Head cleaning method

Abstract

A head cleaning method is provided that includes contacting a nozzle surface of a head in which a nozzle hole is defined with an absorber on a pressurizer; starting a wiping operation at a first edge portion of the head closest to the pressurizer at a first position and ending the wiping operation at a second edge portion of the head farthest from the pressurizer at the first position; positioning the pressurizer at a second position to define a first angle between a first imaginary line parallel to the longitudinal direction of the head and a second imaginary line parallel to the longitudinal direction of the pressurizer; and initiating the wiping operation at a third edge portion of the head closest to the pressurizer at the second position and ending the wiping operation at a fourth edge portion of the head farthest from the pressurizer at the second position.

Description

Technical Field

[0001] The disclosure relates to a head cleaning method, and more particularly to a head cleaning method included in a manufacturing apparatus of a display device and a head cleaner performing the head cleaning method. Background Art

[0002] The display device can be manufactured by various processes. For example, the light-emitting layer included in the display device can be formed by an inkjet process. The light-emitting layer can be formed by discharging ink containing a light-emitting material onto a substrate. The ink can be discharged onto the substrate by an inkjet printer. The inkjet printer can include a head including a plurality of nozzles.

[0003] Compared with the photolithography process including various processes such as deposition, photoresist coating, exposure, development, etching and stripping processes, the inkjet process using an inkjet printer can be relatively simple by only one-step process including discharging ink. Therefore, the manufacturing cost and time of the display device can be reduced. Summary of the invention

[0004] However, since nozzle clogging may occur due to ink residue, regular cleaning may be required for an inkjet process using an inkjet printer.

[0005] The disclosed embodiments relate to a method of cleaning a head that can extend the life of the head.

[0006] The disclosed embodiments relate to a head cleaner that performs the above head cleaning method.

[0007] An embodiment of a head cleaning method includes: bringing a nozzle surface of a head in which a plurality of nozzle holes are defined into contact with an absorbent member disposed on a pressurizer; starting a wiping operation at a first edge portion of the head closest to the pressurizer at a first position, and ending the wiping operation at a second edge portion of the head farthest from the pressurizer at the first position; positioning the pressurizer at a second position different from the first position to define a first angle between a first imaginary line parallel to the longitudinal direction of the head and a second imaginary line parallel to the longitudinal direction of the pressurizer; and starting a wiping operation at a third edge portion of the head closest to the pressurizer at a second position, and ending the wiping operation at a fourth edge portion of the head farthest from the pressurizer at the second position.

[0008] In an embodiment, the head cleaning method may further include: positioning the pressurizer at a third position different from the first position and the second position to define a second angle between a third imaginary line parallel to the longitudinal direction of the head and a fourth imaginary line parallel to the longitudinal direction of the pressurizer; and starting the wiping operation at a fifth edge portion of the head closest to the pressurizer at the third position, and ending the wiping operation at a sixth edge portion of the head farthest from the pressurizer at the third position.

[0009] In an embodiment, the first angle and the second angle may be identical to each other.

[0010] In an embodiment, the first angle and the second angle may be different from each other.

[0011] In an embodiment, the first angle and the second angle may be acute angles.

[0012] In an embodiment, the head cleaning method may further include: replacing the absorbent member at the end of each wiping operation.

[0013] In an embodiment, the step of replacing the absorbent may include: rotating a winder provided at opposite ends of the absorbent; and winding the absorbent wiping the nozzle surface on the winder.

[0014] In an embodiment, the pressurizer may be fixed to the platform, and the position of the pressurizer may be moved by rotation of the platform.

[0015] In an embodiment, the position of the pressurizer may be moved by rotation of the pressurizer.

[0016] In an embodiment, the position of the pressurizer may be moved by rotation of the head.

