Substrate carrier posture changing device, posture changing method and conveying system

Abstract

The present invention discloses a substrate carrier posture changing device, posture changing method and transmission system, including: a clamping assembly, including two clamping members arranged opposite to each other, between which a clamping space for clamping a plate to be clamped is formed, and each of the clamping members has at least one supporting surface and one slope surface; a driving assembly, arranged between the two clamping members, and the driving assembly can drive the two clamping members to approach or move away from each other in a horizontal direction, so that the clamping space gradually shrinks or gradually expands; a matching member, arranged in the clamping space, including two matching blocks arranged opposite to each other in a left-right direction, and the matching blocks have an inclined surface, and the inclined surface is arranged parallel to the supporting surface. The above scheme can effectively prevent the wafer from sliding out due to inertia during the transmission of the substrate carrier, and at the same time enable the substrate carrier to perform clamping and transmission operations at a higher speed, which not only improves the work efficiency, but also ensures the stability of wafer transmission.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer placement equipment, and in particular to a substrate carrier posture changing device, a posture changing method and a conveying system. Background Art

[0002] In the semiconductor manufacturing process, wafer transportation is crucial to integrated circuit manufacturing. In order to ensure the quality of wafers when transported between different processes and avoid dust or other contamination of wafers, more and more transportation work uses standard transport containers, that is, standard mechanical interface (SMIF) technology is used. This system reduces the contamination of wafers by dust particles by significantly reducing the dust particles flowing through the wafers. This effect is achieved by mechanically ensuring that the gas around the wafers remains stationary relative to the wafers during wafer transportation, storage and most processes, and that dust particles in the external environment do not enter the wafer environment. SMIF technology is centered on the concept of "isolation technology", which aims to prevent product contamination by enclosing the wafer in an ultra-clean environment and relaxing the cleanliness requirements outside this enclosed environment.

[0003] SMIF consists of three parts: a container used to enclose and store and transport boxed semiconductor wafers during the manufacturing process, a SMIF wafer box, an input and output device used to open the SMIF wafer box, a SMIF load port, and a clean room that integrates the load port through a process system. The working method of SMIF is usually as follows: an operator or an automated material handling system sends a SMIF wafer box to the SMIF load port. When the automatic batch tracking system identifies that the correct product batch is being loaded and unloaded into the correct equipment, the SMIF load port automatically opens the SMIF wafer box, takes out the wafer and places it in the equipment in the clean room for the corresponding process. When the process step is completed, the wafer is put back into the SMIF wafer box, and then the operator carries it or the automated material handling system (automated material handling system) transports it to the next process.

[0004] The existing wafer box clamping assembly clamps the wafer box horizontally during the process of clamping the wafer box. During the process of transferring it to each workstation, if the robot arm moves too fast, the wafer will slip out of the wafer box due to inertia, causing damage to the wafer box. If the robot arm movement speed is reduced to ensure that the wafer box runs smoothly without falling wafers, the overall work efficiency will be affected. Summary of the invention

[0005] The purpose of the present invention is to provide a substrate carrier posture changing device, a posture changing method and a conveying system, so as to prevent the wafer from slipping out during the process of rapid wafer box transmission by a robotic arm and improve the working efficiency of wafer transmission.

[0006] To achieve the above object, the technical solution of the present invention is as follows:

[0007] In a first aspect, the present invention provides a substrate carrier posture changing device, wherein the substrate carrier has an opening on one side along the front-back direction and is closed on the other side, and the substrate carrier has a to-be-clamped plate on both sides along the left-right direction, comprising:

[0008] The clamping assembly comprises two clamping members arranged opposite to each other, forming a clamping space for clamping the plate to be clamped, and each of the clamping members has at least one supporting surface and one slope surface;

[0009] A driving assembly is arranged between the two clamping members, and the driving assembly can drive the two clamping members to move closer to each other or farther away from each other in a horizontal direction, so that the clamping space is gradually reduced or expanded;

[0010] A matching piece is arranged in the clamping space, comprising two matching blocks arranged opposite to each other in the left-right direction, wherein the matching blocks have an inclined surface, and the inclined surface is arranged parallel to the supporting surface;

[0011] Among them, the substrate carrier has a first posture of horizontal placement and a second posture of inclined placement. When the substrate carrier is in the second posture, the angle between the extension line of the opening direction of the substrate carrier and the horizontal plane is an acute angle; in the process of the substrate carrier changing from the first posture to the second posture, the clamping space gradually shrinks, so that the side of the substrate carrier to be clamped close to the opening gradually rises along the slope to the support surface, so that the substrate carrier changes to the second posture.

