Probe card carrier

Abstract

The invention discloses a probe card carrier. The probe card carrier of the present invention may comprise: a lower housing; an upper case that covers the lower case; a placement module disposed in the lower case to place a probe card; and the card buffer unit is arranged on the placing module to elastically support the bottom surface and the periphery of the probe card.

Description

Technical Field

[0001] The present invention relates to a probe card carrier capable of suppressing the transmission of impact to the probe card. Background Art

[0002] Typically, wafers are manufactured through semiconductor manufacturing processes. Probe cards are used to electrically connect the chips of the wafers and the tester in the wafer inspection process. The probe card has a structure in which a plurality of probes are attached to a circuit board of a predetermined specification. The probe card is manufactured into various shapes according to the chip arrangement on the wafer to be inspected and the arrangement of the pads of the chips.

[0003] Inside the circuit board, hundreds of thousands to millions of vias are connected to dozens of internal layers. Since the circuit board needs to have rigidity to prevent deformation due to the load applied by multiple probes, a ceramic substrate is used as the circuit board.

[0004] The wafer is loaded into the probe chuck. The probes are connected to the pads (power connection units) of the chips in the wafer. The signals sent from the tester are transmitted to the chips in the wafer through the probe card, and the signals output from the chips are retransmitted to the tester through the probe card. The tester determines whether the chip is defective by the signals received from the chip.

[0005] If one of the probe cards has a power-on defect, all the probe cards are considered defective, so the yield of the probe cards and the impact protection during transportation are very important. Such probe cards are very expensive products. Therefore, the carrier is transported in a state where the probe cards are stably placed inside the carrier to prevent the probe cards from being subjected to external impact or vibration. Therefore, a carrier that can safely accommodate the probe cards is required.

[0006] The background art of the present invention is disclosed in Korean Invention Patent Publication No. 2016-0109748 (published on September 21, 2016). Summary of the invention

[0007] Technical issues

[0008] The present invention aims to solve the above-mentioned problem, and to this end provides a probe card carrier capable of suppressing the transmission of impact to the probe card.

[0009] The present invention is directed to providing a probe card carrier capable of supporting the probe card with minimal friction.

[0010] The technical problem of the present invention is not limited to the above-mentioned purpose. Other purposes and advantages of the present invention not mentioned above can be understood through the following description, and it will become clearer through the embodiments of the present invention. In addition, it can be easily understood that the purposes and advantages of the present invention can be achieved through the methods and combinations shown in the claims.

[0011] Technical Solution

[0012] To solve the above problems, the probe card carrier according to the present invention may include: a lower shell; an upper shell covering the lower shell; a placement module arranged on the lower shell to place the probe card; and a card buffer unit provided on the placement module to elastically support the bottom surface and periphery of the probe card.

[0013] The card buffer unit may include a plurality of lower elastic balls arranged at the placement module to elastically support the bottom surface of the probe card and a plurality of peripheral elastic balls arranged at the placement module to elastically support the periphery of the probe card.

[0014] A plurality of the lower elastic balls may be arranged along a circumferential direction in the placement module.

[0015] The plurality of outer elastic balls may be arranged outside the plurality of lower elastic balls to be concentric with the lower elastic balls.

[0016] The placement module includes a plurality of placement blocks, the placement blocks are arranged along a circumferential direction in the lower shell, and the lower elastic balls and the peripheral elastic balls are arranged on the placement blocks.

[0017] The placement block may include: a placement plate, whose position is fixed to the lower shell; a lower support member, which protrudes upward on the placement plate, and a lower placement groove is formed in a hemispherical shape to accommodate the lower side of the lower elastic ball; a peripheral support member, which protrudes higher than the lower support member on the outer side of the lower support member and forms a peripheral placement groove so that the peripheral elastic ball is placed protruding toward the side of the lower support member; and a peripheral bracket, on which a bracket groove is formed to cover the upper side of the peripheral elastic ball, and the peripheral bracket is combined with the upper side of the peripheral support member.

