Method and device for establishing parameterized model of multi-physics field coupling and vehicle

Abstract

The embodiment of the invention discloses a multi-physics field coupled parameterized model establishment method and device, a vehicle and a storage medium. The method comprises the steps that a finite element model of a target object is constructed based on a 3D model of the target object, the finite element model is composed of a plurality of units and nodes which are connected with one another, and each unit has a specific material attribute and a specific geometrical shape; coupling the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis, and determining a harmonic response analysis result; and coupling the harmonic response analysis result to a sound field finite element model as excitation input, performing sound field analysis, and determining the acoustic performance of the target object. Through the method, the influence of the inverse piezoelectric effect on vibration and noise can be calculated and analyzed comprehensively, so that noise design can be quantified, optimal design can be found quickly, and project cost and project time are saved.

Description

Technical Field

[0001] The present application belongs to the field of vehicle technology, and specifically relates to a method, device, vehicle and storage medium for establishing a parameterized model of multi-physical field coupling. Background Art

[0002] With the development of technology, the size of electronic control equipment is getting smaller and thinner, and the temperature inside electronic equipment is getting higher. Gradually, multilayer capacitors are used to replace film capacitors. Especially in portable products, in order to pursue thinness, the height of power circuit boards is getting lower and lower, and components are also beginning to be designed with low thickness and surface mount. Due to the inverse piezoelectric effect of multilayer capacitors, some electronic devices have "howling" problems, which seriously affects the user experience of electronic devices. Various means are used to improve this phenomenon. Summary of the invention

[0003] In view of the above problems, the present application proposes a method, device, vehicle and storage medium for establishing a parameterized model of multi-physical field coupling to improve the above problems.

[0004] In a first aspect, an embodiment of the present application provides a method for establishing a parameterized model of multi-physical field coupling, the method comprising: constructing a finite element model of the target object based on a 3D model of the target object, the finite element model consisting of a plurality of interconnected units and nodes, each unit having specific material properties and geometric shapes; coupling the finite element model in piezoelectric analysis, modal analysis, and harmonic response analysis to determine the harmonic response analysis results; coupling the harmonic response analysis results to an acoustic field finite element model as an excitation input, performing an acoustic field analysis, and determining the acoustic performance of the target object.

[0005] In the second aspect, an embodiment of the present application provides a parameterized model building device for multi-physical field coupling, the device comprising: a construction unit, used to construct a finite element model of the target object based on a 3D model of the target object, the finite element model consisting of a plurality of interconnected units and nodes, each unit having specific material properties and geometric shapes; a result determination unit, used to couple the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis result; a performance determination unit, used to couple the harmonic response analysis result to a sound field finite element model as an excitation input, perform sound field analysis, and determine the acoustic performance of the target object.

[0006] In a third aspect, an embodiment of the present application provides a vehicle, comprising one or more processors and a memory; one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs are configured to execute the above-mentioned method.

[0007] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, in which a program code is stored, wherein the above method is executed when the program code is run.

[0008] The embodiments of the present application provide a method, device, vehicle and storage medium for establishing a parameterized model of multi-physical field coupling. First, based on the 3D model of the target object, a finite element model of the target object is constructed, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes. Then, the finite element model is coupled in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis results. Finally, the harmonic response analysis results are coupled to the sound field finite element model as an excitation input, and the sound field analysis is performed to determine the acoustic performance of the target object. Through the above method, the influence of the inverse piezoelectric effect on vibration and noise can be more comprehensively calculated and analyzed, so that the noise design can be quantified, and the optimal design can be quickly found, saving project costs and project time. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0010] Figure 1 A flow chart of a method for establishing a parameterized model of multi-physical field coupling proposed in an embodiment of the present application is shown;

[0011] Figure 2 A schematic diagram of an acoustic field space in a method for establishing a parameterized model of multi-physical field coupling proposed in an embodiment of the present application is shown;

[0012] Figure 3 A flowchart of a method for establishing a parameterized model of multi-physical field coupling proposed in another embodiment of the present application is shown;

