Normal-high-low temperature chip testing equipment

Abstract

The invention discloses normal high and low temperature chip testing equipment, which comprises an equipment main body, and a pre-warming disc assembly, a feeding manipulator assembly, a material ship assembly, a testing arm assembly and a discharging manipulator assembly which are arranged on the equipment main body, and is characterized in that the feeding manipulator assembly is used for carrying a normal temperature chip onto the material ship assembly or the pre-warming disc assembly; the preheating disc assembly preheats chips into high-temperature chips or precools the chips into low-temperature chips, the feeding mechanical arm assembly is further used for conveying the high-temperature chips or the low-temperature chips on the preheating disc assembly to the material ship assembly, and the material ship assembly is used for conveying the chips. The testing arm assembly is used for taking out the chip on the material ship assembly for testing and putting the chip back to the original position, and the discharging manipulator assembly is used for taking out the chip on the material ship assembly. By adopting the design mode, preheating and precooling of the chip, testing of the chip and taking out of the tested chip can be automatically realized, so that the automation degree can be improved, the working intensity of workers can be reduced, and the production efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip sorting and storage, and in particular to a high-low temperature chip testing device. Background Art

[0002] With the rapid development of the integrated circuit industry, the demand for the use of chips is becoming more and more vigorous. During the production of chips, different working temperatures need to be simulated according to the working environment of the chip for testing, so as to detect the performance of the chip at different working temperatures. In the prior art, when the chip needs to be preheated or precooled, manual assistance is required to put the chip into a heating device or a cooling device for heating or cooling. When the chip temperature needs to be tested, workers need to put the chip into a testing machine. After the test is completed, workers need to take the chip out. Therefore, the existing method has a low degree of automation, high work intensity for workers, and relatively low production efficiency, which is not conducive to mass production. Summary of the invention

[0003] In order to overcome at least one of the defects of the above-mentioned prior art, the present invention provides a high and low temperature chip testing device to solve the problem that the existing chips have low automation and low production efficiency during high and low temperature testing, which is not conducive to mass production.

[0004] The present invention is a technical solution adopted to solve the problem. The embodiment of the present invention discloses a normal high and low temperature chip testing equipment, including an equipment body and a pre-heating plate assembly, a loading robot assembly, a material boat assembly, a test arm assembly and a unloading robot assembly arranged on the equipment body. The loading robot assembly is used to transport the chips at normal temperature to the workstation corresponding to the loading robot assembly on the material boat assembly, or to transport the chips at normal temperature to the pre-heating plate assembly. The pre-heating plate assembly preheats the chips to high-temperature chips or pre-cools the chips to low-temperature chips. The loading robot assembly is also used to transfer the high-temperature chips or low-temperature chips on the pre-heating plate assembly. The chip is transported to the workstation on the material boat assembly corresponding to the loading robot assembly; the material boat assembly is used to transport the chip corresponding to the workstation on the loading robot assembly to the workstation corresponding to the testing arm assembly and to transport the chip corresponding to the workstation on the testing arm assembly to the workstation corresponding to the unloading robot assembly; the testing arm assembly is used to take out the chip corresponding to the workstation on the material boat assembly for testing and put the tested chip back to the workstation on the material boat assembly corresponding to the testing arm assembly; the unloading robot assembly is used to take out the chip corresponding to the workstation on the material boat assembly.

[0005] As an optional implementation, in an embodiment of the present invention, the pre-warming plate assembly includes a heating component having a cavity, a refrigerant tube and a first chip positioning plate, the refrigerant tube is connected to the cavity of the heating component, and is used to provide refrigerant to the heating component, the first chip positioning plate is in contact with the heating component, and the heating component is used to heat the first chip positioning plate, or, is used to cool the first chip positioning plate when the refrigerant tube provides refrigerant.

[0006] As an optional implementation, in an embodiment of the present invention, the heating component is a plate-like structure whose shape and size are consistent with the shape and size of the first chip positioning plate, the first chip positioning plate is arranged on the upper surface of the heating component, and the refrigerant pipe is connected to the side of the heating component.

[0007] As an optional implementation, in an embodiment of the present invention, the loading robot assembly includes a first robot arm, a second robot arm, a first lifting platform and a first suction nozzle assembly, the second robot arm is connected to the first robot arm, the first lifting platform is arranged on the second robot arm, the first suction nozzle assembly is arranged on the first lifting platform, the first robot arm drives the second robot arm to move along the first horizontal direction to drive the first suction nozzle assembly to move along the first horizontal direction, the second robot arm drives the first lifting platform to move along the second horizontal direction to drive the first suction nozzle assembly to move along the second horizontal direction, and the first lifting platform drives the first suction nozzle assembly to move along the first vertical direction; The second horizontal direction is different from the first horizontal direction.

[0008] As an optional embodiment, in an embodiment of the present invention, the loading robot assembly also includes a second drive assembly, a third drive assembly and a fourth drive assembly, the second drive assembly is arranged on the first robot arm and is transmitted along the first horizontal direction to drive the second robot arm to move along the first horizontal direction, the third drive assembly is arranged on the second robot arm and is transmitted along the second horizontal direction to drive the first lifting platform to move along the second horizontal direction, and the fourth drive assembly is arranged on the first lifting platform to drive the first suction nozzle assembly to move along the first vertical direction.

[0009] As an optional embodiment, in an embodiment of the present invention, the second drive component includes a second transmission belt and a second drive motor, the second drive motor is arranged on the first mechanical arm, the second transmission belt is arranged on the second drive motor, and the second transmission belt drives the second mechanical arm to move under the drive of the second drive motor, the third drive component includes a third transmission belt and a third drive motor, the third drive motor is arranged on the second mechanical arm, the third transmission belt is arranged on the third drive motor, and the third transmission belt drives the first lifting platform to move under the drive of the third drive motor, the fourth drive component includes a fourth transmission belt and a fourth drive motor, the fourth drive motor is arranged on the first lifting platform, the fourth transmission belt is arranged on the fourth drive motor, and the fourth transmission belt drives the first lifting platform to move under the drive of the fourth drive motor.

[0010] As an optional implementation, in an embodiment of the present invention, the material boat assembly includes a material boat body and a fifth drive assembly and a second chip positioning plate arranged on the material boat body, the material boat body is provided with a workstation corresponding to the loading robot assembly, a workstation corresponding to the testing arm assembly and a workstation corresponding to the unloading robot assembly, and the fifth drive assembly is used to drive the second chip positioning plate to move between the workstation corresponding to the loading robot assembly, the workstation corresponding to the testing arm assembly and the workstation corresponding to the unloading robot assembly.

[0011] As an optional implementation, in an embodiment of the present invention, the fifth drive assembly includes a fifth transmission belt and a fifth drive motor, the fifth drive motor is arranged on the material ship body, the fifth transmission belt is arranged on the fifth drive motor, and the fifth transmission belt drives the second chip positioning plate to move under the drive of the fifth drive motor.

[0012] As an optional implementation, in an embodiment of the present invention, the test arm assembly includes a test arm body and a sixth drive assembly, a seventh drive assembly and a second suction nozzle assembly arranged on the test arm body, the sixth drive assembly is used to drive the second suction nozzle assembly to move along a third horizontal direction, and the seventh drive assembly is used to drive the second suction nozzle assembly to move along a second vertical direction.

[0013] As an optional embodiment, in an embodiment of the present invention, the sixth drive assembly includes a sixth drive motor and a sixth transmission screw, and the sixth transmission screw drives the second suction nozzle assembly to move along the third horizontal direction under the drive of the sixth drive motor. The seventh drive assembly includes a seventh drive motor and a seventh transmission screw, and the seventh transmission screw drives the second suction nozzle assembly to move along the second vertical direction under the drive of the seventh drive motor.

[0014] As an optional embodiment, in an embodiment of the present invention, the sixth drive assembly is a group, and the seventh drive assembly and the second suction nozzle assembly are two groups. One group of the sixth drive assembly drives two groups of the second suction nozzle assemblies to move along the third horizontal direction, and two groups of the seventh drive assemblies respectively drive two groups of the second suction nozzle assemblies to move along the second vertical direction.

[0015] As an optional implementation, in an embodiment of the present invention, the unloading robot assembly includes a third robot arm, a fourth robot arm, a second lifting platform and a third suction nozzle assembly, the fourth robot arm is connected to the third robot arm, the second lifting platform is arranged on the fourth robot arm, the third suction nozzle assembly is arranged on the second lifting platform, the third robot arm drives the fourth robot arm to move along a fourth horizontal direction to drive the third suction nozzle assembly to move along the fourth horizontal direction, the fourth robot arm drives the second lifting platform to move along a fifth horizontal direction to drive the third suction nozzle assembly to move along the fifth horizontal direction, and the second lifting platform drives the third suction nozzle assembly to move along a third vertical direction; The fifth horizontal direction is different from the fourth horizontal direction.

[0016] As an optional embodiment, in an embodiment of the present invention, the unloading robot assembly also includes an eighth drive assembly, a ninth drive assembly and a tenth drive assembly, the eighth drive assembly is arranged on the third robot arm and is transmitted along the fourth horizontal direction to drive the fourth robot arm to move along the fourth horizontal direction, the ninth drive assembly is arranged on the fourth robot arm and is transmitted along the fifth horizontal direction to drive the second lifting platform to move along the fifth horizontal direction, and the tenth drive assembly is arranged on the second lifting platform to drive the third suction nozzle assembly to move along the third vertical direction.

[0017] As an optional embodiment, in an embodiment of the present invention, the eighth drive component includes an eighth transmission belt and an eighth drive motor, the eighth drive motor is arranged on the third mechanical arm, the eighth transmission belt is arranged on the eighth drive motor, and the eighth transmission belt drives the fourth mechanical arm to move under the drive of the eighth drive motor, the ninth drive component includes a ninth transmission belt and a ninth drive motor, the ninth drive motor is arranged on the fourth mechanical arm, the ninth transmission belt is arranged on the ninth drive motor, and the ninth transmission belt drives the second lifting platform to move under the drive of the ninth drive motor, the tenth drive component includes a tenth transmission belt and a tenth drive motor, the tenth drive motor is arranged on the second lifting platform, the tenth transmission belt is arranged on the tenth drive motor, and the tenth transmission belt drives the second lifting platform to move under the drive of the tenth drive motor.

[0018] As an optional embodiment, in an embodiment of the present invention, the normal high and low temperature chip testing equipment also includes a loading conveyor line assembly, the loading conveyor line assembly is used to transport a tray containing chips at normal temperature, and the loading robot assembly is used to move the chips on the tray of the loading conveyor line assembly to the pre-temperature tray assembly.

[0019] As an optional embodiment, in an embodiment of the present invention, the loading conveyor line assembly includes a loading conveyor line main body and a first drive assembly arranged on the loading conveyor line main body, the loading conveyor line main body is provided with a loading area and a first working area, the pre-warming plate assembly is arranged close to the first working area, the first drive assembly is used to transport the material tray in the loading area to the first working area, and the loading robot assembly is used to move the chips on the material tray in the first working area to the pre-warming plate assembly.

[0020] As an optional embodiment, in an embodiment of the present invention, the first drive component includes a first drive motor and a first transmission belt, the first drive motor is arranged on the main body of the loading conveyor line, the first transmission belt is arranged on the first drive motor, the first drive motor is used to drive the first transmission belt, and the first transmission belt is used to transport the material tray in the loading area to the first working area.

[0021] As an optional implementation, in an embodiment of the present invention, the loading conveyor line assembly further includes a first positioning cylinder, and the first positioning cylinder is used to position the material tray when the material tray is transported to the first working area.

[0022] As an optional implementation, in an embodiment of the present invention, the feeding conveyor line assembly also includes a first limit member, which is arranged at one end of the feeding conveyor line body where a first working area is provided, and the first limit member is used to limit the movement of the material tray along the movement direction of the first transmission belt.

[0023] As an optional implementation, in an embodiment of the present invention, the normal high and low temperature chip testing equipment also includes a material receiving conveyor line assembly and a defective tray assembly, and the unloading robot assembly is used to place good chips on the material tray of the material receiving conveyor line assembly according to the test results of the test arm assembly, and to place unqualified chips on the defective tray assembly.

