Driving mechanism, camera module and electronic equipment

Abstract

The invention discloses a driving mechanism, a camera module and electronic equipment, the driving mechanism comprises a shell, a base and a mover, the mover is arranged in an inner cavity enclosed by the shell and the base, the driving mechanism further comprises a damping layer, and the damping layer is arranged on the shell and / or the base. According to the scheme, due to the fact that the damping layer is arranged on the base, when the rotor collides with the base, the damping layer on the base can reduce the amplitude of the base, shell deformation caused by the fact that the rotor collides with the base is weakened, abnormal sound is caused by disturbance of surrounding air due to the shell deformation, and under the condition that the shell deformation is weakened, the vibration of the base is reduced. Therefore, the disturbance quantity of the shell to surrounding air can be reduced, and the abnormal sound value is further reduced. Meanwhile, the damping layer is arranged on the shell, and the deformation frequency and amplitude of the shell can be reduced due to the increase of the damping of the shell, so that the disturbance quantity of the shell to ambient air is reduced, and the abnormal sound value is further reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic equipment, and in particular to a driving mechanism, a camera module and an electronic device. Background Art

[0002] With the rapid development of science and technology, electronic devices have been basically popularized in people's lives, especially portable electronic devices, such as laptop computers, tablet computers, mobile phones, etc. In order to enable these electronic devices to have a shooting function, cameras are set.

[0003] As consumer demand continues to upgrade, consumers have also put forward higher requirements for the abnormal noise experience of motors in cameras.

[0004] However, the motor in the camera in the related art cannot reduce the abnormal sound level during use, thereby affecting consumers' recognition of the electronic device. Summary of the invention

[0005] The embodiments of the present application provide a driving mechanism, a camera module, and an electronic device, which can reduce abnormal noise of the device, thereby improving consumer recognition of the device.

[0006] In order to solve the above technical problems, in the first aspect, the present application proposes a driving mechanism, comprising: a housing, a base and a mover, wherein the mover is arranged in an inner cavity surrounded by the housing and the base, and the driving mechanism further comprises:

[0007] A damping layer is arranged on the housing and / or the base, and is used to reduce the amplitude of the housing and / or the base.

[0008] The driving mechanism provided in the embodiment of the present application has a damping layer on the base. When the mover collides with the base, the damping layer on the base will reduce the amplitude of the base, thereby weakening the deformation of the shell caused by the mover colliding with the base. Since the disturbance of the surrounding air caused by the deformation of the shell will cause abnormal noise, under the condition of weakened shell deformation, the amount of disturbance of the surrounding air by the shell can be reduced, thereby reducing the value of the abnormal noise. At the same time, since a damping layer is provided on the shell, the increase in the shell damping will reduce the frequency and amplitude of the shell deformation, thereby reducing the amount of disturbance of the surrounding air by the shell, further reducing the value of the abnormal noise. The driving mechanism provided in the present application effectively reduces the abnormal noise of the device and improves the consumer's recognition of the device.

[0009] In one embodiment, the housing includes an upper cover and a side plate arranged around the upper cover; the damping layer is arranged inside the upper cover. When the damping layer is arranged on the upper surface or the lower surface of the upper cover, the damping of the entire housing is not greatly affected. In the present application, the damping layer is arranged inside the upper cover, which can effectively improve the damping of the entire housing, thereby reducing the frequency and amplitude of the deformation of the housing.

[0010] In one of the embodiments, a size of the damping layer along a first direction is smaller than a size of the upper cover along the first direction, wherein the first direction is a horizontal plane direction of the upper cover.

[0011] In one embodiment, the size of the damping layer along the first direction is equal to the size of the upper cover along the first direction, wherein the first direction is the horizontal plane direction of the upper cover. In this way, the entire upper cover is provided with a damping layer along the first direction, thereby effectively improving the damping of the upper cover.

[0012] In one of the embodiments, the base includes a bottom plate and a vertical plate arranged on the upper surface of the bottom plate; the damping layer is arranged on one side of the vertical plate along the height direction.

[0013] In one embodiment, the vertical plate is provided with a first slot along a second direction, and the damping layer is provided in the first slot, wherein the second direction is the height direction of the vertical plate. In this way, it is convenient to provide the damping layer in the vertical plate.

[0014] In one embodiment, the first slot is connected to the outside on one side facing the mover, so that the damping layer can be directly placed into the first slot from the outside.

[0015] In one embodiment, the driving mechanism further comprises a baffle, which is arranged on the side of the vertical plate facing the mover, and the position of the baffle corresponds to the position of the first slot facing the mover. In this way, the damping layer can be prevented from being impacted and causing failure.

[0016] In one embodiment, a second slot is provided on the side of the vertical plate facing the mover, the side of the second slot facing the first slot is connected to the first slot, the side of the second slot facing away from the first slot is connected to the outside, and the baffle is provided in the second slot. In this way, it is convenient to fix the baffle on the vertical plate.

[0017] In one embodiment, the length of the baffle along the second direction matches the length of the second card slot along the second direction;

[0018] The length of the second slot along the second direction is greater than the length of the first slot along the second direction, and the two sides of the first slot along the second direction are located inside the two sides of the second slot. In this way, even if the baffle is hit, since the length of the baffle along the second direction matches the length of the second slot along the second direction, and the length of the second slot along the second direction is greater than the length of the first slot along the second direction, and the two sides of the first slot along the second direction are located inside the two sides of the second slot, at this time, most of the force applied to the baffle will be transmitted to the vertical plate, thereby reducing the force applied by the baffle to the damping layer, and effectively preventing the damping layer from being hit hard and causing failure.

