Ultrathin glass cutting method and cutting device

Abstract

The invention discloses an ultra-thin glass cutting method and cutting device, and relates to the technical field of glass production. The ultra-thin glass cutting method comprises the following steps: transferring a glass plate to a cutting base station; the laser focus is adjusted, so that the laser focus moves in a wave shape in any straight line direction parallel to the plate surface of the glass plate in the thickness direction of the glass plate; and splitting the cut glass plate.

Description

Technical Field

[0001] The present application relates to the technical field of glass production, and in particular to an ultra-thin glass cutting method and cutting device. Background Art

[0002] With the popularity of flexible displays, glass plates are increasingly becoming the best substrate materials and protective materials, with the thinnest thickness reaching micron level; but in order to realize the advantages of ultra-thin glass plates, it is necessary to ensure that the surface is scratch-free, pollution-free, and the edges are smooth and burr-free. At present, laser cutting is mostly used for cutting and splitting of glass plates. The laser forms a concentrated heat area inside the glass plate, and then the glass plate can be split in that area.

[0003] However, for ultra-thin glass plates, their thinness leads to high brittleness. Current laser cutting is to perform straight-line cutting at a certain thickness position of the glass plate. Concentrated, insufficient or uneven heating will cause burrs or cracks. Summary of the invention

[0004] The embodiments of the present application provide an ultra-thin glass cutting method and a cutting device to solve the problem of low product yield due to burrs or cracks easily occurring in traditional laser straight-line cutting of ultra-thin glass.

[0005] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0006] A first aspect of the present application provides an ultra-thin glass cutting method, which comprises the following steps:

[0007] Transfer the glass plate to the cutting base;

[0008] Adjust the laser focus to cut the glass plate, so that the laser focus moves in a wave-like manner along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate;

[0009] A glass sheet after the splinters have been cut.

[0010] In some modified implementations of the first aspect of the present application, the aforementioned ultra-thin glass cutting method, wherein the step of adjusting the laser focus to cut the glass plate so that the laser focus moves in a waveform along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate, comprises:

[0011] The glass plate moves up and down in a wave-like manner based on the midpoint of the glass plate in the thickness direction.

[0012] In some modified implementations of the first aspect of the present application, the aforementioned ultra-thin glass cutting method, wherein the step of moving up and down in a waveform based on the midpoint of the glass plate in the thickness direction as a reference, comprises:

[0013] Adjust the focus of the laser according to formula (1);

[0014]

[0015] Wherein: α is the ordinate value of the laser focus in the base coordinate system; h is the thickness of the glass plate, h≤2mm; x is the abscissa value of the laser focus in the moving direction in the base coordinate system; m is a constant related to the glass plate, 5≤m≤500.

[0016] In some modified implementations of the first aspect of the present application, the aforementioned ultra-thin glass cutting method, wherein the step of moving up and down in a waveform based on the midpoint of the glass plate in the thickness direction as a reference, further includes:

[0017] Corresponding to the glass plate whose part is concave downward due to the influence of gravity, equation (3) is obtained according to equation (1) and equation (2), and the focus of the laser is adjusted according to equation (3);

[0018]

[0019] Y=y+α (3)

[0020] Wherein: y is the ordinate value of the lower surface of the glass plate in the base coordinate system; r is the arc radius of the glass plate where it is depressed by gravity; d1 is the distance between the lowest point of the glass plate where it is depressed by gravity and the upper surface of the base; x is the abscissa value of the laser focus in the moving direction of the base coordinate system; n is the nth depressed position of the glass plate due to gravity; d3 is the width of the glass plate where it is depressed by gravity; d4 is the base support width between adjacent glass plate depressions; Y is the ordinate value of the glass plate corresponding to the depression of the laser focus in the base coordinate system.

[0021] A second aspect of the present application provides a cutting device based on the aforementioned ultra-thin glass cutting method, comprising:

[0022] A cutting base, wherein the cutting base has a supporting surface, and the supporting surface is used to support the glass plate;

[0023] A laser emitting assembly, the laser emitting assembly is arranged above the supporting surface and spaced from the supporting surface, so as to emit a cutting laser in the direction of the supporting surface according to a control instruction; the focus of the laser moves in a wave-like manner along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate;

[0024] A transfer assembly, which is connected to the cutting base and is used to transfer the glass sheet between the transfer vehicle and the cutting base;

[0025] A docking assembly, wherein the docking assembly is movably arranged on the transfer assembly, the docking assembly can reciprocate relative to the transfer assembly along the transfer direction, and the docking assembly can reciprocate relative to the transfer assembly along the direction perpendicular to the transfer surface of the transfer assembly to reciprocate the glass plate between the transfer assembly and the supporting surface.

[0026] In some modified implementations of the second aspect of the present application, the aforementioned ultra-thin glass cutting device, wherein the cutting base is provided with supporting blocks and connecting grooves alternately along its width direction, and the upper surfaces of several of the supporting blocks are of the same height to form the supporting surface;

[0027] The docking assembly includes a docking rack, and the docking rack includes a plurality of docking members arranged at intervals along the width direction of the transfer assembly, and the docking members are adapted to the docking slots;

[0028] Among them, the docking rack can lift the glass plate on the transfer component according to the docking instruction, translate it to the top of the supporting surface, descend into the docking groove so that the glass plate is supported by the supporting surface, and translate it back to the transfer component side.

[0029] In some modified implementations of the second aspect of the present application, the aforementioned ultra-thin glass cutting device, wherein the transmission component includes a plurality of conveyor belts spaced apart along the width direction thereof, and the plurality of conveyor belts move synchronously;

[0030] The plurality of docking members of the docking rack and the plurality of conveyor belts are alternately arranged in the width direction of the transfer component, so that the docking rack can be reciprocatedly lifted and lowered relative to the transfer component between adjacent conveyor belts.

