Circuit board manufacturing method and device, electronic equipment and storage medium

Abstract

The invention discloses a circuit board manufacturing method and device, electronic equipment and a storage medium, and relates to the technical field of circuit board manufacturing. The method comprises the steps of obtaining a semi-finished circuit board; pasting a protective film on the semi-finished circuit board through automatic film pasting equipment; the automatic film pasting equipment comprises a feeding mechanism, a separating mechanism, a pasting mechanism and a discharging mechanism. Performing laser windowing on a protective film of the semi-finished circuit board according to the position of a bonding pad of the semi-finished circuit board to expose the bonding pad; performing surface treatment on the bonding pad to form a substrate to be punched; a to-be-punched substrate is punched through punching equipment, and the to-be-punched substrate is divided into a plurality of pre-cutting units. According to the manufacturing method of the circuit board, the protective film is pasted on the semi-finished circuit board through the automatic film pasting equipment, the film pasting efficiency can be improved, meanwhile, laser windowing is carried out after the protective film is pasted, the windowing precision can be improved, and the problem that the film pasting precision is not high due to the mode that windowing is carried out before film pasting is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a circuit board manufacturing method, device, electronic equipment, and storage medium. Background Art

[0002] In order to achieve the needs of contact and welding of the circuit board, it is necessary to set a pad on the circuit board. At the same time, in order to protect the circuit board, it is also necessary to cover the circuit board with a protective film. In order to prevent the protective film from affecting the exposure of the pad, in the prior art, it is usually necessary to first open the corresponding position on the protective film according to the size of the pad, and then stick the opened protective film on the circuit board to protect the circuit board and expose the position of the pad. However, this method is not suitable for some products with high precision requirements, and it is easy to have the problem of inaccurate fitting position of the protective film. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method, device, electronic device, and storage medium for manufacturing a circuit board, which can improve the lamination of a protective film and the way of opening a window, and enhance the accuracy.

[0004] On the one hand, a method for manufacturing a circuit board according to an embodiment of the present invention comprises the following steps: Obtain semi-finished circuit boards; Laminating a protective film on the semi-finished circuit board by an automatic laminating device; the automatic laminating device comprises a loading mechanism, a separating mechanism, a laminating mechanism and a unloading mechanism; According to the pad position of the semi-finished circuit board, laser opening is performed on the protective film of the semi-finished circuit board to expose the pad; Performing surface treatment on the pad to form a substrate to be punched; Punching the substrate to be punched by a punching device to divide the substrate to be punched into a plurality of pre-cut units; The step of attaching a protective film to the semi-finished circuit board by an automatic film attaching device includes: The film to be processed is loaded by the loading mechanism; the film to be processed comprises a release paper and the protective film arranged on the surface of the release paper; Separating the protective film from the release paper by the separation mechanism, and removing the release paper; Laminating the protective film on the semi-finished circuit board by the laminating mechanism; The semi-finished circuit board after film pasting is unloaded by the unloading mechanism.

[0005] According to some embodiments of the present invention, the feeding mechanism includes a first unloading table, a first moving device and a lifting adsorption device, a limiting device is provided on the first unloading table, the first moving device is located above the first unloading table, and the lifting adsorption device is provided on the first moving device. The step of feeding the film to be processed by the feeding mechanism includes: Placing a plurality of the films to be processed on the first unloading table, and limiting the plurality of the films to be processed by the limiting device; After the lifting and adsorption device descends and adsorbs the topmost film to be processed, the lifting and adsorption device is lifted and lowered multiple times to shake the adsorbed film to be processed; The first moving device drives the lifting and adsorption device to move, so that the lifting and adsorption device transfers the adsorbed film to be processed to the separation mechanism.

[0006] According to some embodiments of the present invention, the separation mechanism includes a conveying platform, a second moving device, a rotating lifting device, a viscous separation roller, a material collecting device, a material receiving platform and a movable grabbing device, the second moving device is located above the conveying platform, the rotating lifting device is arranged on the second moving device, the separation roller is arranged on the rotating lifting device, the material collecting device is arranged between the conveying platform and the material receiving platform, and the grabbing device is located above the material receiving platform; The step of separating the protective film from the release paper by the separation mechanism and removing the release paper comprises: The conveying platform obtains the film to be processed conveyed by the feeding mechanism, and drives the film to be processed to move to a preset position in the direction of the receiving platform; The second moving device drives the rotating lifting device to move above the film to be processed, the rotating lifting device drives the separation roller to descend to the surface of the film to be processed, and the second moving device drives the separation roller to roll back and forth to separate the release paper from the protective film; The collecting device receives the release paper, the grabbing device moves toward the conveying platform and grabs the protective film onto the collecting platform, and the collecting platform performs vacuum adsorption on the protective film.

