Loading and unloading chamber of semiconductor process equipment and semiconductor process equipment

Abstract

The invention discloses a loading and unloading chamber of semiconductor process equipment and the semiconductor process equipment, and relates to the field of semiconductors. The loading and unloading chamber of the semiconductor process equipment comprises a mounting main plate, a sealing cover and an unlocking mechanism, the sealing cover is movably arranged on one side of the mounting main board in the first direction, a sealing shell is arranged in the sealing cover, and the sealing shell can move relative to the sealing cover in the second direction; the unlocking mechanism comprises an unlocking part, the unlocking part is arranged in the sealing shell, and the unlocking end of the unlocking part extends out of the sealing shell and is used for being matched with a door plate of the wafer box; wherein the first direction is parallel to the mounting main board, and the second direction is perpendicular to the mounting main board. According to the invention, at least the problem that particles in the FIMS enter the FOUP to cause particle pollution can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a loading and unloading chamber of semiconductor process equipment and semiconductor process equipment. Background Art

[0002] Vertical heat treatment equipment is widely used in semiconductor manufacturing process flow, and the front-opening interface mechanical standard (FIMS) is an important structure in vertical heat treatment equipment. At present, the semiconductor industry mostly uses front-opening wafer carriers (FOUP) as containers for wafer storage. The role of FIMS is to open the FOUP so that the wafer can be cleanly transferred in or out of the FOUP.

[0003] With the development of semiconductor process technology, wafers are more and more sensitive to particles, and accordingly, more stringent requirements are put forward for particle control of vertical thermal processing equipment. Under normal operation of vertical thermal processing equipment, the wafer loading area and the inside of FOUP are usually considered clean.

[0004] In order to open or close the FOUP, multiple structures will move relative to each other during operation to realize the unlocking, lid opening, sealing, and lateral movement functions of the FIMS. When performing the corresponding actions, tiny particles will inevitably be generated due to friction between the relevant components and dispersed in the gas environment around the components, such as Figure 1 and Figure 2 In this case, when the FIMS opens the FOUP, the movement and changes in air pressure will cause the particles in the FIMS to enter the FOUP, causing particle contamination, which can easily lead to product quality problems. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a loading and unloading chamber of semiconductor process equipment and semiconductor process equipment, which can at least solve the problem of particles inside the FIMS entering the FOUP and causing particle contamination.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] The embodiment of the present application provides a loading and unloading chamber of a semiconductor process equipment, which is used to transfer wafers between a wafer box and a process chamber of the semiconductor process equipment, wherein the loading and unloading chamber comprises: a mounting mainboard, a sealing cover and an unlocking mechanism;

[0008] The sealing cover is movably arranged on one side of the mounting mainboard in a first direction, a sealing shell is arranged inside the sealing cover, and the sealing shell is movable relative to the sealing cover in a second direction;

[0009] The unlocking mechanism comprises an unlocking component, the unlocking component is arranged in the sealed housing, and the unlocking end of the unlocking component extends out of the sealed housing and is used to cooperate with the door panel of the wafer box;

[0010] The first direction is parallel to the mounting mainboard, and the second direction is perpendicular to the mounting mainboard.

[0011] An embodiment of the present application further provides a semiconductor process equipment, including a process chamber and the above-mentioned loading and unloading chamber, wherein the loading and unloading chamber is used to transfer wafers between the process chamber and the wafer box.

[0012] In the embodiment of the present application, a sealing shell is provided in the sealing cover, and the unlocking component is provided in the sealing shell. The sealing shell can surround the unlocking component and separate the unlocking component from the inner cavity of the sealing cover. In this way, even if particles are generated during the operation of the unlocking component, these particles will be bound in the inner cavity of the sealing shell and cannot enter the inner cavity of the sealing cover, thereby effectively preventing particles from entering the inner cavity of the wafer box from the inner cavity of the sealing cover after the door panel is opened and causing contamination to the wafer, thereby ensuring the cleanliness of the inner cavities of the wafer box and the sealing cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of a FIMS and a wafer carrier box in the related art;

[0014] Figure 2 A schematic diagram of particle movement during opening of a wafer carrier box in a FIMS in the related art;

[0015] Figure 3 A first structural schematic diagram of a loading and unloading chamber and a wafer box disclosed in an embodiment of the present application;

[0016] Figure 4 A second structural schematic diagram of a loading and unloading chamber and a wafer box disclosed in an embodiment of the present application;

[0017] Figure 5 A third structural schematic diagram of the loading and unloading chamber and the wafer box disclosed in the embodiment of the present application;

[0018] Figure 6 It is a first structural schematic diagram of the loading and unloading chamber, wafer box and microenvironment chamber disclosed in the embodiment of the present application;

[0019] Figure 7 A second structural schematic diagram of the loading and unloading chamber, wafer box and microenvironment chamber disclosed in the embodiment of the present application;

[0020] Figure 8A schematic diagram of particles being restricted during the process of opening a wafer box in a loading and unloading chamber disclosed in an embodiment of the present application;

[0021] Fig. 9 A first structural schematic diagram of another form of a sealing cover shell and a sealing cover disclosed in an embodiment of the present application;

[0022] Fig.10 This is a second structural schematic diagram of another form of a sealing cover shell and a sealing cover disclosed in an embodiment of the present application.