[0024] As an optional implementation, in an embodiment of the present invention, the material receiving conveyor line assembly includes a material receiving conveyor line main body and an eleventh drive assembly arranged on the material receiving conveyor line main body, the material receiving conveyor line main body is provided with a second working area and a material receiving area, the second working area is arranged close to the material boat assembly, the unloading robot assembly is used to place the good chips on the material tray of the second working area, and the eleventh drive assembly is used to transport the material tray of the second working area to the material receiving area.

[0025] As an optional implementation, in an embodiment of the present invention, the eleventh drive component includes an eleventh drive motor and an eleventh transmission belt, the eleventh drive motor is arranged on the main body of the material receiving conveyor line, the eleventh transmission belt is arranged on the eleventh drive motor, the eleventh drive motor is used to drive the eleventh transmission belt, and the eleventh transmission belt is used to transport the material tray of the second working area to the material receiving area.

[0026] As an optional implementation, in an embodiment of the present invention, the defective tray assembly includes a plurality of defective trays, and the plurality of defective trays are arranged side by side.

[0027] As an optional implementation, in an embodiment of the present invention, the normal high and low temperature chip testing equipment also includes a tray gripper assembly and an empty tray conveyor line assembly, and the tray gripper assembly is used to grab the empty tray after taking the chips from the loading conveyor line assembly and transport it to the empty tray conveyor line assembly.

[0028] As an optional embodiment, in an embodiment of the present invention, the tray gripper assembly includes a fifth robotic arm, a sixth robotic arm and a tray-clamping component, the sixth robotic arm is connected to the fifth robotic arm, the tray-clamping component is arranged on the sixth robotic arm, and the fifth robotic arm drives the sixth robotic arm to move along the sixth horizontal direction or along the fourth vertical direction to drive the tray-clamping component to move along the sixth direction or along the fourth vertical direction.

[0029] As an optional embodiment, in an embodiment of the present invention, the tray gripper assembly also includes a twelfth drive assembly and a thirteenth drive assembly, the twelfth drive assembly is arranged on the fifth robotic arm and moves along the sixth horizontal direction to drive the sixth robotic arm to move along the sixth horizontal direction, and the thirteenth drive assembly is arranged on the fifth robotic arm and moves along the fourth vertical direction.

[0030] As an optional embodiment, in an embodiment of the present invention, the twelfth drive component includes a twelfth transmission belt and a twelfth drive motor, the twelfth drive motor is arranged on the fifth robotic arm, the twelfth transmission belt is arranged on the twelfth drive motor, and the twelfth transmission belt drives the sixth robotic arm to move along the sixth horizontal direction under the drive of the twelfth drive motor, and the thirteenth drive component includes a thirteenth transmission screw and a thirteenth drive motor, the thirteenth drive motor is arranged on the fifth robotic arm, the thirteenth transmission screw is arranged on the thirteenth drive motor, and the thirteenth transmission screw drives the sixth robotic arm to move along the fourth vertical direction under the drive of the thirteenth drive motor.

[0031] As an optional implementation, in an embodiment of the present invention, the empty tray clamping component includes an empty tray clamping body, a clamping cylinder and a tray clamping hand, the empty tray clamping body is arranged on the sixth robotic arm, the clamping cylinder and the tray clamping hand are both arranged on the empty tray clamping body, and the tray clamping hand clamps the empty tray under the drive of the clamping cylinder.

[0032] As an optional implementation, in an embodiment of the present invention, the empty tray conveyor line assembly includes an empty tray conveyor line main body and a fourteenth drive assembly arranged on the empty tray conveyor line main body, the empty tray conveyor line main body is provided with a third working area and an empty tray area, the tray gripper assembly is used to grab the empty tray from which the chips have been taken on the loading conveyor line assembly and transport it to the third working area of ​​the empty tray conveyor line assembly, and the fourteenth drive assembly is used to transport the empty trays in the third working area to the empty tray area.

[0033] As an optional implementation, in an embodiment of the present invention, the fourteenth drive component includes a fourteenth drive motor and a fourteenth transmission belt, the fourteenth drive motor is arranged on the main body of the empty material tray conveyor line, the fourteenth transmission belt is arranged on the fourteenth drive motor, the fourteenth drive motor is used to drive the fourteenth transmission belt, and the fourteenth transmission belt is used to transport the empty material trays in the third working area to the empty material tray area.

[0034] As an optional implementation, in an embodiment of the present invention, the device body includes a bracket and a support plate arranged on the bracket, the pre-temperature plate assembly, the loading robot assembly, the material boat assembly, the test arm assembly and the unloading robot assembly are all arranged on the support plate, and a heating component is provided on the support plate, and the heating component is used to heat the support plate.

[0035] As an optional implementation, in an embodiment of the present invention, the heating component includes a first heating pad, a second heating pad and a third heating pad, the first heating pad is arranged on the lower surface of the support plate corresponding to the position of the pre-heating plate assembly, the second heating pad is arranged on the lower surface of the support plate corresponding to the position of the material boat assembly, and the third heating pad is arranged on the lower surface of the support plate corresponding to the position of the test arm assembly.

[0036] As an optional implementation, in an embodiment of the present invention, the normally high and low temperature chip testing equipment also includes an outer shell covering the pre-temperature plate assembly, the loading robot assembly, the material boat assembly, the test arm assembly and the unloading robot assembly, the outer shell includes a first inner layer and a first outer layer, and a first insulation space is formed between the first inner layer and the first outer layer.

[0037] As an optional implementation, in an embodiment of the present invention, the outer shell is provided with a heat dissipation channel running through the first inner layer and the first outer layer, and the outer shell is provided with a first sealing door, which is movably disposed outside the first outer layer and can be moved to open or close the heat dissipation channel.

[0038] As an optional implementation, in an embodiment of the present invention, a safety door is provided on the outer shell, and the safety door includes a second inner layer and a second outer layer, and a second heat-insulating space is formed between the second inner layer and the second outer layer.

[0039] As an optional embodiment, in an embodiment of the present invention, the normally high and low temperature chip testing equipment also includes a shell covering the pre-temperature plate assembly, the loading manipulator assembly, the material boat assembly, the test arm assembly and the unloading manipulator assembly, and a first partition layer and a second partition layer are arranged at intervals in the shell, and the first partition layer and the second partition layer divide the inner cavity of the shell into a loading chamber, a test chamber and a unloading chamber, and the loading chamber is provided with at least one first dry air inlet, and the loading chamber is filled with dry air to form a high-pressure zone, and the first partition layer is provided with a first through hole that can connect the loading chamber and the test chamber, and the second partition layer is provided with a second through hole that can connect the test chamber and the unloading chamber.

[0040] As an optional implementation, in an embodiment of the present invention, a second sealing door for opening and closing the first through hole and a first power mechanism for controlling the opening and closing of the second sealing door are provided on the first separation layer.

[0041] As an optional implementation, in an embodiment of the present invention, a third sealing door for opening and closing the second through hole and a second power mechanism for controlling the opening and closing of the third sealing door are provided on the second separation layer.

[0042] Implementing the embodiments of the present invention will have the following beneficial effects: The present invention is provided with an equipment body and a preheating plate assembly, a loading robot assembly, a material boat assembly, a test arm assembly and a unloading robot assembly arranged on the equipment body. The loading robot assembly is used to transport chips at room temperature to a workstation corresponding to the loading robot assembly on the material boat assembly, or to transport chips at room temperature to the preheating plate assembly. The preheating plate assembly preheats the chips to high-temperature chips or precools the chips to low-temperature chips. The loading robot assembly is also used to transport the high-temperature chips or low-temperature chips on the preheating plate assembly to the material boat assembly. The material boat assembly is used to transport the chip corresponding to the loading robot assembly station to the corresponding test arm assembly station and to transport the chip corresponding to the test arm assembly station to the corresponding unloading robot assembly station. The test arm assembly is used to take out the chip corresponding to the test arm assembly station on the material boat assembly for testing and put the tested chip back to the station corresponding to the test arm assembly on the material boat assembly. The unloading robot assembly is used to take out the chip corresponding to the unloading robot assembly station on the material boat assembly. With such a design, the high and low temperature chip testing equipment can automatically realize the chip preheating, precooling, chip testing and chip removal after testing, thereby improving the degree of automation, reducing the work intensity of workers and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 It is a structural schematic diagram of a normal high and low temperature chip testing device in an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a feeding conveyor line assembly in an embodiment of the present invention; Figure 3 Schematic diagram of the structure of the pre-warming plate assembly in an embodiment of the present invention; Figure 4 It is a structural schematic diagram of a feeding robot assembly in an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a material ship assembly in an embodiment of the present invention; Figure 6 The structure of the test arm assembly in the embodiment of the present invention is shown in FIG. Figure 1 ; Figure 7 The structure of the test arm assembly in the embodiment of the present invention is shown in FIG. Figure 2 ; Figure 8 for Figure 7 A partial enlarged view of point B in the middle; Fig. 9 It is a structural schematic diagram of a material unloading robot assembly in an embodiment of the present invention; Fig.10 It is a structural schematic diagram of a material receiving conveying line assembly in an embodiment of the present invention; Fig.11 is a schematic structural diagram of a defective tray assembly in an embodiment of the present invention; Fig.12 Schematic diagram of the structure of the tray gripper assembly in an embodiment of the present invention; Fig.13 It is a structural schematic diagram of an empty tray conveyor line assembly in an embodiment of the present invention; Fig.14 is a schematic structural diagram of a support plate in an embodiment of the present invention; Fig.15 The structure of the housing in the embodiment of the present invention is shown in FIG. Figure 1 ; Fig.16 The structure of the housing in the embodiment of the present invention is shown in FIG. Figure 2 ; Fig.17 for Fig.16 A partial enlarged view of point C in the middle; Fig.18 The structure of the housing in the embodiment of the present invention is shown in FIG. Figure 3 ; Fig.19 The structure of the housing in the embodiment of the present invention is shown in FIG. Figure 4 ; Fig. 20 Schematic diagram of the structure of the first separation layer and the second separation layer in an embodiment of the present invention Figure 1 ; Fig.21 Schematic diagram of the structure of the first separation layer and the second separation layer in an embodiment of the present invention Figure 2 ; Fig. 22 yes Fig.21 Schematic diagram of the structure after removing the second sealing plate.

[0045] The meanings of the reference numerals are as follows: 1A-equipment body; 01-bracket; 02-support plate; 03-second heating component; 031-first heating pad; 032-second heating pad; 033-third heating pad; 2A-feeding conveyor assembly; 1-feeding conveyor body; 2-feeding area; 3-first working area; 4-first drive motor; 5-first transmission belt; 6-first positioning cylinder; 7-first limiter; 3A-pre-heating plate assembly; 8-first heating component; 9-refrigerant pipe; 10-first chip positioning plate; 4A-feeding robot assembly; 11-first robot arm; 12-second robot arm; 13-first lifting platform; 14-first suction nozzle; 15-second transmission belt; 16 -second drive motor; 17-third transmission belt; 18-third drive motor; 19-fourth transmission belt; 20-fourth drive motor; 5A-material boat assembly; 21-material boat body; 22-fifth transmission belt; 23-fifth drive motor; 24-second chip positioning plate; 6A-test arm assembly; 25-test arm body; 26-sixth drive motor; 27-sixth transmission screw; 28-seventh drive motor; 29-seventh transmission screw; 30-second suction nozzle; 7A-unloading robot assembly; 31-third robot arm; 32-fourth robot arm; 33-second lifting platform; 34-third suction nozzle; 35-eighth transmission belt; 36-eighth drive Motor; 37-9th transmission belt; 38-9th drive motor; 39-10th transmission belt; 40-10th drive motor; 8A-collecting conveyor line assembly; 41-collecting conveyor line body; 42-2nd working area; 43-collecting area; 44-11th drive motor; 45-11th transmission belt; 9A-defective tray assembly; 46-defective tray; 10A-tray gripper assembly; 47-5th mechanical arm; 48-6th mechanical arm; 49-empty tray gripper; 50-clamping cylinder; 51-tray gripper; 52-12th transmission belt; 53-12th drive motor; 54-13th transmission screw; 55-13th drive motor; 11A-collecting empty tray Conveyor line assembly; 56-main body of the empty tray conveyor line; 57-third working area; 58-empty tray area; 59-the fourteenth driving motor; 60-the fourteenth transmission belt; 61-tray; 62-main body of the empty tray; 63-second positioning cylinder; 12A-housing; 13A-first inner layer; 14A-first outer layer; 15A-heat dissipation channel; 16A-first sealing door; 17A-safety door; 18A-first partition layer; 19A-second sealing door; 20A-first power mechanism; 21A-second partition layer; 22A-third sealing door; 23A-second power mechanism; 24A-loading chamber; 25A-test chamber; 26A-unloading chamber. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0048] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0049] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0051] The technical solution of the present invention will be further described below in conjunction with embodiments and drawings.