[0007] According to some embodiments of the present invention, the material collecting device comprises a rotating rod, a rotating pressure rod, a telescopic plate and a collection frame, wherein the two ends of the rotating rod are respectively provided with rotating plates, the two ends of the rotating pressure rod are respectively connected to the two rotating plates, the collection frame is located below the rotating rod, the telescopic plate is located between the conveying platform and the material receiving platform, and the rotating rod is located between the conveying platform and the telescopic plate; The collecting device receives the release paper, the grabbing device moves toward the conveying platform and grabs the protective film onto the collecting platform, and the collecting platform vacuum adsorbs the protective film, including: The rotating plate drives the rotating pressure rod to rotate between the release paper and the protective film, and presses the release paper downward, so that the release paper bypasses the rotating rod; The telescopic plate extends to connect with the conveying platform, the rotating rod rotates to convey the release paper into the collecting frame, and the conveying platform conveys the protective film onto the telescopic plate; The grabbing device moves toward the telescopic plate and grabs the protective film onto the material receiving platform, and the material receiving platform performs vacuum adsorption on the protective film.

[0008] According to some embodiments of the present invention, the laminating mechanism comprises: a second unloading table, a first manipulator device, a third moving device, a laminating platform, a second manipulator device and a positioning identification device, the first manipulator device is provided with a first clamping component and a second clamping component, the second manipulator device is provided with a rotatable adsorption component, and the laminating platform is provided on the third moving device; The step of laminating the protective film on the semi-finished circuit board by the laminating mechanism includes: Placing the semi-finished circuit board on the second unloading table; The first manipulator device clamps the semi-finished circuit board onto the pressing platform through the first clamping assembly; The third moving device drives the pressing platform to approach the second manipulator device; The second manipulator device absorbs the protective film from the separation mechanism through the adsorption component, positions the semi-finished circuit board on the pressing platform through the positioning identification device, and rotates the protective film through the adsorption component; The second robot device presses the protective film on the adsorption component onto the semi-finished circuit board.

[0009] According to some embodiments of the present invention, the unloading mechanism comprises an unloading platform, and the unloading platform and the second unloading platform are respectively located on both sides of the third moving device; The step of unloading the semi-finished circuit board after film lamination by the unloading mechanism comprises: The third moving device drives the pressing platform to approach the unloading platform; The first manipulator device clamps the semi-finished circuit board without film on the second unloading table through the first clamping component, and the second clamping component places the semi-finished circuit board on the pressing platform on the unloading platform. At the same time, the first clamping component places the semi-finished circuit board without film on the pressing platform.

[0010] According to some embodiments of the present invention, the punching and cutting equipment comprises a frame, on which a lifting platform, a punching and cutting device and a third unloading platform are sequentially arranged, a first suction device is arranged above the lifting platform, a second suction device is arranged above the third unloading platform, and a positioning device is arranged on the lifting platform; The step of punching the substrate to be punched by a punching device to divide the substrate to be punched into a plurality of pre-cut units comprises: Placing the substrate to be punched on the lifting platform according to the positioning of the positioning device; The lifting platform rises, and the first suction device sucks the substrate to be punched from the lifting platform, and places the substrate to be punched on the punching device; After the punching device punches the first area of ​​the substrate to be punched once, the second suction device moves the substrate to be punched by a first preset distance, and the punching device punches the first area of ​​the substrate to be punched twice to form a first pre-cutting unit; the second suction device moves the substrate to be punched by a second preset distance, and after the punching device punches the second area of ​​the substrate to be punched once, the second suction device moves the substrate to be punched by the first preset distance, and the punching device punches the second area of ​​the substrate to be punched twice to form a second pre-cutting unit; repeat the above process to form a plurality of pre-cutting units; The second suction device sucks the punched substrate to be punched onto the third unloading table.

[0011] On the other hand, a circuit board manufacturing device according to an embodiment of the present invention includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the circuit board manufacturing method described in the above-mentioned embodiment.

[0012] On the other hand, an electronic device according to an embodiment of the present invention includes: A memory for storing program instructions; The processor is used to call the program instructions stored in the memory and execute the circuit board manufacturing method of the above embodiment according to the obtained program instructions.

[0013] On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the method for manufacturing a circuit board described in the above embodiment.

