Easily disintegrable thermosetting resin composition and disintegration method

Abstract

The easily detachable thermosetting resin composition contains a thermosetting component, and a cured product obtained by thermally curing the thermosetting resin composition has a structure represented by formula (1).

Description

Technical Field

[0001] The present invention relates to an easily disassembled thermosetting resin composition and a disassembly method. More specifically, the present invention relates to an easily disassembled thermosetting resin composition, a structure including a cured product of the easily disassembled thermosetting resin composition, a semiconductor device including a cured product of the easily disassembled thermosetting resin composition, a disassembly method of the cured product of the easily disassembled thermosetting resin composition, and a method for recovering materials constituting the structure. Background Art

[0002] In recent years, from the perspective of lightweighting, there is a trend that lightweight metals such as aluminum, resins, etc., such as structures of automobiles, are used to replace iron, and the composite of these metals with cured products of thermosetting resins is progressing. On the other hand, in order to promote the effective use of resources such as metals, research and development for separating and recovering metals and the like from waste materials of composite parts used in automobiles and the like and for reuse is actively being carried out. Therefore, it is important to remove cured products of thermosetting resins from composite parts to recover metals while suppressing damage to the metals.

[0003] For example, Patent Document 1 discloses a treatment liquid that can efficiently decompose and dissolve a cured product of a thermosetting resin composition at low temperature in order to recover carbon fibers from carbon fiber reinforced plastics that use carbon fibers as reinforcing materials, or to recover semiconductor elements from semiconductor packages obtained by sealing semiconductor elements with cured epoxy resins (sealing resins).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2020-50689 Summary of the invention

[0007] Technical problem to be solved by the invention

[0008] However, the method for decomposing a cured product of a thermosetting resin composition as disclosed in Patent Document 1 focuses on a treatment liquid for decomposition, but does not disclose a technical concept regarding the decomposability or disintegrability of the thermosetting resin composition itself.

[0009] The inventors of the present invention have conducted intensive studies focusing on the disassembly property of the thermosetting resin composition itself and have found that it is effective for the cured product of the thermosetting resin composition to have a predetermined structure. That is, it is considered that when the cured product of the thermosetting resin composition is subjected to a solution treatment, the predetermined structural portion becomes easily detached, and the network in the cured product is broken, so that the cured product is easily disassembled.

[0010] Means for solving technical problems

[0011] The present invention provides the following easily disassembled thermosetting resin composition, a structure comprising a cured product of the easily disassembled thermosetting resin composition, a semiconductor device comprising a cured product of the easily disassembled thermosetting resin composition, a method for disassembling the cured product of the easily disassembled thermosetting resin composition, and a method for recovering materials constituting the structure.

[0012] [1] An easily dismantling thermosetting resin composition comprising a thermosetting component, wherein a cured product obtained by thermally curing the easily dismantling thermosetting resin composition has a structure represented by the following formula (1).

[0013]

[0014] In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0015] [2] The easily disassembled thermosetting resin composition according to [1], wherein the thermosetting component has a -Si-O- structure.

[0016] [3] The easily disassembled thermosetting resin composition according to [1] or [2], wherein the thermosetting component comprises a thermosetting resin and a curing agent, and both the thermosetting component and the curing agent have a -Si-O- structure.

[0017] [4] The easily disassembled thermosetting resin composition according to [1] or [2], wherein the thermosetting component contains a thermosetting resin and a curing agent, and the curing agent has a -Si-O- structure.

[0018] [5] The easily disassembled thermosetting resin composition according to [1] or [2], wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the thermosetting resin has a -Si-O- structure.

[0019] [6] The easily disassembled thermosetting resin composition according to any one of [3] to [5], wherein the curing agent includes a phenolic curing agent.

[0020] [7] The easily disintegratable thermosetting resin composition according to any one of [3] to [6], wherein the thermosetting resin comprises one or more selected from epoxy resins, phenoxy resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, cyanate resins, bismaleimide resins and acrylic resins.

[0021] [8] The easily disassembled thermosetting resin composition according to [7], wherein the thermosetting resin contains an epoxy resin.

[0022] [9] The easily disassembled thermosetting resin composition according to any one of [1] to [8], further comprising an inorganic filler, wherein the content of the inorganic filler is 10 to 98% by mass based on the total amount of the easily disassembled thermosetting resin composition.

[0023]

[10] The easily disassembled thermosetting resin composition according to any one of [1] to [9], comprising a silyl ether-modified novolac resin.

[0024]

[11] The easily disassembleable thermosetting resin composition according to any one of [1] to

[10] , comprising a phenolic resin having a weight average molecular weight (Mw) of 500 to 10,000.

[0025]

[12] A structure comprising a cured product of the easily disassembled thermosetting resin composition according to any one of [1] to

[11] .

[0026]

[13] A semiconductor device comprising: a semiconductor element; and a sealing material for sealing the semiconductor element, wherein the sealing material is formed from a cured product of the easily disassembled thermosetting resin composition according to any one of [1] to

[11] .

[0027]

[14] A disassembly method, which is a method for disassembling a cured product of an easily disassemblyable thermosetting resin composition according to any one of [1] to

[11] , comprising: immersing the cured product of the easily disassemblyable thermosetting resin composition in a solvent to disassemble the cured product.

[0028]

[15] The disassembly method according to

[14] , wherein the solvent is a solvent containing fluoride ions.

[0029]

[16] The disassembly method according to

[14] or

[15] , wherein the immersion is performed at -20 to 200°C.

[0030]

[17] The disassembly method according to any one of

[14] to

[16] , wherein the immersion is performed at 5 to 30°C.

[0031]

[18] A recycling method, which is a method for recycling materials constituting the structure described in

[12] , comprising: a step of immersing the structure in a solvent to disintegrate the cured product of the easily disintegratable thermosetting resin composition; and a step of recovering the material from the structure.

[0032] Effects of the Invention

[0033] According to the present invention, the easy disassembly property of the cured product of the thermosetting resin composition can be utilized to improve the recyclability of resources. DETAILED DESCRIPTION

[0034] In this specification, the expression "a to b" in the description of a numerical range means a or more and b or less unless otherwise specified. For example, "1 to 5 mass %" means "1 mass % or more and 5 mass % or less". In addition, the lower limit and upper limit of a numerical range can be arbitrarily combined with the lower limit and upper limit of other numerical ranges, respectively.

[0035] Each component and material exemplified in the present specification may be used alone or in combination of two or more unless otherwise specified.

[0036] In the description of the group (atomic group) in this specification, the description that does not record substitution or unsubstituted includes both the group without a substituent and the group with a substituent. For example, "alkyl" includes not only the alkyl group without a substituent (unsubstituted alkyl group) but also the alkyl group with a substituent (substituted alkyl group).

[0037] Furthermore, in the description of the group (atomic group) in the present specification, even if the description of linear, branched, or cyclic is not described, any of the linear, branched, or cyclic structures may be used.

[0038] The term "organic group" in this specification refers to an atomic group obtained by removing one or more hydrogen atoms from an organic compound unless otherwise specified. For example, a "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound.

[0039] Hereinafter, embodiments of the present invention will be described in detail.

[0040] 1. Easily disintegratable thermosetting resin composition

[0041] The easily disintegratable thermosetting resin composition (hereinafter also referred to as "resin composition") of this embodiment contains a thermosetting component, and a cured product obtained by thermally curing the resin composition has a structure represented by the following formula (1). The thermal curing conditions are preferably 175°C and 2 minutes.

[0042]

[0043] (In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.)

[0044] Thus, when the cured product of the resin composition of this embodiment is subjected to solution treatment, the structure of formula (1) is released, and the crosslinked structure in the cured product collapses, thereby achieving easy disassembly. The structure of formula (1) can be generated by a thermal curing reaction of a thermosetting component.

[0045] In the present embodiment, “easy disintegrability” means that when the solidified material is subjected to a solution treatment, the solidified material undergoes gel decomposition and becomes soluble.

[0046] And, the presence or absence of the structure represented by the formula (1) in the solidified material, for example, can be confirmed by the common analytical methods such as gas chromatography, high performance liquid chromatography, thin layer chromatography, NMR, IR. The analysis object when confirming can be the state of the solidified material, or it can be the decomposition liquid after the solidified material is decomposed. From the viewpoint that can be confirmed according to the state of the solidified material, preferably gas chromatography-mass spectrometry (GC-MS). And, from the viewpoints such as being easy to distinguish with the structure based on the coupling agent described later, the analysis object can also be set to the decomposition treatment liquid of the solidified material.

[0047] Furthermore, the cured product of the present embodiment preferably has a structure of formula (1) as a repeating unit. The number of repetitions is not particularly limited, and the average number of repetitions may be 5 to 1,500.

[0048] In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0049] The hydrocarbon group having 1 to 30 carbon atoms may be linear, branched or cyclic, and may or may not have a substituent.

[0050] The hydrocarbon group having 1 to 30 carbon atoms is preferably a linear alkyl group, alkenyl group or alkynyl group having 1 to 20 carbon atoms, and more preferably a linear alkyl group, alkenyl group or alkynyl group having 1 to 10 carbon atoms.

[0051] The branched hydrocarbon group having 3 to 20 carbon atoms is preferably a branched alkyl group, alkenyl group or alkynyl group having 3 to 20 carbon atoms, more preferably a branched alkyl group, alkenyl group or alkynyl group having 3 to 10 carbon atoms, and further preferably a branched alkyl group, alkenyl group or alkynyl group having 3 to 6 carbon atoms.