[0019] In one embodiment, the baffle is a metal plate, so that the overall strength of the baffle can be improved, and the failure of the damping layer caused by the deformation of the baffle due to impact can be further avoided.

[0020] In one embodiment, the shell is made of damping alloy or foam metal. Since the damping alloy or foam metal itself has a large damping coefficient, when the shell is made of damping alloy or foam metal, it itself has a large damping coefficient, which is conducive to changing the frequency and amplitude caused by the deformation of the shell.

[0021] In one embodiment, the damping layer is formed of a high molecular polymer material. Since high molecular polymer materials exhibit different morphological characteristics under different loads, they exhibit a viscous flow state in a natural state or when loaded at a low speed, and a highly elastic state under an impact load, and the elastic modulus increases sharply, so that they can better resist impact deformation and absorb energy, and improve shaking and abnormal noise. At the same time, when the load disappears, it can return to the original viscous flow state, has good self-repair properties, and can be reused many times.

[0022] In a second aspect, the present application provides a camera module, comprising: a lens and a driving mechanism as described in any one of the embodiments of the present application;

[0023] The driving mechanism is connected to the lens.

[0024] The camera module provided in the embodiment of the present application has a damping layer on the base of the driving mechanism. When the mover collides with the base, the damping layer on the base will reduce the amplitude of the base, thereby weakening the deformation of the shell caused by the mover colliding with the base. Since the disturbance of the surrounding air caused by the deformation of the shell will cause abnormal noise, under the condition of weakened shell deformation, the amount of disturbance of the surrounding air by the shell can be reduced, thereby reducing the value of the abnormal noise. At the same time, since a damping layer is provided on the shell, the increase in the shell damping will reduce the frequency and amplitude of the shell deformation, thereby reducing the amount of disturbance of the surrounding air by the shell, thereby reducing the value of the abnormal noise. The driving mechanism provided by the present application effectively reduces the abnormal noise of the device and improves the consumer's recognition of the device.

[0025] In a third aspect, the present application provides an electronic device, comprising: a housing and a camera module as described in the embodiments of the present application, wherein the camera module is arranged inside the housing.

[0026] In the electronic device provided by the embodiment of the present application, since the driving mechanism in the camera module is provided with a damping layer on the base, when the mover collides with the base, the damping layer on the base will reduce the amplitude of the base, thereby weakening the deformation of the shell caused by the mover colliding with the base. Since the disturbance of the surrounding air caused by the deformation of the shell will cause abnormal noise, under the condition of weakened shell deformation, the amount of disturbance of the surrounding air by the shell can be reduced, thereby reducing the value of the abnormal noise. At the same time, since a damping layer is provided on the shell, the increase in the shell damping will reduce the frequency and amplitude of the shell deformation, thereby reducing the amount of disturbance of the surrounding air by the shell, thereby reducing the value of the abnormal noise. The driving mechanism provided by the present application effectively reduces the abnormal noise of the equipment and improves the consumer's recognition of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present application or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative labor.

[0028] Figure 1 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application;

[0029] Figure 2 A schematic diagram of a disassembled structure of an electronic device provided in an embodiment of the present application;

[0030] Figure 3 A schematic diagram of the structure of a driving mechanism provided in one embodiment of the present application;

[0031] Figure 4A schematic cross-sectional structure diagram of a driving mechanism provided in one embodiment of the present application;

[0032] Figure 5 for Figure 4 A is an enlarged schematic diagram;

[0033] Figure 6 A schematic cross-sectional structure diagram of a driving mechanism provided in one embodiment of the present application;

[0034] Figure 7 for Figure 6 The enlarged schematic diagram of point B in FIG.

[0035] Figure 8 A schematic diagram of an acoustic-solid coupling model provided in an embodiment of the present application;

[0036] Fig. 9 An embodiment of the present application provides Figure 6 The shaking and abnormal noise simulation value;

[0037] Fig.10 The simulation value of shaking and abnormal sound of a conventional driving mechanism provided in an embodiment of the present application;

[0038] Fig.11 An embodiment of the present application provides Figure 4 The shaking and abnormal noise simulation value;

[0039] Fig.12 The vibration and abnormal noise simulation value of the housing damping coefficient of 0.002 provided in one embodiment of the present application;

[0040] Fig.13 The vibration and abnormal noise simulation value of the housing damping coefficient of 0.004 provided in one embodiment of the present application;

[0041] Fig.14 The vibration and abnormal noise simulation value of the housing damping coefficient of 0.02 provided in one embodiment of the present application;

[0042] Fig.15 A schematic diagram of the structure of a camera module provided in one embodiment of the present application.