[0052] See also Figure 1The embodiment of the present invention discloses a normal high and low temperature chip testing device, including a device body 1A and a preheating plate assembly 3A, a loading robot assembly 4A, a material boat assembly 5A, a test arm assembly 6A and a unloading robot assembly 7A arranged on the device body 1A. The loading robot assembly 4A is used to transport the chips at normal temperature to the workstation corresponding to the loading robot assembly 4A on the material boat assembly 5A, or to transport the chips at normal temperature to the preheating plate assembly 3A. The preheating plate assembly 3A preheats the chips to high-temperature chips or precools the chips to low-temperature chips. The loading robot assembly 4A is also used to transport the high-temperature chips or low-temperature chips on the preheating plate assembly 3A to the material boat. The component 5A corresponds to the station of the loading robot component 4A. The material boat component 5A is used to transport the chip corresponding to the station of the loading robot component 4A to the station of the corresponding test arm component 6A and to transport the chip corresponding to the station of the test arm component 6A to the station of the unloading robot component 7A. The test arm component 6A is used to take out the normal temperature, high temperature or low temperature chip corresponding to the station of the test arm component 6A on the material boat component 5A for testing and put the tested chip back to the station of the corresponding test arm component 6A on the material boat component 5A. The unloading robot component 7A is used to take out the chip corresponding to the station of the unloading robot component 7A on the material boat component 5A. With such a design, the normal high and low temperature chip testing equipment can automatically realize the preheating and precooling of the chip, the normal temperature, high temperature and low temperature testing of the chip, and the removal of the chip after the test, thereby improving the degree of automation, reducing the work intensity of workers, and improving production efficiency.

[0053] Among them, the normal high and low temperature chips in the normal high and low temperature chip testing equipment include normal temperature chips, high temperature chips and low temperature chips. The normal temperature chip refers to the natural temperature of the chip in the environment where it is located. The high temperature chip refers to the chip heated to a temperature higher than the natural temperature and lower than 150°, and its temperature can be 50°, 70°, 80°, 120°, etc., which is not limited here. The low temperature chip refers to the chip cooled to a temperature lower than the natural temperature and higher than -55°, and its temperature can be 20°, 10°, 0°, -20°, -35°, etc., which is not limited here.

[0054] In some embodiments, in order to continuously supply chips at room temperature for the loading robot assembly to pick up, the high and low temperature chip testing equipment also includes a loading conveyor line assembly 2A, the loading conveyor line assembly 2A is used to transport a tray 61 containing chips at room temperature, and the loading robot assembly 4A is used to move the chips on the tray 61 of the loading conveyor line assembly 2A to the pre-temperature tray assembly 3A.

[0055] In some embodiments, in order to be able to classify good and unqualified chips after chip testing, the high and low temperature chip testing equipment also includes a material receiving conveyor line assembly 8A and a defective tray assembly 9A, and the unloading robot assembly 7A is used to place the good chips on the material tray 61 of the material receiving conveyor line assembly 8A according to the test results of the test arm assembly 6A, and to place the unqualified chips on the defective tray assembly 9A.

[0056] In some embodiments, in order to collect the empty tray 61 after taking out the chips from the loading conveyor assembly so that the loading conveyor assembly can continue to convey the empty tray 61 loaded with chips, the high and low temperature chip testing equipment also includes a tray gripper assembly 10A and an empty tray conveyor line assembly 11A. The tray gripper assembly 10A is used to grab the empty tray 61 after taking out the chips from the loading conveyor line assembly 2A and transport it to the empty tray conveyor line assembly 11A, and the empty tray conveyor line assembly 11A then transports the empty tray 61 away.

[0057] In order to make the whole high and low temperature chip testing equipment operate more efficiently, preferably, the loading conveyor line assembly 2A, the pre-heating plate assembly 3A, the material boat assembly 5A, the defective plate assembly 9A, the material collection conveyor line assembly 8A and the empty material tray conveyor line assembly 11A are sequentially arranged around the table of the equipment body 1A. Among them, the loading robot arm assembly 4A is arranged between the loading conveyor line assembly 2A and the material boat assembly 5A and between the pre-heating plate assembly 3A and the material boat assembly 5A, so as to facilitate the transfer of the chips on the material tray 61 of the loading conveyor line assembly 2A to the pre-heating plate assembly 3A and the transfer of the chips on the pre-heating plate assembly 3A to the corresponding position of the loading robot arm assembly 4A on the material boat assembly 5A; the test arm assembly 6A is arranged above the material boat assembly 5A, so as to facilitate the removal of the chips on the material boat assembly 5A corresponding to the test arm assembly 6A position for testing and the placement of the tested chips back to the corresponding test arm assembly 6A position on the material boat assembly 5A; the unloading robot arm assembly 7A is arranged It is placed between the material boat assembly 5A and the receiving material conveyor line assembly 8A and between the defective tray assembly 9A and the receiving material conveyor line assembly 8A, so as to take out the chip corresponding to the workstation of the unloading manipulator assembly 7A on the material boat assembly 5A, and put the good chip on the material tray 61 of the receiving material conveyor line assembly 8A according to the test result of the test arm assembly 6A, and put the unqualified chip on the defective tray assembly 9A; the tray gripper assembly 10A is arranged between the feeding conveyor line assembly 2A and the empty material tray conveyor line assembly 11A, so as to facilitate the tray gripper assembly 10A to grab the empty material tray 61 on the feeding conveyor line assembly 2A and place the empty material tray 61 on the empty material tray conveyor line assembly 11A. With such a design, on the one hand, the chip testing and subpackaging can be fast flow-loaded in an assembly line style, improving the efficiency of chip testing and subpackaging; on the other hand, it can make the structure of the whole high and low temperature chip testing equipment more compact.

[0058] Specifically, the table top of the equipment body 1A is a rectangular table top, the loading conveyor line assembly 2A, the receiving conveyor line assembly 8A and the empty material tray conveyor line assembly 11A are located on one side of the rectangular table top and are arranged in sequence along the length direction, the material boat assembly 5A is located on the other side of the rectangular table top, the pre-heating tray assembly 3A is located at one end of the rectangular table top, the defective tray assembly 9A and the receiving conveyor line assembly 8A are located at the other end of the rectangular table top and are arranged in sequence along the width direction.

[0059] The high and low temperature chip testing equipment of this solution is used to test 32 chips at the same time. It can be understood that in other embodiments, it can also be designed to test 16 chips or 48 chips at the same time, which is not limited here.

[0060] See also Figure 2 In some embodiments, in order for the loading conveyor line assembly 2A to be able to transport the material tray 61 from the loading place to the loading robot assembly 4A for taking away, the loading conveyor line assembly 2A includes a loading conveyor line body 1 and a first driving assembly arranged on the loading conveyor line body 1, and a loading area 2 and a first working area 3 are provided on the loading conveyor line body 1, and the pre-warming tray assembly 3A is arranged close to the first working area 3. The worker places the material tray 61 with chips on the loading area 2, and the first driving assembly is used to transport the material tray 61 with chips on the loading area 2 to the first working area 3, and the loading robot assembly 4A is used to move the chips on the material tray 61 on the first working area 3 to the pre-warming tray assembly 3A.

[0061] Specifically, the loading conveyor line body 1 is a long frame structure, the loading area 2 and the first working area 3 are respectively located at the two ends of the length direction of the loading conveyor line body 1, and the material tray 61 moves from the loading area 2 to the first working area 3 along the length direction of the loading conveyor line body 1.

[0062] Further, in order for the first drive assembly to drive the material tray 61, the first drive assembly includes a first drive motor 4 and a first transmission belt 5. The first drive motor 4 is provided on the feeding conveyor line body 1, and the first transmission belt 5 is provided on the first drive motor 4. The first drive motor 4 is used to drive the first transmission belt 5, and the first transmission belt 5 is used to transport the material tray 61 in the feeding area 2 to the first working area 3. Specifically, the first drive motor 4 is provided at one end where the feeding area 2 is located, and there are two first transmission belts 5. The two first transmission belts 5 are respectively located on the two inner sides in the length direction of the feeding conveyor line body 1. During operation, the material tray 61 is directly placed on the two first transmission belts 5, and the two first transmission belts 5 drive the material tray 61 to move from the feeding area 2 to the first working area 3.

[0063] Furthermore, in order to ensure that the material tray 61 can be stabilized in the first working area 3 after being conveyed to the first working area 3, so as to facilitate the loading robot assembly 4A to take away the chip, the loading conveyor line assembly 2A also includes a first positioning cylinder 6, and the first positioning cylinder 6 is used to position the material tray 61 when the material tray 61 is transported to the first working area 3.

[0064] Furthermore, in order to prevent the material tray 61 from falling after continuing to move along the direction of the first transmission belt 5 after moving to the first working area 3, the loading conveyor line assembly 2A also includes a first limit member 7. The first limit member 7 is arranged at one end of the loading conveyor line body 1 where the first working area 3 is provided. The first limit member 7 is used to limit the movement of the material tray 61 along the movement direction of the first transmission belt 5.

[0065] See also Figure 3 In some embodiments, in order to preheat and precool the chip so that the chip reaches the high and low temperatures required for testing, the preheating plate assembly 3A includes a first heating component 8 with a cavity, a refrigerant tube 9 and a first chip positioning plate 10. The refrigerant tube 9 is connected to the cavity of the first heating component 8 and is used to provide refrigerant to the first heating component 8. The first chip positioning plate 10 is in contact with the first heating component 8. The first heating component 8 is used to heat the first chip positioning plate 10 to heat the chip, or to cool the first chip positioning plate 10 when the refrigerant tube 9 provides refrigerant to cool the chip. With such a design, the loading robot assembly 4A is used to take the chips on the material tray 61 on the first working area 3 and store them on the first chip positioning plate 10. During preheating, the first heating component 8 heats the first chip positioning plate 10 to a set high temperature, and the first chip positioning plate 10 then heats the chips. During precooling, the refrigerant pipe 9 passes refrigerant into the first heating component 8, and the first heating component 8 cools the first chip positioning plate 10 to a set low temperature, and the first chip positioning plate 10 then cools the chips, thereby allowing the chips to reach the high and low temperatures for testing.

[0066] Preferably, the first heating component 8 is a plate-like structure having the same shape and size as the first chip positioning plate 10, the first chip positioning plate 10 is arranged on the upper surface of the first heating component 8, and the refrigerant pipe 9 is connected to the side of the first heating component 8. With such a design, on the one hand, the contact area between the first chip positioning plate 10 and the first heating component 8 can be increased, thereby improving the heat exchange efficiency between the first chip positioning plate 10 and the first heating component 8, thereby improving the heating efficiency and cooling efficiency of the chip; on the other hand, the structure of the entire pre-warming plate assembly 3A can also be made more compact.

[0067] Among them, the number of chip placement positions on the first chip positioning plate 10 is much greater than 32, so that the first chip positioning plate 10 can place much greater than 32 chips, that is, the pre-heating plate assembly 3A can heat or cool much greater than 32 chips at the same time, thereby reducing energy consumption.