[0013] Figure 4 A schematic diagram showing the process described in step S210 to step S250 in another embodiment of the present application is shown;

[0014] Figure 5 A structural block diagram of a parameterized model building device for multi-physical field coupling proposed in an embodiment of the present application is shown;

[0015] Figure 6 A structural block diagram of a parameterized model building device for multi-physical field coupling proposed in an embodiment of the present application is shown;

[0016] Figure 7 A structural block diagram of a vehicle for executing a parameterized model building method for multi-physics field coupling according to an embodiment of the present application is shown;

[0017] Figure 8 A storage unit in an embodiment of the present application is shown for storing or carrying program codes for implementing a parameterized model building method for multi-physical field coupling according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0019] The embodiments of the present application propose a method, device, vehicle and storage medium for establishing a parameterized model of multi-physical field coupling. First, based on the 3D model of the target object, a finite element model of the target object is constructed, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes. Then, the finite element model is coupled in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis results. Finally, the harmonic response analysis results are coupled to the sound field finite element model as an excitation input, and the sound field analysis is performed to determine the acoustic performance of the target object. Through the above method, the influence of the inverse piezoelectric effect on vibration and noise can be more comprehensively calculated and analyzed, so that the noise design can be quantified, and the optimal design can be quickly found, saving project costs and project time.

[0020] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0021] See also Figure 1 , an embodiment of the present application provides a method for establishing a parameterized model of multi-physical field coupling, the method comprising:

[0022] Step S110: constructing a finite element model of the target object based on the 3D model of the target object, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes.

[0023] In the embodiment of the present application, the target object is a selected object that needs to be subjected to multi-physical field analysis, and the target object can be any actual object that meets the analysis requirements.

[0024] As one approach, the target object includes a PCBA (Printed Circuit Board Assembly) and a piezoelectric capacitor; the piezoelectric capacitor is mounted on a PCB via an SMT patch, and the PCBA is fixed to a housing via screws.

[0025] It can be understood that PCBA is the process of mounting electronic components (such as integrated circuits, resistors, capacitors, etc.) onto printed circuit boards by soldering. It is a key component of electronic devices, providing circuit connections, protecting components, and dissipating heat. The manufacturing process involves steps such as PCB design, manufacturing, component placement, soldering, and testing.

[0026] Compared with PCB (Printed Circuit Board), PCBA is an assembled circuit board with functionality, while PCB is just a bare board used as a connection frame between electronic components. PCBA is more complex and expensive than PCB and plays a vital role in the manufacturing of electronic devices and is used as a finished product.

[0027] The 3D model of the target object is a three-dimensional geometric model of the target object created by computer-aided software. In this process, it is necessary to ensure that the details and features of the model are accurately represented so that reliable results can be obtained in the subsequent finite element analysis.

[0028] As one approach, the steps of establishing a 3D model based on the target object may include:

[0029] 1. Data acquisition: First, it is necessary to obtain geometric data from the target object. This can be achieved through a variety of methods, such as direct measurement, scanning (such as CT or MRI scanning), etc.

[0030] 2. Model construction: Use CAD software (such as AutoCAD) or specialized modeling software (such as Mimics, SolidWorks, etc.) to build a 3D model based on the acquired data. This model should reflect the geometry and features of the actual object as accurately as possible.

[0031] Optionally, the finite element model of the target object in the embodiment of the present application refers to a finite element model obtained after steps such as assigning material properties, establishing boundary conditions, meshing, parameterizing part structure dimensions and material properties based on a 3D model, and the model is composed of a series of interconnected units and nodes, and each unit has specific material properties and geometric shapes. This model will be used for subsequent finite element analysis. Among them, material properties can include elastic modulus, Poisson's ratio, density, etc., and the definition of material properties is usually based on experimental data or standard values ​​in a material manual. Boundary conditions refer to the interaction mode between the model and the external environment, such as fixed constraints, load application, etc., and these conditions need to be set according to actual physical conditions. Meshing refers to the process of discretizing a continuous 3D model into a limited number of units and nodes. This is usually done by a meshing tool in a special meshing software (such as Hypermesh) or a finite element analysis software (such as ANSYS). The quality and density of the mesh directly affect the accuracy and computational efficiency of the analysis results. Parameterization of some structural dimensions and material properties means quickly generating different models and analysis scenarios by changing certain key parameters. In finite element analysis, some structural dimensions and material properties can be parameterized to study the impact of these parameter changes on the analysis results.