[0014] The circuit board manufacturing method, device, electronic device, and storage medium according to the embodiments of the present invention have at least the following beneficial effects: by applying a protective film on a semi-finished circuit board through an automatic film-applying device, the film-applying efficiency can be improved. At the same time, by applying the protective film first and then performing laser window opening, the window opening accuracy can be improved, thereby avoiding the problem of low film-applying accuracy caused by the method of first opening the window and then applying the film; by using a punching device to punch the substrate to be punched, the substrate to be punched is divided into multiple pre-cut units, thereby facilitating the subsequent division of a substrate into multiple products.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 A flowchart of the steps of a method for manufacturing a circuit board according to an embodiment of the present invention; Figure 2 A flowchart of the film-sticking process according to an embodiment of the present invention; Figure 3 It is a structural schematic diagram of an automatic film sticking device according to an embodiment of the present invention; Figure 4 A structural schematic diagram of an automatic film sticking device according to an embodiment of the present invention from a certain perspective; Figure 5 A structural schematic diagram of an automatic film sticking device according to an embodiment of the present invention from a certain perspective; Figure 6 A structural schematic diagram of an automatic film sticking device according to an embodiment of the present invention from a certain perspective; Figure 7 It is a structural schematic diagram of a punching and cutting device according to an embodiment of the present invention; Figure 8 A schematic structural diagram of a substrate to be punched according to an embodiment of the present invention; Reference numerals: Automatic film laminating equipment 100, feeding mechanism 200, first unloading platform 210, limiting device 211, first moving device 220, lifting and adsorption device 230, separation mechanism 300, conveying platform 310, second moving device 320, rotating lifting device 330, separation roller 340, collecting device 350, rotating rod 351, telescopic plate 352, rotating plate 353, material receiving platform 360, grasping device 370, laminating mechanism 400, second unloading platform 410, first manipulator device 420, first clamping assembly 421 , a second clamping assembly 422, a third moving device 430, a pressing platform 440, a second manipulator device 450, an adsorption assembly 460, a material unloading mechanism 500, a material unloading platform 510, a punching device 600, a frame 610, a lifting platform 620, a positioning device 621, a punching device 630, a third unloading table 640, a first suction device 650, a second suction device 660, a substrate to be punched 700, a first area 710, a second area 720, a third area 730, a pre-cutting unit 740, and a pre-cutting opening 741. DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. For the step numbers in the following embodiments, they are only provided for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0018] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0020] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] In order to achieve the needs of contact and welding of the circuit board, it is necessary to set a pad on the circuit board. At the same time, in order to protect the circuit board, it is also necessary to cover the circuit board with a protective film. In order to prevent the protective film from affecting the exposure of the pad, in the prior art, it is usually necessary to first open the corresponding position on the protective film according to the size of the pad, and then stick the opened protective film on the circuit board to protect the circuit board and expose the position of the pad. However, this method is not suitable for some products with high precision requirements, and it is easy to have the problem of inaccurate fitting position of the protective film.

[0022] To this end, the embodiments of the present invention provide a method, device, electronic device and storage medium for manufacturing a circuit board. By using automatic film laminating equipment to affix a protective film to a semi-finished circuit board, the film laminating efficiency can be improved. At the same time, by affixing the protective film first and then performing laser window opening, the window opening accuracy can be improved, thereby avoiding the problem of low film laminating accuracy caused by the method of first opening the window and then laminating the film. By using a punching device to punch the substrate to be punched, the substrate to be punched is divided into multiple pre-cut units, thereby facilitating the subsequent division of a substrate into multiple products.

[0023] The following is combined with Figure 1-8 , describes in detail the circuit board manufacturing method, device, electronic device and storage medium of the embodiment of the present invention.

[0024] On the one hand, an embodiment of the present invention provides a method for manufacturing a circuit board, such as Figure 1 As shown, the method comprises the following steps: Step S100: obtaining a semi-finished circuit board; Step S200: applying a protective film to the semi-finished circuit board by the automatic film-applying device 100; Step S300: laser-cutting windows on the protective film of the semi-finished circuit board according to the pad positions of the semi-finished circuit board to expose the pads; Step S400: performing surface treatment on the pad to form a substrate 700 to be punched; Step S500 : punching the substrate 700 to be punched by the punching device 600 to divide the semi-finished circuit board into a plurality of pre-cut units 740 .

[0025] It should be noted that a semi-finished circuit board refers to a circuit board that has completed the production of circuits, pads, etc., and it is necessary to cover the semi-finished circuit board with a protective film to protect the semi-finished circuit board.

[0026] like Figure 3 As shown, in some embodiments of the present invention, the automatic film laminating device 100 includes a loading mechanism 200, a separation mechanism 300, a laminating mechanism 400 and a unloading mechanism 500; Figure 2 As shown, the above step S200: the step of applying a protective film on the semi-finished circuit board by the automatic film applying device 100 includes the following four steps: Step S210: loading the film to be processed by the loading mechanism 200; the film to be processed includes a release paper and a protective film arranged on the surface of the release paper; Step S220: Separating the protective film from the release paper by the separation mechanism 300, and removing the release paper; Step S230: laminating the protective film on the semi-finished circuit board by the laminating mechanism 400; Step S240: unloading the semi-finished circuit board after film lamination through the unloading mechanism 500.

[0027] It should be noted that the film to be processed is usually composed of a protective film and a release paper. The protective film is pasted on the release paper, and the release paper plays a role in fixing and protecting the protective film. When the protective film is to be pasted on the semi-finished circuit board, the release paper needs to be removed first before the protective film can be pasted on the semi-finished circuit board. The embodiment of the present invention realizes automatic film pasting through an automatic film pasting device 100.