[0052] The cyclic hydrocarbon group having 3 to 20 carbon atoms is preferably a cycloalkyl group, cycloalkenyl group or cycloalkynyl group having 3 to 20 carbon atoms, and more preferably a cycloalkenyl group or cycloalkynyl group having 5 to 10 carbon atoms. Specific examples thereof include cyclopropyl group, cyclobutyl group, cyclopentyl group and cyclohexyl group.

[0053] The aromatic group may have a substituent, and examples of the substituent include a hydrocarbon group, a hydroxyl group, a halogen atom, and an amino group.

[0054] The alkoxy group having 1 to 30 carbon atoms is preferably an alkoxy group having 1 to 10 carbon atoms, and more preferably an alkoxy group having 1 to 6 carbon atoms. Specific examples thereof include a methoxy group, an ethoxy group, and an isopropoxy group.

[0055] The resin composition of the present embodiment contains a thermosetting component. The thermosetting component usually contains a group that can be polymerized / crosslinked by active chemical species such as free radicals, and specifically, it can be any one of a thermosetting resin or a curing agent. The resin composition of the present embodiment may contain only one thermosetting component, or may contain two or more thermosetting components.

[0056] The resin composition of the present embodiment preferably contains a thermosetting resin and a curing agent. In this case, at least one of the thermosetting resin and the curing agent preferably has a -Si-O- structure. Thus, the cured product of the resin composition of the present embodiment can contain a structure represented by formula (1), and the cured product becomes soluble in a solvent, thereby obtaining easy disassembly.

[0057] In the resin composition of the present embodiment, various components can be combined so that the cured product has the structure represented by formula (1), and specific examples thereof include the following resin compositions.

[0058] <1> A resin composition comprising a phenolic resin (P) having a -Si-O- structure.

[0059] <2> A resin composition comprising a thermosetting resin and a phenolic resin (P) having a -Si-O- structure as a curing agent.

[0060] <3> A resin composition comprising an epoxy resin (A) having a -Si-O- structure.

[0061] <4> A resin composition comprising: a silicone resin (organopolysiloxane) (C1) having two or more alkenyl groups bonded to silicon atoms in one molecule as a thermosetting resin; and an organohydrogenpolysiloxane (C2) having two or more hydrogen atoms bonded to silicon atoms in one molecule as a curing agent.

[0062] <5> A resin composition comprising an acrylic / vinyl resin obtained by reacting an unsaturated bond having a -Si-O- structure in a main chain.

[0063] Hereinafter, the details of each embodiment will be described.

[0064] <First embodiment>

[0065] In the first embodiment, a resin composition containing a phenolic resin (P) having a -Si-O- structure is described. In this case, as a curing agent, a curing agent without a -Si-O- structure may be used, and a known curing agent may be used. The known curing agent will be described later.

[0066] As the phenol resin (P) having a -Si-O- structure, a phenol resin modified with a silyl ether having a phenolic hydroxyl group can be used. Specifically, for example, a silyl ether-modified novolac resin represented by the following formula (P1) can be mentioned.

[0067]

[0068] In the formula (P1), x and y are both integers, and x+y is 2 to 200.

[0069] Furthermore, in formula (P1), from the viewpoint of obtaining good disassembly properties and moldability, x:y=1:99 to 99:1 is preferred, x:y=2:98 to 75:25 is more preferred, and x:y=5:95 to 50:50 is further preferred.

[0070] Furthermore, in formula (P1), D has a structure represented by the following formula (P1-1).

[0071]

[0072] In the formula (P1-1), R9 represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 Each independently represents any one of a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms. z is an integer of 0-10.

[0073] Among them, R9 is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and still more preferably a propenyl group. 10 Each independently is preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, and is preferably an alkyl group, further preferably an alkyl group having 1 to 5 carbon atoms, and further preferably a methyl group.

[0074] The weight average molecular weight (Mw) of the phenolic resin (P1) is not particularly limited, but is preferably 500 to 10,000, more preferably 1,000 to 8,000, and even more preferably 1,500 to 5,000. The number average molecular weight (Mn) of the phenolic resin (P1) is not particularly limited, but is preferably 100 to 5,000, more preferably 300 to 3,000, and even more preferably 600 to 1,000.

[0075] In the present embodiment, Mw and Mn can be calculated by gel permeation chromatography (GPC).

[0076] The phenol resin (P) can be obtained by reacting silyl ethers, phenols and aldehydes in the presence of an acid catalyst.

[0077] As the silyl ethers, silyl ethers having a phenolic hydroxyl group are preferred, and examples thereof include silyl ethers represented by the following formula (P1-2).

[0078]

[0079] In the formula (P1-2), R9 represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 Each independently represents any one of a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms. z is an integer of 0-10.

[0080] Among them, R9 is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and still more preferably a propenyl group. 10 Each independently is preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms. Also, an alkyl group is preferred, an alkyl group having 1 to 5 carbon atoms is more preferred, and a methyl group is further preferred.

[0081] Examples of phenols include, but are not particularly limited to, phenol; cresols such as o-cresol, m-cresol, and p-cresol; xylenols such as 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, and 3,5-xylenol; 2,3,5-trimethylphenol, 2-ethylphenol, 4-ethylphenol, 2-isopropylphenol, 4-isopropylphenol, n-butylphenol, isobutylphenol, tert-butylphenol, hexylphenol, octylphenol, nonylphenol, phenylphenol, benzylphenol, Alkylphenols such as phenol, cumylphenol, allylphenol, cardanol, urushiol, urushiol, and urushiol; naphthols such as 1-naphthol and 2-naphthol; halogenated phenols such as fluorophenol, chlorophenol, bromophenol, and iodophenol, p-phenylphenol, aminophenol, nitrophenol, dinitrophenol, and trinitrophenol; polyphenols such as resorcinol, alkylresorcinol, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, phloroglucinol, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalene, and naphthalene. These can be used alone or in combination of two or more. Among these, phenols can contain one or more selected from phenol, cresol, xylenol, and alkylphenol. From the perspective of low price, phenol can be used.

[0082] Aldehydes are not particularly limited, and examples thereof include formaldehyde such as formalin and paraformaldehyde; trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, hexanal, allylaldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, etc. These aldehydes can be used alone or in combination of two or more. Among them, the aldehydes can contain formaldehyde or acetaldehyde, and from the viewpoint of productivity and low price, formalin or paraformaldehyde can be used.

[0083] The catalyst used in the synthesis of the phenolic resin (P) may be non-catalyst, but from the viewpoint of producing a novolac type phenolic resin, an acidic catalyst may be used. The acidic catalyst is not particularly limited, and examples thereof include acids such as oxalic acid, hydrochloric acid, sulfuric acid, diethylsulfuric acid, and p-toluenesulfonic acid, and metal salts such as zinc acetate, which may be used alone or in combination of two or more.

[0084] As the reaction solvent used when synthesizing the phenolic resin (P), water or an organic solvent can be used. As the organic solvent, a non-aqueous system can be used by using a non-polar solvent. As an example of an organic solvent, for example, alcohols, ketones, and aromatics can be cited. As alcohols, methanol, ethanol, propanol, ethylene glycol, diethylene glycol, triethylene glycol, glycerol, etc. can be cited. As ketones, acetone, methyl ethyl ketone, etc. can be cited. As aromatics, toluene, xylene, etc. can be cited. These can be used alone or in combination of two or more.

[0085] The molar ratio of phenols (P) to aldehydes (F) (F / P molar ratio) may be, for example, 0.2 to 1.0 mol of aldehydes, preferably 0.3 to 0.9 mol of aldehydes per 1 mol of phenols. By making the aldehydes within the above range, the amount of unreacted phenols can be reduced and the yield can be improved.

[0086] The reaction temperature can be, for example, 40° C. to 120° C., preferably 60° C. to 110° C. The reaction time is not particularly limited and can be appropriately determined according to the type of starting materials, the blending molar ratio, the amount and type of the catalyst used, and the reaction conditions.

[0087] According to the above, the phenol resin (P) can be obtained.

[0088] <Second embodiment>

[0089] In the second embodiment, a case where a phenolic resin (P) having a -Si-O- structure is used as a curing agent is described. In this case, the thermosetting resin may or may not have a -Si-O- structure, but in the second embodiment, a case where the thermosetting resin does not have a -Si-O- structure is described. The thermosetting resin is not particularly limited, and a known epoxy resin can be used. The known epoxy resin will be described later.

[0090] In addition, regarding the phenolic resin (P) and epoxy resin as the curing agent, the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in all thermosetting resins to the number of phenolic hydroxyl groups (OH) in all phenolic resins is preferably adjusted to 0.8 or more and 1.6 or less, more preferably adjusted to 0.9 or more and 1.3 or less, and further preferably adjusted to 1.0 or more and 1.2 or less. When the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment can be improved.

[0091] Other components contained in the resin composition of the second embodiment will be described later.

[0092] <Third embodiment>

[0093] In the third embodiment, a resin composition containing an epoxy resin (A) having a -Si-O- structure is described. In this case, the curing agent may or may not have a -Si-O- structure, but in the third embodiment, the case where the curing agent does not have a Si-O- structure is described. The curing agent is not particularly limited, and a known curing agent can be used. The known curing agent will be described later.