[0068] See also Figure 4 In some embodiments, in order for the loading robot assembly 4A to be able to transfer the chips on the material tray 61 of the loading conveyor line assembly 2A to the pre-heating tray assembly 3A, and to transfer the chips on the pre-heating tray assembly 3A to the workstation corresponding to the loading robot assembly 4A on the material boat assembly 5A, the loading robot assembly 4A includes a first robot arm 11, a second robot arm 12, a first lifting platform 13 and a first suction nozzle assembly, the second robot arm 12 is connected to the first robot arm 11, the first lifting platform 13 is arranged on the second robot arm 12, the first suction nozzle assembly is arranged on the first lifting platform 13, the first robot arm 11 drives the second robot arm 12 along a first horizontal direction (such as Figure 4 The second robot arm 12 drives the first lifting platform 13 to move along the second horizontal direction (as shown by the arrow x1 in the middle) to drive the first nozzle assembly to move along the first horizontal direction. Figure 4 The first lifting platform 13 drives the first suction nozzle assembly to move along the first vertical direction (as shown by the arrow x2 in the middle) to drive the first suction nozzle assembly to move along the second horizontal direction. Figure 4The second horizontal direction is different from the first horizontal direction. With such a design, when it is necessary to transport the chips on the material tray 61 of the loading conveyor line assembly 2A to the pre-heating tray assembly 3A, the first robot arm 11 drives the second robot arm 12 to move along the first horizontal direction and the second robot arm 12 drives the first lifting platform 13 to move along the second horizontal direction to move to the first working area 3 of the loading conveyor line assembly 2A. The first lifting platform 13 drives the first suction nozzle assembly to move along the first vertical direction and descend to the first working area 3 to absorb the chip, and drives the chip to lift, so as to move the second robot arm 12 and then drive the first lifting platform 13 to move in the opposite direction of the second horizontal direction to the pre-heating tray assembly 3A. The first lifting platform 13 drives the first suction nozzle assembly to descend along the first vertical direction to the pre-heating tray assembly. The chips are placed on the material tray 61 on 3A; when the chips on the pre-heating tray assembly 3A need to be transported to the workstation of the loading robot assembly 4A on the material boat assembly 5A, the first robot arm 11 drives the second robot to move along the first horizontal direction to the pre-heating tray assembly 3A, the first lifting platform 13 drives the first suction nozzle assembly to descend along the first vertical direction to the material tray 61 on the pre-heating tray assembly 3A to suck the chips and drive the chips to lift, the first robot arm 11 then drives the second robot arm 12 to move in the opposite direction of the first horizontal direction to the workstation of the loading robot assembly 4A on the material boat assembly 5A, the first lifting platform 13 then drives the first suction nozzle assembly to descend along the first vertical direction to the material tray 61 on the material boat assembly 5A to place the chips.

[0069] Specifically, the first robotic arm 11 is located at the outer edge of one end of the rectangular table top and is extended along the width direction of the rectangular table top, so that the first robotic arm 11 can drive the second robotic arm 12 to move along the width direction of the rectangular table top, that is, the first robotic arm 11 can drive the second robotic arm 12 to move between the loading conveyor line assembly 2A, the pre-heating plate assembly 3A and the material boat assembly 5A. The second robotic arm 12 is vertically connected to the first robotic arm 11 and is extended along the length direction of the rectangular table top, that is, the first lifting platform 13 can move between the loading conveyor line assembly 2A and the pre-heating plate assembly 3A and between the pre-heating plate assembly 3A and the material boat assembly 5A.

[0070] In addition, the second robot arm 12, the first lifting platform 13 and the first suction nozzle assembly are all located above the loading conveyor line assembly 2A, the pre-heating plate assembly 3A and the material boat assembly 5A, so that when the second robot arm 12, the first lifting platform 13 and the first suction nozzle assembly move relative to the first robot arm 11, they will not interfere with the loading conveyor line assembly 2A, the pre-heating plate assembly 3A and the material boat assembly 5A.

[0071] Furthermore, in order to realize the movement of the above-mentioned second robot arm 12 and the first lifting platform 13, the loading robot assembly 4A also includes a second drive assembly, a third drive assembly and a fourth drive assembly. The second drive assembly is arranged on the first robot arm 11 and is transmitted along the first horizontal direction to drive the second robot arm 12 to move along the first horizontal direction. The third drive assembly is arranged on the second robot arm 12 and is transmitted along the second horizontal direction to drive the first lifting platform 13 to move along the second horizontal direction. The fourth drive assembly is arranged on the first lifting platform 13 to drive the first suction nozzle assembly to move along the first vertical direction.

[0072] Furthermore, the second drive assembly includes a second transmission belt 15 and a second drive motor 16, the second drive motor 16 is arranged on the first robotic arm 11, the second transmission belt 15 is arranged on the second drive motor 16, and the second transmission belt 15 drives the second robotic arm 12 to move under the drive of the second drive motor 16, the third drive assembly includes a third transmission belt 17 and a third drive motor 18, the third drive motor 18 is arranged on the second robotic arm 12, the third transmission belt 17 is arranged on the third drive motor 18, and the third transmission belt 17 drives the first lifting platform 13 to move under the drive of the third drive motor 18, the fourth drive assembly includes a fourth transmission belt 19 and a fourth drive motor 20, the fourth drive motor 20 is arranged on the first lifting platform 13, the fourth transmission belt 19 is arranged on the fourth drive motor 20, and the fourth transmission belt 19 drives the first lifting platform 13 to move under the drive of the fourth drive motor 20.

[0073] As can be seen from the above, the constant high and low temperature chip testing equipment is used to test 32 chips simultaneously, and the first suction nozzle assembly includes 32 first suction nozzles 14, and one first suction nozzle 14 is used to suck one chip.

[0074] See also Figure 5 In some embodiments, in order for the material boat assembly 5A to be able to transport the chip at the corresponding station of the loading robot assembly 4A to the corresponding station of the test arm assembly 6A and to transport the chip at the corresponding station of the test arm assembly 6A to the corresponding station of the unloading robot assembly 7A, the material boat assembly 5A includes a material boat body 21 and a fifth drive assembly and a second chip positioning plate 24 arranged on the material boat body 21. The material boat body 21 is provided with a station corresponding to the loading robot assembly 4A, a station corresponding to the test arm assembly 6A and a station corresponding to the unloading robot assembly 7A. The fifth drive assembly is used to drive the second chip positioning plate 24 to move between the station corresponding to the loading robot assembly 4A, the station corresponding to the test arm assembly 6A and the station corresponding to the unloading robot assembly 7A.

[0075] Specifically, the material boat body 21 is located on the other side of the rectangular table top and extends along the length direction of the rectangular table top. The workstation corresponding to the loading robot assembly 4A, the workstation corresponding to the testing arm assembly 6A, and the workstation corresponding to the unloading robot assembly 7A are arranged from the direction close to one end of the pre-heating disk assembly 3A to the direction close to one end of the defective disk assembly 9A, so that the chips can flow in a straight line on the material boat assembly 5A.

[0076] Specifically, there are two second chip positioning plates 24, and the two second chip positioning plates 24 are arranged side by side. The second chip positioning plates 24 include two states under the drive of the fifth driving component: one state is that one of the second chip positioning plates 24 is located at the workstation corresponding to the loading robot component 4A and the other second chip positioning plate 24 corresponds to the workstation of the test arm component 6A. At this time, the loading robot component 4A transports the chip on the pre-heating plate component 3A to the workstation corresponding to the loading robot component 4A on the material boat component 5A, and the test arm component 6A transports the chip on the material boat component 5A to the workstation corresponding to the test arm component 6A. The chips taken out for testing at the workstation of the arm assembly 6A can be carried out simultaneously; another state is that one of the second chip positioning plates 24 is located at the workstation corresponding to the test arm assembly 6A and the other second chip positioning plate 24 corresponds to the workstation of the unloading robot assembly 7A. At this time, the test arm assembly 6A takes out the chips corresponding to the workstation of the test arm assembly 6A on the material boat assembly 5A for testing and the unloading robot assembly 7A takes out and classifies the chips corresponding to the workstation of the unloading robot assembly 7A on the material boat assembly 5A at the same time, thereby improving the detection and classification efficiency of the normal high and low temperature chip testing equipment.

[0077] As can be seen from the above, the normal high and low temperature chip testing equipment is used to test 32 chips simultaneously, and the two second chip positioning plates 24 are each provided with 32 chip placement positions.

[0078] Furthermore, in order for the fifth drive component to drive the second chip positioning plate 24, the fifth drive component includes a fifth transmission belt 22 and a fifth drive motor 23. The fifth drive motor 23 is arranged on the material ship body 21, and the fifth transmission belt 22 is arranged on the fifth drive motor 23. The fifth transmission belt 22 drives the second chip positioning plate 24 to move under the drive of the fifth drive motor 23.

[0079] See also Figures 6 to 8 In some embodiments, in order for the test arm assembly 6A to be able to take out the chip corresponding to the test arm assembly 6A position on the material boat assembly 5A for testing and put the tested chip back to the position corresponding to the test arm assembly 6A on the material boat assembly 5A, the test arm assembly 6A includes a test arm body 25 and a sixth drive assembly, a seventh drive assembly and a second suction nozzle assembly arranged on the test arm body 25. The sixth drive assembly is used to drive the second suction nozzle assembly along a third horizontal direction (such as Figure 6The seventh driving assembly is used to drive the second nozzle assembly to move along the second vertical direction (as shown by the arrow x3 in the middle). Figure 6 When such a design is adopted, the sixth drive assembly drives the second suction nozzle assembly to move along the third horizontal direction to above the workstation corresponding to the test arm assembly 6A on the material boat assembly 5A, the seventh drive assembly drives the second suction nozzle assembly to move along the second vertical direction to suck the chip on the second chip positioning plate 24 of the material boat assembly 5A, the seventh drive assembly drives the second suction nozzle assembly to move in the opposite direction of the second vertical direction to locate the chip in the test position, and after the chip test is completed, the seventh drive assembly drives the second suction nozzle assembly to move along the second vertical direction to place the chip on the second chip positioning plate 24 of the material boat assembly 5A.

[0080] Specifically, the test arm body 25 is mounted above the material boat assembly 5A, the sixth drive assembly and the seventh drive assembly are arranged on the top table of the test arm body 25, and the second suction nozzle assembly is arranged at the bottom of the test arm body 25 and above the material boat assembly 5A, so that the second suction nozzle assembly can test the chip. In addition, the first lifting platform 13 needs to transport the chips on the pre-heating plate assembly 3A to the material boat assembly 5A. Preferably, the second mechanical arm 12 extends to the bottom of the test arm body 25, so that the first lifting platform 13 can be moved to the bottom of the test arm body 25.

[0081] Furthermore, in order for the sixth drive assembly and the seventh drive assembly to drive the second suction nozzle assembly, the sixth drive assembly includes a sixth drive motor 26 and a sixth transmission screw 27. The sixth transmission screw 27 drives the second suction nozzle assembly to move along the third horizontal direction under the drive of the sixth drive motor 26. The seventh drive assembly includes a seventh drive motor 28 and a seventh transmission screw 29. The seventh transmission screw 29 drives the second suction nozzle assembly to move along the second vertical direction under the drive of the seventh drive motor 28.

[0082] Among them, the sixth drive assembly is a group, the seventh drive assembly and the second suction nozzle assembly are two groups, one group of the sixth drive assembly drives the two groups of the second suction nozzle assemblies to move along the third horizontal direction, and the two groups of the seventh drive assemblies respectively drive the two groups of the second suction nozzle assemblies to move along the second vertical direction.

[0083] From the above, it can be seen that the high and low temperature chip testing equipment is used to test 32 chips at the same time, and the second nozzle assembly is two groups, so the second nozzle assembly includes 16 second nozzles 30, one second nozzle 30 is used to suck one chip, and two groups of second nozzle assemblies can suck 32 chips.

[0084] Preferably, the second suction nozzle 30 is a flexible suction nozzle. With such a design, the pressure test can be performed by controlling the flexible suction nozzle, so that the chip test is subjected to more uniform force and higher accuracy.