[0012] The beneficial effect of the substrate carrier posture changing device provided by the present invention is that: through the above scheme, when the clamping members in the clamping assembly are close to each other, the posture change of the plate to be clamped can be controlled, thereby converting the substrate carrier originally placed horizontally into an inclined state. At this time, one side of the substrate carrier contacts the plate to be clamped through an inclined surface, which can effectively slow down the displacement of the wafer in the box and prevent the wafer from sliding out due to inertia. Specifically, under the clamping action of the two clamping members, the contact mode between the plate to be clamped and the mating member changes from "line contact" to a completely fitted "surface contact". This transformation causes the plate to be clamped to gradually tilt, changing the placement angle of the substrate carrier. Through this device, the problem of the wafer sliding out due to inertia can be effectively avoided during the transmission of the wafer box, while allowing the robot arm to perform clamping and transmission operations at a higher speed, which not only improves the work efficiency, but also ensures the stability of wafer transmission.

[0013] Furthermore, when the clamping space gradually shrinks, the line contact between the plate to be clamped and the inclined surface gradually changes to surface contact.

[0014] Furthermore, the angle between the inclined plane and the horizontal plane is a first angle, and the first angle is 5°~10°.

[0015] Furthermore, each of the clamping members has a vertical portion and a bent portion, the bent portion is bent relative to the vertical portion, the bending point between the bent portion and the vertical portion is a supporting edge, the supporting surface is formed by extending the supporting edge in a horizontal direction, the angle between the bent portion and the supporting surface is a second angle, and the second angle is greater than the first angle.

[0016] Furthermore, the second angle is 15° to 25°, and the slope is formed by bending the support surface counterclockwise by 15° to 25°.

[0017] Furthermore, the two matching blocks each include a fixed seat and a cushion block, the fixed seat is fixedly connected to the cushion block, the fixed seat is connected to the driving assembly, and the inclined surface is arranged on a side of the cushion block away from the fixed seat.

[0018] Further, the driving assembly includes a connecting seat, a push-pull member, a sliding seat, a slider and a slide rail, the vertical portion is installed on the connecting seat, one end of the sliding seat is connected to the connecting seat, the other end of the sliding seat is connected to the push-pull member, the slider is fixedly connected to the sliding seat, the slide rail extends in a horizontal direction, the slider is slidably connected to the slide rail, and the push-pull member is used to drive the sliding seat to move along the extension direction of the slide rail.

[0019] Furthermore, the push-pull member includes a drive shaft, a drive rod, a first push-pull rod and a second push-pull rod, the drive shaft can rotate around an axis, the drive shaft is connected to the middle part of the drive rod, the middle part of the drive rod has a rotation center, the first push-pull rod and the second push-pull rod are respectively hinged at both ends of the drive rod, and the first push-pull rod and the second push-pull rod are respectively hinged to the sliding seats on both sides.

[0020] Furthermore, the driving assembly further comprises an elastic member, wherein the elastic member is arranged between the two clamping members, and two ends of the elastic member are respectively connected to the connecting seats on both sides.

[0021] Furthermore, a detection member is included, and the detection member is used to detect the moving distance of the clamping member.

[0022] Furthermore, the detection member includes a light shielding sheet, a first sensor and a second sensor, one end of the light shielding sheet is arranged on the sliding seat, and the other end of the light shielding sheet is arranged between the first sensor and the second sensor.

[0023] In a second aspect, the present invention further provides a conveying system, comprising the above-mentioned substrate carrier posture changing device, and further comprising:

[0024] A conveying body having a carrying surface, on which a containing box for containing a substrate carrier is placed;

[0025] A frame, mounted on both sides of the transmission body;

[0026] A top cover is arranged at the end of the frame away from the main body, the interior of the top cover has a storage space, the bottom of the top cover has an opening, a robot arm is arranged in the storage space, the substrate carrier posture changing device is connected to the robot arm, and a conveying port for the substrate carrier to pass through is provided between the top cover, the frame and the main body.

[0027] The beneficial effect of the conveying system provided by the present invention is that the conveying system integrates the substrate carrier posture changing device with the robot arm, so that the system can flexibly control the posture of the substrate carrier during the transmission of the wafer. When the substrate carrier passes through the conveying system, it can effectively prevent the wafer from falling or shifting due to inertial sliding. By cooperating with the robot arm, the entire system can perform operations such as clamping, transmission, and placement at a higher speed, thereby improving work efficiency and the stability of wafer transmission.

