Wafer electrical property detection equipment

Abstract

The invention relates to the technical field of wafer detection, in particular to wafer electrical performance detection equipment, which can realize automatic detection of wafers, save manual operation and improve detection efficiency and accuracy, and is characterized in that a detection platform is arranged in an equipment housing, and a moving table connected with an X-axis driving mechanism and a Y-axis driving mechanism is arranged on the detection platform; a lifting table and a lower visual camera which are connected with a Z-axis lifting mechanism are mounted on the mobile table, a wafer adsorption platform is mounted on the lifting table, a probe chuck is mounted on a top cover plate of the equipment housing, a probe circuit board is arranged on the probe chuck, an upper visual camera is arranged above the wafer adsorption platform, and the upper visual camera is connected with a transverse movement driving mechanism; the detection process comprises the steps that a wafer is placed on the wafer adsorption platform, the lower visual camera shoots a probe on the probe circuit board, the upper visual camera shoots a mark point on the wafer to determine the moving path of the wafer adsorption platform, the wafer adsorption platform drives the wafer to move to the position below the probe circuit board, and the wafer is lifted for testing.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a wafer electrical performance detection device. Background Art

[0002] With the increasing application of integrated circuits, the demand for wafers, as the basic material for manufacturing semiconductor devices, has increased rapidly in the market, simultaneously promoting the development of the wafer manufacturing industry.

[0003] During the wafer manufacturing and packaging process, the electrical performance parameters of the wafer need to be tested to ensure the quality of the wafer. In the traditional testing method, after manual loading, the inspectors manually calibrate, select points, and test, and finally manually recycle the wafers into the wafer basket for the next process.

[0004] The above-mentioned method has a long detection cycle and high labor intensity. Manual detection cannot ensure the accuracy of the detection results, which ultimately affects the product qualification rate. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a wafer electrical performance detection device, which can realize automatic detection of wafers, save manual operation, and improve detection efficiency and accuracy.

[0006] The technical solution is as follows: a wafer electrical performance detection device, characterized in that it includes an equipment cover, a detection platform is arranged in the equipment cover, a moving platform connected to the X-axis and Y-axis driving mechanisms is arranged on the detection platform, a lifting platform connected to the Z-axis lifting mechanism and a lower visual camera are installed on the moving platform, a wafer adsorption platform is installed on the lifting platform, a probe chuck is installed on the top cover plate of the equipment cover, a probe circuit board is arranged on the probe chuck, an upper visual camera is arranged above the wafer adsorption platform, and the upper visual camera is connected to the lateral driving mechanism; the wafer detection process is as follows: the wafer is placed on the wafer adsorption platform, the lower visual camera shoots the probe on the probe circuit board and combines the upper visual camera to shoot the mark point on the wafer to determine the moving path of the wafer adsorption platform, the wafer adsorption platform moves with the wafer to the bottom of the probe circuit board, and then rises to make the chip pins on the wafer contact with the probes for testing.