[0031] In some modified implementations of the second aspect of the present application, the aforementioned ultra-thin glass cutting device, wherein the transfer assembly includes a frame, and the plurality of conveyor belts and the docking assembly are all disposed on the frame;

[0032] The docking assembly also includes a first base and a first lifting assembly;

[0033] The first base is movably connected to the frame so as to be able to reciprocate relative to the frame along the conveying direction of the transfer assembly;

[0034] The first end of the first lifting assembly is connected to the first base, and the second end is connected to the docking rack, so that the docking rack can be lifted and lowered relative to the first base.

[0035] In some modified implementations of the second aspect of the present application, in the aforementioned ultra-thin glass cutting device, the docking assembly further includes a second base and a second lifting assembly;

[0036] The second base is connected to the second end of the first lifting assembly;

[0037] The first end of the second lifting component is connected to the second base, and the second end of the second lifting component is connected to the docking rack, so that the docking rack can be lifted and lowered relative to the second base.

[0038] In some modified implementations of the second aspect of the present application, the aforementioned ultra-thin glass cutting device further includes a controller, a first driving unit and a second driving unit;

[0039] The first driving unit is used to drive the transmission component according to a first driving instruction;

[0040] The second driving unit is used to drive the docking assembly according to a second driving instruction;

[0041] The controller is signal-connected with the first driving unit and the second driving unit to send the first driving instruction and the second driving instruction to the first driving unit and the second driving unit respectively according to a start instruction.

[0042] Compared with the prior art, the ultra-thin glass cutting method provided by the present application adjusts the laser focus to make the thickness of the glass plate fluctuate up and down, so that the laser forms a wavy cutting line inside the glass plate, extending the path of the cutting line and thus increasing the heat applied inside the glass plate, evenly distributing the heat, thereby reducing the difficulty of splitting, effectively reducing the generation of burrs and cracks, and greatly improving the product yield. This solves the problem of low product yield such as burrs or cracks that are prone to occur in traditional laser straight line cutting of ultra-thin glass. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0044] Figure 1 The schematic diagram of the process of the ultra-thin glass cutting method provided in this embodiment is schematically shown;

[0045] Figure 2 The schematic diagram schematically shows the state of the glass plate being sunken in the ultra-thin glass cutting method provided in this embodiment;

[0046] Figure 3 Schematically shows the edge of glass after cracking in the traditional laser cutting method;

[0047] Figure 4The edge of the glass after being split by the laser cutting method provided in this embodiment is schematically shown;

[0048] Figure 5 The structure diagram of the ultra-thin glass cutting device provided in this embodiment is schematically shown;

[0049] Figure 6 The schematic diagram of the structure of the base in the ultra-thin glass cutting device provided in this embodiment is schematically shown;

[0050] Figure 7 The schematic diagram of the structure of the transfer component in the ultra-thin glass cutting device provided in this embodiment is schematically shown;

[0051] Figure 8 The schematic diagram of the structural coordination between the connecting assembly and the frame in the ultra-thin glass cutting device provided in this embodiment is schematically shown;

[0052] Fig. 9 The structure block diagram of the ultra-thin glass cutting device provided in this embodiment is schematically shown;

[0053] Explanation of the accompanying figures: cutting base 1, supporting surface 11, docking groove 12, supporting block 13, controller 2, laser emitting assembly 3, transmission assembly 4, conveyor belt 41, first drive motor 42, synchronous belt 43, synchronous wheel 44, shaft 45, frame 46, column 47, guide plate 48, docking frame 5, docking part 51, first base 52, first lifting assembly 53, rodless cylinder 531, second drive motor 54, drive screw 55, guide column 56, second base 57, second lifting assembly 58, cover body 6. DETAILED DESCRIPTION

[0054] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0055] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0056] The technical solution of the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0057] Example 1

[0058] Reference Figure 1 The ultra-thin glass cutting method provided in the embodiment of the present application comprises the following steps:

[0059] S101, transferring the glass plate to the cutting base 1;

[0060] It is understandable that the present embodiment targets ultra-thin glass, which may be a glass plate with a thickness not exceeding 2 mm. In the present embodiment, the glass plate can be fully automatically transferred through transfer components such as a conveyor belt and a conveyor rod, specifically, the glass plate is transferred from the transfer vehicle to the cutting base 1 for laser cutting; in the process, the non-contact with the glass is ensured as much as possible, that is, direct squeezing, contacting, and grabbing of the coated surface and the chemically tempered surface is avoided. In the present embodiment, the non-coated surface and the non-tempered surface of the glass plate can be automatically supported and transferred through a conveyor belt; the transfer process can include linear transfer, lifting support, translational displacement, and other actions, so that the glass plate can be transferred from the transfer component to the cutting base 1. The cutting base 1 has a supporting surface 11, which is a plane, which can be a complete and continuous plane, or a supporting surface composed of multiple planes of equal height but discontinuous, or a non-physical supporting surface formed by air flotation; the support for the glass plate can be the entire plate surface facing the supporting surface 11, or it can be the partial plate surface facing the supporting surface 11. After the laser cutting in step S102 is completed, the above transfer process will run in reverse to remove the laser-cut glass plate from the cutting base 1 and transfer it to the splitting process for splitting operation. It is not difficult to understand that the above process can be realized by the controller 2 to automatically control the transfer component 4, and in this process, it can cooperate with position sensors, electromagnetic sensors, infrared sensors, etc. for precise positioning and coordination.

[0061] S102, adjusting the laser focus to cut the glass plate, so that the laser focus moves in a waveform along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate;

[0062] It can be understood that the laser emitting assembly 3 is controlled by the controller 2 to adjust the height of the focus relative to the glass plate, and moves up and down in a waveform based on the midpoint of the thickness direction of the glass plate. The above process can be achieved by setting a dynamic zoom lens barrel on the laser emitter to adjust the focal length and thus the focus position. Specifically, the controller 2 may be preset with a coordinate system with the supporting surface 11 as the zero reference plane, the width direction of the cutting base 1 is the X direction, the height direction of the cutting base 1 is the Y direction, the X direction is the horizontal movement direction of the laser emitting assembly 3 when cutting the glass plate, and the Y direction is the movement direction of the focus when the laser emitting assembly 3 cuts the glass plate; the trajectory formula of the focus movement is preset in the controller 2, so that the focus fluctuates up and down based on the thickness center of the glass plate to form a waveform trajectory, and then a waveform cutting line can be formed in the thickness direction of the glass plate, which not only extends the path of the cutting line and increases the heat release into the glass itself, but also avoids heat concentration at the center of the glass thickness, thereby reducing the difficulty of splitting, improving the smoothness of splitting, and greatly reducing burrs or cracks generated during the splitting process.