[0085] See also Fig. 9 In some embodiments, in order for the unloading robot assembly 7A to be able to take out the chip corresponding to the unloading robot assembly 7A station on the material boat assembly 5A, and place the good chip on the material tray 61 of the receiving conveyor line assembly 8A according to the test result of the test arm assembly 6A, and place the unqualified chip on the defective tray assembly 9A, the unloading robot assembly 7A includes a third robot arm 31, a fourth robot arm 32, a second lifting platform 33 and a third suction nozzle assembly, the fourth robot arm 32 is connected to the third robot arm 31, the second lifting platform 33 is arranged on the fourth robot arm 32, the third suction nozzle assembly is arranged on the second lifting platform 33, and the third robot arm 31 drives the fourth robot arm 32 along a fourth horizontal direction (such as Fig. 9 The fourth robot arm 32 drives the second lifting platform 33 to move along the fifth horizontal direction (as shown by the arrow x4 in the middle) to drive the third suction nozzle assembly to move along the fourth horizontal direction. Fig. 9 The second lifting platform 33 drives the third nozzle assembly to move along the third vertical direction (as shown by the arrow x5 in the middle), so as to drive the third nozzle assembly to move along the fifth horizontal direction. Fig. 9 The fifth horizontal direction is different from the fourth horizontal direction. With such a design, when it is necessary to take out the chip from the workstation of the unloading robot assembly 7A on the material boat assembly 5A and place it on the material tray 61 of the receiving conveyor line assembly 8A, the second lifting platform 33 drives the third suction nozzle assembly to move down along the third vertical direction to the material boat assembly 5A to take out the chip and drive the chip to lift. The third robot arm 31 drives the fourth robot arm 32 to move along the fourth horizontal direction and the fourth robot arm 32 drives the second lifting platform 33 to move along the fifth horizontal direction to move to the receiving conveyor line assembly 8A. The second lifting platform 33 drives the third suction nozzle assembly to move down along the third vertical direction to take out the chip and drive the chip to lift. It moves in the vertical direction and descends to place the chip on the material tray 61 of the material receiving conveyor line assembly 8A; when it is necessary to take out the chip from the corresponding position of the unloading robot assembly 7A on the material boat assembly 5A and transport it to the defective tray assembly 9A, the second lifting platform 33 drives the third suction nozzle assembly to move along the third vertical direction and descend to the material boat assembly 5A to take out the chip, and drives the chip to be lifted, the third robot arm 31 drives the fourth robot to move along the fourth horizontal direction to the defective tray assembly 9A, and the second lifting platform 33 drives the third suction nozzle assembly to move along the third vertical direction and descend to place the chip on the defective tray assembly 9A.

[0086] Specifically, the third robotic arm 31 is located at the outer edge of the other end of the rectangular table top and is extended along the width direction of the rectangular table top, so that the third robotic arm 31 can drive the fourth robotic arm 32 to move along the width direction of the rectangular table top, that is, the third robotic arm 31 can drive the fourth robotic arm 32 to move between the material boat assembly 5A, the defective tray assembly 9A and the material receiving conveyor line assembly 8A. The fourth robotic arm 32 is vertically connected to the third robotic arm 31 and is extended along the length direction of the rectangular table top, that is, the second lifting platform 33 can move between the material boat assembly 5A and the defective tray assembly 9A and between the material boat assembly 5A and the material receiving conveyor line assembly 8A.

[0087] In addition, the fourth robot arm 32, the second lifting platform 33 and the third suction nozzle assembly are all located above the material boat assembly 5A, the defective tray assembly 9A and the material receiving conveyor line assembly 8A, so that when the fourth robot arm 32, the second lifting platform 33 and the third suction nozzle assembly move relative to the third robot arm 31, they will not interfere with the material boat assembly 5A, the defective tray assembly 9A and the material receiving conveyor line assembly 8A.

[0088] Furthermore, in order for the fourth robot arm 32 and the second lifting platform 33 to achieve the above-mentioned movement, the unloading robot assembly 7A also includes an eighth drive assembly, a ninth drive assembly and a tenth drive assembly. The eighth drive assembly is arranged on the third robot arm 31 and is transmitted along the fourth horizontal direction to drive the fourth robot arm 32 to move along the fourth horizontal direction. The ninth drive assembly is arranged on the fourth robot arm 32 and is transmitted along the fifth horizontal direction to drive the second lifting platform 33 to move along the fifth horizontal direction. The tenth drive assembly is arranged on the second lifting platform 33 to drive the third suction nozzle assembly to move along the third vertical direction.

[0089] Furthermore, the eighth drive assembly includes an eighth transmission belt 35 and an eighth drive motor 36, the eighth drive motor 36 is arranged on the third robotic arm 31, the eighth transmission belt 35 is arranged on the eighth drive motor 36, and the eighth transmission belt 35 drives the fourth robotic arm 32 to move under the drive of the eighth drive motor 36, the ninth drive assembly includes a ninth transmission belt 37 and a ninth drive motor 38, the ninth drive motor 38 is arranged on the fourth robotic arm 32, the ninth transmission belt 37 is arranged on the ninth drive motor 38, and the ninth transmission belt 37 drives the second lifting platform 33 to move under the drive of the ninth drive motor 38, and the tenth drive assembly includes a tenth transmission belt 39 and a tenth drive motor 40, the tenth drive motor 40 is arranged on the second lifting platform 33, the tenth transmission belt 39 is arranged on the tenth drive motor 40, and the tenth transmission belt 39 drives the second lifting platform 33 to move under the drive of the tenth drive motor 40.

[0090] As can be seen from the above, the constant high and low temperature chip testing equipment is used to test 32 chips simultaneously, and the third suction nozzle assembly includes 32 third suction nozzles 34, and one third suction nozzle 34 is used to suck one chip.

[0091] See also Fig.10 In some embodiments, in order for the receiving material conveyor line assembly 8A to be able to convey the material tray 61 from the material receiving place to the material receiving area for workers to take away, the receiving material conveyor line assembly 8A includes a receiving material conveyor line body 41 and an eleventh driving assembly arranged on the receiving material conveyor line body 41. The receiving material conveyor line body 41 is provided with a second working area 42 and a receiving material area 43. The second working area 42 is arranged close to the material boat assembly 5A. The unloading robot assembly 7A is used to place the good chips on the material tray 61 in the second working area 42. The eleventh driving assembly is used to convey the material tray 61 in the second working area 42 to the material receiving area 43, and the workers then take away the material tray 61 with the good chips.

[0092] Specifically, the receiving conveyor line body 41 is a long frame structure, the second working area 42 and the receiving area 43 are respectively located at the two ends of the length direction of the receiving conveyor line body 41, and the material tray 61 moves from the second working area 42 to the receiving area 43 along the length direction of the receiving conveyor line body 41.

[0093] Further, in order for the eleventh drive assembly to drive the material tray 61, the eleventh drive assembly includes an eleventh drive motor 44 and an eleventh transmission belt 45. The eleventh drive motor 44 is arranged on the receiving material conveying line main body 41, and the eleventh transmission belt 45 is arranged on the eleventh drive motor 44. The eleventh drive motor 44 is used to drive the eleventh transmission belt 45, and the eleventh transmission belt 45 is used to convey the material tray 61 in the second working area 42 to the receiving material area 43. Specifically, the eleventh drive motor 44 is arranged at one end where the receiving material area 43 is located, and there are two eleventh transmission belts 45. The two eleventh transmission belts 45 are respectively located at the two inner sides in the length direction of the receiving material conveying line main body 41. During operation, the material tray 61 is directly placed on the two eleventh transmission belts 45, and the two eleventh transmission belts 45 drive the material tray 61 to move from the second working area 42 to the receiving material area 43.

[0094] Furthermore, in order to ensure that the material tray 61 containing qualified chips can be stabilized in the second working area 42 after being placed in the second working area 42, the material receiving conveyor line assembly 8A also includes a second positioning cylinder 63, which is used to position the material tray 61 in the second working area 42.

[0095] See also Fig.11In some embodiments, considering that the number of unqualified chips is small, the defective tray assembly 9A includes multiple defective trays 46, and the multiple defective trays 46 are arranged side by side. With such a design, the defective tray assembly 9A is placed on one side of the material ship assembly 5A, and the unqualified chips are directly stored on the defective tray assembly 9A without being transferred. When there are multiple defective tray assemblies 9A, they can be stacked in sequence and then taken away together. In addition, the multiple defective trays 46 arranged side by side can increase the number of unqualified chips placed on the defective tray 46, without the need for workers to repeatedly take them away.

[0096] This embodiment uses the example that the defective tray assembly 9A includes three defective trays 46. It is understandable that in other implementations, the defective tray assembly 9A may also include two defective trays 46 or more than three defective trays 46, which is not limited here.

[0097] See also Fig.12 In some embodiments, in order for the tray gripper assembly 10A to be able to grab the empty tray 61 from which all chips have been taken from the loading conveyor line assembly 2A and transport it to the empty tray conveyor line assembly 11A, the tray gripper assembly 10A includes a fifth robotic arm 47, a sixth robotic arm 48, and an empty tray clamping component 49, the sixth robotic arm 48 is connected to the fifth robotic arm 47, the empty tray clamping component 49 is disposed on the sixth robotic arm 48, and the fifth robotic arm 47 drives the sixth robotic arm 48 to move along a sixth horizontal direction (such as Fig.12 The empty tray clamping member 49 moves along the sixth direction or along the fourth vertical direction (as shown by the arrow x6 in the middle) or moves along the fourth vertical direction to drive the empty tray clamping member 49 to move along the sixth direction or along the fourth vertical direction (as shown by the arrow x6 in the middle Fig.12 With such a design, when it is necessary to transport the empty tray 61 of the feeding conveyor line assembly 2A to the empty tray conveyor line assembly 11A, the fifth robot arm 47 drives the sixth robot arm 48 to move along the sixth horizontal direction to the feeding conveyor line assembly 2A, and the fifth robot arm 47 then drives the sixth robot arm 48 to move along the fourth vertical direction to the feeding conveyor line assembly 2A to take away the empty tray 61, and the fifth robot arm 47 then drives the sixth robot arm 48 to move in the opposite direction of the fourth vertical direction, and drives the sixth robot arm 48 to move in the opposite direction of the sixth horizontal direction to the empty tray conveyor line assembly 11A, and finally the fifth robot arm 47 drives the sixth robot arm 48 to move along the fourth vertical direction to put down the empty tray 61 on the feeding conveyor line assembly 2A.

[0098] Specifically, the fifth robotic arm 47 is located at the outer edge of one side of the rectangular table top and is extended along the length direction of the rectangular table top, so that the fifth robotic arm 47 can drive the sixth robotic arm 48 to move along the length direction of the rectangular table top, that is, the fifth robotic arm 47 can drive the sixth robotic arm 48 to move between the loading conveyor line assembly 2A and the empty material tray conveyor line assembly 11A. The fourth robotic arm 32 is vertically connected to the third robotic arm 31 and is extended along the width direction of the rectangular table top, that is, the empty material tray clamping component 49 can move between the loading conveyor line assembly 2A and the empty material tray conveyor line assembly 11A.

[0099] In addition, the sixth robotic arm 48 and the empty tray clamping component 49 are both located above the loading conveyor line assembly 2A and the empty tray conveyor line assembly 11A, so that when the sixth robotic arm 48 and the empty tray clamping component 49 move relative to the fifth robotic arm 47, they will not interfere with the loading conveyor line assembly 2A and the empty tray conveyor line assembly 11A.

[0100] Furthermore, in order for the fifth robotic arm 47 to be able to drive the sixth robotic arm 48 to move, the tray gripper assembly 10A also includes a twelfth drive assembly and a thirteenth drive assembly. The twelfth drive assembly is disposed on the fifth robotic arm 47 and moves along the sixth horizontal direction to drive the sixth robotic arm 48 to move along the sixth horizontal direction. The thirteenth drive assembly is disposed on the fifth robotic arm 47 and moves along the fourth vertical direction.

[0101] Furthermore, the twelfth drive assembly includes a twelfth transmission belt 52 and a twelfth drive motor 53, the twelfth drive motor 53 is arranged on the fifth robotic arm 47, the twelfth transmission belt 52 is arranged on the twelfth drive motor 53, and the twelfth transmission belt 52 drives the sixth robotic arm 48 to move along the sixth horizontal direction under the drive of the twelfth drive motor 53, and the thirteenth drive assembly includes a thirteenth transmission screw 54 and a thirteenth drive motor 55, the thirteenth drive motor 55 is arranged on the fifth robotic arm 47, the thirteenth transmission screw 54 is arranged on the thirteenth drive motor 55, and the thirteenth transmission screw 54 drives the sixth robotic arm 48 to move along the fourth vertical direction under the drive of the thirteenth drive motor 55.

[0102] In order to better grasp the empty tray 61, the empty tray clamping component 49 includes an empty tray clamping body 62, a clamping cylinder 50 and a tray clamping hand 51. The empty tray clamping body 62 is arranged on the sixth mechanical arm 48. The clamping cylinder 50 and the tray clamping hand 51 are both arranged on the empty tray clamping body 62. The tray clamping hand 51 clamps the empty tray 61 under the drive of the clamping cylinder 50. Specifically, the empty tray clamping body 62 is a plate-like structure whose size is adapted to the empty tray 61. The top of the empty tray clamping body 62 is connected to the sixth mechanical arm 48. The clamping cylinder 50 is arranged on the top of the empty tray clamping body 62. There are two tray clamping hands 51. The two tray clamping hands 51 are respectively arranged at the two ends of the empty tray clamping body 62. Under the drive of the clamping cylinder 50, the two tray clamping hands 51 clamp the tray 61.

