Shielding method for base powder coating

Abstract

The invention relates to a shielding method for powder coating of a base, which comprises the following steps of: sequentially carrying out polishing treatment and first film coating treatment on a to-be-shielded surface at a flange mounting position of the base, then covering the to-be-shielded part of the to-be-shielded surface by adopting a shielding jig, and removing a film layer outside the to-be-shielded part; and the shielding jig is removed, the inner side of the flange mounting position of the base is subjected to second film coating treatment, and shielding of the base before powder coating is completed. According to the shielding method provided by the invention, comprehensive shielding can be carried out on the flange mounting position, effective shielding in the powder coating process is realized, the quality abnormity risk caused by secondary processing is also avoided, and the processing cost is saved.

Description

Technical Field

[0001] The invention relates to the technical field of transportation equipment processing, and in particular to a base powder coating shielding method. Background Art

[0002] The glass substrates used in LCD panel production are usually large and fragile, so great care must be taken during handling to avoid damage or contamination. Traditional manual handling is not only inefficient, but also prone to misoperation or damage to the substrate. Automated handling robots can significantly improve production efficiency, reduce risks, and improve product quality. Unlike conventional robotic arms, the structure of the LCD glass substrate handling robot is a tooth fork-type robotic arm with a suction cup device under the tooth fork, which allows the robot to easily absorb the LCD glass substrate, grab and place it from the brake, and achieve high-precision handling.

[0003] The base used on the liquid crystal glass substrate handling robot is a special-shaped aluminum profile, and the surface needs to be powder-coated to have anti-static and corrosion-resistant functions. The processing accuracy of the flange installation part of the aluminum profile is high, and the powder spraying film thickness cannot be effectively controlled. Therefore, usually after powder spraying, the product needs to be re-machined to make the size meet the requirements of the drawing. However, during machine processing, clamping can easily scratch the painted surface of the product, resulting in poor appearance and increasing processing costs.

[0004] Shielding the flange installation part of the base can effectively protect the product appearance, ensure dimensional accuracy, and eliminate the risk of quality abnormalities caused by secondary processing, saving processing costs. For example, CN203426022U discloses an electrostatic powder coating shielding device, and the technical solution adopted is: an electrostatic powder coating shielding device, including a coating workpiece, a shielding area on the coating workpiece, and a shielding tool detachably connected to the coating workpiece, wherein the shielding tool is provided with a shielding member at a position corresponding to the shielding area, and the shielding member seals and covers the shielding area. CN220657972U discloses a coating shielding tool, which is welded by a contoured body and a positioning block. The contoured body includes a base plate and a side plate, which are vertically connected. Positioning slots and latches are arranged on both sides of the base plate away from one end of the side plate. The positioning block is welded between the two positioning slots and latches. When in use, the positioning slot latches shield the positioning slot of the part to be coated and abut against the side of the part to be coated to provide horizontal positioning. The positioning block fits the step surface of the part to be coated, and the positioning block and the side plate jointly support the part to be coated. However, the use of the above-mentioned shielding device for powder coating shielding is only applicable to parts on specific equipment, has certain limitations, and has high maintenance costs. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a base powder coating masking method, which can effectively prevent and mask the base flange installation location while avoiding the risk of quality abnormalities caused by secondary processing.

[0006] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0007] The present invention provides a method for shielding a base powder coating, the method comprising the following steps:

[0008] The surface to be masked at the base flange installation location is polished and coated in turn, and then a masking jig is used to cover the masked portion of the surface to be masked, and the film layer outside the masked portion is removed; the masking jig is removed, and the inner side of the base flange installation location is coated with a second coating to complete the masking of the base before powder coating.

[0009] The masking method for base powder coating provided by the present invention first performs a polishing treatment on the surface to be masked to make its surface flat and smooth, then performs a first coating treatment, and then uses a masking fixture to cover the area to be masked, which can remove the film layer outside the area to be masked and ensure the dimensional accuracy of the area to be masked. Further, a second coating treatment is performed on the inner side of the base flange installation area, which can fully protect the flange installation area, thereby achieving effective masking in the powder coating process, eliminating the risk of quality abnormalities caused by secondary processing, and saving processing costs.

[0010] Preferably, the polishing medium used in the polishing process includes 320-1000# sandpaper, for example, 320#, 500#, 600#, 800# or 1000#, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0011] In the present invention, if the sandpaper particle size is lower than 320#, it is too rough, and the surface of the base after polishing has obvious polishing marks; if the sandpaper particle size is higher than 1000#, it is too smooth, and the surface of the base after polishing cannot effectively absorb the coating dust, resulting in uneven film thickness. Therefore, the particle size of the sandpaper needs to be controlled within a reasonable range.