[0018] The placement block may be variably disposed in the lower housing according to a size or a shape of the probe card.

[0019] An accommodation space surrounded by the peripheral placement groove and the bracket groove may be formed in a hemispherical shape.

[0020] The accommodation space may be formed to be larger than a half of the peripheral elastic ball to prevent the peripheral elastic ball from being separated from the accommodation space.

[0021] A coupling protrusion may be formed in the lower elastic ball, and a lower coupling hole may be formed in the lower placement groove, so that the coupling protrusion is constrained after being clamped.

[0022] The probe card carrier may further include a plurality of upper blocks coupled to the upper housing and having upper placement grooves formed therein, and a plurality of upper elastic balls coupled to the plurality of upper placement grooves to elastically support the top surface of the probe card.

[0023] A fastening protrusion may be formed in the upper elastic ball, and an upper fastening hole may be formed in the upper placement groove, so that the fastening protrusion is clamped and constrained.

[0024] A through hole unit may be formed in the upper housing, and the probe card carrier may further include a window unit and an upper sealing unit, the window unit being used to close the through hole unit, and the upper sealing unit being sandwiched between the periphery of the through hole unit and the periphery of the window unit.

[0025] The probe card carrier may further include a sealing member configured to seal peripheries of the lower housing and the upper housing.

[0026] The probe card carrier may further include a vacuum valve disposed at the upper housing.

[0027] The probe card carrier may further include a plurality of external buffer units coupled to peripheral portions of the lower case and the upper case.

[0028] Beneficial Effects

[0029] According to the present invention, the card buffer unit elastically supports the bottom surface and the periphery of the probe card, thereby preventing the probe card from being damaged or broken due to vibrations in the vertical and horizontal directions during movement.

[0030] According to the present invention, since the spherical lower elastic ball supports the bottom surface of the probe card, the vertical vibration or impact of the probe card carrier can be evenly dispersed from the lower elastic ball to the surroundings.

[0031] According to the present invention, the lower elastic balls made of elastic material are in point contact with the bottom surface of the probe card, so the plurality of lower elastic balls can significantly reduce the possibility of damage caused by friction by maintaining a minimum friction area with the probe card.

[0032] According to the present invention, when a part of the lower elastic balls has a slight height deviation from the other lower elastic balls, the probe card can maintain a horizontal state by a slight change in the contraction amount of the lower elastic balls.

[0033] According to the present invention, since the spherical peripheral elastic ball supports the periphery of the probe card, the horizontal vibration or impact of the probe card carrier can be evenly dispersed from the peripheral elastic ball to the surroundings.

[0034] According to the present invention, when a part of the peripheral elastic balls slightly deviates in the radial direction of the circumference, the periphery of the probe card can be stably elastically supported by the slight change in the contraction amount of the lower elastic balls.

[0035] According to the present invention, radial deviations of the plurality of peripheral elastic balls can be corrected by deviations in the shrinkage amounts of the peripheral elastic balls. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a perspective view schematically showing a probe card carrier according to the present invention.

[0037] Figure 2 is a perspective view schematically showing a state in which an upper housing is opened in a probe card carrier according to the present invention.

[0038] Figure 3 is a perspective view schematically showing a state in which a probe card is placed in a lower housing according to the present invention.

[0039] Figure 4 is an exploded perspective view schematically showing a probe card carrier according to the present invention.

[0040] Figure 5 is a cross-sectional view schematically showing a state in which an upper housing is opened in a probe card carrier according to the present invention.

[0041] Figure 6 is a cross-sectional view schematically showing a state in which a probe card is elastically supported by a card buffer unit in a probe card carrier according to the present invention.

[0042] Figure 7 is an enlarged cross-sectional view schematically showing a state in which a probe card is elastically supported by a card buffer unit in a probe card carrier according to the present invention.