[0028] Furthermore, it also includes a lifting component, which is arranged in the accommodating space, the robotic arm is fixedly connected to the lifting component, the lifting component is used to drive the robotic arm to move along the height direction of the top cover, the robotic arm has at least one driving end, and the driving end is connected to the substrate carrier posture changing device.

[0029] In a third aspect, the present invention further provides a method for changing the posture of a substrate carrier, using the above-mentioned substrate carrier posture changing device, the method comprising:

[0030] Placing the substrate carrier horizontally between the two clamping members and maintaining the first posture;

[0031] The driving assembly is started to drive the two clamping members to approach each other, until the clamping plate line contacts the inclined surface and forms a first contact position, and the two clamping members have a bending portion;

[0032] As the clamping members approach each other, the bottom surface of the plate to be clamped contacts the bent portion to form a second contact position, which is arranged obliquely opposite to the first contact position. As the clamping members continue to approach each other, the second contact position gradually rises along the extending direction of the bent portion, so that the open end of the plate to be clamped rises and the closed end falls, forming a height difference.

[0033] Until the top surface of the plate to be clamped forms surface contact with the inclined surface and is completely fitted, the plate to be clamped abuts against the bent portion of the bent portion, so that the substrate carrier changes to the second posture.

[0034] The beneficial effect of the substrate carrier posture changing method provided by the present invention is that by transmitting the substrate carrier at an elevation angle, the original robot arm movement speed can be increased by 20% to 30%, and during this process, the wafer will not slip out, further improving the work efficiency of wafer transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of a substrate carrier posture device according to an embodiment of the present invention;

[0036] Figure 2 It is a schematic diagram of the structure of the driving component in an embodiment of the present invention;

[0037] Figure 3 is a schematic diagram of a substrate carrier according to an embodiment of the present invention;

[0038] Figure 4 is a schematic diagram of a clamping assembly and a matching piece in an embodiment of the present invention;

[0039] Figure 5 is a schematic diagram of a second posture of a plate to be clamped in an embodiment of the present invention;

[0040] Figure 6 is a schematic diagram of a first angle in an embodiment of the present invention;

[0041] Figure 7 is a schematic structural diagram of a vertical portion in an embodiment of the present invention;

[0042] Figure 8 This is a schematic diagram of the structure of the slope in an embodiment of the present invention;

[0043] Fig. 9 It is a structural side view of a matching piece in an embodiment of the present invention;

[0044] Fig.10 It is a schematic diagram of a state in which the plates to be clamped are in initial contact in an embodiment of the present invention;

[0045] Fig.11 for Fig.10 A schematic top view of the plate to be clamped;

[0046] Fig.12 It is a front view of the plate to be clamped in the initial contact state in the embodiment of the present invention;

[0047] Fig.13 This is a schematic diagram of a plate to be clamped in a fully clamped state in an embodiment of the present invention;

[0048] Fig.14 for Fig.13 The front view of the plate to be clamped;

[0049] Fig.15 Schematic diagram of the overall structure of the transmission system in an embodiment of the present invention.

[0050] Figure numerals: 1, clamping assembly; 11, first clamping member; 111, vertical portion; 1111, abutment surface; 112, bending portion; 1121, slope surface; 1122, support surface; 113, second angle; 12, second clamping member; 2, driving assembly; 21, connecting seat; 22, push-pull member; 221, driving shaft; 222, driving rod; 223, first push-pull rod; 224, second push-pull rod; 23, sliding seat; 24, slider; 25, slide rail; 26, elastic member; 27, inspection Test piece; 271, light shield; 272, first sensor; 273, second sensor; 3, matching piece; 31, fixing seat; 32, cushion block; 33, inclined surface; 34, first angle; 4, conveying body; 41, containing box; 5, frame; 51, top cover; 52, robot arm; 53, conveying port; 6, first posture; 61, first contact position; 7, second posture; 71, second contact position; 8, substrate carrier; 81, inlet and outlet; 82, plate to be clamped; 83, wafer. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0052] The present invention is applicable to the semiconductor wafer placement equipment industry. For example, the substrate carrier posture changing device in the embodiment of the present invention is used to transfer a wafer box, which is widely used in the integrated circuit manufacturing industry.

[0053] The following is combined with Figure 1 - Attachment Fig.15 , the specific implementation modes of the present invention are further described in detail.

[0054] The substrate carrier posture changing device in the present invention is used to change the posture of the substrate carrier 8 during transportation. In the present invention, the substrate carrier 8 is mainly used to place wafers 83. The substrate carrier 8 has an inlet and outlet 81 on one side, and the substrate carrier 8 is provided with a clamping plate 82 on the top of the left and right sides of the inlet and outlet 81. Wafer clips 83 are evenly spaced inside the substrate carrier 8, and the wafer clips 83 are used to place wafers 83.