[0028] Specifically, Figure 4As shown, in some embodiments of the present invention, the loading mechanism 200 includes a first unloading platform 210, a first moving device 220 and a lifting and adsorption device 230, a limiting device 211 is provided on the first unloading platform 210, the first moving device 220 is located above the first unloading platform 210, and the lifting and adsorption device 230 is provided on the first moving device 220. It should be noted that in order for the automatic film-sticking device 100 to realize automatic film-sticking, it is necessary to first place the film to be processed on the first unloading platform 210, and multiple films to be processed can be placed at one time. In this example, the limiting device 211 includes a plurality of limiting columns. By placing limiting columns around the first unloading platform 210, the positioning of the film to be processed can be achieved, so that the lifting and adsorption device 230 can grab the film to be processed. The first moving device 220 includes a first slide rail arranged in the front-to-back direction and a sliding mechanism arranged on the first slide rail. When the sliding mechanism moves along the first slide rail, the lifting and adsorption device 230 can be driven to move forward and backward. The lifting and adsorption device 230 includes a lifting component and a suction cup. The lifting component can be a cylinder or other device to drive the suction cup to move up and down, and the suction cup is used to adsorb the film to be processed. In this example, the above step S210: loading the film to be processed through the loading mechanism 200 includes the following three steps: (1) Placing a plurality of films to be processed on the first unloading table 210, and limiting the plurality of films to be processed by a limiting device 211; (2) After the lifting adsorption device 230 descends and adsorbs the topmost film to be processed, the lifting adsorption device 230 is lifted and lowered multiple times to shake the adsorbed film to be processed; (3) The first moving device 220 drives the lifting and adsorption device 230 to move, so that the lifting and adsorption device 230 transfers the adsorbed film to be processed to the separation mechanism 300 .

[0029] It should be noted that after placing multiple films to be processed on the first unloading table 210, the first moving device 230 drives the lifting and adsorption device 230 to move above the films to be processed, and then the lifting component of the lifting and adsorption device 230 drives the suction cup to descend, so that the suction cup adsorbs the topmost film to be processed, and the lifting component drives the suction cup to rise and fall multiple times in situ, thereby shaking the adsorbed film to be processed to prevent multiple films to be processed from sticking together, thereby causing the suction cup to absorb multiple films to be processed at the same time. After the lifting and adsorption device 230 adsorbs a film to be processed, the first moving device 220 drives the lifting and adsorption device 230 to move toward the separation mechanism 300, and transmits the adsorbed film to be processed to the separation mechanism 300.

[0030] like Figure 5As shown, in some embodiments of the present invention, the separation mechanism 300 includes a conveying platform 310, a second moving device 320, a rotating lifting device 330, a viscous separation roller 340, a material collecting device 350, a material receiving platform 360 and a movable grabbing device 370, the second moving device 320 is located above the conveying platform 310, the rotating lifting device 330 is arranged on the second moving device 320, the separation roller 340 is arranged on the rotating lifting device 330, the material collecting device 350 is arranged between the conveying platform 310 and the material receiving platform 360, and the movable grabbing device 370 is located above the material receiving platform 360. When the lifting and adsorption device 230 absorbs the film to be processed, the film to be processed will be placed on the conveying platform 310, and the conveying platform 310 will drive the film to be processed to move in the direction of the material receiving platform 360. When the film to be processed is conveyed to the edge of the conveying platform 310, the film to be processed stops moving further. At this time, the second moving device 320 will drive the rotating lifting device 330 to move above the film to be processed. Subsequently, the rotating lifting device 330 drives the separation roller 340 to descend to the surface of the film to be processed. The second moving device 320 drives the rotating lifting device 330 to move back and forth, so that the separation roller 340 rolls back and forth on the surface of the film to be processed. Since the separation roller 340 is sticky, the protective film can be stuck together by the separation roller 340 rolling back and forth on the surface of the film to be processed, so that the protective film is separated from the release paper at the bottom. Subsequently, the collecting device 350 receives the release paper, and the grabbing device 370 moves toward the conveying platform 310 and grabs the protective film to the receiving platform 360. The receiving platform 360 vacuum adsorbs the protective film. In this example, the above-mentioned step S220: loading the film to be processed through the loading mechanism 200 includes the following three steps: (1) The conveying platform 310 obtains the film to be processed conveyed by the loading mechanism 200, and drives the film to be processed to move toward the receiving platform 360 to a preset position; (2) The second moving device 320 drives the rotating lifting device 330 to move above the film to be processed, and the rotating lifting device 330 drives the separation roller 340 to descend to the surface of the film to be processed. The second moving device 320 drives the separation roller 340 to roll back and forth to separate the release paper from the protective film; (3) The collecting device 350 receives the release paper, and the grabbing device 370 moves toward the conveying platform 310 and grabs the protective film to the collecting platform 360, and the collecting platform 360 performs vacuum adsorption on the protective film.