[0063] S103, the glass plate after the splinters are cut;

[0064] It can be understood that after the glass plate is cut by laser and a wavy cutting line is formed in the later stage, the glass plate is removed from the cutting base 1 and transferred to the splitting process for the splitting operation, thereby completing the entire glass cutting process. In this process, the glass plate needs to undergo a reverse transfer process of the transfer process in step S101. For specific operations, please refer to step S101 and no further details will be given here.

[0065] Specifically, in order to solve the problem of low product yield due to burrs or cracks in traditional laser straight-line cutting of ultra-thin glass, the ultra-thin glass cutting method provided by the present application adjusts the laser focus so that the thickness of the glass plate at the laser focus fluctuates up and down, so that the laser forms a wavy cutting line inside the glass plate, extending the path of the cutting line and thus increasing the heat applied inside the glass plate, evenly distributing the heat, thereby reducing the difficulty of splitting, effectively reducing the generation of burrs and cracks, and greatly improving the product yield. This solves the problem of low product yield due to burrs or cracks in traditional laser straight-line cutting of ultra-thin glass.

[0066] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B, which is specifically understood as: A and B may be included at the same time, A may exist alone, or B may exist alone, and any of the above three situations may exist.

[0067] Further, for step S102, the trajectory formula of the focus movement preset in the controller is as follows:

[0068] Adjust the focus of the laser according to formula (1);

[0069]

[0070] Wherein: α is the ordinate value of the laser focus in the base coordinate system; h is the thickness of the glass plate, h≤2mm; x is the abscissa value of the laser focus in the moving direction in the base coordinate system; m is a constant related to the glass plate, 5≤m≤500.

[0071] It can be understood that the base coordinate system is the coordinate system described in step S102 with the support surface 11 as the zero reference plane, the X direction is the horizontal movement direction of the laser emitting assembly 3 when cutting the glass plate, and the Y direction is the movement direction of the focus when the laser emitting assembly 3 cuts the glass plate, which is also the thickness direction of the glass. In this embodiment, the laser focus is set to fluctuate up and down based on the center of the glass thickness, and then simulated to be a sine form, and the movement distance of the focus is related to the glass thickness, and then the glass thickness and the ordinate value of the focus in the base coordinate system are simulated to have a linear relationship, Through linear fitting, t=12-5h is obtained, and in this embodiment, t can be selected as an integer value according to rounding, for example, when the corresponding glass thicknesses are 0.02mm, 0.2mm, 0.4mm, 0.6mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm, and 2mm, t is 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, and 2 respectively; further, for ultra-thin glass, its overall thickness is relatively small, and excessive fluctuation amplitude is likely to cause damage to the glass surface, affecting cracks and even product yield, and thus in this embodiment, a glass plate related constant m is set, 1 / m is the maximum distance that the laser focus moves up and down based on h / 2, the thinner the glass, the smaller 1 / m is required, and the larger m is, that is, the smaller the amplitude of the waveform trajectory, and in this embodiment, m is determined by experiments, simulations, and cutting effects to have the above-mentioned selected value range of 5-500, for example, m=10. It should be noted that the value of m is related to the composition of the glass. The higher the strength of the glass, the smaller the m value. For example, the m value of soda-lime-silica glass is greater than that of aluminum glass, and the m value of aluminum glass is greater than that of high borosilicate glass. Of course, it can also be transformed into a corresponding cosine expression based on formula (1). This transformation can be easily understood and implemented by those skilled in the art, and will not be elaborated on here.

[0072] Further, see Attachment Figure 3The glass plate is then moved to the support surface 11 by the support members 13 so that the glass plate can be moved to the support surface 11 by the support members 13. Corresponding to the above-mentioned transfer method, when the glass plate is supported by the supporting block 13, due to its small thickness, it will be dented to a certain extent at the position corresponding to the connecting groove 12 due to gravity, that is, the midpoint of the thickness of the glass will no longer remain in a straight line. In this state, the position of the focus needs to be adjusted accordingly based on formula (1) to ensure that the focus can accurately change the position of the center of the glass thickness to avoid burrs or cracks.

[0073] In this embodiment, for the glass plate whose part is concave downward due to the influence of gravity, equation (3) is obtained according to equation (1) and equation (2), and the focus of the laser is adjusted according to equation (3);

[0074]

[0075] Y=y+α (3)

[0076] Where: y is the ordinate value of the lower surface of the glass plate in the base coordinate system; r is the arc radius of the glass plate where it is depressed by gravity; d1 is the distance between the lowest point of the glass plate where it is depressed by gravity and the upper surface of the base; x is the horizontal coordinate value of the laser focus in the moving direction of the base coordinate system; n is the nth depression position of the glass plate due to gravity; d3 is the width of the depression of the glass plate due to gravity; d4 is the base support width between adjacent depressions of the glass plates; Y is the ordinate value of the depression of the glass plate corresponding to the laser focus in the base coordinate system;