[0023] Description of reference numerals:

[0024] 100 - mainboard installation; 110 - guide hole; 120 - second guide member;

[0025] 200-sealing cover; 210-frame; 220-cover plate;

[0026] 300-unlocking mechanism; 310-unlocking component; 320-first driving component; 330-first guide member; 340-first sliding member;

[0027] 410-sealed housing; 411-panel; 412-first cover;

[0028] 420 - second cover shell; 421 - first enclosure plate; 422 - first bottom plate;

[0029] 430 - third cover shell; 431 - second enclosure plate; 432 - second bottom plate;

[0030] 440- fourth housing;

[0031] 451-third enclosure; 452-third bottom plate;

[0032] 500-wafer box; 510-door panel;

[0033] 600-transverse movement mechanism; 610-second driving component; 611-first linear module; 612-second sliding member; 613-second linear module; 620-transverse movement member;

[0034] 700-microenvironment chamber;

[0035] A-first sealed space; B-second sealed space; C-third sealed space; D-fourth sealed space; E-fifth sealed space. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0038] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0039] refer to Figures 3 to 10 The embodiment of the present application discloses a loading and unloading chamber of a semiconductor process equipment, which is used to transfer wafers between the process chamber of the semiconductor process equipment and the wafer box 500. The loading and unloading chamber may include an interface device, which may be a front-opening interface mechanical unit, i.e., FIMS, which may be applied to a vertical heat treatment equipment, so that the wafer box 500 (FOUP) can be assembled to the vertical heat treatment equipment through the FIMS seal, thereby realizing the transfer of wafers while meeting the process requirements; in addition, the interface device may also realize the isolation between the loading area environment inside the chamber (such as the microenvironment chamber 700, etc.) of the semiconductor process equipment and the atmospheric environment outside the chamber, so as to meet the process requirements.

[0040] The disclosed loading and unloading chamber includes a mounting main board 100, a sealing cover 200 and an unlocking mechanism 300. The wafer box 500 may include a box body and a door panel 510. The box body may provide a storage location for the wafers, and the door panel 510 may fix the wafers and seal them. When the wafer box 500 is unlocked and the door is opened, the space enclosed by the box body and the door panel 510 is isolated from particles in the external atmospheric environment, thereby ensuring the cleanliness of the wafer surface in the wafer box 500.

[0041] Among them, the installation mainboard 100 is a basic installation component, which can provide support and installation foundation for the sealing cover 200, the unlocking mechanism 300, etc. In some embodiments, the installation mainboard 100 can be installed to the chamber of the semiconductor process equipment by fasteners, such as bolts, screws, etc. Based on this, the entire interface device can be firmly installed to the chamber by installing the mainboard 100. In addition, in order to realize the transmission of the wafer, the installation mainboard 100 can be provided with a window, through which the transmission of the wafer can be facilitated. It should be noted here that when the wafer needs to be transmitted, the window can be opened, and when the wafer does not need to be transmitted, the window needs to be closed.

[0042] The sealing cover 200 can seal the window of the mainboard 100 to a certain extent. When the wafer needs to be transferred, the sealing cover 200 moves to a position misaligned with the window to open the window; when the wafer does not need to be transferred, the sealing cover 200 moves to a position opposite to the window to seal the window. In some embodiments, the sealing cover 200 is movably arranged on one side of the mainboard 100 in the first direction. In actual circumstances, the sealing cover 200 is located inside the chamber, and the wafer box 500 is located outside the chamber. When the wafer needs to be transferred, the door panel 510 of the wafer box 500 is opened, and the sealing cover 200 moves to the position of the window opening, so that the inner cavity of the wafer box 500 is connected to the inner cavity of the chamber through the window, so as to facilitate the transfer of wafers.

[0043] Exemplarily, the first direction can be parallel to the mounting mainboard 100, such as the sealing cover 200 moves horizontally along the extension direction of the mounting mainboard 100 so that the sealing cover 200 is misaligned or opposite to the window. Of course, it can also move in other directions, which is not specifically limited here.

[0044] The unlocking mechanism 300 is used to lock or unlock the door panel 510 of the wafer box 500 to meet the wafer transmission requirements. Specifically, before opening the door panel 510, the door panel 510 can be unlocked by the unlocking mechanism 300 to facilitate opening of the door panel 510; after the wafer transmission is completed, the door panel 510 is closed, and the door panel 510 is locked by the unlocking mechanism 300 to prevent the door panel 510 from opening, so as to ensure that the internal environment of the wafer box 500 can meet the wafer storage requirements. In some embodiments, the unlocking mechanism 300 may include an unlocking component 310, which can unlock or lock the door panel 510.

[0045] Since the unlocking mechanism 300 is located in the sealing cover 200, and the unlocking component 310 is prone to produce tiny particles due to friction between the structures during operation, and the particles are easy to diffuse in the sealing cover 200. In this way, after the unlocking component 310 opens the door panel 510 of the wafer box 500, the inner cavity of the wafer box 500 is connected with the inner cavity of the sealing cover 200, so that the particles in the sealing cover 200 are easily diffused into the wafer box 500, causing the wafer to be contaminated.

[0046] Based on the above situation, in the embodiment of the present application, a sealed shell 410 is provided in the sealing cover 200, and the unlocking component 310 is provided in the sealed shell 410. The unlocking component 310 can be surrounded by the sealed shell 410 and the unlocking component 310 can be separated from the inner cavity of the sealing cover 200. In this way, even if particles are generated during the operation of the unlocking component 310, these particles will be bound in the sealed shell 410 and cannot enter the inner cavity of the sealing cover 200, thereby ensuring the cleanliness of the internal space of the sealing cover 200, thereby effectively preventing particles from entering the inner cavity of the wafer box 500 from the inner cavity of the sealing cover 200 after opening the door panel 510 and causing contamination to the wafer, thereby ensuring the cleanliness of the inner cavities of the wafer box 500 and the sealing cover 200.