[0103] See also Fig.13 In some embodiments, in order for the empty tray conveyor line assembly 11A to be able to convey the empty tray 61 from the collection location to a place for workers to take away, the empty tray conveyor line assembly 11A includes an empty tray conveyor line body 56 and a fourteenth drive assembly arranged on the empty tray conveyor line body 56. The empty tray conveyor line body 56 is provided with a third working area 57 and an empty tray area 58. The tray gripper assembly 10A is used to grab the empty tray 61 from which the chips have been taken from the loading conveyor line assembly 2A and transport it to the third working area 57 of the empty tray conveyor line assembly 11A. The fourteenth drive assembly is used to transport the empty tray 61 in the third working area 57 to the empty tray area 58.

[0104] Specifically, the main body 56 of the empty material tray conveyor line is a long frame structure, the third working area 57 and the empty material tray area 58 are respectively located at the two ends of the length direction of the main body 56 of the empty material tray conveyor line, and the material tray 61 moves from the third working area 57 to the empty material tray area 58 along the length direction of the main body 56 of the empty material tray conveyor line.

[0105] Further, the fourteenth drive assembly includes a fourteenth drive motor 59 and a fourteenth transmission belt 60. The fourteenth drive motor 59 is disposed on the main body 56 of the empty material tray conveyor line, and the fourteenth transmission belt 60 is disposed on the fourteenth drive motor 59. The fourteenth drive motor 59 is used to drive the fourteenth transmission belt 60, and the fourteenth transmission belt 60 is used to convey the empty material tray 61 in the third working area 57 to the empty material tray receiving area 58. Specifically, the fourteenth drive motor 59 is disposed at one end of the empty material tray receiving area 58, and there are two fourteenth transmission belts 60. The two fourteenth transmission belts 60 are respectively located on the two inner sides of the length direction of the main body 56 of the empty material tray conveyor line. During operation, the material tray 61 is directly placed on the two fourteenth transmission belts 60, and the two fourteenth transmission belts 60 drive the material tray 61 to move from the third working area 57 to the empty material tray receiving area 58.

[0106] See also Figures 14 to 17In some embodiments, the device body 1A includes a bracket 01 and a support plate 02 disposed on the bracket 01, and the pre-heating plate assembly 3A, the loading manipulator assembly 4A, the material boat assembly 5A, the test arm assembly 6A and the unloading manipulator assembly 7A are all disposed on the support plate 02. Considering that the temperature of the pre-heating plate assembly 3A, the material boat assembly 5A and the test arm assembly 6A is lower than the outside during operation, in order to avoid the pre-heating plate assembly 3A, the material boat assembly 5A and the test arm assembly 6A transferring the temperature to the support plate 02, resulting in the support plate 02 being too low in temperature and condensing dew when in contact with the outside, a second heating component 03 is disposed on the support plate 02, and the second heating component 03 is used to heat the support plate 02. With such a design, the second heating component 03 can provide a heat source to offset the heat loss at the support plate 02, thereby avoiding external condensation.

[0107] Furthermore, the second heating component 03 includes a first heating pad 031, a second heating pad 032 and a third heating pad 033. The first heating pad 031 is arranged on the lower surface of the support plate 02 at a position corresponding to the pre-heating plate assembly 3A, the second heating pad 032 is arranged on the lower surface of the support plate 02 at a position corresponding to the material boat assembly 5A, and the third heating pad 033 is arranged on the lower surface of the support plate 02 at a position corresponding to the test arm assembly 6A. With such a design, the heating pad is directly arranged corresponding to the component with a lower temperature, which can better supplement the temperature of the support plate 02 and prevent the low temperature from being transmitted to other areas.

[0108] Furthermore, considering that if there are gaps between the first heating pad 031, the second heating pad 032 and the third heating pad 033 and the support plate 02, the heating pads may easily be damaged by burning out, preferably, the first heating pad 031, the second heating pad 032 and the third heating pad 033 are pressed onto the support plate 02 by the first pressing plate, the second pressing plate and the third pressing plate respectively, so as to avoid gaps between the heating pads and the support plate 02.

[0109] Furthermore, temperature detection sensors are provided on the first heating pad 031, the second heating pad 032 and the third heating pad 033. With such a design, the temperatures of the first heating pad 031, the second heating pad 032 and the third heating pad 033 can be controlled by the temperature detection sensors, thereby meeting different usage requirements.

[0110] In some embodiments, the normal high and low temperature chip testing equipment also includes a shell 12A that is covered outside the pre-heating plate assembly 3A, the loading manipulator assembly 4A, the material boat assembly 5A, the test arm assembly 6A, and the unloading manipulator assembly 7A, and the shell 12A includes a first inner layer 13A and a first outer layer 14A, and a first heat-insulating space is formed between the first inner layer 13A and the first outer layer 14A. With such a design, the first inner layer 13A is in direct contact with the internal space of the equipment, the first outer layer 14A is in direct contact with the external space of the equipment, and there is a hollow heat-insulating space between the first inner layer 13A and the first outer layer 14A, which effectively isolates the temperature of the first inner layer 13A from being transmitted to the first outer layer 14A, thereby avoiding condensation on the outer layer.

[0111] Preferably, the contact surface of the first inner layer 13A that contacts the interior of the equipment space is covered with a heat insulating material to better insulate the temperature.

[0112] In some embodiments, the outer shell 12A is provided with a heat dissipation channel 15A that runs through the first inner layer 13A and the first outer layer 14A, and the outer shell 12A is provided with a first sealing door 16A, which is movably arranged outside the first outer layer 14A and can be moved to open or close the heat dissipation channel 15A. With such a design, when sealing is required at low temperatures, the first sealing door 16A can be closed to close the heat dissipation channel 15A; when heat dissipation is required at high temperatures, the first sealing door 16A can be opened to open the heat dissipation channel 15A for heat dissipation, thereby ensuring that both sealing at low temperatures and heat dissipation at high temperatures are taken into account.

[0113] Furthermore, an exhaust fan is provided in the heat dissipation channel 15A, which can achieve the effect of actively extracting air and dissipating heat when turned on.

[0114] In some embodiments, the housing 12A is provided with a safety door 17A, which includes a second inner layer and a second outer layer, and a second heat-insulating space is formed between the second inner layer and the second outer layer. With such a design, there is also a hollow heat-insulating space between the inner and outer layers to prevent the internal low temperature from being transferred from the inner layer to the outer layer.

[0115] The second inner layer and the second outer layer of the safety door 17A are both made of transparent materials, so that the operation inside the equipment can be clearly observed even when it is closed.

[0116] See also Figures 18 to 22In some embodiments, in order to solve the problem of frost condensation during low-temperature testing, a first partition layer 18A and a second partition layer 21A are arranged in an alternate manner in the shell 12A. The first partition layer 18A and the second partition layer 21A divide the inner cavity of the shell 12A into a loading cavity 24A, a test cavity 25A and a unloading cavity 26A. The loading conveyor line assembly 2A and the pre-warming plate assembly 3A are both located in the loading cavity 24A. The loading manipulator assembly 4A passes through the loading cavity 24A and the test cavity 25A. The material boat assembly 5A and the test arm assembly 6A are both located in the test cavity 25A. The unloading manipulator assembly Component 7A passes through the test chamber 25A and the unloading chamber 26A, the receiving conveyor line assembly 8A and the defective tray assembly 9A are both located in the unloading chamber 26A, the loading chamber 24A is provided with at least one first dry air inlet, and the loading chamber 24A is filled with dry air to form a high-pressure area, the first partition layer 18A is provided with a first through hole that can connect the loading chamber 24A and the test chamber 25A, and the first through hole is provided for the loading robot assembly 4A to move, and the second partition layer 21A is provided with a second through hole that can connect the test chamber 25A and the unloading chamber 26A, and the second through hole is provided for the unloading robot assembly 7A to move. The inner cavity of the shell 12A is divided into three relatively independent areas, namely, a loading cavity 24A, a test cavity 25A and a lower cavity 26A. A large number of first dry air inlets are arranged on the inner wall surface of the loading cavity 24A. After the dry air is filled in, the pressure in the loading cavity 24A rises to form a high-pressure area. By utilizing the pressure difference among the loading cavity 24A, the test cavity 25A and the lower cavity 26A, the dry air can be accelerated to flow toward the test cavity 25A and the lower cavity 26A in a directional manner and finally discharged out of the equipment, thereby reducing the drying time of the equipment and ensuring the drying effect of the equipment.

[0117] In some embodiments, the first partition layer 18A is provided with a second sealing door 19A for opening and closing the first through hole and a first power mechanism 20A for controlling the opening and closing of the second sealing door 19A. When the second sealing door 19A closes the first through hole, the dry air filled into the loading chamber 24A can quickly fill the entire loading chamber 24A, forming a high pressure. At this time, the pressure difference between the loading chamber 24A and the test chamber 25A is large. Then, the first power mechanism 20A drives the second sealing door 19A to open the first through hole, and the dry air in the loading chamber 24A can quickly enter the test chamber 25A through the first through hole until the test chamber 25A is filled, so that a high pressure is also formed in the test chamber 25A.

[0118] Further, the first power mechanism 20A includes a first cylinder or a first electric screw or a first electric pulley. Preferably, the first power mechanism 20A is a first cylinder, and the output end of the first cylinder is connected to the second sealing door 19A, so that the first cylinder can drive the second sealing door 19A to move.

[0119] Specifically, the second sealing door 19A can be a whole door, and the first through hole can be opened and closed by driving the second sealing door 19A to move through a first cylinder; the second sealing door 19A can also be composed of multiple first sealing plates, and each first sealing plate is driven separately by multiple first cylinders. The shape of each first sealing plate can be the same or different, and the driving direction of each first cylinder can be the same or different.

[0120] In some embodiments, the second partition layer 21A is provided with a third sealing door 22A for opening and closing the second through hole and a second power mechanism 23A for controlling the opening and closing of the third sealing door 22A. When the third sealing door 22A closes the second through hole, the dry air entering the test cavity 25A can quickly fill the entire test cavity 25A, so that it also forms a high-pressure cavity, and then the third sealing door 22A is driven by the second power mechanism 23A to open the second through hole. By using the pressure difference between the test cavity 25A and the feeding cavity 26A, the dry air in the test cavity 25A can quickly enter the feeding cavity 26A through the second through hole, thereby achieving the effect of equipment drying and improving the drying efficiency.

[0121] Further, the second power mechanism 23A includes a second cylinder or a second electric screw or a second electric pulley. Preferably, the second power mechanism 23A is a second cylinder, and the output end of the second cylinder is connected to the third sealing door 22A, so that the second cylinder can drive the third sealing door 22A to move.

[0122] Specifically, the third sealing door 22A can be a whole door, and the second through hole can be opened and closed by driving the third sealing door 22A to move through a second cylinder; Fig. 22 The third sealing door 22A may also be composed of a plurality of second sealing plates, each of which is driven by a plurality of second cylinders. The shape of each second sealing plate may be the same or different, and the driving direction of each second cylinder may be the same or different.

[0123] In some embodiments, at least one second dry air inlet is provided in the test chamber 25A, and the number of the second dry air inlets is less than the number of the first dry air inlets. Most of the dry air in the test chamber 25A flows in from the dry air in the loading chamber 24A. When the dew point of the dry air rises after passing through the loading chamber 24A, a small amount of dry air is filled into the test chamber 25A through the second dry air inlet, so that the dry air flowing out of the loading chamber 24A can be compensated to a certain extent in the test chamber 25A, so that the dew point drops again and the dryness is guaranteed.

[0124] Optionally, a small number of third dry air inlets are provided on the feeding chamber 26A, and the number of the third dry air inlets is smaller than the number of the second dry air inlets, which is conducive to forming a pressure difference between the test chamber 25A and the feeding chamber 26A.

[0125] It should be noted that the first dry air inlet, the second dry air inlet and the third dry air inlet are all micropores capable of blowing dry air, and are respectively distributed on the inner walls around the upper material chamber 24A, the test chamber 25A and the lower material chamber 26A. The first dry air inlet, the second dry air inlet and the third dry air inlet are all connected to the air pipe to blow dry air into the equipment.