[0077] It is not difficult to understand that d3 and d4 can be obtained according to the actual structural dimensions of the cutting base 1. In this embodiment, d3 and d4 can be equal or unequal; d1 can be automatically obtained by laser ranging; Figure 2, in the base coordinate system, taking the first connecting groove 12 as an example, the glass plate is sunken downward here, the lowest point is at a distance d1 from the supporting surface 11, the radius of the arc is r, the distance from the center of the circle to the supporting surface 11 is d2, the connecting groove 12 width is d3, the supporting block 13 width is d4, and the width of the supporting block 13 before the connecting groove 12 can be obtained according to the actual structural size. For example, in this embodiment, it can be proposed to be d4 / 2, then Then find r, and the coordinates of the center of the arc caused by the glass downward due to gravity in the device software are (a, b), such as Figure 2 As shown, the coordinates of the center of the circle corresponding to the first connecting groove 12 are (a1, b1), b1=r-d1, corresponding to the nth docking slot 12, its corresponding circular coordinate is (a n , b n ), a n =(2n-1)a1,b n = r-d1, corresponding to the circle formula (xa n )2+(yb n )2=r 2 , where x and y are the corresponding horizontal and vertical coordinates during the movement of the focus of the running laser, respectively, and then the above formula (2) is deduced, and y is used to show the vertical coordinate value of the lower surface of the glass plate in the base coordinate system, and then the glass plate obtains the position change of the midpoint of the thickness in the docking groove 12, and then combined with formula (1), the position change of the glass plate in the docking groove 12 corresponding to the focus can be obtained. It is not difficult to understand that the trajectory of the laser focus in the area corresponding to the supporting block 13 fluctuates up and down based on the horizontal line, and the trajectory of the laser focus in the area corresponding to the docking groove 12 fluctuates up and down based on the concave arc line. It is also not difficult to understand that when the width of the supporting block 13 before the docking groove 12 changes, formulas (2) and (3) can change accordingly, and this change belongs to the protection content of this embodiment.

[0078] Reference Figure 3 The glass edge obtained by using the traditional laser cutting device and method has many burrs and cracks. Figure 4 The glass edge obtained by using the cutting device and method provided in this embodiment is flat and smooth, and the product yield is greatly improved.

[0079] Example 2

[0080] Reference Figure 5The ultra-thin glass cutting device provided in this embodiment includes a cutting base 1, a laser emitting component 3, a transfer component 4 and a docking component. The cutting base 1 has a supporting surface 11, and the supporting surface 11 is used to support a glass plate; the laser emitting component 3 is arranged above the supporting surface 11 and spaced from the supporting surface 11 to emit a cutting laser in the direction of the supporting surface 11 according to a control instruction; the focus of the laser moves in a waveform along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate; the transfer component 4 is arranged in succession to the cutting base 1, and is used to transfer the glass plate between a transfer vehicle (not shown in the figure) and the cutting base 1; the docking component is movably arranged on the transfer component 4, and the docking component can reciprocate relative to the transfer component 4 along the transfer direction, and the docking component can reciprocate relative to the transfer component 4 in a direction perpendicular to the transfer surface of the transfer component 4, so as to reciprocate the glass plate between the transfer component 4 and the supporting surface 11.

[0081] It can be understood that in order to solve the problem that traditional laser straight line cutting of ultra-thin glass is prone to burrs or cracks, resulting in low product yield, this embodiment provides a cutting device for the ultra-thin glass cutting method of Example 1. The cutting device is a fully automatic control device, which can automatically transfer the glass plate to ensure that the coated surface and the tempered surface of the glass plate will not be damaged during the transfer process, thereby ensuring the safety of the glass plate and improving the transfer and cutting efficiency.

[0082] The cutting base 1 is a rigid structure, which can be a table structure, a platform structure, a frame structure, etc. It can provide a supporting surface 11. The supporting surface 11 is a plane, which can be a complete and continuous plane, or a supporting surface composed of multiple planes of equal height but discontinuous, or a non-physical supporting surface formed by air flotation. The support for the glass plate can be the entire surface of the glass plate facing the supporting surface 11 or a part of the surface facing the supporting surface 11, as long as the support of the glass plate is stable. Figure 5 and attached Figure 6 In this embodiment, a cover 6 can be provided outside the cutting base 1. The cover 6 is provided with a slot, and part of the cutting base 1 is placed in the slot. The laser emitting assembly 3 is movably provided on the top wall in the slot, thereby forming a laser cutting area in the slot. The slot can also play a certain protective role on the glass plate to prevent damage to the edge of the glass plate. The shape and size of the cutting base 1 and the cover 6 are not limited here, and can be designed and adjusted according to actual needs.

[0083] Among them, the laser emitting assembly 3 includes a light source emitter and a dynamic zoom lens barrel, so that the light source emitter can achieve a change in focal length through the dynamic zoom lens barrel, and the setting of the focal length change can be easily understood and implemented by those skilled in the art, and will not be described in detail here. In this embodiment, the laser emitting assembly 3 can also be equipped with a guide rail, a slider, and a drive motor to achieve horizontal movement of the light source emitter above the cutting base 1; the above-mentioned structural setting can be easily understood by those skilled in the art, and will not be described in detail here.

[0084] It can be understood that the ultra-thin glass cutting device provided in this embodiment also includes a controller 2, which is a PLC controller capable of receiving and sending data, analyzing, comparing, and editing programs. The controller 2 is electrically connected to the driving motor and laser emitter of the laser emitting component 3, and the dynamic zoom lens barrel, so that it can control the light source emitter to move horizontally while changing the focal length according to the position information of the glass plate relative to the cutting base 1; the position information of the glass plate relative to the cutting base 1 can be transmitted to the controller 2 by the position sensor, or it can be sent or input into the controller 2 by manual control; accordingly, the controller 2 is preset with a waveform motion trajectory formula of the laser focus, namely, equations (1) to (3) described in Example 1.

[0085] Among them, the transfer component 4 has a transmission function, which can be a conveying form such as a conveyor belt, a conveyor roller, etc. Specifically, the glass plate is transferred from the transfer vehicle to the cutting base 1 for laser cutting; in this process, it is ensured as much as possible that there is no contact with the glass, that is, to avoid direct squeezing, contact, and grabbing of the coated surface and the chemically tempered surface. In this embodiment, the non-coated surface and the non-tempered surface of the glass plate can be automatically supported and transferred by a conveyor belt. It is not difficult to understand that the driving mechanism of the transfer component 4 is connected to the controller 2 signal, and the controller 2 can control the start or stop of the transfer component 4 to control the transfer of the glass plate. Accordingly, the control timing of the controller 2 for the transfer component 4 can be obtained by the relevant position sensor or electromagnetic switch, or it can be manually controlled or manually input to the controller 2.