[0055] In an embodiment of the present invention, the substrate carrier posture changing device includes a clamping assembly 1, a driving assembly 2 and a matching member 3. The clamping assembly 1 includes two clamping members arranged opposite to each other, namely, a first clamping member 11 and a second clamping member 12, and a clamping space for clamping the plate to be clamped 82 is provided between the first clamping member 11 and the second clamping member 12. The driving assembly 2 is arranged between the first clamping member 11 and the second clamping member 12, and the driving assembly 2 can drive the first clamping member 11 and the second clamping member 12 to move closer to each other or away from each other in the horizontal direction. The matching member 3 is arranged in the clamping space, including two matching blocks arranged opposite to each other, namely, a first matching block and a second matching block, and the bottoms of the first matching block and the second matching block both have an inclined surface 33, and the inclined surface 33 contacts the plate to be clamped 82 when the substrate carrier 8 is transmitted. Among them, the plate to be clamped 82 has a first posture 6 of horizontal placement and a second posture 7 of inclined placement. When the plate to be clamped 82 is in the second posture 7, the angle between the extension line in the direction of the inlet and outlet 81 of the substrate carrier 8 and the horizontal plane is an acute angle. When the first clamping member 11 and the second clamping member 12 approach each other, one side of the plate to be clamped 82 changes from line contact to surface contact with the inclined surface 33, and the plate to be clamped 82 changes from the first posture 6 to the second posture 7.

[0056] In some embodiments of the present invention, the first matching block and the second matching block each include a fixing seat 31 and a cushion block 32, and the fixing seat 31 is fixedly connected to the cushion block 32. Specifically, the fixing seat 31 and the cushion block 32 are integrally formed. A threaded hole is provided on the left side of the top of the fixing seat 31 in the vertical direction, and the cushion block 32 is arranged to avoid the threaded hole. The fixing seat 31 is threadedly connected to the driving assembly 2 through bolts and threaded holes. The inclined surface 33 is arranged on the side of the cushion block 32 away from the fixing seat 31. The angle between the inclined surface 33 and the horizontal plane is a first angle 34. In some embodiments of the present invention, the first angle 34 is 5°~10°. Preferably, the first angle 34 is 7°.

[0057] In some embodiments of the present invention, the first clamping member 11 and the second clamping member 12 each include a vertical portion 111 and a bent portion 112. Specifically, the vertical portion 111 and the bent portion 112 are both plate-shaped, the vertical portion 111 is mounted on both sides of the driving assembly 2, the bent portion 112 is bent relative to the vertical portion 111, and the angle between the bent portion 112 and the support surface is a second angle 113, and the second angle 113 is greater than the first angle 34. Specifically, the bending point of the vertical portion 111 and the bent portion 112 is defined as a support edge, and a side surface of the bent portion 112 close to the vertical portion 111 is defined as a slope surface 1121. The support edge extends in the horizontal direction to form a support surface 1122, wherein the support surface 1122 is parallel to the inclined surface 33. The inner side of the vertical portion 111 is abutting surface 1111. When the first clamping member 11 and the second clamping member 12 completely clamp the substrate carrier 8, the abutting surface 1111 abuts against the inner side of the matching member 3. In other embodiments of the present invention, the second angle 113 is 15° to 25°. Preferably, the second angle 113 is 20°.

[0058] Specifically, the present invention realizes the transformation of the substrate carrier 8 from the first horizontal posture 6 to the second posture 7 in which the inlet and outlet 81 are tilted upward, which requires a gradual process. In order to gradually change the angle of the substrate carrier 8, the present invention allows the first clamping member 11 and the second clamping member 12 to approach each other. When the two clamping members move toward each other, they drive the plate 82 to be clamped to gradually tilt along the slope 1121 of the bending portion 112 until the upper surface of the plate 82 to be clamped contacts the inclined surface 33. When the plate 82 to be clamped is in the second posture 7, the upper surface of the plate 82 to be clamped fits the inclined surface 33, thereby making the inlet and outlet 81 of the substrate carrier 8 consistent with the direction of the inclined surface 33, and the angle between the extension line of the direction of the inlet and outlet 81 of the substrate carrier 8 and the horizontal plane is 7°, that is, the inlet and outlet 81 of the substrate carrier 8 is tilted upward by 7°.

