Display module and display device

Abstract

The invention discloses a display module and a display device, and the display module comprises a display panel which comprises a display surface and a back surface; the back plate is arranged on the back surface, and the back plate comprises a tongue piece provided with a connecting part; the circuit board comprises a main board and at least one connecting piece, the main board is provided with a first surface and a second surface which are back to back along a first direction, and the connecting piece is arranged by extending from the first surface back to the second surface; and the connecting piece is in interference fit connection with the connecting part, so that the circuit board is fixed on the back plate. According to the display module and the display device provided by the embodiment of the invention, the connecting piece is arranged on the first surface of the circuit board, protrudes back to the second surface and is in interference fit connection with the connecting part of the tongue piece, so that the second surface of the circuit board does not protrude, the requirement for an installation space is reduced, and the risk of interference with a whole machine is reduced; in addition, the circuit board can be stably fixed on the back plate and is not easy to loosen, the yield is high, the circuit board is convenient to disassemble in subsequent installation or repair operation, the required material types are few, and thus the preparation cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of display equipment, and in particular to a display module and a display device. Background Art

[0002] With the development of display technology, display devices (such as mobile phones, tablets, wearable bracelets or TVs, etc.) have been widely used, and users' requirements for display devices have gradually increased, and display devices have gradually developed towards being thinner and lighter and full-screen. However, this has also led to an increase in the difficulty of manufacturing the corresponding display devices, and higher requirements for the manufacturing process. Summary of the invention

[0003] The embodiments of the present application provide a display module and a display device, which can improve the yield rate of the display device and reduce the manufacturing cost.

[0004] In a first aspect, an embodiment of the present application provides a display module, comprising: a display panel, a back plate and a circuit board; the display panel comprises a display surface and a back surface opposite to each other. The back plate is arranged on the back of the display panel, and the back plate also comprises a tongue piece, and the tongue piece is provided with a connecting portion. The circuit board comprises a main board and a connecting member, the main board has a first surface and a second surface opposite to each other along a first direction X, and the connecting member is extended from the first surface to the second surface. The connecting member is connected to the connecting portion by interference fit, so that the circuit board is fixed to the back plate.

[0005] In a second aspect, an embodiment of the present application provides a display device, comprising the display module provided by the embodiment of the first aspect.

[0006] In the display module and display device provided by the embodiments of the present application, in the display module, the connecting member is arranged on the first surface of the circuit board and protrudes away from the second surface, and is connected with the connecting portion of the tongue piece by interference fit, so that no protrusion appears on the second surface of the circuit board, thereby reducing the demand for installation space and the risk of interference with the whole machine. At the same time, the circuit board can also be firmly fixed to the back plate and is not easy to loosen, with a high yield rate, and is easy to disassemble in subsequent installation or rework operations, requiring fewer types of materials, thereby reducing preparation costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0008] Figure 1 It is a schematic diagram of a planar structure of a display module provided by an embodiment of the first aspect of the present application;

[0009] Figure 2 yes Figure 1 A schematic diagram of the planar structure of the back plate shown in FIG.

[0010] Figure 3 yes Figure 1 A schematic diagram of the planar structure of the circuit board shown in FIG.

[0011] Figure 4 yes Figure 1 Schematic diagram of the cross-sectional structure along the AA direction;

[0012] Figure 5 It is a schematic diagram of the planar structure of another display module provided by the embodiment of the first aspect of the present application;

[0013] Figure 6 yes Figure 5 A schematic diagram of the planar structure of the back plate shown;

[0014] Figure 7 yes Figure 5 A schematic diagram of the planar structure of the circuit board shown;

[0015] Figure 8 yes Figure 5 A schematic diagram of a planar structure of another circuit board is shown;

[0016] Fig. 9 yes Figure 5 Schematic diagram of the cross-sectional structure along the BB direction;

[0017] Fig.10 yes Figure 1 A schematic diagram of the planar structure of another backplane shown;

[0018] Fig.11 yes Figure 1 A schematic diagram of the planar structure of another backplane shown;

[0019] Fig.12 yes Figure 1 A schematic diagram of the planar structure of another backplane shown;

[0020] Fig.13 yes Figure 5 A schematic diagram of the planar structure of another backplane shown;

[0021] Fig.14 yes Figure 3 Cross-sectional structure diagram along CC direction;

[0022] Fig.15 yes Figure 7 Cross-sectional structure diagram along DD direction;

[0023] Fig.16 yes Figure 3 Another cross-sectional structure diagram along the CC direction;

[0024] Fig.17 yes Figure 7 Another cross-sectional structure diagram along the DD direction;

[0025] Fig.18 yes Figure 1 Another schematic diagram of the cross-sectional structure along the AA direction;

[0026] Fig.19 yes Fig.16 The planar structure diagram of the conductive adhesive layer shown;

[0027] Fig. 20 yes Figure 5 Schematic diagram of the cross-sectional structure along the BB direction;

[0028] Fig.21 yes Fig.18 The planar structure diagram of the conductive adhesive layer shown;

[0029] Fig. 22 yes Figure 1 Schematic diagram of the cross-sectional structure along the EE direction;

[0030] Fig.23 It is a structural schematic diagram of a display device provided in an embodiment of the second aspect of the present application.

[0031] in:

[0032] 100-display module;

[0033] 10-display panel; 10a-display surface; 10b-back surface;

[0034] 11-light board; 12-light guide plate; 13-optical film;

[0035] 20-back plate; 21-tongue;

[0036] 211-first opening; 211a-first side periphery; 211b-second side periphery;

[0037] 21a-first side; 21b-second side; 22-first notch; 23-second notch; 22a-first notch edge; 23a-second notch edge; 24-second opening; 25-extension portion;

[0038] C0-connection part;

[0039] 30-circuit board; 31-main board; 31a-first surface; 31b-second surface; 32-conductive circuit portion; 33-solder pad;

[0040] C1-connecting piece; C11-first connecting piece; C12-second connecting piece;

[0041] 40-conductive adhesive layer; 41-through hole; 42-cutting opening; 43-first notch; 44-second notch;

[0042] X-first direction;

[0043] 1000-display device.

[0044] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0045] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0046] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0047] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the display module and display device of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0048] In the related art, a printed circuit board in a display device is usually fixed on a tongue piece of a back plate.

[0049] On this basis, related technologies usually adopt two solutions for fixing the printed circuit board and the tongue. The first solution is to punch holes on the tongue and the printed circuit board and then fix them by screwing, with the device surface of the printed circuit board facing the tongue; the second solution is to adhere a conductive double-sided tape with an area equivalent to the plane of the printed circuit board to the tongue, and then place the printed circuit board and press it to achieve bonding and fixing.

[0050] However, in the first solution of the related art, the screws for fastening protrude from the surface of the printed circuit board, and the whole machine inside the display device needs to provide a clearance space of at least 0.2 mm in thickness, or there will be interference between the whole machine and the screws.

[0051] The second solution has the problem that the conductive double-sided adhesive gradually loses its viscosity during long-term use, causing the printed circuit board to warp and deform, gradually aggravating the fixed connection relationship between the printed circuit board and the tongue, thereby affecting the yield rate of the display device.

[0052] At the same time, in the related art, the solutions using screws or conductive double-sided tape for fixing still have the problems of complex installation structure, relatively long operation time required for installation or repair steps, large material loss when replacing conductive double-sided tape, etc., which leads to high preparation cost.

