Electronic device including structure for connecting adhesive members

Abstract

An electronic device according to an embodiment includes: a display; a housing including a base and a sidewall structure disposed on an edge of the base, where the sidewall structure includes a support surface for supporting the display, an outer surface surrounding the support surface and facing an exterior of the electronic device, and a through hole extending from the outer surface to the support surface; a first adhesive member disposed on the support surface and covering a portion of one end of the through hole located on the support surface; a second adhesive member spaced apart from the first adhesive member and disposed on the support surface, and covering another portion of the one end of the through hole; and a sealing member filling at least a portion of the through hole and connecting the first adhesive member and the second adhesive member.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a structure for connecting an adhesive member. Background Art

[0002] An electronic device may include multiple electronic components for providing various functions to a user. For example, an electronic device may include a display for providing visual information to a user. The display may be formed by joining with a component of the electronic device for supporting the display to form an electronic device. Summary of the invention

[0003] Technical issues

[0004] When the display is set on a component (e.g., a housing) for supporting the display, a gap may be formed between the display and the component. In order to suppress the inflow of foreign matter (such as dust and / or water) through the gap, the electronic device may include a plurality of adhesive members arranged between the display and the component. In the case where the plurality of adhesive members are spaced apart from each other, foreign matter may flow in through the space between the plurality of adhesive members. The electronic device may require a structure for connecting a plurality of adhesive members to suppress the inflow of foreign matter.

[0005] Technical problems to be achieved in this document are not limited to those described above, and other technical problems not mentioned herein will be clearly understood from the following description by persons having ordinary knowledge in the field to which the present disclosure belongs.

[0006] Technical Solution

[0007] An electronic device according to an embodiment may include a display, a housing, the housing including a base and a through hole, the base including a support surface supporting the display and an outer surface arranged on the periphery of the base surrounding the support surface and facing the outside of the electronic device, the through hole extending from the outer surface to the support surface, and the housing including a sidewall structure arranged on the periphery of the base. According to an embodiment, the electronic device may include a first adhesive member, which is arranged on the support surface and covers a portion of one end of the through hole arranged on the support surface. According to an embodiment, the electronic device may include a second adhesive member, which is spaced apart from the first adhesive member, is arranged on the support surface, and covers another portion of one end of the through hole. According to an embodiment, the electronic device may include a sealing member, which fills at least a portion of the through hole and connects the first adhesive member and the second adhesive member.

[0008] An electronic device according to an embodiment may include a display, a housing, the housing including a base and an inner surface, the base including a support surface supporting the display and an outer surface surrounding the support surface and facing the outside of the electronic device, the inner surface being opposite to the outer surface, the housing including a through hole extending from the outer surface to the support surface, and including a sidewall structure provided on the periphery of the base. According to an embodiment, the electronic device may include a speaker provided on the inner surface and configured to output audio. According to an embodiment, the electronic device may include a first adhesive member provided on the support surface and covering a portion of one end of the through hole provided on the support surface. According to an embodiment, the electronic device may include a second adhesive member spaced apart from the first adhesive member, provided on the support surface, and covering another portion of one end of the through hole. According to an embodiment, the electronic device may include a sealing member filling at least a portion of the through hole and connecting the first adhesive member and the second adhesive member. According to an embodiment, the sidewall structure may include a plurality of speaker holes extending from the outer surface to the inner surface and spaced apart from each other. According to an embodiment, on the outer surface, a distance between one of the plurality of speaker holes and another of the plurality of speaker holes is the same as a distance between one of the plurality of speaker holes and the through hole on the outer surface.

[0009] Beneficial Effects

[0010] An electronic device according to an embodiment may provide a structure capable of preventing foreign matter from flowing in through a gap between a display and a housing by means of adhesive members connected to each other. Alternatively or additionally, an electronic device according to an embodiment may provide a structure in which it is not necessary to use an integrated single-piece waterproof tape in the form of a closed loop for providing a waterproof and / or dustproof connection of the display to the housing. Such an integrated waterproof tape extending in a closed loop around the display may significantly increase the material cost of the electronic device. In addition, it may be difficult to fix such an integrated single-piece annular waterproof tape to the electronic device, and the size of the closed loop tape should be adapted to the size of the display to be connected. This may reduce the assemblability of the electronic device and / or may increase the assembly cost.

[0011] Effects obtainable from the present disclosure are not limited to those described above, and any other effects not mentioned herein will be clearly understood from the following description by a person having ordinary knowledge in the field to which the present disclosure pertains. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0013] Figure 2a is a perspective view of an electronic device according to an embodiment.

[0014] Figure 2bis an exploded perspective view of an electronic device according to an embodiment.

[0015] Figure 2c is a top view of a housing of an electronic device according to an embodiment.

[0016] Figure 3a is an enlarged perspective view of a housing of an electronic device according to an embodiment.

[0017] Figure 3b is an enlarged perspective view of a housing of an electronic device according to an embodiment.

[0018] Figure 4 FIG. 1 is a diagram showing an electronic device according to an embodiment Figure 2a A cross-sectional view of the example cut along line A-A'.

[0019] Figure 5 is a cross-sectional view illustrating an example in which an electronic device according to an exemplary embodiment is cut.

[0020] Figure 6 is a top view of a housing of an electronic device according to an embodiment. DETAILED DESCRIPTION

[0021] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0022] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0023] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0024] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0025] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0026] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0027] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0028] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the implementation, the receiver can be implemented as a separate speaker or as part of the speaker.

[0029] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0030] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0031] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0032] The interface 177 may support one or more specific protocols that will be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0033] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0035] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0036] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (for example, a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules can be implemented as a single component (for example, a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (for example, multiple chips). The wireless communication module 192 can use user information (for example, an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0039] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). Depending on the embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0040] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0041] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0042] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0043] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0044] Figure 2a is a perspective view of an electronic device according to an embodiment, Figure 2b is an exploded perspective view of an electronic device according to an embodiment, and Figure 2c is a top view of a housing of an electronic device according to an embodiment.

[0045] refer to Figure 2a , Figure 2b and Figure 2c According to the electronic device 200 (eg, Figure 1 The electronic device 101 may include a housing 210, a display 220 (eg, Figure 1display module 160), a speaker 230 (eg, Figure 1 audio module 170), multiple adhesive members 240 and / or sealing members 250.

[0046] According to an embodiment, the housing 210 may define at least a portion of the outer surface of the electronic device 200. The housing 210 may define an inner space 210a for mounting various components of the electronic device 200. According to an embodiment, the housing 210 may include a base 211 and / or a sidewall structure 212. The base 211 may define at least a portion of the outer surface of the electronic device 200 together with the sidewall structure 212. For example, the base 211 may define the rear surface of the electronic device 200. The rear surface of the electronic device 200 may mean a surface opposite to the front surface of the electronic device 200 on which the display 220 is disposed. According to an embodiment, the base 211 may include a receiving surface 211a. The receiving surface 211a may mean an inner surface of the base 211 facing the display 220 and substantially parallel to one surface 220a of the display 220. The receiving surface 211a of the base 211 may be opposite to the rear surface of the electronic device 200. According to an embodiment, the base 211 may define an inner space 210 a of the housing 210 together with the sidewall structure 212 .