[0047] In order to unlock or lock the door panel 510 of the wafer box 500, the unlocking end of the unlocking component 310 extends out of the sealed housing 410, and is used to cooperate with the door panel 510 of the wafer box 500, so as to unlock or lock the door panel 510 through the unlocking component 310. It should be noted here that the specific structure of the unlocking component 310 and the working principle of unlocking or locking can refer to the relevant technology and meet the international standards, and will not be elaborated here.

[0048] In addition, the sealed housing 410 is movable relative to the sealed cover 200 in the second direction, so that the sealed housing 410 can move in a direction away from the wafer box 500 to open the door panel 510, wherein the second direction can be perpendicular to the mounting main board 100. In some embodiments, a portion of the sealed housing 410 can cooperate with the door panel 510, so that when the sealed housing 410 moves in the second direction, the door panel 510 is driven to move synchronously.

[0049] Exemplarily, the sealed housing 410 may be provided with an adsorption member, through which the door panel 510 may be adsorbed, so that the door panel 510 can move synchronously with the sealed housing 410. Of course, other matching modes may also be adopted, which are not specifically limited here.

[0050] refer to Figure 3In some embodiments, the sealed housing 410 may include a panel 411 and a first cover 412, wherein the first cover 412 is disposed on a side of the panel 411 away from the mounting mainboard 100, and a first sealed space A is formed between the first cover 412 and the panel 411. Exemplarily, the first cover 412 may include a frame 210 and a cover, wherein the frame 210 may be a square frame, a circular frame, etc., and the cover has the same shape as the frame 210 and is disposed on the other side of the frame 210 away from the panel 411, so that the other side of the frame 210 can be closed by the cover.

[0051] The unlocking component 310 is located in the first sealed space A and fixed to the panel 411, and the unlocking end of the unlocking component 310 passes through the panel 411. Based on this, the unlocking end of the unlocking component 310 can be matched with the panel 411 of the wafer box 500, so as to realize unlocking or locking the panel 411. Exemplarily, the panel 411 can be provided with a first avoidance hole, and the unlocking end of the unlocking component 310 can pass through the first avoidance hole and cooperate with the panel 411.

[0052] To ensure sealing, a sealing member, such as a sealing ring, a sealing ring, etc., can be provided at the first avoidance hole to achieve sealing between the unlocking end and the first avoidance hole to prevent particles generated during the operation of the unlocking component 310 from diffusing through the first avoidance hole.

[0053] In order to drive the sealed housing 410 to move, so as to drive the door panel 510 to open or close through the sealed housing 410, the unlocking mechanism 300 may further include a first driving component 320, the driving end of which is connected to the sealed housing 410, and is used to drive the sealed housing 410 to move in the second direction. Exemplarily, the first driving component 320 may be a linear driving component, including a linear module, a cylinder, a hydraulic cylinder, an electric cylinder, etc., as long as it can drive the sealed housing 410 to move in the second direction, and the specific form is not limited.

[0054] In the embodiment of the present application, the first driving component 320 is located on the inner side of the sealing cover 200, considering that the first driving component 320 may generate particles during operation. In order to prevent the particles from diffusing in the sealing cover 200 and causing the particles to continue to diffuse into the wafer box 500 after the door panel 510 is opened, in the embodiment of the present application, a second cover shell 420 may be provided in the sealing cover 200, and a second sealed space B is enclosed between the second cover shell 420 and at least part of the wall surface of the sealing cover 200. The first driving component 320 is provided in the second sealed space B. In this way, the second sealed space B can be separated from the inner cavity of the sealing cover 200 by the second cover shell 420, thereby achieving the enclosure of the first driving component 320. The first driving component 320 is surrounded by the door panel 510 and is separated from the inner cavity of the sealing cover 200. Even if particles are generated during the operation of the first driving component 320, these particles will be bound in the second sealed space B, isolated from the internal space of the sealing cover 200 and unable to enter the inner cavity of the sealing cover 200. This can effectively prevent particles from entering the inner cavity of the wafer box 500 from the inner cavity of the sealing cover 200 after opening the door panel 510 and causing contamination to the wafers, thereby ensuring the cleanliness of the inner cavities of the wafer box 500 and the sealing cover 200.

[0055] To drive the sealed shell 410, the driving end of the first driving component 320 extends out of the second sealed space B and is connected to the sealed shell 410 to drive the sealed shell 410 to move in the second direction, thereby driving the door panel 510 to open or close through the sealed shell 410.

[0056] In order to ensure that the sealed housing 410 can move according to the preset trajectory and improve the movement accuracy of the sealed housing 410, the unlocking mechanism 300 may further include a first guide member 330 and a first sliding member 340, wherein the first sliding member 340 is slidably connected to the first guide member 330, and the first sliding member 340 is connected to the sealed housing 410. Based on this, under the driving action of the first driving component 320, the sealed housing 410 can be moved along the axis direction of the first guide member 330 by the first sliding member 340, so as to ensure the movement accuracy of the sealed housing 410 through the sliding cooperation between the first sliding member 340 and the first guide member 330, and prevent the sealed housing 410 from shaking randomly and affecting the normal opening or closing of the door panel 510.