[0032] Step S120: coupling the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis result.

[0033] In the embodiment of the present application, coupling analysis refers to an analysis method that takes different physical fields (such as structural fields, electric fields, magnetic fields, etc.) into account at the same time, that is, it can be understood as taking the previous analysis result as the input of the next analysis. In the embodiment of the present application, it is necessary to couple the 3D model, material properties and finite element model in piezoelectric analysis, modal analysis and harmonic response analysis. The harmonic response analysis result refers to the velocity vector of each point of the PCBA at each frequency.

[0034] Among them, piezoelectric analysis: studies the mechanical response of piezoelectric materials under the action of electric field or the influence of mechanical deformation on the electric field.

[0035] Modal analysis: Study the natural vibration characteristics of a structure, such as natural frequencies and mode shapes.

[0036] Harmonic response analysis: study the dynamic response of a structure under simple harmonic loads.

[0037] Implementation of coupling: In finite element analysis software such as ANSYS, coupling between different physical fields can usually be achieved by setting up multi-physics interfaces or coupled field units. Users need to define corresponding boundary conditions, loads, and solution settings to ensure that the analysis can be carried out correctly.

[0038] In the embodiment of the present application, coupling the finite element model in piezoelectric analysis, modal analysis, and harmonic response analysis means using the analysis results of the finite element model in piezoelectric analysis and the finite element model as the excitation input of the modal analysis; and using the analysis results of the finite element model in piezoelectric analysis, the analysis results in modal analysis, and the finite element model as the excitation input of the harmonic response analysis.

[0039] Step S130: coupling the harmonic response analysis result to the sound field finite element model as an excitation input, performing sound field analysis, and determining the acoustic performance of the target object.

[0040] In the embodiment of the present application, the sound field finite element model refers to a finite element model corresponding to the sound field space constructed based on the 3D model of the target object.

[0041] Specifically, the 3D model created in step S110 is used as the basis of the sound field space. At the same time, the material properties (such as density, sound velocity, etc.) set in step S120 are connected to the sound field analysis to obtain a sound field space corresponding to the actual structure of the PCBA, and a sound field analysis model containing correct material properties. These material properties have an important influence on the propagation and reference of sound in the PCBA. Among them, the schematic diagram of the sound field space can be as follows Figure 2 shown.

[0042] Then determine the boundary of the sound field, which includes the range, shape and boundary conditions (such as reflection, absorption, etc.) of the sound field. Then, establish a finite element model of the sound field, and divide the sound field space into multiple small finite elements for numerical calculation. Next, couple the velocity vectors of each point of the PCBA at each frequency obtained by the harmonic response analysis in step S120 to this step as the excitation input of the sound field analysis. Thus, a finite element model containing the correct excitation input can be obtained, and the sound field calculation can be performed to evaluate the acoustic performance of the PCBA.

[0043] The present application provides a method for establishing a parameterized model of multi-physical field coupling. First, based on the 3D model of the target object, a finite element model of the target object is constructed. The finite element model consists of multiple interconnected units and nodes, and each unit has specific material properties and geometric shapes. Then, the finite element model is coupled in piezoelectric analysis, modal analysis, and harmonic response analysis to determine the harmonic response analysis results. Finally, the harmonic response analysis results are coupled to the acoustic field finite element model as an excitation input, and an acoustic field analysis is performed to determine the acoustic performance of the target object. Through the above method, the influence of the inverse piezoelectric effect on vibration and noise can be more comprehensively calculated and analyzed, so that the noise design can be quantified, the optimal design can be quickly found, and project costs and project time can be saved.

