Semiconductor device assembling equipment and method

Abstract

The invention provides semiconductor device assembling equipment and method. The assembling equipment comprises a working plate, and a feeding mechanism, a first assembling mechanism, a second assembling mechanism and a welding mechanism are installed on the working plate; the feeding mechanism comprises a plurality of fixing columns installed on the working plate, a bearing plate is installed on the fixing columns, a tray is placed on the bearing plate, a fixing frame a is installed on the working plate, and a fixing shell is installed on the fixing frame a. A sliding plate is driven to move, so that a device body on an assembling groove moves to the position below an extrusion block, the extrusion block is driven to move downwards to press the device body and a T-shaped nail, a rotating disc is driven to rotate, a welding nozzle moves to the position below an avoiding hole and an avoiding groove, and a linear driving piece m drives the welding nozzle to make contact with the T-shaped nail and the bottom of an L-shaped shell; and compared with manual assembly, the T-shaped nail and L-shaped shell bottom contact welding assembly device is easy to operate, and the assembly efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device assembly, and in particular to a semiconductor device assembly device and method. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion, such as Fig.19 The figure shows a schematic diagram of the structure of a semiconductor device in the prior art, including an L-shaped shell 801, a device body 802 and a T-shaped nail 803. There are usually two ways to assemble the semiconductor device, the first is to assemble it by assembly equipment, and the second is to assemble it manually.

[0003] Chinese patent application No. 2023213551308 discloses an assembly device for semiconductor devices, including a base plate and a positioning plate, a fixed rod is installed on the upper end of the base plate, a rotating sleeve is sleeved on the outer surface of the fixed rod, and the rotating sleeve is rotatably connected to the base plate, a bevel gear 1 is installed on the outer surface of the rotating sleeve, the bevel gear 1 is meshed with the bevel gear 2, a motor 1 is installed at one end of the bevel gear 2, a trigger switch is installed at the rear end of the base plate, four rotary dampers are symmetrically installed on the outer surface of the rotating sleeve, a rotary rod is installed at one end of the rotary damper, a positioning plate is installed at one end of the rotary rod, three placement grooves are provided on the upper end of the positioning plate, and a gear is installed on the outer surface of the rotating rod.

[0004] But it is obvious that the above assembly equipment is not convenient for Fig.19 The semiconductor device shown is assembled. In addition, if it is assembled manually, the operation is troublesome and the assembly efficiency is greatly reduced. Therefore, we propose a semiconductor device assembly equipment and method. Summary of the invention

[0005] The purpose of the present invention is to address the shortcomings of the prior art and provide a semiconductor device assembly device, which drives the slide plate to move so that the device body on the assembly groove moves to the bottom of the extrusion block, drives the extrusion block to move downward and press on the device body and the T-shaped nail, drives the rotating disk to rotate, and moves the welding nozzle to the bottom of the avoidance hole and the avoidance groove. The linear drive member m drives the welding nozzle to contact the T-shaped nail and the bottom of the L-shaped shell, and the T-shaped nail and the bottom of the L-shaped shell are welded and assembled. Compared with manual assembly, the operation is simple and the assembly efficiency is improved.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor device assembly device comprises a working plate, on which a feeding mechanism, a first assembly mechanism, a second assembly mechanism and a welding mechanism are mounted;

[0008] The feeding mechanism includes a plurality of fixed columns installed on the working plate, a carrying plate is installed on the fixed columns, a pallet is placed on the carrying plate, a fixed frame a is installed on the working plate, a fixed shell is installed on the fixed frame a, two rotating wheels a are rotatably provided in the fixed shell, a belt a is sleeved on the outer sides of the two rotating wheels a, a guide rail is installed in the fixed shell, a moving frame is slidably provided on the guide rail, the moving frame is connected to the belt a, a guide rail is installed on the moving frame, a slider is slidably provided on the guide rail, a cross plate a is installed on the slider, a guide rail is installed on the cross plate a, a mobile frame is slidably provided on the guide rail, and a detection adsorption component is installed on the mobile frame.

[0009] The detection adsorption assembly includes: a rotating driving member a, which is installed on the fixed shell, and the rotating driving member a drives one of the rotating wheels a to rotate; a linear driving member a, which is installed on the moving frame, and the output end of the linear driving member a is connected to the slider; a rotating rod, which is rotatably arranged on the moving frame; a round table, which is installed on the rotating rod; a connecting rod a, which is installed on one end of the round table; and an arc-shaped adsorption block, which is installed on the connecting rod a.

[0010] A connecting rod b is installed at the other end of the truncated table, a detection end is installed on the connecting rod b, a gear a is installed on the connecting rod b, a connecting plate is installed on the slider, a linear drive member b is installed on the connecting plate, and a rack plate is installed at the output end of the linear drive member b; a rotating sleeve is installed on the rotating rod, a mounting groove is provided in the rotating sleeve, an elastic connecting member is provided in the mounting groove, a positioning ball is provided on the elastic connecting member, and a placement groove and two positioning holes are provided in the movable frame.