[0059] Under the clamping action of the plate to be clamped 82 and the first clamping member 11 and the second clamping member 12, the contact mode between the plate to be clamped 82 and the mating member 3 changes from "line contact" to "surface contact" of complete fit. This change causes the plate to be clamped 82 to gradually tilt, changing the placement angle of the substrate carrier 8. The device can be used to tilt the wafer box synchronously during the wafer box transmission process, specifically during the process of clamping the wafer box, thereby effectively avoiding the problem of the wafer sliding out due to inertia, and allowing the robot arm 52 to perform clamping and transmission operations at a higher speed, which not only improves the work efficiency, but also ensures the stability of wafer transmission.

[0060] In the embodiment of the present invention, the slope 1121 formed by the bending portion 112 has two technical effects: on the one hand, it can make the edge line of the support surface 1122 cooperate with the inclined surface 33, thereby clamping the plate to be clamped 82; on the other hand, the slope 1121 cooperates with the movement of the first clamping member 11 and the second clamping member 12 to form a process in which the angle between the plate to be clamped 82 and the horizontal plane gradually changes; so that the plate to be clamped 82 of the substrate carrier 8 gradually changes from a horizontal state to an inclined state. In the process of the plate to be clamped 82 gradually tilting from the horizontal, the matching member 3 and the clamping assembly 1 impose an angle change on the plate to be clamped 82, and also limit the plate to be clamped 82, so that it can operate stably during the angle change process.

[0061] In other embodiments of the present invention, the driving assembly 2 includes a connecting seat 21, a push-pull member 22, a sliding seat 23, a slider 24 and a slide rail 25, the vertical portion 111 is mounted on the connecting seat 21, one end of the slide seat 23 is connected to the connecting seat 21, the other end of the slide seat 23 is connected to the push-pull member 22, the slider 24 is fixedly connected to the slide seat 23, the slide rail 25 extends in the horizontal direction, the slider 24 is slidably connected to the slide rail 25, and the push-pull member 22 is used to drive the slide seat 23 to move along the extension direction of the slide rail 25. Specifically, the driving assembly 2 also includes a mounting shell, the connecting seat 21, the push-pull member 22, the sliding seat 23, the slider 24 and the slide rail 25 are all placed in the mounting shell, the mounting seat partially extends out of the left and right sides of the mounting shell, the mounting seat is provided with a mounting hole, the vertical portion 111 is provided with a matching hole, the mounting hole is connected to the matching hole, and the vertical portion 111 and the mounting seat can be fixed by bolts or pins.

[0062] In some other embodiments of the present invention, the push-pull member 22 includes a drive shaft 221, a drive rod 222, a first push-pull rod 223 and a second push-pull rod 224. Specifically, it also includes a rotating disk, which is synchronously connected to the drive shaft 221, and the drive rod 222, the first push-pull rod 223 and the second push-pull rod 224 are arranged in the rotating disk. The drive shaft 221 is connected to the middle part of the drive rod 222, and the middle part of the drive rod 222 has a rotation center. The first push-pull rod 223 and the second push-pull rod 224 are respectively hinged at both ends of the drive rod 222. The first push-pull rod 223 and the second push-pull rod 224 are respectively hinged to the sliding seat 23 on both sides. Specifically, one end of the first push-pull rod 223 is connected to the end pin of the drive rod 222, and the other end of the first push-pull rod 223 is connected to the sliding seat 23. The slider 24 is slidably connected to the track, and the drive shaft 221 drives the drive rod 222 in the rotating disk to rotate in the horizontal direction.

[0063] In some other embodiments of the present invention, the driving assembly 2 further includes an elastic member 26, which is disposed between the first clamping member 11 and the second clamping member 12, and the two ends of the elastic member 26 are respectively connected to the connecting seats 21 on both sides. Specifically, the elastic member 26 is a spring, and the two ends of the spring have hooks. A through hole is provided on the connecting seat 21, and the hook of the spring is inserted into the through hole of the connecting seat 21.

[0064] In an embodiment of the present invention, during the process of the driving component 2 driving the clamping of the substrate carrier 8, when the driving shaft 221 rotates clockwise, the driving rod 222 rotates synchronously, and at the same time, the two ends of the driving rod 222 drive the first push-pull rod 223 and the second push-pull rod 224 to move laterally through the pin shaft. At the same time, the angle between one end of the two push-pull rods and the rotating disk gradually becomes smaller, and the other ends of the two push-pull rods drive the two sliding seats 23 to move towards each other through the pin shaft. The two sliding seats 23 drive the two clamping parts to move towards each other through the connecting seat 21 to clamp the substrate carrier 8.