[0007] It is further characterized in that at least three ejector pin holes are provided on the wafer adsorption platform, and retractable ejector pins are provided in the ejector pin holes; The wafer adsorption platform is rotatably connected to the lifting platform and connected to a θ-axis rotation drive mechanism, the θ-axis rotation drive mechanism includes a θ-axis rotation motor, the motor shaft of the θ-axis rotation motor is connected to a horizontal screw rod, a θ-axis rotation drive slide is installed on the horizontal screw rod, a first pin is installed on the θ-axis rotation drive slide, one end of a transmission plate is rotatably connected to the first pin, and a second pin is installed on the other end, a rotation drive plate is rotatably mounted on the second pin, and the rotation drive plate is connected to the outer peripheral surface of the wafer adsorption platform; The top cover is a flip cover structure, a mounting hole is provided in the middle of the top cover, and the probe chuck is mounted at the mounting hole through a chuck fixing member; A grinding table is also installed on the movable table, and the grinding table is connected to the grinding table lifting cylinder. A sway-stop groove is provided at the bottom of the grinding table, and a sway-stop plate is provided below the grinding table. The sway-stop plate is provided with a convex strip that matches the sway-stop groove, and the sway-stop plate is connected to the translation cylinder; The X-axis and Y-axis driving mechanisms include a Y-axis guide rail fixed to the detection platform, a lower moving seat slidably connected to the Y-axis guide rail, and an X-axis guide rail fixed to the lower moving seat, the moving platform is slidably connected to the X-axis guide rail, and the lower moving seat and the moving platform are respectively connected to corresponding screw driving mechanisms; The Z-axis lifting mechanism includes a Z-axis screw drive mechanism and a Z-axis guide rail arranged between the lifting platform and the moving platform; The transverse movement driving mechanism is a screw driving mechanism, the upper visual camera is installed on the camera bracket and connected to the screw driving mechanism, and a dotting device is also installed on the camera bracket.

[0008] After adopting the present invention, the wafer is placed on the wafer adsorption platform, and the position is first determined by the upper visual camera and the lower visual camera, and then the X-axis and Y-axis driving mechanisms and the Z-axis lifting mechanism move the wafer to the probe circuit board for detection, without the need for human intervention, thereby realizing automatic detection of the wafer and improving detection efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the external structure of the present invention; Figure 2 It is a schematic diagram of the structure of the detection platform inside the housing of the present invention; Figure 3 It is a schematic diagram of the structure of a mobile station; Figure 4 Schematic diagram of the top cover structure; Figure 5 Schematic diagram of the visual camera structure; Figure 6 is a schematic diagram of the θ-axis rotation drive mechanism; Figure 7This is a first-person perspective diagram of the needle grinding station; Figure 8 This is a schematic diagram of the second perspective of the needle grinding table. DETAILED DESCRIPTION

[0010] See Figures 1 to 8 As shown, a wafer electrical performance detection device includes an equipment cover 1, the lower half of the equipment cover 1 is a casting frame 4, and a base 6 is installed at the bottom. The casting can reduce the internal stress of the casting after aging treatment, improve its plasticity and toughness, and maintain or improve its hardness and strength, and has good stability; a column 5 is installed on the casting frame 4, and a cover mechanism is installed on the column 5. The cover mechanism includes a cover fixing 14 and a top cover 15. The top cover 15 is a flip-up structure, and a mounting hole is opened in the middle of the top cover 15. A probe chuck 17 is installed at the mounting hole through a chuck fixing 16. A probe circuit board is arranged on the probe chuck 17. The top cover 15 can be flipped up to open, and the probe chuck 17 can also be replaced according to different wafers.

[0011] A detection platform 2 is arranged in the equipment cover 1, and a moving platform 3 connected to an X-axis and a Y-axis driving mechanism is arranged on the detection platform. The X-axis and the Y-axis driving mechanism include a Y-axis guide rail 9 fixed to the detection platform 2, a lower moving seat 22 slidably connected to the Y-axis guide rail 9, and an X-axis guide rail 8 fixed to the lower moving seat 22. The moving platform 3 is slidably connected to the X-axis guide rail 8, and the lower moving seat 22 and the moving platform 3 are respectively connected to corresponding screw driving mechanisms, so that displacement adjustment in the X-axis and Y-axis directions can be realized.

[0012] A lifting platform connected to a Z-axis lifting mechanism and a lower visual camera 12 are installed on the movable platform 3. The Z-axis lifting mechanism includes a Z-axis screw drive mechanism 23 and a Z-axis guide rail 7 arranged between the lifting platform and the movable platform 3; a wafer adsorption platform 11 is installed on the lifting platform, and an upper visual camera 20 installed on a camera bracket 21 is arranged above the wafer adsorption platform 11. The camera bracket 21 is connected to a transverse driving mechanism 19. The transverse driving mechanism 19 adopts a screw drive mechanism and is installed on an upper visual fixing frame 18, which can realize the translation of the upper camera. The upper visual fixing frame 18 is installed on the casting frame 4, and a dotting device is also installed on the camera bracket 21.