[0011] The first assembly mechanism includes: a fixed frame b, which is installed on the working plate; a rotating wheel b, which is rotatably arranged at both ends of the fixed frame b; a transmission belt, which is sleeved on the outer sides of the two rotating wheels b; a connecting seat, which is installed on the working plate; a vertical plate, which is installed on the connecting seat; a rotating driving member b, which is installed on the vertical plate; an eccentric disk, which is installed on the output end of the rotating driving member b, and a accommodating cavity is provided in the eccentric disk; a placing plate a, which is installed on the vertical plate, and a groove and a limiting groove are provided on the placing plate a; a linear driving member c, which is installed on the placing plate a; a pushing plate, which is installed on the output end of the linear driving member c; a conveying assembly, which is installed on the working plate.

[0012] The transport assembly includes a support frame arranged on the working plate, a mounting frame is installed on the support frame, a guide rail is installed on the mounting frame, a lifting frame is slidably provided on the guide rail, a guide rail is installed on the lifting frame, a moving plate is slidably provided on the guide rail, a clamping cylinder is installed on the moving plate, a linear drive component e is installed on the support frame, an output end of the linear drive component e is connected to the lifting frame, a linear drive component d is installed on the lifting frame, and an output end of the linear drive component d is connected to the moving plate.

[0013] The second assembly mechanism includes a placement plate b and a flat plate installed on the working plate, the placement plate b is installed with a vibrating loading plate, the flat plate is installed with a circular block and a linear driving member u, a movable plate is installed at the output end of the linear driving member u, the movable plate slides in the circular block, a circular groove and a square groove are provided in the movable plate, a discharge pipe is installed at the bottom of the flat plate, an oblique groove is provided in the circular block, a square block is slidably provided in the square groove, a sliding rod sliding in the oblique groove is installed on the square block, and a U-shaped groove is provided at one end of the square; an assembly component is installed on the working plate.

[0014] The assembly component includes a transverse plate b installed on the working plate, a guide rail is installed on the transverse plate b, a slide plate is slidably provided on the guide rail, a linear drive component t is installed on the transverse plate b, the output end of the linear drive component t is connected to the slide plate, an L-shaped block is installed on the slide plate, a push groove and a material transport groove are provided in the L-shaped block, a feed pipe is installed on the L-shaped block, a linear drive component q and a linear drive component w are installed on the slide plate, a push plate a is installed on the output end of the linear drive component q, and a push plate b is installed on the output end of the linear drive component w.

[0015] The welding mechanism comprises a fixed frame mounted on the working plate, a rotary drive member t is mounted on the fixed frame, a rotary disk is mounted on the output end of the rotary drive member t, a linear drive member m is mounted on the rotary disk, and a welding nozzle is mounted on the output end of the linear drive member m.

[0016] A motion driving member is installed on the rotating disk, and a grinding stone is installed on the output end of the motion driving member. A linear driving member n is installed on the rotating disk, and a sponge block is installed on the output end of the linear driving member n.

[0017] An L-shaped plate is installed on the working plate, a linear driving member f is installed on the L-shaped plate, and an injection pipe is installed on the output end of the linear driving member f.

[0018] The beneficial effects of the present invention are:

[0019] (1) The present invention drives the slide plate to move so that the device body on the assembly groove moves to the bottom of the extrusion block, drives the extrusion block to move downward and press on the device body and the T-shaped nail, drives the rotating disk to rotate, and moves the welding nozzle to the bottom of the avoidance hole and the avoidance groove. The linear driving member m drives the welding nozzle to contact the T-shaped nail and the bottom of the L-shaped shell, and the T-shaped nail and the bottom of the L-shaped shell are welded and assembled. Compared with manual assembly, the operation is simple and the assembly efficiency is improved.

[0020] (2) The present invention drives the rotating wheel b to rotate, and transmits the device body to the accommodating cavity through the transmission belt. The rotating driving member drives the eccentric disk to rotate 90 degrees, so that the device body in the accommodating cavity corresponds to the position of the limiting groove; the linear driving member c drives the pushing plate to push the device body in the accommodating cavity into the limiting groove to adjust the position of the device body.

[0021] (3) The present invention drives the rotating disk to rotate so that the grinding stone moves to the bottom of the avoidance hole and the avoidance groove, drives the grinding stone to move upward to contact the bottom of the T-shaped nail and the L-shaped shell, drives the grinding stone to rotate to grind the bottom of the T-shaped nail and the L-shaped shell to increase the roughness of the bottom of the T-shaped nail and the L-shaped shell; drives the rotating disk to rotate so that the sponge block moves to the bottom of the avoidance hole and the avoidance groove, drives the sponge block to move upward to contact the bottom of the T-shaped nail and the L-shaped shell, and applies the transmittance enhancer to the bottom of the T-shaped nail and the L-shaped shell.

