity, the second air induction structure includes a second air induction cavity, the first air induction cavity and the second air induction cavity are connected, and the first air guide groove and at least part of the second air guide groove are connected to the first air induction cavity.

[0014] Optionally, the first air inducing structure and the second air inducing structure are connected via an air guiding structure;

[0015] The wind guide structure includes an wind guide cavity, and the two ends of the wind guide cavity in the second direction are open structures. The first wind guide structure is provided with a connecting hole at the bottom in the third direction, and the connecting hole is connected to one end of the wind guide cavity, and the other end of the wind guide cavity is connected to the second wind guide structure, wherein the second direction intersects with the third direction, the second direction is the direction of flow of airflow in the first wind guide groove, and the third direction intersects with the plane where the memory is located.

[0016] Optionally, the air guide structure includes a first air guide plate, a second air guide plate and an air guide block;

[0017] The first air guide plate and the second air guide plate are arranged opposite to each other in the first direction, the first air guide plate and the second air guide plate are arranged on the end of the air guide block close to the first air guide groove, and the air guide cavity is formed between the first air guide plate and the second air guide plate;

[0018] The orthographic projection of the air guide structure on the first plane does not overlap with the orthographic projection of the memory on the first plane, and the orthographic projection of the connecting through hole on the second plane overlaps with the orthographic projection of the air guide cavity formed between the first air guide plate and the second air guide plate on the second plane, wherein the first plane is a plane formed by the first direction and the third direction, and the second plane is a plane formed by the first direction and the second direction;

[0019] The end of the air guide block toward the air guide cavity formed between the first air guide plate and the second air guide plate is an inclined surface, and the distance between the inclined surface and the first air guide groove increases successively from the first side of the inclined surface to the second side of the inclined surface, the first side of the inclined surface is the side where the inclined surface and the connecting through hole are connected, and the second side of the inclined surface is the side of the inclined surface close to the second air guide structure.

[0020] Optionally, the inclined surface extends into the second air induction cavity.

[0021] Optionally, the size of the second air induction cavity in the first direction decreases successively from the first port of the second air induction structure to the extension direction of the first port of the second air induction structure, and the first port and the second port are two opposite ports of the second air induction structure in the second direction, the first port is close to the inclined surface, and the second port is far away from the inclined surface.

[0022] Optionally, the computing server further includes an optical module, the optical module is arranged closely to the network card, and the second air induction structure simultaneously covers the optical module and at least a part of the network card.

[0023] Optionally, a heat exchange component is provided on one side of the air guide cavity formed between the first air guide plate and the second air guide plate, and the heat exchange component is provided close to the first air guide plate.

[0024] Optionally, the heat exchange component includes a glue-filled heat exchange component;

[0025] The glue-potting heat exchange component comprises a heat-conducting glue and a heat-conducting shell. The heat-conducting glue is attached to the first air guide plate, and the heat-conducting shell covers the heat-conducting glue.

[0026] Optionally, the heat exchange component includes an air-cooled heat exchange component;

[0027] The air-cooled heat exchange assembly includes a heat exchange fan and a heat exchange shell. The heat exchange fan is arranged inside the heat exchange shell. The inner cavity of the heat exchange shell is connected to the air guide cavity formed between the first air guide plate and the second air guide plate.

[0028] Optionally, the outer wall of the heat exchange shell facing the air guide cavity is connected to the first air guide plate, a first air guide hole is opened on the outer wall of the heat exchange shell facing the air guide cavity, a second air guide hole is opened on the second air guide plate, the first air guide hole and the second air guide hole are connected, and the fan surface of the heat exchange fan faces the first air guide hole.

[0029] Optionally, the size of the first air induction cavity in the first direction decreases successively from the first mouth of the first air induction structure to the second mouth of the first air induction structure, and the first mouth and the second mouth are two opposite ports of the first air induction structure in the second direction, the first mouth is close to the first air guide groove, and the second mouth is far away from the air guide groove, wherein the second direction is the direction of flow of airflow in the first air guide groove.

