Ceramic resistance pressure sensor

Abstract

The invention relates to a ceramic resistance pressure sensor, which belongs to the technical field of sensors and comprises a pressure inlet head, the pressure inlet head is of a cavity structure and is provided with a detection port, a ceramic resistance pressure chip is mounted in the pressure inlet head, an amplification circuit board is mounted on the ceramic resistance pressure chip, and a pressure ring is mounted in the pressure inlet head. The pressing ring is used for fixing the ceramic resistance pressure chip in the pressing head, one side of the ceramic resistance pressure chip right faces the detection port, the pressing head is connected with an installation shell, the installation shell is connected with a connector, the amplification circuit board is connected with a wire, and the wire is connected with the connector. According to the invention, the structure of the pressure sensor is simplified, the production complexity of the pressure sensor is reduced, and the signal output stability is ensured.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a ceramic resistance pressure sensor. Background Art

[0002] Pressure sensors are widely used in industrial automation, automobiles, aerospace and other fields to measure the pressure of liquids or gases. However, existing pressure sensors contain multiple sensing elements or hierarchical structures, such as multi-layer electrodes, sensors for compensating temperature drift, complex electromagnetic shielding structures, additional packaging structures, etc., which make their structures complex and difficult to produce. Summary of the invention

[0003] In order to simplify the structure of the pressure sensor, reduce the production complexity of the pressure sensor, and ensure the stability of the signal output, the present application provides a ceramic resistance pressure sensor.

[0004] The ceramic resistance pressure sensor provided in this application adopts the following technical solution: A ceramic resistance pressure sensor comprises a pressure inlet head, which is a cavity structure, is provided with a detection port, is installed with a ceramic resistance pressure chip in the pressure inlet head, is installed with an amplifying circuit board in the ceramic resistance pressure chip, is installed with a pressure ring in the pressure inlet head, is used to fix the ceramic resistance pressure chip in the pressure inlet head, one side of the ceramic resistance pressure chip faces the detection port, is connected with a mounting shell, is connected with a connector, is connected with a wire in the amplifying circuit board, and is connected with the connector.

[0005] By adopting the above technical solution, electrodes are deposited on the surface of the ceramic diaphragm to form two plates of the resistor. When the diaphragm is subjected to pressure, the distance between the plates will change slightly, thereby changing the resistance value. Due to the high stiffness and stability of the ceramic material, it can accurately detect small pressure changes with high detection accuracy. There is no need to set up multiple layers of electrodes, which simplifies the structure of the sensor. At the same time, ceramic is a high-strength and very rigid material. Even under high pressure, its deformation is very small, usually at the nanometer or micrometer level. This extremely small deformation is sufficient to measure pressure changes, but not enough to affect the structural integrity of the sensor. Therefore, even if the ceramic diaphragm is slightly deformed during operation, it will not produce cracks or other problems that will cause leakage. Therefore, additional packaging structures can be reduced and the complexity of the sensor can be reduced. At the same time, compared with metal materials, ceramics are less sensitive to temperature changes. Therefore, the flat film ceramic resistance pressure sensor already has a certain temperature compensation capability in the basic material. When applied to scenarios with general environmental requirements, it is usually not necessary to set up additional sensors to compensate for temperature drift; Therefore, the sensor reduces multiple complex components and circuits, reduces production difficulty and production costs, while ensuring signal stability and accuracy, making it suitable for large-scale production and application scenarios with low environmental requirements.

[0006] Optionally, a protrusion is provided on the circumferential surface of the pressure ring, a plurality of elastic sheets are connected to the inner wall of the pressure head, a limiting plate is provided inside the pressure head, and the limiting plate is closer to the ceramic resistor pressure chip than the elastic sheet. When the pressure ring is completely located in the pressure head, the limiting plate abuts against the pressure ring, and a plurality of the elastic sheets abut against the side wall of the pressure ring.

[0007] By adopting the above technical solution, when installing the pressure ring, the elastic sheet is deformed and pressed tightly against the side wall of the pressure ring. The installation can be completed by simply pressing the pressure ring into the installation shell. It is convenient and quick, and the limit plate plays a limiting role to prevent the pressure ring from squeezing the ceramic resistor pressure chip.

[0008] Optionally, a gasket is provided in the pressure inlet head, and the gasket is located between the pressure ring and the ceramic resistor pressure chip, and the gasket is tightly against the pressure ring and the ceramic resistor pressure chip.