[0017] An embodiment of a head cleaner includes: an absorbent member in contact with a head including a nozzle surface having a plurality of nozzle holes defined therein; a pressurizer disposed under the absorbent member; and a controller that starts a wiping operation at a first edge portion of the head closest to the pressurizer at a first position and ends the wiping operation at a second edge portion of the head farthest from the pressurizer at the first position, positions the pressurizer at a second position different from the first position to define a first angle between a first imaginary line parallel to a longitudinal direction of the head and a second imaginary line parallel to the longitudinal direction of the pressurizer, and starts a wiping operation at a third edge portion of the head closest to the pressurizer at a second position and ends the wiping operation at a fourth edge portion of the head farthest from the pressurizer at the second position.

[0018] In an embodiment, the controller may also position the pressurizer at a third position different from the first position and the second position to define a second angle between a third imaginary line parallel to the longitudinal direction of the head and a fourth imaginary line parallel to the longitudinal direction of the pressurizer, and start the wiping operation at a fifth edge portion of the head closest to the pressurizer at the third position and end the wiping operation at a sixth edge portion of the head farthest from the pressurizer at the third position.

[0019] In an embodiment, the first angle and the second angle may be identical to each other.

[0020] In an embodiment, the first angle and the second angle may be different from each other.

[0021] In an embodiment, the first angle and the second angle may be acute angles.

[0022] In an embodiment, the controller may also replace the absorbent member at the end of each wiping operation.

[0023] In an embodiment, the head cleaner may further include a winder provided at opposite ends of the absorbent. The controller may rotate the winder and wind the absorbent wiping the nozzle surface on the winder so that the absorbent is replaced at the end of each wiping operation.

[0024] In an embodiment, the head cleaner may further include a platform, the pressurizer may be fixed to the platform, the platform may include a first rotation driver, and when the platform is rotated by the first rotation driver, the position of the pressurizer may move.

[0025] In an embodiment, the pressurizer may further include a second rotation driver, and when the pressurizer is rotated by the second rotation driver, the position of the pressurizer may be moved.

[0026] In an embodiment, the head may further include a third rotation driver, and when the head is rotated by the third rotation driver, the position of the pressurizer may be moved.

[0027] As described above, in an embodiment, a head cleaning method and a head cleaner for performing the head cleaning method may include: contacting a nozzle surface of a head in which a plurality of nozzle holes are defined with an absorber provided on a pressurizer; starting a wiping operation at a first edge portion of the head closest to the pressurizer at a first position, and ending the wiping operation at a second edge portion of the head farthest from the pressurizer at the first position; positioning the pressurizer at a second position different from the first position so that a first imaginary line parallel to the longitudinal direction of the head and a second imaginary line parallel to the longitudinal direction of the pressurizer have a first angle therebetween; and starting a wiping operation at a third edge portion of the head closest to the pressurizer at a second position, and ending the wiping operation at a fourth edge portion of the head farthest from the pressurizer at a second position. Therefore, the position on the nozzle surface of the head susceptible to peeling of the coating film can be constantly changed, thereby extending the life of the head. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0029] Figure 1 , Figure 2 , Figure 3 and Figure 4 is a cross-sectional view of an embodiment of a head cleaner according to the disclosure.

[0030] Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 It is shown that the use Figure 1 View of a head cleaning method of a head cleaner.

[0031] Fig.19 , Fig. 20 and Fig.21 It is shown Figure 1 View of the effect of the head cleaner. DETAILED DESCRIPTION

[0032] The disclosed embodiments will now be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, the disclosed embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals always refer to the same elements. Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings.

[0033] It will be understood that when an element is referred to as being "on" another element, the element can be directly on the other element or intervening elements may be present between the element and the other element. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements.

[0034] It will be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the first "element", "component", "region", "layer" or "part" discussed below may be referred to as a second element, component, region, layer or part.

[0035] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the content clearly indicates otherwise, the singular forms "one", "one (kind / person)" and "the (the)" are intended to include plural forms (including "at least one (kind / person)"). "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more of the relevant listed items. It will also be understood that when the terms "include" or "comprise" and / or their variations are used in this specification, the stated features, regions, wholes, steps, operations, elements and / or components are indicated, but the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components and / or their groups is not excluded.