[0057] For example, the first guide member 330 may be a linear bearing, a guide sleeve, etc., and the first sliding member 340 may be a sliding rod, a sliding column, etc. In the embodiment of the present application, the first guide member 330 may ensure the smooth sliding of the first sliding frame, and the first sliding member 340 may be restricted in a direction perpendicular to the sliding direction to ensure the stability and smoothness of the sliding.

[0058] In the embodiment of the present application, the first guide member 330 and the first sliding member 340 are respectively located in the sealing cover 200. Considering that particles may be generated when the first sliding member 340 slides along the first guide member 330. In order to prevent the particles from diffusing in the sealing cover 200 and causing the particles to continue to diffuse into the wafer box 500 after the door panel 510 is opened, in the embodiment of the present application, a third cover shell 430 may be provided in the sealing cover 200. The third cover shell 430 and at least part of the wall surface of the sealing cover 200 form a third sealed space C. The first guide member 330 and the first sliding member 340 are respectively arranged in the third sealed space C. In this way, the third sealed space C can be separated from the inner cavity of the sealing cover 200 by the third cover shell 430, thereby achieving the first guide member 330 and the first sliding member 340. The movable member 340 is surrounded by the first guide member 330 and the first sliding member 340 is respectively separated from the inner cavity of the sealing cover 200. Even if particles are generated during the sliding process of the first sliding member 340 along the first guide member 330, these particles will be bound in the third sealing space C and cannot enter the inner cavity of the sealing cover 200. This can effectively prevent particles from entering the inner cavity of the wafer box 500 from the inner cavity of the sealing cover 200 after opening the door panel 510 and contaminating the wafer, thereby ensuring the cleanliness of the inner cavities of the wafer box 500 and the sealing cover 200.

[0059] In order to guide the sealed housing 410, the first guide member 330 is completely disposed in the third sealed space C, and the first sliding member 340 is at least partially disposed in the third sealed space C, and one end of the first sliding member 340 extends out of the third sealed space C and is connected to the sealed housing 410. Based on this, under the driving action of the first driving component 320 and the limiting action of the first sliding member 340 and the first guide member 330, the stability and smoothness of the movement of the sealed housing 410 can be guaranteed, and the movement accuracy can be guaranteed.

[0060] In order to allow the first sliding member 340 to extend out of the third sealed space C, the side wall of the third cover shell 430 may be provided with a second avoidance hole, and one end of the first sliding member 340 may pass through the second avoidance hole and be connected to the sealed shell 410 .

[0061] To ensure sealing, a sealing member, such as a sealing ring, a sealing ring, etc., can be provided at the second avoidance hole to achieve sealing between the first sliding member 340 and the second avoidance hole to prevent particles generated during the operation of the first sliding member 340 from diffusing through the second avoidance hole.

[0062] In order to realize the transmission of the wafer, the window of the mounting main board 100 needs to be opened to facilitate the transfer of the wafer. The loading and unloading chamber may also include a transverse movement mechanism 600 connected to the mounting main board 100. The transverse movement end of the transverse movement mechanism 600 is connected to the sealing cover 200 to drive the sealing cover 200 to move in the first direction. Based on this, under the driving action of the transverse movement mechanism 600, the sealing cover 200 can move to a position opposite to the window to seal the window, and can also move to a position misaligned with the window to open the window.

[0063] Taking into account that the transverse movement mechanism 600 may generate particles during operation, in order to prevent the particles from diffusing in the sealing cover 200 and causing the particles to continue to diffuse into the wafer box 500 after the door panel 510 is opened, in an embodiment of the present application, the transverse movement mechanism 600 is arranged outside the sealing cover 200, specifically, on the side of the main board 100 that is away from the sealing cover 200. In this way, the particles generated by the transverse movement mechanism 600 will not diffuse in the sealing cover 200, thereby alleviating the problem of particles diffusing from the sealing cover 200 to the wafer box 500.

[0064] The above-mentioned arrangement enables the transverse movement mechanism 600 to be located outside the chamber, that is, in the external atmospheric environment. In order to prevent the external atmospheric environment from adversely affecting the operation of the transverse movement mechanism 600, a fourth cover shell 440 is provided on the side of the mounting mainboard 100 away from the sealing cover 200. The fourth cover shell 440 and the mounting mainboard 100 form a fourth sealed space D. The transverse movement mechanism 600 is located in the fourth sealed space D. In this way, the fourth cover shell 440 can separate the transverse movement mechanism 600 from the external atmospheric environment, thereby achieving the encirclement of the transverse movement mechanism 600, so as to protect the transverse movement mechanism 600 and ensure that the transverse movement mechanism 600 is not affected by the external environment. In addition, it can also prevent the particles generated during the operation of the transverse movement mechanism 600 from spreading randomly in the external atmospheric environment.

[0065] In addition, the transverse end of the transverse mechanism 600 passes through the mounting main board 100 and is connected to the sealing cover 200 so as to drive the sealing cover 200 to move in the first direction through the transverse end.

[0066] In some embodiments, the transverse movement mechanism 600 may include a second driving component 610 and a transverse member 620 as a transverse movement end, wherein one end of the transverse member 620 is connected to the driving end of the second driving component 610, and the other end of the transverse member 620 is connected to the sealing cover 200. In this way, under the driving action of the second driving component 610, the transverse member 620 can drive the sealing cover 200 to move in the first direction, so as to align the sealing cover 200 with the window on which the main board 100 is installed to achieve shielding of the window, or to misalign the sealing cover 200 with the window to achieve opening of the window.