[0030] In an embodiment of the present application, due to the memory and the first air guide cover structure located on the top of the memory, the first air guide cover structure includes a first air guide groove and a plurality of second air guide grooves arranged along a first direction, wherein the orthographic projections of the first air guide groove on the plane where the memory is located overlap, and the first direction is a direction intersecting with the flow direction of the airflow in the first air guide groove. Therefore, relatively low-temperature air at the top of the memory can be introduced through the first air guide groove and the second air guide groove, and the internal heat at the bottom of the first air guide cover structure can be isolated. Furthermore, due to the network card and the second air guide cover structure, the first end of the second air guide cover structure is connected to the first air guide cover structure, and the second end of the second air guide cover structure is installed on the peripheral side of the network card. The second air guide cover structure includes at least one air guide channel with two ends connected, one end of the air guide channel is connected to the first air guide groove and at least part of the second air guide groove, and the other end of the air guide channel is connected to the peripheral area of ​​the network card. Therefore, the relatively low-temperature air in the first air guide groove and the second air guide groove on the top of the memory can be introduced into the network card through the second air guide groove, thereby achieving the heat dissipation effect of the network card, reducing the heat dissipation difficulty of the network card, avoiding local overheating of the network card, and thereby reducing the risk of damage to the network card. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 One of the structural schematic diagrams of a computing server provided in an embodiment of the present application is shown;

[0033] Figure 2 A second structural diagram showing a computing server provided in an embodiment of the present application;

[0034] Figure 3 One of the structural schematic diagrams showing a second air scoop structure included in a computing server provided in an embodiment of the present application;

[0035] Figure 4 A second structural schematic diagram showing a second air guide cover structure included in a computing server provided in an embodiment of the present application;

[0036] Figure 5 A third structural schematic diagram showing a second air guide cover structure included in a computing server provided in an embodiment of the present application;

[0037] Figure 6 A fourth structural schematic diagram showing a second air guide cover structure included in a computing server provided in an embodiment of the present application;

[0038] Figure 7 A schematic structural diagram of a first air guide cover structure included in a computing server provided in an embodiment of the present application.

[0039] Reference numerals:

[0040] 1: memory; 2: first air guide cover structure; 21: first air guide slot; 22: second air guide slot; 3: network card; 4: second air guide cover structure; 41: first air induction structure; 42: second air induction structure; 43: air guide structure; 431: first air guide plate; 432: second air guide plate; 433: air guide block; 4331: inclined surface; 44: flared air induction structure; 441: first baffle plate; 442: second baffle plate; 5: heat exchange component. DETAILED DESCRIPTION

[0041] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] like Figures 1 to 7 As shown, an embodiment of the present application provides a computing server, which includes:

[0045] The memory 1 and the first air guide cover structure 2 located on the top of the memory 1, the first air guide cover structure 2 includes a first air guide groove 21 and a plurality of second air guide grooves 22 arranged along a first direction X, wherein the orthographic projections of the first air guide groove 21 on the plane where the memory 1 is located overlap, and the first direction X is a direction intersecting with the flow direction of the airflow in the first air guide groove 21.

[0046] The network card 3 and the second air guide cover structure 4, the first end of the second air guide cover structure 4 is connected to the first air guide cover structure 2, the second end of the second air guide cover structure 4 is installed on the peripheral side of the network card 3, the second air guide cover structure 4 includes at least one air guide channel with two ends connected, one end of the air guide channel is connected to the first air guide groove 21 and at least part of the second air guide groove 22, and the other end of the air guide channel is connected to the peripheral area of ​​the network card 3.

[0047] It can be seen from the above embodiments that in the embodiments of the present application, due to the memory 1 and the first air guide cover structure 2 located on the top of the memory 1, the first air guide cover structure 2 includes a first air guide groove 21 and a plurality of second air guide grooves 22 arranged along the first direction X, wherein the orthographic projections of the first air guide groove 21 on the plane where the memory 1 is located overlap, and the first direction X is a direction intersecting with the flow direction of the airflow in the first air guide groove 21, so that relatively low-temperature air at the top of the memory 1 can be introduced through the first air guide groove 21 and the second air guide groove 22, and the internal heat at the bottom of the first air guide cover structure 2 can be isolated. Furthermore, due to the network card 3 and the second air guide cover structure 4, the first end of the second air guide cover structure 4 is connected to the first air guide cover structure 2, and the second end of the second air guide cover structure 4 is installed on the peripheral side of the network card 3. The second air guide cover structure 4 includes at least one air guide channel with two ends connected, one end of the air guide channel is connected to the first air guide groove 21 and at least part of the second air guide groove 22, and the other end of the air guide channel is connected to the peripheral area of ​​the network card 3. Therefore, the relatively low-temperature air in the first air guide groove 21 and the second air guide groove 22 at the top of the memory 1 can be introduced into the network card 3 through the second air guide groove 22, thereby achieving the heat dissipation effect of the network card 3, reducing the heat dissipation difficulty of the network card 3, avoiding local overheating of the network card 3, and thereby reducing the risk of damage to the network card 3.