[0047] The sidewall structure 212 may support the display 220. According to an embodiment, the sidewall structure 212 may be disposed at the periphery of the base 211. The periphery may mean an area including a boundary that distinguishes one component from other components among an area included in a component, and unless otherwise specified, corresponding expressions may be used in the same manner below. For example, the sidewall structure 212 may be disposed on the base 211 and may surround the periphery of the display 220. The sidewall structure 212 may define at least a portion of a side surface of the electronic device 200. For example, the side surface of the electronic device 200 may mean an outer surface of the electronic device 200 surrounding the front surface and / or rear surface of the electronic device 200. The side surface of the electronic device 200 may be perpendicular to the front surface of the electronic device 200.

[0048] According to an embodiment, the sidewall structure 212 may include a support surface 212a, an outer surface 212b and / or an inner surface 212c. The support surface 212a may support the display 220. According to an embodiment, the support surface 212a may face the periphery of the display 220. The support surface 212a may be substantially parallel to a surface 220a of the display 220 facing the inner space 210a. The support surface 212a may be spaced apart from the receiving surface 211a of the base 211. For example, the support surface 212a may be disposed between a surface 220a of the display 220 and the receiving surface 211a of the base 211. The outer surface 212b of the sidewall structure 212 may face the outside of the electronic device 200 and define the side surface of the electronic device 200. According to an embodiment, the outer surface 212b may surround the display 220 and the support surface 212a. For example, the outer surface 212b may be substantially perpendicular to the support surface 212a, but is not limited thereto. According to an embodiment, the outer surface 212 b of the sidewall structure 212 may have a bent shape to have a curvature.

[0049] According to an embodiment, the sidewall structure 212 may include a first sidewall 213, a second sidewall 214, a third sidewall 215, and a fourth sidewall 216. The first sidewall 213 may extend in a first direction (e.g., +x direction) on the base 211. The second sidewall 214 may extend on the base 211 to be perpendicular to the first sidewall 213. For example, the second sidewall 214 may extend from one end of the first sidewall 213 facing the first direction in a second direction (e.g., +y direction) perpendicular to the first direction. The third sidewall 215 may extend on the base 211 to be perpendicular to the first sidewall 213. For example, the third sidewall 215 may extend in a second direction from the other end of the first sidewall 213 facing the direction opposite to the first direction (e.g., -x direction). The third sidewall 215 may be parallel to the second sidewall 214. The third sidewall 215 may face the second sidewall 214 and may be spaced apart from the second sidewall 214 in a direction opposite to the first direction (e.g., -x direction). The fourth sidewall 216 may be parallel to the first sidewall 213. For example, the fourth sidewall 216 may extend in the first direction between one end of the second sidewall 214 facing the second direction (e.g., +y direction) and one end of the third sidewall 215. The fourth sidewall 216 may face the first sidewall 213 and may be spaced apart from the first sidewall 213 in the second direction.

[0050] According to an embodiment, the plurality of side walls 213, 214, 215, and 216 may contact each other to define a plurality of corners of the housing 210. For example, the plurality of corners may be provided in an area where the first side wall 213 and the second side wall 214 contact, an area where the first side wall 213 and the third side wall 215 contact, and an area where the second side wall 214 and the fourth side wall 216 contact. According to an embodiment, the plurality of corners of the housing 210 may have a curvature and be bent, but is not limited thereto. According to an embodiment, when the plurality of side walls 213, 214, 215, and 216 contact each other vertically, at least a portion of the plurality of corners may not have a curvature.

[0051] The display 220 may be configured to provide visual information to the user. According to an embodiment, the display 220 may be disposed on the housing 210 to define at least a portion of the front surface of the electronic device 200. For example, the front surface of the electronic device 200 may be defined by the display 220 and the sidewall structure 212 surrounding the periphery of the display 220. According to an embodiment, the display 220 may be disposed on the sidewall structure 212 of the housing 210. For example, the display 220 may be disposed on the support surface 212a of the sidewall structure 212. The display 220 may be spaced apart from the receiving surface 211a of the base 211. According to an embodiment, the display 220 may include a plurality of layers stacked in sequence. For example, the plurality of layers may include a thin film transistor (TFT) and a light emitting layer including a plurality of pixels controlled by the TFT. A plurality of pixels included in the light emitting layer may emit light toward the outside of the electronic device 200 based on a current or voltage supplied from the TFT. According to an embodiment, the display 220 may include a display driver integrated circuit (DDI) controlling the operation of the plurality of layers.

[0052] The speaker 230 may be configured to output audio information to the user. According to an embodiment, the speaker 230 may be disposed inside the housing 210. For example, the speaker 230 may be disposed on the receiving surface 211a of the base 211 parallel to the support surface 212a. According to an embodiment, the housing 210 may include at least one speaker hole 217. At least one speaker hole 217 may transmit the audio output from the speaker 230 disposed in the housing 210 to the outside of the housing 210. At least one speaker hole 217 may connect the inner space 210a of the housing 210 to the outside of the housing 210. For example, at least one speaker hole 217 may extend from the outer surface 212b of the side wall structure 212 to the inner surface 212c of the side wall structure 212 opposite to the outer surface 212b. According to an embodiment, at least one speaker hole 217 may be disposed on at least one of the first side wall 213 and the fourth side wall 216. According to an embodiment, at least one speaker hole 217 may include a plurality of speaker holes spaced apart from each other, but is not limited thereto. According to an embodiment, at least one speaker hole 217 may include one hole extending long in the first direction (eg, +x direction). In the case where at least one hole has a long extending shape, a mesh may be provided on the at least one hole.

[0053] According to an embodiment, the housing 210 may include a through hole 218 connecting the outside of the housing 210 and the inside of the housing 210. The through hole 218 may extend from the outer surface 212b of the sidewall structure 212 to the support surface 212a of the sidewall structure 212. According to an embodiment, the position of the through hole 218 may correspond to the position of the at least one speaker hole 217. For example, in the case where the at least one speaker hole 217 is provided on the first sidewall 213, the through hole 218 may be provided on the first sidewall 213 to be adjacent to the at least one speaker hole 217. According to an embodiment, one end 218a of the through hole 218 provided on the support surface 212a may be covered by the display 220. Since the one end 218a of the through hole 218 is covered by the display 220, the one end 218a of the through hole 218 may not be visible from the outside of the electronic device 200.

[0054] A plurality of adhesive members 240 may inhibit foreign matter (e.g., moisture or dust) from flowing in through the gap between the housing 210 and the display 220. According to an embodiment, a plurality of adhesive members 240 may be provided on the sidewall structure 212 of the housing 210. For example, a plurality of adhesive members 240 may be provided on the support surface 212a of the sidewall structure 212 to contact the periphery of the display 220. According to an embodiment, a plurality of adhesive members 240 may attach the display 220 to the housing 210. For example, a plurality of adhesive members 240 may be interposed between the display 220 and the housing 210. A plurality of adhesive members 240 may include an adhesive material that attaches the display 220 to the support surface 212a. A plurality of adhesive members 240 may maintain the connection between the housing 210 and the display 220 by the adhesive material. For example, a plurality of adhesive members 240 may be a belt including an adhesive material, but is not limited thereto. According to an embodiment, a plurality of adhesive members 240 may be spaced apart from each other.