[0022] (4) The present invention drives the rotating disk to rotate, so that the sponge block moves to the bottom of the injection tube, and the linear drive member f drives the injection tube to move downward to contact the sponge block, thereby adding the permeability enhancer into the sponge block. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the structure of the fixing frame a and the fixing shell of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the rotating wheel a and the belt a of the present invention;

[0026] Figure 4 It is a schematic diagram of the structure of the first assembly mechanism of the present invention;

[0027] Figure 5 It is a schematic diagram of the structure of the rotating wheel b and the transmission belt of the present invention;

[0028] Figure 6 This is a schematic diagram of the structure of the rotary drive member b and the eccentric disk of the present invention;

[0029] Figure 7 For the present invention Figure 2 The enlarged schematic diagram at A in the middle;

[0030] Figure 8For the present invention Figure 2 The enlarged schematic diagram of point B in the middle;

[0031] Fig. 9 This is a schematic diagram of the placement groove and positioning hole structure of the present invention;

[0032] Fig.10 This is a schematic diagram of the structure of the handling assembly of the present invention;

[0033] Fig.11 This is a schematic diagram of the structure of the loading tray of the present invention;

[0034] Fig.12 This is a schematic diagram of the flat plate and circular block structure of the present invention;

[0035] Fig.13 It is a cross-sectional schematic diagram of a flat plate and a circular block of the present invention;

[0036] Fig.14 This is a schematic diagram of the circular groove and U-shaped groove structure of the present invention;

[0037] Fig.15 This is a schematic diagram of the first angle structure of the welding mechanism of the present invention;

[0038] Fig.16 It is a schematic diagram of the second angle structure of the welding mechanism of the present invention;

[0039] Fig.17 It is a schematic diagram of the assembly structure of the present invention;

[0040] Fig.18 This is a schematic diagram of the structure of the slide plate and the L-shaped block of the present invention;

[0041] Fig.19 It is a schematic diagram of the structure of a semiconductor device in the prior art.

[0042] The accompanying drawings of the present application are as follows: 1. working plate; 2. feeding mechanism; 201. fixed column; 202. bearing plate; 203. fixed frame a; 204. fixed shell; 205. rotating wheel a; 206. belt a; 207. moving frame; 208. slider; 209. horizontal plate a; 210. moving frame; 2101. placement groove; 2102. positioning hole; 22. detection adsorption component; 221. rotating drive member a; 222. linear drive member a; 223. rotating rod; 224. round table; 225. connecting rod a; 226. arc adsorption block; 227. connecting rod b; 228. detection end; 229. gear a; 23 0, connecting plate; 231, linear drive member b; 232, rack plate; 233, rotating sleeve; 2331, mounting groove; 234, elastic connecting member; 235, positioning ball; 3, first assembly mechanism; 300, support frame; 301, fixed frame b; 302, rotating wheel b; 303, transmission belt; 304, connecting seat; 305, vertical plate; 306, rotating drive member b; 307, eccentric disk; 3071, accommodating chamber; 308, placing plate a; 3081, groove; 3082, limiting groove; 309, linear drive member c; 31, handling assembly; 310, pushing plate; 311, mounting frame; 312, lifting frame; 3 13. Moving plate; 314. Clamping cylinder; 315. Linear drive e; 316. Linear drive d; 4. Second assembly mechanism; 401. Placement plate b; 402. Loading tray; 403. Flat plate; 4031. Discharge tube; 404. Round block; 4041. Inclined groove; 405. Linear drive u; 406. Moving plate; 4061. Round groove; 4062. Square groove; 407. Square block; 4071. Sliding rod; 4072. U-shaped groove; 408. Linear drive g; 409. Extrusion block; 41. Assembly component; 411. Horizontal plate b; 412. Slide plate; 413. Linear drive t; 414. L-shaped block ;4141, push trough;4142, material transport trough;4143, assembly trough;415, feed pipe;416, linear drive member q;417, linear drive member w;418, push plate a;419, push plate b;5, welding mechanism;501, fixed frame;502, rotating drive member t;503, rotating disk;504, linear drive member m;505, welding nozzle;506, motion drive member;507, grinding stone;508, linear drive member n;509, sponge block;510, L-shaped plate;511, linear drive member f;512, injection pipe;801, L-shaped shell;802, device body;803, T-shaped nail. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0046] Embodiment 1: Figure 1-Figure 18 As shown, this embodiment provides a semiconductor device assembly device, including a working plate 1, on which a feeding mechanism 2, a first assembly mechanism 3, a second assembly mechanism 4 and a welding mechanism 5 are installed;

[0047] like Figure 2-Figure 9 As shown, the feeding mechanism 2 includes a plurality of fixed columns 201 installed on the working plate 1, a carrying plate 202 is installed on the fixed columns 201, a tray is placed on the carrying plate 202, a fixed frame a203 is installed on the working plate 1, a fixed shell 204 is installed on the fixed frame a203, two rotating wheels a205 are rotatably provided in the fixed shell 204, a belt a206 is sleeved on the outer side of the two rotating wheels a205, a guide rail is installed in the fixed shell 204, a moving frame 207 is slidably provided on the guide rail, the moving frame 207 is connected to the belt a206, a guide rail is installed on the moving frame 207, a slider 208 is slidably provided on the guide rail, a cross plate a209 is installed on the slider 208, a guide rail is installed on the cross plate a209, a movable frame 210 is slidably provided on the guide rail, a detection adsorption component 22 is installed on the movable frame 210, it should be noted that: a number of device bodies 802 are placed on the tray.