[0031] It should be noted that the grabbing device 370 includes a second slide rail arranged along the front-back direction and a clamping claw arranged on the second slide rail. When the release paper and the protective film are separated, the grabbing device 370 will approach the protective film along the second slide rail, grab the protective film with the clamping claw, and then move back to the material receiving platform 360 to place the protective film on the material receiving platform 360. The material receiving platform 360 is provided with a vacuum adsorption device, which can vacuum adsorb the protective film to prevent the protective film from moving.

[0032] like Figure 5 As shown, in some embodiments of the present invention, the material collecting device 350 includes a rotating rod 351, a rotating pressure rod (not shown), a telescopic plate 352 and a collection frame (not shown), wherein the two ends of the rotating rod 351 are respectively provided with a rotating plate 353, the two ends of the rotating pressure rod are respectively connected to the two rotating plates, the collection frame is located below the rotating rod, the telescopic plate 352 is located between the conveying platform 310 and the material receiving platform 360, and the rotating rod 351 is located between the conveying platform 310 and the telescopic plate 352. In this example, the above-mentioned: the material collecting device 350 receives the release paper, the grabbing device 370 moves toward the conveying platform 310 and grabs the protective film to the material receiving platform 360, and the material receiving platform 360 performs vacuum adsorption on the protective film, includes the following three steps: (1) The rotating plate 353 drives the rotating pressure rod to rotate between the release paper and the protective film, pressing the release paper downward so that the release paper bypasses the rotating rod 351; (2) The telescopic plate 352 extends to connect with the conveying platform 310, the rotating rod 351 rotates to convey the release paper into the collection frame, and the conveying platform 310 conveys the protective film onto the telescopic plate 352; (3) The grabbing device 370 moves toward the telescopic plate 352 and grabs the protective film onto the receiving platform 360 , and the receiving platform 360 performs vacuum adsorption on the protective film.

[0033] It should be noted that, when the release paper and the protective film are separated, the rotating rod 351 will drive the rotating pressure rod to rotate counterclockwise, so that it rotates between the release paper and the protective film, and presses the release paper downward, so that the release paper is located between the rotating rod 351 and the rotating pressure rod. At this time, the rotating rod 351 rotates, and the release paper is rolled down by the rotating rod 351 and finally falls into the collection frame. Then, the conveying platform 310 conveys the protective film to the telescopic plate 352, and the grabbing device 370 moves along the second slide rail to the telescopic plate 352, grabs the protective film with the clamp, and then returns to the top of the receiving platform 360 to place the protective film on the receiving platform 360.

[0034] like Figure 6As shown, in some embodiments of the present invention, the laminating mechanism 400 includes: a second unloading platform 410, a first manipulator device 420, a third moving device 430, a pressing platform 440, a second manipulator device 450 and a positioning identification device (not shown), the first manipulator device 420 is provided with a first clamping component 421 and a second clamping component 422, the second manipulator device 450 is provided with a rotatable adsorption component 460, and the pressing platform 440 is arranged on the third moving device 430. The unloading mechanism 500 includes a unloading platform 510, and the unloading platform 510 and the second unloading platform 410 are respectively located on both sides of the third moving device 430. Among them, the second unloading table 410 is used to place semi-finished circuit boards; the third moving device 430 can drive the pressing platform 440 to move in the front and rear directions. When the semi-finished circuit board is to be placed on the pressing platform 440, the third moving device 430 moves the pressing platform 440 to one end close to the second unloading table 410, and then, the first clamping component 421 will grab the semi-finished circuit board and move it to the pressing platform 440, and then, the third moving device 430 will move the pressing platform 440 to one end close to the second manipulator device 450, and the second manipulator device 450 grabs the protective film from the receiving platform 360 through the adsorption component 460. At this time, the receiving platform 360 stops vacuum adsorption, and then, the second manipulator device 450 drives the adsorption component 460 to move to the top of the pressing platform 440, and adheres the protective film to the semi-finished circuit board on the pressing platform 440, thereby completing the film pasting of the semi-finished circuit board. In this example, the above step S230: laminating the protective film on the semi-finished circuit board by the laminating mechanism 400 includes the following five steps: (1) Placing the semi-finished circuit board on the second unloading table 410; (2) The first manipulator device 420 clamps the semi-finished circuit board onto the pressing platform 440 through the first clamping assembly 421; (3) The third moving device 430 drives the pressing platform 440 to approach the second manipulator device 450; (4) The second manipulator device 450 absorbs the protective film from the separation mechanism 300 through the adsorption component 460, and positions the semi-finished circuit board on the pressing platform 440 through the positioning recognition device, and adjusts the position of the protective film through the adsorption component 460; (5) The second robot device 450 presses the protective film on the adsorption component 460 onto the semi-finished circuit board.