[0055] According to an embodiment, the plurality of adhesive members 240 may include a first adhesive member 241, a second adhesive member 242, a third adhesive member 243, and a fourth adhesive member 244. The first adhesive member 241 may be disposed on the support surface 212a and may extend along a portion of the first side wall 213. For example, the first adhesive member 241 may extend along a first direction on a portion of the first side wall 213. The length of the first adhesive member 241 extending in the first direction may be shorter than the length of the first side wall 213. The second adhesive member 242 may be spaced apart from the first adhesive member 241 and may be disposed on the support surface 212a. The second adhesive member 242 may extend along another portion of the first side wall 213 and the second side wall 214. The second adhesive member 242 may extend along a portion of the fourth side wall 216. For example, the second adhesive member 242 may extend along the first direction on another portion of the first side wall 213, and may extend along a second direction perpendicular to the first direction on the second side wall 214. The length of the second adhesive member 242 extending in the second direction may correspond to the length of the second side wall 214. The second adhesive member 242 may extend in the first direction on a portion of the fourth side wall 216. The third adhesive member 243 may be symmetrical to the first adhesive member 241 with respect to the display 220. For example, the third adhesive member 243 may extend along another portion of the fourth side wall 216. The fourth adhesive member 244 may be symmetrical to the second adhesive member 242 with respect to the display 220. For example, the fourth adhesive member 244 may extend along another portion of the first side wall 213, the third side wall 215, and another portion of the fourth side wall 216.

[0056] although Figure 2bThe number of the plurality of bonding members 240 is shown to be 4, but the number of bonding members is not limited thereto. According to an embodiment, the number of the plurality of bonding members 240 may be 2. For example, the plurality of bonding members 240 may include a first bonding member 241 and a second bonding member 242. In the case where the number of the plurality of bonding members 240 is 2, the first bonding member 241 may extend along a portion of the first side wall 213, and the second bonding member 242 may extend along another portion of the first side wall 213, the second side wall 214, the third side wall 215, and the fourth side wall 216.

[0057] According to an embodiment, the positions at which the plurality of adhesive members 240 are segmented may correspond to the positions of the through-holes 218 on the support surface 212a. For example, the first adhesive member 241 and the second adhesive member 242 may be spaced apart from each other relative to the through-hole 218. A portion of one end 218a of the through-hole 218 disposed on the support surface 212a may be covered by the first adhesive member 241 and the second adhesive member 242. For example, the first adhesive member 241 may cover a portion of one end 218a of the through-hole 218 disposed on the support surface 212a. The second adhesive member 242 may cover another portion of one end 218a of the through-hole 218. The second adhesive member 242 may be spaced apart from the first adhesive member 241 on one end 218a of the through-hole 218.

[0058] According to an embodiment, the first adhesive member 241 may include a first extension portion 241a and a second extension portion 241b, the first extension portion 241a covering a portion of one end 218a of the through hole 218 disposed on the support surface 212a, and the second extension portion 241b connected to the first extension portion 241a and having a width wider than the width of the first extension portion 241a. For example, the second extension portion 241b may extend from the first extension portion 241a in a direction away from the through hole 218 (e.g., -x direction). The width of a component may mean the length of the component in the second direction (e.g., +y direction), and unless otherwise specified, the corresponding expressions may be used in the same manner below. According to an embodiment, the second adhesive member 242 may include a third extension portion 242a and a fourth extension portion 242b, the third extension portion 242a covering the other portion of the one end 218a of the through hole 218 disposed on the support surface 212a, and the fourth extension portion 242b connected to the third extension portion 242a and having a width wider than the width of the third extension portion 242a. The fourth extension portion 242b may extend from the third extension portion 242a in a direction away from the through hole 218 (e.g., +x direction). The fourth extension portion 242b may face the second extension portion 241b and may extend in a direction opposite to the extension direction of the second extension portion 241b.

[0059] The sealing member 250 can inhibit foreign matter (e.g., moisture or dust) from flowing in through the gap between the housing 210 and the display 220. According to an embodiment, the sealing member 250 can connect a plurality of adhesive members 240. For example, the sealing member 250 can be disposed between the first adhesive member 241 and the second adhesive member 242 to connect the first adhesive member 241 and the second adhesive member 242. When the sealing member 250 connects a plurality of adhesive members 240, a closed loop can be defined on the support surface 212a of the sidewall structure 212 together with the plurality of adhesive members 240. According to an embodiment, the structure of the closed loop formed by the plurality of adhesive members 240 and the sealing member 250 can reduce the inflow of moisture or foreign matter from the outside of the electronic device 200. For example, the plurality of adhesive members 240 and the sealing member 250 can fill the gap between the display 220 and the housing 210. The plurality of adhesive members 240 and the sealing member 250 can isolate the inside of the electronic device 200 from the outside of the electronic device 200.

[0060] According to an embodiment, the sealing member 250 may fill the gap between the plurality of adhesive members 240. For example, the sealing member 250 may fill the gap between the first adhesive member 241 and the second adhesive member 242. In the case where the first adhesive member 241 and the second adhesive member 242 overlap each other, the coupling between the display 220 and the housing 210 may be unstable due to the step generated by the overlap of the first adhesive member 241 and the second adhesive member 242. In the case where the plurality of adhesive members 240 are integrally manufactured to prevent the formation of the step, the manufacturing cost of the electronic device 200 may increase. For the stable coupling of the display 220 and the housing 210 and the reduction of the manufacturing cost of the electronic device 200, the first adhesive member 241 and the second adhesive member 242 may be spaced apart from each other. When the first adhesive member 241 and the second adhesive member 242 are spaced apart from each other, foreign matter (e.g., moisture or dust) may flow into the interior of the housing 210 through the gap between the first adhesive member 241 and the second adhesive member 242. The electronic device 200 according to the embodiment may provide a structure capable of suppressing the inflow of foreign matter into the inside of the electronic device 200 by filling a gap between the first adhesive member 241 and the second adhesive member 242 with the sealing member 250 .

[0061] According to an embodiment, the sealing member 250 may fill at least a portion of the through hole 218. For example, the sealing member 250 may fill one end 218a of the through hole 218 disposed on the support surface 212a. The sealing member 250 may contact the first adhesive member 241 and the second adhesive member 242 covering the one end 218a of the through hole 218 by filling the one end 218a of the through hole 218. According to an embodiment, when manufacturing the electronic device 200, the sealing member 250 may be formed by curing the solution containing silicon injected into the through hole 218. For example, the sealing member 250 may include a rolled plastic gasket (CIPG), but is not limited thereto. When manufacturing the electronic device 200, in a state where the housing 210 and the display 220 are connected by a plurality of adhesive members 240, a solution for forming the sealing member 250 may flow in through the through hole 218. The solution flowing in through the through hole 218 may fill one end 218a of the through hole 218 on the support surface 212a. The solution flowing in through the through hole 218 may connect the first adhesive member 241 and the second adhesive member 242 disposed on the support surface 212a. The electronic device 200 according to the embodiment may provide a structure for reducing the manufacturing cost of the electronic device 200 by forming the sealing member 250 by a relatively simple process.

[0062] As described above, the electronic device 200 according to the embodiment can provide a structure capable of suppressing foreign matter from flowing into the inside of the electronic device 200 by connecting the sealing member 250 of the plurality of adhesive members 240. The electronic device 200 according to the embodiment can provide a structure that reduces the manufacturing cost of the electronic device 200 by providing the sealing member 250 through the through hole 218.