[0048] like Figure 2-Figure 9As shown, the detection adsorption component 22 includes: a rotating driving member a221, which is installed on the fixed shell 204, and the rotating driving member a221 drives one of the rotating wheels a205 to rotate; a linear driving member a222, which is installed on the moving frame 207, and the output end of the linear driving member a222 is connected to the slider 208; a rotating rod 223, which is rotatably arranged on the moving frame 210; a round table 224, which is installed on the rotating rod 223; a connecting rod a225, which is installed on one end of the round table 224; an arc-shaped adsorption block 226, which is installed on the connecting rod a225. It should be noted that the arc-shaped adsorption block 226 uses the negative pressure adsorption device body 802 as a conventional technical means in the field, which will not be elaborated here.

[0049] A connecting rod b227 is installed at the other end of the truncated table 224, a detection end 228 is installed on the connecting rod b227, a gear a229 is installed on the connecting rod b227, a connecting plate 230 is installed on the slider 208, a linear driving component b231 is installed on the connecting plate 230, and a rack plate 232 is installed at the output end of the linear driving component b231; a rotating sleeve 233 is installed on the rotating rod 223, a mounting groove 2331 is provided in the rotating sleeve 233, an elastic connecting component 234 is provided in the mounting groove 2331, a positioning ball 235 is provided on the elastic connecting component 234, and a placement groove 2101 and two positioning holes 2102 are provided in the movable frame 210.

[0050] In this embodiment, in the initial state, the detection end 228 faces downward, the movable frame 210 slides on the horizontal plate a209, the linear driving component a222 drives the detection end 228 to move downward, the rotating driving component a221 drives the rotating wheel a205 to rotate, and the detection end 228 is driven to move through the belt a206 (the detection end 228 can be driven to move freely in the XYZ directions). The detection end 228 is driven to contact the terminal of the device body 802 on the tray to detect the device body 802. If it is qualified, it enters the loading process.

[0051] like Figure 4-Figure 10As shown, the first assembly mechanism 3 includes: a fixed frame b301, the fixed frame b301 is installed on the working plate 1; a rotating wheel b302, the rotating wheel b302 is rotatably arranged at both ends of the fixed frame b301; a transmission belt 303, the transmission belt 303 is sleeved on the outside of the two rotating wheels b302; a connecting seat 304, the connecting seat 304 is installed on the working plate 1; a vertical plate 305, the vertical plate 305 is installed on the connecting seat 304; a rotating driving member b306, the rotating driving member b306 is installed on the vertical plate 305; an eccentric disk 307 The eccentric disk 307 is installed at the output end of the rotating driving member b306, and a accommodating cavity 3071 is provided in the eccentric disk 307; the placing plate a308, the placing plate a308 is installed on the vertical plate 305, and a groove 3081 and a limiting groove 3082 are provided on the placing plate a308; the linear driving member c309, the linear driving member c309 is installed on the placing plate a308; the pushing plate 310, the pushing plate 310 is installed at the output end of the linear driving member c309; the conveying assembly 31, the conveying assembly 31 is installed on the working plate 1.

[0052] In this embodiment, the linear drive member b231 drives the rack plate 232 to move downward, the movable frame 210 slides on the horizontal plate a209, the driving gear a229 engages with the rack plate 232, drives the rotating rod 223 to rotate 180 degrees, and drives the arc-shaped adsorption block 226 to rotate downward;

[0053] The arc-shaped adsorption block 226 is driven to contact with the qualified device body 802 on the tray, and the arc-shaped adsorption block 226 adsorbs the device body 802 by negative pressure, and transports the device body 802 to the transmission belt 303 .

[0054] like Figure 4-Figure 10 As shown, the transport assembly 31 includes a support frame 300 arranged on the working plate 1, a mounting frame 311 is installed on the support frame 300, a guide rail is installed on the mounting frame 311, a lifting frame 312 is slidably provided on the guide rail, a guide rail is installed on the lifting frame 312, a moving plate 313 is slidably provided on the guide rail, a clamping cylinder 314 is installed on the moving plate 313, a linear drive component e315 is installed on the support frame 300, and the output end of the linear drive component e315 is connected to the lifting frame 312, a linear drive component d316 is installed on the lifting frame 312, and the output end of the linear drive component d316 is connected to the moving plate 313. It should be noted that: the clamping cylinder 314 is provided with two clamping blocks for clamping the device body 802.