[0043] Description of reference numerals:

[0044] 100- electronic equipment;

[0045] 10-shell; 11-middle frame; 111-middle plate;

[0046] 112-frame; 1121-socket; 1122-sound outlet;

[0047] 12-back cover; 20-screen; 21-display screen;

[0048] 22-translucent cover plate; 30-circuit board; 31-main circuit board;

[0049] 32-sub-circuit board; 40-battery; 50-camera module;

[0050] 60-speaker module; 61-sound channel; 70-connection structure;

[0051] 200-driving mechanism;

[0052] 210-housing; 211-upper cover; 212-side panel;

[0053] 220-base; 221-bottom plate; 222-vertical plate;

[0054] 2221-first card slot; 2222-second card slot; 2223-boss

[0055] 230- mover; 240- ball; 250- damping layer;

[0056] 260- baffle;

[0057] 300-hemispherical acoustic air domain;

[0058] 400-lens. DETAILED DESCRIPTION

[0059] The terms used in the implementation method part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application. The implementation method of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0060] The electronic device provided in the present application may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device, a security device, a television, and other mobile or fixed terminals with a camera function. The present application embodiment is described by taking a mobile phone as an example.

[0061] Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application. Figure 2 This is a schematic diagram of the disassembled structure of an electronic device 100 provided in an embodiment of the present application, refer to Figure 1 and Figure 2As shown, the electronic device 100 provided in the embodiment of the present application may include: a housing 10, a screen 20, a circuit board 30, a battery 40, a camera module 50, a universal serial bus (USB) device (not shown in the figure) and a speaker module 60.

[0062] It should be understood that Figure 1 and Figure 2 It is not drawn according to the actual proportions of each part, and the same is true for other drawings, so the present application should not be limited to the proportions, sizes, etc. shown in the drawings. In addition, in the present application, "connection" or "electrical connection" can not only mean that the two are directly connected, but also that the two are connected through one or more intermediate devices. In the present application, "installation" and "assembly" can include any existing installation method. For example, one component can be fixed on, under or in another component by means of connectors (such as bolts, rivets, etc.) and / or adhesives. These understandings all fall within the scope of the embodiments of the present application. In addition, when the electronic device 100 is a device of some other form, the electronic device 100 may also not include at least one of the screen 20, the circuit board 30, the battery 40, the camera module 50, and the USB device.

[0063] Specifically, refer to Figure 1 and Figure 2 As shown, the housing 10 can provide a structural framework for the electronic device 100, for example Figure 1 and Figure 2 In the embodiment, the housing 10 may include a middle frame 11 and a back cover 12. When the electronic device 100 has a display function, it may also have a screen 20. The middle frame 11, the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60 are arranged between the screen 20 and the back cover 12. Among them, the middle frame 11 can be used as the structural "skeleton" of the electronic device 100, and the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60 can be arranged on the middle frame 11. For example, the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60 are arranged on the side of the middle frame 11 facing the back cover 12, or the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60 can be arranged on the side of the middle frame 11 facing the screen 20.

[0064] Among them, the middle frame 11 may include a middle plate 111 and a frame 112, and the frame 112 is arranged around the outer periphery of the middle plate 111. Generally, the frame 112 may include a top frame, a bottom frame, a left frame and a right frame. The top frame, the bottom frame, the left frame and the right frame form a frame of a square ring structure. Among them, the middle plate 111 can be an aluminum plate, an aluminum alloy, or a magnesium alloy. The frame 112 can be a metal frame or a ceramic frame. Among them, the middle plate 111 and the frame 112 can be clamped, welded, bonded or integrally formed, or the metal middle plate 111 and the frame 112 can be fixedly connected by injection molding.

[0065] It is easy to understand that the shell 10 of the electronic device 100 provided in the present application includes but is not limited to the above-mentioned structure. For example, in some other embodiments, the shell 10 can be an integrated or split shell made of metal or plastic. In the embodiment of the present application, the shell 10 is specifically described by taking the structure composed of the middle frame 11 and the back cover 12 as an example. When the electronic device 100 does not include the middle frame 11, the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60 can be fixed to the surface of the screen 20 facing the back cover 12 by means of threaded connection, snap connection, welding, etc., and can also be fixed to the surface of the back cover 12 facing the screen 20 by means of threaded connection, snap connection, welding, etc.

[0066] It should be noted that in the electronic device 100, the middle frame 11 and the back cover 12 include but are not limited to: Figure 1 and Figure 2 In some other embodiments, the back cover 12 may be connected to the frame 112 to form an integrally formed housing. For example, the electronic device 100 may include: a screen 20, a middle plate 111 and a housing, and the housing may be formed by integrally forming the frame 112 and the back cover 12. In this way, the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60 are arranged in the accommodation space enclosed by the middle plate 111 and the housing.

[0067] The screen 20 is used to display images, videos, etc. The screen 20 may include a transparent cover plate 22 and a display screen 21 (also referred to as a display panel). The transparent cover plate 22 is stacked with the display screen 21 and fixedly connected by gluing or the like. The transparent cover plate 22 is mainly used to protect the display screen 21 and prevent dust. The material of the transparent cover plate 22 includes but is not limited to glass. The display screen 21 may be a flexible display screen or a rigid display screen. For example, the display screen 21 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (Mini Organic Light-Emitting Diode) display screen, a micro organic light-emitting diode (Micro Organic Light-Emitting Diode) display screen, a micro organic light-emitting diode (Micro Organic Light-Emitting Diode) display screen, a quantum dot light-emitting diode (Quantum dot Light Emitting Diodes, QLED) display screen, a liquid crystal display (Liquid Crystal Display, LCD), etc.