[0086] Among them, the docking component can move relative to the transfer component 4, which can be but not limited to translation, lifting, etc. It can lift the glass plate to separate from the transfer component 4 and transfer it to the supporting surface 11 of the cutting base 1, so that the transportation and transfer of the glass plate is a fully automatic process, which is not only efficient but also does not require a mechanical arm to grab the glass plate, effectively ensuring the safety of the glass plate. For example: the docking component can be set at the end of the transfer component 4 to receive the glass plate, and then transfer the glass plate to the side of the cutting base 1 by lifting or by translation combined with lifting; for another example, the docking component can be set in the transfer component 4, and can be lifted and translated relative to the transfer component 4, lift the glass plate relative to the transfer component 4, and then translate it to the side of the cutting base 1, and then lower it to place the glass plate on the supporting surface 11.

[0087] Further, see Attachment Figure 5 In the ultra-thin glass cutting device provided in this embodiment, in a specific implementation, the cutting base 1 is alternately provided with supporting blocks 13 and docking grooves 12 along its width direction, and the upper surfaces of several supporting blocks 13 are at the same height to form the supporting surface 11; the docking assembly includes a docking rack 5, and the docking rack 5 includes several docking members 51 arranged at intervals along the width direction of the transfer assembly 4, and the docking members 51 are adapted to the docking grooves 12; wherein, the docking rack 5 can lift the glass plate on the transfer assembly 4 according to the docking instruction, translate to the top of the supporting surface 11, and descend to the docking groove 12 so that the glass plate is supported by the supporting surface 11 and translates back to the side of the transfer assembly 4.

[0088] It is understandable that in order to fully ensure the safety of the glass sheet and achieve no damage during the transfer process to the cutting base 1 and the recycling process, the cutting base 1 is configured in this embodiment to include a plurality of alternately arranged support blocks 13 and docking grooves 12, and the docking frame 5 is configured to include a plurality of spaced docking members 51, so that the docking members 51 can fall into or be inserted into the docking grooves 12 to support or detach the glass sheet. The support block 13 is a rigid structure, and its shape is not limited here, and can be Figure 5The rectangle shown can also be any other shape, as long as the upper surfaces of several support blocks 13 are flush to form a support surface 11; the support block 13 can be formed by digging a docking groove 12 on the surface of the cutting base 1, or it can be a protruding structure formed by additional bonding or welding on the surface of the cutting base 1. In this embodiment, the dimensions of the support block 13 and the docking groove 12 in the width direction of the cutting base 1 can be the same or different, for example: a docking groove 12 with a width of 150 mm and a depth of 150 mm is set at every 150 mm interval, which can be designed and adjusted according to actual needs, and is not limited here. The docking member 51 is a rigid structure, which can be a rod-shaped structure or a plate-shaped structure that is compatible with the docking groove 12. The controller 2 in this embodiment can control the docking frame 5 to lift relative to the transfer component 4 so that the docking member 51 supports the glass plate to separate it from the support of the transfer component 4, and then control the docking frame 5 to move horizontally toward the cutting base 1. After it is in place, the docking frame 5 descends so that the glass plate falls on the supporting surface 11, and the docking member 51 falls into the docking groove 12 to separate from the glass substrate, completing the transfer of the glass substrate to the cutting base 1; accordingly, after the glass plate is cut on the cutting base 1, the controller 2 controls the docking frame 5 to reverse and transfer the glass substrate to the transfer component 4, which can be subsequently transferred to the splitting process through the transfer component 4, or to the transfer vehicle through the transfer component 4. In this embodiment, a protective film layer can also be attached to the supporting surface 11, which can be but not limited to Teflon, to prevent the glass from being scratched or worn. The docking instruction is generated and issued by the controller 2, for example: the controller 2 can generate and send a docking instruction to the docking component according to the position of the glass plate, so that the docking component moves relative to the transfer component 4.

[0089] Further, see Attachment Figure 7 In the ultra-thin glass cutting device provided in this embodiment, in a specific implementation, the transfer component 4 includes a plurality of conveyor belts 41 arranged at intervals along its width direction, and the plurality of conveyor belts 41 move synchronously; the plurality of connecting pieces 51 of the connecting rack 5 and the plurality of conveyor belts 41 are alternately arranged in the width direction of the transfer component 4, so that the connecting rack 5 can be reciprocated and lifted relative to the transfer component 4 between adjacent conveyor belts 41.