[0063] Meanwhile, the first adhesive member 241, the second adhesive member 242, and the sealing member 250 have been described as being disposed on the support surface 212 facing the display 220, but are not limited thereto. For example, when the housing 210 is formed by the sidewall structure 212 and a member defining the rear surface of the electronic device 200 opposite to the display 220 (which defines the front surface of the electronic device 200), the first adhesive member 241, the second adhesive member 242, and the sealing member 250 may be placed between the member and the sidewall structure 212.

[0064] Hereinafter, the structure of the embodiment will be described based on the first and second adhesive members 241 and 242 , but this is for convenience of description. The following description of the first and second adhesive members 241 and 242 may be substantially equally applied to each of the plurality of adhesive members 240 .

[0065] Figure 3a is an enlarged perspective view of a housing of an electronic device according to an embodiment, and Figure 3bis an enlarged perspective view of a housing of an electronic device according to an embodiment.

[0066] Figure 3a and Figure 3b Shown are multiple bonding members (e.g., Figure 2a , Figure 2b and Figure 2c A plurality of bonding members 240) and a sealing member (eg, Figure 2c 250) are removed.

[0067] refer to Figure 3a and Figure 3b According to an embodiment, at least one speaker hole 217 may penetrate the side wall structure 212. For example, at least one speaker hole 217 may penetrate the first side wall 213 of the side wall structure 212. According to an embodiment, the side wall structure 212 may include a plurality of speaker holes 217a, 217b, 217c, 217d, and 217e spaced apart from each other. Each of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may be spaced apart from each other by a specified interval in a first direction (e.g., +x direction). For example, the first speaker hole 217a among the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may be spaced apart from the second speaker hole 217b by a first distance. According to an embodiment, the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may be parallel to each other. For example, each of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may extend along the second direction (e.g., +y direction) from the outer surface 212b of the sidewall structure 212 to the inner surface 212c of the sidewall structure 212. According to an embodiment, the shape of one end of each of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e disposed on the outer surface 212b may be substantially the same as the shape of the other end of each of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e disposed on the inner surface 212c.

[0068] According to an embodiment, the through hole 218 may be arranged near at least one speaker hole 217. For example, the through hole 218 may be arranged near the first speaker hole 217a among the plurality of speaker holes 217a, 217b, 217c, 217d and 217e. The corner 210b of the housing 210 that contacts the first side wall 213 and the second side wall 214 may be close to the through hole 218 among the plurality of speaker holes 217a, 217b, 217c, 217d and 217e and the through hole 218. The following description is described based on the through hole 218 and the plurality of speaker holes 217a, 217b, 217c, 217d and 217e, but the embodiment is not limited thereto. For example, the through hole 218 may be arranged near other holes (not shown) included in the housing 210. The shape of the through hole 218 may be substantially the same as the other holes included in the housing 210.

[0069] According to an embodiment, the shape of the other end 218b of the through hole 218 disposed on the outer surface 212b of the sidewall structure 212 may correspond to the shape of one end of the at least one speaker hole 217 disposed on the outer surface 212b of the sidewall structure 212. For example, when observed from the outside of the electronic device, the shape of the at least one speaker hole 217 substantially corresponds to the shape of the through hole 218. For example, the shape of the other end 218b of the through hole 218 may be substantially the same as the shape of one end of the at least one speaker hole 217. For example, when the sidewall structure 212 is observed in a direction perpendicular to the outer surface 212b (e.g., the +y direction), the shape of the through hole 218 and the shape of the at least one speaker hole 217 may be the same as each other. In a state where the electronic device 200 is manufactured and one end 218a of the through hole 218 is displayed (e.g., Figure 2a and Figure 2b The other end 218b of the through hole 218 may be visible from the outside of the electronic device 200. In the case where the shape of the other end 218b of the through hole 218 is different from the shape of one end of the at least one speaker hole 217, the shape of the sealing member (e.g., Figure 2c The through hole 218 of the sealing member 250 may reduce the appearance quality of the electronic device 200. The electronic device 200 according to the embodiment can provide a structure with excellent appearance quality by having the through hole 218 having substantially the same shape as the at least one speaker hole 217 on the outer surface 212b of the sidewall structure 212.

[0070] According to an embodiment, the extension direction of the through hole 218 may be different from the extension direction of the at least one speaker hole 217. For example, the at least one speaker hole 217 may extend from the outer surface 212b of the side wall structure 212 to the inner surface 212c, and the through hole 218 may extend from the outer surface 212b of the side wall structure 212 to the support surface 212a perpendicular to the inner surface 212c. In the case where one end 218a of the through hole 218 is disposed on the inner surface 212c, the solution used to form the sealing member 250 may be transferred to the inner surface 212c. The solution used to form the sealing member 250 may be transferred to the receiving surface 211a through the inner surface 212c. The speaker (e.g., Figure 2b The speaker 230 of the embodiment may be damaged by the solution transmitted to the receiving surface 211a. The electronic device 200 according to the embodiment may provide a structure capable of preventing the solution used to form the sealing member 250 from being transmitted to the receiving surface 211a when manufacturing the electronic device 200 through the through hole 218 extending in a direction different from the extending direction of the at least one speaker hole 217. The electronic device 200 according to the embodiment may provide a structure capable of preventing damage to the speaker 230 through the through hole 218 (which prevents the solution from being transmitted to the receiving surface 211a).

[0071] According to an embodiment, a distance between one speaker hole and another speaker hole among the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e on the outer surface 212b of the sidewall structure 212 may be the same as a distance between one speaker hole and the through hole 218 on the outer surface 212b of the sidewall structure 212. An interval between the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may be the same as a distance between one speaker hole among the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e and the through hole 218. For example, on the outer surface 212b of the sidewall structure 212, the second speaker hole 217b may be spaced apart from the first speaker hole 217a by a first distance, and the through hole 218 may be spaced apart from the first speaker hole 217a by a first distance. For another example, the other end 218b of the through hole 218 disposed on the outer surface 212b of the side wall structure 212 may be spaced apart from the one end of the first speaker hole 217a disposed on the outer surface 212b of the side wall structure 212 by a first distance. Since the distance between the through hole 218 and the first speaker hole 217a on the outer surface 212b of the side wall structure 212 is the same as the intervals between the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e, the through hole 218 and the at least one speaker hole 217 may be indistinguishable from each other on the outside of the electronic device 200. Since the through hole 218 and the at least one speaker hole 217 are indistinguishable from each other on the outside of the electronic device 200, the electronic device 200 according to the embodiment may provide a structure having excellent appearance quality.

[0072] According to an embodiment, the shape of one end 218 a of the through hole 218 disposed on the support surface 212 a of the sidewall structure 212 may be different from the shape of the other end 218 b of the through hole 218 disposed on the outer surface 212 b of the sidewall structure 212 .

[0073] As described above, the electronic device 200 according to the embodiment may provide a structure having excellent appearance quality while suppressing inflow of foreign matter into the electronic device 200 by having the through hole 218 having substantially the same shape as the at least one speaker hole 217 on the outer surface 212 b of the sidewall structure 212 .