[0036] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as shown in the drawings. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the drawings. For example, if the device in one of the drawings is turned over, the element described as being on the "lower" side of the other element will then be oriented to be on the "upper" side of the other element. Therefore, depending on the specific orientation of the drawings, the exemplary term "lower" may include both "lower" and "upper" orientations. Similarly, if the device in one of the drawings is turned over, the element described as being "below" or "under" the other element will then be oriented to be "above" the other element. Therefore, the exemplary terms "below..." or "under..." may include both "upper" and "lower" orientations.

[0037] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, a term such as "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0038] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0039] Figure 1 , Figure 2 , Figure 3 and Figure 4 is a cross-sectional view of an embodiment of a head cleaner 10 according to the disclosure.

[0040] Reference Figure 1 and Figure 2 , the head cleaner 10 may be applied to an inkjet process for manufacturing a display device.

[0041] When the inkjet process is continuously performed, a pollution source such as residual ink may remain on the nozzle surface of the head HD. When the pollution source is not processed in time, the pollution source may cause defects due to ink discharge. Therefore, the process of cleaning the nozzle surface of the head HD may be frequently performed while the inkjet process is performed.

[0042] In an embodiment, the pollution source may include, for example, inorganic ink. In an embodiment, the inorganic ink may include, for example, oxide, nitride, or semiconductor.

[0043] In an embodiment, the oxide may include TiO 2 、ZnO、SiO 2 SnO 2 , WO 3 、 2 O 3 、BaTiO 3 、BaZrO 3 、ZrO 2 , HfO 2 、Al 2 O 3 , Y 2 O 3 、ZrSiO 4 , Fe 2 O 3 , Fe 3 O 4 、NiO、Mg 2 O, MnO, ZnMgO or ZnAlO, etc. For example, these oxides may be used alone or in any combination with each other.

[0044] In an embodiment, the nitride may include InN, AlN, GaN or Si 3 N 4 Etc. For example, these nitrides may be used alone or in any combination with one another.

[0045] In an embodiment, the semiconductor may include CdTe, ZnTe, CdS, ZnSe, ZnS or Cu 2 S, etc. For example, these semiconductors may be used alone or in any combination with each other.

[0046] In an embodiment, the inorganic ink may include, for example, quantum dots. Quantum dots may be defined as semiconductor materials having nano-sized crystals. In an embodiment, the quantum dots may include, for example, II-VI compounds, III-V compounds, IV-VI compounds, IV elements, IV compounds, and combinations thereof.

[0047] In an embodiment, the II-VI group compound included in the quantum dot may be a binary compound including at least one of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and combinations thereof; a binary compound including CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZ nTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and combinations thereof; and a quaternary compound comprising at least one of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe and combinations thereof.

[0048] In an embodiment, the III-V compound included in the quantum dots may be a binary compound including at least one of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and combinations thereof; a ternary compound including at least one of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InNP, InNAs, InNSb, InPAs, InPSb and combinations thereof; and a quaternary compound including at least one of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and combinations thereof.

[0049] In an embodiment, the IV-VI group compound included in the quantum dots may be a binary compound including at least one of SnS, SnSe, SnTe, PbS, PbSe, PbTe and combinations thereof; a ternary compound including at least one of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and combinations thereof; and a quaternary compound including at least one of SnPbSSe, SnPbSeTe, SnPbSTe and combinations thereof.

[0050] In an embodiment, the group IV element included in the quantum dot may be Si, Ge, and a combination thereof. In addition, an embodiment of the group IV compound included in the quantum dot may be a binary compound including one of the group consisting of SiC, SiGe, and a combination thereof.

[0051] However, the disclosure is not limited thereto.In an embodiment, the pollution source may include, for example, various substances.