[0053] Based on the technical needs and considerations for solving the above problems, the present application provides a display module and a display device.

[0054] Figure 1 The planar structure of the display module 100 provided by the first embodiment is shown. Figure 2 Shows Figure 1 The planar structure of the back plate 20 in the embodiment, Figure 3 Shows Figure 1 The planar structure of the circuit board 30 in the embodiment, Figure 4 It shows Figure 1 FIG. 1 is a cross-sectional structure of the display module 100 along the AA direction.

[0055] See also Figures 1 to 4 In a first aspect, an embodiment of the present application provides a display module 100 , including: a display panel 10 , a back panel 20 and a circuit board 30 .

[0056] The display panel 10 includes a display surface 10 a and a back surface 10 b which are opposite to each other.

[0057] The back plate 20 is disposed on the back side 10 b of the display panel 10 . The back plate 20 further includes a tongue piece 21 . The tongue piece 21 is provided with a connecting portion C0 .

[0058] The circuit board 30 includes a main board 31 and a connecting member C1. The main board 31 has a first surface 31a and a second surface 31b opposite to each other along a first direction X. The connecting member C1 extends from the first surface 31a to the second surface 31b.

[0059] The connecting member C1 is connected to the connecting portion C0 by interference fit, so that the circuit board 30 is fixed to the back plate 20 .

[0060] In the display module 100 provided in the embodiment of the present application, the connector C1 is arranged on the first surface 31a of the circuit board 30 and protrudes away from the second surface 31b, and is connected with the connecting portion C0 of the tongue 21 by interference fit, so that no protrusion appears on the second surface 31b of the circuit board 30, thereby reducing the demand for installation space and the risk of interference with the whole machine. At the same time, the circuit board 30 can also be firmly fixed to the back plate 20 and is not easy to loosen, with a high yield rate, and is easy to disassemble in subsequent installation or rework operations, requiring fewer types of materials, thereby reducing the preparation cost.

[0061] The types of display panel 10 include, but are not limited to, liquid crystal display panel LCD, organic light emitting display panel OLED and light emitting diode display panel LED. If the display panel 10 is a liquid crystal display panel LCD, a backlight module may be provided between the display panel and the back panel, and the backlight module is used to provide a backlight source for the liquid crystal display panel. If the display panel 10 is an OLED or LED, in the display panel 10, the light emitting devices for display function and light emitting function are usually provided on only one side of the substrate, so the display panel 10 includes a display surface 10a and a back surface 10b for light emission opposite to each other.

[0062] In order not to affect the display function of the display panel 10 , the back plate 20 for supporting and fixing the display panel 10 (or the backlight module) is usually arranged on the back side 10 b of the display panel 10 .

[0063] Optionally, the planar area of ​​the back plate 20 is slightly larger than the display panel 10 . In addition to fixing the display panel 10 , the back plate 20 also needs to provide support and fixation for components that cooperate with the normal operation of the display panel 10 , such as driver chips.

[0064] A tongue piece 21 is provided on one side of the back plate 20 . The tongue piece 21 is a protruding piece extending from the back plate 20 and has a cross-sectional area much smaller than that of the back plate 20 . The tongue piece 21 is used to fix the circuit board 30 that cooperates with the display panel 10 to work normally.

[0065] Due to the limitation of the setting position of the circuit board 30 and the consideration of reducing the weight of the entire display device 1000, the back panel 20 is provided with a tongue 21 instead of further increasing the plane area of ​​the back panel 20. The connecting portion C0 of the tongue 21 is interference fit connected with the connecting element fixed in advance on the circuit board 30, which can also fix the circuit board 30 on the back panel 20.

[0066] The main board 31 of the circuit board 30 has a first surface 31a and a second surface 31b opposite to each other along the first direction X, which are the same as the display panel 10. However, for the convenience of circuit setting and device connection, the first surface 31a is the device surface where the main working devices and lines on the circuit board 30 are set, and the second surface 31b is the back side 10b of the substrate of the circuit board 30 where no devices are set.

[0067] Among them, the connecting member C1 is arranged on the first surface 31a and extends from the first surface 31a in a direction away from the second surface 31b. When the circuit board 30 and the back plate 20 are assembled together, and the connecting member C1 and the connecting portion C0 form an interference fit connection, the first surface 31a as the device surface of the circuit board 30 is arranged toward the side of the back plate 20.

[0068] When the first surface 31a of the circuit board 30 is arranged toward the back plate 20, the working components and the connector C1 on the circuit board 30 will not protrude from the second surface 31b, and thus will not occupy the working space of other components in the display device 1000, thereby reducing the possibility of interference with other components in the whole device space on the second surface 31b side. Such a setting scheme can reduce the risk of interference while further reducing the thickness of the display device 1000, thereby improving product performance.

[0069] The backplane 20 and other devices are stacked in sequence on one side of the circuit board 30. The stacking arrangement mentioned here means that the other film layers are arranged in sequence along the thickness direction of the circuit board 30, and the thickness direction of the backplane 20 located on one side of the circuit board 30 is usually consistent with the thickness direction of the backplane 20 itself. Therefore, for the convenience of expression, the thickness directions of the circuit board 30 or the backplane 20 mentioned later in the embodiments of the present application are all in the same direction, so this direction is specified as the first direction X.

[0070] The interference fit connection between the connecting member C1 and the connecting portion C0 means that the size of the connecting member C1 is slightly larger than the size of the connecting portion C0, and the operator needs to apply a certain external force to align the connecting member C1 with the connecting portion C0 and press it, so that the connecting portion C0 undergoes a certain degree of elastic deformation, thereby causing the size of the connecting portion C0 to undergo a certain degree of incremental change, and the connecting member C1 also undergoes a certain degree of elastic deformation, so that the size of the connecting member C1 is compressed to a certain extent, so that the connecting member C1 can smoothly enter the connecting portion C0.

[0071] When the external force is removed, the elastic deformation of the connection part C0 and the connection member C1 will continue to deform in the direction of restoring the shape, the size of the connection part C0 will shrink to a certain extent, and the size of the connection member C1 will expand to a certain extent, so that the connection member C1 can fit tightly and be firmly connected with the connection part C0 after installation.

[0072] Optionally, both the connection part C0 and the connection piece C1 are made of materials with good elasticity. When the connection part C0 and the connection piece C1 are connected by interference fit, the elastic deformation of the connection part C0 and the connection piece C1 will not exceed the elastic limit of the connection part C0 and the connection piece C1, avoiding the risk of irreversible deformation.

[0073] At the same time, the connection portion C0 and the connection piece C1 are made of materials with good elasticity, which can make the installation and disassembly process more convenient for operators, thereby improving the preparation efficiency.

[0074] When the connecting member C1 and the connecting portion C0 are connected by interference fit, the circuit board 30 is firmly fixed to the back plate 20 , thereby achieving a fixed connection of the circuit board 30 .

[0075] Optionally, the size difference between the connection portion C0 and the connection member C1, that is, the interference fit, is set within 0.2 mm to ensure that the deformation of the connection portion C0 and the connection member C1 does not exceed the elastic limit during interference fit, thereby avoiding the risk of irreversible deformation.

[0076] See also Figure 4 In some embodiments, the circuit board 30 further includes a conductive circuit portion 32 , and the conductive circuit portion 32 is exposed through the first surface 31 a .