[0090] It can be understood that in order to achieve the connection component can be translated and raised and lowered relative to the transfer component 4 without affecting the normal movement of the transfer component 4, the transfer component 4 is configured in the present embodiment to include a plurality of spaced conveyor belts 41, and then the connection piece 51 can be arranged alternately with the conveyor belts 41, and the connection piece 51 can be raised and lowered between adjacent conveyor belts 41 to avoid mutual interference between the movements of the two. The synchronous driving of several conveyor belts 41 can be achieved by the first driving motor 42 cooperating with the synchronous belt 43, the synchronous wheel 44 and the shaft 45. The first shaft 45 and the second shaft 45 are parallel and relatively arranged. The shaft 45 is provided with several synchronous wheels 44 rotating at intervals along its axial direction. A synchronous wheel 44 on the first shaft 45 (it can also be a separately arranged driving wheel) is connected to the output end of the first driving motor 42 through the synchronous belt 43, and the other synchronous wheels 44 are connected to the conveyor belt 41 in a one-to-one correspondence. When the first driving motor 42 is started, the synchronous wheel 44 rotates around the shaft 45 to drive the conveyor belt 41 to move around the two shafts 45 to realize the transmission of the glass plate; of course, it is not difficult to understand that the synchronous wheel 44 is also provided with a bearing. It is also easy to understand that in this embodiment, the first drive motor 42 is connected to the controller 2 signal to realize automatic control of start and stop. To this end, in this embodiment, a first position sensor (not shown in the figure) can also be set at the feeding end of the transmission component 4. When the transfer vehicle carries the glass plate to the feeding end of the transmission component 4 or the glass plate is placed on the transmission component 4, the first position sensor detects the feeding signal and sends it to the controller 2, and the controller 2 starts the first drive motor 42 to run at a preset speed. Correspondingly, in this embodiment, a second position sensor (not shown in the figure) and a third position sensor (not shown in the figure) can be spaced apart at one end of the transmission component 4 close to the cutting base 1. The second position sensor detects the arrival signal of the glass plate, and the third position sensor detects the arrival signal of the docking component. The position of the second position sensor can be the starting position of the translational action of the docking component, and the position of the third position sensor can be the end position of the translational action of the docking component. When the docking component is in the starting position of the translational action, the docking component 41 does not extend out of the range of the transmission component 4. When the docking component is in the end position of the translational action, the docking component 41 extends out of the range of the transmission component 4 and all of its orthographic projections in the vertical direction fall within the range of the cutting base 1. Therefore, the positions of the second position sensor and the third position sensor can be adjusted according to the size design of the transmission component 4 and the docking component 51, and are not limited here.Specifically, when the glass plate is conveyed to the point where its edge facing the cutting base 1 passes through the second position sensor, the second position sensor sends an in-position signal to the controller 2. At this time, the glass plate has not yet completely entered the supporting area of ​​the docking assembly. When the edge of the glass plate facing away from the cutting base 1 passes through the second position sensor, the in-position signal from the second position sensor to the controller 2 disappears, indicating that the glass plate has completely entered the supporting area of ​​the docking assembly. At this time, the controller 2 controls the first drive motor 42 of the transmission assembly 4 to stop running, and synchronously controls the docking assembly to lift upward so that the glass plate is separated from the conveyor belt 41, that is, higher than the transmission assembly 4, and then controls the docking assembly to translate toward the cutting base 1 side. After the third position sensor detects that the docking assembly has translated into position, the controller 2 controls the docking assembly to stop the translation action, and at the same time controls the docking assembly to descend until the docking piece 41 falls into the docking groove 12, and the glass plate is supported by the supporting surface 11.

[0091] Further, see Attachment Figure 7 and attached Figure 8 In the ultra-thin glass cutting device provided in this embodiment, in a specific implementation, the transfer component 4 includes a frame 46, and the plurality of conveyor belts 41 and the docking components are all arranged on the frame 46; the docking component also includes a first base 52 and a first lifting component 53; the first base 52 is movably connected to the frame 46 so as to be able to reciprocate relative to the frame 46 along the conveying direction of the transfer component 4; the first end of the first lifting component 53 is connected to the first base 52, and the second end is connected to the docking rack 5, so that the docking rack 5 can be lifted and lowered relative to the first base 52.

[0092] It can be understood that in order to realize the interval arrangement and synchronous driving of several conveyor belts 41, a frame 46 is designed in this embodiment; the frame 46 is a rigid frame structure, which can provide a stable installation position for the first drive motor 42, the synchronous belt 43, the synchronous wheel 44, and the shaft 45. In this embodiment, the shaft 45 and the conveyor belt 41 can be stably installed by the support column 47 and the guide plate 48. The guide plate 48 corresponds to the conveyor belt 41 one by one as the internal support of the conveyor belt 41. The conveyor belt 41 is sleeved outside the guide plate 48, and the guide plate 48 stably supports the conveyor belt 41. , to avoid the problem of unstable transmission caused by sinking or deformation of a single conveyor belt 41; the columns 47 are arranged at both ends of the guide plate 48 in a one-to-one correspondence with the guide plate 48, and the columns 47 serve as a connecting medium between the frame 46 and the guide plate 48. The frame 46, the columns 47 and the guide plate 48 can be integrally formed or connected by welding, bonding, clamping, etc.; accordingly, the shaft 45 can be connected to the side wall of the guide plate 48 or the side wall of the column 47 with a bearing to ensure the stable setting of the shaft 45, so as to achieve the interval setting and synchronous driving of several conveyor belts 41. In order to achieve the lifting and translation of the docking assembly relative to the conveyor belt 4, a first base 52 and a first lifting assembly 53 are set. The first base 52 is a rigid structure, which can be a plate-like structure, a frame structure, a block structure, a groove-like structure, etc., as long as it can provide stable support for the first lifting assembly 53 and the docking frame 5; in this embodiment, the first base 52 can reciprocate on the frame 46 along the transmission direction of the conveyor belt 41. In this regard, refer to the attached Figure 8 In this embodiment, a second drive motor 54 and a drive screw 55 can be provided. The drive screw 55 is connected to the second drive motor 54 and the first base 52 at the same time. When the second drive motor 54 is started, the first base 52 can reciprocate along the axial direction of the drive screw 55, that is, the conveying direction of the conveyor belt 41. Of course, corresponding sliding matching structures, such as slide rails, guide rails, pulleys, slide grooves, sliders, etc., can also be provided on the frame 46 and the first base 52; at the same time, corresponding limit blocks (not shown in the figure) can also be provided on the frame to prevent the first base 52 from slipping out when moving on the drive screw 55. It is not difficult to understand that in this embodiment, the second drive motor 54 is connected to the controller 2 by signal. When the docking assembly is controlled to lift upward to make the glass plate detach from the conveyor belt 41, that is, higher than the transmission assembly 4, the second drive motor 54 is controlled to drive the first base 52 to translate toward the cutting base 1. When the third position sensor detects that the docking assembly has been translated into place, the controller 2 controls the second drive motor 54 to stop the translation action. The first lifting assembly 53 may include, but is not limited to, a rodless cylinder 531, and may include a guide column 56, which is vertically arranged on the first base 52. The docking rack 5 can be slidably connected to the guide column 56 through a slide rail, a guide rail, a pulley, a slide groove, and a slider; the number of the first lifting assembly 53 can be designed and adjusted according to actual needs. For example, if the width of the docking rack 5 is large, it can be as follows Figure 8As shown, a guide column 56 is provided at each end of the docking frame 5 to ensure stable lifting. In this embodiment, the lifting and lowering control of the first lifting component 53 can be automatically controlled by using its lifting limit or by using the setting of a position sensor or an electromagnetic switch in cooperation with the controller 2. For example, a rodless cylinder is selected according to the distance between the first base 52 and the upper surface of the conveyor belt 41, so that the lifting limit of the rodless cylinder is greater than the distance between the first base 52 and the upper surface of the conveyor belt 41, and then when controlling the rodless cylinder, only the opening and closing command control is required; for another example, a position sensor or an electromagnetic switch can be provided at the top of the guide column 56 to cooperate with the detection of the lifting and lowering of the rodless cylinder.