[0052] The head cleaner 10 in the disclosed embodiment may perform a blotting process while rotating at various angles. The blotting process may refer to a process of physically cleaning the head HD.

[0053] In an embodiment, the head cleaner 10 may include an absorbent AM, a pressurizer PM, a winder WI, a controller CO, a platform ST, and a driver.

[0054] In an embodiment, the absorber AM may contact the head HD. The head HD may include a plurality of nozzle holes (eg, Figure 6 The nozzle surface NS has a plurality of nozzle holes NH).

[0055] The absorber AM may include a material capable of absorbing ink. In an embodiment, the absorber AM may be, for example, a fabric capable of absorbing ink well. In an embodiment, the absorber AM may include, for example, cotton fiber, hemp fiber, wool fiber, polyamide fiber, polyester fiber, or polyurethane fiber, etc. These may be used alone or in any combination with each other.

[0056] However, the disclosure is not limited thereto. In the embodiments, for example, the material included in the absorbent AM and the shape of the absorbent AM may be changed in various ways.

[0057] In an embodiment, the pressurizer PM may be disposed below the absorber AM.

[0058] In an embodiment, for example, the pressurizer PM may apply a predetermined pressure so that the absorber AM contacts the head HD. The predetermined pressure may apply tension to bring the absorber AM into close contact with the head HD, and may have a size that does not cause damage to the head HD.

[0059] In an embodiment, the pressurizer PM may have a rod shape including or consisting of silicon, for example. However, the disclosure is not limited thereto. In an embodiment, for example, the material included in the pressurizer PM and the shape of the pressurizer PM may be changed in various ways.

[0060] In an embodiment, the winder WI may be disposed at opposite ends of the absorbent AM. In an embodiment, the winder WI may have, for example, a linear shape. In an embodiment, the winder WI may include, for example, a providing portion and a recovery portion. The providing portion may be configured to unwind the absorbent AM, and the recovery portion may be configured to wind the absorbent AM. Therefore, the providing portion may provide a clean absorbent AM, and the recovery portion may recover the absorbent AM contaminated by a pollution source while performing a suction process. However, the disclosure is not limited thereto. The shape of the winder WI may be changed in various ways.

[0061] In an embodiment, the controller CO may control various operations of the head cleaner 10 .

[0062] The head cleaner 10 can perform a suction process while rotating the pressurizer PM. To this end, in an embodiment, the controller CO may include: a function of starting a wiping operation at a first edge portion of the head HD closest to the pressurizer PM at a first position and ending the wiping operation at a second edge portion of the head HD farthest from the pressurizer PM at the first position; a function of positioning the pressurizer PM at a second position different from the first position so that a first imaginary line parallel to the longitudinal direction of the head HD and a second imaginary line parallel to the longitudinal direction of the pressurizer PM have a first angle; and a function of starting a wiping operation at a third edge portion of the head HD closest to the pressurizer PM at a second position and ending the wiping operation at a fourth edge portion of the head HD farthest from the pressurizer PM at a second position.

[0063] The head cleaner 10 can perform the suction process while rotating the pressurizer PM at various angles. To this end, in an embodiment, the controller CO may also include: a function of positioning the pressurizer PM at a third position different from the second position so that a third imaginary line parallel to the longitudinal direction of the head HD and a fourth imaginary line parallel to the longitudinal direction of the pressurizer PM have a second angle; and a function of starting the wiping operation at the fifth edge portion of the head HD closest to the pressurizer PM at the third position and ending the wiping operation at the sixth edge portion of the head HD farthest from the pressurizer PM at the third position.

[0064] In an embodiment, the first angle and the second angle may be the same as each other. In an embodiment, the first angle and the second angle may be acute angles. In this case, the controller CO may store a predetermined angle and then perform a suction process, and may be used to store data and maintain the coating film CL while monitoring the degree of peeling of the coating film CL on the nozzle surface NS of the head HD.