[0067] Considering that the transverse movement mechanism 600 and the sealing cover 200 are respectively located on opposite sides of the mounting main board 100, in order to prevent the mounting main board 100 from hindering the movement of the transverse movement member 620, the mounting main board 100 may be provided with a guide hole 110 extending along the first direction, and the transverse movement member 620 is movably arranged in the guide hole 110. Based on this, under the driving action of the second driving component 610, the transverse movement member 620 can move along the guide hole 110 in the first direction, thereby driving the sealing cover 200 to move in the first direction through the transverse movement member 620, so as to adjust the position of the sealing cover 200, thereby realizing the opening or covering of the window of the mounting main board 100.

[0068] It should be noted that when the interface device is installed in the chamber of the semiconductor process equipment, the sealing cover 200 is located in the chamber, and the traverse mechanism 600 is located outside the chamber, that is, in the fourth sealed space D. However, the fourth sealed space D is connected to the inner cavity of the chamber through the guide hole 110, so that particles generated during the operation of the traverse mechanism 600 may enter the chamber through the guide hole 110, thereby causing particle contamination inside the chamber.

[0069] Based on the above situation, a flexible seal can be provided at the guide hole 110, and the flexible seal can seal the guide hole 110, and when the traverse member 620 moves in the guide hole 110, the flexible seal will be squeezed by the traverse member 620 and deform flexibly, so as not to affect the movement of the traverse member 620 along the guide hole 110. Based on this, by providing the flexible seal, the guide hole 110 can be sealed to prevent particles generated by the operation of the traverse mechanism 600 from entering the chamber through the guide hole 110, and the traverse member 620 can be moved freely to achieve the position switching of the sealing cover 200.

[0070] Exemplarily, the flexible sealing member may include two elongated portions extending along the first direction, one of which is connected to one side of the guide hole 110 in the width direction, and the other is connected to the other side of the guide hole 110 in the width direction, and the two elongated portions are closely connected to each other's edges, and the transverse member 620 is located between the two elongated portions. Based on this, when the transverse member 620 moves to any position, the edges of the two elongated portions are surrounded by the transverse member 620, thereby achieving the sealing of the guide hole 110, and as the transverse member 620 moves, the two elongated portions located in front of the transverse member 620 are squeezed and continuously separated, and the two elongated portions located behind the transverse member 620 are not squeezed by the transverse member 620 and are continuously connected, therefore, both the free movement of the transverse member 620 and the sealing of the guide hole 110 can be guaranteed.

[0071] In some embodiments, the second driving component 610 may include a first linear module 611 and a second sliding member 612, wherein the first linear module 611 is provided on the mounting main board 100, the second sliding member 612 is connected to the first linear module 611, and the transverse member 620 is connected to the second sliding member 612; in addition, a second guide member 120 extending along the first direction is further provided on the side of the mounting main board 100 away from the sealing cover 200, and the second sliding member 612 is slidably connected to the second guide member 120. With this arrangement, the second sliding member 612 can be driven to move along the second guide member 120 by the first linear module 611, and the transverse member 620 can be driven to move in the first direction by the second sliding member 612, so as to realize the switching of the position of the sealing cover 200.

[0072] For example, the first linear module 611 can be in the form of a cylinder, a hydraulic cylinder, an electric cylinder, etc.; the second guide member 120 can be a guide rail, and the second sliding member 612 can be a slider. In addition, the first linear module 611 and the second guide member 120 can be respectively assembled on the mounting main board 100 using threaded fasteners to facilitate assembly and disassembly. The traverse member 620 can be connected to the second sliding member 612 by threading.

[0073] In order to achieve the sealing and unsealing of the sealing cover 200 relative to the mounting mainboard 100, the sealing cover 200 can be close to the mounting mainboard 100 or away from the mounting mainboard 100 in the second direction. Based on this, the second driving component 610 in the embodiment of the present application can also include a second linear module 613, which is arranged on the second sliding member 612 and connected to the transverse member 620, and is used to drive the transverse member 620 to move in the second direction. Through this arrangement, under the driving action of the second linear module 613, the transverse member 620 can drive the sealing cover 200 to move in the second direction, so that the sealing cover 200 can be pressed against the side of the mounting mainboard 100 and achieve sealing, or the sealing cover 200 can be separated from the side of the mounting mainboard 100 to release the seal; and the second linear module 613 can also move in the first direction with the second sliding member 612.

[0074] For example, the first linear module 611 may be in the form of a cylinder, a hydraulic cylinder, an electric cylinder, etc. In addition, the second linear module 613 may be connected to the traverse member 620 by threaded connection.

[0075] In some embodiments, the sealing cover 200 may include a frame 210 and a cover plate 220, wherein one side of the frame 210 faces the mounting mainboard 100, and the cover plate 220 is disposed on the side of the frame 210 away from the mounting mainboard 100, so that the side of the frame 210 away from the mounting mainboard 100 can be shielded by the cover plate 220, so as to form an inner cavity of the sealing cover 200, thereby providing a holding space for the sealing shell 410, the second cover shell 420, the third cover shell 430, etc. In addition, the side of the frame 210 facing the mounting mainboard 100 can move toward the mounting mainboard 100 and fit tightly with the side of the mounting mainboard 100 to achieve sealing. Of course, the frame 210 can also move away from the mounting mainboard 100 to release the seal, thereby facilitating the sealing cover 200 to move to a position misaligned with the window, so that the window is opened to achieve the transmission of the wafer.