[0035] It should be noted that in order to ensure the accuracy of the film's position, the semi-finished circuit board needs to be positioned using a positioning and identification device before the film is applied; at the same time, the adsorption component 460 grabs the protective film from the material receiving platform 360 and needs to be rotated to a suitable angle to properly stick the protective film on the circuit board.

[0036] In this example, the above step S240: unloading the semi-finished circuit board after film lamination by the unloading mechanism 500 includes the following two steps: (1) The third moving device 430 drives the pressing platform 440 to approach the unloading platform 510; (2) The first manipulator device 420 clamps the unfilmed semi-finished circuit board on the second unloading platform 410 through the first clamping component 421, and the second clamping component 422 places the semi-finished circuit board on the pressing platform 440 on the unloading platform 510. At the same time, the first clamping component 421 places the unfilmed semi-finished circuit board on the pressing platform 440.

[0037] It should be noted that the first manipulator device 420 is provided with a first clamping assembly 421 and a second clamping assembly 422. When the first clamping assembly 421 moves to the top of the pressing platform 440, the second clamping assembly 422 is just located above the unloading platform 510. With such a setting, when the previous semi-finished circuit board is finished with film pasting, the first clamping assembly 421 will grab a semi-finished circuit board without film pasting from the second unloading platform 410, and the second clamping assembly 422 will grab the semi-finished circuit board with film pasting from the pressing platform 440 at the same time. Subsequently, the first clamping assembly 421 and the second clamping assembly 422 move to the left together, the first clamping assembly 421 is located above the pressing platform 440, and the semi-finished circuit board without film pasting is placed on the pressing platform 440, and the second clamping assembly 422 is located above the unloading platform 510, and the semi-finished circuit board with film pasting is placed on the unloading platform 510. Through such an arrangement, the efficiency of loading and unloading semi-finished circuit boards is greatly improved, thereby improving production efficiency.

[0038] After the film is applied to the semi-finished circuit board, in order to avoid affecting the connection between the pads of the semi-finished circuit board and external components, it is necessary to laser open windows on the protective film of the semi-finished circuit board according to the pad positions of the semi-finished circuit board to expose the pads. Then, the pads need to be surface treated, such as nickel plating and gold plating, to protect the pads. The final circuit board is the substrate to be punched 700. Subsequently, the substrate to be punched 700 needs to be punched by the punching device 600 to divide the substrate to be punched 700 into a plurality of pre-cut units 740.

[0039] like Figure 7As shown, in some embodiments of the present invention, the punching device 600 includes a frame 610, on which a lifting platform 620, a punching device 630 and a third unloading platform 640 are sequentially arranged, a first suction device 650 is arranged above the lifting platform 620, a second suction device 660 is arranged above the third unloading platform 640, and a positioning device 621 is arranged on the lifting platform 620. Among them, the lifting platform 620 is used to place the substrate 700 to be punched, and the substrate 700 to be punched is positioned by the positioning device 621. In this example, the positioning device 621 includes a positioning pin, and the positioning pin passes through the positioning hole (not shown) of the substrate 700 to be punched to achieve the positioning of the substrate 700 to be punched. After the substrate 700 to be punched is placed, the lifting platform 620 rises to facilitate the first suction device 650 to grab the substrate 700 to be punched and place it on the punching device 630 for punching. The second suction device 660 is used to place the punched substrate 700 on the third unloading platform 640. In this example, the above step S500: punching the substrate 700 to be punched by the punching device 600 to divide the substrate 700 to be punched into a plurality of pre-cut units 740 includes the following four steps: (1) Placing the substrate to be punched on the lifting platform 620 according to the positioning of the positioning device 621; (2) The lifting platform 620 rises, and the first suction device 650 sucks the substrate to be punched from the lifting platform 620 and places it on the punching device 630; (3) After the punching device 630 punches the first area 710 of the substrate to be punched 700 once, the second suction device 660 moves the substrate to be punched 700 by a first preset distance, and the punching device 630 punches the first area 710 of the substrate to be punched a second time to form a plurality of first pre-cut units; the second suction device 660 moves the substrate to be punched 700 by a second preset distance, and after the punching device 630 punches the second area 720 of the substrate to be punched once, the second suction device 660 moves the substrate to be punched 700 by a first preset distance, and the punching device 630 punches the second area 720 of the substrate to be punched a second time to form a plurality of second pre-cut units; the above process is repeated to form a plurality of pre-cut units 740; (4) The second suction device 660 sucks the plurality of punched substrates 700 onto the third unloading platform 640 .