[0009] By adopting the above technical solution, adding a gasket can buffer the pressure between the pressure ring and the ceramic resistor pressure chip, thereby preventing mechanical damage to the ceramic resistor pressure chip during installation and use.

[0010] Optionally, a sealing ring groove is opened on the inner side wall of the pressure inlet head, the sealing ring groove is arranged around the detection port, a sealing ring is installed in the sealing ring groove, and the sealing ring is tightly pressed against the ceramic resistor pressure chip.

[0011] By adopting the above technical solution, the pressure sensor can be effectively prevented from being invaded by external gas or liquid. The sealing ring fits tightly with the ceramic chip to ensure that the sensor still has good sealing in a high pressure or liquid environment, thereby preventing the chip from being disturbed by external factors and improving the long-term stability and service life of the sensor.

[0012] Optionally, the mounting shell includes a shell and a back cover, the shell is connected to the pressure ring, the back cover is connected to the shell, the back cover is provided with a connecting channel, and one end of the connector passes through the connecting channel and is fixed in the back cover.

[0013] By adopting the above technical solution, the mounting shell is connected to the back cover, and the back cover is provided with a connection channel, which is convenient for connecting and protecting the wires. The connector is fixed in the back cover, so that the wires can be stably connected to the circuit board inside the sensor, avoiding the loosening of the connector due to external vibration or mechanical shock, thereby improving the overall stability of the sensor.

[0014] Optionally, a ventilation hole is opened on the top of the back cover, and the back cover, the shell and the pressure inlet head are interconnected. The wire passes through the pressure ring, the shell and the back cover in sequence and is connected to the connector. The wire is a shielded wire, and the ceramic diaphragm of the ceramic resistor pressure chip is a flat film ceramic.

[0015] By adopting the above technical solution, the air vent design makes the air pressure inside the sensor balanced with the outside world, avoiding diaphragm deformation or signal error caused by internal air pressure difference. At the same time, the use of shielded wires can effectively reduce external electromagnetic interference and further improve the anti-interference ability of the sensor, thereby ensuring the stability and accuracy of the output signal. In addition, the flat membrane ceramic is designed with a flat surface and a smooth surface, which can accurately sense the pressure changes and effectively avoid the accumulation of sediments or impurities on the diaphragm surface, thereby maintaining the measurement accuracy and stability of the sensor.

[0016] Optionally, a plurality of snap-in grooves are provided on the inner side wall of the shell away from the pressure inlet head, and the back cover is connected to a plurality of elastic snap-in blocks, the elastic snap-in blocks correspond one-to-one to the snap-in grooves, and the elastic snap-in blocks are provided with guiding arc surfaces, and when the shell is docked with the back cover, the elastic snap-in blocks are located in the corresponding snap-in grooves.

[0017] By adopting the above technical solution, the shell and the back cover cooperate with each other through the card slot and the elastic card block, so that the back cover can be easily installed. The elastic card block is provided with a guide arc surface, and the back cover can be separated from the shell by simply pulling the back cover hard, thereby improving the assembly efficiency of the sensor.

[0018] Optionally, a stepped annular groove is provided at one end of the pressure inlet head close to the shell along the circumferential direction, and the side wall of the shell rests on the stepped annular groove. At least two sliding grooves are provided in the pressure inlet head, one end of the sliding groove is connected to the side wall of the stepped annular groove, and the other end of the sliding groove passes through the side wall of the pressure inlet head. An adjusting rod and a spring are slidingly arranged in the sliding groove, and the spring and the adjusting rod are jointly connected with a plug-in block, which extends into the stepped groove, and a guide surface is provided on the plug-in block. A plug-in groove is provided on the side wall of the shell facing the stepped groove, and the plug-in block corresponds to and fits with the plug-in groove one by one.

[0019] By adopting the above technical solution, when installing the shell, as the shell continues to approach the stepped ring groove, the plug-in block is first squeezed into the sliding groove under the action of its guide surface. When the plug-in block is facing the plug-in groove, the spring pushes the plug-in block to extend out of the sliding groove and insert into the plug-in groove. The shell and the pressure inlet head can be fixed by simply docking the shell and the pressure inlet head. When disassembling the shell, it is only necessary to press the end of the adjustment rod located below the stepped ring groove, and the adjustment rod drives the plug-in block to extend into the sliding groove, so that the shell can be pulled out of the pressure inlet head for easy disassembly.