[0076] For example, the frame 210 may be a square frame, a circular frame, or the like, and its shape is not limited. In addition, the cover plate 220 may be fixedly connected or detachably connected to the frame 210, for example, by welding, bonding, riveting, fastener connection, clamping, plugging, etc., and the specific connection method is not limited.

[0077] In order to form the second sealed space B, the second housing 420 may include a first enclosure 421 and a first bottom plate 422, wherein the two ends of the first enclosure 421 in the first direction are respectively connected to the inner walls of the frame 210 on both sides in the first direction, one end of the first enclosure 421 in the second direction extends to be connected to the cover plate 220, and the other end is connected to the first bottom plate 422; at least part of the edge of the first bottom plate 422 is connected to the frame 210. Based on this, the second sealed space B can be enclosed by multiple inner walls of the frame 210, the cover plate 220, the first enclosure 421 and the first bottom plate 422, so as to enclose the first driving component 320 in the second sealed space B, thereby effectively preventing particles generated during the operation of the first driving component 320 from entering the inner cavity of the sealing cover 200, thereby alleviating the problem of particles entering the wafer box 500 from the sealing cover 200 after the door plate 510 of the wafer box 500 is opened.

[0078] In order to form the third sealed space C, the third housing 430 may include a second enclosure 431 and a second bottom plate 432, wherein the two ends of the second enclosure 431 in the first direction are respectively connected to the inner walls of the frame 210 on both sides in the first direction, one end of the second enclosure 431 in the second direction extends to be connected to the cover plate 220, and the other end is connected to the second bottom plate 432; at least part of the edge of the second bottom plate 432 is connected to the frame 210. Based on this, the third sealed space C can be enclosed by multiple inner walls of the frame 210, the cover plate 220, the second enclosure 431 and the second bottom plate 432, so as to enclose at least part of the first guide member 330 and the first sliding member 340 in the third sealed space C, thereby effectively preventing particles generated during the sliding process of the first sliding member 340 relative to the first guide member 330 from entering the inner cavity of the sealing cover 200, thereby alleviating the problem of particles entering the wafer box 500 from the sealing cover 200 after the door plate 510 of the wafer box 500 is opened.

[0079] In some embodiments, the second sealed space B and the third sealed space C are independent of each other to respectively seal the first driving component 320 and the first sliding member 340 and the first guiding member 330 that cooperate with each other.

[0080] refer to Fig. 9 and Fig.10 In other embodiments, the second sealed space B and the third sealed space C may also be interconnected so as to simultaneously seal the first driving component 320 and the first sliding member 340 and the first guide member 330 that cooperate with each other.

[0081] Specifically, the sealing cover 200 may be provided with a third enclosure 451 and a third bottom plate 452, wherein the third enclosure 451 surrounds the periphery of the sealing housing 410 and is spaced apart from each corresponding inner wall of the frame 210, and one end of the third enclosure 451 in the second direction is connected to the cover plate 220, and the other end is connected to the third bottom plate 452, and at least part of the edge of the third bottom plate 452 is connected to the inner wall of the frame 210. Based on this, the inner wall of the frame 210, the cover plate 220, the third enclosure 451 and the third bottom plate 452 can be used together to enclose a fifth sealed space E, and the fifth sealed space E is located at the periphery of the first sealed space A.

[0082] In addition, the unlocking mechanism 300 includes a first driving component 320, a first guide component 330 and a first sliding component 340, wherein the first driving component 320 is arranged in the fifth sealed space E, and the driving end of the first driving component 320 extends out of the fifth sealed space E and is connected to the sealed shell 410, and is used to drive the sealed shell 410 to move in the second direction, the first guide component 330 is arranged in the fifth sealed space E, the first sliding component 340 is slidably connected to the first guide component 330, and the first sliding component 340 extends out of the fifth sealed space E and is connected to the sealed shell 410.

[0083] Based on the above configuration, the embodiment of the present application can enclose at least part of the first driving component 320, the first guide member 330 and the first sliding member 340 together in the fifth sealed space E, thereby effectively preventing particles generated during the operation of the first driving component 320 and the sliding of the first sliding member 340 relative to the first guide member 330 from entering the inner cavity of the sealing cover 200, thereby alleviating the problem of particles entering the wafer box 500 from the sealing cover 200 after the door panel 510 of the wafer box 500 is opened.

[0084] Exemplarily, the third enclosing plate 451 may be completely surrounded by the periphery of the sealed housing 410. Of course, the third enclosing plate 451 may also be surrounded by a portion of the periphery of the sealed housing 410. For example, when the sealed housing 410 is a rectangular housing, the third enclosing plate 451 may be rectangular. In this case, the third enclosing plate 451 is completely surrounded by the periphery of the sealed housing 410. In this case, the third enclosing plate 451 and the inner wall of the frame 210 form a ring-shaped fifth sealed space E. In addition, the third enclosing plate 451 may also be concave. In this case, the third enclosing plate 451 may be surrounded by the periphery of three sides of the sealed housing 410, and the two ends of the third enclosing plate 451 in the length direction are respectively connected to the inner wall of the frame 210. In this case, the third enclosing plate 451 and the inner wall of the frame 210 form a concave fifth sealed space E. Of course, other forms are also possible, which are not specifically limited here.