[0094] As the epoxy resin (A) having a -Si-O- structure, specifically, for example, there can be mentioned an epoxy resin (A1) having a -Si-O- structure obtained by epoxidizing the phenolic resin (P1) having a -Si-O- structure described in the first embodiment, a bifunctional or higher epoxy compound (A2) having a structure represented by the following formula (A2), and an organosiloxane-type epoxy compound (A3) having a structure represented by the following formula (A3).

[0095] [Epoxy resin (A1)]

[0096] Examples of the epoxy resin (A1) having a -Si-O- structure obtained by epoxidizing the phenol resin (P1) having a -Si-O- structure include resins represented by the following formula (A1).

[0097]

[0098] In formula (A1), x and y are both integers, and x+y is 2-200.

[0099] Furthermore, in formula (A1), from the viewpoint of obtaining good disassembly properties and moldability, x:y=1:99 to 99:1 is preferred, x:y=2:98 to 75:25 is more preferred, and x:y=5:95 to 50:50 is further preferred.

[0100] Furthermore, in formula (A1), D has a structure represented by the following formula (A1-1).

[0101]

[0102] In the formula (A1-1), R9 represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 Each independently represents any one of a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms. z is an integer of 0-10.

[0103] Among them, R9 is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and still more preferably a propenyl group. 10 Each independently is preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms. Also, an alkyl group is preferred, an alkyl group having 1 to 5 carbon atoms is more preferred, and a methyl group is further preferred.

[0104] The epoxy resin (A1) can be produced by epoxidizing the phenol resin (P1) by a known method.

[0105] [Epoxy compound (A2)]

[0106] The epoxy compound (A2) is a bifunctional or higher-functional epoxy compound having a structure represented by the following formula (A2).

[0107]

[0108] In formula (A2), m and n are integers, and m+n=4.

[0109] R3 is independently hydrogen, alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, heterocyclic, heterocycloalkyl, cycloalkenyl, heteroaryl, alkoxyaryl, alkoxyalkyl.

[0110] B is independently arylene, arylene ether, alkylene-arylene, alkylene-arylene alkylene, alkenylene-arylene, alkenylene-arylene alkenylene, alkylene-arylene-alkenylene, alkynylene arylene, alkynylene-arylene-alkynylene, heteroarylene, alkylene-heteroarylene, alkylene-heteroarylene-alkylene, alkenylene-heteroarylene, alkenylene-heteroarylene-alkenylene, alkylene-heteroarylene arylene-alkenylene, alkynyleneheteroarylene, alkynylene-heteroarylene-alkynylene, alkylene, alkylene-hetero-alkylene, alkenylene, alkenylene-hetero-alkenylene, alkylene-hetero-alkenylene, alkynylene, cycloalkylene, alkylene-cycloalkylene, alkylene-cycloalkylene alkylene, alkenylene-cycloalkylene, alkenylene-cycloalkylene-alkenylene, alkylene-cycloalkylene alkenylene, alkynylene-cycloalkylene, alkynylene-cycloalkylene-alkynylene, heterocycloalkylene, alkyleneheterocycloalkylene, alkylene-heterocycloalkylene alkylene, alkenylene-heterocycloalkylene, alkenyleneheterocycloalkylene-alkenylene, alkyleneheterocycloalkylene-alkenylene, alkynyleneheterocycloalkylene, alkynylene-heterocycloalkylene alkynylene, cycloalkenylene, alkylene-cycloalkenylene, alkylene-cycloalkenylene-alkylene, alkenylene-cycloalkenylene, The invention further comprises the following: alkenyl-cycloalkenylene-alkenylene, alkylenecycloalkenylene-alkenylene, alkynylene-cycloalkenylene, alkynylene-cycloalkenylene-alkynylene, heterocycloalkenylene, alkylene-heterocycloalkenylene, alkylene-heterocycloalkenylene-alkylene, alkenylene-heterocycloalkenylene, alkenylene-heterocycloalkenylene-alkenylene, alkylene-heterocycloalkenylene-alkenylene, alkynylene-heterocycloalkenylene, alkynylene-heterocycloalkenylene or alkynylene.

[0111] Specific examples of the bifunctional or higher-functional epoxy compound (A2) include compounds represented by the following formulae (A2-1) to (A2-19), respectively.

[0112]

[0113]

[0114] The epoxy compound (A2) can be obtained, for example, as follows.

[0115] The method comprises: first, partially epoxidizing a polyol having one or more hydroxyl groups with an epihalohydrin in the presence of a base to obtain a partially epoxidized alcohol; and reacting the partially epoxidized alcohol with a compound having a structure represented by the following formulas (4-1) to (4-3) in the presence of an acidic catalyst. Thus, a mixture containing an epoxy compound (A2) having a -Si-O- structure can be obtained.

[0116]

[0117] (wherein, R5 to R8 are independently hydrogen, alkyl, alkenyl, alkynyl, methylene, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, heterocyclic, heterocycloalkyl, cycloalkenyl, heteroaryl, alkoxy, alkoxyaryl, alkoxyalkyl or aryloxy, R 11 is hydrogen, alkyl, aryl, aralkyl, alkenyl or alkynyl)

[0118] [Epoxy compound (A3)]

[0119] The epoxy compound (A3) has a structure represented by the following formula (A3).

[0120]

[0121] In formula (A3), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0122] R 12 Each independently represents any one of a hydrogen atom and a hydrocarbon group having 1 to 30 carbon atoms.

[0123] w is an integer from 1 to 50.

[0124] As the epoxy compound (A3), commercially available products can be used, for example, dual-end epoxy-modified silicones "X-22-163", "X-22-163A", "X-22-163B", "X-22-163C" and "KF-105" (all manufactured by Shin-Etsu Silicone Co., Ltd.) can be mentioned.

[0125] Furthermore, specific examples of the epoxy compound (A3) include compounds represented by the following formula (A3-1).

[0126]

[0127] In formula (A3-1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0128] Among them, R1 and R2 are preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and still more preferably a methyl group.

[0129] As the epoxy compound represented by the formula (A3-1), a commercially available product can be used, and examples thereof include alicyclic epoxy group-containing linear siloxane bifunctional oligomer "X-40-2669" (manufactured by Shin-Etsu Silicone Co., Ltd.).

[0130] Hereinafter, the physical properties of the epoxy resin (A) having a -Si-O- structure according to the present embodiment will be described.

[0131] The weight average molecular weight (Mw) of the epoxy resin (A) having a -Si-O- structure according to the present embodiment is not particularly limited, but is preferably 500 to 10,000, more preferably 1,000 to 7,000, and even more preferably 2,000 to 6,000.

[0132] The number average molecular weight (Mn) of the epoxy resin (A) having a -Si-O- structure according to the present embodiment is not particularly limited, but is preferably 100 to 5,000, more preferably 300 to 3,000, and even more preferably 600 to 1,000.

[0133] Furthermore, the viscosity of the epoxy resin (A) having a -Si-O- structure according to the present embodiment is preferably within a range of 1 to 40,000 mPa·s.

[0134] The epoxy resin (A) having a -Si-O- structure of the present embodiment preferably has an epoxy equivalent (EEW) in the range of 100 to 600 g / milli-equivalent. The epoxy equivalent refers to the mass (gram) of a resin containing one equivalent of epoxy groups.

[0135] In the third embodiment, it is preferable to use a known phenolic curing agent for the resin composition.

[0136] In addition, regarding the phenolic curing agent and the epoxy resin (A) having a -Si-O- structure as a curing agent, the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in all thermosetting resins to the number of phenolic hydroxyl groups (OH) in all phenolic resins is preferably adjusted to 0.8 or more and 1.6 or less, more preferably adjusted to 0.9 or more and 1.3 or less, and further preferably adjusted to 1.0 or more and 1.2 or less. When the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment can be improved.

[0137] Other components contained in the resin composition of the third embodiment will be described later.

[0138] <Fourth embodiment>

[0139] In the fourth embodiment, a resin composition is described that contains an organopolysiloxane (organosilicone resin) (C1) as a thermosetting resin and an organohydrogenpolysiloxane (C2) as a curing agent (cross-linking agent) and having two or more hydrogen atoms bonded to silicon atoms in one molecule.

[0140] (Organopolysiloxane (C1))

[0141] The organopolysiloxane (C1) having two or more alkenyl groups bonded to silicon atoms in one molecule is preferably a linear organopolysiloxane, and preferably has 2 to 8 alkenyl groups bonded to silicon atoms in one molecule. Specific examples include compounds having a structure represented by the following formula (C1-1).

[0142]

[0143] In formula (C1-1), R 13 They are the same or different types of substituted or unsubstituted alkyl groups having 1 to 10 carbon atoms, aryl groups having 6 to 12 carbon atoms or alkenyl groups having 2 to 10 carbon atoms.

[0144] As R 13 Specific examples include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl and cyclohexyl, fluorine-substituted alkyl groups such as trifluoromethyl and 3,3,3-trifluoropropyl, in which some or all of the hydrogen atoms bonded to the carbon atoms of these alkyl groups are substituted with halogen atoms such as chlorine atoms, fluorine atoms and bromine atoms, alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl and cyclohexenyl, and aryl groups such as phenyl.

[0145] Among these, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 8 carbon atoms, and an alkenyl group having 2 to 6 carbon atoms are preferred.

[0146] s is an integer of 5 to 50,000, preferably an integer of 10 to 20,000.

[0147] The organopolysiloxane (C1) may have an alkenyl group at any of the molecular chain terminal and the side chain, but preferably has an alkenyl group only at the terminal.