[0020] Optionally, at least two movable grooves are opened on the inner wall of the connecting channel, abutment plates are installed in the movable grooves, countersunk bolts are bolted to the rear cover, the countersunk bolts abut against the abutment plates, and the abutment plates abut against the joints.

[0021] By adopting the above technical solution, the connection between the connector and the back cover is strengthened, so that the wire and the circuit board inside the sensor can be stably connected, avoiding the connector from loosening due to external vibration or mechanical shock, thereby improving the overall stability of the sensor.

[0022] Optionally, a connecting plate is provided in the movable groove, the connecting plate is connected to a plurality of connecting columns, the plurality of connecting columns are commonly connected to the abutting plate, and the countersunk bolt abuts against the connecting plate.

[0023] By adopting the above technical solution, the countersunk bolts are pressed against the connecting plate, and the connecting plate drives multiple connecting columns to press against the connecting plate, thereby further strengthening the fixing effect of the joint.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. Electrodes are deposited on the surface of the ceramic diaphragm to form the two plates of the resistor. When the diaphragm is subjected to pressure, the distance between the plates will change slightly, thereby changing the resistance value. Due to the high rigidity and stability of the ceramic material, it can accurately detect small pressure changes with high detection accuracy. There is no need to set up multiple layers of electrodes, which simplifies the structure of the sensor. 2. At the same time, ceramic is a high-strength, very rigid material. Even under high pressure, its deformation is very small, usually at the nanometer or micrometer level. This extremely small deformation is enough to measure the change in pressure, but not enough to affect the structural integrity of the sensor. Therefore, even if the ceramic diaphragm is slightly deformed during operation, it will not produce cracks or other problems that may cause leakage, thus reducing additional packaging structures and reducing the complexity of the sensor; 3. Compared with metal materials, ceramics are less sensitive to temperature changes. Therefore, the flat film ceramic resistance pressure sensor already has a certain temperature compensation capability in the basic material. When applied to scenes with general environmental requirements, it is usually not necessary to set up additional sensors to compensate for temperature drift; 4. Adding a gasket can buffer the pressure between the pressure ring and the ceramic resistor pressure chip, preventing mechanical damage to the ceramic resistor pressure chip during installation and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application.

[0026] Figure 2 yes Figure 1 Enlarged schematic diagram of part A.

[0027] Figure 3 It is a schematic diagram of the overall structure of Example 2 of the present application.

[0028] Explanation of the accompanying drawings: 1. pressure inlet head; 11. first mounting groove; 12. second mounting groove; 13. detection port; 14. sealing ring groove; 15. sealing ring; 16. limit plate; 17. elastic sheet; 18. stepped ring groove; 19. sliding groove; 110. adjusting rod; 111. spring; 112. plug-in block; 1121. guide surface; 2. ceramic resistor pressure chip; 3. gasket; 4. pressure ring; 41. raised portion; 5. mounting shell; 51. shell; 511. snap-in groove; 512. plug-in groove; 52. back cover; 521. connecting channel; 5211. movable groove; 522. air vent; 53. elastic block; 531. guiding arc surface; 54. connecting plate; 55. connecting column; 56. countersunk bolt; 57. abutment plate; 6. amplifying circuit board; 61. wire; 7. connector. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-3 This application is described in further detail.

[0030] Embodiment 1 of the present application discloses a ceramic resistance pressure sensor.