[0068] The back cover 12 is used to protect the internal electronic components of the electronic device 100. The material of the back cover 12 includes but is not limited to metal, ceramic, plastic and glass. In order to ensure that the electronic device 100 is light and thin while ensuring the structural strength of the back cover 12, the material of the back cover 12 can be selected to be metal. The light-transmitting cover plate 22, the frame 112 and the back cover 12 enclose the internal accommodation space of the electronic device 100. The accommodation space accommodates the display screen 21, the circuit board 30, the battery 40, the camera module 50, the USB device and the speaker module 60.

[0069] Continue to refer Figure 2 As shown, in the electronic device 100 provided in the embodiment of the present application, the circuit board 30 may include: a main circuit board 31 and a sub-circuit board 32 .

[0070] The main circuit board 31 is used to integrate the control chip. The control chip may be, for example, an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal flash storage (UFS). In some embodiments, the main circuit board 31 is electrically connected to the display screen 21, and the main circuit board 31 is used to control the display screen 21 to display images or videos. The main circuit board 31 may be a rigid circuit board, a flexible circuit board, or a combination of rigid and soft circuit boards. The main circuit board 31 may use a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on. Here, FR-4 is a code for a flame retardant material grade, and the Rogers dielectric board is a high-frequency board.

[0071] The auxiliary circuit board 32 is used to integrate electronic components such as the antenna (such as a 5G antenna) radio frequency front end, Universal Serial bus (USB) devices, etc. The auxiliary circuit board 32 can be a hard circuit board, a flexible circuit board, or a combination of hard and soft circuit boards. The auxiliary circuit board 32302 can use a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on.

[0072] The auxiliary circuit board 32 is electrically connected to the main circuit board 31 through the connection structure 70 to achieve data and signal transmission between the auxiliary circuit board 32 and the main circuit board 31. The connection structure 70 may be a flexible printed circuit (FPC). In other embodiments, the connection structure 70 may also be a wire or an enameled wire.

[0073] Of course, in other embodiments, the circuit board 30 may be one or more circuit boards. Here, the present application does not limit the number of circuit boards 30 .

[0074] The battery 40 is used to provide power to electronic devices in the electronic device 100, such as the display screen 21, the main circuit board 31, the auxiliary circuit board 32, the camera module 50, the speaker module 60, etc. In some embodiments, a battery installation groove can be provided on the surface of the middle frame 11 facing the back cover 12, and the battery 40 is installed in the battery installation groove.

[0075] The camera module 50 can realize the photo taking and video recording functions of the electronic device 100, and the camera module 50 is electrically connected to the circuit board 30. The camera module 50 can be a front camera, a rear camera, etc., and the number of the front camera and the rear camera can be one or more. For example, Figure 2 As shown, in the embodiment of the present application, the camera module 50 is described by taking three rear cameras as an example.

[0076] The USB device is connected to the auxiliary circuit board 32, and the USB device is an interface device that complies with the USB standard specification. Specifically, the USB device can be a Mini USB device, a Micro USB device, a USB Type C device, etc. The USB device is used to connect a charger via the socket 1121 on the frame 112 to charge the electronic device 100, and can also be used to transmit data between the electronic device 100 and peripheral devices, and can also be used to connect headphones to play audio through the headphones. The USB device can also be used to connect other electronic devices, such as augmented reality (AR) devices, etc.

[0077] The speaker module 60 is used to restore audio electrical signals such as music and voice into sound, and can support the audio external speaker function. In some embodiments, the speaker module 60 is electrically connected to the auxiliary circuit board 32. At this time, the audio signal sent by the main circuit board 31 is transmitted to the speaker module 60 via the auxiliary circuit board 32, and is converted into a sound signal output by the speaker module 60. For details, refer to Figure 2 Combined with Figure 1 As shown, a sound outlet channel 61 is provided on the housing of the speaker module 60. The sound signal output by the speaker module 60 is output through the sound outlet channel 61, and a sound outlet hole 1122 is provided on the frame 112, and the sound outlet hole 1122 is connected to the sound outlet channel 61. The sound output by the sound outlet channel 61 is output to the outside of the electronic device 100 through the sound outlet hole 1122.

[0078] In other embodiments, the speaker module 60 may also be directly electrically connected to the main circuit board 31 via an FPC, a wire, an enameled wire, or the like.

[0079] It should be noted that the speaker module 60 is described as one in the drawings of the present application. Of course, the number of speaker modules 60 can also be multiple. For example, in other embodiments of the present application, there can be two speaker modules 60, one of which is set at the top of the mobile phone, and the other speaker module 60 is set at the bottom of the mobile phone. In addition, the setting position of the speaker module 60 can also be set according to specific needs, including but not limited to the setting position in the above example.

[0080] Below, this application is described in detail.

[0081] At present, most electronic devices are equipped with camera modules to realize functions such as taking photos and videos. These camera modules have many high-end functions, such as autofocus, anti-shake, zoom, etc., which can focus light on the imaging element to obtain high-definition image effects.

[0082] When users use electronic devices in daily life, there are scenarios where the electronic devices are shaken. Since there is a gap between the stator and the mover in the motor of the camera module in the electronic device, the stator and the mover will collide during the shaking process, resulting in abnormal noise. This abnormal noise will affect the user's hearing and user experience, thereby reducing consumers' recognition of the equipment.

[0083] In order to solve the above problem, in a related technology, soft rubber is added to the mover to play a buffering role, thereby reducing the abnormal sound generated when the mover collides with the stator. However, this method has a limited degree of reducing the abnormal sound.