[0055] In this embodiment, the rotating wheel b302 is driven to rotate, and the device body 802 is transmitted to the accommodating cavity 3071 through the transmission belt 303. The rotating driving member b306 drives the eccentric disk 307 to rotate 90 degrees, so that the device body 802 in the accommodating cavity 3071 corresponds to the position of the limiting groove 3082;

[0056] The linear drive member c309 drives the push plate 310 to push the device body 802 in the accommodating cavity 3071 into the limiting groove 3082 to adjust the position of the device body 802; it should be noted that: the device body 802 in the accommodating cavity 3071 is in a horizontal state, and the device body 802 in the limiting groove 3082 is in a vertical state.

[0057] like Figure 11-Figure 14 As shown, the second assembly mechanism 4 includes a placement plate b401 and a flat plate 403 installed on the working plate 1, the placement plate b401 is installed with a vibrating loading tray 402, the flat plate 403 is installed with a circular block 404 and a linear drive member u405, and a moving plate 406 is installed at the output end of the linear drive member u405, the moving plate 406 slides in the circular block 404, and a circular groove 4061 and a square groove 4062 are opened in the moving plate 406, and the flat plate 403 A discharge pipe 4031 is installed at the bottom, an inclined groove 4041 is opened in the circular block 404, a square block 407 is slidably installed in the square groove 4062, a sliding rod 4071 sliding in the inclined groove 4041 is installed on the square block 407, and a U-shaped groove 4072 is opened at one end of the block 407; an assembly component 41 is installed on the working plate 1, a linear drive component g408 is installed on the flat plate 403, and an extrusion block 409 is installed on the output end of the linear drive component g408.

[0058] like Figure 11-Figure 14 As shown, the assembly component 41 includes a transverse plate b411 installed on the working plate 1, a guide rail is installed on the transverse plate b411, a slide plate 412 is slidably provided on the guide rail, a linear drive member t413 is installed on the transverse plate b411, the output end of the linear drive member t413 is connected to the slide plate 412, an L-shaped block 414 is installed on the slide plate 412, a material pushing groove 4141, a material transport groove 4142 and an assembly groove 4143 are provided in the L-shaped block 414, a material feeding pipe 415 is installed on the L-shaped block 414, and a linear drive member q4 is installed on the slide plate 412. 16 and linear drive member w417, a push plate a418 is installed at the output end of the linear drive member q416, and a push plate b419 is installed at the output end of the linear drive member w417. It should be noted that: a plurality of stacked L-shaped shells 801 are arranged in the feed pipe 415, and the bottom L-shaped shell 801 is located in the push groove 4141, the push groove 4141 is L-shaped, and an avoidance hole (not shown in the figure) is opened on the slide plate 412, and an avoidance groove (not shown in the figure) is opened in the L-shaped block 414, and the avoidance hole and the avoidance groove are located below the assembly groove 4143.

[0059] In this embodiment, the transport component 31 transports the device body 802 in the limiting groove 3082 and places it in the assembly groove 4143. The linear drive component q416 drives the pushing plate a418 to push the L-shaped shell 801 at the bottom of the feeding tube 415 along the pushing groove 4141 into the transport groove 4142. The linear drive component w417 drives the pushing plate b419 to push the L-shaped shell 801 in the transport groove 4142 into the assembly groove 4143, so that the L-shaped shell 801 is assembled with the device body 802.

[0060] In this embodiment, the driving slide plate 412 moves, so that the device body 802 on the assembly groove 4143 moves to the bottom of the discharge tube 4031, the vibrating loading plate 402 loads the T-shaped nail 803 and transmits it to the U-shaped groove 4072 in the circular groove 4061, and the linear driving member u405 drives the moving plate 406 to slide in the circular block 404, so that the T-shaped nail 803 in the circular groove 4061 moves to the position corresponding to the discharge tube 4031;

[0061] At the same time, the sliding rod 4071 slides in the inclined groove 4041, driving the block 407 to slide in the square groove 4062, so that the U-shaped groove 4072 leaves the T-shaped nail 803, and the T-shaped nail 803 falls along the discharge pipe 4031 under the action of gravity, and the T-shaped nail 803 passes through the hole of the device body 802 (located on the assembly groove 4143);

[0062] The driving slide 412 moves, so that the device body 802 on the assembly groove 4143 moves to the bottom of the extrusion block 409, and the linear driving member g408 drives the extrusion block 409 to move downward and press on the device body 802 and the T-shaped nail 803, thereby limiting the device body 802 and the T-shaped nail 803.

[0063] Embodiment 2: Figure 1-Figure 18 As shown, the components identical or corresponding to those in the first embodiment are marked with the corresponding reference numerals in the first embodiment. For the sake of simplicity, only the differences from the first embodiment are described below. The second embodiment differs from the first embodiment in that:

[0064] like Figure 15-18 As shown, the welding mechanism 5 includes a fixed frame 501 installed on the working plate 1, a rotating driving member t502 is installed on the fixed frame 501, a rotating disk 503 is installed at the output end of the rotating driving member t502, a linear driving member m504 is installed on the rotating disk 503, and a welding nozzle 505 is installed at the output end of the linear driving member m504.