[0048] It should be noted that, in the above embodiment, since the heating elements inside the computing server (such as memory 1 and motherboard and other devices) are usually located at the bottom of the computing server, the temperature at the bottom of the computing server is usually greater than the temperature at the top. Based on this, in the embodiment of the present application, a first air duct structure 2 is set at the top of the memory 1, and the low-temperature air at the top of the computing server is introduced from the first air duct structure 2. The first air duct structure 2 includes a first air duct 21 and a plurality of second air ducts 22 arranged along the first direction X. The first air duct 21 is in a relative position with the memory 1 in the third direction Z, that is, the first air duct 21 is at the top of the memory 1, and the number of the second air duct 22 is determined according to the distribution of the heating elements inside the computing server, which can be two, three, or other numbers, and the embodiment of the present application does not limit this. The first air duct may include a bottom plate and a plurality of side plates, and the plurality of side plates are arranged on the bottom plate, and each adjacent two side plates are arranged at intervals along the first direction X, and each adjacent two side plates isolate a first air duct 21 and a second air duct 22.

[0049] The Open Compute Project (OPC) network card is mainly used to improve the network transmission performance and data processing capabilities of the computing server. The network card 3 is located on the side of the memory 1 in the third direction Y, that is, the network card 3 is located at the rear end of the memory 1. The second air guide cover structure 4 is connected between the first air guide cover structure 2 and the peripheral side of the network card 3. The second air guide cover structure 4 can be a shell structure of an overall shape, or a shell structure including multiple cavities, so that the second air guide structure 43 includes at least one air guide channel with two ends connected, and then the low-temperature air at the top of the interior can be introduced into the peripheral area of ​​the network card 3 through the air guide channel.

[0050] It should be noted that in the embodiments of the present application, Figure 1 and Figure 2 As shown, in the embodiment of the present application, the X-axis direction and the Z-axis direction intersect, the X-axis direction and the Y-axis direction intersect, and the Y-axis direction and the Z-axis direction intersect. For the convenience of explanation, the first direction is defined as the X-axis direction (that is, the direction of intersection of the flow direction of the airflow in the first air guide groove 21 in the present application), the second direction is defined as the Y-axis direction (that is, the flow direction of the airflow in the first air guide groove 21 in the present application), and the third direction is defined as the Z-axis direction (that is, the direction of intersection with the plane where the memory 1 is located in the present application). It is further explained that the definition of vertical in the specification should be understood as vertical when it fluctuates by 10% within 90 degrees, that is, the angle between the defined first direction and the second direction should be understood as vertical when it is between 80 degrees and 90 degrees, the angle between the defined first direction and the third direction should be understood as vertical when it is between 80 degrees and 90 degrees, and the angle between the defined second direction and the third direction should be understood as vertical when it is between 80 degrees and 90 degrees.

[0051] In some embodiments, a flared air induction structure 44 is provided at the first end of the second air guide cover structure 4; the flared air induction structure 44 includes a wind shield plate, which extends in the second direction Y to the second air guide groove 22 adjacent to the first air guide groove 21, wherein the second direction Y is a direction consistent with the flow direction of the airflow in the second air guide groove 22.

[0052] In this embodiment, since the first end of the second air guide cover structure 4 is provided with a flared air induction structure 44; the flared air induction structure 44 includes a wind shield, and the wind shield extends in the second direction Y to the second air guide groove 22 adjacent to the first air guide groove 21. Therefore, the conduction area of ​​the first end of the second air guide cover structure 4 can be expanded by the flared air induction structure 44, and more air can be guided to flow into the second air guide cover structure 4, further increasing the heat dissipation efficiency of the network card 3.

[0053] Regarding the specific form of the flared air induction structure 44, in some embodiments, the wind shield includes a first baffle 441 and a second baffle 442; the second baffle 442 is connected between the first baffle 441 and the first end of the second air guide cover structure 4, and the first baffle 441 and the second baffle 442 are bent between them. The first baffle 441 extends along the second direction Y, and the distance between the second baffle 442 and the first air guide groove 21 decreases successively from the first end of the second baffle 442 to the second end of the second baffle 442. The first end of the second baffle 442 is connected to the first baffle 441, and the second end of the second baffle 442 is connected to the first end of the second air guide cover structure 4.