[0065] In an embodiment of the present invention, during the process of the drive component 2 driving the substrate carrier 8 to be released: when the drive shaft 221 rotates counterclockwise, the two ends of the rotating disk drive the first push-pull rod 223 and the second push-pull rod 224 to move laterally through the pin shaft, and the angle between one end of the two push-pull rods and the rotating disk gradually increases, and the other ends of the two push-pull rods drive the two sliding seats 23 to move away from each other through the pin shaft, and the two sliding seats 23 drive the two clamping parts to move away from each other through the connecting seat 21, thereby releasing the substrate carrier 8.

[0066] In some other embodiments of the present invention, a detection member 27 is further included, and the detection member 27 is used to detect the moving distance of the first clamping member 11. Specifically, the detection member 27 includes a light shielding sheet 271, a first sensor 272 and a second sensor 273, one end of the light shielding sheet 271 is arranged on the sliding seat 23, and the other end of the light shielding sheet 271 is arranged between the first sensor 272 and the second sensor 273. The first sensor 272 and the second sensor 273 are photoelectric sensors or optical sensors, which are used to detect whether the light shielding sheet 271 is in a specific position. The light shielding sheet 271 is a physical element that blocks the light source, and can transmit position information by blocking the light beam emitted by the sensor during the movement of the clamping member. When the driving component 2 drives the first clamping member 11 and the second clamping member 12 to approach each other through the driving shaft 221 and the push-pull member 22, the sliding seat 23 will move along the track, causing the position of the light shielding sheet 271 to change. The light shielding sheet 271 blocks the light beam of the first sensor 272 during the movement, and the sensor will output a passing signal to indicate the position of the light shielding sheet 271. By detecting the displacement of the light shielding sheet 271, the relative position of the first clamping member 11 and the second clamping member 12 can be accurately determined. This enables the posture changing device to more accurately control the movement of the first clamping member 11 and the second clamping member 12, thereby ensuring that the posture changing process of the substrate carrier 8 is smooth and accurate.

[0067] Reference Fig.15 In a second aspect, the present invention also provides a conveying system, including the above-mentioned substrate carrier posture changing device, and also including a conveying body 4, a frame 5 and a top cover 51. The conveying body 4 has a carrying surface, and a receiving box 41 for receiving the substrate carrier 8 is placed on the carrying surface. The frame 5 is located and installed on both sides of the conveying body 4 along the y-axis direction. The top cover 51 is arranged at the end of the frame 5 away from the body, and the interior of the top cover 51 has a receiving space, and the bottom of the top cover 51 has an opening. A robotic arm 52 is arranged in the receiving space, and the substrate carrier posture changing device is connected to the robotic arm 52. There is a conveying port 53 for the substrate carrier 8 to pass through between the top cover 51, the frame 5 and the body.

[0068] In some other embodiments of the present invention, a lifting assembly (in the figure) is further included, the lifting assembly is arranged in the accommodation space, the mechanical arm 52 is fixedly connected to the lifting assembly, and the lifting assembly is used to drive the mechanical arm 52 to move along the height direction of the top cover 51. Specifically, in some embodiments of the present invention, the lifting assembly is driven by an electric cylinder, and the driving end of the electric cylinder is fixedly connected to the tail of the mechanical arm 52. The mechanical arm 52 has at least one driving end, and the driving end is connected to the mechanical arm 52.

[0069] The robot arm 52 can be lifted and lowered along the z-axis direction through the lifting assembly, extending from the top cover 51 to enter the area of ​​the transfer port 53. The substrate carrier posture changing device drives the clamping assembly 1 to clamp the substrate carrier 8 through the driving shaft 221 and place it at the designated workstation. By integrating the substrate carrier posture changing device with the robot arm 52, the system can flexibly control the posture of the substrate carrier 8 during the transmission of the wafer. When the substrate carrier 8 passes through the transmission system, it can effectively prevent the wafer 83 from falling or shifting due to inertial sliding. By cooperating with the robot arm 52, the entire system can perform operations such as clamping, transmission, and placement at a higher speed, thereby improving work efficiency and the stability of wafer transmission.

[0070] In a third aspect, the present invention further provides a method for changing the posture of a substrate carrier 8, using the above-mentioned substrate carrier posture changing device, the method comprising:

[0071] Place the substrate carrier 8 horizontally between the first clamping member 11 and the second clamping member 12 and maintain the first posture 6;

[0072] The driving assembly 2 is started to drive the first clamping member 11 and the second clamping member 12 to approach each other, and the clamping plate 82 is in line contact with the inclined surface 33 and forms a first contact position 61, and the first clamping member 11 and the second clamping member 12 have a bending portion 112;

[0073] As the first clamping member 11 and the second clamping member 12 approach each other, the bottom surface of the plate to be clamped 82 contacts the bent portion 112 to form a second contact position 71, and the second contact position 71 is arranged obliquely opposite to the first contact position 61. As the first clamping member 11 and the second clamping member 12 continue to approach each other, the second contact position 71 gradually rises along the extending direction of the bent portion 112, so that one end of the plate to be clamped 82 rises and the other end falls, forming a height difference.