[0065] A motion driver 506 is installed on the rotating disk 503, and a grinding stone 507 is installed on the output end of the motion driver 506. A linear driver n508 is installed on the rotating disk 503, and a sponge block 509 is installed on the output end of the linear driver n508. The motion driver 506 is a combination of a motor and a cylinder.

[0066] In this embodiment, the rotating disk 503 is driven to rotate, so that the grinding stone 507 moves to below the avoidance hole and the avoidance groove, and the motion driving member 506 drives the grinding stone 507 to move upward to contact the bottom of the T-shaped nail 803 and the L-shaped shell 801, and drives the grinding stone 507 to rotate to grind the bottom of the T-shaped nail 803 and the L-shaped shell 801, thereby increasing the roughness of the bottom of the T-shaped nail 803 and the L-shaped shell 801;

[0067] The rotating disk 503 is driven to rotate, so that the sponge block 509 moves to below the avoidance hole and the avoidance groove, and the sponge block 509 is driven to move upward to contact the T-shaped nail 803 and the bottom of the L-shaped shell 801, and the permeability enhancer is applied to the T-shaped nail 803 and the bottom of the L-shaped shell 801;

[0068] In this embodiment, the rotating disk 503 is driven to rotate, so that the welding nozzle 505 moves to the bottom of the avoidance hole and the avoidance groove, and the linear driving member m504 drives the welding nozzle 505 to contact the bottom of the T-shaped nail 803 and the L-shaped shell 801, and the T-shaped nail 803 and the L-shaped shell 801 are contacted to weld the bottom, thereby increasing the roughness of the bottom of the T-shaped nail 803 and the L-shaped shell 801, which is convenient for absorbing the permeability enhancer, and the permeability enhancer can enhance the welding effect;

[0069] An L-shaped plate 510 is installed on the working plate 1, and a linear driving component f511 is installed on the L-shaped plate 510. An injection tube 512 is installed on the output end of the linear driving component f511. The rotating disk 503 is driven to rotate, so that the sponge block 509 moves to the bottom of the injection tube 512. The linear driving component f511 drives the injection tube 512 to move downward and contact the sponge block 509, and the transmittance enhancer is added to the sponge block 509. The injection tube 512 is connected to the box through a pipeline, and the transmittance enhancer is stored in the box. This is a conventional technical means in this field and will not be described in detail here.

[0070] Embodiment 3: This embodiment provides an assembly method of a semiconductor device assembly device, comprising the following steps:

[0071] Step 1, testing process: in the initial state, the testing end 228 faces downward, the moving frame 210 slides on the horizontal plate a209, the linear driving member a222 drives the testing end 228 to move downward, the rotating driving member a221 drives the rotating wheel a205 to rotate, and the testing end 228 is driven to move by the belt a206 (the testing end 228 can be driven to move freely in the XYZ directions), and the driving testing end 228 contacts the terminal of the device body 802 on the tray to test the device body 802, and if qualified, it enters the loading process;

[0072] Step 2, loading process: the linear drive member b231 drives the rack plate 232 to move downward, the mobile frame 210 slides on the horizontal plate a209, the driving gear a229 engages with the rack plate 232, drives the rotating rod 223 to rotate 180 degrees, and drives the arc-shaped adsorption block 226 to rotate downward;

[0073] The arc-shaped adsorption block 226 is driven to contact with the qualified device body 802 on the tray, and the arc-shaped adsorption block 226 adsorbs the device body 802 by negative pressure, and transports the device body 802 to the transmission belt 303;

[0074] Step 3, position adjustment process: drive the rotating wheel b302 to rotate, transfer the device body 802 to the accommodating cavity 3071 through the transmission belt 303, and the rotating driving member b306 drives the eccentric disk 307 to rotate 90 degrees, so that the device body 802 in the accommodating cavity 3071 corresponds to the position of the limiting groove 3082;

[0075] The linear drive member c309 drives the push plate 310 to push the device body 802 in the accommodating cavity 3071 into the limiting groove 3082 to adjust the position of the device body 802;

[0076] Step 4, transporting process: the transporting component 31 transports the device body 802 in the limiting groove 3082 and places it in the assembly groove 4143, the linear driving component q416 drives the pushing plate a418 to push the L-shaped shell 801 at the bottom of the feeding tube 415 along the pushing groove 4141 into the transport groove 4142, and the linear driving component w417 drives the pushing plate b419 to push the L-shaped shell 801 in the transport groove 4142 into the assembly groove 4143, so that the L-shaped shell 801 and the device body 802 are assembled together;

[0077] Step 5, assembly process: drive the slide plate 412 to move, so that the device body 802 on the assembly groove 4143 moves to the bottom of the discharge pipe 4031, the vibrating loading plate 402 loads the T-shaped nail 803, and transmits it to the U-shaped groove 4072 in the circular groove 4061, and the linear driving member u405 drives the moving plate 406 to slide in the circular block 404, so that the T-shaped nail 803 in the circular groove 4061 moves to the position corresponding to the discharge pipe 4031;