[0074] exist Figure 3a and Figure 3b, a plurality of speaker holes 217a, 217b, 217c, 217d, and 217e are shown as being spaced apart from each other, but the embodiment is not limited thereto. For example, a portion of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e and the through hole 218 may be connected to each other. A portion of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may be connected to the other end 218b of the through hole 218 on the outer surface 212b of the side wall structure 212. Since one end 218a of the through hole 218 is disposed on the support surface 212a, another portion of the plurality of speaker holes 217a, 217b, 217c, 217d, and 217e may be spaced apart from the through hole 218 on the inner surface 212c of the side wall structure 212. For another example, the through hole 218 may be connected to the first speaker hole 217a inside the side wall structure 212. In the case where the through hole 218 and the first speaker hole 217a are connected to each other, the other end 218b of the through hole 218 disposed on the outer surface 212b of the side wall structure 212 and one end of the first speaker hole 217a may define a hole. In the case where the through hole 218 and the first speaker hole 217a are connected to each other, the other end of the first speaker hole 217a may be disposed on the inner surface 212c of the side wall structure 212, and the one end 218a of the through hole 218 may be disposed on the support surface 212a of the side wall structure 212. In the case where the through hole 218 and the first speaker hole 217a are connected to each other, the audio output from the speaker 230 may pass through the other end of the first speaker hole 217a disposed on the inner surface 212c of the side wall structure 212, and may be transmitted to the outside of the electronic device 200 through the one end of the first speaker hole 217a disposed on the outer surface 212b of the side wall structure 212 and the other end 218b of the through hole 218.

[0075] Figure 4 FIG. 1 is a diagram showing an electronic device according to an embodiment Figure 2a A cross-sectional view of the example cut along line A-A'.

[0076] refer to Figure 4According to an embodiment, the through hole 218 may include a first region 218c and a second region 218d. The first region 218c may extend from the outer surface 212b of the sidewall structure 212 in a direction inclined relative to the outer surface 212b. For example, the first region 218c may extend from the outer surface 212b of the sidewall structure 212 in a direction closer to the support surface 212a. According to an embodiment, the first region 218c may define the other end 218b of the through hole 218 disposed on the outer surface 212b of the sidewall structure 212. The second region 218d may be connected to the first region 218c and may extend from the first region 218c to the support surface 212a. The second region 218d may extend from the first region 218c to the support surface 212a in a direction perpendicular to the support surface 212a. The second region 218d may extend in a direction parallel to the outer surface 212b of the sidewall structure 212. According to an embodiment, the second region 218d may define an end 218a of the through hole 218 disposed on the support surface 212a.

[0077] According to an embodiment, the first adhesive member 241 and the second adhesive member 242 may be spaced apart from each other on the one end 218a of the through hole 218. A gap g may be formed between the first adhesive member 241 and the second adhesive member 242.

[0078] According to an embodiment, when manufacturing the electronic device 200, in a state where the display 220 is set on the support surface 212a, a solution for forming the sealing member 250 may flow between the first adhesive member 241 and the second adhesive member 242 through the through hole 218. For example, the solution for forming the sealing member 250 may flow into the through hole 218 through the needle n inserted into the through hole 218. The solution flowing into the through hole 218 may fill at least a portion of the through hole 218. For example, the solution flowing into the through hole 218 may fill at least a portion of the second region 218d of the through hole 218. The solution flowing into the through hole 218 may fill the gap g provided between the first adhesive member 241 and the second adhesive member 242. The solution filling the gap g and at least a portion of the through hole 218 may be cured to form the sealing member 250.

[0079] According to an embodiment, the contact area of ​​the sealing member 250, the first adhesive member 241, and the second adhesive member 242 may extend through the first adhesive member 241 and the second adhesive member 242 covering the one end 218a of the through hole 218. For example, in the case where the first adhesive member 241 and the second adhesive member 242 do not cover the one end 218a of the through hole 218, the sealing member 250 may not contact one surface of the first adhesive member 241 facing the second area 218d and one surface of the second adhesive member 242 facing the second area 218d. Since the contact area between the sealing member 250, the first adhesive member 241, and the second adhesive member 242 is reduced, the coupling strength between the sealing member 250, the first adhesive member 241, and the second adhesive member 242 may be reduced. When the first bonding member 241 and the second bonding member 242 cover one end 218a of the through hole 218, when the sealing member 250 contacts a surface of the first bonding member 241 facing the second area 218d and a surface of the second bonding member 242 facing the second area 218d, the contact area between the sealing member 250, the first bonding member 241 and the second bonding member 242 can be relatively increased.

[0080] As described above, the electronic device 200 according to the embodiment can provide a structure in which the first adhesive member 241 and the second adhesive member 242 are easily coupled through the through hole 218 connecting the outer surface 212b of the sidewall structure 212 and the support surface 212a. The electronic device 200 according to the embodiment can provide a structure in which the coupling strength between the sealing member 250, the first adhesive member 241 and the second adhesive member 242 is increased by the first adhesive member 241 and the second adhesive member 242 covering the one end 218a of the through hole 218.

[0081] At the same time, despite Figure 4 The through hole 218 is shown to be spaced apart from the inner surface 212c of the sidewall structure 212, but embodiments are not limited thereto. For example, the first region 218c of the through hole 218 may extend from the outer surface 212b of the sidewall structure 212 to the inner surface 212c of the sidewall structure 212. When the first region 218c of the through hole 218 extends from the outer surface 212b of the sidewall structure 212 to the inner surface 212c of the sidewall structure 212, the first region 218c of the through hole 218 may be connected to the speaker (e.g., Figure 2b The audio output by the speaker 230) is transmitted to the outside of the electronic device 200.

[0082] Figure 5 is a cross-sectional view illustrating an example in which an electronic device according to an exemplary embodiment is cut.

[0083] because Figure 5The electronic device 200 may be one in which the internal structure of the through hole 218 is Figure 4 The electronic device 200 is changed in the electronic device 200, so the overlapping description is omitted.

[0084] refer to Figure 5 According to an embodiment, the through hole 218 may include a first region 218c and a second region 218d. The first region 218c may extend from the outer surface 212b of the sidewall structure 212 in a direction perpendicular to the outer surface 212b (e.g., +y direction). The second region 218d may extend from the first region 218c to the support surface 212a in a direction perpendicular to the first region 218c. For example, the second region 218d may extend from the first region 218c to the support surface 212a in a direction perpendicular to the support surface 212a.

[0085] According to an embodiment, when the electronic device 200 is manufactured, in a state where the display 220 is set on the support surface 212a, a solution for forming the sealing member 250 may flow between the first adhesive member 241 and the second adhesive member 242 through the through hole 218. For example, the solution for forming the sealing member 250 may flow into the through hole 218 through a needle n inserted into the through hole 218. As the solution flowing into the through hole 218 is cured, the sealing member 250 connecting the first adhesive member 241 and the second adhesive member 242 may be formed.

[0086] As described above, the electronic device 200 according to the embodiment may provide a structure in which the first adhesive member 241 and the second adhesive member 242 are easily coupled through the through hole 218 connecting the outer surface 212 b of the sidewall structure 212 and the support surface 212 a .

[0087] Figure 6 is a top view of a housing of an electronic device according to an embodiment.