[0012] Preferably, the polishing treatment time is 5-10 min, for example, 5 min, 6 min, 8 min, 9 min or 10 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0013] If the polishing time is less than 5 minutes, the polishing effect is not obvious and the surface is not smooth enough.

[0014] Preferably, a cleaning step is further included after the polishing process and before the first coating process.

[0015] Preferably, the cleaning reagent comprises an ethanol solution with a concentration of 75%.

[0016] Preferably, the cleaning time is 5-10 min, for example, 5 min, 6 min, 8 min, 9 min or 10 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0017] If the cleaning time is less than 5 minutes, the cleaning effect is not obvious and impurities are likely to remain.

[0018] Preferably, the film layer used for the first lamination treatment includes any one of polyimide tape, Teflon high temperature resistant tape, PET high temperature resistant tape or masking paper high temperature resistant tape, preferably PET high temperature resistant tape.

[0019] Since the powder coating process requires curing in a 220°C oven for 30 minutes, a high temperature resistant film layer must be used to avoid melting and affecting the product appearance quality. The film layer selected in the present invention has the characteristics of high temperature resistance, no debonding, strong adhesion, corrosion resistance, easy tearing, and no deformation at 220°C. Among them, the heat-resistant temperature of polyimide tape is 260-300°C; the heat-resistant temperature of Teflon high temperature resistant tape is 250-300°C; the heat-resistant temperature of PET high temperature resistant tape is 220°C, which is low in price and meets the heat resistance requirements; the heat-resistant temperature of masking paper high temperature resistant tape is 230°C.

[0020] Preferably, the thickness of the film layer used for the first coating treatment is less than 0.5 μm, for example, it can be 0.4 μm, 0.3 μm, 0.2 μm, 0.1 μm or 0.05 μm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0021] Preferably, the shielding fixture is ring-shaped.

[0022] Preferably, the outer diameter of the shielding fixture is 231-233 mm, and the inner diameter is 137-139 mm.

[0023] The outer diameter of the shielding fixture is 231-233 mm, for example, it can be 231 mm, 231.5 mm, 232 mm, 232.5 mm or 233 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0024] The inner diameter of the shielding fixture is 137-139 mm, for example, it can be 137 mm, 137.5 mm, 138 mm, 138.5 mm or 139 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0025] It should be noted that the present invention does not specifically limit the thickness of the shielding jig. The role of the shielding jig in the present invention is to design the size of the shielding film layer. Therefore, it can be understood that other thicknesses of shielding jigs that can achieve such functions can be used in the present invention. Those skilled in the art can adaptively adjust the thickness of the shielding jig according to the usage scenario and application conditions.

[0026] Preferably, the base is in a strip shape.

[0027] Preferably, the base has a length of 1890-1892 mm and a width of 249-251 mm.

[0028] The length of the base is 1890-1892 mm, for example, it can be 1890 mm, 1890.5 mm, 1891 mm, 1891.5 mm or 1892 mm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0029] The width of the base is 249-251 mm, for example, 249 mm, 249.5 mm, 250 mm, 250.5 mm or 251 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0030] Preferably, the method of removing the film layer outside the area to be shielded comprises cutting.

[0031] Preferably, the film layer used for the second lamination treatment includes any one of polyimide tape, Teflon high temperature resistant tape, PET high temperature resistant tape or masking paper high temperature resistant tape, preferably masking paper high temperature resistant tape.

[0032] The material of the film layer used for the second coating treatment needs to have good viscosity to improve the adhesion effect. The preferred masking paper high temperature resistant tape in the present invention has the characteristics of being special for paint, no residual glue, strong viscosity, and impermeability, and can meet the use requirements. If a high temperature tape with a lower heat resistance temperature such as 150°C, 180°C, or 200°C is used, there will be residual glue on the surface of the base, and the tape will deform and fall off at high temperatures, affecting the powder coating effect.

[0033] As a preferred technical solution of the shielding method described in the present invention, the shielding method comprises the following steps:

[0034] The surface to be shielded at the base flange installation location is polished with 320-1000# sandpaper for 5-10 minutes, cleaned with 75% ethanol solution for 5-10 minutes, and subjected to a first coating treatment with a film layer with a thickness of less than 0.5μm; then a masking jig is used to cover the shielded portion of the surface to be shielded, the masking jig is annular, the outer diameter of the masking jig is 231-233mm, and the inner diameter is 137-139mm; the film layer outside the shielded portion is removed by cutting; the masking jig is removed, and the inner side of the base flange installation location is subjected to a second coating treatment to complete the shielding of the base before powder coating; the base is strip-shaped, the length of the base is 1890-1892mm, and the width is 249-251mm.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] The masking method for base powder coating provided by the present invention first performs a polishing treatment on the surface to be masked to make its surface flat and smooth, then performs a first coating treatment, and then uses a masking fixture to cover the area to be masked, which can remove the film layer outside the area to be masked and ensure the dimensional accuracy of the area to be masked. Further, a second coating treatment is performed on the inner side of the base flange installation area, which can fully protect the flange installation area, thereby achieving effective masking in the powder coating process, eliminating the risk of quality abnormalities caused by secondary processing, and saving processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is an optical image after the first coating process provided by Example 1 of the present invention;