[0078] At the same time, the sliding rod 4071 slides in the inclined groove 4041, driving the block 407 to slide in the square groove 4062, so that the U-shaped groove 4072 leaves the T-shaped nail 803, and the T-shaped nail 803 falls along the discharge pipe 4031 under the action of gravity, and the T-shaped nail 803 passes through the hole of the device body 802 (located on the assembly groove 4143);

[0079] The driving slide plate 412 moves, so that the device body 802 on the assembly groove 4143 moves to below the extrusion block 409, and the linear driving member g408 drives the extrusion block 409 to move downward and press on the device body 802 and the T-shaped nail 803;

[0080] Step 6, grinding and coating process: drive the rotating disk 503 to rotate, so that the grinding stone 507 moves to the bottom of the avoidance hole and the avoidance groove, and the motion driving member 506 drives the grinding stone 507 to move upward to contact the bottom of the T-shaped nail 803 and the L-shaped shell 801, and drives the grinding stone 507 to rotate to grind the bottom of the T-shaped nail 803 and the L-shaped shell 801 to increase the roughness of the bottom of the T-shaped nail 803 and the L-shaped shell 801;

[0081] The rotating disk 503 is driven to rotate, so that the sponge block 509 moves to below the avoidance hole and the avoidance groove, and the sponge block 509 is driven to move upward to contact the T-shaped nail 803 and the bottom of the L-shaped shell 801, and the permeability enhancer is applied to the T-shaped nail 803 and the bottom of the L-shaped shell 801;

[0082] Step 7, welding process: drive the rotating disk 503 to rotate, so that the welding nozzle 505 moves to the bottom of the avoidance hole and the avoidance groove, and the linear driving member m504 drives the welding nozzle 505 to contact the bottom of the T-shaped nail 803 and the L-shaped shell 801, and welds the bottom of the T-shaped nail 803 and the L-shaped shell 801 to increase the roughness of the bottom of the T-shaped nail 803 and the L-shaped shell 801, so as to facilitate the absorption of the anti-transmitting agent, and the anti-transmitting agent can enhance the welding effect;

[0083] Step 8, transparent agent adding process: drive the rotating disk 503 to rotate, so that the sponge block 509 moves to the bottom of the injection tube 512, and the linear driving member f511 drives the injection tube 512 to move downward to contact the sponge block 509, and the transparent agent is added into the sponge block 509.

[0084] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor device assembly device, comprising a working plate (1), characterized in that: The working plate (1) is provided with a feeding mechanism (2), a first assembly mechanism (3), a second assembly mechanism (4) and a welding mechanism (5); The feeding mechanism (2) comprises a plurality of fixed columns (201) mounted on the working plate (1), a carrying plate (202) being mounted on the fixed columns (201), a fixed frame a (203) being mounted on the working plate (1), a fixed shell (204) being mounted on the fixed frame a (203), two rotating wheels a (205) being rotatably arranged in the fixed shell (204), a belt a (206) being sleeved on the outer sides of the two rotating wheels a (205), and the fixed shell ( A guide rail is installed in the belt a (204), a moving frame (207) is slidably provided on the guide rail, the moving frame (207) is connected to the belt a (206), a guide rail is installed on the moving frame (207), a slider (208) is slidably provided on the guide rail, a transverse plate a (209) is installed on the slider (208), a guide rail is installed on the transverse plate a (209), a moving frame (210) is slidably provided on the guide rail, and a detection adsorption component (22) is installed on the moving frame (210).

2. The semiconductor device assembly equipment according to claim 1, characterized in that: The detection adsorption component (22) comprises: A rotating driving member a (221), wherein the rotating driving member a (221) is mounted on the fixed shell (204), and the rotating driving member a (221) drives one of the rotating wheels a (205) to rotate; A linear drive member a (222), the linear drive member a (222) being mounted on the motion frame (207), the output end of the linear drive member a (222) being connected to the slider (208); A rotating rod (223), the rotating rod (223) being rotatably disposed on the moving frame (210); A round table (224), wherein the round table (224) is mounted on the rotating rod (223); A connecting rod a (225), wherein the connecting rod a (225) is mounted on one end of the truncated table (224); An arc-shaped adsorption block (226), wherein the arc-shaped adsorption block (226) is installed on the connecting rod a (225).

3. A semiconductor device assembly equipment according to claim 2, characterized in that: A connecting rod b (227) is installed at the other end of the truncated table (224), a detection end (228) is installed on the connecting rod b (227), a gear a (229) is installed on the connecting rod b (227), a connecting plate (230) is installed on the slider (208), a linear drive member b (231) is installed on the connecting plate (230), and a rack plate (232) is installed at the output end of the linear drive member b (231); A rotating sleeve (233) is installed on the rotating rod (223), a mounting groove (2331) is provided in the rotating sleeve (233), an elastic connecting piece (234) is provided in the mounting groove (2331), a positioning ball (235) is provided on the elastic connecting piece (234), and a placement groove (2101) and two positioning holes (2102) are provided in the movable frame (210).