[0040] like Figure 8As shown, in this example, the substrate to be punched 700 is composed of multiple circuit units, each of which can be used as a separate product. By punching the substrate to be punched, pre-cut openings 741 can be formed on both sides of each circuit unit, thereby forming multiple pre-cut units 740, which is convenient for later dividing a whole substrate to be punched 700 into multiple products. Since the area of ​​the substrate to be punched 700 is large, and the punching die of the punching device 630 can punch a limited area each time, it is necessary to divide the substrate to be punched 700 into multiple areas, such as Figure 8 As shown, in this example, the substrate 700 to be punched is divided into a first area 710, a second area 720 and a third area 730, each area including a plurality of circuit units. At the same time, since pre-cut openings 741 need to be formed on both sides of each circuit unit, and the distance between the two sides of each circuit unit is relatively close, but the distance between adjacent punching dies of the punching device 630 cannot be too close, the punching device 630 cannot simultaneously cut two pre-cut openings 741 at such a close distance. To this end, after the punching device 630 punches the first area 710 of the substrate 700 to be punched once, a pre-cut opening 741 is formed on one side of each circuit unit in the first area 710. Then, the second suction device 660 moves the substrate 700 to be punched a first preset distance (the first preset distance is equal to the spacing between the pre-cut openings on both sides of a circuit unit), so that the punching device 630 punches the first area 710 of the substrate 700 to be punched a second time, thereby forming a pre-cut opening 741 on the other side of each circuit unit in the first area 710. Pre-cut openings 741 are formed on both sides of each pre-cut unit 740 in the first area 710 through two punchings. Subsequently, the second suction device 660 moves the substrate to be punched 700 by a second preset distance (the second preset distance is equal to the spacing between two adjacent areas), and the punching device 630 punches the second area 720 of the substrate to be punched 700 twice, and the punching process is the same as that of the first area 710, thereby forming a plurality of second pre-cutting units; the above process is repeated to form a plurality of pre-cutting units, and the punching of the substrate to be punched 700 is completed.

[0041] According to the method for manufacturing a circuit board of an embodiment of the present invention, a protective film is applied to a semi-finished circuit board by an automatic film applying device 100, so that the film applying efficiency can be improved. At the same time, applying the protective film first and then performing laser window opening can improve the accuracy of window opening, thereby avoiding the problem of low film applying accuracy caused by the method of first opening the window and then applying the film. The substrate 700 to be punched is punched by a punching device 600, and the substrate 700 to be punched is divided into a plurality of pre-cut units 740, so as to facilitate the subsequent division of a substrate into a plurality of products.

[0042] On the other hand, an embodiment of the present invention further provides a circuit board manufacturing device, comprising: The processor may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory can store an operating system and other application programs. When the technical solution provided in the embodiments of this specification is implemented by software or firmware, the relevant program code is stored in the memory, and the processor is called to execute the method for manufacturing a circuit board in the embodiments of this application.

[0043] On the other hand, an embodiment of the present invention further provides an electronic device, including the circuit board manufacturing device as described above.

[0044] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the method for manufacturing the circuit board is implemented.

[0045] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0046] It will be appreciated by those skilled in the art that all or some of the steps and systems in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0047] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that: The following steps are involved: Obtain semi-finished circuit boards; Laminating a protective film on the semi-finished circuit board by an automatic laminating device; the automatic laminating device comprises a loading mechanism, a separating mechanism, a laminating mechanism and a unloading mechanism; According to the pad position of the semi-finished circuit board, laser opening is performed on the protective film of the semi-finished circuit board to expose the pad; Performing surface treatment on the pad to form a substrate to be punched; Punching the substrate to be punched by a punching device to divide the substrate to be punched into a plurality of pre-cut units; The step of attaching a protective film to the semi-finished circuit board by an automatic film attaching device includes: The film to be processed is loaded by the loading mechanism; the film to be processed comprises a release paper and the protective film arranged on the surface of the release paper; Separating the protective film from the release paper by the separation mechanism, and removing the release paper; Laminating the protective film on the semi-finished circuit board by the laminating mechanism; The semi-finished circuit board after film pasting is unloaded by the unloading mechanism.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The feeding mechanism comprises a first unloading platform, a first moving device and a lifting and adsorption device, a limiting device is arranged on the first unloading platform, the first moving device is located above the first unloading platform, and the lifting and adsorption device is arranged on the first moving device. The step of feeding the film to be processed by the feeding mechanism comprises: Placing a plurality of the films to be processed on the first unloading table, and limiting the plurality of the films to be processed by the limiting device; After the lifting and adsorption device descends and adsorbs the topmost film to be processed, the lifting and adsorption device is lifted and lowered multiple times to shake the adsorbed film to be processed; The first moving device drives the lifting and adsorption device to move, so that the lifting and adsorption device transfers the adsorbed film to be processed to the separation mechanism.