[0077] The connecting member C1 is connected to the connecting portion C0 by interference fit, so that the circuit board 30 abuts against the tongue piece 21 of the back plate 20 through the conductive circuit portion 32 .

[0078] In these embodiments, the conductive circuit portion 32 in the circuit board 30 is exposed through the first surface 31a and abuts against the tongue 21 of the back plate 20, thereby achieving conduction of the grounding circuit of the circuit board 30 and completing the grounding; at the same time, due to the interference fit connection between the connector C1 and the connecting portion C0, the circuit board 30 and the back plate 20 are always firmly connected, so that the conductive circuit portion 32 is always abutted against the tongue 21, further ensuring the continuous and effective grounding of the circuit board 30.

[0079] In the related art, the first solution is that holes are punched on the tongue 21 and the printed circuit board 30 and then fixed by screws. In addition to the fixed connection between the tongue 21 and the printed circuit board 30, the device surface of the printed circuit board 30 faces the tongue 21, and the copper leakage area on the printed circuit board 30 is in contact with the tongue 21 to achieve grounding.

[0080] The second solution is to use a conductive double-sided tape with an area equivalent to that of the printed circuit board 30 to adhere to the tongue 21, and then place the printed circuit board 30 and press it to achieve adhesion and fixation. In addition to the tongue 21 and the printed circuit board 30 being fixedly connected by the conductive double-sided tape, the copper leakage area of ​​the printed circuit board 30 is also connected to the tongue 21 by the conductive double-sided tape to achieve grounding.

[0081] In the first and second solutions, there is still the problem that the printed circuit board 30 may warp, or the conductive double-sided adhesive may gradually lose its viscosity during long-term use, which will gradually aggravate the problem of failure of the electrical connection between the printed circuit board 30 and the tongue 21, thereby increasing the grounding impedance of the printed circuit board 30, thereby affecting the yield of the display device 1000 to a certain extent.

[0082] In the display module 100 provided in the embodiment of the present application, the conductive circuit portion 32 is in abutment with the tongue piece 21. Due to the interference fit connection between the connector C1 and the connecting portion C0, the circuit board 30 can always be firmly connected to the back plate 20, so that the conductive circuit portion 32 can always be in abutment with the tongue piece 21, thereby achieving continuous and effective grounding.

[0083] The conductive circuit portion 32 refers to the circuit or period in a specific area on the circuit board 30 that is exposed from the device surface and is not covered with insulating material. The specific area is divided into a copper leakage area, and the circuits and devices in the copper leakage area mainly play the role of testing, heat dissipation, or maintenance standby. In the embodiment of the present application, the conductive circuit portion 32 is used to achieve the internal circuit of the circuit board 30 and the tongue 21 of the back plate 20 overlap, so as to achieve the internal circuit of the circuit board 30 grounding.

[0084] Optionally, the thickness of the conductive circuit portion 32 is slightly greater than the gap width between the circuit board 30 and the back plate 20 after the connection portion C0 and the connector C1 are connected by interference fit, further enabling the conductive circuit portion 32 to always abut against the tongue piece 21 .

[0085] See also Figure 2 and Figure 4 In some embodiments, the tongue piece 21 includes at least one first opening 211 that penetrates through the tongue piece 21 and connects two side planes of the tongue piece 21. The connecting portion C0 also includes a first side periphery 211a and a second side periphery 211b of a cross section of the first opening 211 along the first direction X.

[0086] The connecting member C1 can be connected to the first side enclosure 211a and the second side enclosure 211b by interference fit.

[0087] In these embodiments, a first opening 211 is provided on the tongue piece 21, and the connecting member C1 contacts the side periphery of the first opening 211 at least at two points, namely, the first side periphery 211a and the second side periphery 211b in the cross section of the first opening 211 along the first direction X. The first side periphery 211a and the second side periphery 211b constitute a connecting portion C0 on the tongue piece 21, and the connecting member C1 forms an interference fit connection with the first side periphery 211a and the second side periphery 211b in the cross-sectional direction.

[0088] Optionally, the first opening 211 on the tongue piece 21 is a closed opening, which means that the shape formed by the entire side of the first opening 211 is a closed figure on the tongue piece 21. When the connecting portion C0 is arranged on the first opening 211, the connecting member C1 can only be connected to the connecting portion C0 by interference fit in a manner of penetrating the tongue piece 21 from one side surface of the tongue piece 21 and being arranged on the other side surface of the tongue piece 21.

[0089] Optionally, the connection portion C0 is disposed on the side of the first opening 211. When the connection member C1 passes through the first opening 211 and is connected to the first opening 211 by interference fit, the connection portion C0 at least includes the first side 211a and the second side 211b in a cross section of the first opening 211 along the first direction X.

[0090] When the minimum distance between the first side enclosure 211a and the second side enclosure 211b is smaller than the size of the connector C1, the connector C1 forms an interference fit connection with the first side enclosure 211a and the second side enclosure 211b at least when passing through the first opening 211, thereby fixing the circuit board 30 and the back plate 20.

[0091] Optionally, the connector C1 only needs to ensure that the size of a certain cross section along the first direction X is greater than the minimum distance between the first side enclosure 211a and the second side enclosure 211b. In these optional embodiments, the connector C1 only needs to be passed through the first opening 211, and an interference fit connection is not necessarily formed at this time; then the connector C1 is rotated to make the cross section of the connector C1 with a cross section size greater than the distance between the first side enclosure 211a and the second side enclosure 211b coincide with the cross section where the first side enclosure 211a and the second side enclosure 211b are located, and the connector C1 and the connecting portion C0 can also form an interference fit connection, and the installation and disassembly process is more convenient, which can improve the preparation efficiency in the production or rework steps.

[0092] When the connector C1 contacts the connecting portion C0 in the tongue 21 at least at two locations to form a connection relationship, the connector C1 has a new contact point. Since there are at least two contacts, the force on the connector C1 is more balanced, making the connection relationship between the connector C1 and the connecting portion C0 more stable.

[0093] When the connecting member C1 forms an interference fit connection with the first side enclosure 211a and the second side enclosure 211b, since the first side enclosure 211a and the second side enclosure 211b are two sides of an opening on a certain cross section along the first direction X, the connecting member C1 is in contact with the first side enclosure 211a and the second side enclosure 211b of the connecting portion C0 on opposite sides, and the force on the connecting member C1 is further balanced, so that the connection relationship is further stabilized.

[0094] Optionally, the connection portion C0 includes a first side periphery 211a and a second side periphery 211b on a cross section of multiple openings along the first direction X, and the connection member C1 further forms multiple contacts with the connection portion C0, and the force on the connection member C1 is further balanced, so that the connection relationship is further stabilized.

[0095] Optionally, the connection portion C0 includes a first side perimeter 211a and a second side perimeter 211b on any cross section of the opening along the first direction X. The connection portion C0 is the entire side perimeter of the first opening 211 . The force of the connection member C1 is further balanced, making the connection relationship more stable.

[0096] Optionally, the first opening 211 also includes an extension portion 25 formed by the first opening 211 on the side of the tongue 21 away from the circuit board 30 and extending in a direction away from the first opening 211, the extension portion 25 and the tongue 21 are an integrated structure, and the first side surround 211a and the second side surround 211b also include the inner side of the cross-section of the extension portion 25 along the first direction X.