[0065] In another embodiment, the first angle and the second angle may be different from each other. In an embodiment, the first angle and the second angle may be acute angles. In this case, the rotation angle of the pressurizer PM may vary for each suction process. Therefore, the position on the nozzle surface NS of the head HD that is susceptible to peeling of the coating film CL may be changed in various ways. However, the disclosure is not limited to this. In an embodiment, the first angle and the second angle may be, for example, a right angle or an obtuse angle.

[0066] In the case of the head cleaner according to the comparative example, the suction process may be performed in a predetermined direction. In this case, the peeling of the coating film CL on the nozzle surface NS of the head HD may occur in a direction parallel to the direction in which the suction process is performed.

[0067] However, the head cleaner 10 in the disclosed embodiment can perform the suction process while rotating at various angles, so that the position on the nozzle surface NS of the head HD susceptible to peeling of the coating film CL can be constantly changed. Therefore, the life of the head HD can be extended.

[0068] In an embodiment, the controller CO may further include a function of replacing the absorber AM at the end of each wiping operation. In an embodiment, the function of replacing the absorber AM may include a function of rotating a winder WI provided at opposite ends of the absorber AM and winding the absorber AM wiping the nozzle surface NS on the winder WI. In other words, each time the suction process is performed, a clean absorber AM may wipe the nozzle surface NS.

[0069] Will refer to later Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 A detailed description of the gettering process is described.

[0070] The controller CO may be implemented as a device, a program, a system, or the like.

[0071] In an embodiment, the pressurizer PM may be disposed on the platform ST, and the absorber AM may be disposed on the pressurizer PM.

[0072] Reference Figure 2In an embodiment, the driver may be connected to the platform ST. In an embodiment, the platform ST may include, for example, a first rotary driver DM1. In this case, the pressurizer PM may be fixed to the platform ST, and the position of the pressurizer PM may be moved (or changed) by the rotation of the first rotary driver DM1.

[0073] Reference Figure 3 In an embodiment, the driver may be connected to the pressurizer PM. In an embodiment, the pressurizer PM may include, for example, a second rotary driver DM2. In this case, the pressurizer PM may be movably connected to the platform ST, and the position of the pressurizer PM may be moved (or changed) by the rotation of the second rotary driver DM2.

[0074] Reference Figure 4 In an embodiment, the driver may be connected to the head HD. In an embodiment, the head HD may include, for example, a third rotary driver DM3. In this case, the position of the pressurizer PM may be moved (or changed) by the rotation of the third rotary driver DM3.

[0075] However, the disclosure is not limited thereto. Figure 1 , Figure 2 , Figure 3 and Figure 4 The described configuration of the head cleaner 10 is exemplary, and the configuration may be changed, omitted, and / or added to.

[0076] Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.13 , Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 It is shown that the use Figure 1 FIG. 1 is a view of a head cleaning method of a head cleaner 10 .

[0077] In the following, the above references will be omitted or simplified. Figure 1 , Figure 2 , Figure 3 and Figure 4 The description of the head cleaner 10 described above is repeated.

[0078] Reference Figure 5 In an embodiment, the nozzle surface NS of the head HD and the absorber AM may be brought into contact ( S100 ).

[0079] After performing an inkjet process, the nozzle surface NS of the head HD may be contaminated by remaining ink. The absorber AM may physically clean the nozzle surface NS by wiping off the remaining ink.

[0080] In an embodiment, the absorber AM may be disposed on the pressurizer PM, and the pressurizer PM may be disposed on the platform ST.

[0081] In an embodiment, for example, when the platform ST moves up and down, the nozzle surface NS of the head HD and the absorber AM may contact each other. However, the disclosure is not limited thereto. In an embodiment, for example, when the head HD moves up and down, the nozzle surface NS of the head HD and the absorber AM may contact each other.