[0084] In view of this, an embodiment of the present application provides a driving mechanism 200, referring to Figure 3 Combined with Figure 4 and Figure 5 As shown, the driving mechanism 200 includes: a shell 210, a base 220, a mover 230 and a damping layer 250, wherein the mover 230 is arranged in an inner cavity surrounded by the shell 210 and the base 220, and the damping layer 250 is arranged on the shell 210 and / or the base 220 for reducing the amplitude of the shell 210 and / or the base 220.

[0085] In this embodiment, the base 220 is equivalent to the stator in the driving mechanism of the existing camera module, the housing 210 is buckled on the base 220 to form a closed cavity, and the mover 230 is arranged in the closed cavity. At the same time, a first track is provided on the side of the mover 230 facing the base 220, and a second track is provided on the side of the base 220 facing the mover 230. A ball 240 is provided between the mover 230 and the upper surface of the base 220, and the ball 240 is located in the corresponding first track and second track. When the mover 230 moves relative to the base 220, under the cooperation of the ball 240 and the first track and the second track, the mover 230 can only move along the fixed track.

[0086] In this embodiment, a damping layer 250 may be provided on the housing 210 , or on the base 220 , or on both the housing 210 and the base 220 . The specific method may be determined based on actual conditions, and the embodiments of this specification do not limit this.

[0087] When the driving mechanism 200 in the present application is a motor in a camera module, when in use, the mover 230 is connected to the lens on the lens in the camera module, and the base 220 drives the mover 230 to drive the lens to move. Since the connection structure and working principle of the driving mechanism and the lens in the camera module are prior art, they are not described here.

[0088] The driving mechanism 200 provided in the embodiment of the present application has a damping layer 250 disposed on the base 220. When the mover 230 collides with the base 220, the damping layer 250 on the base 220 will reduce the amplitude of the base 220, thereby weakening the deformation of the housing 210 caused by the mover 230 colliding with the base 220. Since the disturbance of the surrounding air caused by the deformation of the housing 210 will cause abnormal noise, under the condition that the deformation of the housing 210 is weakened, the disturbance of the surrounding air by the housing 210 can be reduced, thereby reducing the abnormal noise value. At the same time, since the damping layer 250 is disposed on the housing 210, the increase in the damping of the housing 210 will reduce the frequency and amplitude of the deformation of the housing 210, thereby reducing the disturbance of the surrounding air by the housing 210, and further reducing the abnormal noise value. The driving mechanism 200 provided in the present application effectively reduces the abnormal noise of the device and improves the consumer's recognition of the device.

[0089] In some embodiments, Figure 6 Combined with Figure 7 , Figure 3 As shown, the housing 210 includes an upper cover 211 and a side plate 212 arranged around the upper cover 211 , wherein the damping layer 250 is arranged inside the upper cover 211 .

[0090] In this embodiment, the damping layer 250 can be horizontally arranged inside the upper cover 211. Of course, the damping layer 250 can also be inclined relative to the upper cover 211. The specific amount can be determined according to actual conditions, and this embodiment of the specification does not limit this.

[0091] In this embodiment, a damping layer 250 may be provided inside one of the side panels 212 , or a damping layer 250 may be provided inside each side panel 212 . The specific number may be determined based on actual conditions, and this specification does not limit this.

[0092] According to experiments, when the damping layer 250 is disposed on the upper surface or the lower surface of the upper cover 211, the damping effect on the entire housing 210 is not significant. Figure 7 As shown, the present application sets the damping layer 250 inside the upper cover 211 along the horizontal direction, which can effectively improve the damping of the entire shell 210, thereby reducing the frequency and amplitude of the deformation of the shell 210.

[0093] refer to Figure 8 As shown, Figure 8 A schematic diagram of an acoustic-solid coupling model provided for an embodiment of the present application. The acoustic-solid coupling model in this embodiment is a unidirectional acoustic-solid coupling, which is mainly the propagation of sound waves in the air. The loudness value of the impact is calculated by extracting the pressure-time variation curve of particles in the air.

[0094] When measuring the abnormal sound value generated by the mover 230 hitting the base 220, the driving mechanism 200 is first set at the center of the bottom surface of the hemispherical acoustic air domain 300. The hemispherical acoustic air domain 300 is equivalent to a hemispherical closed structure with a radius of 100mm-110mm. The hemispherical structure is filled with air. The outer shell 210 of the driving mechanism 200 is fitted with the bottom surface of the hemispherical structure to form an acoustic-solid coupling model.

[0095] When the mover 230 in the driving mechanism 200 hits the base 220, the shell 210 will be deformed as the base 220 is hit, triggering air disturbance in the hemispherical acoustic air domain 300. After solving the pressure acoustic equation for the air domain, its sound pressure-time variation curve can be obtained, and then the sound pressure dB value can be obtained by filtering the sound pressure signal using the A-weighting method.

[0096] This embodiment first simulates a conventional drive mechanism, in which no damping layer is provided. Simultaneously, the damping coefficients of the housing in the conventional drive mechanism are set to 0.002, 0.004 and 0.02 respectively, and then simulates. Figure 12-14 As shown, Fig.12 is the simulation value of shaking noise when the shell damping coefficient is 0.002. Fig.13 is the simulation value of shaking noise when the shell damping coefficient is 0.004. Fig.14 It is the simulation value of shaking and abnormal noise when the shell damping coefficient is 0.02.