[0148] In the organopolysiloxane (C1), examples of the specific structure of the vinyl group-containing linear organopolysiloxane (C1-2) include a structure represented by the following formula (C1-2).

[0149]

[0150] In formula (C1-2), R 1 and R 2 Each is independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0151] The vinyl-containing linear organopolysiloxane (C1-2) may contain a first vinyl-containing linear organopolysiloxane (C1-2') having two or more vinyl groups in the molecule and a vinyl content of 0.4 mol% or less. The vinyl content of the first vinyl-containing linear organopolysiloxane (C1-2') may also be 0.1 mol% or less.

[0152] Furthermore, the vinyl-containing linear organopolysiloxane (C1-2) may contain a first vinyl-containing linear organopolysiloxane (C1-2′) and a second vinyl-containing linear organopolysiloxane (C1-2″) having a vinyl content of 0.5 to 15 mol%.

[0153] By combining a first vinyl-containing linear organopolysiloxane (C1-2') and a second vinyl-containing linear organopolysiloxane (C1-2") having a high vinyl content as a raw material for silicone rubber, i.e., raw rubber, the vinyl groups can be localized, thereby more effectively forming a sparse and dense crosslinking density in the crosslinking network of the silicone rubber. As a result, the tear strength of the release film can be more effectively improved, and the dimensional stability and transferability can be easily controlled.

[0154] Specifically, as the vinyl group-containing linear organopolysiloxane (C1-2), for example, a vinyl group having two or more R in the above formula (C1-2) in the molecule is preferably used. 1 The vinyl unit and / or R 2 A first vinyl-containing linear organopolysiloxane (C1-2′) containing 0.4 mol % or less of a vinyl unit and 0.5 to 15 mol % of R 1 The vinyl unit and / or R 2 The second vinyl-containing linear organopolysiloxane (C1-2") having a vinyl unit.

[0155] The first vinyl-containing linear organopolysiloxane (C1-2') preferably has a vinyl content of 0.01 to 0.2 mol%. The second vinyl-containing linear organopolysiloxane (C1-2") preferably has a vinyl content of 0.8 to 12 mol%.

[0156] Moreover, when the first vinyl-containing straight-chain organopolysiloxane (C1-2') and the second vinyl-containing straight-chain organopolysiloxane (C1-2") are combined and formulated, the ratio of (C1-2') to (C1-2") is not particularly limited. For example, in terms of weight ratio, (C1-2'):(C1-2") is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0157] The first vinyl group-containing linear organopolysiloxane (C1-2′) and the second vinyl group-containing linear organopolysiloxane (C1-2″) may be used alone or in combination of two or more.

[0158] Furthermore, the functional polysiloxane (C1) may contain a vinyl group-containing branched organopolysiloxane having a branched structure.

[0159] (Organohydrogenpolysiloxane (C2))

[0160] Examples of the organohydrogenpolysiloxane (C2) having two or more hydrogen atoms bonded to silicon atoms in one molecule include organohydrogenpolysiloxane having a structure represented by the following formula (C2).

[0161]

[0162] In formula (C2), R 14 Each of them is independently an alkyl group such as methyl, ethyl, propyl, butyl, a cycloalkyl group such as cyclohexyl, an aryl group such as phenyl, tolyl, or a group obtained by replacing part or all of the hydrogen atoms bonded to the carbon atoms of these groups with hydroxyl, cyano, halogen atoms, etc. It is preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, and more preferably an alkyl group or an aryl group. t is an integer greater than 2, preferably 2 to 50, and more preferably 3 to 30.

[0163] The amount of the organohydrogenpolysiloxane (C2) to be added can be appropriately set depending on the number of moles of alkenyl groups in the organopolysiloxane (C1) having two or more alkenyl groups in one molecule, but is preferably adjusted so that the number of moles of SiH groups in the organohydrogenpolysiloxane (C2) is within the range of 0.5 to 20, more preferably 0.8 to 5, of the number of moles of alkenyl groups in the silicone resin (C1).

[0164] The organohydrogenpolysiloxane (C2) can be classified into a linear organohydrogenpolysiloxane (C2-1) having a linear structure and a branched organohydrogenpolysiloxane (C2-2) having a branched structure, and may contain either or both of them.

[0165] The straight-chain organohydrogenpolysiloxane (C2-1) is a polymer having a straight-chain structure and a structure in which hydrogen and Si are directly bonded (≡Si—H). In addition to undergoing a hydrosilylation reaction with the vinyl groups of the vinyl-containing organopolysiloxane (C1-2), it also undergoes a hydrosilylation reaction with the vinyl groups of the components contained in the raw materials of the release layer 1, thereby crosslinking these components.

[0166] The molecular weight of the linear organohydrogenpolysiloxane (C2-1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0167] The weight average molecular weight of the linear organohydrogenpolysiloxane (C2-1) can be measured, for example, in terms of polystyrene in GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0168] Furthermore, it is generally preferred that the linear organohydrogenpolysiloxane (C2-1) does not have a vinyl group. This can reliably prevent a crosslinking reaction from occurring within the molecule of the linear organohydrogenpolysiloxane (C2-1).

[0169] As the linear organohydrogenpolysiloxane (C2-1) as described above, for example, a compound having a structure represented by the following formula (C2-1) can be preferably used.

[0170]

[0171] In formula (C2-1), R 4 It is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, hydrocarbon group or hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, etc., among which methyl group is preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include vinyl group, allyl group, butenyl group, etc. Examples of the aryl group having 1 to 10 carbon atoms include phenyl group.

[0172] And, R 5 It is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, hydrocarbon group or hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group and propyl group, among which methyl group is preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include vinyl group, allyl group and butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include phenyl group.

[0173] In formula (C2-1), a plurality of R 4 They are independent of each other and can be different or the same. 5 The same is true. Among them, multiple R 4 and R 5 At least two of them are hydride groups.

[0174] And, R 6 It is a substituted or unsubstituted alkyl group, aryl group or a hydrocarbon group obtained by combining them having 1 to 8 carbon atoms. Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, propyl, etc., among which methyl is preferred. Examples of the aryl group having 1 to 8 carbon atoms include phenyl. 6 Independent of each other, they can be different or the same.

[0175] In addition, as R in formula (C2-1), 4 , R 5 , R 6 Examples of the substituent include a methyl group and a vinyl group. From the viewpoint of preventing a cross-linking reaction within the molecule, a methyl group is preferred.

[0176] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (C2-1) represented by formula (C2-1), m is an integer of 2 to 150, and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100, and n is an integer of 2 to 100.

[0177] The linear organohydrogenpolysiloxane (C2-1) may be used alone or in combination of two or more.

[0178] The branched organohydrogenpolysiloxane (C2-2) has a branched structure, and therefore can form a region with a high crosslinking density, and is a component that greatly contributes to the formation of a sparse and dense structure of the crosslinking density in the silicone rubber system. In addition, similar to the above-mentioned straight-chain organohydrogenpolysiloxane (C2-1), it is a polymer having a structure in which hydrogen and Si are directly bonded (≡Si-H), and in addition to undergoing a hydrosilylation reaction with the vinyl group of the vinyl-containing organopolysiloxane (C1-2), it also undergoes a hydrosilylation reaction with the vinyl group of the component contained in the raw material of the release layer 1, so that these components are crosslinked.

[0179] Furthermore, the specific gravity of the branched organohydrogenpolysiloxane (C2-2) is within a range of 0.9 to 0.95.

[0180] Furthermore, it is generally preferred that the branched organohydrogenpolysiloxane (C2-2) does not have a vinyl group. This can reliably prevent a crosslinking reaction from proceeding within the molecule of the branched organohydrogenpolysiloxane (C2-2).

[0181] Furthermore, as the branched organohydrogenpolysiloxane (C2-2), a compound represented by the following average composition formula (c) is preferred.

[0182] Average composition formula (c)

[0183] (Ha(R 7 )3-aSiO 1 / 2 )m(SiO 4 / 2 )

[0184] (In formula (c), R 7 is a monovalent organic group, a is an integer in the range of 1 to 3, and m is Ha(R 7 )3-aSiO 1 / 2 The number of units, n is SiO 4 / 2 Number of units)

[0185] In formula (c), R 7It is a monovalent organic group, preferably a substituted or unsubstituted alkyl group, aryl group or a hydrocarbon group obtained by combining them having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, etc., among which methyl is preferred. Examples of the aryl group having 1 to 10 carbon atoms include phenyl.

[0186] In formula (c), a represents the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer in the range of 1 to 3, and is preferably 1.

[0187] Furthermore, in formula (c), m is Ha(R 7 )3-aSiO 1 / 2 The number of units, n is SiO 4 / 2 The number of cells.

[0188] The branched organohydrogenpolysiloxane (C2-2) has a branched structure. The linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2) differ in whether their structures are linear or branched, and the number of alkyl groups R bonded to Si when the number of Si is 1 (R / Si) is in the range of 1.8 to 2.1 in the linear organohydrogenpolysiloxane (C2-1), and in the range of 0.8 to 1.7 in the branched organohydrogenpolysiloxane (C2-2).

[0189] In addition, the branched organohydrogenpolysiloxane (C2-2) has a branched structure, and therefore, for example, the amount of residue when heated to 1000° C. at a heating rate of 10° C. / min in a nitrogen atmosphere is 5% or more. On the other hand, the linear organohydrogenpolysiloxane (C2-1) is linear, and therefore, the amount of residue after heating under the above conditions is almost zero.