[0043] Figure 8 is an enlarged cross-sectional view schematically showing a state in which a position where a module is placed is changed in the probe card carrier according to the present invention.

[0044] Fig. 9 is a perspective view schematically showing a state in which the card buffer unit is disposed on the placement module.

[0045] Fig.10 is an exploded perspective view schematically showing a card buffer unit and a placement module according to the present invention.

[0046] Fig.11 is a cross-sectional view schematically showing a card buffer unit and a placement module according to the present invention.

[0047] Fig.12 is a perspective view schematically showing an upper pusher according to the present invention.

[0048] Fig.13 is an exploded perspective view schematically showing an upper pusher according to the present invention.

[0049] Fig.14 is a cross-sectional view schematically showing an upper pusher according to the present invention.

[0050] Reference numerals

[0051] 10: Probe card 11: Ceramic substrate

[0052] 12: Circuit board 100: Probe card carrier

[0053] 110: Lower housing 112: Insert nut

[0054] 114: Open support 120: Upper housing

[0055] 121: Through hole unit 122: Window unit

[0056] 123: Upper sealing unit 125: Sealing component

[0057] 126: Lock 128: External buffer unit

[0058] 130: Place module 131: Place block

[0059] 132: Placement plate 132a: Placement slot

[0060] 132b: Fixing bolt 133: Lower support member

[0061] 134: Lower placement slot 135: Lower coupling hole

[0062] 136: Peripheral support 137: Peripheral placement groove

[0063] 138: peripheral bracket 138a: bracket hole

[0064] 138b: Bracket bolt 139: Bracket slot

[0065] 140: Card buffer unit 141: Lower elastic ball

[0066] 142: Combination protrusion 145: Peripheral elastic ball

[0067] 150: Upper pusher 151: Upper block

[0068] 152: Upper placement slot 153: Upper fastening hole

[0069] 155: Upper elastic ball 156: Fastening protrusion

[0070] 157: Bolt insertion hole 157a: Upper bolt

[0071] 160: Vacuum valve 162: Vacuum port DETAILED DESCRIPTION

[0072] The present invention is not limited to the embodiments disclosed below, and the present invention can be subjected to various modifications and implemented in various forms. This embodiment is intended only to make the disclosure of the present invention complete and to fully inform the technical personnel in the field to which the present invention belongs of the scope of the invention. Therefore, it should be understood that the present invention is not limited to the embodiments disclosed below, and the configuration of any embodiment and the configuration of another embodiment are mutually replaced or added, and all modifications, equivalents or substitutes included in the concept and technical scope of the present invention are included in the present invention.

[0073] The accompanying drawings are intended to help understand the embodiments disclosed in this specification. The technical concepts disclosed in this specification are not limited thereto. It should be understood that all modifications, equivalents or substitutes included in the concepts and technical scope of the present invention are included in the present invention. For ease of understanding, the size or thickness of the constituent elements in the accompanying drawings may be expressed as being too large or too small, but the scope of protection of the present invention should not be interpreted as being restrictive.

[0074] Hereinafter, a probe card carrier according to an embodiment of the present invention will be described.

[0075] Figure 1 is a perspective view schematically showing a probe card carrier according to the present invention, Figure 2 is a perspective view schematically showing a state in which an upper housing is opened in a probe card carrier according to the present invention, Figure 3 is a perspective view schematically showing a state where a probe card is placed in a lower housing according to the present invention, Figure 4 is an exploded perspective view schematically showing a probe card carrier according to the present invention.

[0076] Reference Figures 1 to 4 , the probe card carrier 100 according to the embodiment of the present invention includes a lower housing 110 , an upper housing 120 , a placement module 130 , and a card buffer unit 140 .

[0077] The lower housing 110 may be formed in a rectangular shape with an upper side open. The lower housing 110 may be formed of a synthetic resin material. The lower housing may be made in various shapes.