[0093] Further, see Attachment Figure 8 The docking assembly also includes a second base 57 and a second lifting assembly 58; the second base 57 is connected to the second end of the first lifting assembly 53; the first end of the second lifting assembly 58 is connected to the second base 57, and the second end of the second lifting assembly 58 is connected to the docking rack 5, so that the docking rack 5 can be lifted and lowered relative to the second base 57.

[0094] It can be understood that in order to ensure the stability of the lifting of the docking assembly, a second base 57 and a second lifting assembly 58 are set at the second end of the first lifting assembly 53 in this embodiment to reduce the difficulty of lifting to the desired position at one time and reduce the risk of failure of the first lifting assembly 53 during long-distance lifting. At the same time, the depth of the docking groove 12 can only correspond to the lifting height of the second lifting assembly 58, and does not need to correspond to the entire lifting height of the docking assembly, which greatly reduces the depth of the docking groove 12 and reduces the difficulty and cost of preparation. The second base 57 is a rigid structure, which can be a plate-like structure, a frame structure, a block-like structure, a groove-like structure, etc. It can be the same as the first base 52 or different from the first base 52, as long as it can provide stable support for the second lifting assembly 58 and the docking rack 5; the second lifting assembly 58 can be, but is not limited to, a rodless cylinder, and can also refer to the guide column 56 set in cooperation with the first lifting assembly 53. The guide column 56 is vertically set on the second base 57, and the docking rack 5 can be slidably connected to the guide column 56 through the cooperation of slide rails, guide rails, pulleys, slide grooves, and sliders; the number of second lifting assemblies 56 can be designed and adjusted according to actual needs, for example: Figure 8As shown, a second lifting assembly 56 is provided for each connecting member 51 to ensure stable lifting. Even if some of the second lifting assemblies 56 fail, the normal lifting of the glass plate can still be ensured. Under this setting mode, the start timing of the second lifting assembly 56 in this embodiment can be based on the control of the first lifting assembly 53 by the controller 2. For example, when the lifting height of the first lifting assembly 53 is set according to the limit, the controller 2 stores the time when the lifting of the first lifting assembly 53 is completed. Then, when the controller 2 controls the first lifting assembly 53 to start lifting, it starts timing or countdown. After the end, it controls the second lifting assembly 56 to lift. The control of the lifting of the second lifting assembly 56 can be controlled by using its lifting limit or by using the setting of a position sensor or an electromagnetic switch in conjunction with the controller 2 for automatic control. This setting can refer to the setting mode of the first lifting assembly 53 mentioned above, and will not be repeated here.

[0095] Furthermore, the ultra-thin glass cutting device provided in this embodiment, in a specific implementation, also includes a controller 2, a first drive unit and a second drive unit; the first drive unit is used to drive the transmission component 4 according to a first drive instruction; the second drive unit is used to drive the docking component according to a second drive instruction; the controller 2 is connected to the first drive unit and the second drive unit by signal to send the first drive instruction and the second drive instruction to the first drive unit and the second drive unit respectively according to the start instruction.

[0096] It can be understood that the first drive unit is the aforementioned first drive motor 42, the second drive unit is the second drive motor 54, the first lifting assembly 53 and the second lifting assembly 58; the first drive instruction is the control instruction for the first drive motor 42 generated by the controller 2 after the first position sensor sends a feeding signal to the controller 2, so that the transfer assembly 4 starts to transfer; the second drive instruction is the control instruction for the lifting and translation of the docking assembly generated after the second position sensor sends a position signal to the controller 2 disappears, and the second drive instruction is the same instruction as the aforementioned docking instruction; the start instruction is a signal to manually turn on the controller 2 and the power supply of the entire device.

[0097] It is not difficult to understand that the entire operation process of the ultra-thin glass cutting device provided in this embodiment is as follows:

[0098] The first position sensor sends a feeding signal to the controller 2, and the controller 2 controls the first driving motor 42 of the transmission component 4 to drive the synchronous wheel 44 and the conveyor belt 41 to rotate around the shaft 51 to realize the transmission of the glass plate. When the glass plate is transmitted to the second position sensor and continuously sends an in-position signal until the in-position signal disappears, the controller 2 can stop the first driving motor 42, and synchronously control the first lifting component 53 to lift the second base 57 and the docking rack 5. After the first lifting component 53 is lifted into place, the second lifting component 56 is controlled to lift the docking rack 5 so that the glass plate is higher than the conveyor belt 41 and is separated from the support of the conveyor belt 41. After the second lifting component 56 is lifted into place, the second driving motor 54 is controlled to enable the first base 52 to drive the docking rack 5 to translate along the driving screw 55 toward the cutting base 1. After the third position sensor sends an in-position signal to the controller 2, the controller 2 controls the second driving motor 54 to stop, and synchronously controls the second lifting component 56 to descend until the docking piece 51 falls into the docking groove 12, and the glass plate is supported by the supporting surface 11. The controller 2 controls the second driving motor 54 to stop. The machine 54 drives the lead screw 55 in reverse so that the docking frame 5 moves in the direction of the transmission component 4 and leaves the cutting base 1 area, waiting for the cutting to be completed. In this process, the third position sensor and the second position sensor can be used in reverse, which will not be described in detail here. The controller 2 is connected and sends a control instruction to the laser emitting component 3 according to the feedback of the second position sensor so that the laser emitting component 3 cuts the glass plate according to the formula (1)-formula (3) described in Example 1. After the cutting is completed, the controller 2 controls the second driving motor 54 to start so that the docking frame 5 moves in the direction of the cutting base 1 and the docking member 51 is inserted into the docking slot 12. Then, the controller 2 drives the second lifting component 56 to lift again so that the cut glass plate leaves the supporting surface 11 and is supported by the docking frame 5. Then, the docking frame 5 is translated in reverse so that the glass plate returns to the side of the transmission component 4. Then, the second lifting component 56 and the first lifting component 53 are driven in reverse so that the glass plate is supported by the conveyor belt 41 again. Then, the first driving motor 42 is driven in reverse to drive the synchronous wheel to reversely transfer the glass plate, completing the entire transfer and cutting process.