[0190] Furthermore, specific examples of the branched organohydrogenpolysiloxane (C2-2) include compounds having a structure represented by the following formula (C2-2).

[0191]

[0192] In formula (C2-2), R 7 is a substituted or unsubstituted alkyl group, an aryl group, a hydrocarbon group obtained by combining these groups, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, and propyl groups, among which methyl is preferred. Examples of the aryl group having 1 to 8 carbon atoms include phenyl groups. 7 The substituent group thereof includes, for example, a methyl group.

[0193] In formula (C2-2), a plurality of R 7 Independent of each other, they can be different or the same.

[0194] Furthermore, in the formula (C2-2), "-O-Si≡" indicates that Si has a three-dimensionally extended branched structure.

[0195] The branched organohydrogenpolysiloxane (C2-2) may be used alone or in combination of two or more.

[0196] In addition, in the linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2), the amount of hydrogen atoms (hydride groups) directly bonded to Si is not particularly limited.

[0197] However, in the release layer 1, the total amount of hydride groups of the linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2) is preferably 0.5 to 5 mol, more preferably 1 to 3.5 mol, per 1 mol of the vinyl group in the vinyl-containing linear organopolysiloxane (C1-1). This allows a crosslinking network to be reliably formed between the linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2) and the vinyl-containing linear organopolysiloxane (C1-1).

[0198] (Catalyst, curing accelerator)

[0199] In the fourth embodiment, the resin composition preferably further contains a catalyst, which can promote the curing of the organopolysiloxane (C1) and the organohydrogenpolysiloxane (C2).

[0200] Examples of the catalyst include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, and among them, platinum is preferred.

[0201] Specific examples of the platinum-based catalyst include platinum fine powder, chloroplatinic acid, alcohol solutions of chloroplatinic acid, platinum-alkenylsiloxane complexes, platinum-olefin complexes, and platinum-carbonyl complexes, as well as catalysts obtained by dispersing or encapsulating these platinum-based catalysts with thermoplastic resins.

[0202] The amount of the catalyst added is preferably 0.01 to 5% by mass, more preferably 0.02 to 2% by mass, and even more preferably 0.05 to 1% by mass, based on the total amount of the resin composition.

[0203] Other components contained in the resin composition of the fourth embodiment will be described later.

[0204] As mentioned above, although an example of embodiment of the resin composition of this invention was demonstrated, the resin composition of this invention is not limited to this.

[0205] Furthermore, the resin composition of each embodiment described above may contain a known thermosetting resin, a known curing agent, and other components in addition to the above-mentioned thermosetting component, and may contain other components according to the application and the like.

[0206] Hereinafter, other components which may be contained in the resin composition of the present invention will be described.

[0207] [Thermosetting resin]

[0208] As the thermosetting resin of the present embodiment, for example, one or more selected from phenolic resin, epoxy resin, phenoxy resin, polyimide resin, benzoxazine resin, unsaturated polyester resin, melamine resin, silicone resin, cyanate resin, maleimide resin, cyanate resin and acrylic resin can be cited. These thermosetting resins can use all monomers, oligomers, and polymers having two or more reactive functional groups in one molecule, and their molecular weight and molecular structure are not particularly limited.

[0209] As the epoxy resin, any monomer, oligomer or polymer having two or more epoxy groups in one molecule may be used, and the molecular weight and molecular structure thereof are not particularly limited.

[0210] Specific examples of epoxy resins include novolac epoxy resins such as phenol novolac epoxy resins and cresol novolac epoxy resins; bisphenol-A epoxy resins and bisphenol-F epoxy resins; aromatic glycidylamine epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane glycidylamine, and aminophenol glycidylamine; hydroquinone epoxy resins; biphenyl epoxy resins; stilbene epoxy resins; trisphenolmethane epoxy resins; trisphenolpropane epoxy resins; Alkyl-modified trisphenol methane type epoxy resin; epoxy resin containing a triazine core; dicyclopentadiene-modified phenol type epoxy resin; naphthol type epoxy resin; naphthalene type epoxy resin; naphthylene ether type epoxy resin; aralkyl type epoxy resins such as phenol aralkyl type epoxy resin having a phenylene skeleton and / or a biphenylene skeleton, naphthol aralkyl type epoxy resin having a phenylene skeleton and / or a biphenylene skeleton, or aliphatic epoxy resins such as vinyl cyclohexene dioxide, dicyclopentadiene oxide, alicyclic diepoxy-adipic acid esters, etc., or one or more of the following.

[0211] The content of the thermosetting resin is preferably 1% by mass to 50% by mass, more preferably 2% by mass to 30% by mass, and even more preferably 5% by mass to 20% by mass, based on the total amount of the resin composition.

[0212] By making the content of the thermosetting resin equal to or greater than the above lower limit, the fluidity and moldability of the resin composition can be more effectively improved. In addition, by making the content of the thermosetting resin equal to or less than the above upper limit, the curability can be improved to obtain a good cured product.

[0213] [Curing agent]

[0214] The curing agent of the present embodiment can be selected according to the type of thermosetting resin, and is not particularly limited as long as it can react with the thermosetting resin. Specific examples of the curing agent include addition curing agents, catalytic curing agents, and condensation curing agents.

[0215] Specific examples of the curing agent include phenolic curing agents, amines, polyhydroxystyrenes such as polyparahydroxystyrene, alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), acid anhydrides such as trimellitic anhydride (TMA), pyromellitic dianhydride (PMDA), and aromatic acid anhydrides such as benzophenonetetracarboxylic dianhydride (BTDA), polythiol compounds such as polysulfides, thioesters, and thioethers, isocyanate prepolymers, isocyanate compounds such as blocked isocyanates, and organic acids such as carboxylic acid-containing polyester resins.

[0216] Specifically, the phenolic curing agent may include one or more selected from phenol novolac resins, cresol novolac resins, naphthol novolac resins, aminotriazine novolac resins, novolac resins, triphenylmethane-type phenol novolac resins, and other novolac-type phenolic resins; terpene-modified phenolic resins, dicyclopentadiene-modified phenolic resins, and other modified phenolic resins; aralkyl-type resins such as phenol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton, and naphthol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F; and resol-type phenolic resins. In addition, from the viewpoint of curability, the hydroxyl equivalent of the phenolic resin-based curing agent is preferably, for example, 90 g / eq or more and 250 g / eq or less.

[0217] Specific examples of the amines include: aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and meta-xylylenediamine (MXDA); aromatic polyamines such as diaminodiphenylmethane (DDM), meta-phenylenediamine (MPDA), and diaminodiphenylsulfone (DDS); and polyamine compounds such as dicyandiamide (DICY) and organic acid dihydrazides; and acid anhydrides such as alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA); and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic dianhydride (PMDA), and benzophenonetetracarboxylic dianhydride (BTDA).

[0218] The content of the curing agent is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass, based on 100 parts by mass of the thermosetting resin.

[0219] And, the content of thermosetting resin and curing agent can be appropriately set according to thermosetting resin and curing agent. For example, about phenolic curing agent as curing agent and epoxy resin as thermosetting resin, the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in all thermosetting resins and the number of phenolic hydroxyl groups (OH) of all phenolic resins is preferably adjusted to 0.8 or more and 1.6 or less, more preferably adjusted to 0.9 or more and 1.3 or less, and further preferably adjusted to 1.0 or more and 1.2 or less. When the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment obtained can be good.

[0220] The resin composition of the present embodiment may further contain the following components.

[0221] [Inorganic filler]

[0222] The resin composition of the present embodiment may contain an inorganic filler.

[0223] The inorganic filler can be used to improve the mechanical strength or impart heat resistance, flame retardancy, etc., depending on the application of the cured product or structure.

[0224] As inorganic fillers, specifically, silicates such as talc, fired clay, unfired clay, mica, and glass can be cited; oxides such as titanium oxide, aluminum oxide, boehmite, and silicon dioxide; carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide; sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite; borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate; nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride; titanates such as strontium titanate and barium titanate, etc. These can be used alone or in combination of two or more.

[0225] The average particle size D50 of the inorganic filler is preferably 0.01 μm to 75 μm, more preferably 0.05 μm to 50 μm. By making the average particle size of the inorganic filler within the above range, the filling property can be improved. The average particle size D50 can be a volume conversion (cumulative 50%) average particle size measured by a commercially available laser particle size distribution meter.

[0226] The content of the inorganic filler can be appropriately set depending on the application, and is preferably 10 to 98% by mass, more preferably 20 to 95% by mass, and even more preferably 40 to 95% by mass based on the total amount of the resin composition.

[0227] By making the content of the inorganic filler greater than or equal to the above lower limit, the storage stability and curability of the cured product can be improved. In addition, by making the content of the inorganic filler less than or equal to the above upper limit, good fluidity of the resin composition can be obtained, and moldability can be effectively improved.

[0228] [Coupling agent]

[0229] The resin composition of the present embodiment may contain a coupling agent when containing an inorganic filler, thereby suppressing aggregation of the inorganic filler and obtaining good fluidity.

[0230] As the coupling agent, for example, known coupling agents such as various silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane and vinylsilane, titanium compounds, aluminum chelates and aluminum / zirconium compounds can be used.