[0085] In the embodiment of the present application, due to the limited space inside the loading and unloading chamber and the strict requirements on the safety distance of moving parts for the window of the interface device as the transmission channel of the wafer, the thickness of the interface device is limited to a certain range. In order to leave space for the sealing structure added to improve the sealing of the interface device, the power and transmission structure of the interface device are specifically laid out and designed to ensure the normal realization of the original function of the interface device while improving the sealing.

[0086] Specifically, since the sealing structure occupies the space of the driving part and the transmission part for opening and closing the wafer door plate 510, it is necessary to rearrange the driving part and the transmission part, for example, the first driving component 320 and the matching first guide 330 and the first sliding member 340 are respectively arranged in the upper and lower side areas of the sealing shell 410. The first driving component 320 and the matching first guide 330 and the first sliding member 340 occupy the space of the original transverse moving part, so the transverse moving mechanism 600 is arranged outside the interface device to ensure that the overall size of the interface device does not exceed the safety range, and the original function of the interface device can also be retained.

[0087] Based on the above configuration, an embodiment of the present application further discloses a semiconductor process equipment, which includes a process chamber and the above loading and unloading chamber, wherein the loading and unloading chamber is used to transfer wafers between the process chamber and the wafer box.

[0088] Among them, the loading and unloading chamber is the micro-environment chamber 700 of the semiconductor process equipment, which is used to perform process processing on the wafer. The transfer platform is used to carry and transfer the wafer box 500 so that the wafer box 500 can be close to or away from the loading and unloading chamber; the interface device of the loading and unloading chamber can keep the wafer and the micro-environment chamber 700 sealed from the external environment, so that the wafer and the wafer inside can be isolated from the external atmospheric environment, and the wafer inside the wafer box 500 can be processed by subsequent equipment in the micro-environment chamber 700.

[0089] In the initial state, the transfer stage carries the wafer box 500 to the docking position, so that the wafer box 500 is tightly attached to the mounting mainboard 100, and the sealing cover 200 is in tight contact with the mounting mainboard 100 to ensure the sealing of the wafer loading area in the micro-environment chamber 700.

[0090] When opening the door, the sealing shell 410 and the unlocking component 310 move toward the wafer loading area, and the door panel 510 of the wafer box 500 moves toward the wafer loading area along with the panel 411 through the unlocking mechanism 300 to open the wafer box 500; then, the sealing cover 200 is driven away from the mounting main board 100 by the second driving component 610 to release the seal, for example, the second driving component 610 drives the sealing cover 200 to move to a position 5 mm away from the mounting main board; finally, the sealing cover 200 is driven to move horizontally by the first driving component 320 to open the window.

[0091] It should be noted here that the specific structure and working principle of the semiconductor process equipment can be referred to the relevant technology and will not be elaborated here.

[0092] To summarize, the embodiments of the present application surround and seal each moving part so that the particles generated by each moving part are sealed in the corresponding sealed space, thereby preventing the particles from diffusing into the sealing cover 200 of the loading and unloading chamber, and further preventing the particles from entering the wafer box 500 from the sealing cover 200 when the door panel 510 of the wafer box 500 is opened, thereby ensuring the cleanliness of the particles in the wafer box 500 and thus ensuring the quality of the wafer surface.

[0093] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A loading and unloading chamber of a semiconductor process equipment, used for transferring wafers between a wafer box (500) and a process chamber of the semiconductor process equipment, characterized in that: The loading and unloading chamber comprises: a mounting main board (100), a sealing cover (200) and an unlocking mechanism (300); The sealing cover (200) is movably arranged on one side of the mounting main board (100) in a first direction, a sealing shell (410) is arranged inside the sealing cover (200), and the sealing shell (410) is movable relative to the sealing cover (200) in a second direction; The unlocking mechanism (300) comprises an unlocking component (310), the unlocking component (310) is arranged in the sealed housing (410), and an unlocking end of the unlocking component (310) extends out of the sealed housing (410) and is used to cooperate with the door panel (510) of the wafer box (500); Wherein, the first direction is parallel to the mounting mainboard (100), and the second direction is perpendicular to the mounting mainboard (100).

2. The loading and unloading chamber according to claim 1, characterized in that: The sealed housing (410) comprises a panel (411) and a first cover shell (412); The first cover shell (412) is disposed on a side of the panel (411) away from the mounting main board (100), and a first sealed space (A) is enclosed between the first cover shell (412) and the panel (411); The unlocking component (310) is located in the first sealed space (A) and is fixed to the panel (411), and an unlocking end of the unlocking component (310) passes through the panel (411).

3. The loading and unloading chamber according to claim 1, characterized in that: A second cover shell (420) is provided inside the sealing cover (200), and a second sealed space (B) is enclosed between the second cover shell (420) and at least a portion of the wall surface of the sealing cover (200); The unlocking mechanism (300) further comprises a first driving component (320), wherein the first driving component (320) is arranged in the second sealed space (B), and a driving end of the first driving component (320) extends out of the second sealed space (B) and is connected to the sealed housing (410), so as to drive the sealed housing (410) to move in the second direction.

4. The loading and unloading chamber according to claim 1, characterized in that: A third cover shell (430) is provided in the sealing cover (200), and a third sealed space (C) is enclosed between the third cover shell (430) and at least a portion of the wall surface of the sealing cover (200); The unlocking mechanism (300) further comprises a first guide member (330) and a first sliding member (340) respectively arranged in the third sealed space (C), wherein the first sliding member (340) is slidably connected to the first guide member (330), and one end of the first sliding member (340) extends out of the third sealed space (C) and is connected to the sealed housing (410).