[0031] Example 1 like Figure 1 and Figure 2The ceramic resistance pressure sensor includes a pressure inlet head 1, which is a cavity structure. The cavity structure of the pressure inlet head 1 includes a first mounting groove 11 and a second mounting groove 12. The pressure inlet head 1 is a cylindrical structure. A detection port 13 is provided at one end of the pressure inlet head 1. The detection port 13 is connected to the first mounting groove 11. A sealing ring groove 14 is provided on the inner wall of the pressure inlet head 1. The sealing ring groove 14 is arranged around the detection port 13. The first mounting groove 11 is connected to the detection port 13. A sealing ring 15 is installed in the sealing ring groove 14. A ceramic resistance pressure chip 2 and a gasket 3 are placed in the first mounting groove 11. One side of the ceramic resistance pressure chip 2 faces the detection port 13 and fits with the sealing ring 15 and the inner wall of the pressure inlet head 1. The gasket 3 is located on the side of the ceramic resistor pressure chip 2 away from the detection port 13, and a limiting plate 16 is connected to the bottom wall of the second mounting groove 12. A plurality of elastic sheets 17 are circumferentially connected to the inner wall of the shell 51 away from the detection port 13. There is a movable space between the elastic sheet 17 and the limiting plate 16. The limiting plate 16 is closer to the central axis than the elastic sheet 17. The elastic sheet 17 is close to the limiting plate 16 in a natural state. A pressure ring 4 is arranged in the second mounting groove 12, and a protrusion 41 is integrally formed on the circumferential surface of the pressure ring 4. When the pressure ring 4 is completely located in the pressure head 1, the limiting plate 16 abuts against the pressure ring 4, and a plurality of elastic sheets 17 abut against the side wall of the pressure ring 4. The pressure ring 4 abuts against the gasket 3, and the gasket 3 abuts against the ceramic resistor pressure chip 2.

[0032] The pressure inlet head 1 is connected to a mounting shell 5, which includes a shell body 51 and a back cover 52. The shell body 51 is welded to the end of the pressure inlet head 1 away from the detection port 13. Three snap-in grooves 511 are provided on the inner side wall of the shell body 51 away from the end of the pressure inlet head 1. The back cover 52 is connected to three elastic snap-in blocks 53. The elastic snap-in blocks 53 correspond to the snap-in grooves 511 one by one. The elastic snap-in blocks 53 have a guiding arc surface 531 on one side facing the shell body 51. When the shell body 51 is docked with the back cover 52, the elastic snap-in blocks 53 are snapped into the corresponding snap-in grooves 511.

[0033] An amplifying circuit board 6 is provided on the side of the ceramic resistor pressure chip 2 facing away from the detection port 13. The ceramic diaphragm of the ceramic resistor pressure chip 2 adopts flat film ceramic. The amplifying circuit board 6 is connected to the wire 61, and the wire 61 is a shielding wire. A connecting channel 521 is provided on one side of the back cover 52, and a vent hole 522 is provided on the top of the back cover 52. A connector 7 is tightly fitted in the connecting channel 521. The wire 61 passes through the gasket 3, the pressure ring 4, the housing 51 and the back cover 52 in sequence and is connected to the connector 7.

[0034] When installing the pressure ring 4, the elastic sheet 17 is deformed and pressed against the side wall of the pressure ring 4. The installation can be completed by simply pressing the pressure ring 4 into the installation shell 5, which is convenient and quick. The limiting plate 16 plays a limiting role to prevent the pressure ring 4 from squeezing the ceramic resistor pressure chip 2.

[0035] The gasket 3 can buffer the pressure between the pressure ring 4 and the ceramic resistor pressure chip 2 to prevent mechanical damage to the ceramic resistor pressure chip 2 during installation and use.

[0036] Electrodes are deposited on the surface of the ceramic diaphragm to form two plates of the resistor. When the diaphragm is subjected to pressure, the distance between the plates will change slightly, thereby changing the resistance value. Due to the high stiffness and stability of the ceramic material, it can accurately detect small pressure changes with high detection accuracy. There is no need to set up multiple layers of electrodes, which simplifies the structure of the sensor. At the same time, ceramic is a high-strength and very rigid material. Even under high pressure, its deformation is very small, usually at the nanometer or micrometer level. This extremely small deformation is sufficient to measure changes in pressure, but not enough to affect the structural integrity of the sensor. Therefore, even if the ceramic diaphragm is slightly deformed during operation, it will not produce cracks or other problems that will cause leakage. Therefore, additional packaging structures can be reduced and the complexity of the sensor can be reduced. At the same time, compared with metal materials, ceramics are less sensitive to temperature changes. Therefore, the flat film ceramic resistance pressure sensor already has a certain temperature compensation capability in the basic material. When applied to scenarios with general environmental requirements, it is usually not necessary to set up additional sensors to compensate for temperature drift; Therefore, the sensor reduces multiple complex components and circuits, reduces production difficulty and production costs, while ensuring signal stability and accuracy, making it suitable for large-scale production and application scenarios with low environmental requirements.

[0037] When installing the pressure ring 4, the elastic sheet 17 is deformed and pressed against the side wall of the pressure ring 4. The installation can be completed by simply pressing the pressure ring 4 into the installation shell 5, which is convenient and quick. The limiting plate 16 plays a limiting role to prevent the pressure ring 4 from squeezing the ceramic resistor pressure chip 2.