[0054] In this embodiment, the first baffle 441 extends along the second direction Y, that is, the first baffle 441 is arranged parallel to the partition between the first air guide groove 21 and the second air guide groove 22, and the distance between the second baffle 442 and the first air guide groove 21 decreases from the first end of the second baffle 442 to the second end of the second baffle 442, that is, the second baffle 442 is arranged obliquely. In this way, due to the bending arrangement between the first baffle 441 and the second baffle 442, the first baffle 441 extends along the second direction Y, and the distance between the second baffle 442 and the first air guide groove 21 decreases from the first end of the second baffle 442 to the second end of the second baffle 442, so that the expanded air induction structure 44 forms a bell-mouth shape, and then the expanded air induction structure 44 has the function of gathering air, so as to facilitate guiding the air to flow from the expanded air induction structure 44 to the second air guide cover structure 4.

[0055] Further, in some embodiments, the distance between the first baffle 441 and the partition between the first air guide groove 21 and the second air guide groove 22 is greater than a first value, the first value is greater than or equal to one-half of the size of the second air guide groove 22 in the first direction X, and less than or equal to three-quarters of the size of the second air guide groove 22 in the first direction X.

[0056] In this embodiment, since the distance between the first baffle 441 and the partition between the first air guide groove 21 and the second air guide groove 22 is greater than the first value, the first value is greater than or equal to one half of the size of the second air guide groove 22 in the first direction X, and less than or equal to three quarters of the size of the second air guide groove 22 in the first direction X, it is possible to avoid the expansion air induction structure 44 being too small to cause insufficient air volume, and it is possible to avoid the expansion air induction structure 44 being too large to introduce air with higher temperature in the middle of the server, thereby affecting the heat dissipation efficiency of the network card 3.

[0057] Regarding the specific form of the second air guide cover structure 4, in some embodiments, the second air guide cover structure 4 includes a first air induction structure 41 and a second air induction structure 42; the first air induction structure 41 includes a first air induction cavity, the second air induction structure 42 includes a second air induction cavity, the first air induction cavity and the second air induction cavity are connected, and the first air guide groove 21 and at least part of the second air guide groove 22 are connected to the first air induction cavity.

[0058] In this embodiment, the first air induction structure 41 and the second air induction structure 42 are both shell structures with two ends connected. Since the first air induction structure 41 includes a first air induction cavity, the second air induction structure 42 includes a second air induction cavity, the first air induction cavity and the second air induction cavity are connected, and the first air guide groove 21 and at least part of the second air guide groove 22 are connected to the first air induction cavity, the low-temperature air on the top of the memory 1 can be introduced through the first air induction cavity, and then introduced to the peripheral side of the network card 3 by the second air induction cavity. In this way, by successively introducing the low-temperature air to the peripheral side of the network card 3 through the first air induction cavity and the second air induction cavity, not only can the low-temperature air introduction path be changed, but also the network card 3 can be fully cooled. It should be noted that the first air induction structure 41 and the second air induction structure 42 can be directly connected, or they can be connected through other cavities.

[0059] Furthermore, in some embodiments, the first air-inducing structure 41 and the second air-inducing structure 42 are connected through an air-guiding structure 43; the air-guiding structure 43 includes an air-guiding cavity, and the two ends of the air-guiding cavity in the second direction Y are open structures. The first air-inducing structure 41 is provided with a connecting hole at the bottom of the third direction Z, and the connecting hole is connected to one end of the air-guiding cavity, and the other end of the air-guiding cavity is connected to the second air-inducing structure 42, wherein the second direction Y intersects with the third direction Z, the second direction Y is the direction of flow of the airflow in the first air-guiding groove 21, and the third direction Z intersects with the plane where the memory 1 is located.

[0060] In this embodiment, since the air-guiding structure 43 includes an air-guiding cavity, the two ends of the air-guiding cavity in the second direction Y are open structures, and the first air-guiding structure 41 is provided with a connecting hole at the bottom in the third direction Z, and the connecting hole is connected to one end of the air-guiding cavity, and the other end of the air-guiding cavity is connected to the second air-guiding structure 42. Therefore, the first air-guiding structure 41 and the second air-guiding structure 42 are connected through the air-guiding structure 43, which facilitates the introduction of low-temperature air in the first air-guiding structure 41 into the second air-guiding structure 42 through the air-guiding structure 43, and the air-guiding structure 43 can ensure that the low-temperature air will not diffuse during the circulation process. At the same time, the air-guiding structure 43 can avoid the existence of local turbulence and increase the circulation resistance.