[0044] See also Figure 3, an embodiment of the present application provides a method for establishing a parameterized model of multi-physical field coupling, the method comprising:

[0045] Step S210: constructing a finite element model of the target object based on the 3D model of the target object, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes.

[0046] As a method, a 3D model of a target object is constructed; material properties are assigned to different parts or components in the 3D model to obtain a first 3D model; the boundaries of the first 3D model are determined and meshed to obtain a second 3D model; and some structural dimensions and material properties in the second 3D model are parameterized to obtain the finite element model.

[0047] In the embodiment of the present application, after the 3D model is constructed, it is necessary to assign material properties to different parts or components in the model. These properties include elastic modulus, Poisson's ratio, density, etc., which will affect the results of subsequent finite element analysis. The definition of material properties is usually based on experimental data or standard values ​​in material manuals.

[0048] After assigning material properties to obtain the first 3D model, the boundary of the first 3D model can be determined and meshed. Specifically:

[0049] 1. Establish boundary conditions: Boundary conditions refer to the way the model interacts with the external environment, such as fixed constraints, load application, etc. These conditions need to be set according to the actual physical situation.

[0050] 2. Meshing: Meshing is the process of discretizing a continuous 3D model into a finite number of units and nodes. This is usually done through specialized meshing software (such as Hypermesh) or meshing tools in finite element analysis software (such as ANSYS). The quality and density of the mesh directly affect the accuracy of the analysis results and the computational efficiency.

[0051] Parametric design allows users to quickly generate different models and analysis scenarios by changing certain key parameters. In finite element analysis, some structural dimensions and material properties can be parameterized to study the impact of these parameter changes on the analysis results.

[0052] After the above steps, a finite element model will be obtained, which consists of a series of interconnected units and nodes, each unit has specific material properties and geometric shapes. This model will be used for subsequent finite element analysis.

[0053] Step S220: coupling the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis result.

[0054] As a method, a preset voltage excitation is obtained; based on the preset voltage excitation, a piezoelectric analysis is performed on the finite element model to determine the inverse piezoelectric effect stress on the finite element model; a modal analysis is performed on the finite element model to determine the modal analysis result corresponding to the finite element model; the inverse piezoelectric effect stress and the modal analysis result are used as excitation inputs for harmonic response analysis, and the harmonic response analysis result is determined through harmonic response analysis, wherein the harmonic response analysis result includes the velocity vector of the target object at each frequency.

[0055] The preset voltage excitation refers to a preset excitation input for performing piezoelectric analysis.

[0056] Specifically, piezoelectric analysis is performed: the preset voltage excitation is used as the excitation input of the piezoelectric analysis. When the preset voltage excitation is applied to the PCBA, the material will deform due to the inverse piezoelectric effect and thus be acted upon by a force. The magnitude and direction of the force generated by the inverse piezoelectric effect are calculated to obtain a vector force, that is, the inverse piezoelectric effect force.

[0057] Perform modal analysis: First, perform modal analysis on the PCBA to determine its natural frequency and vibration mode. This step helps to understand the vibration characteristics of the PCBA at different frequencies.

[0058] Set harmonic response analysis parameters: Next, set the parameters of the harmonic response analysis, such as frequency range, damping coefficient, etc. These parameters will affect the accuracy and reliability of the analysis results.

[0059] Apply excitation and solve: In harmonic response analysis, apply appropriate excitation to the PCBA, such as acceleration or force, and solve its response at different frequencies. This step will obtain the velocity vector of each point of the PCBA at each frequency.

[0060] Step S230: coupling the harmonic response analysis result to the sound field finite element model as an excitation input, performing sound field analysis, and determining the acoustic performance of the target object.

[0061] As a method, a sound field space based on the 3D model is constructed; the material properties assigned to the 3D model are coupled to the sound field space to obtain a target sound field space; the sound field boundary of the target sound field space is determined to obtain the sound field finite element model; the harmonic response analysis result is used as the excitation input of the sound field finite element model to perform sound field analysis and determine the acoustic performance of the target object.