[0126] In some embodiments, the lower material chamber 26A is provided with an exhaust port capable of exhausting gas to the outside. Compared with the upper material chamber 24A and the test chamber 25A, the lower material chamber 26A is a low-pressure area, but in fact, part of the dry gas is also filled into the lower material chamber 26A, so that the pressure in the lower material chamber 26A is greater than the atmospheric pressure outside the sorting machine, and there is a pressure difference between the lower material chamber 26A and the external environment, and the gas in the lower material chamber 26A can be discharged to the external environment from the exhaust port.

[0127] In some embodiments, a first low-temperature structure is provided in the feeding chamber 24A for reducing the internal temperature of the feeding chamber 24A. The first low-temperature structure is arranged in the feeding chamber 24A, and the feeding chamber 24A is a high-pressure area, and air in other areas is not easy to enter the feeding chamber 24A, which can ensure the dryness in the feeding chamber 24A and ensure that no frost will occur.

[0128] Similarly, a second low-temperature structure for reducing the internal temperature of the test chamber 25A is provided in the test chamber 25A. After the dry air enters the test chamber 25A, the pressure in the test chamber 25A also rises, making the pressure in the test chamber 25A greater than the pressure in the feeding chamber 26A. The air in the feeding chamber 26A is not easy to enter the test chamber 25A, which can ensure the dryness in the test chamber 25A. The second low-temperature structure is arranged in the test chamber 25A to ensure that it will not frost. The normal temperature structure is provided in the feeding chamber 26A, which can effectively improve the drying speed of the equipment.

[0129] In some embodiments, there is a first gap between the first partition layer 18A and the housing 12A, and there is a second gap between the second partition layer 21A and the housing 12A, and the dry air in the upper material chamber 24A can enter the test chamber 25A from the first gap, and the dry air in the test chamber 25A can enter the lower material chamber 26A from the second gap. It should be noted that the first gap and the second gap are both tiny gaps that can only allow a small amount of dry gas to pass through. In this case, most of the dry air between the chambers still flows through the first through hole and the second through hole, and only a small amount of dry air flows through the first gap and the second gap.

[0130] The present invention provides a normal high and low temperature chip testing device, comprising a device body 1A and a preheating plate assembly 3A, a loading robot assembly 4A, a material boat assembly 5A, a test arm assembly 6A and a unloading robot assembly 7A arranged on the device body 1A. The loading robot assembly 4A is used to transport chips at normal temperature to the workstation corresponding to the loading robot assembly 4A on the material boat assembly 5A, or to transport chips at normal temperature to the preheating plate assembly 3A. The preheating plate assembly 3A preheats the chips to high-temperature chips or precools the chips to low-temperature chips. The loading robot assembly 4A is also used to transport high-temperature chips or low-temperature chips on the preheating plate assembly 3A to the workstation corresponding to the loading robot assembly 4A. To the station of the loading robot assembly 4A on the material boat assembly 5A, the material boat assembly 5A is used to transport the chip corresponding to the station of the loading robot assembly 4A to the station of the corresponding test arm assembly 6A and to transport the chip corresponding to the station of the test arm assembly 6A to the station of the corresponding unloading robot assembly 7A, the test arm assembly 6A is used to take out the chip corresponding to the station of the test arm assembly 6A on the material boat assembly 5A for testing and put the tested chip back to the station of the corresponding test arm assembly 6A on the material boat assembly 5A, and the unloading robot assembly 7A is used to take out the chip corresponding to the station of the unloading robot assembly 7A on the material boat assembly 5A. With such a design, the high and low temperature chip testing equipment can automatically realize the preheating and precooling of the chip, the normal temperature, high temperature and low temperature testing of the chip, and the removal of the chip after the test, thereby improving the degree of automation, reducing the work intensity of workers, and improving production efficiency.

[0131] The above is a detailed introduction to a kind of normally high and low temperature chip testing equipment disclosed in the embodiment of the present invention. This article uses individual examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the normally high and low temperature chip testing equipment of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A high and low temperature chip testing device, characterized in that: The invention comprises an equipment body (1A) and a preheating plate assembly (3A), a loading robot assembly (4A), a material boat assembly (5A), a test arm assembly (6A) and a unloading robot assembly (7A) arranged on the equipment body (1A). The loading robot assembly (4A) is used to transport chips at room temperature to a workstation on the material boat assembly (5A) corresponding to the loading robot assembly (4A), or to transport chips at room temperature to the preheating plate assembly (3A). The preheating plate assembly (3A) preheats the chips to high-temperature chips or precools the chips to low-temperature chips. The loading robot assembly (4A) is also used to transport high-temperature chips or low-temperature chips on the preheating plate assembly (3A) to the material boat assembly (5A) corresponding to the loading robot assembly (7A). The material boat assembly (5A) is used to transport the chip corresponding to the station of the loading robot assembly (4A) to the station corresponding to the test arm assembly (6A) and to transport the chip corresponding to the station of the test arm assembly (6A) to the station corresponding to the unloading robot assembly (7A). The test arm assembly (6A) is used to take out the chip corresponding to the station of the test arm assembly (6A) on the material boat assembly (5A) for testing and put the tested chip back to the station corresponding to the test arm assembly (6A) on the material boat assembly (5A). The unloading robot assembly (7A) is used to take out the chip corresponding to the station of the unloading robot assembly (7A) on the material boat assembly (5A).

2. The high and low temperature chip testing equipment according to claim 1, characterized in that: The pre-warming plate assembly (3A) comprises a first heating component (8) having a cavity, a refrigerant tube (9) and a first chip positioning plate (10), wherein the refrigerant tube (9) is connected to the cavity of the first heating component (8) and is used to provide refrigerant to the first heating component (8), the first chip positioning plate (10) is in contact with the first heating component (8), and the first heating component (8) is used to heat the first chip positioning plate (10), or, is used to cool the first chip positioning plate (10) when the refrigerant tube (9) provides refrigerant.

3. The high and low temperature chip testing equipment according to claim 2, characterized in that: The first heating component (8) is a plate-like structure having a shape and size consistent with that of the first chip positioning plate (10); the first chip positioning plate (10) is arranged on the upper surface of the first heating component (8); and the refrigerant pipe (9) is connected to the side of the first heating component (8).

4. The high and low temperature chip testing equipment according to claim 1, characterized in that: The loading robot assembly (4A) comprises a first robot arm (11), a second robot arm (12), a first lifting platform (13) and a first suction nozzle assembly, wherein the second robot arm (12) is connected to the first robot arm (11), the first lifting platform (13) is arranged on the second robot arm (12), the first suction nozzle assembly is arranged on the first lifting platform (13), the first robot arm (11) drives the second robot arm (12) to move along a first horizontal direction, so as to drive the first suction nozzle assembly to move along the first horizontal direction, the second robot arm (12) drives the first lifting platform (13) to move along a second horizontal direction, so as to drive the first suction nozzle assembly to move along the second horizontal direction, and the first lifting platform (13) drives the first suction nozzle assembly to move along a first vertical direction; The second horizontal direction is different from the first horizontal direction.

5. The high and low temperature chip testing equipment according to claim 4, characterized in that: The loading robot assembly (4A) further includes a second drive assembly, a third drive assembly and a fourth drive assembly, wherein the second drive assembly is arranged on the first robot arm (11) and is transmitted along the first horizontal direction to drive the second robot arm (12) to move along the first horizontal direction, the third drive assembly is arranged on the second robot arm (12) and is transmitted along the second horizontal direction to drive the first lifting platform (13) to move along the second horizontal direction, and the fourth drive assembly is arranged on the first lifting platform (13) to drive the first suction nozzle assembly to move along the first vertical direction.

6. The high and low temperature chip testing equipment according to claim 5, characterized in that: The second driving assembly comprises a second transmission belt (15) and a second driving motor (16); the second driving motor (16) is arranged on the first mechanical arm (11); the second transmission belt (15) is arranged on the second driving motor (16); the second transmission belt (15) drives the second mechanical arm (12) to move under the drive of the second driving motor (16); the third driving assembly comprises a third transmission belt (17) and a third driving motor (18); the third driving motor (18) is arranged on the second mechanical arm (12); the third transmission belt (17) is driven by the second driving motor (16); The belt (17) is arranged on the third drive motor (18), and the third transmission belt (17) drives the first lifting platform (13) to move under the drive of the third drive motor (18). The fourth drive component comprises a fourth transmission belt (19) and a fourth drive motor (20), and the fourth drive motor (20) is arranged on the first lifting platform (13). The fourth transmission belt (19) is arranged on the fourth drive motor (20), and the fourth transmission belt (19) drives the first lifting platform (13) to move under the drive of the fourth drive motor (20).

7. The high and low temperature chip testing equipment according to claim 1, characterized in that: The material boat assembly (5A) comprises a material boat body (21) and a fifth drive assembly and a second chip positioning plate (24) arranged on the material boat body (21); the material boat body (21) is provided with a station corresponding to the loading robot assembly (4A), a station corresponding to the test arm assembly (6A) and a station corresponding to the unloading robot assembly (7A); the fifth drive assembly is used to drive the second chip positioning plate (24) to move between the station corresponding to the loading robot assembly (4A), the station corresponding to the test arm assembly (6A) and the station corresponding to the unloading robot assembly (7A).

8. The high and low temperature chip testing equipment according to claim 7, characterized in that: The fifth driving assembly comprises a fifth transmission belt (22) and a fifth driving motor (23); the fifth driving motor (23) is arranged on the material ship body (21); the fifth transmission belt (22) is arranged on the fifth driving motor (23); the fifth transmission belt (22) drives the second chip positioning plate (24) to move under the drive of the fifth driving motor (23).

9. The high and low temperature chip testing equipment according to claim 1, characterized in that: The test arm assembly (6A) includes a test arm body (25) and a sixth drive assembly, a seventh drive assembly and a second suction nozzle assembly arranged on the test arm body (25), the sixth drive assembly being used to drive the second suction nozzle assembly to move along a third horizontal direction, and the seventh drive assembly being used to drive the second suction nozzle assembly to move along a second vertical direction.

10. The normal high and low temperature chip testing equipment according to claim 9, characterized in that: The sixth drive assembly includes a sixth drive motor (26) and a sixth transmission screw (27), and the sixth transmission screw (27) drives the second suction nozzle assembly to move along the third horizontal direction under the drive of the sixth drive motor (26). The seventh drive assembly includes a seventh drive motor (28) and a seventh transmission screw (29), and the seventh transmission screw (29) drives the second suction nozzle assembly to move along the second vertical direction under the drive of the seventh drive motor (28).

11. The high and low temperature chip testing equipment according to claim 9, characterized in that: The sixth drive assembly is a group, and the seventh drive assembly and the second suction nozzle assembly are two groups. One group of the sixth drive assembly drives two groups of the second suction nozzle assemblies to move along the third horizontal direction, and two groups of the seventh drive assemblies respectively drive two groups of the second suction nozzle assemblies to move along the second vertical direction.

12. The high and low temperature chip testing equipment according to claim 1, characterized in that: The unloading robot assembly (7A) comprises a third robot arm (31), a fourth robot arm (32), a second lifting platform (33) and a third suction nozzle assembly, wherein the fourth robot arm (32) is connected to the third robot arm (31), the second lifting platform (33) is arranged on the fourth robot arm (32), the third suction nozzle assembly is arranged on the second lifting platform (33), the third robot arm (31) drives the fourth robot arm (32) to move along a fourth horizontal direction, so as to drive the third suction nozzle assembly to move along the fourth horizontal direction, the fourth robot arm (32) drives the second lifting platform (33) to move along a fifth horizontal direction, so as to drive the third suction nozzle assembly to move along the fifth horizontal direction, and the second lifting platform (33) drives the third suction nozzle assembly to move along a third vertical direction; The fifth horizontal direction is different from the fourth horizontal direction.

13. The high and low temperature chip testing equipment according to claim 12, characterized in that: The unloading robot assembly (7A) also includes an eighth drive assembly, a ninth drive assembly and a tenth drive assembly, wherein the eighth drive assembly is arranged on the third robot arm (31) and is transmitted along the fourth horizontal direction to drive the fourth robot arm (32) to move along the fourth horizontal direction, the ninth drive assembly is arranged on the fourth robot arm (32) and is transmitted along the fifth horizontal direction to drive the second lifting platform (33) to move along the fifth horizontal direction, and the tenth drive assembly is arranged on the second lifting platform (33) to drive the third suction nozzle assembly to move along the third vertical direction.