[0082] Reference Figure 5 , Figure 6 , Figure 7 and Figure 8 In an embodiment, the wiping operation may start at a first edge portion ED1 of the head HD closest to the pressurizer PM at the first position LO1 and end at a second edge portion ED2 of the head HD farthest from the pressurizer PM at the first position LO1 (S200).

[0083] The gettering process may be performed while the pressurizer PM disposed at the first position LO1 on the stage ST moves in one direction. In an embodiment, for example, the pressurizer PM may perform the gettering process while linearly moving in the second direction DR2.

[0084] However, the disclosure is not limited thereto. In an embodiment, for example, the pressurizer PM may perform the gettering process while linearly moving in a direction opposite to the second direction DR2.

[0085] An extending direction of the head HD (ie, a direction in which the plurality of nozzle holes NH are defined) is illustrated as being parallel to the first direction DR1, however, the disclosure is not limited thereto.

[0086] In an embodiment, for example, when the extension direction of the head HD is parallel to the second direction DR2, the pressurizer PM may perform the gettering process while linearly moving in the first direction DR1. In an alternative embodiment, the pressurizer PM may perform the gettering process while linearly moving in a direction opposite to the first direction DR1.

[0087] In an embodiment, for example, when the gettering process is performed in the second direction DR2, a first point PO1 susceptible to film peeling may be generated in a direction parallel to the second direction DR2. The first point PO1 may indicate a portion where film peeling may occur when the gettering process is continued in the second direction DR2.

[0088] Reference Fig. 9 and Fig.10 In an embodiment, after the wiping operation is completed, the absorbent member AM may be replaced ( S300 ).

[0089] In the embodiment, the winder WI provided at the opposite ends of the absorbent AM can be rotated, and while the absorbent AM is wound on the winder WI, the absorbent AM wiping the nozzle surface NS of the head HD can be replaced.

[0090] However, the disclosure is not limited thereto. In the embodiments, for example, any method that can replace the absorber AM wiping the nozzle surface NS with a clean absorber AM as long as the wiping operation is completed may be used without limitation.

[0091] Reference Figure 7 and Fig.11 In an embodiment, the pressurizer PM may be disposed at a second position different from the first position so that the first imaginary line LI1 and the second imaginary line LI2 have a first angle AN1 therebetween ( S400 ).

[0092] The first imaginary line LI1 may represent an imaginary line parallel to the longitudinal direction of the head HD, and the second imaginary line LI2 may represent an imaginary line parallel to the longitudinal direction of the pressurizer PM.

[0093] In the embodiments, as mentioned above, Figure 1 and Figure 2 As described above, the pressurizer PM may be fixed to the platform ST, and the position of the pressurizer PM may move (or change) as the platform ST rotates.

[0094] In another embodiment, as described above with reference to Figure 1 and Figure 3 As described above, the position of the pressurizer PM may move (or change) as the pressurizer PM rotates.

[0095] In another embodiment, as described above with reference to Figure 1 and Figure 4 As described above, the position of the pressurizer PM can move (or change) as the head HD rotates.

[0096] However, the disclosure is not limited thereto. In the embodiments, for example, the position of the pressurizer PM may be changed in various ways.

[0097] Reference Fig.12 , Fig.13 and Fig.14 The wiping operation may start at a third edge portion ED3 of the head HD closest to the presser PM at the second position LO2 and end at a fourth edge portion ED4 of the head HD farthest from the presser PM at the second position LO2 ( S500 ).

[0098] The gettering process may be performed while the pressurizer PM disposed at the second position LO2 on the stage ST moves in one direction. In an embodiment, for example, the pressurizer PM may perform the gettering process while linearly moving in the third direction DR3.

[0099] The third direction DR3 may cross each of the first direction DR1 and the second direction DR2 .

[0100] However, the disclosure is not limited thereto. In an embodiment, for example, the pressurizer PM may perform the gettering process while linearly moving in a direction opposite to the third direction DR3.