[0231] More specifically, vinyl trichlorosilane, vinyl trimethoxysilane, vinyl triethoxysilane, vinyl tri(β-methoxyethoxy)silane, γ-methacryloxypropyl trimethoxysilane, β-(3,4-epoxycyclohexyl)-ethyl trimethoxysilane, γ-glycidyloxypropyl trimethoxysilane, γ-glycidyloxytriethoxysilane, γ-glycidyloxypropyl methyl dimethoxysilane, γ-methacryloxypropyl methyl diethoxysilane, γ-methacryloxypropyl triethoxysilane, vinyl triacetoxysilane, γ-mercaptopropyl trimethoxysilane, γ-aminopropyl Triethoxysilane, γ-anilinopropyl trimethoxysilane, γ-anilinopropyl methyl dimethoxysilane, γ-[bis(β-hydroxyethyl)]aminopropyl triethoxysilane, N-β-(aminoethyl)-γ-aminopropyl trimethoxysilane, N-β-(aminoethyl)-γ-aminopropyl triethoxysilane, N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane, N-phenyl-γ-aminopropyl trimethoxysilane, γ-(β-aminoethyl) aminopropyl dimethoxymethyl silane, N-(trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, Silane coupling agents such as trimethoxysilane, dimethyldimethoxysilane, methyltriethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, and hydrolyzate of N-(1,3-dimethylbutenyl)-3-(triethoxysilyl)propylamine; isopropyl triisostearate titanate, isopropyl tri(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl-amino) Titanate coupling agents include bis(dioctyl pyrophosphate)oxyacetate titanate, bis(dioctyl pyrophosphate)ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylate isostearyl titanate, isopropyl tri-dodecylbenzenesulfonyl titanate, isopropyl isostearyl diacrylate titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, and tetraisopropyl di(dioctyl phosphite) titanate. These may be used alone or in combination of two or more.

[0232] The content of the coupling agent is not particularly limited, and is preferably 0.05% by mass or more and 3% by mass or less, and more preferably 0.1% by mass or more and 2% by mass or less, relative to the entire resin composition. By making the content of the coupling agent above the above lower limit, the dispersibility of the inorganic filler in the resin composition can be made good. In addition, by making the content of the coupling agent below the above upper limit, the fluidity of the resin composition can be made good, thereby improving formability.

[0233] [Curing accelerator]

[0234] The resin composition of the present embodiment may contain a curing accelerator.

[0235] The curing accelerator is typically a substance that can accelerate the reaction between the thermosetting resin and the curing agent.

[0236] Specific examples of curing accelerators include phosphorus atom-containing compounds such as organic phosphines, tetrasubstituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, or adducts of phosphonium compounds and silane compounds; amidine compounds such as 1,8-diazabicyclo(5,4,0)undecene-7 and imidazole; nitrogen atom-containing compounds such as tertiary amines such as benzyldimethylamine, amidine salts or ammonium salts; phenol compounds such as phenol, bisphenol A, nonylphenol, and 2,3-dihydroxynaphthalene; and the like.

[0237] Examples of the organic phosphine include triphenylphosphine, tri-p-tolylphosphine, tetraphenylphosphonium-tetraphenylborate, triphenylphosphine-triphenylborane, 1,2-bis-(diphenylphosphino)ethane, etc. These may be used alone or in combination of two or more.

[0238] The content of the curing accelerator can be appropriately set depending on the application, and is preferably 0.1 to 5% by mass, more preferably 0.2 to 3% by mass, based on the total amount of the resin composition.

[0239] By making the content of the curing accelerator not less than the above lower limit, the resin composition can be easily cured appropriately. On the other hand, by making the content of the curing accelerator not more than the above upper limit, the molten state can be prolonged, and the low viscosity state can be further prolonged.

[0240] [Hydroxy-containing cyclic compounds]

[0241] The resin composition of the present embodiment, when containing a curing accelerator, may contain a compound having hydroxyl groups bonded to two or more adjacent carbon atoms constituting an aromatic ring (hereinafter, also referred to as a "cyclic compound containing hydroxyl groups"). Thus, even when a curing accelerator containing phosphorus atoms that does not have latency is used as a curing accelerator, the reaction in the melt kneading of the resin composition can be suppressed, thereby stably obtaining the resin composition. In addition, the cyclic compound containing hydroxyl groups also has the effect of reducing the melt viscosity of the resin composition and improving fluidity.

[0242] As the cyclic compound containing a hydroxyl group, a monocyclic compound represented by the following general formula (5) or a polycyclic compound represented by the following general formula (6) can be used. These compounds may have a substituent other than a hydroxyl group.

[0243]

[0244] In the general formula (5), one of R15 and R19 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. Furthermore, R16, R17, and R18 are a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group.

[0245]

[0246] In the general formula (6), either R20 or R26 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. Furthermore, R21, R22, R23, R24, and R25 are a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group.

[0247] Specific examples of the monocyclic compound represented by the general formula (5) include catechol, pyrogallol, gallic acid, gallic acid esters, and derivatives thereof.

[0248] Furthermore, as specific examples of polycyclic compounds represented by the general formula (6), for example, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and their derivatives can be cited. Among these, from the viewpoint of easy control of fluidity and curability, compounds in which hydroxyl groups are respectively bonded to two adjacent carbon atoms constituting the aromatic ring are preferred. Furthermore, in consideration of volatilization in the kneading process, it is more preferred that the parent core is a compound having a naphthalene ring with low volatility and high weighing stability. In this case, the hydroxyl-containing cyclic compound can be specifically, for example, a compound having a naphthalene ring such as 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and its derivatives. These hydroxyl-containing cyclic compounds can be used alone or in combination of two or more.

[0249] The content of the hydroxyl-containing cyclic compound is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, and further preferably 0.05% by mass or more, relative to the total value of 100% by mass of the resin composition. When the content of the hydroxyl-containing cyclic compound is within the above range, the effect of sufficiently low viscosity and improved fluidity of the resin composition can be obtained. In addition, the content of the hydroxyl-containing cyclic compound is preferably 2% by mass or less, more preferably 0.8% by mass or less, and further preferably 0.5% by mass or less, relative to the total value of 100% by mass of the resin composition. When the content of the hydroxyl-containing cyclic compound is within the above range, the possibility of causing a decrease in the curability of the resin composition or a decrease in the physical properties of the cured product is small.

[0250] Moreover, the resin composition of this embodiment may also contain colorants such as carbon black; release agents such as natural wax, synthetic wax, higher fatty acid or its metal salt, paraffin, oxidized polyethylene, etc.; low stress agents such as silicone oil, silicone rubber, etc.; flame retardants such as aluminum hydroxide; ion scavengers such as hydrotalcite or hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium; various additives such as adhesion imparting agents such as thiazoline, diazole, triazole, triazine, pyrimidine, antioxidants, etc.

[0251] Next, the method for producing the resin composition according to the present embodiment will be described.

[0252] The method for manufacturing the resin composition of the present embodiment is not particularly limited. For example, the thermosetting component and any other components can be mixed using a mixer, etc., and then melt-heated and kneaded at about 90 to 120° C. using a heating kneader, a hot roller or an extruder. Then, the obtained kneaded product is cooled and crushed to obtain a powdery or granular resin composition. The resin composition can be pressed into a tablet shape after crushing as needed, or it can be crushed into a sheet shape, for example, by vacuum lamination or compression molding.

[0253] Furthermore, for example, a varnish-like resin composition can be prepared by dissolving, mixing and stirring the thermosetting component and other arbitrary components in a solvent using various mixers such as an ultrasonic dispersion method, a high-pressure impact dispersion method, a high-speed rotation dispersion method, a bead mill method, a high-speed shear dispersion method or a rotation-revolution dispersion method.

[0254] Specific examples of the solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolves, carbitols, anisole, and N-methylpyrrolidone. The solvent may be used alone or in combination of two or more.

[0255] 2. Structure

[0256] The structure of the present embodiment includes a cured product of the easily disassembled thermosetting resin composition. The cured product can be obtained by thermally curing the resin composition of the present embodiment at 100 to 200° C. for 10 to 900 seconds.

[0257] As a structure, for example, it can be widely used in composite parts for transportation equipment such as automobiles, railways, ships, and aircraft, semiconductor chips, semiconductor elements, semiconductor devices including printed wiring boards, composite parts for factory equipment such as working robots, circuit display devices, information communication terminals, light-emitting diodes, physical batteries, chemical batteries and other electronic devices, civil engineering and construction composite parts, sports and entertainment composite parts, etc. Among them, composite parts for transportation equipment such as automobiles, semiconductor devices, etc. are preferred from the viewpoint of the importance of coping with environmental issues.

[0258] Specifically, the semiconductor device includes a semiconductor element and a sealing material for sealing the semiconductor element, wherein the sealing material is formed of a cured product of the resin composition of this embodiment. The sealing method is not particularly limited, and a known method can be used.

[0259] 3. Dismantling method

[0260] The disassembly method of this embodiment is performed by immersing the cured product of the easily disassemblyable thermosetting resin composition in a solvent, thereby breaking or decomposing the crosslinks in the cured product, making the cured product soluble, or partially soluble or gelling, thereby enabling disassembly.

[0261] The immersion temperature of the cured product can be appropriately set depending on the intended use, and is, for example, preferably -20 to 200°C, more preferably 0 to 150°C.

[0262] Furthermore, from the viewpoint of disassembly by a simple method, the immersion of the solidified material can be carried out at ambient temperature, that is, at room temperature. Thus, no special operation such as cooling or heating treatment is required. For example, the liquid temperature of the solvent can be 5 to 30°C.