[0099] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for cutting ultra-thin glass, characterized in that: include: Transfer the glass plate to the cutting base; Adjust the laser focus to cut the glass plate, so that the laser focus moves in a wave-like manner along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate; A glass sheet after the splinters have been cut.

2. The ultra-thin glass cutting method according to claim 1, characterized in that: The step of adjusting the laser focus to cut the glass plate so that the laser focus moves in a waveform along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate comprises: The glass plate moves up and down in a wave-like manner based on the midpoint of the glass plate in the thickness direction.

3. The ultra-thin glass cutting method according to claim 2, characterized in that: The step of moving up and down in a waveform based on the midpoint of the glass plate in the thickness direction comprises: Adjust the focus of the laser according to formula (1); Wherein: α is the ordinate value of the laser focus in the base coordinate system; h is the thickness of the glass plate, h≤2mm; x is the abscissa value of the laser focus in the moving direction in the base coordinate system; m is a constant related to the glass plate, 5≤m≤500.

4. The ultra-thin glass cutting method according to claim 3, characterized in that: The step of moving up and down in a wave-like manner based on the midpoint of the glass plate in the thickness direction as a reference also includes: Corresponding to the glass plate whose part is concave downward due to the influence of gravity, equation (3) is obtained according to equation (1) and equation (2), and the focus of the laser is adjusted according to equation (3); Y=y+α (3) Wherein: y is the ordinate value of the lower surface of the glass plate in the base coordinate system; r is the arc radius of the glass plate where it is depressed by gravity; d1 is the distance between the lowest point of the glass plate where it is depressed by gravity and the upper surface of the base; x is the abscissa value of the laser focus in the moving direction of the base coordinate system; n is the nth depressed position of the glass plate due to gravity; d3 is the width of the glass plate where it is depressed by gravity; d4 is the base support width between adjacent glass plate depressions; Y is the ordinate value of the glass plate where the laser focus corresponds to the depression in the base coordinate system.

5. An ultra-thin glass cutting device based on the ultra-thin glass cutting method according to any one of claims 1 to 4, characterized in that: It includes: A cutting base, wherein the cutting base has a supporting surface, and the supporting surface is used to support the glass plate; A laser emitting assembly, the laser emitting assembly is arranged above the supporting surface and spaced from the supporting surface, so as to emit a cutting laser in the direction of the supporting surface according to a control instruction; the focus of the laser moves in a wave-like manner along the thickness direction of the glass plate in any straight line direction parallel to the plate surface of the glass plate; A transfer assembly, which is connected to the cutting base and is used to transfer the glass sheet between the transfer vehicle and the cutting base; A docking assembly, wherein the docking assembly is movably arranged on the transfer assembly, the docking assembly can reciprocate relative to the transfer assembly along the transfer direction, and the docking assembly can reciprocate relative to the transfer assembly along the direction perpendicular to the transfer surface of the transfer assembly to reciprocate the glass plate between the transfer assembly and the supporting surface.

6. The ultra-thin glass cutting device according to claim 5, characterized in that: The cutting base is provided with supporting blocks and connecting grooves alternately along its width direction, and the upper surfaces of a plurality of the supporting blocks are of the same height to form the supporting surface; The docking assembly includes a docking rack, and the docking rack includes a plurality of docking members arranged at intervals along the width direction of the transfer assembly, and the docking members are adapted to the docking slots; Among them, the docking rack can lift the glass plate on the transfer component according to the docking instruction, translate it to the top of the supporting surface, descend into the docking groove so that the glass plate is supported by the supporting surface, and translate it back to the transfer component side.

7. The ultra-thin glass cutting device according to claim 6, characterized in that: The transmission assembly includes a plurality of conveyor belts spaced apart along the width direction thereof, and the plurality of conveyor belts move synchronously; The plurality of docking members of the docking rack and the plurality of conveyor belts are alternately arranged in the width direction of the transfer component, so that the docking rack can be reciprocatedly lifted and lowered relative to the transfer component between adjacent conveyor belts.

8. The ultra-thin glass cutting device according to claim 7, characterized in that: The transfer assembly comprises a frame, and the plurality of conveyor belts and the docking assembly are arranged on the frame; The docking assembly also includes a first base and a first lifting assembly; The first base is movably connected to the frame, and the first base can reciprocate relative to the frame along the conveying direction of the transfer assembly; The first end of the first lifting assembly is connected to the first base, and the second end is connected to the docking rack, so that the docking rack can be lifted and lowered relative to the first base.

9. The ultra-thin glass cutting device according to claim 8, characterized in that: The docking assembly also includes a second base and a second lifting assembly; The second base is connected to the second end of the first lifting assembly; The first end of the second lifting component is connected to the second base, and the second end of the second lifting component is connected to the docking rack, so that the docking rack can be lifted and lowered relative to the second base.

10. The ultra-thin glass cutting device according to claim 5, characterized in that: Also includes a controller, a first drive unit and a second drive unit; The first driving unit is used to drive the transmission component according to a first driving instruction; The second driving unit is used to drive the docking assembly according to a second driving instruction; The controller is signal-connected with the first driving unit and the second driving unit to send the first driving instruction and the second driving instruction to the first driving unit and the second driving unit respectively according to a start instruction.

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