[0101] In addition, the direction in which the gettering process is performed may be based on the extending direction of the head HD or the first angle (eg, Fig.11 The size of the first angle AN1) in the image may change.

[0102] In an embodiment, for example, when the gettering process is performed in the third direction DR3, a second point PO2 susceptible to film peeling may be generated in a direction parallel to the third direction DR3. The second point PO2 may indicate a portion where film peeling may occur when the gettering process is continued in the third direction DR3.

[0103] The second point PO2 susceptible to film peeling when the gettering process is performed in the third direction DR3 may be different from the first point (eg, Figure 8 Therefore, even when the gettering process continues, the position susceptible to film peeling continues to change, so that the head HD can be extended (for example, Figure 5 The life of the coating film CL).

[0104] As mentioned above Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 As described above, after the wiping operation is completed, the absorbent member AM may be replaced (S300). Next, the suction removal process (S400, S500) may be repeated while the pressurizer PM is rotated. Fig.13 , Fig.14 , Fig.15 , Fig.16 , Fig.17 and Fig.18 Only the gettering process is described.

[0105] Reference Fig.13 , Fig.14 and Fig.15In an embodiment, the pressurizer PM may be disposed at a third position different from both the first position and the second position so that the third imaginary line LI3 and the fourth imaginary line LI4 have a second angle AN2 therebetween (S400').

[0106] The third imaginary line LI3 may represent an imaginary line parallel to the longitudinal direction of the head HD, and the fourth imaginary line LI4 may represent an imaginary line parallel to the longitudinal direction of the pressurizer PM.

[0107] In an embodiment, the first angle (eg, Fig.11 The first angle AN1) and the second angle AN2 may be the same, or the first angle and the second angle AN2 may be different from each other.

[0108] In an embodiment, the first angle and the second angle AN2 may be acute angles. However, the disclosure is not limited thereto.

[0109] Reference Fig.16 , Fig.17 and Fig.18 The wiping operation may start at a fifth edge portion ED5 of the head HD closest to the pressurizer PM at the third position LO3 , and may be completed at a sixth edge portion ED6 of the head HD farthest from the pressurizer PM at the third position LO3 ( S500 ′).

[0110] The gettering process may be performed while the pressurizer PM disposed at the third position LO3 on the stage ST moves in one direction. In an embodiment, for example, the pressurizer PM may perform the gettering process while linearly moving in the first direction DR1.

[0111] However, the disclosure is not limited thereto. In an embodiment, for example, the pressurizer PM may perform the gettering process while linearly moving in a direction opposite to the first direction DR1.

[0112] In addition, the direction in which the gettering process is performed may be based on the extending direction of the head HD or the second angle (e.g., Fig.15 The size of the second angle AN2) in the image may change.

[0113] In an embodiment, for example, when the gettering process is performed in the first direction DR1, a third point PO3 susceptible to film peeling may be generated in a direction parallel to the first direction DR1. The third point PO3 may indicate a portion where film peeling may occur when the gettering process is continued in the first direction DR1.

[0114] The third point PO3 susceptible to film peeling when the gettering process is performed in the first direction DR1 may be different from the first point (eg, Figure 8and a second point (eg, Fig.14 Therefore, even when the gettering process continues, the position susceptible to film peeling continues to change, so that the head HD (for example, Figure 5 The life of the coating film CL).

[0115] Fig.19 , Fig. 20 and Fig.21 It is shown Figure 1 A view of the effect of the head cleaner 10.

[0116] Reference Fig.19 The head cleaner and the cleaning method using the head cleaner according to the comparative embodiment may continue the suction process in one direction (e.g., the second direction DR2). In this case, peeling of the film STR may occur in the coating film of the nozzle surface (e.g., the coating film CL of the nozzle surface NS) in a direction parallel to the direction in which the suction process is performed.

[0117] In the embodiment, for example, a coating film having opposite properties to the ink may be formed on the nozzle surface of the head that discharges the ink. In the embodiment, when the ink is hydrophilic, the coating film may include or consist of, for example, a hydrophobic material.