14. The normal high and low temperature chip testing equipment according to claim 13, characterized in that: The eighth driving assembly comprises an eighth transmission belt (35) and an eighth driving motor (36), wherein the eighth driving motor (36) is arranged on the third mechanical arm (31), the eighth transmission belt (35) is arranged on the eighth driving motor (36), and the eighth transmission belt (35) drives the fourth mechanical arm (32) to move under the drive of the eighth driving motor (36), and the ninth driving assembly comprises a ninth transmission belt (37) and a ninth driving motor (38), wherein the ninth driving motor (38) is arranged on the fourth mechanical arm (32), and the ninth transmission belt (37) drives the fourth mechanical arm (32) to move. The belt (37) is arranged on the ninth driving motor (38), and the ninth driving belt (37) drives the second lifting platform (33) to move under the drive of the ninth driving motor (38). The tenth driving component comprises a tenth driving belt (39) and a tenth driving motor (40), and the tenth driving motor (40) is arranged on the second lifting platform (33). The tenth driving belt (39) is arranged on the tenth driving motor (40), and the tenth driving belt (39) drives the second lifting platform (33) to move under the drive of the tenth driving motor (40).

15. The normal high and low temperature chip testing equipment according to any one of claims 1 to 14, characterized in that: The normal high and low temperature chip testing equipment further comprises a loading conveyor line assembly (2A), wherein the loading conveyor line assembly (2A) is used to convey a tray (61) containing chips at normal temperature, and the loading robot assembly (4A) is used to transport the chips on the tray (61) of the loading conveyor line assembly (2A) to the pre-warming tray assembly (3A).

16. The normal high and low temperature chip testing equipment according to claim 15, characterized in that: The loading conveyor line assembly (2A) comprises a loading conveyor line body (1) and a first drive assembly arranged on the loading conveyor line body (1); the loading conveyor line body (1) is provided with a loading area (2) and a first working area (3); the pre-warming plate assembly (3A) is arranged close to the first working area (3); the first drive assembly is used to transport the material tray (61) of the loading area (2) to the first working area (3); and the loading robot assembly (4A) is used to transport the chips on the material tray (61) on the first working area (3) to the pre-warming plate assembly (3A).

17. The normal high and low temperature chip testing equipment according to claim 16, characterized in that: The first drive assembly comprises a first drive motor (4) and a first transmission belt (5); the first drive motor (4) is arranged on the feeding conveyor line body (1); the first transmission belt (5) is arranged on the first drive motor (4); the first drive motor (4) is used to drive the first transmission belt (5); and the first transmission belt (5) is used to transport the material tray (61) of the feeding area (2) to the first working area (3).

18. The high and low temperature chip testing equipment according to claim 17, characterized in that: The loading conveyor line assembly (2A) further comprises a first positioning cylinder (6), wherein the first positioning cylinder (6) is used to position the material tray (61) when the material tray (61) is transported to the first working area (3).

19. The high and low temperature chip testing equipment according to claim 17, characterized in that: The feeding conveyor line assembly (2A) further comprises a first position-limiting member (7), the first position-limiting member (7) being arranged at one end of the feeding conveyor line body (1) where a first working area (3) is arranged, the first position-limiting member (7) being used to limit the movement of the material tray (61) along the movement direction of the first transmission belt (5).

20. The normal high and low temperature chip testing equipment according to any one of claims 1 to 14, characterized in that: The normal high and low temperature chip testing equipment also includes a receiving conveyor line assembly (8A) and a defective tray assembly (9A), and the unloading robot assembly (7A) is used to place good chips on the tray (61) of the receiving conveyor line assembly (8A) according to the test results of the test arm assembly (6A), and to place unqualified chips on the defective tray assembly (9A).

21. The high and low temperature chip testing equipment according to claim 20, characterized in that: The receiving conveyor line assembly (8A) comprises a receiving conveyor line body (41) and an eleventh drive assembly arranged on the receiving conveyor line body (41); the receiving conveyor line body (41) is provided with a second working area (42) and a receiving area (43); the second working area (42) is arranged close to the material boat assembly (5A); the unloading robot assembly (7A) is used to place good chips on the material tray (61) of the second working area (42); and the eleventh drive assembly is used to transport the material tray (61) of the second working area (42) to the receiving area (43).

22. The high and low temperature chip testing equipment according to claim 21, characterized in that: The eleventh driving component comprises an eleventh driving motor (44) and an eleventh transmission belt (45); the eleventh driving motor (44) is arranged on the material receiving and conveying line body (41); the eleventh transmission belt (45) is arranged on the eleventh driving motor (44); the eleventh driving motor (44) is used to drive the eleventh transmission belt (45); and the eleventh transmission belt (45) is used to convey the material tray (61) of the second working area (42) to the material receiving area (43).

23. The normal high and low temperature chip testing equipment according to claim 20, characterized in that: The defective product tray assembly (9A) comprises a plurality of defective product trays (46), and the plurality of defective product trays (46) are arranged side by side.

24. The normal high and low temperature chip testing equipment according to any one of claims 1 to 14, characterized in that: The normal high and low temperature chip testing equipment further comprises a tray gripper assembly (10A) and an empty tray conveyor line assembly (11A), wherein the tray gripper assembly (10A) is used to grip an empty tray (61) from which chips have been taken from the loading conveyor line assembly (2A) and convey it to the empty tray conveyor line assembly (11A).

25. The normal high and low temperature chip testing equipment according to claim 24, characterized in that: The tray gripper assembly (10A) comprises a fifth robotic arm (47), a sixth robotic arm (48) and an empty tray clamping component (49), wherein the sixth robotic arm (48) is connected to the fifth robotic arm (47), and the empty tray clamping component (49) is arranged on the sixth robotic arm (48); the fifth robotic arm (47) drives the sixth robotic arm (48) to move along a sixth horizontal direction or along a fourth vertical direction, so as to drive the empty tray clamping component (49) to move along the sixth direction or along the fourth vertical direction.

26. The normal high and low temperature chip testing equipment according to claim 25, characterized in that: The tray gripper assembly (10A) further comprises a twelfth drive assembly and a thirteenth drive assembly, wherein the twelfth drive assembly is arranged on the fifth robotic arm (47) and moves along the sixth horizontal direction to drive the sixth robotic arm (48) to move along the sixth horizontal direction, and the thirteenth drive assembly is arranged on the fifth robotic arm (47) and moves along the fourth vertical direction.

27. The normal high and low temperature chip testing equipment according to claim 26, characterized in that: The twelfth driving assembly comprises a twelfth transmission belt (52) and a twelfth driving motor (53), the twelfth driving motor (53) being arranged on the fifth mechanical arm (47), the twelfth transmission belt (52) being arranged on the twelfth driving motor (53), and the twelfth transmission belt (52) driving the sixth mechanical arm (48) to move along the sixth horizontal direction under the drive of the twelfth driving motor (53), and the thirteenth driving assembly comprises a thirteenth transmission screw rod (54) and a thirteenth driving motor (55), the thirteenth driving motor (55) being arranged on the fifth mechanical arm (47), the thirteenth transmission screw rod (54) being arranged on the thirteenth driving motor (55), and the thirteenth transmission screw rod (54) driving the sixth mechanical arm (48) to move along the fourth vertical direction under the drive of the thirteenth driving motor (55).

28. The high and low temperature chip testing equipment according to claim 25, characterized in that: The empty tray clamping component (49) comprises an empty tray clamping body (62), a clamping cylinder (50) and a tray clamping hand (51); the empty tray clamping body (62) is arranged on the sixth robot arm (48); the clamping cylinder (50) and the tray clamping hand (51) are both arranged on the empty tray clamping body (62); and the tray clamping hand (51) clamps the empty tray (61) under the drive of the clamping cylinder (50).

29. The high and low temperature chip testing equipment according to claim 24, characterized in that: The empty tray conveyor line assembly (11A) comprises an empty tray conveyor line body (56) and a fourteenth drive assembly arranged on the empty tray conveyor line body (56); the empty tray conveyor line body (56) is provided with a third working area (57) and an empty tray collecting area (58); the tray gripper assembly (10A) is used to grip an empty tray (61) from which chips have been taken from the loading conveyor line assembly (2A) and transport it to the third working area (57) of the empty tray conveyor line assembly (11A); and the fourteenth drive assembly is used to transport the empty tray (61) in the third working area (57) to the empty tray collecting area (58).

30. The normal high and low temperature chip testing equipment according to claim 29, characterized in that: The fourteenth driving component includes a fourteenth driving motor (59) and a fourteenth transmission belt (60); the fourteenth driving motor (59) is arranged on the empty material tray conveyor line body (56); the fourteenth transmission belt (60) is arranged on the fourteenth driving motor (59); the fourteenth driving motor (59) is used to drive the fourteenth transmission belt (60); and the fourteenth transmission belt (60) is used to convey the empty material trays (61) in the third working area (57) to the empty material tray area (58).

31. The normal high and low temperature chip testing equipment according to any one of claims 1 to 14, characterized in that: The device body comprises a bracket (01) and a support plate (02) arranged on the bracket (01); the pre-heating plate assembly (3A), the loading robot assembly (4A), the material boat assembly (5A), the test arm assembly (6A) and the unloading robot assembly (7A) are all arranged on the support plate (02); a second heating component (03) is provided on the support plate (02); and the second heating component (03) is used to heat the support plate (02).

32. The normal high and low temperature chip testing equipment according to claim 31, characterized in that: The second heating component (03) comprises a first heating pad (031), a second heating pad (032) and a third heating pad (033), wherein the first heating pad (031) is arranged on the lower surface of the support plate (02) at a position corresponding to the pre-heating plate assembly (3A), the second heating pad (032) is arranged on the lower surface of the support plate (02) at a position corresponding to the material boat assembly (5A), and the third heating pad (033) is arranged on the lower surface of the support plate (02) at a position corresponding to the test arm assembly (6A).

33. The normal high and low temperature chip testing equipment according to any one of claims 1 to 14, characterized in that: The normally high and low temperature chip testing equipment also includes a shell (12A) covering the pre-heating plate assembly (3A), the loading robot assembly (4A), the material boat assembly (5A), the test arm assembly (6A) and the unloading robot assembly (7A), the shell (12A) includes a first inner layer (13A) and a first outer layer (14A), and a first heat insulating space is formed between the first inner layer (13A) and the first outer layer (14A).

34. The high and low temperature chip testing equipment according to claim 33, characterized in that: The outer shell (12A) is provided with a heat dissipation channel (15A) penetrating the first inner layer (13A) and the first outer layer (14A); the outer shell (12A) is provided with a first sealing door (16A); the first sealing door (16A) is movably arranged outside the first outer layer (14A) and can be moved to open or close the heat dissipation channel (15A).

35. The high and low temperature chip testing equipment according to claim 33, characterized in that: The outer shell (12A) is provided with a safety door (17A), the safety door (17A) comprising a second inner layer and a second outer layer, a second heat-insulating space being formed between the second inner layer and the second outer layer.

36. The normal high and low temperature chip testing equipment according to any one of claims 1 to 14, characterized in that: The normal high and low temperature chip testing equipment also includes a shell (12A) that is arranged outside the pre-heating plate assembly (3A), the loading robot assembly (4A), the material boat assembly (5A), the test arm assembly (6A) and the unloading robot assembly (7A), and the shell (12A) is provided with a first partition layer (18A) and a second partition layer (21A) arranged in an interval, and the first partition layer (18A) and the second partition layer (21A) divide the inner cavity of the shell (12A) into The invention relates to a feeding chamber (24A), a test chamber (25A) and a lower feeding chamber (26A); the feeding chamber (24A) is provided with at least one first dry air inlet; after the feeding chamber (24A) is filled with dry air, a high pressure area is formed; the first partition layer (18A) is provided with a first through hole capable of conducting the feeding chamber (24A) and the test chamber (25A); and the second partition layer (21A) is provided with a second through hole capable of conducting the test chamber (25A) and the lower feeding chamber (26A).

37. The normal high and low temperature chip testing equipment according to claim 36, characterized in that: The first separation layer (18A) is provided with a second sealing door (19A) for realizing the opening and closing of the first through hole and a first power mechanism (20A) for controlling the opening and closing of the second sealing door (19A).

38. The high and low temperature chip testing equipment according to claim 36, characterized in that: The second separation layer (21A) is provided with a third sealing door (22A) for realizing the opening and closing of the second through hole and a second power mechanism (23A) for controlling the opening and closing of the third sealing door (22A).

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