[0097] When the shell damping coefficient is 0.002, the measured abnormal sound value is 72.575dB, when the shell damping coefficient is 0.004, the measured abnormal sound value is 67.38dB, and when the shell damping coefficient is 0.02, the measured abnormal sound value is 27.49dB. This result shows that the increase of shell damping will change the frequency and amplitude of shell deformation, reduce the disturbance of the shell to the surrounding air, and reduce the abnormal sound value.

[0098] Since the shell material of the existing drive mechanism is usually steel, the damping coefficient is 0.001-0.008, which is a very small value. Therefore, in order to improve the shaking and abnormal sound, Figure 7 As shown, in this embodiment, a damping layer 250 is disposed inside the upper cover 211. Fig. 9 and Fig.10 As shown, Fig. 9 The upper cover 211 provided in an embodiment of the present application is provided with a damping layer 250, and the shaking and abnormal sound simulation value thereof is 56.89dB; Fig.10 The simulation value of the shaking and abnormal noise of the conventional driving mechanism provided in one embodiment of the present application is 75.32dB. It can be seen that providing a damping layer 250 inside the upper cover 211 can effectively reduce the disturbance of the outer shell 210 to the surrounding air and reduce the abnormal noise value.

[0099] In some embodiments, a dimension of the damping layer 250 along a first direction is smaller than a dimension of the upper cover 211 along the first direction, wherein the first direction is a horizontal plane direction of the upper cover 211 .

[0100] refer to Figure 7 Combined with Figure 6 As shown, in this embodiment, the area of ​​the damping layer 250 along the horizontal direction is smaller than the area of ​​the upper cover 211 along the horizontal direction. Of course, it can be understood that the specific size of the damping layer 250 can be determined according to actual conditions, and this embodiment of the specification does not limit this.

[0101] In some embodiments, a dimension of the damping layer 250 along the first direction is equal to a dimension of the upper cover 211 along the first direction, wherein the first direction is a horizontal plane direction of the upper cover 211 .

[0102] refer to Figure 7 Combined with Figure 6 As shown, in this embodiment, the damping layer 250 completely covers the interior of the upper cover 211 in the horizontal direction. In this way, the damping layer 250 is provided inside the entire upper cover 211 in the horizontal direction, thereby effectively improving the damping of the upper cover 211.

[0103] In some embodiments, Figure 3 As shown, the base 220 includes a bottom plate 221 and a vertical plate 222 disposed on the upper surface of the bottom plate 221 ; the damping layer 250 is disposed on one side of the vertical plate 222 along the height direction.

[0104] In this embodiment, a vertical plate 222 may be provided on one side or each side of the upper surface of the bottom plate 221, and the vertical plate 222 may be vertically provided on the upper surface of the bottom plate 221, wherein the vertical plate 222 may be integrally formed with the bottom plate 221, or the vertical plate 222 may be screwed and fixed on the bottom plate 221. When the housing 210 is buckled onto the base 220, the side plate 212 on the housing 210 is located outside the vertical plate 222, and the side of the side plate 212 facing the bottom plate 221 abuts against the upper surface of the bottom plate 221, and at this time, the housing 210 and the base 220 are buckled to form an inner cavity.

[0105] It should be noted that the structure of the base is only an example, and other structures may be used in other alternative solutions, for example, the base is a concave structure. The present application does not impose any special restrictions on the specific structure of the base, as long as the above structure can achieve the purpose of the present application.

[0106] refer to Figure 8 As shown, Figure 8This is a schematic diagram of an acoustic-solid coupling model provided in an embodiment of the present application. Acoustic-solid coupling refers to the interaction between sound waves and solids when propagating in solids. When measuring the abnormal sound value generated by the mover 230 hitting the base 220, the drive mechanism 200 is first set at the center of the bottom surface of the hemispherical acoustic air domain 300. The hemispherical acoustic air domain 300 is equivalent to a hemispherical closed structure with a radius of 100mm-110mm. The hemispherical structure is filled with air. The housing 210 of the drive mechanism 200 fits the bottom surface of the hemispherical structure to form an acoustic-solid coupling model.

[0107] When the mover 230 in the driving mechanism 200 hits the base 220, the shell 210 will be deformed as the base 220 is hit, triggering air disturbance in the hemispherical acoustic air domain 300. After solving the pressure acoustic equation for the air domain, its sound pressure-time variation curve can be obtained, and then the sound pressure dB value can be obtained by filtering the sound pressure signal using the A-weighting method.

[0108] This embodiment first simulates the conventional driving mechanism. Fig.10 As shown, Fig.10 This is the simulation result without the damping layer in the conventional drive mechanism, and the shaking noise value is 75.32dB. Fig.11 As shown, Fig.11 The simulation result of the driving mechanism with the damping layer 250 disposed on the vertical plate 222 shows that the shaking and abnormal noise value is 73.84 dB. Therefore, in this embodiment, the damping layer 250 disposed on the vertical plate 222 can reduce the shaking and abnormal noise value.

[0109] In some embodiments, Figure 5 Combined with Figure 4 As shown, the vertical plate 222 is provided with a first slot 2221 along the second direction, and the damping layer 250 is disposed in the first slot 2221 , wherein the second direction is the height direction of the vertical plate 222 .