[0263] On the other hand, from the viewpoint of promoting disintegration, etc., when the solidified material is immersed, heating or heat treatment may be applied.

[0264] The method of impregnating the solidified product is not particularly limited, as long as a part or the whole of the solidified product is in contact with the solvent. In addition, the immersion time can be appropriately adjusted according to the size of the solidified product, etc.

[0265] Furthermore, the solvent may be poured into the container containing the solidified material, or the solidified material may be immersed in the solvent in the container and stirred.

[0266] The solvent may be any solvent as long as it can release the -Si-O- structure from the cured product, and is preferably a solvent containing fluoride ions. The solvent containing fluoride ions may be a solvent that generates fluoride ions.

[0267] The solvent of the present embodiment may be prepared, for example, as follows.

[0268] (i) A solvent obtained by allowing a fluorine compound such as tetra-n-butylammonium fluoride (n-Bu4NF) to act in an organic solvent such as tetrahydrofuran.

[0269] Examples of the fluorine compound include ammonium, organic amines or fluoride salts of organic ammonium, and specifically, one or more selected from ammonium fluoride, hydrofluoric acid, acidic ammonium fluoride, methylamine hydrogen fluoride, ethylamine hydrogen fluoride, propylamine hydrogen fluoride, tetramethylammonium fluoride, tetraethylammonium fluoride, ethanolamine hydrogen fluoride, methylethanolamine hydrogen fluoride, dimethylethanolamine hydrogen fluoride, hydroxylamine hydrogen fluoride, dimethylhydroxylamine hydrogen fluoride, triethylenediamine hydrogen fluoride, etc. Among them, ammonium fluoride and tetra-n-butylammonium fluoride are preferred, and tetra-n-butylammonium fluoride is more preferred.

[0270] (ii) A solvent obtained by allowing an inorganic acid or an organic strong acid to act in an anhydrous organic solvent such as acetonitrile or a water-containing organic solvent.

[0271] (iii) A solvent obtained by reacting N-bromosuccinimide (NBS) in dimethyl sulfoxide (DMSO).

[0272] (iv) A solvent obtained by reacting an alkali metal hydrogen sulfate in a solvent such as water or alcohol.

[0273] As the hydrogen sulfate salt, alkali metal salts such as lithium hydrogen sulfate, potassium hydrogen sulfate, and sodium hydrogen sulfate can be used, and among them, potassium salts and sodium salts are preferred.

[0274] (v) A solvent obtained by allowing an acetic acid aqueous solution to act.

[0275] (vi) A solvent obtained by reacting an excess of potassium fluoride dihydrate with an excess of tetrabutylammonium chloride in acetonitrile.

[0276] Among these solvents, the solvent (i) is preferably used from the viewpoint of decomposition rate and waste liquid treatment.

[0277] 4. Recycling methods

[0278] The recycling method of the present embodiment is a method for recycling materials constituting the above-mentioned structure, and the recycling method includes: a step of immersing the structure in a solvent to disintegrate the cured product of the easily disassembleable thermosetting resin composition; and a step of recovering the material from the structure.

[0279] This allows the materials used in the structure to be reused. The process of disassembling the solidified material is the same as that described in the above disassembly method.

[0280] Furthermore, the method for recovering the material from the structure is not particularly limited as long as the quality of the material is not reduced. For example, there can be a method in which the material is precipitated in a solvent that disintegrates the solidified material and only the material is recovered by filtration, etc.; or a method in which the structure is taken out from the solvent and the structure and the solidified material that has become brittle due to the disintegration are destroyed together to recover the material.

[0281] The material is not particularly limited as long as it is a material that is insoluble in the above-mentioned solvent and does not produce a chemical reaction, and examples thereof include metals.

[0282] As mentioned above, although embodiment of this invention was described, these are only illustrations of this invention, and various structures other than the above-mentioned can also be adopted.

[0283] Example

[0284] Next, the present invention will be described in detail by way of examples, but the contents of the present invention are not limited to the examples.

[0285] 1. Synthesis method

[0286] Each silyl ether type phenolic resin was synthesized by the following steps.

[0287] [Synthesis Example 1] (Synthesis method of silyl ether type phenol monomer)

[0288] In a flask including a thermometer, a stirring device, and a reflux cooling tube, 56.1 g of 2-allylphenol, 80 g of toluene, and 10 μL of Karstedt catalyst were placed and heated to 80°C. Then, 28.0 g of 1,1,3,3-tetramethyldisiloxane was added dropwise. Then, after reacting at 80°C for 2 hours, toluene was distilled off from the reaction solution. By the above operation, 89.3 g of a silyl ether-type phenol monomer (1) represented by the following formula (S1) was obtained.

[0289]

[0290] [Synthesis Example 2] (Synthesis method of silyl ether type phenol novolac resin (1))

[0291] In a flask equipped with a thermometer, a stirring device, and a reflux cooling tube, 25.0 g of the obtained silyl ether type phenol monomer (1) and 0.11 g of oxalic acid were placed, and the temperature was gradually raised. Then, 4.5 g of a 37% formalin solution was added dropwise, and the mixture was reacted at an internal temperature of 100°C for 5 hours. Then, the temperature was raised to an internal temperature of 120°C, and dehydration was performed at normal pressure to remove water. Through the above operation, 27.4 g of a silyl ether type phenol novolac resin (1) represented by the following formula (S2) was obtained.

[0292] The silyl ether novolac resin (1) had Mn=780, Mw=2,800, and a hydroxyl equivalent of 237 g / eq.

[0293]

[0294] [Synthesis Example 3] (Synthesis method of silyl ether type phenol novolac resin (2))

[0295] In a flask equipped with a thermometer, a stirring device, and a reflux cooling tube, 25.0 g of a silyl ether type phenol monomer (1), 5.8 g of phenol, and 0.22 g of oxalic acid were placed, and the temperature was gradually raised. Then, 9.0 g of a 37% formalin solution was added dropwise, and the mixture was reacted at an internal temperature of 100° C. for 5 hours. Then, the temperature was raised to an internal temperature of 120° C., and dehydration was performed under normal pressure to remove water. Furthermore, a dehydration reaction was performed under reduced pressure to obtain 29.5 g of a silyl ether type novolac resin (2) represented by the following formula (S3).

[0296] The silyl ether novolac resin (2) had Mn=800, Mw=2,300, and a hydroxyl equivalent of 198 g / eq.

[0297]

[0298] (In formula (S3), x:y represents approximately 45:55.)

[0299] 2. Preparation of resin composition

[0300] <Comparative Examples 1 and 2 and Examples 1 to 4>

[0301] Using the raw material I shown below, each component was mixed at the solid content ratio shown in Table 1 to obtain a mixture. The mixing was performed using a Henschel mixer at room temperature. Then, the obtained mixture was roll-kneaded at 90 to 120° C. to obtain a kneaded product. After the obtained kneaded product was cooled, it was pulverized to obtain each resin composition of Comparative Examples 1 and 2 and Examples 1 to 4.

[0302] [Raw Materials I]

[0303] (Thermosetting resin)

[0304] Epoxy resin 1: o-cresol novolac type epoxy resin (manufactured by DIC Corporation, EPICRON N-670)

[0305] Epoxy resin 2: BPA bisphenol A type resin (manufactured by Mitsubishi Chemical Corporation, YL6810)

[0306] (Curing agent)

[0307] Curing agent 1: Novolac type phenol compound (manufactured by Sumitomo Bakelite Co., Ltd., PR-51470)

[0308] Curing agent 2: Silyl ether type novolac resin (1) obtained in Synthesis Example 2

[0309] Curing agent 3: Silyl ether type phenol novolac resin (2) obtained in Synthesis Example 3

[0310] (Curing accelerator)

[0311] Curing accelerator 1: triphenylphosphine

[0312] (Inorganic filler)

[0313] Inorganic filler 1: fused spherical silica (manufactured by Denka Company Limited., FB-60)

[0314] (other)

[0315] Colorant 1: Carbon black (manufactured by Mitsubishi Chemical Corporation, Carbon Black #5)

[0316] Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (manufactured by Dow Corning Toray Co., Ltd., CF-4083)

[0317] Release agent 1: Carnauba wax

[0318] Additives: low stress agents, ion scavengers and flame retardants

[0319] <Example 5>

[0320] A silicone rubber-based curable composition was prepared using the following raw material II.

[0321] First, a mixture of silicone rubber 1 (80 parts by mass), silicone rubber 2 (20 parts by mass), coupling agent 2 (10 parts by mass), coupling agent 3 (0.5 parts by mass) and water (5.25 parts by mass) was kneaded in advance, and then inorganic filler 2 (25 parts by mass) was added to the mixture and further kneaded to obtain a kneaded product (silicone rubber composite).

[0322] Here, the kneading after adding the inorganic filler 2 is carried out through a first step of kneading at 60 to 90° C. for 1 hour in a nitrogen atmosphere for the coupling reaction, and a second step of kneading at 160 to 180° C. for 2 hours in a reduced pressure atmosphere for removing by-products (ammonia), followed by cooling and kneading for 20 minutes.

[0323] Next, silicone rubber 3 and curing accelerator 2 were added to the obtained kneaded product (silicone rubber compound) in the ratios (mass %) shown in Table 1, and kneaded with a roll to obtain a silicone rubber-based curable composition of Example 5.