[0097] Optionally, the extension portion 25 is formed by bending the tongue piece 21 structure originally covering the first opening 211 outward.

[0098] See also Figure 2 In some embodiments, the first opening 211 is disposed at the center of the tongue piece 21 .

[0099] In these embodiments, the first opening 211 is arranged at the center position of the tongue piece 21, which can ensure the mechanical structural strength of the first opening 211. When repeatedly connected with the connecting portion C0 by interference fit, the first opening 211 is not prone to cracks from the side of the first opening 211 to the edge of the tongue piece 21, thereby avoiding the risk of the first opening 211 breaking and the connection failing.

[0100] See also Figure 2 and Figure 4 In some embodiments, the first opening 211 is a circular hole, the connecting member C1 is a rotating body, and the maximum diameter of the connecting member C1 is greater than the maximum diameter of the first opening 211 .

[0101] In these embodiments, the first opening 211 is configured as a circular hole and the connecting member C1 is configured as a rotating body. While the preparation process is simple, the mechanical structural strength of the first opening 211 and the connecting member C1 can be guaranteed to the greatest extent, and structural deformation exceeding the elastic limit can be prevented. The maximum diameter of the connecting member C1 is larger than the maximum diameter of the first opening 211, thereby ensuring that the connecting member C1 and the connecting portion C0 can form an interference fit connection.

[0102] See also Figure 4 In some embodiments, the cross-section of the first opening 211 in the first direction X is trapezoidal, and the diameter of the first opening 211 gradually decreases in a direction away from the circuit board 30 .

[0103] In these embodiments, by setting the size of the first opening 211 to gradually decrease in a direction away from the circuit board 30 , the first opening 211 is funnel-shaped, thereby facilitating the alignment of the connector C1 during the assembly process.

[0104] The first opening 211 is configured to be funnel-shaped, and the connector C1 can first form a pre-assembly relationship with the first opening 211, and then the connector C1 can be passed through the first opening 211 by applying external force to form a stable interference fit connection relationship, so that the connector C1 is conveniently aligned with the first opening 211 during the assembly process, shortening the time for rework or assembly steps and improving preparation efficiency.

[0105] Optionally, by setting the first opening 211 to be funnel-shaped, the assembly process of the connector C1 and the first opening 211 can achieve automatic alignment. When there is a small deviation in the positional relationship between the connector C1 and the first opening 211, the connector C1 can still automatically slide into the first opening 211 to form a pre-assembly relationship, and then external force is applied to complete the interference fit connection.

[0106] See also Figure 4 In some embodiments, the cross-section of the connecting member C1 along the first direction X is trapezoidal, and the diameter of the connecting member C1 gradually increases in a direction away from the first surface 31 a.

[0107] In these embodiments, the head diameter of the connector C1 is larger than the root diameter of the connector C1, which facilitates the preparation of the connector C1 and the alignment of the connector C1 and the connecting portion C0. When the connector C1 has not completely passed through the first opening 211, the connector C1 and the connecting portion C0 have already formed an interference fit connection.

[0108] Optionally, the root diameter of the connector C1 is 1 to 2 mm, and the height is 0.5 to 1 mm.

[0109] Figure 5 FIG. 2 shows a planar structure of another display module 100 provided by the first embodiment. Figure 6 Shows Figure 5 The planar structure of the back plate 20 in the embodiment, Figure 7 Shows Figure 5 The planar structure of the circuit board 30 in the embodiment, Figure 8 Shows Figure 5 Another planar structure of the circuit board 30 in the embodiment, Fig. 9 It shows Figure 5 FIG. 1 is a cross-sectional structure of the display module 100 along the BB direction.

[0110] See also Figures 5 to 9 In some embodiments, the connection member C1 includes a first connection member C11 and a second connection member C12, and the connection portion C0 further includes a first side edge 21a and a second side edge 21b in a cross section of the tongue piece 21 along the first direction X.

[0111] The first connecting member C11 is connected to the first side 21a by interference fit, and the second connecting member C12 is connected to the second side 21b by interference fit, so that the tongue 21 is clamped between the first connecting member C11 and the second connecting member C12.

[0112] In these embodiments, the first connecting member C11 and the second connecting member C12 respectively cooperate with the first side 21a and the second side 21b to form an interference fit connection. There is no need to punch holes on the tongue 21. The interference fit connection can also be achieved to achieve a stable connection between the circuit board 30 and the back panel 20, and the preparation process is simpler.

[0113] Optionally, the first side edge 21a and the second side edge 21b are arranged as the part where two side edges opposite to each other of the tongue piece 21 intersect with a cross section along the first direction X, wherein when the first side edge 21a and the second side edge 21b exist, the cross section along the first direction X is not parallel to any one of the two side edges opposite to the tongue piece 21.

[0114] Optionally, the connection portion C0 is disposed on two opposite sides of the tongue piece 21. When the first connection member C11 and the second connection member C12 overlap the two sides respectively, the connection portion C0 at least includes the first side edge 21a and the second side edge 21b in the cross section of the tongue piece 21 along the first direction X.

[0115] When the distance between the first side 21a and the second side 21b is greater than the distance between the first connecting member C11 and the second connecting member C12, the tongue piece 21 is connected between the first connecting member C11 and the second connecting member C12 to achieve interference fit connection.

[0116] Optionally, the distance between the first connector C11 and the second connector C12 is smaller than the length of the tongue 21. The first connector C11 or the second connector C12 is first overlapped with one side of the tongue 21, and then the second connector C12 or the first connector C11 is overlapped with the other side of the tongue 21 by applying external force to form an interference fit connection, thereby fixing the circuit board 30 and the back plate 20.

[0117] Alternatively, two positions of the circuit board 30 corresponding to the first connector C11 and the second connector C12 are pressed simultaneously, so that the first connector C11 and the second connector C12 overlap with the tongue piece 21 at the same time to form an interference fit connection.

[0118] Optionally, the distance between the first connector C11 and the second connector C12 only needs to be less than the distance between the first side 21a and the second side 21b in a certain cross section of the tongue piece 21 along the first direction X. In these optional embodiments, the tongue piece 21 only needs to be disposed between the first connector C11 and the second connector C12, and an interference fit connection is not necessarily formed at this time; the first connector C11 and the second connector C12 are then rotated, and the plane where the first connector C11 and the second connector C12 are located coincides with the cross section where the first side 21a and the second side 21b are located, and the distance between the first connector C11 and the second connector C12 is greater than the distance between the first connector C11 and the second connector C12. The first connector C11 and the second connector C12 can also form an interference fit connection with the connecting portion C0, and the installation and disassembly process is more convenient, which can improve the preparation efficiency in the production or rework steps.

[0119] When the first connecting member C11 and the second connecting member C12 contact the connecting portion C0 in the tongue piece 21 at least at two points to form a connection relationship, the first connecting member C11 and the second connecting member C12 have newly added contact points, and since there are at least two points of contact, the forces on the first connecting member C11 and the second connecting member C12 are more balanced, making the connection relationship between the first connecting member C11 and the second connecting member C12 and the connecting portion C0 more stable.