[0110] In this embodiment, if Figure 4 As shown, the first slot 2221 is arranged along the height direction of the vertical plate 222, and the size of the first slot 2221 matches the size of the damping layer 250. Since the first slot 2221 is arranged on the vertical plate 222, it is convenient to place the damping layer 250 in the first slot 2221. Since the size of the first slot 2221 matches the size of the damping layer 250, when the damping layer 250 is located in the first slot 2221, it is possible to prevent the damping layer 250 from shaking relative to the first slot 2221. Of course, it can be understood that the position of the first slot 2221 and the size of the first slot 2221 and the size of the damping layer 250 are only examples, which can be determined according to actual conditions, and the embodiments of this specification do not limit this.

[0111] In some embodiments, Figure 5 Combined with Figure 4 As shown, the first slot 2221 is connected to the outside on the side facing the mover 230. In this way, the side of the first slot 2221 facing the mover 230 is an open structure, and when the damping layer 250 needs to be placed in the first slot 2221, it only needs to be placed from the outside to the inside of the opening side of the first slot 2221, thereby facilitating the placement of the damping layer 250.

[0112] In some embodiments, Figure 5 Combined with Figure 4 As shown, the driving mechanism further includes a baffle 260 , which is disposed on a side of the vertical plate 222 facing the mover 230 , and a position of the baffle 260 corresponds to a position of the first clamping slot 2221 facing the mover 230 .

[0113] In this embodiment, reference Figure 5 As shown, after the damping layer 250 is set in the first slot 2221, the baffle 260 is set on the right side of the vertical plate 222. At this time, the left side of the baffle 260 blocks the right side of the damping layer 250. When the driving mechanism is hit, the baffle 260 protects the damping layer 250 from direct external impact.

[0114] In some embodiments, Figure 5 As shown, a second slot 2222 is provided on the side of the vertical plate 222 facing the mover 230, wherein the side of the second slot 2222 facing the first slot 2221 is connected to the first slot 2221, and the side of the second slot 2222 away from the first slot 2221 is connected to the outside, and the baffle 260 is provided in the second slot 2222.

[0115] refer to Figure 5 As shown, in this embodiment, the second slot 2222 is located on the right side of the first slot 2221, the left side of the second slot 2222 is connected to the first slot 2221, and the right side of the second slot 2222 is connected to the outside. At the same time, the size of the second slot 2222 along the height direction of the vertical plate 222 matches the size of the baffle 260 along the height direction of the vertical plate 222. Of course, the size of the baffle 260 along the height direction of the vertical plate 222 can also be slightly smaller than the size of the second slot 2222 along the height direction of the vertical plate 222. The specific size can be determined according to actual conditions, and this embodiment of the specification does not limit this.

[0116] During installation, the damping layer 250 is first placed in the first slot 2221 , and then the baffle 260 is snapped into the second slot 2222 . This makes it easier to fix the baffle 260 on the vertical plate 222 .

[0117] It should be noted that the connection structure between the baffle and the vertical plate is only an example. In other alternative solutions, other structures may also be used, for example, the baffle is screwed to the vertical plate. This application does not impose any special restrictions on the specific connection structure between the baffle and the vertical plate, as long as the above structure can achieve the purpose of this application.

[0118] In some embodiments, Figure 5 As shown, the length of the baffle 260 along the second direction matches the length of the second slot 2222 along the second direction. At the same time, the length of the second slot 2222 along the second direction is greater than the length of the first slot 2221 along the second direction, and the two side positions of the first slot 2221 along the second direction correspond to the inside of the two side positions of the second slot 2222 along the second direction.

[0119] In this embodiment, the second direction is the height direction of the vertical plate 222, the dimension of the baffle 260 along the height direction of the vertical plate 222 is equal to the dimension of the second slot 2222 along the height direction of the vertical plate 222, and the dimension of the second slot 2222 along the height direction of the vertical plate 222 is greater than the dimension of the first slot 2221 along the height direction of the vertical plate 222. Figure 5 As shown, the upper side of the first slot 2221 is located inside the upper side of the second slot 2222, and the lower side of the first slot 2221 is located inside the lower side of the second slot 2222. Of course, it can be understood that the position structure of the first slot 2221 and the second slot 2222 can also be other types, for example: the upper side of the first slot 2221 and the upper side of the second slot 2222 overlap, etc., which can be determined according to actual conditions, and this specification embodiment does not limit this.

[0120] Take a side panel as a reference, such as Figure 5 As shown, since the upper side of the first slot 2221 is located inside the upper side of the second slot 2222, and the lower side of the first slot 2221 is located inside the lower side of the second slot 2222, and the dimension of the baffle 260 along the height direction of the vertical plate 222 is equal to the dimension of the second slot 2222 along the height direction of the vertical plate 222, that is, the height dimension of the baffle 260 is equal to the height dimension of the second slot 2222. Since the height dimension of the second slot 2222 is greater than the height dimension of the first slot 2221, the height dimension of the baffle 260 is also greater than the height dimension of the first slot 2221. In this way, even if the baffle 260 is hit, most of the force applied to the baffle 260 will be transmitted to the boss 2223 on the vertical plate 222 through the baffle 260, thereby reducing the force applied by the baffle 260 to the damping layer 250, and effectively preventing the damping layer 250 from being hit and causing failure.

[0121] In some embodiments, the baffle 260 is a metal plate. Of course, it is understandable that the baffle 260 can also be an alloy plate, etc., which can be determined according to actual conditions, and the embodiments of this specification do not limit this.