[0038] Figure 2 is an optical image of a portion to be shielded of a surface to be shielded covered by a shielding fixture provided by Embodiment 1 of the present invention;

[0039] Figure 3 is an optical image after the second coating treatment provided by Example 1 of the present invention;

[0040] Figure 4 This is a diagram showing the anti-smear effect of the powder coating after curing provided in Example 1 of the present invention. DETAILED DESCRIPTION

[0041] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0042] Example 1

[0043] This embodiment provides a method for shielding a base powder coating, the method comprising the following steps:

[0044] The shielded surface of the base flange installation was polished with 600# sandpaper for 8 minutes, cleaned with 75% ethanol solution for 8 minutes, and coated with 0.4μm thick PET high temperature resistant tape. The optical image is as follows: Figure 1 As shown; then a shielding fixture is used to cover the shielded area of ​​the shielded surface, and the optical image is as shown Figure 2 As shown, the masking jig is annular, with an outer diameter of 232 mm and an inner diameter of 138 mm. The film layer outside the area to be masked is removed by cutting. The masking jig is removed, and the inner side of the base flange installation area is subjected to a second lamination treatment using masking paper and high temperature resistant tape to complete the masking of the base before powder coating. The optical image is shown in FIG. Figure 3 As shown; the base is strip-shaped, with a length of 1891mm and a width of 250mm.

[0045] The shielding method of this embodiment is used to shield the base before powder coating. The anti-fouling effect after the powder coating is cured is shown in the figure. Figure 4 As shown, it can be seen that the shielding effect is good and the flange installation is effectively protected.

[0046] Example 2

[0047] This embodiment provides a method for shielding a base powder coating, the method comprising the following steps:

[0048] The surface to be shielded at the base flange installation location is polished with 320# sandpaper for 5 minutes, cleaned with 75% ethanol solution for 5 minutes, and coated with a PET high-temperature resistant tape with a thickness of 0.2μm; then a masking jig is used to cover the shielded area of ​​the surface to be shielded, the masking jig is annular, and the outer diameter of the masking jig is 231mm and the inner diameter is 137mm; the film layer outside the shielded area is removed by cutting; the masking jig is removed, and the inner side of the base flange installation location is coated with a masking paper high-temperature resistant tape for a second time to complete the masking of the base before powder coating; the base is strip-shaped, and the length of the base is 1890mm and the width is 249mm.

[0049] The masking method of this embodiment is used to perform masking before the base is powder coated, and the masking effect is good, and the flange installation location can be effectively protected.

[0050] Example 3

[0051] This embodiment provides a method for shielding a base powder coating, the method comprising the following steps:

[0052] The surface to be shielded at the base flange installation location is polished with 1000# sandpaper for 10 minutes, cleaned with 75% ethanol solution for 10 minutes, and coated with a PET high-temperature resistant tape with a thickness of 0.1 μm; then a masking jig is used to cover the shielded area of ​​the surface to be shielded, the masking jig is annular, and the outer diameter of the masking jig is 233 mm and the inner diameter is 139 mm; the film layer outside the shielded area is removed by cutting; the masking jig is removed, and the inner side of the base flange installation location is coated with a masking paper high-temperature resistant tape for a second time to complete the masking of the base before powder coating; the base is strip-shaped, and the length of the base is 1892 mm and the width is 251 mm.

[0053] The masking method of this embodiment is used to perform masking before the base is powder coated, and the masking effect is good, and the flange installation location can be effectively protected.

[0054] Example 4

[0055] This embodiment provides a method for masking a base powder coating, which is different from Embodiment 1 in that, except for adjusting the particle size of the sandpaper used for the polishing process to 1200#, the rest is the same as Embodiment 1.

[0056] The masking method of this embodiment is used to mask the base before powder coating. Since the particle size of the sandpaper used for polishing is higher than 1000#, the surface is too smooth, which is not conducive to the coating process, and the masking effect is reduced.

[0057] Example 5

[0058] This embodiment provides a method for masking a base powder coating, which is different from Embodiment 1 in that, except for adjusting the particle size of the sandpaper used for the polishing process to 300#, the rest is the same as Embodiment 1.

[0059] The masking method of this embodiment is used to mask the base before powder coating. Since the particle size of the sandpaper used for polishing is lower than 320#, the surface is too rough and easily scratched, thereby affecting the quality of the product.