[0120] When the first connecting member C11 and the first side 21a as well as the second connecting member C12 and the second side 21b form an interference fit connection, the first side 21a and the second side 21b are arranged on two opposite sides of a tongue 21 on a certain section along the first direction X, and the first connecting member C11 and the second connecting member C12 are respectively in contact with the first side 21a and the second side 21b of the connecting portion C0, so the forces on the first connecting member C11 and the second connecting member C12 are further balanced, so that the connection relationship is further stabilized.

[0121] Optionally, the connection portion C0 includes multiple first side edges 21a and second side edges 21b on the cross section of the tongue 21 along the first direction X, the first connection member C11 and the second connection member C12 further form multiple contacts with the connection portion C0, the forces on the first connection member C11 and the second connection member C12 are further balanced, and the connection relationship is further stabilized.

[0122] Optionally, the connection portion C0 includes a first side 21a and a second side 21b on any cross section of the tongue 21 along the first direction X. The connection portion C0 is two opposite side surfaces of the tongue 21. The forces on the first connection member C11 and the second connection member C12 are further balanced, making the connection relationship further stable.

[0123] See also Fig. 9 In some embodiments, the circuit board 30 further includes a conductive circuit portion 32, which is exposed through the first surface 31a, the first connector C11 is distributed on one side of the conductive circuit portion 32, and the second connector C12 is distributed on a side of the conductive circuit portion 32 away from the first connector C11.

[0124] The first connector C11 is connected to the first side 21 a by interference fit, and the second connector C12 is connected to the second side 21 b by interference fit, so that the circuit board 30 abuts against the tongue 21 of the back plate 20 through the conductive circuit portion 32 .

[0125] In these embodiments, the conductive circuit portion 32 in the circuit board 30 is exposed through the first surface 31a and abuts against the tongue 21 of the back plate 20, so that the grounding circuit of the circuit board 30 can be connected and the grounding is completed; at the same time, due to the interference fit connection between the first connector C11 and the second connector C12 and the connecting portion C0, the conductive circuit portion 32 is arranged between the first connector C11 and the second connector C12, and the circuit board 30 and the back plate 20 are always firmly connected, so that the conductive circuit portion 32 is further always in abutment with the tongue 21, further ensuring the continuous and effective grounding of the circuit board 30.

[0126] Due to the abutment and fit relationship between the conductive circuit portion 32 and the tongue piece 21, and the interference fit connection between the first connector C11 and the second connector C12 and the connector C0, and the conductive circuit portion 32 is arranged between the first connector C11 and the second connector C12, the circuit board 30 can always be firmly connected to the back plate 20, so that the conductive circuit portion 32 can further always abut against the tongue piece 21 to achieve continuous and effective grounding.

[0127] The conductive circuit portion 32 refers to the circuit or period in a specific area on the circuit board 30 that is exposed from the device surface and is not covered with insulating material. The specific area is divided into a copper leakage area, and the circuits and devices in the copper leakage area mainly play the role of testing, heat dissipation, or maintenance standby. In the embodiment of the present application, the conductive circuit portion 32 is used to achieve the internal circuit of the circuit board 30 and the tongue 21 of the back plate 20 overlap, so as to achieve the internal circuit of the circuit board 30 grounding.

[0128] Optionally, the thickness of the conductive circuit portion 32 is slightly larger than the gap width between the circuit board 30 and the back plate 20 after the connection portion C0 is connected by interference fit with the first connector C11 and the second connector C12, further enabling the conductive circuit portion 32 to always abut against the tongue 21.

[0129] See also Figure 6 and Fig. 9 In some embodiments, the tongue 21 also includes a first notch 22 and a second notch 23, and the connecting portion C0 also includes a first notch edge 22a in a cross section of the first notch 22 along the first direction X and a second notch edge 23a in a cross section of the second notch 23 along the first direction X, the first notch edge 22a is connected to the first side 21a, and the second notch edge 23a is connected to the second side 21b.

[0130] The first connecting member C11 is connected to the first notch edge 22a by interference fit, and the second connecting member C12 is connected to the second notch edge 23a by interference fit.

[0131] In these embodiments, by setting the connecting part C0 at the first notch 22 and the second notch 23, the connecting part C0 includes a first notch edge 22a and a second notch edge 23a, which facilitates the pre-assembly relationship between the first connecting member C11 and the first notch 22, and the second connecting member C12 and the second notch 23, thereby facilitating the alignment of the first connecting member C11 and the second connecting member C12 during the assembly process.

[0132] The first notch 22 and the second notch 23 are arranged on two opposite sides of the tongue 21, that is, the first side 21a and the second side 21b in the cross section of the tongue 21 along the first direction X, and the first notch edge 22a and the second notch edge 23a in the cross section of the first notch 22 and the second notch 23 along the first direction X, the first notch edge 22a and the first side 21a are actually on the same surface, and the second notch edge 23a and the second side 21b are actually on the same surface.

[0133] When the connecting part C0 includes a first notch edge 22a and a second notch edge 23a, the first connecting part C11 and the second connecting part C12 can be pre-assembled with the first notch 22 and the second notch 23 before being connected with the connecting part C0 by interference fit, and then the first connecting part C11 and the second connecting part can be matched with the first notch 22 and the second notch 23 to form a stable interference fit connection relationship by applying external force, so that the connecting parts can be easily aligned with the first notch 22 and the second notch 23 during the assembly process, thereby shortening the time of rework or assembly steps and improving preparation efficiency.

[0134] Optionally, by setting the first notch 22 and the second notch 23, the assembly process of the first connecting member C11 and the second connecting member C12 with the tongue 21 can achieve automatic alignment. When there is a small deviation in the positional relationship between the first connecting member C11 and the second connecting member C12 and the first notch 22 and the second notch 23 of the tongue 21, the first connecting member C11 and the second connecting member C12 can still automatically slide into the first notch 22 and the second notch 23 to form a pre-assembly relationship, and then external force is applied to complete the interference fit connection.

[0135] See also Figure 6 In some embodiments, the first notch 22 and the second notch 23 are arranged flush with each other.

[0136] In these embodiments, the flush arrangement allows the first notch 22 and the second notch 23 located on two opposite sides of the tongue piece 21 to maintain balanced forces, thereby avoiding the risk of torsional deformation of the tongue piece 21 due to unbalanced forces on both sides.

[0137] See also Figure 7 and Figure 8 In some embodiments, the cross-sectional shapes of the first connecting member C11 and the second connecting member C12 are circular or square, and the shapes of the first notch 22 and the second notch 23 are adapted to the cross-sectional shapes of the first connecting member C11 and the second connecting member C12.

[0138] In these embodiments, the cross-sectional shapes of the first connecting member C11 and the second connecting member C12 can be set to be circular or square, so as to facilitate the preparation of the first connecting member C11 and the second connecting member C12.

[0139] Optionally, the cross-sectional shape of the first connecting member C11 and the second connecting member C12 is not limited to circular or square, and can be set to any shape.

[0140] Since the first notch 22 and the second notch 23 are arranged on two opposite sides of the tongue piece 21, the first notch edge 22a is connected to the first side 21a, and the second notch edge 23a is connected to the second side 21b, the first notch 22 and the second notch 23 can avoid the risks of material fatigue and cracking caused by insufficient mechanical strength, and can match the cross-sectional shape setting of the first connecting member C11 and the second connecting member C12.

[0141] Figures 10 to 12 Shows Figure 1 Another planar structure of the back plate 20, Fig.13 Shows Figure 5 Another planar structure of the back plate 20.