[0062] In an embodiment of the present application, corresponding acoustic boundary conditions, such as reflection boundaries, absorption boundaries, etc., can be set according to the geometric shape of the 3D model to simulate the actual acoustic environment.

[0063] Step S240: post-processing the acoustic performance of the target object to determine a processing result.

[0064] Step S250: Optimizing the structure of the target object based on the processing result to obtain an optimized target object.

[0065] In the embodiment of the present application, the process described in step S240 and step S250 may include:

[0066] (1) Post-processing and evaluation of results:

[0067] Data collation: collate the data obtained from simulation or experiment and extract key information, such as load, earthquake, frequency, etc.

[0068] Result visualization: Use charts, cloud maps, animations, etc. to display the results analytically for analysis and understanding.

[0069] Performance analysis: Evaluate the results based on design requirements and standards to determine whether the structure meets the expected performance indicators.

[0070] (2) Structural optimization:

[0071] Problem identification: Based on the results of subsequent processing, weak links or potential problems in the structure are identified.

[0072] Improve the design: Propose improvement plans for the identified problems, such as adjusting materials, changing structural shape, adding supports, etc.

[0073] Verify the optimization: Simulate or experiment again on the optimized structure to verify whether the optimization effect meets expectations.

[0074] (3) Parametric design:

[0075] Parameter definition: Based on the design requirements, define a set of variable parameters, such as the elastic modulus of the material, the size of the structure, etc.

[0076] Parameter analysis: By changing the values ​​of these parameters, analyze the impact of their structure on performance and find the optimal parameter combination.

[0077] Design automation: Use parametric design tools to automate design and improve design efficiency and quality.

[0078] Optionally, the process described in step S210 to step S250 can be as follows: Figure 4 As shown, in Figure 4In the process, first, the vibration characteristics of the PCBA at each frequency are obtained by coupling piezoelectric analysis and modal analysis. Then, these vibration characteristics are used as input to perform harmonic response analysis to obtain the velocity vectors of each point at each frequency, which are then used as excitation inputs for acoustic field analysis. Then, the acoustic field space is built based on the original 3D model, and the material properties are coupled to the acoustic field analysis. After that, the acoustic field boundary is established, the finite element model is established, and the calculation is performed using the previously calculated results as excitation input. Finally, the results are post-processed and evaluated, and structural optimization and parametric design are performed as needed.

[0079] The present application provides a method for establishing a parameterized model of multi-physical field coupling, which can comprehensively calculate and analyze the influence of the inverse piezoelectric effect on vibration and noise, thereby quantifying the noise design and quickly finding the optimal design, saving project costs and time.

[0080] See also Figure 5 , an embodiment of the present application provides a multi-physics field coupling parameterized model building device 300, the device 300:

[0081] The construction unit 310 is used to construct a finite element model of the target object based on the 3D model of the target object, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes.

[0082] As a method, the construction unit 310 is also used to construct a 3D model of the target object; assign material properties to different parts or components in the 3D model to obtain a first 3D model; determine the boundaries and mesh the first 3D model to obtain a second 3D model; parameterize some structural dimensions and material properties in the second 3D model to obtain the finite element model.

[0083] The result determination unit 320 is used to couple the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis result.

[0084] As a method, the result determination unit 320 is specifically used to obtain a preset voltage excitation; based on the preset voltage excitation, perform piezoelectric analysis on the finite element model to determine the inverse piezoelectric effect stress on the finite element model; perform modal analysis on the finite element model to determine the modal analysis result corresponding to the finite element model; use the inverse piezoelectric effect stress and the modal analysis result as excitation inputs for harmonic response analysis, and determine the harmonic response analysis result through harmonic response analysis, wherein the harmonic response analysis result includes the velocity vector of the target object at each frequency.