[0038] The design of the air hole 522 allows the air pressure inside the sensor to be balanced with the outside world, avoiding deformation of the diaphragm or signal error caused by the internal air pressure difference. At the same time, the use of shielded wires for the wire 61 can effectively reduce external electromagnetic interference and further improve the anti-interference ability of the sensor, thereby ensuring the stability and accuracy of the output signal. In addition, the flat membrane ceramic is designed in a flat surface with a smooth surface, which can accurately sense the pressure changes and effectively avoid the accumulation of sediments or impurities on the surface of the diaphragm, thereby maintaining the measurement accuracy and stability of the sensor.

[0039] Example 2 Reference Figure 3The difference between this embodiment and the first embodiment is that a stepped annular groove 18 is provided along the circumferential direction at one end of the pressure inlet head 1 close to the shell 51, the shell 51 is placed on the stepped annular groove 18, the inner side wall of the shell 51 is in contact with the side wall of the stepped annular groove 18, and two sliding grooves 19 are provided in the pressure inlet head 1, one end of the sliding groove 19 is connected to the side wall of the stepped annular groove 18, and the other end of the sliding groove 19 passes through the side wall of the pressure inlet head 1, and one end of the sliding groove 19 passing through the side wall of the pressure inlet head 1 is located in the stepped annular groove 18. Below, an adjusting rod 110 and a spring 111 are slidably arranged in the sliding groove 19, the adjusting rod 110 is a concave rod, the spring 111 is opposite to the side wall of the stepped ring groove 18, the adjusting rod 110 is connected together with a plug-in block 112, the plug-in block 112 extends into the stepped ring groove 18, a guide surface 1121 is provided on the top of the plug-in block 112, and a plug-in groove 512 is provided on the side wall of the housing 51 opposite to the stepped ring groove 18, and the plug-in block 112 corresponds to and fits with the plug-in groove 512 one by one.

[0040] Two movable grooves 5211 are provided on the inner wall of the connecting channel 521, and a connecting plate 54 is slidably arranged in the movable groove 5211, and a plurality of connecting columns 55 are connected to the connecting plate 54. A countersunk bolt 56 is bolted to the rear cover 52, and the countersunk bolt 56 abuts against the connecting plate 54. A plurality of connecting columns 55 are connected to an abutting plate 57, and the abutting plate 57 abuts against the joint 7.

[0041] When installing the shell 5, as the shell 51 is constantly approaching the stepped annular groove 18, the plug-in block 112 is first squeezed into the sliding groove 19 under the action of its guide surface 1121. When the plug-in block 112 is facing the plug-in groove 512, the spring 111 pushes the plug-in block 112 to extend out of the sliding groove 19 and insert into the plug-in groove 512. The shell 51 and the pressure inlet head 1 can be fixed by simply docking the shell 51 with the pressure inlet head 1. When disassembling the shell 51, it is only necessary to press the end of the adjustment rod 110 located below the stepped annular groove 18. The adjustment rod 110 drives the plug-in block 112 to extend into the sliding groove 19, and the shell 51 can be pulled out of the pressure inlet head 1 for easy disassembly.

[0042] The connection between the connector 7 and the rear cover 52 is strengthened, so that the wire 61 can be stably connected to the circuit board inside the sensor, avoiding the connector 7 from loosening due to external vibration or mechanical shock, thereby improving the overall stability of the sensor.

[0043] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A ceramic resistance pressure sensor, characterized in that: The invention comprises a pressure inlet head (1), wherein the pressure inlet head (1) is a cavity structure, the pressure inlet head (1) is provided with a detection port (13), a ceramic resistor pressure chip (2) is installed in the pressure inlet head (1), the ceramic resistor pressure chip (2) is installed with an amplifying circuit board (6), a pressure ring (4) is installed in the pressure inlet head (1), the pressure ring (4) is used to fix the ceramic resistor pressure chip (2) in the pressure inlet head (1), one side of the ceramic resistor pressure chip (2) faces the detection port (13), the pressure inlet head (1) is connected to a mounting shell (5), the mounting shell (5) is connected to a connector (7), the amplifying circuit board (6) is connected to a wire (61), and the wire (61) is connected to the connector (7).