[0078] The upper case 120 is formed in a size and shape corresponding to the lower case 110 to cover an upper side of the lower case 110. The upper case 120 may be formed of a synthetic resin material.

[0079] The placement module 130 is arranged on the lower housing 110 to place the probe card 10. For example, the placement module 130 can be fixed to the lower housing 110 by bolts, rivets, adhesives, etc. The placement module 130 can be formed as an integral ring or a plurality of blocks arranged in a ring. Of course, the placement module 130 can be made in various shapes under the premise of stably supporting the probe card 10.

[0080] The probe card 10 may include a ceramic substrate 11 and a circuit board 12. A plurality of probes (not shown) are arranged on the ceramic substrate 11. The plurality of probes have elasticity so as not to damage the chips of the wafer. The ceramic substrate 11 is formed with a strength that prevents the plurality of probes from being deformed when in close contact with the pads of the wafer. The circuit board 12 is arranged on the upper side of the ceramic substrate 11. The circuit board 12 includes a circuit pattern of dozens of layers or more to be electrically connected to the probes (not shown). The circuit board 12 performs the function of electrically connecting the plurality of probes to the tester.

[0081] The card buffer unit 140 is disposed on the placement module 130 to elastically support the bottom surface and the periphery of the probe card 10. The card buffer unit 140 protects the probe card 10 by absorbing and dispersing external impact or vibration. The card buffer unit 140 elastically supports the bottom surface and the periphery of the probe card 10, thereby preventing the probe card from being damaged or broken due to vibrations in the vertical and horizontal directions during movement.

[0082] A through hole unit 121 may be formed in the upper housing 120. At this time, a window unit 122 is provided to close the through hole unit 121. An upper sealing unit 123 is sandwiched between the periphery of the through hole unit 121 and the periphery of the window unit 122. The upper sealing unit 123 is formed in a shape corresponding to the shapes of the window unit 122 and the through hole unit 121. The upper sealing unit 123 seals the gap between the through hole unit 121 and the window unit 122. Since the window unit 122 is provided in the upper housing 120, the inside of the probe card carrier 100 can be visually confirmed from the outside.

[0083] The probe card carrier 100 further includes a sealing member 125 provided to seal the periphery of the lower housing 110 and the upper housing 120. The sealing member 125 is formed to correspond to the shapes of the lower housing 110 and the upper housing 120. The sealing member 125 may be formed of an elastic material such as rubber, silicone, or polyurethane.

[0084] The lock catch 126 is provided to lock the lower housing 110 and the upper housing 120. The lock catch 126 is constrained by a locking portion (not shown) of the lower housing 110 to prevent the upper housing 120 from opening when it is rotated. The lock catch 126 may be applicable to various shapes.

[0085] The probe card carrier 100 may further include a plurality of external buffer units 128, which are coupled to the outer peripheral portions of the lower housing 110 and the upper housing 120. The external buffer units 128 may be formed of an elastic material such as rubber, silicone grease, or polyurethane. About 10 or more external buffer units 128 may be provided at the corner portions and the outer peripheral portions of the lower housing 110 and the upper housing 120. The external buffer units 128 absorb impacts applied from the outside during transportation and loading of the probe card carrier 100.

[0086] The probe card carrier 100 may further include a vacuum valve 160, which is disposed on the upper housing 120. At this time, a vacuum port 162 communicating with the internal space is connected to the upper housing 120, and the vacuum valve 160 is disposed on the vacuum port 162. The probe card 10 is placed inside the upper housing 120 and the lower housing 110, the upper housing 120 is closed to the lower housing 110, and the lock 126 locks the upper housing 120 to the lower housing 110. In addition, when a vacuum device (not shown) is connected to the vacuum port 162 to vacuum the internal space of the upper housing 120 and the lower housing 110, manual operation can be performed to close the vacuum port 162 by the vacuum valve 160. As a result, during the movement of the probe card carrier 100, the internal space of the upper housing 120 and the lower housing 110 can be maintained in a vacuum state.