3. The method for manufacturing a circuit board according to claim 1, characterized in that: The separation mechanism includes a conveying platform, a second moving device, a rotating lifting device, a viscous separation roller, a material collecting device, a material receiving platform and a movable grabbing device, wherein the second moving device is located above the conveying platform, the rotating lifting device is arranged on the second moving device, the separation roller is arranged on the rotating lifting device, the material collecting device is arranged between the conveying platform and the material receiving platform, and the grabbing device is located above the material receiving platform; The step of separating the protective film from the release paper by the separation mechanism and removing the release paper comprises: The conveying platform obtains the film to be processed conveyed by the feeding mechanism, and drives the film to be processed to move to a preset position in the direction of the receiving platform; The second moving device drives the rotating lifting device to move above the film to be processed, the rotating lifting device drives the separation roller to descend to the surface of the film to be processed, and the second moving device drives the separation roller to roll back and forth to separate the release paper from the protective film; The collecting device receives the release paper, the grabbing device moves toward the conveying platform and grabs the protective film onto the collecting platform, and the collecting platform performs vacuum adsorption on the protective film.

4. The method for manufacturing a circuit board according to claim 3, characterized in that: The material collecting device comprises a rotating rod, a rotating pressure rod, a telescopic plate and a collecting frame, wherein the two ends of the rotating rod are respectively provided with rotating plates, the two ends of the rotating pressure rod are respectively connected to the two rotating plates, the collecting frame is located below the rotating rod, the telescopic plate is located between the conveying platform and the material receiving platform, and the rotating rod is located between the conveying platform and the telescopic plate; The collecting device receives the release paper, the grabbing device moves toward the conveying platform and grabs the protective film onto the collecting platform, and the collecting platform vacuum adsorbs the protective film, including: The rotating plate drives the rotating pressure rod to rotate between the release paper and the protective film, and presses the release paper downward, so that the release paper bypasses the rotating rod; The telescopic plate extends to connect with the conveying platform, the rotating rod rotates to convey the release paper into the collecting frame, and the conveying platform conveys the protective film onto the telescopic plate; The grabbing device moves toward the telescopic plate and grabs the protective film onto the material receiving platform, and the material receiving platform performs vacuum adsorption on the protective film.

5. The method for manufacturing a circuit board according to claim 1, characterized in that: The laminating mechanism comprises: a second unloading table, a first manipulator device, a third moving device, a laminating platform, a second manipulator device and a positioning identification device, wherein the first manipulator device is provided with a first clamping component and a second clamping component, the second manipulator device is provided with a rotatable adsorption component, and the laminating platform is provided on the third moving device; The step of laminating the protective film on the semi-finished circuit board by the laminating mechanism includes: Placing the semi-finished circuit board on the second unloading table; The first manipulator device clamps the semi-finished circuit board onto the pressing platform through the first clamping assembly; The third moving device drives the pressing platform to approach the second manipulator device; The second manipulator device absorbs the protective film from the separation mechanism through the adsorption component, positions the semi-finished circuit board on the pressing platform through the positioning identification device, and rotates the protective film through the adsorption component; The second robot device presses the protective film on the adsorption component onto the semi-finished circuit board.

6. The method for manufacturing a circuit board according to claim 5, characterized in that: The unloading mechanism comprises an unloading platform, and the unloading platform and the second unloading platform are respectively located on both sides of the third moving device; The step of unloading the semi-finished circuit board after film lamination by the unloading mechanism comprises: The third moving device drives the pressing platform to approach the unloading platform; The first manipulator device clamps the semi-finished circuit board without film on the second unloading table through the first clamping component, and the second clamping component places the semi-finished circuit board on the pressing platform on the unloading platform. At the same time, the first clamping component places the semi-finished circuit board without film on the pressing platform.

7. The method for manufacturing a circuit board according to claim 1, characterized in that: The punching and cutting equipment comprises a frame, on which a lifting platform, a punching and cutting device and a third unloading platform are sequentially arranged, a first suction device is arranged above the lifting platform, a second suction device is arranged above the third unloading platform, and a positioning device is arranged on the lifting platform; The step of punching the substrate to be punched by a punching device to divide the substrate to be punched into a plurality of pre-cut units comprises: Placing the substrate to be punched on the lifting platform according to the positioning of the positioning device; The lifting platform rises, and the first suction device sucks the substrate to be punched from the lifting platform, and places the substrate to be punched on the punching device; After the punching device punches the first area of ​​the substrate to be punched once, the second suction device moves the substrate to be punched by a first preset distance, and the punching device punches the first area of ​​the substrate to be punched twice to form a first pre-cutting unit; the second suction device moves the substrate to be punched by a second preset distance, and after the punching device punches the second area of ​​the substrate to be punched once, the second suction device moves the substrate to be punched by the first preset distance, and the punching device punches the second area of ​​the substrate to be punched twice to form a second pre-cutting unit; repeat the above process to form a plurality of pre-cutting units; The second suction device sucks the punched substrate to be punched onto the third unloading table.

8. A circuit board manufacturing device, characterized in that: It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the circuit board manufacturing method as described in any one of claims 1 to 7.

9. An electronic device, characterized in that: A device for manufacturing a circuit board comprising the device described in claim 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the method for manufacturing a circuit board as described in any one of claims 1 to 7.

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