2. The ceramic resistance pressure sensor according to claim 1, characterized in that: The circumferential surface of the pressure ring (4) is provided with a protrusion (41), the inner wall of the pressure head (1) is connected with a plurality of elastic sheets (17), a limit plate (16) is provided inside the pressure head (1), the limit plate (16) is closer to the ceramic resistance pressure chip (2) than the elastic sheet (17), when the pressure ring (4) is completely located inside the pressure head (1), the limit plate (16) is in contact with the pressure ring (4), and the plurality of elastic sheets (17) are in tight contact with the side wall of the pressure ring (4).

3. The ceramic resistance pressure sensor according to any one of claims 1 or 2, characterized in that: A gasket (3) is provided in the pressure inlet head (1), and the gasket (3) is located between the pressure ring (4) and the ceramic resistance pressure chip (2). The gasket (3) is tightly against the pressure ring (4) and the ceramic resistance pressure chip (2).

4. The ceramic resistance pressure sensor according to claim 1, characterized in that: A sealing ring groove (14) is provided on the inner side wall of the pressure inlet head (1), the sealing ring groove (14) is arranged around the detection port (13), a sealing ring (15) is installed in the sealing ring groove (14), and the sealing ring (15) is tightly pressed against the ceramic resistance pressure chip (2).

5. The ceramic resistance pressure sensor according to claim 1, characterized in that: The mounting shell (5) comprises a shell (51) and a rear cover (52); the shell (51) is connected to the pressure ring (4); the rear cover (52) is connected to the shell (51); the rear cover (52) is provided with a connecting channel (521); one end of the connector (7) passes through the connecting channel (521) and is fixed in the rear cover (52).

6. The ceramic resistance pressure sensor according to claim 5, characterized in that: A vent hole (522) is provided on the top of the rear cover (52); the rear cover (52), the shell (51) and the pressure inlet head (1) are interconnected; the wire (61) passes through the pressure ring (4), the shell (51) and the rear cover (52) in sequence and is connected to the connector (7); the wire (61) is a shielded wire; and the ceramic diaphragm of the ceramic resistor pressure chip (2) is a flat-film ceramic.

7. The ceramic resistance pressure sensor according to claim 5, characterized in that: A plurality of snap-in grooves (511) are provided on the inner side wall of the shell (51) at one end away from the pressure inlet head (1); the rear cover (52) is connected to a plurality of elastic snap-in blocks (53); the elastic snap-in blocks (53) correspond to the snap-in grooves (511) one by one; the elastic snap-in blocks (53) are provided with guide arc surfaces (531); and when the shell (51) and the rear cover (52) are butt-jointed, the elastic snap-in blocks (53) are located in the snap-in grooves (511).

8. The ceramic resistance pressure sensor according to claim 5, characterized in that: The end of the pressure inlet head (1) close to the shell (51) is provided with a stepped annular groove (18) along the circumferential direction, the shell (51) rests on the stepped annular groove (18), at least two sliding grooves (19) are provided in the pressure inlet head (1), one end of the sliding groove (19) is communicated with the side wall of the stepped annular groove (18), and the other end of the sliding groove (19) passes through the side wall of the pressure inlet head (1), and an adjusting rod (11) is slidably provided in the sliding groove (19). 0) and a spring (111), the spring (111) and the adjusting rod (110) are commonly connected with a plug-in block (112), the plug-in block (112) extends into the stepped annular groove (18), the plug-in block (112) is provided with a guide surface (1121), a plug-in groove (512) is provided on a side wall of the housing (51) facing the stepped annular groove (18), and the plug-in block (112) corresponds to and fits with the plug-in groove (512) one by one.

9. The ceramic resistance pressure sensor according to claim 5, characterized in that: At least two movable grooves (5211) are provided on the inner wall of the connecting channel (521), and abutment plates (57) are installed in the movable grooves (5211). A countersunk bolt (56) is bolted to the rear cover (52), and the countersunk bolt (56) abuts against the abutment plate (57), and the abutment plate (57) abuts against the joint (7).

10. The ceramic resistance pressure sensor according to claim 9, characterized in that: A connecting plate (54) is arranged in the movable groove (5211), and the connecting plate (54) is connected to a plurality of connecting columns (55). The plurality of connecting columns (55) are connected to the abutting plate (57) in common, and the countersunk bolt (56) abuts against the connecting plate (54).

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