[0087] Figure 5 is a cross-sectional view schematically showing a state in which an upper housing is opened in a probe card carrier according to the present invention, Figure 6 is a cross-sectional view schematically showing a state in which a probe card is elastically supported by a card buffer unit in a probe card carrier according to the present invention, Figure 7 is an enlarged cross-sectional view schematically showing a state in which a probe card is elastically supported by a card buffer unit in a probe card carrier according to the present invention, Figure 8 is an enlarged cross-sectional view schematically showing a state in which a position where a module is placed is changed in a probe card carrier according to the present invention, Fig. 9 is a perspective view schematically showing a state in which the card buffer unit is set in a placement module, Fig.10 is an exploded perspective view schematically showing a card buffer unit and a placement module according to the present invention, Fig.11 is a cross-sectional view schematically showing a card buffer unit and a placement module according to the present invention.

[0088] Reference Figures 5 to 11 , the card buffer unit 140 includes a plurality of lower elastic balls 141 and a plurality of peripheral elastic balls 145 .

[0089] A plurality of lower elastic balls 141 are arranged in the placement module 130 to elastically support the bottom surface of the probe card 10. The lower elastic balls 141 can be formed of elastic silicone material or polyurethane material, etc. The plurality of lower elastic balls 141 are arranged outside the circuit board 12 of the probe card 10 to avoid the plurality of probes. For example, the plurality of lower elastic balls 141 can be arranged along the circumferential direction in the placement module 130. At this time, the plurality of lower elastic balls 141 can be arranged on a circumference of the central part of the lower shell 110. In addition, the plurality of lower elastic balls 141 can be arranged on at least two circumferences that are concentric circles in the central part of the lower shell 110. The arrangement structure of the plurality of lower elastic balls 141 can be subjected to various changes according to the size and shape of the probe card 10.

[0090] Since the spherical lower elastic ball 141 supports the bottom surface of the probe card 10, the vertical vibration or impact of the probe card carrier 100 can be evenly dispersed to the surroundings from the lower elastic ball 141. In addition, since the lower elastic ball 141 is formed in a spherical shape, even if the lower elastic ball 141 is placed in any direction in the placement module 130, the height of the lower elastic ball 141 or the supporting position of the probe card 10 does not change.

[0091] In addition, the lower elastic balls 141 made of elastic material are in point contact with the bottom surface of the probe card 10, so the plurality of lower elastic balls 141 can significantly reduce the possibility of damage caused by friction by maintaining a minimum friction surface with the probe card 10. In addition, when a slight height deviation occurs between some lower elastic balls 141 and other lower elastic balls 141, the probe card 10 can maintain a horizontal state by slightly changing the amount of contraction of the lower elastic balls 141. In addition, the height deviation of the lower elastic balls 141 can be corrected by the contraction deviation.

[0092] A plurality of peripheral elastic balls 145 may be arranged on the placement module 130 to elastically support the periphery of the probe card 10. The peripheral elastic balls 145 may be formed of a silicone material or a polyurethane material having elasticity, etc. For example, the plurality of peripheral elastic balls 145 may be arranged outside the plurality of lower elastic balls 141 to be concentric with the lower elastic balls 141. The plurality of peripheral elastic balls 145 elastically support the outer peripheral surface of the ceramic substrate 11 of the probe card 10. The peripheral elastic balls 145 may be formed in the same size or different size from the lower elastic balls 141.

[0093] Since the spherical outer elastic ball 145 supports the outer periphery of the probe card 10, the horizontal vibration or impact of the probe card carrier 100 can be evenly dispersed to the surroundings from the outer elastic ball 145. In addition, since the outer elastic ball 145 is formed in a spherical shape, even if the outer elastic ball 145 is placed in any direction in the placement module 130, the support position of the probe card 10 does not change.