[0324] [Raw Materials II]

[0325] (Silicone rubber; Organopolysiloxane (C1))

[0326] Silicone rubber 1 (linear organopolysiloxane (C1-2') with low vinyl content: synthesized according to Synthesis Scheme 1. In the structure represented by formula (C1-2), only R1 (terminal) is a vinyl group)

[0327] Silicone rubber 2 (linear organopolysiloxane with a high vinyl content (C1-2"): synthesized according to Synthesis Scheme 2. In the structure represented by formula (C1-2), R1 and R2 are vinyl groups)

[0328] Silicone rubber 3 (organohydrogen polysiloxane (C2)), manufactured by Momentive Performance Materials Inc.: "TC-25D"

[0329] (Inorganic filler)

[0330] Inorganic filler 2: Silica fine particles (particle size: 7 nm, specific surface area: 300 m2 / g), manufactured by NIPPONAEROSIL Co., Ltd., “AEROSIL 300”

[0331] (Catalyst, curing accelerator)

[0332] Curing accelerator 2: platinum compound, manufactured by Momentive Performance Materials Inc.: "TC-25A"

[0333] (other)

[0334] Silane coupling agent 2: Hexamethyldisilazane (HMDZ), manufactured by Gelest, “HEXAMETHYLDISILAZANE (SIH6110.1)”

[0335] Silane coupling agent 3: divinyltetramethyldisilazane, manufactured by Gelest, "1,3-DIVINYLTETRAMETHYLDISILAZANE (SID4612.0)"

[0336] <Synthesis of vinyl-containing organopolysiloxane (C1)>

[0337] [Synthesis Scheme 1: Synthesis of Linear Organopolysiloxane (C1-2') with Low Vinyl Content]

[0338] According to the following formula (7), a linear organopolysiloxane (C1-2') having a low vinyl content was synthesized.

[0339] Specifically, 74.7 g (252 mmol) of octamethylcyclotetrasiloxane and 0.1 g of potassium silicate were added to a 300 mL separable flask equipped with a cooling tube and stirring blades after purging with Ar gas, and the mixture was heated and stirred at 120° C. for 30 minutes. At this time, an increase in viscosity was observed.

[0340] Then, the temperature was raised to 155° C. and stirring was continued for 3 hours. Then, 0.1 g (0.6 mmol) of 1,3-divinyltetramethyldisiloxane was added 3 hours later, and stirring was further continued at 155° C. for 4 hours.

[0341] Furthermore, after 4 hours, it was diluted with 250 mL of toluene and washed with water 3 times. The washed organic layer was washed several times with 1.5 L of methanol and reprecipitated and purified to separate the oligomer and the polymer. The obtained polymer was dried under reduced pressure at 60°C overnight to obtain a linear organopolysiloxane (C1-2') with a low vinyl content (Mn = 2,2 × 105, Mw = 4,8 × 105). In addition, the vinyl content calculated by H-NMR spectroscopy was 0.04 mol%.

[0342] Formula (7)

[0343]

[0344] [Synthesis Scheme 2: Synthesis of Linear Organopolysiloxane (C1-2") with High Vinyl Content]

[0345] In the synthesis step of (C1-2'), in addition to 74.7 g (252 mmol) of octamethylcyclotetrasiloxane, 0.86 g (2.5 mmol) of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane was used. The same operation as the synthesis step of (C1-2') was performed to synthesize a linear organopolysiloxane (C1-2") having a high vinyl content as shown in the following formula (8). (Mn = 2.3 × 105, Mw = 5.0 × 105). The vinyl content calculated by H-NMR spectroscopy was 0.93 mol%.

[0346] Formula (8)

[0347]

[0348] 3. Confirmation of the structure of the cured product of the resin composition

[0349] In Comparative Examples 1 and 2 and Examples 1 to 4, each of the obtained resin compositions was molded under the conditions of a mold temperature of 175° C. and a curing time of 2 minutes to obtain a cured product. In Example 5, the obtained resin composition was pressed at 160° C. and 10 MPa for 20 minutes to be molded into a sheet, and primary cured, and then heated at 200° C. for 4 hours for secondary curing, thereby obtaining a sheet-like silicone rubber cured product.

[0350] The following resin composition analysis was performed on each cured product using pyrolysis GC-MS. GC-MS measurement used an FT-NMR device (JNM-ECA400 manufactured by JEOL Ltd.).

[0351] First, the solidified material was heated at 600°C for 1 minute in a helium atmosphere, and all the generated components were introduced into a GC separation column and trapped with liquid nitrogen. After the heating was completed, the trap was removed, and GC-MS measurement was started immediately thereafter.

[0352] The -Si-O- structure was identified based on the mass spectrum and retention time, and judged according to the following criteria. The results are shown in Table 1.

[0353] (Benchmark)

[0354] OK: The -Si-O- structure can be identified

[0355] N / A: -Si-O- structure could not be identified

[0356] 4. Evaluation of disassembly

[0357] The disassembly properties were evaluated using the following solvents.

[0358] Solvent: Tetrabutylammonium fluoride (0.5 mol / L, THF solution)

[0359] First, in Comparative Examples 1 and 2 and Examples 1 to 4, each of the obtained resin compositions was molded under the conditions of a mold temperature of 175° C. and a curing time of 2 minutes to obtain a cured product (width 10 mm, thickness 4 mm, length 20 mm). In Example 5, the obtained resin composition was pressed at 160° C. and 10 MPa for 20 minutes to be molded into a sheet, and a primary cure was performed, followed by heating at 200° C. for 4 hours for secondary cure, thereby obtaining a sheet-like silicone rubber cured product (width 10 mm, thickness 4 mm, length 20 mm).

[0360] Next, the obtained solidified product was immersed in 25 ml of a solvent in a container and allowed to stand at 23° C. for 24 hours.

[0361] Then, use a shaker (about 200 reciprocating times / minute) to shake the container together for 1 minute, and then filter all the solutions in the container with a filter of 212μm mesh (JIS standard sieve 212μm diameter 100mm). Observe the ability to filter (whether the filter is blocked) and the residue on the filter, and evaluate according to the following criteria. The lower the degree of blockage of the filter and the less the residue, the more the solidified material can be dissolved in the solvent and the better the disintegration property. The results are shown in Table 1.

[0362] (Benchmark)

[0363] A: The filter is not clogged, and there is no solidified residue or very little solidified residue on the filter.

[0364] B: The filter is not clogged, but there is significant solidified residue on the filter.

[0365] C: The filter is immediately clogged and filtering is impossible

[0366] [Table 1]

[0367]

[0368] This application claims priority based on Japanese patent application No. 2022-088784, filed on May 31, 2022, the disclosure of which is incorporated herein in its entirety.

Claims

1. An easily disassembled thermosetting resin composition, comprising a thermosetting component, wherein the easily disassembled thermosetting resin composition is characterized in that: The cured product obtained by thermally curing the easily disintegrable thermosetting resin composition has a structure represented by the following formula (1): In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

2. The easily disassembled thermosetting resin composition according to claim 1, characterized in that: The thermosetting component has a -Si-O- structure.

3. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: The thermosetting component comprises a thermosetting resin and a curing agent, and both the thermosetting component and the curing agent have a -Si-O- structure.

4. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: The thermosetting component includes a thermosetting resin and a curing agent, and the curing agent has a -Si-O- structure.

5. The easily disassembled thermosetting resin composition according to claim 3, characterized in that: The curing agent includes a phenolic curing agent.

6. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: The thermosetting component includes a thermosetting resin and a curing agent, wherein the thermosetting resin has a -Si-O- structure.

7. The easily disassembled thermosetting resin composition according to claim 6, characterized in that: The thermosetting resin comprises one or more selected from epoxy resin, phenoxy resin, polyimide resin, benzoxazine resin, unsaturated polyester resin, phenolic resin, melamine resin, silicone resin, cyanate resin, bismaleimide resin and acrylic resin.

8. The easily disassembled thermosetting resin composition according to claim 7, characterized in that: The thermosetting resin includes an epoxy resin.

9. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: The easily disassembleable thermosetting resin composition further contains an inorganic filler, and the content of the inorganic filler is 10 to 98% by mass based on the total amount of the easily disassembleable thermosetting resin composition.

10. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: Contains silyl ether modified novolac resin.

11. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: Contains a phenolic resin having a weight average molecular weight (Mw) of 500 to 10,000.

12. A structure, characterized in that: A cured product comprising the easily disintegratable thermosetting resin composition according to claim 1 or 2.

13. A semiconductor device, characterized in that: include: Semiconductor components; and A sealing material for sealing the semiconductor element, The sealing material is formed of a cured product of the easily disassembled thermosetting resin composition according to claim 1 or 2.

14. A disassembly method, which is a method for disassembling a cured product of the easily disassemblyable thermosetting resin composition according to claim 1 or 2, characterized in that: include: A step of immersing the cured product of the easily disassembleable thermosetting resin composition in a solvent to disassemble the cured product.

15. The disassembly method according to claim 14, characterized in that: The solvent is a solvent containing fluoride ions.

16. The disassembly method according to claim 14, characterized in that: The impregnation is carried out at -20 to 200°C.

17. The disassembly method according to claim 14, characterized in that: The immersion is carried out at 5-30°C.

18. A recycling method, which is a method for recycling materials constituting the structure according to claim 12, characterized in that: include: A step of immersing the structure in a solvent to disintegrate the cured product of the easily disintegratable thermosetting resin composition; and A step of recovering the material from the structure.

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