[0085] The performance determination unit 330 is used to couple the harmonic response analysis result to the sound field finite element model as an excitation input, perform sound field analysis, and determine the acoustic performance of the target object.

[0086] As a method, the performance determination unit 330 is specifically used to build a sound field space based on the 3D model; couple the material properties assigned to the 3D model to the sound field space to obtain a target sound field space; determine the sound field boundary of the target sound field space to obtain the sound field finite element model; use the harmonic response analysis result as the excitation input of the sound field finite element model, perform sound field analysis, and determine the acoustic performance of the target object.

[0087] See also Figure 6 , the device 300 further includes:

[0088] The optimization unit 340 is used to perform post-processing on the acoustic performance of the target object to determine a processing result; and perform structural optimization on the target object based on the processing result to obtain an optimized target object.

[0089] Wherein, the target object includes a PCBA and a piezoelectric capacitor; the piezoelectric capacitor is mounted on the PCB via an SMT patch, and the PCBA is fixed to the housing via screws.

[0090] It should be noted that the device embodiment in the present application corresponds to the aforementioned method embodiment. The specific principles in the device embodiment can be found in the contents of the aforementioned method embodiment and will not be repeated here.

[0091] The following will be combined Figure 7 A vehicle provided in the present application is described.

[0092] See also Figure 7 Based on the above-mentioned method and device for establishing a parameterized model of multi-physical field coupling, the embodiment of the present application also provides another vehicle 800 that can execute the above-mentioned method for establishing a parameterized model of multi-physical field coupling. The vehicle 800 includes one or more (only one is shown in the figure) processors 802, a memory 804, and a network module 806 that are coupled to each other. Among them, the memory 804 stores a program that can execute the content of the above-mentioned embodiment, and the processor 802 can execute the program stored in the memory 804.

[0093] Among them, the processor 802 may include one or more processing cores. The processor 802 uses various interfaces and lines to connect various parts of the entire vehicle 800, and executes various functions and processes data of the vehicle 800 by running or executing instructions, programs, code sets or instruction sets stored in the memory 804, and calling data stored in the memory 804. Optionally, the processor 802 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 802 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface and application programs; the GPU is responsible for rendering and drawing display content; and the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 802, but may be implemented separately through a communication chip.

[0094] The memory 804 may include a random access memory (RAM) or a read-only memory (ROM). The memory 804 may be used to store instructions, programs, codes, code sets or instruction sets. The memory 804 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the following various method embodiments, etc. The data storage area may also store data created by the vehicle 800 during use (such as a phone book, audio and video data, chat record data), etc.

[0095] The network module 806 is used to receive and send electromagnetic waves, realize the mutual conversion between electromagnetic waves and electrical signals, and thus communicate with a communication network or other devices, such as communicating with a vehicle. The network module 806 may include various existing circuit elements for performing these functions, such as antennas, radio frequency nodes, digital signal processors, encryption / decryption chips, user identity module (SIM) cards, memories, etc. The network module 806 can communicate with various networks such as the Internet, corporate intranets, wireless networks, or communicate with other devices through wireless networks. The above-mentioned wireless networks may include cellular telephone networks, wireless local area networks, or metropolitan area networks. For example, the network module 806 can exchange information with a base station.

[0096] Please refer to Figure 8 , which shows a structural block diagram of a computer-readable storage medium provided in an embodiment of the present application. The computer-readable storage medium 900 stores program codes, which can be called by a processor to execute the method described in the above method embodiment.

[0097] The computer-readable storage medium 900 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read-only memory), an EPROM, a hard disk, or a ROM. Optionally, the computer-readable storage medium 900 includes a non-transitory computer-readable storage medium. The computer-readable storage medium 900 has storage space for program code 910 that performs any method step in the above method. These program codes can be read from or written to one or more computer program products. The program code 910 can be compressed, for example, in an appropriate form.