5. The loading and unloading chamber according to claim 1, characterized in that: A fourth cover shell (440) is provided on the side of the mounting main board (100) facing away from the sealing cover (200), and a fourth sealed space (D) is enclosed between the fourth cover shell (440) and the mounting main board (100); The loading and unloading chamber also includes a transverse movement mechanism (600), which is located in the fourth sealed space (D) and connected to the mounting main board (100), and a transverse movement end of the transverse movement mechanism (600) passes through the mounting main board (100) and is connected to the sealing cover (200), so as to drive the sealing cover (200) to move in the first direction.

6. The loading and unloading chamber according to claim 5, characterized in that: The transverse movement mechanism (600) comprises a second driving component (610) and a transverse movement member (620) serving as the transverse movement end; The mounting main board (100) is provided with a guide hole (110) extending along the first direction, and the transverse member (620) is movably arranged in the guide hole (110), and one end of the transverse member (620) is connected to the driving end of the second driving member (610), and the other end of the transverse member (620) is connected to the sealing cover (200).

7. The loading and unloading chamber according to claim 6, characterized in that: The second driving component (610) comprises a first linear module (611) and a second sliding member (612); The first linear module (611) is arranged on the mounting main board (100), the second sliding member (612) is connected to the first linear module (611), and the transverse member (620) is connected to the second sliding member (612); A second guide member (120) extending along the first direction is provided on a side of the mounting main board (100) away from the sealing cover (200), and the second sliding member (612) is slidably connected to the second guide member (120).

8. The loading and unloading chamber according to claim 7, characterized in that: The second driving component (610) further comprises a second linear module (613), wherein the second linear module (613) is arranged on the second sliding member (612) and connected to the transverse member (620) for driving the transverse member (620) to move in the second direction.

9. The loading and unloading chamber according to claim 3, characterized in that: The sealing cover (200) comprises a frame (210) and a cover plate (220), one side of the frame (210) faces the mounting main board (100), and the cover plate (220) is arranged on a side of the frame (210) away from the mounting main board (100); The second cover shell (420) comprises a first enclosing plate (421) and a first bottom plate (422), the first enclosing plate (421) being spaced apart from the inner wall of the frame (210), the two ends of the first enclosing plate (421) in the first direction being respectively connected to the inner walls of the frame (210) on both sides in the first direction, one end of the first enclosing plate (421) in the second direction being connected to the cover plate (220), and the other end being connected to the first bottom plate (422), and at least a portion of the edge of the first bottom plate (422) being connected to the frame (210); The inner wall of the frame (210), the cover plate (220), the first enclosure plate (421) and the first bottom plate (422) together enclose the second sealed space (B).

10. The loading and unloading chamber according to claim 4, characterized in that: The sealing cover (200) comprises a frame (210) and a cover plate (220), one side of the frame (210) faces the mounting main board (100), and the cover plate (220) is arranged on a side of the frame (210) away from the mounting main board (100); The third cover shell (430) comprises a second enclosing plate (431) and a second bottom plate (432), the second enclosing plate (431) being spaced apart from the inner wall of the frame (210), the two ends of the second enclosing plate (431) in the first direction being respectively connected to the inner walls of the frame (210) on both sides in the first direction, one end of the second enclosing plate (431) in the second direction being connected to the cover plate (220), and the other end being connected to the second bottom plate (432), and at least part of the edge of the second bottom plate (432) being connected to the frame (210); The inner wall of the frame (210), the cover plate (220), the second enclosure plate (431) and the second bottom plate (432) together enclose the third sealed space (C).

11. The loading and unloading chamber according to claim 2, characterized in that: The sealing cover (200) comprises a frame (210) and a cover plate (220), one side of the frame (210) faces the mounting main board (100), and the cover plate (220) is arranged on a side of the frame (210) away from the mounting main board (100); A third enclosure (451) and a third bottom plate (452) are provided in the sealing cover (200); the third enclosure (451) surrounds the periphery of the sealing shell (410) and is spaced apart from each corresponding inner wall of the frame (210); one end of the third enclosure (451) in the second direction is connected to the cover plate (220), and the other end is connected to the third bottom plate (452); at least part of the edge of the third bottom plate (452) is connected to the inner wall of the frame (210); the inner wall of the frame (210), the cover plate (220), the third enclosure (451) and the third bottom plate (452) together enclose a fifth sealed space (E); and the fifth sealed space (E) is located at the periphery of the first sealed space (A); The unlocking mechanism (300) further includes a first driving component (320), a first guide component (330) and a first sliding component (340); the first driving component (320) is arranged in the fifth sealed space (E), and the driving end of the first driving component (320) extends out of the fifth sealed space (E) and is connected to the sealed shell (410) for driving the sealed shell (410) to move in the second direction; the first guide component (330) and the first sliding component (340) are respectively arranged in the fifth sealed space (E), the first sliding component (340) is slidably connected to the first guide component (330), and one end of the first sliding component (340) extends out of the fifth sealed space (E) and is connected to the sealed shell (410).

12. A semiconductor process equipment, characterized in that: It comprises a process chamber and a loading and unloading chamber as claimed in any one of claims 1 to 11, wherein the loading and unloading chamber is used to transfer wafers between the process chamber and the wafer box.

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