[0094] In addition, the peripheral elastic balls 145 of elastic material are in point contact with the periphery of the probe card 10, so the plurality of peripheral elastic balls 145 can significantly reduce the possibility of damage caused by friction by maintaining a minimum friction area with the periphery of the probe card 10. In addition, when a portion of the peripheral elastic balls 145 has a slight deviation in the radial direction of the circumference, the periphery of the probe card 10 can be stably elastically supported by a slight change in the contraction amount of the peripheral elastic balls 145. In addition, the radial deviation of the plurality of peripheral elastic balls 145 can be corrected by the deviation of the contraction amount of the peripheral elastic balls 145.

[0095] The placement module 130 includes a plurality of placement blocks 131, which are arranged circumferentially in the lower housing 110, and the lower elastic balls 141 and the peripheral elastic balls 145 are arranged on the placement blocks 131. One lower elastic ball 141 and one peripheral elastic ball 145 may be arranged on each placement block 131. The plurality of placement blocks 131 may be arranged at equal intervals along the circumference.

[0096] The placement block 131 may be variably disposed in the lower housing 110 according to the size of the probe card 10 (see Figure 7 and Figure 8 ). For example, after a plurality of insert nuts 112 are radially inserted into the lower housing 110 by injection molding, and the position of the placement block 131 is changed corresponding to the size of the probe card 10, the fixing bolt 132b of the placement block 131 can be fastened to the insert nut 112. Thus, probe cards 10 of various sizes can be placed on the probe card carrier 100. In addition, the probe card carrier 100 does not need to be manufactured to correspond to probe cards 10 of various sizes. In addition, a plurality of placement blocks 131 can be fixed to other positions along the radial direction of the circumference, so the fixing position of the placement block 131 can be changed corresponding to the outer shape of the probe card 10. The variable position structure of the placement block 131 can be changed to various structures such as a guide rail structure and a sliding structure.

[0097] The placement block 131 includes a placement plate 132 , a lower support member 133 , a peripheral support member 136 , and a peripheral bracket 138 .

[0098] The position of the placement plate 132 is fixed to the lower housing 110. At least two or more placement grooves 132a may be formed in the placement plate 132. The placement grooves 132a are formed at intervals corresponding to the intervals of the insertion nuts 112. The fixing bolts 132b penetrate the placement grooves 132a and are fastened to the insertion nuts 112. The lower side of the insertion nuts 112 has a structure blocked by the lower housing 110.

[0099] The lower support member 133 protrudes upward on the placement plate 132, and the lower placement groove 134 is formed in a hemispherical shape to accommodate the lower side of the lower elastic ball 141. About half of the lower elastic ball 141 protrudes upward from the lower support member 133. The radius of the lower placement groove 134 can be formed to be almost the same as the radius of the lower elastic ball 141. Thus, the lower elastic ball 141 can be stably accommodated in the lower placement groove 134 in a protruding state.

[0100] The peripheral support member 136 protrudes higher than the lower support member 133 on the outer side of the lower support member 133, and a peripheral placement groove 137 may be formed to place the peripheral elastic ball 145 protruding toward the side of the lower support member 133. The peripheral elastic ball 145 is arranged higher than the lower elastic ball 141. The peripheral elastic ball 145 protrudes toward the side of the lower support member 133, so that the periphery of the probe card 10 can be prevented from contacting the peripheral support member 136.

[0101] A bracket groove 139 may be formed in the peripheral bracket 138 to cover the upper side of the peripheral elastic ball 145, and the peripheral bracket 138 is combined with the upper side of the peripheral support 136. The bracket groove 139 can be formed with a spherical surface of about one quarter of the peripheral elastic ball 145. The bracket grooves 139 are formed on both sides of the peripheral bracket 138, and the bracket bolts 138b are fastened to the bracket grooves 139 and the peripheral support 136. The bracket holes 138a are formed on both sides of the peripheral bracket 138 so that the bracket bolts 138b pass therethrough. The peripheral bracket 138 can be bonded to the upper side of the peripheral support 136 by an adhesive. Thus, the peripheral bracket 138 constrains the peripheral elastic ball 145, and thus the peripheral elastic ball 145 can be prevented from detaching from the peripheral placement groove 137 and the bracket groove 139.