[0061] It should be noted that if the air guide structure 43 is located in front of the memory 1 in the second direction Y, that is, the air guide structure 43 blocks the air circulation channel of the memory 1 on the side of the second direction Y, thereby causing the air on one side of the memory 1 to gather, resulting in an increase in pressure, which will cause the air flow resistance in the area where the memory 1 is located to increase, thereby affecting the heat dissipation effect of the memory 1.

[0062] Based on this, for the specific type of the wind guide structure 43, in some embodiments, the wind guide structure 43 includes a first wind guide plate 431, a second wind guide plate 432 and an wind guide block 433; the first wind guide plate 431 and the second wind guide plate 432 are arranged opposite to each other in the first direction X, the first wind guide plate 431 and the second wind guide plate 432 are arranged on the end of the wind guide block 433 close to the first wind guide groove 21, and an wind guide cavity is formed between the first wind guide plate 431 and the second wind guide plate 432; the orthographic projection of the wind guide structure 43 on the first plane and the orthographic projection of the memory 1 on the first plane have no overlap, and the connecting through hole is formed between the first wind guide plate 431 and the second wind guide plate 432. The positive projections of the air guide cavity on the second plane overlap, wherein the first plane is a plane formed by the first direction X and the third direction Z, and the second plane is a plane formed by the first direction X and the second direction Y; the end of the air guide block 433 toward the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 is an inclined surface 4331, and the distance between the inclined surface 4331 and the first air guide groove 21 increases successively from the first side of the inclined surface 4331 to the second side of the inclined surface 4331, the first side of the inclined surface 4331 is a side where the inclined surface 4331 and the connecting through hole are connected, and the second side of the inclined surface 4331 is a side of the inclined surface 4331 close to the second air induction structure 42.

[0063] In this embodiment, the orthographic projection of the air guide structure 43 on the first plane can be understood as the projection of the air guide structure 43 along the second direction Y on the plane formed by the first direction X and the third direction Z, and the orthographic projection of the memory 1 on the first plane can be understood as the projection of the memory 1 along the second direction Y on the plane formed by the first direction X and the third direction Z. In this way, since the orthographic projection of the air guide structure 43 on the first plane and the orthographic projection of the memory 1 on the first plane do not overlap, the air guide structure 43 will not block the air circulation channel of the memory 1 in the second direction Y, that is, there is an air circulation channel between the air guide structure 43 and the memory 1, which can not only avoid the air gathering on one side of the memory 1 and the pressure increase, reduce the air flow resistance in the area where the memory 1 is located, and ensure the heat dissipation effect of the memory 1, but also the air guide structure 43 can completely isolate the heat dissipating air of the memory 1 and the heat dissipating air of the network card 3, thereby ensuring that the heat dissipating air of the memory 1 can flow away smoothly. In summary, through this embodiment, not only the normal heat dissipation of the memory 1 can be ensured, but also the normal heat dissipation of the network card 3 can be ensured, and it can be ensured that the heat dissipation air of the network card 3 and the heat dissipation air of the memory 1 do not interfere with each other.

[0064] In addition, in this embodiment, since the end of the air guide block 433 toward the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 is an inclined surface 4331, the distance between the inclined surface 4331 and the first air guide groove 21 increases successively from the first side of the inclined surface 4331 to the second side of the inclined surface 4331. The first side of the inclined surface 4331 is the side where the inclined surface 4331 and the connecting through hole are connected, and the second side of the inclined surface 4331 is the side where the inclined surface 4331 is close to the second air guide structure 42. Therefore, the air guide cavity formed by the air guide structure 43 can form a cavity structure with a large top and a small bottom. The low-temperature air in the first air guide structure 41 can be smoothly introduced into the second air guide structure 42 through the air guide cavity, avoiding the existence of local turbulence and increasing the circulation resistance.

[0065] For the above embodiment, further, the second air induction structure 42 includes a second air induction cavity, and the inclined surface 4331 extends into the second air induction cavity.

[0066] In this embodiment, since the second air induction structure 42 includes a second air induction cavity, the inclined surface 4331 extends into the second air induction cavity.

[0067] In this embodiment, since the second air induction structure 42 includes the second air induction cavity and the inclined surface 4331 extends into the second air induction cavity, low-temperature air can be smoothly introduced into the second air induction cavity under the guidance of the inclined surface 4331 .