[0013] In order to achieve fine adjustment of the wafer angle in the planar direction, the wafer adsorption platform 11 is rotatably connected to the lifting platform and connected to the θ-axis rotation drive mechanism 10, so that the wafer adsorption platform 11 can be rotated to an appropriate angle to align the wafer. The specific structure is as follows: the θ-axis rotation drive mechanism 10 includes a θ-axis rotation motor 101, the motor shaft of the θ-axis rotation motor 101 is connected to a horizontal screw rod 102, a θ-axis rotation drive slide 103 is installed on the horizontal screw rod 102, a first pin shaft 104 is installed on the θ-axis rotation drive slide 103, one end of a transmission plate 105 is rotatably connected to the first pin shaft 104, and the other end is installed with a second pin shaft 106, a rotation drive plate 107 is rotatably arranged on the second pin shaft 106, and the rotation drive plate 107 is connected to the outer peripheral surface of the wafer adsorption platform 11, generally using screws. When the θ-axis rotation motor 101 drives the horizontal screw rod 102 to rotate, the θ-axis rotation drive slide 103 translates. Since one end of the transmission plate 105 is hinged, it can swing, and the rotation drive plate 107 can also swing, so that the wafer adsorption platform 11 is finally rotated to achieve fine adjustment of the wafer angle.

[0014] Generally, wafers are placed on the wafer adsorption platform 11 by bottom adsorption. Therefore, at least three ejector pin holes 24 are opened on the wafer adsorption platform 11. Retractable ejector pins are arranged in the ejector pin holes 24. When the wafer is sent over, the ejector pins rise and exceed the thickness of the robot that adsorbs the wafer, so that the wafer can be smoothly supported on the ejector pins. After the robot is moved away, the ejector pins fall, and the wafer can fall steadily on the wafer adsorption platform 11 for adsorption.

[0015] A needle grinding table 13 is also installed on the movable table 3, which can clean the probe on the probe circuit board. The needle grinding table 13 is connected to the needle grinding table lifting cylinder 18, and a sway stop groove 19 is provided at the bottom of the needle grinding table 13. A sway stop plate 20 is provided below the needle grinding table 13, and a convex strip 21 cooperating with the sway stop groove 19 is provided on the sway stop plate 20. The sway stop plate 20 is connected to the translation cylinder 22. When the probe needs to be cleaned, the existing needle grinding table lifting cylinder 18 drives the needle grinding table 13 to rise, and the translation cylinder 22 drives the sway stop plate 20 to move, so that the convex strip 21 is aligned with the sway stop groove 19, and then the sway stop plate 20 is lowered, and the convex strip 21 is inserted into the sway stop groove 19 so that it will not sway, thereby ensuring the flatness and parallelism of the needle grinding table 13 during cleaning, which is stable and reliable.

[0016] After the wafer is adsorbed on the wafer adsorption platform 11, the inspection can begin. The wafer inspection process is as follows: the upper visual camera 20 moves to the top of the wafer, captures the position information of the wafer mark point, and generates a wafer MAP. At the same time, the lower visual camera 12 moves to the bottom of the probe chuck 17 and the dotting device, captures the position of the probe and the dotting device, and compares the position coordinates of the wafer to generate a complete position coordinate system. The X and Y axis drive mechanisms move the wafer adsorption platform 11 to the inspection position with the wafer according to the generated wafer MAP. The Z axis lifting mechanism drives the wafer adsorption platform 11 to rise, so that the chip pins (PAD) on the wafer contact the probe. The test machine connected to the probe chuck 17 measures the electrical properties and other parameters of each chip. The industrial computer generates the inspection result map of all chips on the wafer based on the inspection results. Then, the wafer adsorption platform 11 moves to the bottom of the dotting device, and the dotting device marks the defective chips on the wafer.