4. The semiconductor device assembly equipment according to claim 3, characterized in that: The first assembly mechanism (3) comprises: A fixing frame b (301), wherein the fixing frame b (301) is installed on the working plate (1); Rotating wheels b (302), the rotating wheels b (302) are rotatably disposed at two ends of the fixing frame b (301); A transmission belt (303), wherein the transmission belt (303) is sleeved on the outer sides of the two rotating wheels b (302); A connecting seat (304), the connecting seat (304) being mounted on the working plate (1); A vertical plate (305), wherein the vertical plate (305) is installed on the connecting seat (304); A rotating driving member b (306), wherein the rotating driving member b (306) is mounted on the vertical plate (305); An eccentric disk (307), wherein the eccentric disk (307) is mounted on the output end of the rotary drive member b (306), and a receiving cavity (3071) is provided in the eccentric disk (307); A placement plate a (308), the placement plate a (308) being mounted on the vertical plate (305), and the placement plate a (308) being provided with a groove (3081) and a limiting groove (3082); A linear drive member c (309), wherein the linear drive member c (309) is mounted on the placement plate a (308); A push plate (310), the push plate (310) being mounted on the output end of the linear drive member c (309); A transport assembly (31), wherein the transport assembly (31) is mounted on the working plate (1).

5. The semiconductor device assembly equipment according to claim 4, characterized in that: The transport assembly (31) comprises a support frame (300) arranged on the working plate (1), a mounting frame (311) being mounted on the support frame (300), a guide rail being mounted on the mounting frame (311), a lifting frame (312) being slidably mounted on the guide rail, a guide rail being mounted on the lifting frame (312), a moving plate (313) being slidably mounted on the guide rail, and a clamping cylinder (314) being mounted on the moving plate (313); A linear drive member e (315) is installed on the support frame (300), and an output end of the linear drive member e (315) is connected to the lifting frame (312). A linear drive member d (316) is installed on the lifting frame (312), and an output end of the linear drive member d (316) is connected to the moving plate (313).

6. The semiconductor device assembly equipment according to claim 5, characterized in that: The second assembly mechanism (4) comprises a placement plate b (401) and a flat plate (403) mounted on the working plate (1); the placement plate b (401) is mounted with a vibrating loading tray (402); the flat plate (403) is mounted with a circular block (404) and a linear drive member u (405); a moving plate (406) is mounted at the output end of the linear drive member u (405); the moving plate (406) slides in the circular block (404); A circular groove (4061) and a square groove (4062) are provided in the movable plate (406); a discharge pipe (4031) is installed at the bottom of the flat plate (403); an inclined groove (4041) is provided in the circular block (404); a square block (407) is slidably provided in the square groove (4062); a sliding rod (4071) is installed on the square block (407) and slides in the inclined groove (4041); and a U-shaped groove (4072) is provided at one end of the square block (407); An assembly component (41) is installed on the working plate (1), a linear drive member g (408) is installed on the flat plate (403), and an extrusion block (409) is installed at the output end of the linear drive member g (408).

7. The semiconductor device assembly equipment according to claim 6, characterized in that: The assembly component (41) comprises a transverse plate b (411) mounted on the working plate (1), a guide rail being mounted on the transverse plate b (411), a slide plate (412) being slidably mounted on the guide rail, a linear drive member t (413) being mounted on the transverse plate b (411), and an output end of the linear drive member t (413) being connected to the slide plate (412); The slide plate (412) is provided with an L-shaped block (414), wherein a material pushing groove (4141), a material transporting groove (4142) and an assembly groove (4143) are provided in the L-shaped block (414), a material feeding pipe (415) is provided on the L-shaped block (414), a linear driving component q (416) and a linear driving component w (417) are provided on the slide plate (412), a material pushing plate a (418) is provided at the output end of the linear driving component q (416), and a material pushing plate b (419) is provided at the output end of the linear driving component w (417).

8. The semiconductor device assembly equipment according to claim 7, characterized in that: The welding mechanism (5) comprises a fixed frame (501) mounted on the working plate (1), a rotary drive member t (502) being mounted on the fixed frame (501), a rotary disk (503) being mounted on the output end of the rotary drive member t (502), a linear drive member m (504) being mounted on the rotary disk (503), and a welding nozzle (505) being mounted on the output end of the linear drive member m (504).

9. The semiconductor device assembly equipment according to claim 8, characterized in that: A motion driving member (506) is mounted on the rotating disk (503), and a grinding stone (507) is mounted on the output end of the motion driving member (506). A linear driving member n (508) is mounted on the rotating disk (503), and a sponge block (509) is mounted on the output end of the linear driving member n (508).

10. The semiconductor device assembly equipment according to claim 9, characterized in that: An L-shaped plate (510) is mounted on the working plate (1), a linear drive member f (511) is mounted on the L-shaped plate (510), and an injection pipe (512) is mounted on the output end of the linear drive member f (511).

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