[0074] Until the top surface of the to-be-clamped plate 82 forms surface contact with the inclined surface 33 and fits completely, the to-be-clamped plate 82 abuts against the bending portion of the bending portion 112 , so that the substrate carrier 8 is in the second posture 7 .

[0075] The beneficial effect of the method for changing the posture of a substrate carrier 8 provided by the present invention is that by transmitting the substrate carrier 8 at an elevation angle, the movement speed of the original robot arm 52 can be increased by 20% to 30%, and during this process, the wafer 83 will not slip out, further improving the working efficiency of wafer transmission.

[0076] In summary, in the first aspect of the present invention, through the interaction between the clamping assembly 1 and the matching member 3, the posture of the substrate carrier 8 can be smoothly transitioned from a horizontal state to an inclined state during transportation, effectively avoiding the problem of the wafer 83 falling or shifting due to inertial sliding. Through the proximity of the first clamping member 11 and the second clamping member 12, the angle of the clamping plate 82 to be clamped is gradually changed, and through the design of the slope 1121, the clamping plate 82 to be clamped is limited, so that it can operate stably during the angle change process, thereby improving the work efficiency of the entire device. In the second aspect, the transmission system of the present invention combines the substrate carrier posture changing device with the mechanical arm 52 to realize the automatic transmission and posture change of the wafer 83. During the transmission process of the wafer, the system can flexibly adjust the posture of the substrate carrier 8, avoiding the problem of the wafer sliding out due to inertia, and can perform operations such as clamping, transmission, and placement at a higher speed, while ensuring the stability of the wafer transmission, avoiding the influence of the mechanical arm on the wafer during high-speed transmission, and improving the work efficiency. The third aspect of the method for changing the posture of the substrate carrier 8 can control the approach and separation between the clamping parts, so that the angle of the clamping plate 82 gradually changes, and finally the posture of the substrate carrier 8 is changed from a horizontal state to an inclined state.

[0077] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A substrate carrier posture changing device, wherein the substrate carrier (8) has an opening on one side along the front-back direction and is closed on the other side, and the substrate carrier (8) has a clamping plate (82) on both sides along the left-right direction, characterized in that: include: A clamping assembly (1) comprises two clamping members arranged opposite to each other, forming a clamping space for clamping a plate to be clamped (82), each of the clamping members having at least one supporting surface (1122) and one slope surface (1121); A driving assembly (2) is arranged between the two clamping members, and the driving assembly (2) is capable of driving the two clamping members to move closer to each other or farther away from each other in a horizontal direction, so that the clamping space gradually shrinks or gradually expands; A matching piece (3) is arranged in the clamping space, comprising two matching blocks arranged opposite to each other in the left-right direction, the matching blocks having an inclined surface (33), and the inclined surface (33) is arranged parallel to the supporting surface (1122); The substrate carrier (8) has a first posture (6) of horizontal placement and a second posture (7) of inclined placement. When the substrate carrier (8) is in the second posture (7), the angle between the extension line of the opening direction of the substrate carrier (8) and the horizontal plane is an acute angle. In the process of the substrate carrier (8) changing from the first posture (6) to the second posture (7), the clamping space is gradually reduced, so that the side of the to-be-clamped plate (82) of the substrate carrier (8) close to the opening gradually rises along the slope (1121) to the support surface (1122), so that the substrate carrier (8) changes to the second posture (7).

2. The substrate carrier posture changing device according to claim 1, characterized in that: When the clamping space gradually shrinks, the to-be-clamped plate (82) and the inclined surface (33) gradually change from line contact to surface contact.

3. The substrate carrier posture changing device according to claim 1, characterized in that: The angle between the inclined surface (33) and the horizontal plane is a first angle (34), and the first angle (34) is 5° to 10°.

4. The substrate carrier posture changing device according to claim 3, characterized in that: Each of the clamping members comprises a vertical portion (111) and a bent portion (112); the bent portion (112) is bent relative to the vertical portion (111); a bending portion between the bent portion (112) and the vertical portion (111) is a support edge; the support surface (1122) is formed by extending the support edge in a horizontal direction; an angle between the bent portion (112) and the support surface (1122) is a second angle (113); and the second angle (113) is greater than the first angle (34).