[0122] Since the baffle 260 is a metal plate, the overall strength of the baffle 260 can be improved, and the failure of the damping layer 250 caused by the deformation of the baffle 260 due to impact can be further avoided.

[0123] In some embodiments, the housing 210 is made of a damping alloy or foam metal. Of course, it is understandable that the housing 210 can also be made of an iron material, which can be determined according to actual conditions, and the embodiments of this specification do not limit this.

[0124] Since the damping alloy or foam metal itself has a relatively large damping coefficient, when the housing 210 is made of the damping alloy or foam metal, it itself has a relatively large damping coefficient, which is beneficial to changing the frequency and amplitude caused by the deformation of the housing 210 .

[0125] In some embodiments, the damping layer 250 is formed of a high molecular polymer material, such as polyacrylate, polyurethane, epoxy resin, etc. The specific material can be determined according to actual conditions, and the embodiments of this specification are not limited to this.

[0126] Since high molecular polymer materials will present different forms of characteristics under different loads, among which, they will present a viscous flow state in the natural state or when loaded at a low speed, and a highly elastic state under an impact load, and the elastic modulus will increase sharply, so that they can better resist impact deformation and absorb energy, and improve shaking and abnormal noise. At the same time, when the load disappears, it can return to the original viscous flow state, has good self-repairing properties, and can be reused many times. Therefore, the damping layer 250 of the present application can not only improve shaking and abnormal noise, but also can be reused many times.

[0127] The present application also provides a camera module 50, such as Fig.15 As shown, the camera module 50 includes: a lens 400 and a driving mechanism 200 as in any one of the embodiments of the present application, wherein the driving mechanism 200 is connected to the lens 400. The specific structure of the driving mechanism 200 in this embodiment refers to the above embodiments, and since the camera module adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0128] The present application also provides an electronic device, comprising: a housing and a camera module as in the embodiment of the present application, wherein the camera module is arranged inside the housing. The specific structure of the camera module in this embodiment refers to the above embodiment, and since the electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0129] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0130] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A driving mechanism, comprising: A housing (210), a base (220) and a mover (230), wherein the mover (230) is arranged in an inner cavity surrounded by the housing (210) and the base (220), wherein the driving mechanism further comprises: A damping layer (250) is provided on the housing (210) and / or the base (220) and is used to reduce the amplitude of the housing (210) and / or the base (220).

2. The driving mechanism according to claim 1, characterized in that: The housing (210) comprises an upper cover (211) and a side plate (212) arranged around the upper cover (211); The damping layer (250) is arranged inside the upper cover (211).

3. The driving mechanism according to claim 2, characterized in that: The dimension of the damping layer (250) along the first direction is smaller than the dimension of the upper cover (211) along the first direction, wherein the first direction is the horizontal plane direction of the upper cover (211).

4. The driving mechanism according to claim 2, characterized in that: The dimension of the damping layer (250) along the first direction is equal to the dimension of the upper cover (211) along the first direction, wherein the first direction is the horizontal plane direction of the upper cover (211).

5. The driving mechanism according to claim 1, characterized in that: The base (220) comprises a bottom plate (221) and a vertical plate (222) arranged on the upper surface of the bottom plate (221); The damping layer (250) is arranged on one side of the vertical plate (222) along the height direction.

6. The driving mechanism according to claim 5, characterized in that: The vertical plate (222) is provided with a first slot (2221) along a second direction, and the damping layer (250) is arranged in the first slot (2221), wherein the second direction is a height direction of the vertical plate (222).

7. The driving mechanism according to claim 6, characterized in that: The first slot (2221) is connected to the outside on a side facing the mover (230).

8. The driving mechanism according to claim 7, characterized in that: The driving mechanism further comprises a baffle (260), wherein the baffle (260) is arranged on a side of the vertical plate (222) facing the mover (230), and the position of the baffle (260) corresponds to the position of the first clamping groove (2221) facing the mover (230).

9. The driving mechanism according to claim 8, characterized in that: A second slot (2222) is provided on a side of the vertical plate (222) facing the mover (230); a side of the second slot (2222) facing the first slot (2221) is connected to the first slot (2221); a side of the second slot (2222) facing away from the first slot (2221) is connected to the outside; and the baffle (260) is provided in the second slot (2222).

10. The driving mechanism according to claim 9, characterized in that: The length of the baffle (260) along the second direction matches the length of the second card slot (2222) along the second direction; The length of the second card slot (2222) along the second direction is greater than the length of the first card slot (2221) along the second direction, and the two side positions of the first card slot (2221) along the second direction are correspondingly located inside the two side positions of the second card slot (2222) along the second direction.

11. The driving mechanism according to any one of claims 8 to 10, characterized in that: The baffle (260) is a metal plate.

12. The driving mechanism according to any one of claims 1 to 10, characterized in that: The housing (210) is made of damping alloy or foam metal.

13. The driving mechanism according to any one of claims 1 to 10, characterized in that: The damping layer (250) is formed of a high molecular polymer material.

14. A camera module, characterized in that: include: A lens and a driving mechanism as claimed in any one of claims 1 to 13; The driving mechanism is connected to the lens.

15. An electronic device, characterized in that: include: A shell and a camera module as claimed in claim 14, wherein the camera module is arranged inside the shell.

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