[0118] When peeling of the film STR occurs in the head, the straightness or discharge speed of ink droplets may be affected. Therefore, the discharge performance of ink may be deteriorated.

[0119] like Fig. 20 As shown in , as the suction process is repeated, the number of satellite droplets may increase. Satellite droplets may refer to small ink droplets that are unintentionally generated during the inkjet process. As the number of satellite droplets increases, the final print quality may deteriorate.

[0120] Reference Figure 1 , Figure 2 and Fig.21 The head cleaner 10 and the head cleaning method using the head cleaner 10 in the disclosed embodiment can perform the suction process by rotating the presser PM at various angles. Therefore, the point PO susceptible to film peeling (e.g., Figure 8 The first point PO1, Fig.14 The second point PO2 and / or Fig.18 The third point PO3) can be changed continuously. Thus, the head HD can be extended (for example, Figure 5 The life of the coating film CL).

[0121] Embodiments of the invention can be applied to, for example, manufacturing processes of display devices and electronic devices including display devices (such as computers, notebook computers, cellular phones, smart phones, smart tablets, portable media players (PMPs), personal digital assistants (PDAs), and / or Moving Picture Experts Group Audio Layer (MP3) players, etc.).

[0122] The disclosed embodiments should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the invention to those skilled in the art.

[0123] Although the invention has been specifically shown and described with reference to the embodiments of the invention, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the claims. It should be understood, therefore, that the foregoing is an illustration of various embodiments and should not be construed as limited to the disclosed illustrative embodiments, and modifications to the disclosed embodiments as well as other embodiments are intended to be included within the scope of the appended claims. In addition, the embodiments or portions of the embodiments may be combined in whole or in part without departing from the scope of the invention.

Claims

1. A head cleaning method, the method comprising: bringing a nozzle surface of the head, in which a plurality of nozzle holes are defined, into contact with an absorbent member disposed on the pressurizer; starting a wiping operation at a first edge portion of the head closest to the pressurizer at a first position, and ending the wiping operation at a second edge portion of the head farthest from the pressurizer at the first position; positioning the pressurizer at a second position different from the first position to define a first angle between a first imaginary line parallel to the longitudinal direction of the head and a second imaginary line parallel to the longitudinal direction of the pressurizer; as well as The wiping operation is started at a third edge portion of the head closest to the pressurizer at the second position, and the wiping operation is ended at a fourth edge portion of the head farthest from the pressurizer at the second position.

2. The head cleaning method according to claim 1, further comprising: positioning the pressurizer at a third position different from the first position and the second position to define a second angle between a third imaginary line parallel to the longitudinal direction of the head and a fourth imaginary line parallel to the longitudinal direction of the pressurizer; as well as The wiping operation is started at a fifth edge portion of the head closest to the pressurizer at the third position, and the wiping operation is ended at a sixth edge portion of the head farthest from the pressurizer at the third position.

3. The head cleaning method according to claim 2, wherein: The first angle and the second angle are identical to each other.

4. The head cleaning method according to claim 2, wherein: The first angle and the second angle are different from each other.

5. The head cleaning method according to claim 2, wherein: The first angle and the second angle are acute angles.

6. The head cleaning method according to claim 1, further comprising: The absorbent is replaced at the end of each wiping operation.

7. The head cleaning method according to claim 6, wherein: The steps of replacing the absorbent include: rotating winders disposed at opposite ends of the absorbent member; and The absorbent that wipes the nozzle surface is wound around the winder.

8. The head cleaning method according to claim 1, wherein: The pressurizer is fixed to the platform, and The position of the pressurizer is moved by the rotation of the platform.

9. The head cleaning method according to claim 1, wherein: The position of the pressurizer is moved by the rotation of the pressurizer.

10. The head cleaning method according to claim 1, wherein: The position of the pressurizer is moved by the rotation of the head.

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