[0088] refer to Figure 6 , the electronic device 600 according to the embodiment may include a housing 610, a plurality of adhesive members 640, a sealing member 650 and / or at least one flow path 660. Figure 6 The housing 610, the plurality of adhesive members 640 and the sealing member 650 may be respectively Figure 2a , Figure 2b and Figure 2c The housing 210, the plurality of adhesive members 240 and the sealing member 250 are substantially the same, and thus overlapping descriptions are omitted.

[0089] According to an embodiment, the housing 610 may include an inner space 610a, a sidewall structure 612, a through hole 618, and at least one receiving groove 619. Figure 6The inner space 610a, the sidewall structure 612 and the through hole 618 can be Figure 2a , Figure 2b and Figure 2c The inner space 210a, the sidewall structure 212 and the through hole 218 are substantially the same, and thus overlapping descriptions are omitted.

[0090] According to an embodiment, the sidewall structure 212 may include a support surface 612a and an outer surface 612b. Figure 6 The support surface 612a and the outer surface 612b can be Figure 2a , Figure 2b and Figure 2c The support surface 212a and the outer surface 212b are substantially the same, and thus overlapping descriptions are omitted.

[0091] According to an embodiment, when manufacturing the electronic device 600, at least one accommodating groove 619 can prevent the solution for forming the sealing member 650 from being transmitted to the outside of the support surface 612a. For example, when manufacturing the electronic device 600, at least one accommodating groove 619 can accommodate the solution for forming the sealing member 650 transmitted to the outside of the through hole 618. The solution contained in the at least one accommodating groove 619 can be solidified in the at least one accommodating groove 619. When the solution for forming the sealing member 650 is solidified in the at least one accommodating groove 619, it may not be transmitted to the outside of the support surface 612a. According to an embodiment, at least one accommodating groove 619 can be formed by making the support surface 612a inwardly concave. According to an embodiment, at least one accommodating groove 619 can be spaced apart from the through hole 618. For example, at least one accommodating groove 619 may include a first accommodating groove 619a spaced apart from the through hole 618 in a direction opposite to the first direction (e.g., -x direction) and a second accommodating groove 619b spaced apart from the through hole 618 in a first direction (e.g., +x direction). The second accommodation groove 619b may face the first accommodation groove 619a. According to an embodiment, the first accommodation groove 619a and the second accommodation groove 619b may be symmetrical to each other with respect to the through hole 618. The through hole 618 may be provided between the first accommodation groove 619a and the second accommodation groove 619b.

[0092] According to an embodiment, the plurality of adhesive members 640 may include a first adhesive member 641 and a second adhesive member 642. The first adhesive member 641 may be disposed on a portion of the support surface 612a. The second adhesive member 642 may be disposed on another portion of the support surface 612a and may be spaced apart from the first adhesive member 641. The first adhesive member 641 and the second adhesive member 642 may cover a portion of one end 618a of the through hole 618 disposed on the support surface 612a.

[0093] According to an embodiment, a portion of at least one accommodating groove 619 may be covered by the first adhesive member 641 and the second adhesive member 642. According to an embodiment, the first adhesive member 641 may include a first extension portion 641a, a second extension portion 641b, a third extension portion 641c, and a fourth extension portion 641d. The first extension portion 641a may cover a portion of one end 618a of the through hole 618 disposed on the support surface 612a, the first accommodating groove 619a, and the second accommodating groove 619b. The second extension portion 641b may be connected to one end of the first extension portion 641a facing the second accommodating groove 619b. The second extension portion 641b may have a greater width than the first extension portion 641a. The second extension portion 641b may cover the second accommodating groove 619b. The third extension portion 641c may be connected to the other end of the first extension portion 641a facing the first accommodating groove 619a. The third extension portion 641c may have a smaller width than the first extension portion 641a. The third extension portion 641c may cover the first accommodating groove 619a. The fourth extension portion 641d may be connected to the third extension portion 641c and may have a greater width than the first extension portion 641a. For example, the fourth extension portion 641d may have a greater width than the second extension portion 641b.

[0094] According to an embodiment, a portion of the first extension portion 641a may include a concave portion 641e overlapping with the second receiving groove 619b and extending along the periphery of the second receiving groove 619b. For example, the concave portion 641e may correspond to the shape of a portion of the periphery of the second receiving groove 619b. The concave portion 641e may be formed by recessing a portion of the first extension portion 641a overlapping with the second receiving groove 619b toward the inner side (e.g., +y direction) of the first extension portion 641a.

[0095] According to an embodiment, the second adhesive member 642 may be symmetrical with the first adhesive member 641 relative to the through hole 618. The second adhesive member 642 may include a fifth extension portion 642a, a sixth extension portion 642b, a seventh extension portion 642c, and an eighth extension portion 642d. The fifth extension portion 642a may cover a portion of one end 618a of the through hole 618 disposed on the support surface 612a, the first accommodating groove 619a, and the second accommodating groove 619b. The sixth extension portion 642b may be connected to one end of the fifth extension portion 642a facing the first accommodating groove 619a. The sixth extension portion 642b may have a greater width than the fifth extension portion 642a. The sixth extension portion 642b may cover the first accommodating groove 619a. The seventh extension portion 642c may be connected to the other end of the fifth extension portion 642a facing the second accommodating groove 619b. The seventh extension portion 642c may have a smaller width than the fifth extension portion 642a. The seventh extension portion 642c may cover the second accommodation groove 619b. The eighth extension portion 642d is connected to the seventh extension portion 642c and may have a greater width than the fifth extension portion 642a. For example, the eighth extension portion 642d may have a greater width than the sixth extension portion 642b.

[0096] At least one flow path 660 may be provided between the first adhesive member 641 and the second adhesive member 642. According to an embodiment, the at least one flow path 660 may extend from the through hole 618 between the first adhesive member 641 and the second adhesive member 642. According to an embodiment, the at least one flow path 660 may be bent between the first adhesive member 641 and the second adhesive member 642. The at least one flow path 660 may include a first flow path 661 extending between the through hole 618 and at least one accommodating groove 619, a second flow path 662 extending from the through hole 618 to be parallel to the first flow path 661, and a third flow path 663 extending from the second flow path 662 perpendicular to the second flow path 662. For example, the first flow path 661 may extend from one end 618a of the through hole 618 to the first accommodating groove 619a in a direction opposite to the first direction (e.g., -x direction). The second flow path 662 may extend from the first accommodating groove 619a in a direction opposite to the first direction. The second flow path 662 may extend along the third extension portion 641c. The third flow path 663 may extend perpendicularly to the second flow path 662 along the fourth extending portion 641 d .

[0097] According to an embodiment, the electronic device 600 can delay the movement of the solution for forming the sealing member 650 on the support surface 612a through at least one flow path 660 bent between the first adhesive member 641 and the second adhesive member 642. In the case where the amount of the solution for forming the sealing member 650 flowing in through the through hole 618 is too large, the solution may move on the support surface 612a. In the case where the solution moves to the outside of the support surface 612a, damage to the speaker (for example, Figure 2b When at least one flow path 660 is bent, the solution moving along the second flow path 662 may pass through the second flow path 662, and may enter the third flow path 663, and then may collide with the fourth extension portion 641d. When the movement of the solution is delayed by the collision with the fourth extension portion 641d, the solution may solidify in the at least one flow path 660.