5. The substrate carrier posture changing device according to claim 4, characterized in that: The second angle (113) is 15° to 25°, and the slope surface (1121) is formed by bending the support surface (1122) counterclockwise by 15° to 25°.

6. The substrate carrier posture changing device according to claim 1, characterized in that: The two matching blocks each comprise a fixed seat (31) and a cushion block (32); the fixed seat (31) is fixedly connected to the cushion block (32); the fixed seat (31) is connected to the drive assembly (2); and the inclined surface (33) is arranged on a side of the cushion block (32) facing away from the fixed seat (31).

7. The substrate carrier posture changing device according to claim 4, characterized in that: The driving assembly (2) comprises a connecting seat (21), a push-pull member (22), a sliding seat (23), a slider (24) and a slide rail (25); the vertical portion (111) is mounted on the connecting seat (21); one end of the slide seat (23) is connected to the connecting seat (21); the other end of the slide seat (23) is connected to the pushing-pull member (22); the slider (24) is fixedly connected to the sliding seat (23); the slide rail (25) extends in a horizontal direction; the slider (24) is slidably connected to the slide rail (25); and the pushing-pull member (22) is used to drive the slide seat (23) to move along the extension direction of the slide rail (25).

8. The substrate carrier posture changing device according to claim 7, characterized in that: The push-pull member (22) comprises a drive shaft (221), a drive rod (222), a first push-pull rod (223) and a second push-pull rod (224); the drive shaft (221) is capable of rotating about an axis; the drive shaft (221) is connected to the middle portion of the drive rod (222); the middle portion of the drive rod (222) has a rotation center; the first push-pull rod (223) and the second push-pull rod (224) are respectively hinged at two ends of the drive rod (222); the first push-pull rod (223) and the second push-pull rod (224) are respectively hinged to the sliding seats (23) on both sides.

9. The substrate carrier posture changing device according to claim 7, characterized in that: The driving assembly (2) further comprises an elastic member (26), wherein the elastic member (26) is arranged between the two clamping members, and two ends of the elastic member (26) are respectively connected to the connecting seats (21) on both sides.

10. The substrate carrier posture changing device according to claim 7, characterized in that: It also comprises a detection member (27), wherein the detection member (27) is used to detect a moving distance of the clamping member.

11. The substrate carrier posture changing device according to claim 10, characterized in that: The detection member (27) comprises a light shielding sheet (271), a first sensor (272) and a second sensor (273); one end of the light shielding sheet (271) is arranged on the sliding seat (23), and the other end of the light shielding sheet (271) is arranged between the first sensor (272) and the second sensor (273).

12. A conveying system comprising a substrate carrier posture changing device according to any one of claims 1 to 11, characterized in that: Also includes: A conveying body (4) having a carrying surface, on which a containing box (41) for containing a substrate carrier (8) is placed; A frame (5) mounted on both sides of the transmission body (4); A top cover (51) is arranged at an end of the frame (5) away from the main body, the top cover (51) has a storage space inside, the bottom of the top cover (51) has an opening, a mechanical arm (52) is arranged in the storage space, the substrate carrier (8) posture changing device is connected to the mechanical arm (52), and a conveying port (53) for the substrate carrier (8) to pass through is provided between the top cover (51), the frame (5) and the main body.

13. The conveying system according to claim 12, characterized in that It also includes a lifting component, which is arranged in the accommodating space, the mechanical arm (52) is fixedly connected to the lifting component, and the lifting component is used to drive the mechanical arm (52) to move along the height direction of the top cover (51), and the mechanical arm (52) has at least one driving end, and the driving end is connected to the posture changing device of the substrate carrier (8).

14. A method for changing the posture of a substrate carrier, using the substrate carrier posture changing device according to any one of claims 1 to 11, characterized in that: The method comprises: Placing the substrate carrier (8) horizontally between the two clamping members and maintaining the first posture (6); The driving assembly (2) is started to drive the two clamping members to approach each other, until the clamping plate (82) contacts the inclined surface (33) and forms a first contact position (61), and the two clamping members have a bending portion (112); As the clamping members approach each other, the bottom surface of the plate to be clamped (82) contacts the bent portion (112), forming a second contact position (71), the second contact position (71) being arranged obliquely opposite to the first contact position (61), and as the clamping members continue to approach each other, the second contact position (71) gradually rises along the extension direction of the bent portion (112), so that the open end of the plate to be clamped (82) rises and the closed end falls, forming a height difference; Until the top surface of the plate to be clamped (82) forms surface contact with the inclined surface (33) and is completely fitted, the plate to be clamped (82) abuts against the bending portion of the bending portion (112), so that the substrate carrier (8) changes to the second posture (7).

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