[0102] The accommodation space surrounded by the peripheral placement groove 137 and the bracket groove 139 can be formed in a hemispherical shape. Thus, the peripheral elastic ball 145 can be placed in the accommodation space in an undeformed state.

[0103] The accommodation space may be formed to be larger than half of the peripheral elastic ball 145 to prevent the peripheral elastic ball 145 from being separated from the accommodation space (refer to Fig.11 ). For example, when the peripheral elastic ball 145 is placed in the accommodation space and observed, the inner end of the accommodation space is extended inward by a predetermined length H compared to the vertical diameter of the peripheral elastic ball 145. At this time, the portion of the peripheral elastic ball 145 that is more than half is introduced between the peripheral placement groove 137 and the bracket groove 139, so that the peripheral elastic ball 145 can be prevented from escaping from the accommodation space.

[0104] A coupling protrusion 142 may be formed in the lower elastic ball 141, and a lower coupling hole 135 may be formed in the lower placement groove 134, so that the coupling protrusion 142 is clamped and constrained. A clamping protrusion (not shown) is formed at the end of the coupling protrusion 142, and the clamping protrusion is larger than the lower coupling hole 135. Thus, the lower elastic ball 141 can be prevented from being separated from the lower placement groove 134.

[0105] Fig.12 is a perspective view schematically showing an upper pusher according to the present invention, Fig.13 is an exploded perspective view schematically showing an upper pusher according to the present invention, Fig.14 is a cross-sectional view schematically showing an upper pusher according to the present invention.

[0106] Reference Figure 12 to Figure 14 , the probe card carrier 100 may further include a plurality of upper blocks 151 and a plurality of upper elastic balls 155 .

[0107] A plurality of upper blocks 151 are coupled to the upper housing 120, and upper placement grooves 152 are formed in the upper blocks 151. Upper fastening holes 153 may be formed at both sides of the upper blocks 151. At this time, insert nuts (not shown) are inserted and injection-molded in the upper housing 120 corresponding to the upper fastening holes 153, and upper bolts 157a are fastened to the insert nuts through the bolt insertion holes 157, whereby the upper blocks 151 are coupled to the upper housing 120.

[0108] A plurality of upper elastic balls 155 are coupled to the plurality of upper placement grooves 152 to elastically support the top surface of the probe card 10. The upper elastic balls 155 may be formed of a silicone material or a polyurethane material having elasticity, etc. The upper placement grooves 152 are formed in a hemispherical shape having the same size as the upper elastic balls 155.

[0109] Since the spherical upper elastic balls 155 support the top surface of the probe card 10, the vibration or impact of the probe card carrier 100 in the up-and-down direction can be evenly dispersed from the upper elastic balls 155 to the surroundings. In addition, the upper elastic balls 155 made of elastic material are in point contact with the top surface of the probe card 10, so the plurality of upper elastic balls 155 can significantly reduce the possibility of damage caused by friction by maintaining a minimum friction area with the probe card 10. In addition, when there is a slight height deviation of the upper elastic balls 155, the top surface of the probe card 10 can be stably supported by slight changes in the shrinkage amount of the plurality of upper elastic balls 155. In addition, even if there is a slight height deviation of the upper elastic balls 155, the upper elastic balls 155 and the top surface of the probe card 10 can be prevented from being separated from each other.

[0110] A fastening protrusion 156 is formed in the upper elastic ball 155, and an upper fastening hole 153 is formed in the upper placement groove 152, so that the fastening protrusion 156 is clamped and constrained. A clamping protrusion is formed at the end of the fastening protrusion 156, and the clamping protrusion is larger than the upper fastening hole 153. Thus, the upper elastic ball 155 can be prevented from being separated from the upper placement groove 152.