[0098] As described above, the electronic device 600 according to the embodiment can provide a structure capable of preventing the solution for forming the sealing member 650 from being transferred to the outside of the support surface 612a by at least one accommodating groove 619. The electronic device 600 according to the embodiment can provide a structure capable of preventing the solution from being transferred to the outside of the support surface 612a by delaying the movement of the solution for forming the sealing member 650 by at least one flow path 660 bent between the first adhesive member 641 and the second adhesive member 642.

[0099] According to an electronic device (for example, Figure 2a , Figure 2b and Figure 2c The electronic device 200 may include a display (eg, Figure 2a and Figure 2b 220), a base (e.g., Figure 2a , Figure 2b and Figure 2c A base 211 of the display device, a support surface for supporting the display device (eg, Figure 2b and Figure 2c a supporting surface 212a), an outer surface surrounding the supporting surface and facing the outside of the electronic device (eg, Figure 2a , Figure 2b and Figure 2c The outer surface 212b of the support surface, and the through hole extending from the outer surface to the support surface (for example, Figure 2a , Figure 2b and Figure 2c through hole 218), and may include a housing (e.g., Figure 2a , Figure 2b and Figure 2c The housing 210 includes a side wall structure (e.g., Figure 2a , Figure 2b and Figure 2c According to an embodiment, the electronic device may include a first adhesive member (eg, Figure 2b and Figure 2c The first adhesive member 241 is disposed on the support surface and covers one end of the through hole disposed on the support surface (eg, Figure 2c According to an embodiment, the electronic device may include a second adhesive member (eg, Figure 2b and Figure 2c The second adhesive member 242 is spaced apart from the first adhesive member and disposed on the support surface, and covers another portion of one end of the through hole. According to an embodiment, the electronic device may include a sealing member (e.g., Figure 2c Sealing member 250).

[0100] According to an embodiment, the sidewall structure may include an inner surface opposite to the outer surface (eg, Figure 2c According to an embodiment, the side wall structure may include at least one speaker hole (eg, Figure 2a and Figure 2b at least one speaker hole 217).

[0101] According to an embodiment, the at least one speaker hole may include a first speaker hole (eg, Figure 3a and Figure 3b a first speaker hole 217a) and a second speaker hole (eg, Figure 3a and Figure 3b According to an embodiment, the through hole is disposed at the other end (eg, Figure 3a The shape of the other end 218b) may correspond to the shape of one end of the first speaker hole disposed on the outer surface.

[0102] According to an embodiment, the through hole may include a first region (eg, Figure 4 The first region 218c) and the second region (eg, Figure 4 The first region defines the other end of the through hole and is inclined relative to the outer surface, and the second region is perpendicular to the support surface from the first region.

[0103] According to an embodiment, the through hole may include a first region (eg, Figure 5 The first region 218c) and the second region (eg, Figure 5The first region extends from the outer surface in a direction perpendicular to the outer surface, and the second region extends from the first region to the support surface in a direction perpendicular to the support surface.

[0104] According to an embodiment, the first adhesive member may include a first extending portion (eg, Figure 2c The first extension portion 241a) and the second extension portion (eg, Figure 2c The second extension portion 241b of the first extension portion covers a portion of one end of the through hole, and the second extension portion extends from the first extension portion in a direction away from the through hole and has a wider width than the first extension portion. According to an embodiment, the second adhesive member may include a third extension portion (e.g., Figure 2c The third extension portion 242a) and the fourth extension portion (eg, Figure 2c The fourth extension portion 242b), the third extension portion covers another portion of one end of the through hole, the fourth extension portion extends from the third extension portion in a direction away from the through hole, and has a wider width than the third extension portion.

[0105] According to an embodiment, the side wall structure may further include a first side wall (eg, Figure 2a , Figure 2b and Figure 2c The first side wall 213 and the second side wall (eg, Figure 2a , Figure 2b and Figure 2c According to an embodiment, the first bonding member may extend along a portion of the first sidewall. According to an embodiment, the second bonding member may extend along the second sidewall and another portion of the first sidewall.

[0106] According to an embodiment, the electronic device may further include at least one receiving groove (eg, Figure 6 According to an embodiment, a portion of the at least one accommodating groove may be covered by the first adhesive member and the second adhesive member.

[0107] According to an embodiment, the at least one receiving groove may include a first receiving groove (eg, Figure 6 A first accommodating groove 619a) and a second accommodating groove (eg, Figure 6 According to an embodiment, the first adhesive member may include a portion covering one end of the through hole, the first accommodating groove, and a first extending portion of the second accommodating groove (eg, Figure 6 According to an embodiment, the first adhesive member may include a second extending portion (eg, Figure 6 The second extension portion 641b is connected to the end of the first extension portion facing the second receiving groove and has a greater width than the first extension portion. According to an embodiment, the first adhesive member may include a third extension portion (e.g., Figure 6 The third extension portion 641c is connected to the other end of the first extension portion facing the first receiving groove and has a smaller width than the first extension portion. According to an embodiment, the first adhesive member may include a fourth extension portion (e.g., Figure 6 The fourth extension portion 641d is connected to the third extension portion and has a greater width than the first extension portion. According to an embodiment, the second adhesive member may be symmetrical to the first adhesive member with respect to the through hole.

[0108] According to an embodiment, a portion of the first extension portion may include a concave portion (eg, Figure 6 The first extending portion 641a) overlaps with the second accommodating groove and extends along the periphery of the second accommodating groove.

[0109] According to an embodiment, the electronic device may further include at least one flow path (eg, Figure 6 According to an embodiment, the at least one flow path may include a first flow path extending between the through hole and the at least one receiving groove (eg, Figure 6 According to an embodiment, at least one flow path may include a second flow path extending from at least one accommodating groove to be parallel to the first flow path (e.g., Figure 6 According to an embodiment, at least one flow path may include a third flow path extending perpendicularly from the second flow path to the second flow path (e.g., Figure 6 A third flow path 663).

[0110] According to an embodiment, the first adhesive member and the second adhesive member may include an adhesive material that attaches the display to a supporting surface.

[0111] According to an embodiment, the base may further include a receiving surface (eg, Figure 2b and Figure 2c According to an embodiment, the electronic device may further include a speaker configured to output audio and disposed on the receiving surface (eg, Figure 2b speaker 230).

[0112] Depending on the implementation, the sidewall structure may surround the perimeter of the display.

[0113] An electronic device (e.g. Figure 2a , Figure 2b and Figure 2c The electronic device 200 may include a display (eg, Figure 2a and Figure 2b 220), a base (e.g., Figure 2a , Figure 2b and Figure 2c A base 211 of the display device, a support surface for supporting the display device (eg, Figure 2b and Figure 2c a supporting surface 212a), an outer surface surrounding the supporting surface and facing the outside of the electronic device (eg, Figure 2a , Figure 2b and Figure 2c an outer surface 212b), an inner surface opposite to the outer surface (e.g., Figure 2c inner surface 212c), through holes extending from the outer surface to the support surface (e.g., Figure 2a , Figure 2b and Figure 2c through hole 218), and may include a housing (e.g., Figure 2a , Figure 2b and Figure 2c The housing 210 includes a side wall structure (e.g., Figure 2a , Figure 2b and Figure 2c According to an embodiment, the electronic device may include a speaker (eg, Figure 2b According to an embodiment, the electronic device may include a first adhesive member (eg, Figure 2b and Figure 2c The first adhesive member 241 is disposed on the support surface and covers one end of the through hole disposed on the support surface (eg, Figure 2c According to an embodiment, the electronic device may include a second adhesive member (eg, Figure 2b and Figure 2c The second adhesive member 242 is spaced apart from the first adhesive member, disposed on the support surface, and covers another portion of one end of the through hole. According to an embodiment, the electronic device may include a sealing member (e.g., Figure 2c According to an embodiment, the side wall structure may include a plurality of speaker holes (eg, Figure 2a and Figure 2bAccording to an embodiment, on the outer surface, a distance between one speaker hole and another speaker hole among the plurality of speaker holes may be the same as a distance between one speaker hole and the through hole on the outer surface.