[0142] See also Figures 10 to 13 In some embodiments, the tongue piece 21 further includes a second opening 24 that penetrates the tongue piece 21 and connects the two side surfaces of the tongue piece 21 .

[0143] The connecting member C1 is connected to the connecting portion C0 by interference fit, so that the size of the second opening 24 is changed.

[0144] In these embodiments, the second opening 24 cooperates with the connecting portion C0 . When the connecting portion C0 generates elastic deformation, the second opening 24 can absorb the elastic deformation generated and transmitted by the connecting portion C0 to a certain extent, thereby improving the flexibility of assembly and disassembly.

[0145] See also Figures 10 to 12 In some embodiments, the tongue piece 21 includes a first opening 211 that penetrates the tongue piece 21 and connects the two side surfaces of the tongue piece 21 .

[0146] The connecting portion C0 includes an edge of the first opening 211 , the connecting member C1 is connected to the edge of the first opening 211 by interference fit, the second opening 24 is arranged around the first opening 211 , and / or the second opening 24 is connected to the first opening 211 .

[0147] In these embodiments, when the connecting portion C0 is set as the edge of the first opening 211, the elastic deformation of the connecting portion C0 during the interference fit connection is manifested as the deformation of the first opening 211. The deformation of the first opening 211 can be absorbed by the second opening 24 that is set around the first opening 211 and / or connected to the first opening 211. The second opening 24 can absorb the deformation of the first opening 211 to a certain extent, thereby further improving the flexibility of assembly and disassembly.

[0148] See also Fig.13 In some embodiments, the circuit board 30 includes a first connector C11 and a second connector C12 , and the tongue piece 21 also includes a first notch 22 and a second notch 23 .

[0149] The connecting portion C0 includes the edges of the first notch 22 and the second notch 23 , the first connecting member C11 is connected to the edge of the first notch 22 by interference fit, the second connecting member C12 is connected to the edge of the second notch 23 by interference fit, and the second opening 24 is arranged between the first notch 22 and the second notch 23 .

[0150] In these embodiments, when the connecting portion C0 is set as the edge of the first notch 22 and the second notch 23, the elastic deformation of the connecting portion C0 generated during the interference fit connection is manifested as the deformation amount of the first notch 22 and the second notch 23, and the deformation generated by the first notch 22 and the second notch 23 can be absorbed by the second opening 24 set between the first notch 22 and the second notch 23. The second opening 24 can absorb the deformation amount of the first notch 22 and the second notch 23 to a certain extent, thereby further improving the flexibility of assembly and disassembly.

[0151] Fig.14 Shows Figure 3 A cross-sectional structure diagram along the CC direction, Fig.15 Shows Figure 7 A cross-sectional structure diagram along the DD direction.

[0152] See also Fig.14 and Fig.15 In some embodiments, the circuit board 30 further includes a soldering pad 33 , the connector C1 includes a metal element, and the connector C1 is connected to the soldering pad 33 by welding.

[0153] The circuit board 30 is also connected to the tongue piece 21 of the back plate 20 through the connecting member C1.

[0154] In these embodiments, while the connector C1 configured as a metal element is welded to the pad 33 of the circuit board 30, the connector C1 overlaps with the tongue 21 of the back plate 20 to form a path, and the circuit board 30 can also be grounded through the path from the connector C1 to the tongue 21.

[0155] Optionally, the connector C1 may be configured as a low-resistance component or metal component to further enhance the grounding effect.

[0156] Fig.16 Shows Figure 3 Another cross-sectional structure diagram along the CC direction, Fig.17 Shows Figure 7 Another cross-sectional structure diagram along the DD direction.

[0157] See also Fig.16 and Fig.17 In some embodiments, the connecting member C1 is a rivet, and the connecting member C1 is fixed to the main board 31 by riveting.

[0158] In these embodiments, the connector C1 is fixed to the circuit board 30 by riveting to avoid the risk of falling off during repeated maintenance.

[0159] The circuit board 30 can also be grounded to the tongue piece through rivets.

[0160] In the related art, when the display module 100 needs to be repaired multiple times, the interference fit connection between the circuit board 30 and the tongue 21 may need to be repeatedly disassembled and reconnected. If a welding connection is used, there is a risk that the pad 33 at the connector C1 will fall off due to multiple repairs.

[0161] Therefore, the connection member C1 is configured as a rivet and directly riveted to the circuit board 30 to further improve the stability of the connection and avoid the risk of falling off during repeated maintenance.

[0162] Optionally, the depth of the connector C1 embedded in the circuit board 30 does not exceed the thickness of the circuit board 30, that is, the connector C1 is fixed by riveting and does not protrude from the second surface 31b of the circuit board 30, avoiding the risk of interfering with the installation space of the entire machine.

[0163] In some embodiments, the length of the connector C1 extending from the first surface 31 a toward the second back surface 10 b is greater than the thickness of the circuit board 30 .

[0164] In these embodiments, since the connector C1 is disposed on one side of the circuit board 30 and the connecting portion C0 is disposed on the tongue 21, the extended length dimension of the connector C1 can be greater than the thickness dimension of the circuit board 30, thereby avoiding the risk of the connector C1 interfering with the installation space of the entire machine when the connecting portion C0 is disposed on the circuit board 30 and the connector C1 is disposed on the tongue 21 and the connector C1 exceeds the connecting portion C0 and protrudes from the second surface 31b.

[0165] Fig.18 Shows Figure 1 Another cross-sectional structure schematic diagram along the AA direction, Fig.19 Shows Fig.18 40 is a planar structural diagram of the conductive adhesive layer 40.

[0166] See also Fig.18 and Fig.19 In some embodiments, the display module 100 further includes a conductive adhesive layer 40 , which is disposed between the conductive circuit portion 32 and the tongue piece 21 , and a portion of the conductive adhesive layer 40 is disposed between the connecting member C1 and the connecting portion C0 .

[0167] The conductive circuit portion 32 of the circuit board 30 is in contact with the tongue piece 21 of the back plate 20 via the conductive adhesive layer 40 .

[0168] In these embodiments, the conductive adhesive layer 40 is provided to further improve the contact effect between the conductive circuit portion 32 and the tongue piece 21 , thereby further enhancing the grounding stability.

[0169] In the related art, the circuit board 30 and the tongue 21 are not completely flat. In fact, there is a certain roughness and chamfer angle between the circuit board 30 and the tongue 21. The conductive circuit part 32 of the circuit board 30 cannot completely abut against the surface of the tongue 21. There is a certain gap between the conductive circuit part 32 and the tongue 21, which may cause the grounding impedance to be too large and the grounding effect to be poor.

[0170] At the same time, the interference fit connection between the connector C1 and the connecting portion C0 may fail, which may also cause the abutment relationship between the conductive circuit portion 32 and the tongue piece 21 to fail, resulting in grounding failure.

[0171] Therefore, a conductive film may be provided between the conductive circuit portion 32 and the tongue piece 21 , so as to further improve the contact effect between the conductive circuit portion 32 and the tongue piece 21 and further enhance the grounding stability.

[0172] At the same time, part of the conductive adhesive layer 40 is pasted between the connection part C0 and the connector C1, which can increase the adhesive force between the connection part C0 and the connector C1. On the other hand, the conductive adhesive layer 40 has a certain thickness, and the conductive adhesive layer 40 is pasted on the connection part C0, which is equivalent to reducing the corresponding size of the connection part C0, thereby increasing the extrusion force formed by the interference fit between the connection part C0 and the connector C1, which is conducive to further improving the clamping stability of the connector C1 on the connection part C0, thereby further improving the fixed connection effect of the circuit board 30 and the tongue piece 21.