[0098] The present application provides a method, device, vehicle and storage medium for establishing a parameterized model of multi-physical field coupling. First, based on the 3D model of the target object, a finite element model of the target object is constructed, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes. Then, the finite element model is coupled in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis results. Finally, the harmonic response analysis results are coupled to the sound field finite element model as an excitation input, and the sound field analysis is performed to determine the acoustic performance of the target object. Through the above method, the influence of the inverse piezoelectric effect on vibration and noise can be more comprehensively calculated and analyzed, so that the noise design can be quantified, and the optimal design can be quickly found, saving project costs and project time.

[0099] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A method for establishing a parameterized model of multi-physics field coupling, characterized in that: The method comprises: Based on the 3D model of the target object, construct a finite element model of the target object, wherein the finite element model consists of a plurality of interconnected units and nodes, each unit having specific material properties and geometric shapes; The finite element model is coupled in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis result; The harmonic response analysis result is coupled to a sound field finite element model as an excitation input, and a sound field analysis is performed to determine the acoustic performance of the target object.

2. The method according to claim 1, characterized in that The step of constructing a finite element model of the target object based on the 3D model of the target object includes: Build a 3D model of the target object; Assigning material properties to different parts or components in the 3D model to obtain a first 3D model; Determine the boundary and divide the mesh of the first 3D model to obtain a second 3D model; Part of the structural dimensions and material properties in the second 3D model are parameterized to obtain the finite element model.

3. The method according to claim 1, characterized in that The step of coupling the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis to determine the harmonic response analysis result includes: Get preset voltage excitation; Based on the preset voltage excitation, performing piezoelectric analysis on the finite element model to determine the inverse piezoelectric effect stress on the finite element model; Performing modal analysis on the finite element model to determine a modal analysis result corresponding to the finite element model; The inverse piezoelectric effect stress and the modal analysis result are used as excitation inputs of a harmonic response analysis, and the harmonic response analysis result is determined through the harmonic response analysis, wherein the harmonic response analysis result includes a velocity vector of the target object at each frequency.

4. The method according to claim 3, characterized in that The step of coupling the harmonic response analysis result to the sound field finite element model as an excitation input, performing sound field analysis, and determining the acoustic performance of the target object includes: Building a sound field space based on the 3D model; coupling the material properties assigned to the 3D model to the sound field space to obtain a target sound field space; Determining the sound field boundary of the target sound field space to obtain the sound field finite element model; The harmonic response analysis result is used as the excitation input of the sound field finite element model to perform sound field analysis and determine the acoustic performance of the target object.

5. The method according to claim 1, characterized in that The method further comprises: Post-processing the acoustic performance of the target object to determine a processing result; The target object is structurally optimized based on the processing result to obtain an optimized target object.

6. The method according to any one of claims 1 to 5, characterized in that: The target object includes a PCBA and a piezoelectric capacitor; the piezoelectric capacitor is mounted on the PCB via an SMT patch, and the PCBA is fixed to the housing via screws.

7. A parameterized model building device for multi-physics field coupling, characterized in that: The device comprises: A construction unit, used to construct a finite element model of the target object based on the 3D model of the target object, wherein the finite element model is composed of a plurality of interconnected units and nodes, and each unit has specific material properties and geometric shapes; A result determination unit, used for coupling the finite element model in piezoelectric analysis, modal analysis and harmonic response analysis to determine a harmonic response analysis result; The performance determination unit is used to couple the harmonic response analysis result to the sound field finite element model as an excitation input, perform sound field analysis, and determine the acoustic performance of the target object.

8. The device according to claim 7, characterized in that The construction unit is also used to construct a 3D model of the target object; assign material properties to different parts or components in the 3D model to obtain a first 3D model; determine the boundaries and mesh the first 3D model to obtain a second 3D model; parameterize some structural dimensions and material properties in the second 3D model to obtain the finite element model.

9. A vehicle, characterized in that: The method comprises one or more processors; one or more programs are stored in a memory and configured to execute the method according to any one of claims 1 to 6 by the one or more processors.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores program code, wherein when the program code is executed by a processor, the method according to any one of claims 1 to 6 is executed.

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