[0114] According to an embodiment, the through hole may include a first region (eg, Figure 4 The first region 218c) and the second region (eg, Figure 4 The first region extends from the outer surface in a direction inclined relative to the outer surface, and the second region extends from the first region to the support surface in a direction perpendicular to the support surface.

[0115] According to an embodiment, the through hole may include a first region (eg, Figure 5 The first region 218c) and the second region (eg, Figure 5 The first region extends from the outer surface in a direction perpendicular to the outer surface, and the second region extends from the first region to the support surface in a direction perpendicular to the support surface.

[0116] According to an embodiment, the first adhesive member may include a first extending portion (eg, Figure 2c The first extension portion 241a) and the second extension portion (eg, Figure 2c The second extension portion 241b of the first extension portion covers a portion of one end of the through hole, and the second extension portion extends from the first extension portion in a direction away from the through hole and has a wider width than the first extension portion. According to an embodiment, the second adhesive member may include a third extension portion (e.g., Figure 2c The third extension portion 242a) and the fourth extension portion (eg, Figure 2c The fourth extension portion 242b), the third extension portion covers another portion of one end of the through hole, the fourth extension portion extends from the third extension portion in a direction away from the through hole, and has a wider width than the third extension portion.

[0117] According to an embodiment, the side wall structure may further include a first side wall (eg, Figure 2a , Figure 2b and Figure 2c The first side wall 213 and the second side wall (eg, Figure 2a , Figure 2b and Figure 2c According to an embodiment, the first bonding member may extend along a portion of the first sidewall. According to an embodiment, the second bonding member may extend along the second sidewall and another portion of the first sidewall.

[0118] According to an embodiment, the electronic device may further include at least one receiving groove (eg, Figure 6 According to an embodiment, a portion of the at least one accommodating groove may be covered by the first adhesive member and the second adhesive member.

[0119] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0120] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0121] As used in connection with various embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0122] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0123] According to the implementation, the methods according to various implementations of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0124] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be detachably arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device, comprising: monitor; A housing, comprising a base, a side wall structure and a through hole, wherein the side wall structure comprises a support surface for supporting the display and an outer surface surrounding the support surface and facing the outside of the electronic device, the side wall structure is arranged on the periphery of the base, and the through hole extends from the outer surface to the support surface; a first adhesive member covering a portion of one end of the through hole disposed on the support surface; a second adhesive member spaced apart from the first adhesive member and covering another portion of the one end of the through hole disposed on the support surface; as well as A sealing member fills at least a portion of the through hole and connects the first bonding member and the second bonding member.

2. The electronic device according to claim 1, The sidewall structure further comprises: an inner surface facing the interior of the housing and opposite to the outer surface; as well as At least one speaker hole is spaced apart from the through hole and extends from the outer surface to the inner surface.

3. The electronic device according to claim 2, wherein the at least one speaker hole comprises: First speaker hole; as well as a second speaker hole, spaced apart from the first speaker hole by a first distance, The other end of the through hole disposed on the outer surface is spaced apart from one end of the first speaker hole disposed on the outer surface by the first distance.

4. The electronic device according to any one of claims 1 to 3, The through hole comprises: a first region extending from the outer surface in a direction inclined relative to the outer surface; as well as A second region extends from the first region to the support surface in a direction perpendicular to the support surface.

5. The electronic device according to any one of claims 1 to 4, The through hole comprises: a first region extending from the outer surface in a direction perpendicular to the outer surface; as well as A second region extends from the first region to the support surface in a direction perpendicular to the support surface.

6. The electronic device according to any one of claims 1 to 5, Wherein the first bonding member comprises: a first extending portion covering the portion of the one end of the through hole; as well as a second extending portion extending from the first extending portion in a direction away from the through hole and having a width wider than that of the first extending portion, The second bonding member comprises: a third extending portion covering the other portion of the one end of the through hole; as well as The fourth extending portion extends from the third extending portion in a direction away from the through hole and has a width wider than that of the third extending portion.

7. The electronic device according to any one of claims 1 to 6, The side wall structure further includes a first side wall and a second side wall surrounding the display and being perpendicular to each other, wherein the first bonding member extends along a portion of the first side wall, and The second bonding member extends along the second side wall and another portion of the first side wall.

8. The electronic device according to any one of claims 1 to 7, wherein the electronic device further comprises at least one accommodating groove, the at least one accommodating groove being provided to the support surface and spaced apart from the through hole, and A portion of the at least one accommodating groove is covered by the first adhesive member and the second adhesive member.

9. The electronic device according to any one of claims 1 to 8, Wherein the at least one receiving groove comprises: a first accommodating groove, spaced apart from the through hole; as well as a second accommodating groove, spaced apart from the through hole and facing the first accommodating groove, Wherein the first bonding member comprises: a first extending portion covering the portion of the one end of the through hole, the first accommodating groove, and the second accommodating groove; a second extending portion connected to an end of the first extending portion facing the second receiving groove and having a greater width than the first extending portion; a third extending portion connected to the other end of the first extending portion facing the first accommodating groove and having a smaller width than the first extending portion; and a fourth extending portion connected to the third extending portion and having a greater width than the first extending portion, and The second bonding member is symmetrical to the first bonding member relative to the through hole.

10. The electronic device according to any one of claims 1 to 9, A portion of the first extension portion includes a recessed portion, which overlaps with the second accommodating groove and extends along a periphery of the second accommodating groove.

11. The electronic device according to any one of claims 1 to 10, wherein the electronic device further comprises at least one flow path disposed between the first adhesive member and the second adhesive member, wherein the at least one flow path comprises: a first flow path extending between the through hole and the at least one receiving groove; a second flow path extending from the at least one receiving groove to be parallel to the first flow path; as well as A third flow path extends from the second flow path perpendicular to the second flow path.

12. The electronic device according to any one of claims 1 to 11, Wherein the first adhesive member and the second adhesive member include adhesive material that attaches the display to the support surface.

13. The electronic device according to any one of claims 1 to 12, wherein the base further comprises a receiving surface, the receiving surface being parallel to the supporting surface and facing the display, and The electronic device further includes a speaker configured to output audio and disposed on the receiving surface.

14. The electronic device according to any one of claims 1 to 13, The sidewall structure surrounds the periphery of the display.

15. The electronic device according to any one of claims 1 to 14, wherein the side wall structure further comprises at least one speaker hole penetrating the side wall structure, and in, When viewed from the outside of the electronic device, a shape of the through hole corresponds to a shape of the at least one speaker hole.

Images