[0173] Optionally, the thickness of the conductive adhesive layer 40 is selected according to the actual needs of the display module 100, preferably 0.05 to 0.2 mm. The adhesive strength of the conductive adhesive layer 40 should be greater than 1600 gf / 25 mm, thereby further ensuring the stability and reliability of the conductive adhesive layer 40 in terms of adhesion and conduction.

[0174] See also Fig.18 In some embodiments, the tongue piece 21 includes a first opening 211 that penetrates the tongue piece 21 and connects the two side surfaces of the tongue piece 21 , and a portion of the conductive adhesive layer 40 is disposed between the connector C1 and the first opening 211 .

[0175] When the conductive adhesive layer 40 is in a flat state, the conductive adhesive layer 40 includes at least one through hole 41 penetrating the conductive adhesive layer 40 . The through hole 41 is corresponding to the first opening 211 , and the size of the through hole 41 is smaller than that of the first opening 211 .

[0176] In these embodiments, a through hole 41 is provided at a position corresponding to the conductive adhesive layer 40 and the first opening 211, which is conducive to enabling the connection portion C0 to pass through the conductive adhesive layer 40 and be embedded in the first opening 211. At the same time, the size of the through hole 41 is set to be smaller than the size of the first opening 211, so that in the first direction X, a portion of the conductive adhesive layer 40 is not cut at the corresponding position of the first opening 211 and the conductive adhesive layer 40, which is conducive to enabling the connector C1 to pass through the through hole 41 of the conductive adhesive layer 40 and squeeze into the first opening 211 together with a portion of the conductive adhesive layer 40, thereby further achieving an interference fit between the connector C1 and the edge of the first opening 211.

[0177] Optionally, when the first opening 211 and the through hole 41 are both circular holes, along the first direction X, the center of the first opening 211 coincides with the center of the through hole 41 , and the diameter of the first opening 211 is smaller than the diameter of the through hole 41 .

[0178] See also Fig.19 In some embodiments, when the conductive adhesive layer 40 is in a flat state, the conductive adhesive layer 40 further includes a plurality of cutouts 42 , and the cutouts 42 are connected to the through holes 41 and extend in a direction away from the through holes 41 .

[0179] In these embodiments, the provision of the cutout 42 helps to prevent wrinkles when a portion of the conductive adhesive layer 40 is squeezed into the first opening 211 , thereby avoiding the risk of uneven squeezing force when the connector C1 is interference-fitted with the edge of the first opening 211 .

[0180] Fig. 20 Shows Figure 5 Another cross-sectional structure diagram along the BB direction, Fig.21 Shows Fig. 20 40 is a planar structural diagram of the conductive adhesive layer 40.

[0181] See also Fig. 20 and Fig.21 In some embodiments, the circuit board 30 includes two first connectors C11 and second connectors C12 extending from the first surface 31a to the second surface 31b, the tongue 21 also includes a first notch 22 and a second notch 23, and a portion of the conductive adhesive layer 40 is disposed between the first connector C11 and the first notch 22 and between the second connector C12 and the second notch 23.

[0182] When the conductive adhesive layer 40 is in a flat state, the conductive adhesive layer 40 includes a first notch 43 and a second notch 44. The first notch 43 is arranged corresponding to the first notch 22, and the second notch 44 is arranged corresponding to the second notch 23. The size of the first notch 43 is smaller than the size of the first notch 22, and the size of the second notch 44 is smaller than the size of the second notch 23.

[0183] In these embodiments, the first notch 43 and the second notch 44 are provided at positions of the conductive adhesive layer 40 corresponding to the first notch 22 and the second notch 23, which is conducive to achieving the connection portion C0 passing through the conductive adhesive layer 40 and being embedded in the first notch 22 and the second notch 23. At the same time, the sizes of the first notch 43 and the second notch 44 are set to be smaller than the sizes of the first notch 22 and the second notch 23, so that in the first direction X, part of the conductive adhesive layer 40 is not cut at the corresponding positions of the first notch 22 and the second notch 23 and the conductive adhesive layer 40, which is conducive to achieving that when the connector C1 passes through the first notch 43 and the second notch 44 of the conductive adhesive layer 40, it can carry part of the conductive adhesive layer 40 and squeeze into the first notch 22 and the second notch 23, further achieving the interference fit between the connector C1 and the edges of the first notch 22 and the second notch 23.

[0184] Optionally, when the first notch 22, the second notch 23, the first notch 43 and the second notch 44 are all circular notches, along the first direction X, the center of the first notch 22 and the second notch 23 coincide with the center of the first notch 43 and the second notch 44, and the diameter of the first notch 22 and the second notch 23 is smaller than the diameter of the first notch 43 and the second notch 44.

[0185] Fig. 22 Shows Figure 1 Cross-sectional structure along EE direction.

[0186] See also Fig. 22 In some embodiments, the back panel 20 also includes a main structure connected to the tongue piece 21. Along the first direction X, the main structure is stacked with the display panel 10, and along the first direction, compared with the bottom surface of the main structure, the tongue piece 21 is tilted toward the direction close to the display panel 10, and along the first direction X, it is raised a certain height toward the direction close to the display panel 10.

[0187] In these embodiments, the tongue piece 21 is lifted to make room on the side of the tongue piece 21 away from the circuit board 30, providing some reserved space for the setting of the connection part C0, making the overall structure of the display module 100 more compact and saving the layout space of the whole machine.

[0188] Optionally, the display panel 10 is a liquid crystal display panel LCD, and the display device further includes a backlight module, which is used to provide a backlight source for the liquid crystal display panel LCD. The backlight module includes a light board 11, a light guide plate 12, an optical film 13 and other structures. The light board 11 may include a plurality of light emitting diodes. Fig. 22 An edge-type backlight module is used as an illustration. In other embodiments, the backlight module can also be a direct-type, that is, a plurality of light-emitting elements in the backlight module are arranged in an array in a plane to provide backlight to the liquid crystal display panel. In the first direction X, the optical film is located between the light-emitting element and the liquid crystal display panel.

[0189] The light board 11 and the light guide plate 12 are arranged in the same layer, and the backlight emitted by the light board 11 enters the multi-layer optical film 13 through the light guide plate 12 along the plane direction of the display panel 10 .

[0190] The multi-layer optical film 13 is stacked on the light guide plate 12 in sequence, including a diffusion film, a brightness enhancement film and other films.

[0191] The liquid crystal display panel 10 is located above the optical film 13 , and the backlight enters the liquid crystal display panel after passing through the multi-layer optical film for display.

[0192] By lifting the tongue piece 21, the connection portion C0 of the tongue piece 21 away from one end of the circuit board 30 and the side of the circuit board 30 away from the tongue piece 21 can be made as flush as possible with the overall structure of the display panel 10 on both sides along the first direction X, thereby making the display module 100 more compact and further saving the layout space of the entire machine.

[0193] At the same time, the configuration of the display module 100 provided in this embodiment can be combined with any other embodiment of the present application without conflicting with the configuration of the display module 100 provided in other embodiments of the present application.