[0068] In some embodiments, the size of the second air induction cavity in the first direction X decreases successively from the first port of the second air induction structure 42 to the extension direction of the first port of the second air induction structure 42. The first port and the second port are two opposite ports of the second air induction structure 42 in the second direction Y. The first port is close to the inclined surface 4331, and the second port is far away from the inclined surface 4331.

[0069] In this embodiment, since the size of the second air induction cavity in the first direction X decreases successively from the first port of the second air induction structure 42 to the extension direction of the first port of the second air induction structure 42, the first port and the second port are two opposite ports of the second air induction structure 42 in the second direction Y, the first port is close to the inclined surface 4331, and the second port is far away from the inclined surface 4331, so that the second air induction cavity can be formed into a trumpet shape, which can increase the resistance of the low-temperature air during flow while facilitating the introduction of low-temperature air, thereby reducing the speed of air flowing out of the second air induction cavity, so that the network card 3 can be fully cooled.

[0070] In some embodiments, the computing server further includes an optical module, which is disposed close to the network card 3 , and the second air induction structure 42 simultaneously covers the optical module and at least a portion of the network card 3 .

[0071] In this embodiment, since the second air induction structure 42 covers the optical module and at least a portion of the network card 3 at the same time, the optical module and the network card 3 can be cooled at the same time.

[0072] In some embodiments, a heat exchange component 5 is disposed on one side of the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 , and the heat exchange component 5 is disposed close to the first air guide plate 431 .

[0073] In this embodiment, since a heat exchange component 5 is provided on one side of the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, and the heat exchange component 5 is arranged close to the first air guide plate 431, the air flow rate on one side of the air guide cavity can be increased through the heat exchange component 5, thereby further accelerating the heat dissipation efficiency of the network card 3.

[0074] It should be noted that the heat exchange component 5 can be a contact heat exchange component 5, a counter-flow heat exchange component 5, or more, and the embodiment of the present application does not limit this.

[0075] Regarding the type of heat exchange component 5, in one possible implementation, the heat exchange component 5 includes a glue-potted heat exchange component 5; the glue-potted heat exchange component 5 includes a thermally conductive glue and a thermally conductive shell, the thermally conductive glue is attached to the first air guide plate 431, and the thermally conductive shell covers the thermally conductive glue.

[0076] In this embodiment, since the thermal conductive adhesive is attached to the first air guide plate 431 and the thermal conductive shell covers the thermal conductive adhesive, the heat in the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432 can be introduced into the thermal conductive shell through the thermal conductive adhesive, thereby increasing the heat dissipation path and further accelerating the heat exchange efficiency of the network card 3.

[0077] Regarding the type of the heat exchange component 5, in another possible implementation, the heat exchange component 5 includes an air-cooled heat exchange component 5; the air-cooled heat exchange component 5 includes a heat exchange fan and a heat exchange shell, the heat exchange fan is arranged inside the heat exchange shell, and the inner cavity of the heat exchange shell is connected to the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432.

[0078] In this embodiment, since the air-cooled heat exchange component 5 includes a heat exchange fan and a heat exchange shell, the heat exchange fan is arranged inside the heat exchange shell, and the inner cavity of the heat exchange shell is connected to the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, the air flow rate at the network card 3 can be increased by the heat exchange fan, thereby further accelerating the heat dissipation speed of the network card 3.

[0079] Furthermore, the outer wall of the heat exchange shell facing the air guide cavity is connected to the first air guide plate 431, a first air guide hole is opened on the outer wall of the heat exchange shell facing the air guide cavity, a second air guide hole is opened on the second air guide plate 432, the first air guide hole and the second air guide hole are connected, and the fan surface of the heat exchange fan faces the first air guide hole.

[0080] In this embodiment, since the outer wall of the heat exchange shell facing the air guide cavity is connected to the first air guide plate 431, the outer wall of the heat exchange shell facing the air guide cavity is provided with a first air guide hole, the second air guide plate 432 is provided with a second air guide hole, the first air guide hole and the second air guide hole are connected, and the fan of the heat exchange fan faces the first air guide hole, it can be ensured that the airflow of the fan can smoothly flow into the air guide cavity formed between the first air guide plate 431 and the second air guide plate 432, thereby ensuring the heat exchange efficiency of the heat exchange fan. In addition, it should be noted that in this embodiment, the temperature of the 3 peripheral sides of the network card can be monitored in real time by the mainboard. If the temperature of the 3 peripheral sides of the network card increases, the speed of the heat exchange fan is increased, and vice versa, the speed of the heat exchange fan is reduced, thereby achieving the effect of energy saving and consumption reduction.