[0017] After the detection is completed, the wafer is removed from the wafer adsorption platform 11. The above process is repeated, and the wafer is automatically detected, and it is applicable to wafers of different specifications, and has high versatility. At the same time, the detection process is fast, the detection efficiency is high, and the surface quality of the wafer is effectively guaranteed.

Claims

1. A wafer electrical performance testing device, characterized in that: It includes an equipment cover, a detection platform is arranged in the equipment cover, a moving platform connected to an X-axis and a Y-axis driving mechanism is arranged on the detection platform, a lifting platform connected to a Z-axis lifting mechanism and a lower visual camera are installed on the moving platform, a wafer adsorption platform is installed on the lifting platform, a probe chuck is installed on the top cover plate of the equipment cover, a probe circuit board is arranged on the probe chuck, an upper visual camera is arranged above the wafer adsorption platform, and the upper visual camera is connected to a lateral movement driving mechanism; The wafer inspection process is as follows: the wafer is placed on the wafer adsorption platform, the lower visual camera photographs the probes on the probe circuit board and the upper visual camera photographs the mark points on the wafer to determine the moving path of the wafer adsorption platform, the wafer adsorption platform moves with the wafer to the bottom of the probe circuit board, and then rises to make the chip pins on the wafer contact with the probes for testing.

2. The wafer electrical performance testing device according to claim 1, characterized in that: At least three ejector pin holes are provided on the wafer adsorption platform, and retractable ejector pins are arranged in the ejector pin holes.

3. The wafer electrical performance testing device according to claim 1, characterized in that: The wafer adsorption platform is rotatably connected to the lifting platform and is connected to a θ-axis rotation drive mechanism; the θ-axis rotation drive mechanism includes a θ-axis rotation motor, the motor shaft of the θ-axis rotation motor is connected to a horizontal screw rod, a θ-axis rotation drive slide is installed on the horizontal screw rod, a first pin is installed on the θ-axis rotation drive slide, one end of a transmission plate is rotatably connected to the first pin, and the other end is installed with a second pin, a rotation drive plate is rotatably provided on the second pin, and the rotation drive plate is connected to the outer peripheral surface of the wafer adsorption platform.

4. The wafer electrical performance testing device according to claim 1, characterized in that: The top cover plate is a flip cover structure, a mounting hole is provided in the middle of the top cover plate, and the probe chuck is mounted at the mounting hole through a chuck fixing piece.

5. The wafer electrical performance testing device according to claim 1, characterized in that: A needle grinding table is also installed on the movable table, and the needle grinding table is connected to the needle grinding table lifting cylinder. A sway-stop groove is provided at the bottom of the needle grinding table, and an anti-sway plate is provided under the needle grinding table. The anti-sway plate is provided with a convex strip that cooperates with the anti-sway groove, and the anti-sway plate is connected to the translation cylinder.

6. The wafer electrical performance testing device according to claim 1, characterized in that: The X-axis and Y-axis driving mechanisms include a Y-axis guide rail fixed to the detection platform, a lower moving seat slidably connected to the Y-axis guide rail, and an X-axis guide rail fixed to the lower moving seat. The moving platform is slidably connected to the X-axis guide rail, and the lower moving seat and the moving platform are respectively connected to corresponding screw driving mechanisms.

7. The wafer electrical performance testing device according to claim 1, characterized in that: The Z-axis lifting mechanism comprises a Z-axis screw drive mechanism and a Z-axis guide rail arranged between the lifting platform and the moving platform.

8. The wafer electrical performance testing device according to claim 1, characterized in that: The transverse movement driving mechanism is a screw driving mechanism, the upper visual camera is installed on the camera bracket and connected to the screw driving mechanism, and a dotting device is also installed on the camera bracket.

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