[0060] Example 6

[0061] This embodiment provides a method for masking powder coating of a base, which is different from Embodiment 1 in that, except for replacing the film layer used in the first coating treatment with Teflon high temperature resistant tape, the rest is the same as Embodiment 1.

[0062] The masking method of this embodiment is used to perform masking before the base is powder coated. The material of the film layer used in the first coating treatment has excellent high temperature resistance, but the production cost is relatively high.

[0063] Example 7

[0064] This embodiment provides a method for masking a base powder coating, which is different from Embodiment 1 in that, except for replacing the film layer used in the second coating treatment with a PET high temperature resistant tape, the rest is the same as Embodiment 1.

[0065] When the masking method of this embodiment is used to mask the base before powder coating, the high temperature resistance and bonding performance of the film layer used for the second coating treatment will be slightly reduced compared with that of Example 1.

[0066] Comparative Example 1

[0067] This comparative example provides a method for masking a base powder coating, which differs from Example 1 in that no polishing step is provided, and the rest is the same as Example 1.

[0068] The masking method of this comparative example is used to perform masking before the base is powder coated. Since no polishing step is provided, it is not conducive to the coating process, and the masking effect is significantly reduced.

[0069] Comparative Example 2

[0070] This comparative example provides a base powder coating masking method, which is different from Example 1 in that the second coating treatment step is not provided, and the rest is the same as Example 1.

[0071] The masking method of this comparative example is used to perform masking before powder coating of the base. Since no second coating treatment step is provided, the inner side of the base cannot be shielded from damage in the subsequent powder curing process.

[0072] To summarize, the masking method for base powder coating provided by the present invention first polishes the surface to be masked to make its surface flat and smooth, then performs a first coating treatment, and then uses a masking jig to cover the area to be masked, which can remove the film layer outside the area to be masked and ensure the dimensional accuracy of the area to be masked. Further, a second coating treatment is performed on the inner side of the base flange installation area, which can fully protect the flange installation area, thereby achieving effective masking during powder coating, eliminating the risk of quality abnormalities caused by secondary processing, and saving processing costs.

[0073] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A method for shielding a base powder coating, characterized in that: The shielding method comprises the following steps: The surface to be masked at the base flange installation location is polished and coated in turn, and then a masking jig is used to cover the masked portion of the surface to be masked, and the film layer outside the masked portion is removed; the masking jig is removed, and the inner side of the base flange installation location is coated with a second coating to complete the masking of the base before powder coating.

2. The shielding method according to claim 1, characterized in that: The polishing medium used in the polishing process includes 320-1000# sandpaper; Preferably, the polishing treatment time is 5-10 minutes.

3. The shielding method according to claim 1 or 2, characterized in that: A cleaning step is also included after the polishing process and before the first coating process.

4. The shielding method according to claim 3, characterized in that: The cleaning reagent includes an ethanol solution with a concentration of 75%; Preferably, the cleaning time is 5-10 minutes.

5. The shielding method according to any one of claims 1 to 4, characterized in that: The film layer used for the first lamination treatment includes any one of polyimide tape, Teflon high temperature resistant tape, PET high temperature resistant tape or masking paper high temperature resistant tape, preferably PET high temperature resistant tape; Preferably, the thickness of the film layer used in the first coating treatment is less than 0.5 μm.

6. The shielding method according to any one of claims 1 to 5, characterized in that: The shielding fixture is ring-shaped; Preferably, the outer diameter of the shielding fixture is 231-233 mm, and the inner diameter is 137-139 mm.

7. The shielding method according to any one of claims 1 to 6, characterized in that: The base is in a strip shape; Preferably, the base has a length of 1890-1892 mm and a width of 249-251 mm.

8. The shielding method according to any one of claims 1 to 7, characterized in that: The method of removing the film layer outside the area to be shielded includes cutting.

9. The shielding method according to any one of claims 1 to 8, characterized in that: The film layer used for the second lamination treatment includes any one of polyimide tape, Teflon high temperature resistant tape, PET high temperature resistant tape or masking paper high temperature resistant tape, preferably masking paper high temperature resistant tape.

10. The shielding method according to any one of claims 1 to 9, characterized in that: The shielding method comprises the following steps: The surface to be shielded at the base flange installation location is polished with 320-1000# sandpaper for 5-10 minutes, cleaned with 75% ethanol solution for 5-10 minutes, and subjected to a first coating treatment with a film layer with a thickness of less than 0.5μm; then a masking jig is used to cover the shielded portion of the surface to be shielded, the masking jig is annular, the outer diameter of the masking jig is 231-233mm, and the inner diameter is 137-139mm; the film layer outside the shielded portion is removed by cutting; the masking jig is removed, and the inner side of the base flange installation location is subjected to a second coating treatment to complete the shielding of the base before powder coating; the base is strip-shaped, the length of the base is 1890-1892mm, and the width is 249-251mm.

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