[0081] In some embodiments, the size of the first air induction cavity in the first direction X decreases successively from the first mouth of the first air induction structure 41 to the second mouth of the first air induction structure 41. The first mouth and the second mouth are two opposite ports of the first air induction structure 41 in the second direction Y. The first mouth is close to the first air guide groove 21, and the second mouth is far away from the air guide groove, wherein the second direction Y is the direction of flow of the airflow in the first air guide groove 21.

[0082] In this embodiment, since the size of the first air induction cavity in the first direction X decreases successively from the first mouth of the first air induction structure 41 to the second mouth of the first air induction structure 41, the first mouth and the second mouth are two opposite ports of the first air induction structure 41 in the second direction Y, the first mouth is close to the first air guide groove 21, and the second mouth is far away from the air guide groove, so that the first air induction cavity can be formed into a trumpet shape, which can increase the resistance of the low-temperature air during flow while facilitating the introduction of low-temperature air, thereby allowing the network card 3 to fully dissipate heat.

[0083] It can be seen from the above embodiments that in the embodiments of the present application, due to the memory 1 and the first air guide cover structure 2 located on the top of the memory 1, the first air guide cover structure 2 includes a first air guide groove 21 and a plurality of second air guide grooves 22 arranged along the first direction X, wherein the orthographic projections of the first air guide groove 21 on the plane where the memory 1 is located overlap, and the first direction X is a direction intersecting with the flow direction of the airflow in the first air guide groove 21, so that relatively low-temperature air at the top of the memory 1 can be introduced through the first air guide groove 21 and the second air guide groove 22, and the internal heat at the bottom of the first air guide cover structure 2 can be isolated. Furthermore, due to the network card 3 and the second air guide cover structure 4, the first end of the second air guide cover structure 4 is connected to the first air guide cover structure 2, and the second end of the second air guide cover structure 4 is installed on the peripheral side of the network card 3. The second air guide cover structure 4 includes at least one air guide channel with two ends connected, one end of the air guide channel is connected to the first air guide groove 21 and at least part of the second air guide groove 22, and the other end of the air guide channel is connected to the peripheral area of ​​the network card 3. Therefore, the relatively low-temperature air in the first air guide groove 21 and the second air guide groove 22 at the top of the memory 1 can be introduced into the network card 3 through the second air guide groove 22, thereby achieving the heat dissipation effect of the network card 3, reducing the heat dissipation difficulty of the network card 3, avoiding local overheating of the network card 3, and thereby reducing the risk of damage to the network card 3.

[0084] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0085] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A computing server, characterized in that: The computing server comprises: A memory and a first air guide cover structure located on the top of the memory, wherein the first air guide cover structure includes a first air guide slot and a plurality of second air guide slots arranged along a first direction, wherein the orthographic projections of the first air guide slots on the plane where the memory is located overlap, and the first direction is a direction intersecting with a flow direction of airflow in the first air guide slots; A network card and a second air guide cover structure, wherein a first end of the second air guide cover structure is connected to the first air guide cover structure, a second end of the second air guide cover structure is installed on the peripheral side of the network card, and the second air guide cover structure includes at least one air guide channel with two ends connected, one end of the air guide channel is connected to the first air guide groove and at least part of the second air guide groove, and the other end of the air guide channel is connected to the peripheral area of ​​the network card.

2. The computing server according to claim 1, characterized in that: The first end of the second air guide cover structure is provided with a flared air induction structure; The flared air induction structure includes a wind shield plate, which extends in a second direction to the second air guide groove adjacent to the first air guide groove, wherein the second direction is a direction consistent with a flow direction of the airflow in the second air guide groove.

3. The computing server according to claim 2, characterized in that: The windshield comprises a first baffle and a second baffle; The second baffle is connected between the first baffle and the first end of the second air guide cover structure, the first baffle and the second baffle are bent, the first baffle extends along the second direction, the distance between the second baffle and the first air guide groove decreases from the first end of the second baffle to the second end of the second baffle, the first end of the second baffle is connected to the first baffle, and the second end of the second baffle is connected to the first end of the second air guide cover structure.

4. The computing server according to claim 3, characterized in that: The distance between the first baffle and the partition between the first air guide groove and the second air guide groove is greater than a first value, and the first value is greater than or equal to one-half of the size of the second air guide groove in the first direction, and less than or equal to three-quarters of the size of the second air guide groove in the first direction.