[0111] As described above, the present invention is described with reference to the accompanying drawings shown, but the present invention is not limited to the embodiments and drawings disclosed in this specification, and it is obvious that a person skilled in the art can make various modifications within the technical concept of the present invention. In addition, although the effect of the configuration according to the present invention is not explicitly recorded in the process of describing the embodiments of the present invention, the effect predicted by the configuration should also be recognized.

Claims

1. A probe card carrier, comprising: Lower housing; an upper shell covering the lower shell; A placement module, which is arranged on the lower housing to place a probe card; as well as The card buffer unit is arranged on the placement module to elastically support the bottom surface and the periphery of the probe card.

2. The probe card carrier according to claim 1, wherein: The card buffer unit includes: a plurality of lower elastic balls arranged on the placement module to elastically support the bottom surface of the probe card; and A plurality of peripheral elastic balls are arranged on the placement module to elastically support the periphery of the probe card.

3. The probe card carrier according to claim 2, wherein: A plurality of the lower elastic balls are arranged along the circumferential direction in the placement module.

4. The probe card carrier according to claim 2, wherein: The plurality of outer elastic balls are arranged outside the plurality of lower elastic balls so as to be concentric with the lower elastic balls.

5. The probe card carrier according to claim 1, wherein: The placement module includes a plurality of placement blocks, the placement blocks are arranged along a circumferential direction in the lower shell, and the lower elastic balls and the peripheral elastic balls are arranged in the placement blocks.

6. The probe card carrier according to claim 5, wherein: The placement block includes: a placement plate, the position of which is fixed to the lower shell; a lower support member protruding upward on the placement plate, and a lower placement groove formed in a hemispherical shape to accommodate the lower side of the lower elastic ball; a peripheral support member protruding higher than the lower support member on the outer side of the lower support member and forming a peripheral placement groove so that the peripheral elastic ball is placed protruding toward the lower support member side; and A peripheral bracket is formed with a bracket groove to cover the upper side of the peripheral elastic ball, and the peripheral bracket is combined with the upper side of the peripheral support member.

7. The probe card carrier according to claim 5, wherein: The placement block is variably disposed in the lower housing according to the size or shape of the probe card.

8. The probe card carrier according to claim 6, wherein: An accommodation space surrounded by the peripheral placement groove and the bracket groove is formed in a hemispherical shape.

9. The probe card carrier according to claim 8, wherein: The accommodation space is formed to be larger than a half of the peripheral elastic ball to prevent the peripheral elastic ball from escaping from the accommodation space.

10. The probe card carrier according to claim 7, wherein: A coupling protrusion is formed in the lower elastic ball, A coupling hole is formed in the lower placement groove so that the coupling protrusion can be constrained after being clamped therein.

11. The probe card carrier according to claim 1, further comprising: a plurality of upper blocks coupled to the upper housing, and upper placement grooves formed in the upper blocks; as well as A plurality of upper elastic balls are coupled to the plurality of upper placement grooves to elastically support the top surface of the probe card.

12. The probe card carrier according to claim 11, wherein: A fastening protrusion is formed in the upper elastic ball, An upper fastening hole is formed in the upper placement groove so that the fastening protrusion can be clamped and constrained.

13. The probe card carrier according to claim 1, wherein: The upper housing has a through hole unit formed therein, and further includes a window unit for closing the through hole unit and an upper sealing unit interposed between a periphery of the through hole unit and a periphery of the window unit.

14. The probe card carrier according to claim 1, further comprising: A sealing member is provided to seal the peripheries of the lower shell and the upper shell.

15. The probe card carrier according to claim 1, further comprising: A vacuum valve is arranged on the upper shell.

16. The probe card carrier according to claim 1, further comprising: A plurality of external buffer units are coupled to outer peripheral portions of the lower case and the upper case.

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