[0194] Fig.23 A schematic structural diagram of a display device 1000 provided in an embodiment of the second aspect of the present application is shown.

[0195] See also Fig.23 In a second aspect, an embodiment of the present application further provides a display device 1000, comprising a display module 100 provided by any one of the embodiments of the first aspect.

[0196] The display device 1000 provided in the embodiment of the present application includes the display module 100 provided in the above-mentioned first aspect embodiment. Therefore, the display device 1000 provided in the second aspect embodiment of the present application has the beneficial effects of the display module 100 provided in the first aspect embodiment, which will not be repeated here.

[0197] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display module, characterized in that: include: A display panel, comprising a display surface and a back surface facing each other; A back plate, disposed on the back side of the display panel, the back plate comprising a tongue piece, and the tongue piece is provided with a connecting portion; A circuit board, comprising a main board and a connecting member, wherein the main board has a first surface and a second surface opposite to each other along a first direction, and the connecting member is extended from the first surface to the second surface; Wherein, the connecting member is connected to the connecting portion by interference fit, so that the circuit board is fixed to the back plate.

2. The display module according to claim 1, characterized in that: The circuit board further includes a conductive circuit portion, and the conductive circuit portion is exposed through the first surface; The connecting member is connected to the connecting portion by interference fit, so that the circuit board abuts against the tongue piece of the back plate through the conductive circuit portion.

3. The display module according to claim 1, characterized in that: The tongue piece includes at least one first opening that penetrates the tongue piece and connects two side planes of the tongue piece, and the connecting portion also includes a first side periphery and a second side periphery in a cross section of the first opening along the first direction; Wherein, the connecting piece can be connected with the first side surround and the second side surround by interference fit.

4. The display module according to claim 3, characterized in that: The first opening is arranged at the center of the tongue piece.

5. The display module according to claim 4, characterized in that: The first opening is a circular hole, the connecting member is a rotating body, and the maximum diameter of the connecting member is greater than the maximum diameter of the first opening.

6. The display module according to claim 5, characterized in that: The cross section of the first opening in the first direction is a trapezoid, and the diameter of the first opening gradually decreases in a direction away from the circuit board.

7. The display module according to claim 5, characterized in that: The cross section of the connecting member along the first direction is trapezoidal, and the diameter of the connecting member gradually increases in a direction away from the first surface.

8. The display module according to claim 1, characterized in that: The connecting member includes a first connecting member and a second connecting member; The connecting portion further includes a first side edge and a second side edge in a cross section of the tongue piece along the first direction; The first connecting member is connected to the first side edge by interference fit, and the second connecting member is connected to the second side edge by interference fit, so that the tongue piece is clamped between the first connecting member and the second connecting member.

9. The display module according to claim 8, characterized in that: The circuit board further includes a conductive circuit portion, and the conductive circuit portion is exposed through the first surface; The first connecting member is distributed on one side of the conductive circuit portion, and the second connecting member is distributed on a side of the conductive circuit portion away from the first connecting member; The first connecting member is connected to the first side edge by interference fit, and the second connecting member is connected to the second side edge by interference fit, so that the circuit board abuts against the tongue of the back plate through the conductive circuit portion.

10. The display module according to claim 8, characterized in that: The tongue piece also includes a first notch and a second notch; The connecting portion further includes a first notch edge in a cross section of the first notch along the first direction and a second notch edge in a cross section of the second notch along the first direction, the first notch edge is connected to the first side edge, and the second notch edge is connected to the second side edge; Wherein, the first connecting member is connected to the edge of the first notch by interference fit, and the second connecting member is connected to the edge of the second notch by interference fit.

11. The display module according to claim 10, characterized in that: The first notch is flush with the second notch.

12. The display module according to claim 10, characterized in that: The cross-sectional shapes of the first connecting member and the second connecting member are circular or square, and the shapes of the first notch and the second notch are adapted to the cross-sectional shapes of the first connecting member and the second connecting member.

13. The display module according to claim 1, characterized in that: The tongue piece also includes a second opening that penetrates the tongue piece and connects the two side surfaces of the tongue piece; Wherein, the connecting member is connected to the connecting portion by interference fit, so that the size of the second opening is changed.

14. The display module according to claim 13, characterized in that: The tongue piece includes a first opening that penetrates the tongue piece and connects the two side surfaces of the tongue piece; Wherein, the connecting portion includes an edge of the first opening, the connecting member is connected to the edge of the first opening by interference fit, the second opening is arranged around the first opening, and / or, The second opening is connected to the first opening.

15. The display module according to claim 13, characterized in that: The circuit board includes a first connecting member and a second connecting member, and the tongue piece also includes a first notch and a second notch; Wherein, the connecting portion includes the edges of the first notch and the second notch, the first connecting member is connected to the edge of the first notch by interference fit, the second connecting member is connected to the edge of the second notch by interference fit, and the second opening is arranged between the first notch and the second notch.

16. The display module according to claim 1, characterized in that: The circuit board further comprises a soldering pad, the connecting member comprises a metal element, and the connecting member is connected to the soldering pad by welding; Wherein, the circuit board is also abutted against the tongue of the back plate through the connecting member.

17. The display module according to claim 1, characterized in that: The connecting piece is a rivet, and the connecting piece is fixed to the main board by riveting.

18. The display module according to claim 1, characterized in that: The length dimension of the connecting member extending from the first surface to the second surface is greater than the thickness dimension of the circuit board.

19. The display module according to claim 2 or 9, characterized in that: The display module further comprises a conductive adhesive layer, wherein the conductive adhesive layer is disposed between the conductive circuit portion and the tongue piece, and a portion of the conductive adhesive layer is disposed between the connecting member and the connecting portion; Wherein, the conductive circuit portion of the circuit board is in contact with the tongue piece of the back plate through the conductive adhesive layer.

20. The display module according to claim 19, characterized in that: The tongue piece includes a first opening that penetrates the tongue piece and connects the two side surfaces of the tongue piece, and part of the conductive adhesive layer is arranged between the connecting piece and the first opening; When the conductive adhesive layer is in a flat state, the conductive adhesive layer includes at least one through hole penetrating the conductive adhesive layer, the through hole is arranged corresponding to the first opening, and the size of the through hole is smaller than the size of the first opening.

21. The display module according to claim 20, characterized in that: When the conductive adhesive layer is in a flat state, the conductive adhesive layer further includes a plurality of cutting openings, and the cutting openings are connected to the through holes and extend in a direction away from the through holes.

22. The display module according to claim 19, characterized in that: The circuit board includes two first connectors and a second connector extending from the first surface to the second surface, the tongue also includes a first notch and a second notch, and part of the conductive adhesive layer is disposed between the first connector and the first notch and between the second connector and the second notch; When the conductive adhesive layer is in a flat state, the conductive adhesive layer includes a first notch and a second notch, the first notch is arranged corresponding to the first notch, the second notch is arranged corresponding to the second notch, and the size of the first notch is smaller than the size of the first notch, and the size of the second notch is smaller than the size of the second notch.

23. The display module according to claim 1, characterized in that: The back panel also includes a main structure connected to the tongue piece. Along the first direction, the main structure and the display panel are stacked, and along the first direction, compared to the bottom surface of the main structure, the tongue piece is tilted toward the direction close to the display panel.

24. A display device, characterized in that: Comprising a display module as described in any one of claims 1 to 23.

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