5. The computing server according to claim 1, characterized in that: The second air guide cover structure includes a first air induction structure and a second air induction structure; The first air induction structure includes a first air induction cavity, the second air induction structure includes a second air induction cavity, the first air induction cavity and the second air induction cavity are connected, and the first air guide groove and at least part of the second air guide groove are connected to the first air induction cavity.

6. The computing server according to claim 5, characterized in that: The first air inducing structure and the second air inducing structure are connected via an air guiding structure; The wind guide structure includes an wind guide cavity, and the two ends of the wind guide cavity in the second direction are open structures. The first wind guide structure is provided with a connecting hole at the bottom in the third direction, and the connecting hole is connected to one end of the wind guide cavity, and the other end of the wind guide cavity is connected to the second wind guide structure, wherein the second direction intersects with the third direction, the second direction is the direction of flow of airflow in the first wind guide groove, and the third direction intersects with the plane where the memory is located.

7. The computing server according to claim 6, characterized in that: The wind guide structure includes a first wind guide plate, a second wind guide plate and a wind guide block; The first air guide plate and the second air guide plate are arranged opposite to each other in the first direction, the first air guide plate and the second air guide plate are arranged on the end of the air guide block close to the first air guide groove, and the air guide cavity is formed between the first air guide plate and the second air guide plate; The orthographic projection of the air guide structure on the first plane does not overlap with the orthographic projection of the memory on the first plane, and the orthographic projection of the connecting through hole on the second plane overlaps with the orthographic projection of the air guide cavity formed between the first air guide plate and the second air guide plate on the second plane, wherein the first plane is a plane formed by the first direction and the third direction, and the second plane is a plane formed by the first direction and the second direction; The end of the air guide block toward the air guide cavity formed between the first air guide plate and the second air guide plate is an inclined surface, and the distance between the inclined surface and the first air guide groove increases successively from the first side of the inclined surface to the second side of the inclined surface, the first side of the inclined surface is the side where the inclined surface and the connecting through hole are connected, and the second side of the inclined surface is the side of the inclined surface close to the second air guide structure.

8. The computing server according to claim 7, characterized in that: The inclined surface extends into the second air induction cavity.

9. The computing server according to claim 8, characterized in that: The size of the second air induction cavity in the first direction decreases successively from the first port of the second air induction structure to the extension direction of the first port of the second air induction structure. The first port and the second port are two opposite ports of the second air induction structure in the second direction. The first port is close to the inclined surface, and the second port is far away from the inclined surface.

10. The computing server according to claim 5, characterized in that: The computing server further includes an optical module, which is arranged closely to the network card, and the second air induction structure simultaneously covers the optical module and at least a part of the network card.

11. The computing server according to claim 7, characterized in that: A heat exchange component is disposed on one side of the air guide cavity formed between the first air guide plate and the second air guide plate, and the heat exchange component is disposed closely against the first air guide plate.

12. The computing server according to claim 11, characterized in that: The heat exchange component comprises a glue-filled heat exchange component; The glue-potting heat exchange component comprises a heat-conducting glue and a heat-conducting shell. The heat-conducting glue is attached to the first air guide plate, and the heat-conducting shell covers the heat-conducting glue.

13. The computing server according to claim 11, characterized in that: The heat exchange component includes an air-cooled heat exchange component; The air-cooled heat exchange assembly includes a heat exchange fan and a heat exchange shell. The heat exchange fan is arranged inside the heat exchange shell. The inner cavity of the heat exchange shell is connected to the air guide cavity formed between the first air guide plate and the second air guide plate.

14. The computing server according to claim 13, characterized in that: The outer wall of the heat exchange shell facing the air guide cavity is connected to the first air guide plate, a first air guide hole is opened on the outer wall of the heat exchange shell facing the air guide cavity, a second air guide hole is opened on the second air guide plate, the first air guide hole and the second air guide hole are connected, and the fan surface of the heat exchange fan faces the first air guide hole.

15. The computing server according to claim 5, characterized in that: The size of the first air induction cavity in the first direction decreases successively from the first mouth of the first air induction structure to the second mouth of the first air induction structure in the extension direction, the first mouth and the second mouth are two opposite ports of the first air induction structure in the second direction, the first mouth is close to the first air guide groove, and the second mouth is far away from the air guide groove, wherein the second direction is the direction of flow of the airflow in the first air guide groove.

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